JP5126866B2 - Linear drive device, variable shutter device, beam shaping device, beam irradiation device, defect correction method, and pattern substrate manufacturing method - Google Patents

Description

  The present invention relates to a linear drive device, a variable shutter device, a beam shaping device, a beam irradiation device, a defect correction method using the beam shaping device, and a pattern substrate manufacturing method.

  In the manufacturing process of color filters for liquid crystal displays, defects in the color filter substrate are corrected in order to improve the yield. In the defect correction apparatus for a color filter substrate, for example, the defect is removed by irradiating a laser beam to a defective portion to which foreign matter or the like is attached. In a defect correction apparatus that irradiates laser light, it is necessary to make the laser light have a spot shape corresponding to the shape of the defect. A slit mechanism serving as a beam shaping device is used to make the laser light in a shape that matches the defect shape (see Patent Document 1). In this patent document, a slit mechanism having four light shielding plates and a rotational drive mechanism and a reciprocating drive means for driving the respective light shielding means is used. Then, the rotational drive means and the reciprocating drive means are controlled independently to change the opening shape.

JP 2005-138133 A

  However, the above-described slit mechanism of the defect correcting apparatus has a problem that a motor or the like is required to drive each light shielding plate, and the driving mechanism becomes complicated. In addition, with the above slit mechanism, it is difficult to change the opening shape at high speed. Therefore, it has been difficult to improve the efficiency of defect correction.

  The present invention has been made in view of such problems, and has a simple configuration, such as a linear drive device, a variable shutter device, a beam shaping device, a laser irradiation device using the same, a defect correction method, and a pattern substrate manufacturing method. The purpose is to provide.

  The linear drive device according to the first aspect of the present invention is a linear drive device that independently moves a plurality of target objects independently, and a plurality of wiring boards provided corresponding to the plurality of target objects; Coil wiring formed on each of the plurality of wiring boards, and a magnet pair disposed so as to sandwich a part of the coil wiring and generating a magnetic field in a direction across the coil wiring. Thereby, it can be set as a simple structure.

  A linear drive device according to a second aspect of the present invention is the linear drive device described above, wherein a flexible wiring portion in which a supply wiring for supplying a current to the coil wiring is formed from the wiring board to the magnet. It extends to the outside of the pair. Thereby, the wiring part to a flexible moving body is comprised and it does not break even in many strokes. Furthermore, since the overlapped wiring portions do not interfere, the linearity can be improved.

  A linear drive device according to a third aspect of the present invention is the linear drive device described above, and has a position-detecting translucent portion that moves in accordance with the movement of the wiring board and a predetermined length in the movement direction. And a light source that emits light to the light transmission unit and the position detection unit, and a light transmission unit for detecting the position of the light from the light source. And a light detector that detects the light through the light transmitting portion, and measures the position of the wiring board based on the detection result of the light detector. Thereby, position accuracy can be improved.

  A linear drive device according to a fourth aspect of the present invention is the linear drive device described above, and feedback-controls the current supplied to the coil wiring based on the detection result of the position detection unit. Thereby, movement time can be shortened.

  A variable shutter device according to a fifth aspect of the present invention is a variable shutter device capable of changing an opening shape, and includes any one of the linear drive devices described above and a plurality of target objects. Each of the plurality of shutter plates, and the opening shape is changed by displacing the shutter plate. Thereby, it can be set as a simple structure.

  A variable shutter device according to a sixth aspect of the present invention is the variable shutter device described above, wherein at least one of the plurality of shutter plates has a hypotenuse inclined from a direction parallel to a moving direction and a direction perpendicular to the moving direction. The opening which has is formed. Thereby, opening shape can be made into various shapes.

  A variable shutter device according to a seventh aspect of the present invention is the above-described variable shutter device, wherein an opening having the oblique side is formed in at least two of the plurality of shutter plates, and the oblique side is provided. The oblique sides provided on the two shutter plates in which the openings are formed have different angles. Thereby, the variation of opening shape can be widened.

  A variable shutter device according to an eighth aspect of the present invention is the variable shutter device described above, wherein the end portion of the shutter plate and the end portion of the wiring substrate are arranged so as to overlap each other, and the plurality of wiring substrates are arranged. In the two adjacent wiring boards, the shutter plate is attached to the surface in the opposite direction. Thereby, it can prevent that the end surface of a shutter board and a wiring board collides.

  A variable shutter device according to a ninth aspect of the present invention is a variable shutter device that changes an opening shape by independently moving the shutter plate in a state in which a plurality of shutter plates each having an opening formed thereon are overlapped. The position detection translucent part is provided at a different position with respect to each of the plurality of shutter plates, and is arranged so as to overlap the position detection translucent part. A light-transmitting part having a predetermined length in the moving direction of the shutter plate, a light source that emits light to the light-transmitting part and the position-detecting light-transmitting part, and light from the light source for position detection And a light detector that detects through the light transmitting portion, and moves the shutter plate based on the detection result of the light detector. Thereby, the position can be accurately controlled.

  A variable shutter device according to a tenth aspect of the present invention is the variable shutter device described above, wherein the shutter plate is a titanium plate. By using a lightweight and highly rigid titanium plate as a shutter plate, it is possible to achieve high speed.

  A beam shaping apparatus according to an eleventh aspect of the present invention includes the variable shutter device described above, and forms a beam aperture by overlapping openings of the plurality of shutter plates. Thereby, it can be set as a simple structure.

  A beam shaping apparatus according to a twelfth aspect of the present invention is the beam shaping apparatus described above, wherein the two variable shutter devices are arranged so as to intersect each other. Thereby, it is possible to shape the beam into various shapes with a simple configuration.

  A beam irradiation apparatus according to a thirteenth aspect of the present invention includes a beam generation source and the beam shaping apparatus arranged in the path of the beam generated from the beam generation source, and the beam of the beam shaping apparatus. The spot shape of the beam is formed by an aperture. Thereby, beams of various spot shapes can be irradiated with a simple configuration.

  A beam irradiation apparatus according to a fourteenth aspect of the present invention is the beam irradiation apparatus described above, wherein a movement completion signal indicating that the shutter plate has moved to a target position is used as a trigger for the beam generation source. It is what. Thereby, a beam can be irradiated only to a predetermined area.

  A defect correction method according to a fifteenth aspect of the present invention is a defect correction method for correcting a defect by irradiating light onto a pattern substrate on which a predetermined pattern is formed, and is provided in the beam shaping apparatus described above. Supplying current to the coil wiring to change the beam aperture according to the shape of the defect to be corrected, causing light from the light source to enter the beam shaping device, and passing through the beam aperture of the beam shaping device Irradiating the defective portion of the pattern substrate with the irradiated light. Thereby, a defect can be corrected simply.

  A defect correction method according to a sixteenth aspect of the present invention is the above-described defect correction method, wherein the light source is a pulse laser light source, and the shape of the beam aperture is changed according to a pulse of the pulse laser light. Is. Thereby, a defect can be corrected reliably.

  A defect correction method according to a seventeenth aspect of the present invention is the defect correction method described above, wherein the pulse laser beam is emitted based on a movement completion signal indicating that the shutter plate has moved to a target position. It is characterized by. Thereby, a defect can be corrected reliably.

  A defect correction method according to an eighteenth aspect of the present invention is the above-described defect correction method, wherein the defect is removed by removing the pattern of the defect portion by irradiating the pulse laser beam. A correction pattern corresponding to the pattern is formed at a location. Thereby, productivity can be improved.

  A defect correction method according to a nineteenth aspect of the present invention is the defect correction method described above, wherein the pattern of the pattern remaining in the defect portion is changed by changing the shape of the beam aperture according to the pulse of the pulse laser beam. The edge is processed into a staircase shape. Thereby, a defect can be corrected reliably.

  A defect correcting method according to a twentieth aspect of the present invention is the above-described defect correcting method, wherein the mask film is irradiated with the pulsed laser light on a mask film arranged corresponding to a defective portion of the substrate. A film opening corresponding to the defective portion is formed on the pattern substrate, and the pattern substrate is irradiated with pulsed laser light through the film opening to remove the pattern of the defective portion. Thereby, a defect can be corrected reliably.

  A defect correcting method according to a twenty-first aspect of the present invention is the above-described defect correcting method, wherein the edge of the film opening is changed by changing the shape of the beam aperture in accordance with the pulse of the pulse laser beam. A correction pattern corresponding to the pattern is formed on the pattern substrate through a film opening processed in a step shape. Thereby, a defect can be corrected reliably.

A pattern substrate manufacturing method according to a twenty-second aspect of the present invention is a pattern substrate manufacturing method in which a predetermined pattern is formed, the step of forming a pattern on the substrate, and the step of detecting defects on the substrate Then, the defect is corrected by the above-described defect correction method with respect to the defect portion where the defect is detected. Thereby, productivity can be improved.

  According to the present invention, it is possible to provide a linear drive device, a variable shutter device, a beam shaping device, a beam irradiation device, and a defect correction method and a pattern substrate method using the beam shaping device with a simple configuration.

Embodiments of the present invention will be described below with reference to the drawings. The following description shows preferred examples of the present invention, and the scope of the present invention is not limited to the following examples. In the following description, the same reference numerals denote the same contents.
Embodiment 1 of the Invention

  First, a beam forming apparatus using the variable shutter device according to the present embodiment will be described with reference to FIG. The beam shaping apparatus 200 is inserted into the optical path, and changes the spot shape of the light beam to a desired shape. That is, when the light beam passes through the beam shaping apparatus 200, a part of the light beam is shielded, and a desired spot shape can be obtained. FIG. 1 is a front view schematically showing the configuration of the beam forming apparatus 200. That is, FIG. 1 shows the beam shaping apparatus 200 viewed from the traveling direction of the light beam. Therefore, the beam shaping apparatus 200 shapes the spot shape of the light beam traveling in the direction perpendicular to the paper surface. Furthermore, as shown in FIG. 1, the direction perpendicular to the traveling direction of the light beam is defined as an X direction and a Y direction. 100 is a variable shutter device, 101 is a variable shutter device, 103 is a linear guide, 120 is a shutter plate, 130 is a magnet body, 137 is a magnet pair, 138 is a magnet pair, 145 is a flexible wiring unit, 150 is a drive unit, and 160 is It is a position detection unit.

  The beam shaping device 200 includes a variable shutter device 100 and a variable shutter device 101. Each of the variable shutter devices 100 and 101 is provided with a plurality of shutter plates 120. Here, the first variable shutter device 100 will be described assuming that four shutter plates 120 are provided. Similarly, the second variable shutter device 101 is also provided with four shutter plates 120. In the vicinity of the center of the shutter plate 120, an opening having a predetermined shape is formed. The plurality of shutter plates 120 are overlapped in the vicinity of the opening. That is, at least a part of the openings of all the shutter plates 120 are overlapped. The light beam passes through a portion where the openings of all the shutter plates 120 are overlapped.

  Each of the variable shutter devices 100 and 101 includes a drive unit 150 that independently moves the shutter plate 120 linearly. The drive unit 150 that functions as a linear drive device includes a magnet body 130 and a wiring board described later. The variable shutter devices 100 and 101 use the drive unit 150 to drive each shutter plate 120 linearly. Specifically, the variable shutter device 100 drives the shutter plate 120 in the X direction. The variable shutter device 101 drives the shutter plate 120 in the Y direction perpendicular to the X direction. Each shutter plate 120 has a rectangular shape whose longitudinal direction is the driving direction. All the shutter plates 120 are driven independently. Thereby, the position of the opening part provided in each shutter plate 120 shifts. Therefore, the portions where the light beams are blocked by the respective shutter plates 120 are different. Thereby, the spot shape of the light beam can be changed to a desired shape. That is, the light beam that passes through all the shutter plates 120 is formed into a desired spot shape. Here, let the through hole formed by the openings of the plurality of shutter plates 120 be the beam aperture 201. The shape of the opening provided in each shutter plate 120 will be described later.

  Here, the drive unit 150 is provided at one end of the variable shutter devices 100 and 101 in the drive direction, and the position detection unit 160 is provided at the other end. That is, the drive unit 150 is provided at the + X side end of the variable shutter device 100, and the position detection unit 160 is provided at the −X side end. Here, the driving unit 150 provided in the variable shutter device 100 independently moves the four shutter plates 120 in the X direction as described above. The drive unit 150 includes a magnet body 130 for forming a predetermined magnetic field. The magnet body 130 includes a magnet pair 137 and a magnet pair 138 indicated by dotted lines in FIG. Further, a flexible wiring portion 145 for supplying a driving current is provided outside the magnet body 130. The detailed configuration of the drive unit 150 will be described later.

  The position detector 160 detects the position of each shutter plate 120. The amount of movement of the shutter plate 120 is feedback controlled based on the detection result of the position detection unit 160. That is, each shutter plate 120 is driven according to the detected position. When the shutter plate 120 moves to the target position corresponding to the shape of the beam aperture 201 to be set, the driving is stopped. Thereby, the beam aperture 201 has a desired shape. The configuration of the position detection unit 160 and feedback control will be described later.

  The basic configuration of the variable shutter device 101 is the same as that of the variable shutter device 100. That is, the variable shutter device 101 is configured by rotating and mounting the same configuration as the variable shutter device 100 by 90 °. The shutter plate 120 of the variable shutter device 100 and the shutter plate 120 of the variable shutter device 101 are arranged so as to be in contact with each other.

  Further, linear guides 103 having bearings and the like are provided on both sides of the shutter plate 120. The linear guide 103 guides the movement of the shutter plate 120 in the X direction by the variable shutter device 100. Similarly, the linear guide 103 guides the movement of the shutter plate 120 in the Y direction by the variable shutter device 101. As a result, straightness can be improved.

  Next, the configuration of the variable shutter device 100 will be described with reference to FIGS. FIG. 2 is a perspective view schematically showing the configuration of the variable shutter device 100 according to the present embodiment. FIG. 3 is a cross-sectional view showing the configuration of the magnet body 130 used in the variable shutter device 100. FIG. 4 is a front view showing the configuration of the wiring board 140 used in the variable shutter device 100. FIG. 5 is a side view showing a connection portion between the wiring board and the shutter plate 120. FIG. 6 is a front view showing the configuration of each shutter plate 120.

  121 is an opening, 122 is a position-detecting light-transmitting part, 123 is a light-transmitting part, 131 is a yoke, 132 is a magnet, 133 is a magnet, 134 is a magnet, 135 is a magnet, 141 is a coil wiring, 145 is a flexible wiring part Reference numeral 146 denotes a supply wiring, 147 denotes a terminal, and 149 denotes a through hole. It should be noted that the letters a to d are added after each symbol to distinguish the constituent elements for the four shutter plates 120. That is, a is a component for the first shutter plate 120, b is a component for the second shutter plate 120, and c is a component for the third shutter plate 120. The components for the shutter plate 120 are indicated by d. Therefore, the first shutter plate 120 becomes the shutter plate 120a, and the wiring board 140 attached to the first shutter plate 120a becomes the wiring board 140a. The same applies to other components.

  First, the configuration of the variable shutter device 100 will be described with reference to FIG. An opening 121 for shaping the light beam is provided at the center of the shutter plate 120. Note that the four shutter plates 120 are overlaid as described above. The four shutter plates 120 have the same size and have differently shaped openings 121. The four shutter plates 120 have a rectangular shape with the X direction as the longitudinal direction. A wiring board 140 is connected to one end of the shutter plate 120 in the X direction. The wiring board 140 is, for example, a rigid printed wiring board. A position detector 160 is provided at the other end of the shutter plate 120. The position detecting unit 160 is provided with a position detecting light transmitting unit 122. The position of the position detecting light transmitting portion 122 provided in the position detecting portion 160 is different for each shutter plate 120. The configuration of the position detection unit 160 will be described later.

  A spiral coil wiring 141 is formed on the wiring board 140. A magnet body 130 is provided so as to sandwich the wiring board 140. The drive unit 150 includes a wiring board 140 and a magnet body 130. The magnet body 130 generates a predetermined magnetic field. That is, the magnet body 130 constitutes a field for driving the wiring board 140. The driving unit 150 drives the shutter plate 120 with a current flowing through the coil wiring 141. Specifically, a magnetic field in the Z direction is generated by the magnet body 130 in a portion of the coil wiring 141 where current flows in the Y direction. A propulsive force is generated in the X direction according to Fleming's law. That is, the wiring board 140 slides on the same principle as the voice coil motor. As a result, the shutter plate 120 connected to the wiring board 140 is driven in the X direction. Further, by reversing the current of the coil wiring 141, the coil wiring 141 can be moved in the opposite direction.

  Here, the wiring board 140 is provided on each of the four shutter plates 120. Therefore, by controlling the current flowing through the coil wiring 141 provided on the wiring board 140, each shutter plate 120 moves straight forward independently. Each of the wiring boards 140 is provided with a flexible wiring portion 145. A flexible wiring portion 145 extends to the outside of the magnet body 130. A current is supplied from the flexible wiring portion 145 to the coil wiring 141. By using the flexible wiring portion 145 as described above, a flexible wiring portion can be configured. Therefore, it does not break even with many strokes. Specifically, it does not break even with millions of strokes. Further, since the stacked wiring boards do not interfere with each other, the linearity can be improved.

  The configuration of the magnet body 130 and the wiring board 140 will be described with reference to FIGS. 3 and 4 together with FIG. The magnet body 130 is provided with a yoke 131 and four magnets 132, 133, 134, 135 in order to form a magnetic field in the Z direction. Here, the magnet 132 and the magnet 133 constitute the magnet pair 137 shown in FIG. Further, the magnet 134 and the magnet 135 constitute the magnet pair 138 shown in FIG. As shown in FIG. 3, the magnet 132 and the magnet 133 constituting the magnet pair 137 are provided apart from each other in the Z direction. Four wiring boards 140 a to 140 d are arranged between the magnet 132 and the magnet 133. Similarly, the magnet 134 and the magnet 135 constituting the magnet pair 138 are also provided apart in the Z direction. Four wiring boards 140 a to 140 d are arranged between the magnet 134 and the magnet 135. The magnets 132, 133, 134, and 135 are formed in a flat plate shape.

  Here, for clarity of explanation, the Z direction is described as the up and down direction. The magnet 132 and the magnet 134 are upper magnets, and the magnet 133 and the magnet 135 are lower magnets. That is, the magnet 132 is disposed above the magnet 133 and the magnet 135 is disposed below the magnet 134. The magnets 132 to 135 have substantially the same shape. And the arrangement is different. Magnets 132, 133, 134, and 135 are fixed to yoke 131. The yoke 131 is formed in a U-shaped cross section as shown in FIG. And four magnets 132 to 135 are arranged inside the U-shape. That is, four magnets 132 to 135 are inserted into the yoke 131.

  The magnet 132 and the magnet 133 constituting the magnet pair 137 are arranged at the same position in the X direction and the Y direction. Similarly, the magnet 134 and the magnet 135 constituting the magnet pair 138 are also arranged at the same position in the X direction and the Y direction. The magnet pair 137 and the magnet pair 138 have different positions in the X direction.

  Here, as shown in FIG. 3, the lower surface of the magnet 132 is the N pole 132N, and the upper surface of the magnet 133 is the S pole 133S. Accordingly, the magnetic lines of force between the magnet pair 137 are directed downward (−Z direction). The wiring board 140 is disposed between the different magnetic poles of the magnet pair 137. Therefore, in the magnet pair 137, the magnetic field lines in the −Z direction cross the wiring board 140.

  On the other hand, in the magnet 134 and the magnet 135, the directions of the magnetic poles are opposite. That is, the lower surface of the upper magnet 134 is an S pole, and the upper surface of the lower magnet 135 is an N pole. Accordingly, the lines of magnetic force between the magnet pair 138 are directed upward (+ Z direction). In the magnet pair 137, the magnetic field lines in the + Z direction cross the wiring board 140. As described above, the direction of the magnetic force lines is opposite between the magnet pair 137 and the magnet pair 138. Wiring boards 140a to 140d are disposed between the magnet pair 137 and between the magnet pair 138. Each of the wiring boards 140 has a flat plate shape. The flat wiring boards 140a to 140d are arranged so as to overlap each other. In this way, among the magnet pairs arranged so as to sandwich the wiring board 140, two surfaces on the wiring board 140 side are different magnetic poles.

  The wiring board 140 attached to the shutter plate 120 is provided with a spiral coil wiring 141 as shown in FIG. The coil wirings 141 provided on the four wiring boards 140 are overlapped with each other. Further, a through hole 149 is provided in the wiring board 140 at the center of the spiral coil wiring 141. Further, the coil wiring 141 is formed in a laminated structure on the front surface and the back surface of the wiring substrate 140. Thereby, the number of turns of the coil can be increased. When a constant current is passed through the spiral coil wiring 141, the current flows spirally. In this case, the direction of the current path is repeatedly changed in the order of, for example, + X direction, -Y direction, -X direction, and + Y direction. Since the coil wiring 141 is formed in a spiral shape, the coil wiring 141 has a portion formed along the Y direction. When a constant current is passed through the coil wiring 141, a part of the coil wiring 141 flows in the + Y direction, and a part facing the coil wiring 141 moves in the -Y direction. Further, the coil wiring 141 has a current path in the Y direction and a current path in the -Y direction. Thus, the spiral coil wiring 141 has a portion in which the direction of current flow is opposite.

  In FIG. 4, the magnet pairs 137 and 138 are shown by dotted lines. The magnet pairs 137 and 138 are arranged in a portion where the current of the coil wiring 141 flows in the ± Y direction. That is, the current path in the Y direction in the coil wiring 141 is included between the magnet pair 137 or the magnet pair 138. Further, in the X direction, the magnet pair 137 and the magnet pair 138 are separated by a distance corresponding to the size of the coil wiring 141. Thus, the magnet pairs 137 and 138 are arranged corresponding to the current paths in the ± Y directions. That is, a current path in the Y direction of the coil wiring 141 is disposed between the magnet pair 137 and between the magnet pair 138. Therefore, the magnet pair 137 and the magnet pair 138 are arranged in a portion where the current direction of the coil wiring 141 is opposite. That is, when the current of the coil wiring 141 in the magnet pair 137 is in the + Y direction, the current of the coil wiring 141 in the magnet pair 138 is in the −Y direction. Thus, in the magnet pair 137, the current of the coil wiring 141 flows only in one direction (for example, + Y direction) in the Y direction and does not flow in the opposite direction (for example, -Y direction).

  As described above, a magnetic field in the Z direction is generated on the wiring board 140 by the magnet body 130. For example, a magnetic field in the + Z direction is generated between the magnet pair 137. In this portion, the coil wiring 141 is formed in the Y direction, and a current flows in the + Y direction or the −Y direction. Therefore, when a current is passed through the coil wiring 141, the direction of the magnetic field (Z direction) and the direction of the current (Y direction) are orthogonal. Thereby, a thrust is generated in the X direction on the wiring board 140. This thrust changes according to the current of the coil wiring 141. Specifically, when the direction of the current of the coil wiring 141 is reversed, the thrust is reversed. Further, the magnitude of the thrust changes according to the magnitude of the current of the coil wiring 141.

  Further, in the magnet pair 138, a magnetic field in the −Z direction is formed. In this portion, the coil wiring 141 is formed in the Y direction, and a current flows in the −Y direction or the + Y direction. Here, current flows in the opposite direction between the current path between the magnet pair 138 and the current path of the coil wiring 141 between the magnet pair 137. That is, in the magnet pair 137 and the magnet pair 138, the direction of the magnetic field and the direction of the current are opposite. Therefore, the thrust generated by the magnetic field of the magnet pair 138 and the current of the coil wiring 141 has the same direction as the thrust generated by the magnetic field of the magnet pair 137 and the current of the coil wiring 141. Thus, since the two magnet pairs 137 and 138 are provided, the thrust can be doubled even with the same current. In this way, the two magnet pairs 137 and 138 are arranged so as to sandwich the opposing current paths in the coil wiring 141.

  Here, the magnets 132 to 135 provided in the magnet pairs 137 and 138 have a substantially rectangular parallelepiped shape. The magnet pairs 137 and 138 are provided along the X direction. Therefore, the sum of the currents flowing in the X direction is 0 between the magnet pair 137 and the magnet pair 138. That is, the sum of currents flowing in the + X direction is equal to the sum of currents flowing in the -X direction. Therefore, generation of thrust in the Y direction can be prevented. Thus, the shutter plate 120 can be moved straight in the X direction with high straightness.

  As described above, when a current flows through the wiring board 140, a thrust in the X direction is generated. Thereby, the shutter plate 120 connected to the wiring board 140 can be driven. Therefore, the amount of movement of the shutter plate 120 can be controlled by controlling the current flowing through the coil wiring 141. Then, by independently controlling the current of each coil wiring 141, the positions of the four shutter plates 120 are shifted. Accordingly, the shutter plates 120 can be adjusted to be in different positions. Thereby, the beam aperture 201 can be formed into a desired shape.

  Further, a flexible wiring portion 145 extends from the end portion of the wiring substrate 140. The flexible wiring part 145 is provided at the end of the wiring board 140 opposite to the side where the shutter plate 120 is provided. The flexible wiring part 145 is provided along the X direction, that is, the driving direction. Two supply wirings 146 are formed in the flexible wiring part 145. A terminal 147 is formed at the end of the flexible wiring portion 145 opposite to the coil wiring side. External wiring is connected to the terminal 147. As a result, current from the external wiring is supplied to the coil wiring 141 via the supply wiring 146. One of the two supply wirings is provided to the back surface side through the through hole. The two supply wirings 146 are connected to the coil wiring 141. Here, the flexible wiring part 145 has flexibility. Therefore, even when the wiring board 140 moves in the X direction, the shape of the flexible wiring portion 145 changes flexibly. Thereby, the force added to the wiring board 140 can be reduced, and linearity can be improved.

  The flexible wiring portion 145 extends to the outside of the magnet body 130 as shown in FIG. Then, it is bent in a U shape outside the magnet body 130. Thereby, even when it moves to a X direction, the force added to the wiring board 140 can be reduced. Further, the flexible wiring portions 145 are arranged so as not to interfere with each other. The arrangement of the flexible wiring portion 145 will be described with reference to FIGS. 2, 3, and 5. In FIG. 3, the flexible wiring portion 145 is indicated by a dotted line.

  Half of the four flexible wiring portions 145 are bent in the + Z direction (upward), and the other half are bent in the −Z direction (downward). Specifically, as shown in FIG. 5, among the four flexible wiring portions 145, two flexible wiring portions 145a and 145b are bent upward, and the remaining two flexible wiring portions 145c and 145d are bent downward. Thereby, as shown in FIG. 2, the terminals 147 of the two flexible wiring portions 145 a and 145 b are extended to the + Z side of the magnet body 130. Further, the terminals 147 of the remaining two flexible wiring portions 145 c and 145 d are extended to the −Z side of the magnet body 130.

  Here, the flexible wiring portions 145a and 145b of the two wiring boards 140a and 140b arranged on the upper side (+ Z side) are bent upward. Further, the flexible wiring portions 145c and 145d of the two wiring boards 140c and 140d that are arranged on the lower side (−Z side) are bent downward. The flexible wiring portion 145 is bent in a direction corresponding to the position of the overlaid wiring board 140. That is, the bending direction of the flexible wiring portion 145 is determined based on the positions in the plurality of wiring substrates 140 that are overlaid. Specifically, the flexible wiring portions 145a and 145b are bent upward with respect to the wiring substrates 140a and 140b located on the upper side among the plurality of wiring substrates 140a to 140b overlapped. On the other hand, the flexible wiring portions 145c and 145d are bent upward with respect to the wiring substrates 140c and 140d located on the lower side among the plurality of wiring substrates 140 stacked. Thereby, it can prevent that the flexible wiring part 145 mutually interferes, and can prevent that force is added to the wiring board 140. FIG.

  Further, the flexible wiring portions 145a and 145b bent upward are displaced from each other in the Y direction. That is, the flexible wiring parts 145 bent in the same direction are arranged at different positions in the direction orthogonal to the driving direction. For example, as shown in FIG. 3, the flexible wiring portion 145a extends from the end portion on the + Y side of the wiring board 140a. On the other hand, the flexible wiring portion 145b extends from the end portion on the −Y side of the wiring substrate 140b. That is, the flexible wiring portion 145a and the flexible wiring portion 145b are arranged so as to be shifted in the Y direction. Therefore, even if the wiring board 140 is driven in the X direction, the flexible wiring portions 145 can be prevented from contacting each other. Therefore, it is possible to prevent a force from being applied to the wiring board 140 and to improve the straightness.

  Here, all the four flexible wiring parts 145 can be unified in the same shape by setting the connection to the shutter plate 120 in a predetermined arrangement. This point will be described with reference to FIGS. In FIG. 6, only a part of the configuration of the wiring board 140 is shown, and the configuration on the flexible wiring portion 145 side is omitted. Here, as shown in FIG. 5, the shutter plate 120a, the shutter plate 120b, the shutter plate 120c, and the shutter plate 120d are arranged in this order from the top. Therefore, the wiring board 140a, the wiring board 140b, the wiring board 140c, and the wiring board 140d are arranged in this order from the top. Of the wiring formation surface of the wiring substrate 140, the surface on which the flexible wiring portion 145 is extended is referred to as a front surface 142, and the opposite surface is referred to as a back surface 143.

  The wiring substrate 140a has a back surface 143a disposed on the upper side, and the wiring substrate 140b has a surface 142b disposed on the upper side. Similarly, the back surface 143c is disposed on the upper side of the wiring board 140c, and the front surface 142d is disposed on the upper side of the wiring board 140d. Here, FIG. 6 is a view of each shutter plate 120 and the wiring board 140 as viewed from the surface 142 side of the wiring board 140. In this case, the wiring boards 140a and 140c are positioned on the front side of the shutter plates 120a and 120c. On the other hand, the shutter plates 120b and 120d are positioned in front of the wiring boards 140b and 120d. Thus, two adjacent wiring boards 140 are connected to the shutter plate 120 on the opposite surface of the wiring board 140. That is, in the two adjacent shutter plates 120, the opposite surface of the wiring board 140 is a connection surface. Thus, the same surface in the wiring board 140 is a connection surface every other sheet. In other words, the back surface 143 and the front surface 142 of the wiring board 140 are alternately connected surfaces.

  In this case, the two adjacent wiring boards 140 are arranged so as to be reversed by the center line in the X direction. Therefore, in the two adjacent wiring boards 140, the flexible wiring part 145 is disposed on the opposite side. Thereby, the wiring board 140 having the same shape can be used for the four shutter plates 120. That is, even when the wiring boards 140a and 140b have the same shape, the position of the flexible wiring portion 145 is shifted in the Y direction. Therefore, parts can be shared and production costs can be reduced.

  Furthermore, the wiring board 140 and the shutter plate 120 are arranged so as not to interfere with each other. This point will be described with reference to FIG. The end of the wiring board 140 and the end of the shutter plate 120 are arranged so as to overlap each other. Here, the wiring board 140a is connected to the upper surface side of the shutter plate 120a. On the other hand, the wiring board 140b is connected to the lower surface side of the shutter plate 120b. Furthermore, the wiring board 140c is connected to the upper surface side of the shutter plate 120c, and the wiring board 140d is connected to the lower surface side of the shutter plate 120d. That is, in the two adjacent shutter plates 120, the surface on the opposite direction side is a connection surface with the wiring board 140. In other words, the number of shutter plates 120 arranged between the adjacent wiring boards 140 in the connection portion is 0 or 2. Thus, between the adjacent wiring boards 140, the end portions of the two shutter plates 120 are arranged, or no end portion of the shutter plate 120 is arranged.

  As shown in FIG. 5, except for the uppermost and lower wiring boards 140, the two shutter plates 120 and the two wiring boards 140 are alternately arranged in the Z direction. In other words, the wiring board 140 is attached to the surfaces opposite to each other in the two adjacent shutter plates 120. Specifically, in the shutter plate 120a, the wiring substrate 140a is attached to the upper surface (+ Z side surface), and in the shutter plate 120b, the wiring substrate 140b is attached to the lower surface (−Z side surface). It is done. In the shutter plate 120c, the wiring substrate 140c is attached to the upper surface (+ Z side surface), and in the shutter plate 120d, the wiring substrate 140d is attached to the lower surface (−Z side surface). Thereby, it is possible to prevent the wiring board 140 and the shutter plate 120 from interfering with each other. That is, even when moved in the X direction, the side end surface of the wiring board 140 and the side end surface of the shutter plate 120 can be prevented from colliding with each other.

  The wiring board 140 and the shutter plate 120 are connected by, for example, an adhesive. Alternatively, the wiring board 140 and the shutter plate 120 may be integrally formed. In addition, an insulating protective film is formed on the surface of the wiring board 140. Thereby, a protective film is formed on the coil wiring 141 and the supply wiring 146, and only the terminal 147 is exposed.

  The drive unit 150 independently drives the four shutter plates 120 as described above. Accordingly, the opening 121 provided in each shutter plate 120 changes to a different position. Here, the four shutter plates 120 are provided with openings 121 as shown in FIG. Specifically, the openings 121c and 121d of the shutter plates 120c and 120d are formed in a square shape. The sides of the openings 121c and 121d are provided in parallel with the X direction or the Y direction. The opening 121c and the opening 121d have the same size.

  The openings 121a and 121b of the shutter plates 120a and 120b are formed in a trapezoidal shape. Two sides of the trapezoidal openings 121a and 121b are provided in parallel with the X direction. One of the remaining two sides is provided parallel to the Y direction, and the other side is provided inclined by 45 ° from the X direction. Here, the sides formed in the openings 121a and 121b with an inclination of 45 ° from the X direction are assumed to be hypotenuses. The oblique side of the opening 121a and the oblique side of the opening 121b are provided to be orthogonal to each other. The opening 121a and the opening 121b have the same size. Therefore, the opening 121b has a shape obtained by inverting the opening 121a with a line in the Y direction.

  The four shutter plates 120 are driven in the X direction independently as described above. By combining the four openings 121 described above, the spot shape of the light beam can be changed. That is, the side of the opening 121 serves as a boundary line that restricts the passage of the beam. Here, as shown in FIG. 1, the beam shaping apparatus 200 includes two variable shutter apparatuses 100 and 101. The variable shutter device 101 has the same configuration as the variable shutter device 100. Further, the driving directions of the two variable shutter devices 100 and 101 are different by 90 °. That is, the variable shutter device 101 is provided by being rotated 90 ° from the variable shutter device 100. Thus, the beam aperture 201 having various shapes can be formed by intersecting the variable shutter device 100 and the variable shutter device 101. That is, by combining the two variable shutter devices 100 and 101, the beam aperture 201 can be changed into various shapes.

  The variable shutter device 100 whose driving direction is the X direction limits the beam spot shape to the Y direction. Further, the variable shutter device 101 whose driving direction is the Y direction limits the beam spot shape to the X direction. Further, a part of the opening 121 is provided with a hypotenuse inclined from the driving direction of the two variable shutter devices 100 and 101. Thereby, the beam aperture 201 can be made into a triangle, a tetragon, a pentagon, a hexagon, a heptagon, or an octagon.

  Here, FIG. 7 shows an example of the beam aperture 201 formed by the beam shaping apparatus 200. In FIG. 7, ten beam apertures 201 are shown. As shown in FIG. 7, the shape of the beam aperture 201 can be, for example, a square, a rectangle, a trapezoid, a right-angled isosceles triangle, a parallelogram, an octagon, or the like. Furthermore, it is also possible to form a beam aperture 201 combining the above shapes. In this way, a 3-8 octagonal beam aperture 201 can be formed. Of course, it is not limited to the illustrated shape. Here, the side of the beam aperture 201 is parallel to the X direction, perpendicular to the X direction, or inclined by 45 ° from the X direction. Thus, by combining the four shutter plates 120 displaced in the X direction and the four shutter plates 120 displaced in the Y direction, the beam can be formed into various shapes. Further, the beam aperture 201 can be similar to the above shape. That is, the size of the beam aperture 201 can be changed.

  At least a part of the plurality of shutter plates 120 is formed with a rectangular quadrilateral (rectangular, square) opening having a side parallel to the moving direction. Of the plurality of shutter plates 120, the shutter plate 120 different from the shutter plate 120 in which the right-angled quadrilateral opening 121 is formed has an opening 121 having a hypotenuse inclined at an angle from the side of the right-angled quadrilateral. To do. The opening 121 having the oblique side is preferably trapezoidal. Furthermore, an opening 121 having a hypotenuse is formed for at least two shutter plates. The hypotenuses provided on the two shutter plates are set at different angles. Further, the two hypotenuses may be orthogonal. By using such an opening, beam apertures 201 having various shapes can be formed.

  As described above, the plurality of shutter plates 120 provided with the openings 121 are independently moved straight ahead. As a result, the relative position of the shutter plate 120 changes and the opening 121 is displaced. Accordingly, the opening shape of the beam aperture 201 changes. At this time, an opening having a side parallel to the moving direction and a vertical side is formed in at least one of the plurality of shutter plates. Further, the other shutter plate 120 is formed with a side parallel to the moving direction and a hypotenuse inclined from a vertical side. The oblique sides of the openings 121 provided in the two shutter plates 120 are set to different angles. Furthermore, it is preferable to incline the two oblique sides so as to be orthogonal.

  Next, the configuration of the position detection unit 160 will be described with reference to FIG. By detecting the position of each shutter plate 120 by the position detection unit 160, it can be moved accurately. FIG. 8A is a side view schematically showing the configuration of the position detection unit 160. FIG. 8B is a top view schematically showing the configuration of the position detection unit 160. Reference numeral 161 denotes an LED (Light Emitting Diode) array, 162 denotes an LED, 163 denotes a light guide block, 164 denotes an incident surface of the light guide block 163, 165 denotes an exit surface of the light guide block 163, and 166 denotes a detector.

  The position detection unit 160 has an LED array 161 in which LEDs 162 are arranged in an array. The LED array 161 has 4 × 4 LEDs 162 arranged in a matrix. That is, in the LED array 161, four LEDs 162 are arranged in the Y direction, and four LEDs 162 are arranged in the Z direction. Here, the LED 162 emits white light in the + X direction. The light emitted from the LED array 161 is emitted to the incident surface 164 of the light guide block 163. The light guide block 163 is made of an acrylic resin having a high refractive index. Therefore, the light that has entered the light guide block 163 is totally reflected in the light guide block 163 and is emitted from the emission surface 165 of the light guide block 163.

  Here, the entrance surface 164 of the light guide block 163 is parallel to the YZ plane, and the exit surface 165 is parallel to the XY plane. Then, the light in the light guide block 163 is totally reflected by a surface inclined from the incident surface 164 and the emission surface 165 and is emitted from the emission surface 165. As described above, after light from the plurality of LEDs 162 is guided into the light guide block 163 and then emitted from the emission surface 165, spatially uniform light can be emitted. Note that metal or the like may be vapor-deposited on a surface other than the incident surface 164 or the emission surface 165 of the light guide block 163. Thereby, light leakage can be prevented.

  Accordingly, the light from the LED array 161 is emitted in the direction of the shutter plate 120 from the emission surface 165 of the light guide block 163. Here, a light transmitting portion 123 and a position detecting light transmitting portion 122 are provided on the shutter plate 120 at a position facing the light exit surface 165 of the light guide block 163. Further, a light detector 166 is disposed at a position corresponding to the position detecting light transmitting portion 122 and the light transmitting portion 123. The light from the LED array 161 is incident on the photodetector 166 through the light transmitting portion 123 and the position detecting light transmitting portion. Here, the photodetector 166 is a position detecting element (PSD) and outputs a detection signal corresponding to the incident position of light. Specifically, a one-dimensional PSD manufactured by Hamamatsu Photonics can be used as the photodetector 166. Accordingly, the light receiving surface of the photodetector 166 has a band shape. That is, the photodetector 166 has a light receiving surface extending in the X direction. The light incident position in the X direction of the photodetector 166 is detected. Therefore, a signal corresponding to the incident position of light on the light receiving surface of the photodetector 166 is output. Further, the length of the photodetector 166 corresponds to the length of the light guide block 163 in the X direction. Therefore, when there are no four shutter plates 120, the light from the light guide block 163 enters the entire light receiving surface of the photodetector 166.

  As described above, the shutter plate 120 is disposed between the photodetector 166 and the light guide block 163. The shutter plate 120 is provided with a light transmitting portion 123 and a position detecting light transmitting portion 122. Therefore, the light emitted from the LED array 161 passes through the light transmitting portion 123 and the position detecting light transmitting portion 122 and enters the light detector 166. Four photodetectors 166 are provided on the back side of the shutter plate 120 in order to detect the position of each of the four shutter plates 120. Each of the four photodetectors 166 has a band-shaped light receiving surface extending in the X direction (driving direction). The four photodetectors 166a to 166d are arranged in the Y direction. Here, the four shutter plates 120 are disposed between the emission surface 165 of the light guide block 163 and the light receiving surface of the photodetector 166. Therefore, the light from the LED array 161 enters the photodetector 166 via the light transmitting portion 123 and the position detecting light transmitting portion 122.

  Here, the configuration of the position detecting light transmitting portion 122 and the light transmitting portion 123 will be described with reference to FIG. 6 together with FIG. 8. The translucent part 123 is formed in a strip shape extending in the X direction. The position detecting translucent part 122 is sufficiently smaller than the translucent part 123, for example. Therefore, the light that has passed through the light transmitting portion 123 is blocked by the position detecting light transmitting portion 122. On the contrary, the light that has passed through the position detecting light transmitting portion 122 is not shielded by the light transmitting portion 123. That is, the translucent part 123 does not block the light passing through the position detecting translucent part 122 and the passed light. The translucent part 123 is provided in a rectangular shape of 25 mm in the X direction and 2 mm in the Y direction, for example. The position detecting translucent portion 122 is provided in a rectangular shape of 1 mm in the X direction and 2 mm in the Y direction, for example. Thus, the position detecting translucent part 122 is sufficiently shorter than the translucent part 123 in the X direction.

  Each shutter plate 120 is formed with three light transmitting portions 123 and one position detecting light transmitting portion 122. The three light transmission parts 123 and the one position detection light transmission part 122 are arranged side by side in the Y direction. Here, in the four shutter plates 120, the position of the position detecting light transmitting portion 122 is different. For example, as shown in FIG. 6, in the shutter plate 120a, the position detecting light transmitting portion 122a, the light transmitting portion 123a, the light transmitting portion 123a, and the light transmitting portion 123a are arranged in this order from the left side. In the shutter plate 120b, the light transmitting portion 123b, the position detecting light transmitting portion 122b, the light transmitting portion 123b, and the light transmitting portion 123b are arranged in this order from the left side. Further, in the shutter plate 120c, the light transmitting portion 123c, the light transmitting portion 123c, the position detecting light transmitting portion 122c, and the light transmitting portion 123c are arranged in this order from the left side, and in the shutter plate 120d, the light transmitting portion 123d from the left side. The light transmitting part 123d, the light transmitting part 123d, and the position detecting light transmitting part 122d are arranged in this order. Here, as shown in FIG. 8, the light transmitting portions 123b, 123c, and 123d of the shutter plates 120b, 120c, and 120d are superimposed on the position detecting light transmitting portion 122a of the shutter plate 120a. Similarly, the position detecting light transmitting portions 122 provided on the shutter plates 120b, 120c, and 120d are overlapped with the light transmitting portions 123 provided on the other three sheets. In other words, the light transmitting portions 123 of the three shutter plates 120 are arranged at the position of the position detecting light transmitting portion 122 of one shutter plate 120 on the XY plane.

  Therefore, as shown in FIG. 8A, in the position detection unit 160, light is transmitted only through the position detection light transmitting unit 122, and is blocked out in other cases. That is, the light from the LED array 161 passes through the light transmitting portions 123 of the three shutter plates 120 and the position detecting light transmitting portion 122 of the one shutter plate 120 and enters the light detector 166. Here, the translucent part 123 has a predetermined length in the X direction and is longer than the light receiving surface of the photodetector 166. The translucent part 123 is provided sufficiently longer than the movable range of the shutter plate 120. Therefore, regardless of the position of the shutter plate 120, the translucent portion 123 is at a position corresponding to the emission surface 165 of the light guide block 163. That is, even when the shutter plate 120 moves in the X direction, the light transmitting portion 123 is disposed to face the light exit surface 165 of the light guide block 163. Thus, the light emitted from the light guide block 163 is hardly shielded around the translucent part 123.

  Further, the length of the position detecting translucent part 122 in the X direction is sufficiently shorter than the translucent part 123. The length of the position detecting translucent portion 122 in the X direction is sufficiently shorter than the photodetector 166. The length of the position detecting light transmitting portion 122 can be set according to the performance of the photodetector. Accordingly, when the shutter plate 120 moves in the X direction, the emitted light passes through the position detecting light transmitting portion 122 at a different position. Therefore, the incident position of light on the light receiving surface of the photodetector 166 changes in the X direction according to the position of the shutter plate 120. Based on the incident position in the X direction on the light receiving surface, the position of the shutter plate 120 corresponding to the position detecting light transmitting portion 122 is measured. That is, the position of the shutter plate 120 provided with the passing position detecting light transmitting portion 122 is measured.

  Here, as shown in FIG. 8B, one row of the LEDs 162 arranged in the Z direction in the LED array 161 corresponds to one light guide block 163. That is, light from four LEDs 162 arranged in the Z direction enters one light guide block 163. One light guide block 163 corresponds to one light detector 166. That is, light emitted from one light guide block 163 is incident on one photodetector 166. As described above, the columns of the LEDs 162, the light guide block 163, and the photodetector 166 correspond to each other.

  For example, in the configuration shown in FIG. 8B, when the configuration arranged on the most −Y side is considered, the light emitted from the LED 162a enters the light guide block 163a. And the light radiate | emitted from the light guide block 163a injects into the photodetector 166a. Here, as shown in FIG. 6, between the light guide block 163a and the photodetector 166a arranged on the most -Y side, one position detecting light transmitting portion 122a and three light transmitting portions are provided. 123b, 123c, and 123d are arranged. The light guide block 163 emits light having a predetermined length in the X direction.

  Therefore, when the shutter plate 120a moves in the X direction, the incident position of the light passing through the position detecting light transmitting portion 122a changes on the light receiving surface of the photodetector 166a. Therefore, the position of the shutter plate 120 can be detected based on the position detecting light transmitting portion 122a. That is, the position of the shutter plate 120 can be detected by the detection signal from the photodetector 166. Here, even if the shutter plates 120b, 120c, 120c move in the X direction, the incident position of the light on the light receiving surface of the photodetector 166a does not change. That is, the translucent part 123 has a predetermined length in the X direction so that light can enter the entire light receiving surface of the photodetector 166 even when the shutter plate 120 is moved. The light from the light guide block 163 is limited by the shutter plate 120a provided with the position detecting light transmitting portion 122. In this way, the light incident on the photodetector 166a is shielded by the shutter plate 120a corresponding to the position detecting light transmitting portion 122a. That is, the incident position in the photodetector 166 changes only by the position of the shutter plate 120a.

  As described above, when the shutter plate 120a is driven to displace the position detecting light transmitting portion 122a, the incident position of the light on the light receiving surface of the photodetector 166a changes in the X direction. Accordingly, the output from the photodetector 166a changes. As described above, the position of the shutter plate 120a can be detected by the detection signal output from the photodetector 166a. Furthermore, four photodetectors 166 are provided to detect the positions of the shutter plates 120a to 120d. A light guide block 163 and an LED array 161 are provided corresponding to the four photodetectors 166. That is, assuming that one photo detector 166, one light guide block, and one row of LEDs 162 are one set, four sets are arranged in the Y direction. Here, the position of the shutter plate 120a is measured by the photodetector 166a, the position of the shutter plate 120b is measured by the photodetector 166b, the position of the shutter plate 120c is measured by the photodetector 166c, and the position of the shutter plate 120c is measured by the photodetector 166d. The position of the shutter plate 120d is measured. At this time, the positions of the light transmitting portion 123 and the position detecting light transmitting portion 122 provided on the shutter plate 120 are changed for each set. In other words, the position detecting translucent portion 122 is arranged shifted in the Y direction. Then, the position detecting translucent part 122 of one shutter plate 120 and the translucent part 123 of another shutter plate 120 are arranged so as to overlap each other. Accordingly, the positions of all the shutter plates 120 that are overlaid on each other can be detected.

  Note that the plurality of position detecting light transmitting portions 122 are not limited to being arranged in parallel. That is, it is only necessary that the plurality of position detecting translucent portions 122 are arranged so as to be shifted. Of course, the photodetectors 166 are also arranged so as to be shifted in correspondence with the position detecting translucent portion 122. At this time, it is preferable to arrange the plurality of photodetectors 166 in the Y direction perpendicular to the driving direction. The plurality of position detecting light transmitting portions 122 are also arranged at different positions in the Y direction. Thereby, an increase in the size of the shutter plate 120 can be prevented. In addition, the length of the light guide block 163 should just correspond to the length of the light-receiving surface of the photodetector 166. In addition, the exit surface 165 of the light guide block 163 and the light receiving surface of the photodetector 166 are made longer than the movable range.

  Furthermore, it is preferable that the translucent part 123 is longer than the sum of the length of the light guide block 163 and the movable distance of the shutter plate 120. As a result, regardless of the position of the position detecting translucent portion 122, light having a constant intensity can be incident on the photodetector 166. Therefore, detection accuracy can be improved. The shape of the translucent part 123 is, for example, a rectangular shape of 25 mm in the X direction and 2 mm in the Y direction. This is because when the movable distance of one shutter plate 120 is 12 mm, the length of the light transmitting portion 123 in the X direction is 25 mm at (12 + 1 + 12) mm. As a result, the light transmitting portion 123 is opposed to the light exit surface 165 of the light guide block 163 regardless of the position of the shutter plate 120.

  The position detecting light transmitting portion 122 and the light transmitting portion 123 are formed by providing a through hole in the shutter plate 120. Of course, the position-detecting light-transmitting part 122 and the light-transmitting part 123 are not limited to the through holes, but may be any light-transmitting part. For example, the translucent part 123 and the position detecting translucent part 122 may be formed of a transparent film or the like. That is, the translucent part 123 and the position detecting translucent part 122 may be anything as long as they can transmit light. Furthermore, a part of the shutter plate 120 may be cut out to form the light transmitting portion 123. That is, it is possible to form the light transmitting portion 123 by forming irregularities in the X direction with respect to the end portion of the shutter plate 120. For example, the shape of the end portion of the shutter plate 120 is a comb shape. And the comb-shaped recessed part is good also as the translucent part 123. FIG. Further, the position detecting light transmitting portion 122 may be formed by projecting an end portion of the shutter plate 120 in the X direction.

  Note that the number of columns of the LEDs 162 in the LED array 161, the number of the light guide blocks 163, and the number of the photodetectors 166 may be determined according to the number of the shutter plates 120. Thereby, even if it is a case where the some shutter plate 120 is piled up, each position is detectable. Note that the light source of the position detection unit 160 is not limited to the LED array 161. Any light source that emits light having a certain width may be used. Further, when a light source that emits uniform light is used, the light guide block 163 can be omitted. Furthermore, the measurement result may be corrected according to the fluctuation of the light emitted from the LED 162. Specifically, the measurement result is corrected according to the current flowing in each column of the LED array 161.

  As described above, the position detecting translucent portion 122 is formed at a different position with respect to each of the shutter plates 120. At this time, the light transmitting portion 123 is formed on the shutter plate 120 so as not to block the position detecting light transmitting portion 122 of the other shutter plate 120. Since the translucent portion 123 has a predetermined length in the X direction, the position detecting translucent portion 122 is not blocked even when the shutter plate 120 is displaced. Each shutter plate 120 is formed with one position detecting light transmitting portion 122. The sum of the number of the position detecting light transmitting portions 122 and the light transmitting portions 123 formed on one shutter plate 120 is equal to the number of the shutter plates 120. A plurality of light transmitting portions 123 may be integrally formed.

  In this way, the position detector 160 detects the position of each shutter plate 120. Then, the current supplied to the coil wiring 141 of the wiring board 140 is controlled according to the position of each shutter plate 120. Thereby, the position of the shutter plate 120 can be accurately controlled. Further, the drive current is feedback controlled according to the position of the shutter plate 120. For example, in the variable shutter device 100, the drive current is PID controlled. Thereby, the shutter plate 120 can be moved to a predetermined position in a short time. The position control of the shutter plate 120 will be described later.

  The position detection unit 160 having the above-described configuration can also be used for a variable shutter device and a beam shaping device that are driven by a method different from the driving unit 150. That is, the position detection unit 160 is provided in a variable shutter device that is moved independently by the shutter plate 120 in a state where a plurality of shutter plates 120 having openings formed thereon are overlapped. Furthermore, it is provided at a different position with respect to each of the plurality of shutter plates, and is disposed so as to overlap with the position detecting light transmitting portion 122 that moves according to the movement of the shutter plate 120, and the position detecting light transmitting portion 122, A light transmitting portion 123 having a predetermined length in the moving direction of the shutter plate 120 is formed on the shutter plate 120. Then, light is emitted from the light source to the light transmitting part and the position detecting light transmitting part. A light detector for detecting the light from the light source through the position detecting light transmitting portion and the light transmitting portion is provided. Then, the shutter plate is controlled based on the detection result of the photodetector. Thereby, each shutter plate can be accurately moved. In this way, the opening shape can be changed. Here, various types of driving mechanisms can be used. The position detecting light transmitting portion 122 and the light transmitting portion 123 can be formed other than the shutter plate 120. That is, the position detecting light transmitting portion 122 and the light transmitting portion 123 may be formed separately in a separate body attached to the shutter plate 120.

  Hereinafter, an example of a specific configuration of the variable shutter device 100 will be described. As the shutter plate 120, for example, a titanium plate having a thickness of 0.1 mm can be used. By using a lightweight and highly rigid titanium plate as the shutter plate 120, it is possible to increase the speed, and surface treatment is applied to the shutter plate 120 to improve wear resistance. Here, the surface of the shutter plate 120 is dry-rubbed. Thereby, even if the shutter plate 120 is moved in a superimposed state, wear due to driving can be reduced. The dry rubbing process may be performed only on one side of the shutter plate.

  The size of the shutter plate 120 is 80 mm in the X direction and 38 mm in the Y direction. That is, the shutter plate 120 has a rectangular shape of 80 mm × 38 mm. Further, the lower square-shaped openings 121c and 121d shown in FIG. 6 are squares each having a side of 12 mm. One side of the openings 121a and 121b is provided along the Y direction, and two sides are provided along the X direction. The remaining one side of the trapezoidal openings 121a and 121b is a 45 ° oblique side. Therefore, one of the two sides in the X direction of the openings 121a and 121b is the same length as one side of the opening 121c, and the other is twice as long.

  On the wiring board 140, for example, a wiring having a pattern with a width of 1 mm is formed in a spiral shape of 10 rotations to form a coil wiring 141. Here, a maximum current of 2 A can be passed through the coil wiring 141. Furthermore, coil wiring is formed on both surfaces of the wiring board 140 in order to increase thrust. Furthermore, the front and back coil wirings 141 are laminated. Here, each of the wiring on the front surface and the coil wiring on the back surface has two layers. Therefore, a total of four layers are formed, and a 40-turn coil wiring is formed. Of course, an insulating film is formed between the wirings of each layer. In addition, since an electric current flows through the coil wiring 141 instantaneously, the heating of the coil wiring 141 does not become a problem practically.

  Further, the magnets 132 to 135 are neodymium magnets. Here, the surface magnetic field between the magnet pair 137 is about 1.3T. The surface magnetic field of the magnet pair 138 is the same. The magnet pairs 137 and 138 and the yoke are combined to form a field. Thereby, it is possible to accelerate with a maximum thrust of 400 gf with a driving current of 2 A. Here, the total mass of one shutter plate 120 and one wiring board 140 is about 4 g. Therefore, a large acceleration of 100G can be obtained. Thereby, it can move to a target position in a short time.

  The beam shaping device 200 includes the variable shutter device 100 described above and a variable shutter device 101 having the same configuration as the variable shutter device 100. The variable shutter device 100 and the variable shutter device 101 are orthogonal to each other. That is, the four shutter plates 120 and the four shutter plates 120 are arranged in a direction orthogonal to each other. Thereby, as shown in FIG. 7, the beam aperture 201 of various shapes can be formed. The beam shaping apparatus 200 is suitable for a beam irradiation apparatus that irradiates laser light. Specifically, the beam shaping apparatus 200 is suitable for a defect correction apparatus that corrects defects on a pattern substrate such as a color filter. That is, the beam shaping apparatus 200 may be applied to a laser processing apparatus such as a defect correction apparatus. As a result, the processing shape can be accurately controlled.

  By using the variable shutter device 100 described above, the shutter plate 120 can be driven with a stroke of 12 mm. Furthermore, since a high acceleration can be obtained, the moving time of 12 mm can be set to 5 msec or less. For example, the moving time can be set to 3 msec. Therefore, the time required to change the shape of the aperture can be shortened. The beam forming apparatus 200 using the variable shutter apparatuses 100 and 101 has a positional accuracy of ± 2.5 μm or less. Therefore, when the objective lens of the beam irradiation device is 20 times, the laser beam can be irradiated on the object with a positional accuracy of about ± 0.1 μm. Therefore, the beam shaping apparatus 200 is suitable for correcting a pattern substrate that requires high accuracy. Furthermore, since the opening shape can be changed in a short time, the correction time can be shortened. Therefore, highly accurate correction can be performed in a short time. Thereby, productivity can be improved significantly.

  When the beam shaping apparatus 200 is used in a laser irradiation apparatus such as a laser processing apparatus, the magnet body 130 is fixed to the optical system of the laser irradiation apparatus. Then, the opening 121 of the shutter plate 120 is disposed in the optical path of the laser light. When the drive current for the coil wiring 141 is controlled, the shutter plate 120a moves. Thereby, the shape of the beam aperture 201 can be changed. When the shutter plate 120 is driven, a reaction force is generated on the magnet body 130. However, since the magnet body 130 is fixed to the laser irradiation apparatus, there is no practical problem. The linear guide 103 is also fixed to the laser irradiation device.

  When the field of the plurality of shutter plates 120 is used in common, a certain amount of field turbulence occurs due to the armature reaction, but the level does not become a problem in terms of control. In particular, when the four shutter plates 120 in one field are moved in the opposite directions, the directions in which the armature reaction occurs are opposite to each other. For example, when changing the size of the beam aperture 201, the shutter plates 120a and 120c are moved in the + X direction, and the shutter plates 120b and 120c are moved in the -X direction. . When this operation is performed, the armature reaction is intensified by the adjacent shutter plate 120. As a result, the travel time can be further shortened.

  Further, a dummy plate may be arranged to cancel the mechanical reaction due to the acceleration of the shutter plate 120. For example, when the octagonal beam aperture 201 is not necessary and a square shape is sufficient, two of the four shutter plates 120 may be dummy plates. Here, an opening sufficiently larger than the opening 121 is formed in the dummy plate. Thereby, the vibration caused by the reaction can be canceled.

  In the above description, four shutter plates 120 are used, but the present invention is not limited to this. That is, the variable shutter device 100 may be provided with a plurality of shutter plates 120. In addition, since the variable shutter devices 100 and 101 have a simple configuration, the drive units 150 do not interfere with each other even when the two variable shutter devices 100 and 101 are arranged to cross each other. Therefore, the beam shaping apparatus 200 can be made compact.

  Next, a defect correction apparatus using the beam shaping apparatus 200 will be described. Here, a defect correcting apparatus for correcting a defect of the liquid crystal display panel will be described with reference to FIG. FIG. 9 is a diagram schematically showing a configuration of an optical system of a defect correcting apparatus using the beam shaping apparatus 200. The defect correction apparatus includes an optical system 41 that irradiates the substrate 6 with laser light. That is, the defect correcting device corrects the defect by irradiating the defective portion with the laser beam via the beam shaping device. Furthermore, this defect correction apparatus corrects a defect by arranging a mask film 5 serving as a mask on a substrate 6 as disclosed in, for example, Japanese Patent No. 3580550.

  The optical system 41 includes a half mirror 3, a laser light source 1, a beam shaping mechanism 2, an objective lens 4, a lamp light source 9, a filter 10, a half mirror 11, and a CCD camera 12. The optical system 41 further includes a UV light source 13 that irradiates the transfer layer transferred to the defective portion of the substrate 6 with UV light. The optical system 41 is provided in a repair head disposed on the substrate 6. Further, a light source head 37 is provided below the substrate 6. The light source head 37 has an illumination light source 51 and a UV light source 52. The lamp light source 9, the half mirror 3, the half mirror 11, the filter 10, the CCD camera 12, and the illumination light source 51 of the light source head 37 of the optical system 41 confirm whether or not the defect detection or defect correction has been normally performed. Used for. That is, a defect is detected by observing a reflected image or a transmitted image of the substrate 6.

  A configuration for observing the reflected image of the substrate 6 will be described. A lamp light source 9 provided in the optical system 41 is used as a reflection observation light source. The lamp light source 9 emits white light for illuminating the surface of the substrate 6. The light for reflection observation emitted from the lamp light source 9 passes through the filter 10 and enters the half mirror 11. The filter 10 is a wavelength tunable filter and can shield only a predetermined wavelength. Here, the filter 10 can emit light having a wavelength suitable for defect detection. The light incident on the half mirror 11 is reflected in the direction of the substrate 6. This light passes through the half mirror 3 and enters the objective lens 4. A mask film 5 is provided between the objective lens 4 and the substrate 6 so as to face the substrate 6. Then, the light condensed by the objective lens 4 passes through the mask film 5 and enters the surface of the substrate 6. Thereby, a part of the substrate 6 can be illuminated from the upper surface of the substrate 6. The light reflected by the substrate 6 passes through the mask film 5, the objective lens 4, the half mirror 3 and the half mirror 11 and enters the CCD camera 12. The CCD camera 12 detects a reflected image based on the reflected light on the surface of the substrate 6. Thereby, the reflected image of the substrate 6 can be observed.

  Next, a configuration for observing a transmission image will be described. In the present invention, the illumination light source 51 is used for the light source head 37 in order to observe the transmission image of the substrate 6. The illumination light source 51 is provided on the optical axis of the objective lens 4. That is, the optical axis of the illumination light source 51 coincides with the optical axis of the optical system for observing the reflected image. The illumination light source 51 causes the transmitted illumination light to enter the substrate 6 from the back side of the substrate 6 through the stage 7. The transmitted light that has passed through the substrate 6 passes through the mask film 5, the objective lens 4, the half mirror 3, and the half mirror 11 and enters the CCD camera 12. As the illumination light source 51, a lamp light source can be used similarly to the observation of the reflected image. Further, a filter such as a lens or a wavelength tunable filter may be provided for the illumination light source 51. When a defect is detected, the repair head and the light source head are moved in synchronization. Thereby, since the transmitted illumination light and the reflected illumination light are incident on the substrate with the same optical axis, by controlling the ON / OFF of the lamp light source 9 and the illumination light source 51 independently, either the transmitted image or the reflected image can be obtained. Whether to take an image can be easily switched.

  In the above description, the substrate 6 is observed through the mask film 5, but the present invention is not limited to this. For example, the mask film 5 can be removed from between the substrate 6 and the optical system 41 for observation. That is, you may observe in the state which shifted the mask film 5 from the optical axis.

  The CCD camera 12 is connected to an information processing apparatus such as a personal computer (PC), and determines the presence or absence of a defect in the substrate 6 based on the detected image. For example, a die-to-die method for comparing with a detected reference die can be used. If the detected image is different from the reference die, it is determined as a defective portion. With this defect detection mechanism, an opaque black defect and a transparent white defect can be distinguished and detected.

  The optical system 41 is provided in a repair head (not shown). This repair head is movably provided on the substrate 6. Further, the repair head is provided with a transfer film having a transfer layer transferred to the substrate 6. That is, the transfer film has a transfer layer corresponding to the pattern provided on the substrate 6. For example, when the correction target is a colored layer provided on a color filter substrate of a liquid crystal display device, a transfer layer colored R, G, or B is formed on the transfer film. The transfer layer of the transfer film is attached to the substrate to correct the defect. A repair head having such a transfer film is movably provided on the substrate 6.

  The information processing apparatus is connected to the XY drive mechanism of the repair head, the detection location is specified from the position of the repair head at the time of defect detection, and the coordinates of the defective pixel on the substrate are detected. Of course, the defect detection mechanism is not limited to the illustrated configuration, and a defect detection mechanism having a configuration other than this may be used. About this defect detection mechanism, the structure similar to the conventional defect detection apparatus can be used. By moving the repair head, the relative position of the light from the substrate 6 and the lamp light source 9 is changed to detect defects on the entire surface of the substrate 6. The information processing apparatus stores the coordinates of the defective portion of the substrate 6 in association with the defect type (R, G, B, light shielding layer) and the size of the defect.

  The defect detected by the above-described defect detection mechanism is corrected by the defect correction mechanism. The defect correction mechanism will be described below. The laser light source 1 is a Q-switched YAG laser and can emit a short pulse light of 10 nsec or less. Furthermore, the laser light source 1 can emit pulse laser light of 20 to 100 Hz or more, for example. The short pulse laser beam emitted from the laser light source 1 enters the beam shaping mechanism 2. The beam shaping mechanism 2 includes the beam shaping device 200 described above, and can form a short pulse light spot into an appropriate shape. For example, the beam spot of the short pulse light on the substrate is formed in substantially the same shape as the color filter pixels. Or you may make it shape | mold in the shape substantially the same as the shape of a defect. The half mirror 3 reflects short pulse light in the direction of the substrate 6. Here, the respective optical components are arranged so that the light from the laser light source 1 and the lamp light source 9 are coaxial. The short pulse laser beam reflected by the half mirror 3 is applied to the mask film 5. At this time, the mask film 5 is fixed by a mask film fixing jig. That is, a film opening is formed in the mask film 5 in a state where the mask film 5 is fixed to the substrate 6. Here, an image of the beam aperture of the beam shaping mechanism 2 is formed on the substrate 6. Therefore, the laser beam is irradiated to the region corresponding to the shape of the beam aperture. Thereby, the defect of the board | substrate 6 can be corrected with high position accuracy.

  Further, the half mirror 3 may be a mirror that efficiently reflects the laser light from the laser light source 1. For example, a dichroic mirror or a reflection mirror having a high reflectance with respect to the wavelength of the laser beam may be used. Thereby, since the laser beam 1 can be efficiently applied to the mask film 5, the output of the laser light source 1 can be reduced. In this case, the half mirror 3 may be removed from the optical path during defect detection or defect observation. That is, at the time of defect detection or defect observation, the half mirror 3 is preferably removed from the optical path of the lamp light source 9 in order to illuminate the substrate 6 with light having a wavelength suitable for defect detection and defect observation. At this time, the half mirror 3 is mechanically moved so as to be removed from the optical path. At the time of defect detection and observation, the half mirror 3 is removed from the optical path of the lamp light source 9, and the half mirror 3 is arranged on the optical path of the lamp light source 9 when the opening is formed.

  The configuration of the mask film 5 and the substrate 6 will be described with reference to FIG. FIG. 10 is an enlarged cross-sectional view showing the configuration of the corrected portion. FIG. 10A shows the configuration of the mask film 5 and the substrate that are being irradiated with the short pulse light. FIG. 10B shows the structure of the substrate from which the colored layer of the defective pixel is removed. 61 is a red (R) colored layer, 62 is a green (G) colored layer, 63 is a blue (B) colored layer, and 64 is a black matrix (BM). These are the upper surface side of the substrate 6, that is, It is provided on the repair head 35 side. First, a general method for manufacturing a color filter substrate will be described. On the color filter substrate 6, a black resin film or the like serving as a light-shielding film is formed on a transparent glass substrate or the like, and is patterned by exposure and development processes. Thereby, the resin film becomes BM64 formed in a matrix. From this, a photosensitive resin in which a pigment corresponding to the color of the colored layer is dispersed is applied and patterned by exposure and development processes. By repeating this process, the R colored layer 61, the G colored layer 62, and the B colored layer 63 are provided in order between the BM 64. Of course, the colored layer and the BM may be formed by an inkjet method. Here, as shown in FIG. 10A, it is assumed that a white portion is provided in the R colored layer 61. In other words, it is assumed that there is a portion where the R colored layer 61 is not attached to a part of the pixels to be the R colored layer 61. A pixel provided with such a blank portion is detected as a defective pixel that transmits light by a defect detection mechanism. The mask film 5 is substantially in contact with the substrate 6.

  This pixel is irradiated with short pulse light of 10 nsec or less from the laser light source 1. The short pulse light condensed by the objective lens 4 is incident on the mask film 5 adjacent to the substrate 6. The power of this short pulse light is adjusted so as to partially open the mask film 5 by laser ablation. In this embodiment, since a polyimide film is used, if the third harmonic of 355 nm or the fourth harmonic of 266 nm of the YAG short pulse laser light source 1 is used, the mask film 5 is easily absorbed because the short pulse light is absorbed. Can be provided with a film opening. Further, since the polyimide film is substantially transparent without absorption in the visible light region, observation is easy, and the defect can be detected using the lamp light source 9. The mask film 5 is not limited to polyimide, but may be made of a material that is opened by chemical decomposition, thermal decomposition, sublimation, ablation, or the like when irradiated with light. Since the laser beam is shaped by the beam shaping mechanism 2 so as to have a defect shape or a pixel shape, the shape of the film opening of the mask film 5 is substantially the same as the shape of the defect shape or the R pixel. be able to. That is, the shape of the beam aperture 201 is made to correspond to the pixel shape. The colored layer 61 of R and a part of the mask film can be removed almost simultaneously by laser ablation.

  The removed colored layer 61 of R is removed from the substrate through the opening of the mask film 5. Thereby, substantially all of the R colored layer 61 of the white defect pixel can be removed, resulting in a white defect 66 as shown in FIG. That is, a pixel from which the colored layer 61 having a pinhole defect is removed becomes a white defect 66. At this time, the colored layer 61 removed from the substrate 6 adheres to the mask film 5. Since the periphery of the correction portion is covered with the film, the R colored layer 61 does not adhere to the periphery of the correction portion and create a new defect. Thus, the film and defects can be removed almost simultaneously by laser ablation. Although the removed colored layer 61 of R is a single piece, it may become a large number of debris and land on the mask film. The power of the laser light source 1 may be adjusted so that the mask film 5 is gradually perforated, or may be adjusted so that the perforation of the mask film 5 and the removal of the colored layer are performed simultaneously.

  In the above description, the colored layer 61 is removed from the white pixels, but the present invention can also be applied to a pixel to which foreign matter is attached. In this case, the foreign matter adhering to the pixel can be prevented from adhering to the substrate 6 again by the mask film 5. When the foreign matter is transparent, laser ablation does not occur even if the foreign matter is irradiated with short pulse light because no light is absorbed. On the other hand, if a film that absorbs light, such as polyimide, is used as the mask film 5 and the short film laser light is irradiated with the absorbing film substantially in contact with the top of the foreign matter, the mask film opens by laser ablation. At the same time, the foreign matter is pressed against the substrate for a moment by the gas or debris that has come forward, and can be detached from the substrate by the subsequent recoil. Since the colored layer 61 is removed together with the foreign matter on the substrate by the above-described processing, the black defect becomes a white defect 66 that transmits light.

  The transfer film 18 is a transfer film having a transfer layer that is transferred by thermal transfer. For example, Transer (registered trademark) manufactured by Fuji Photo Film Co., Ltd. can be used. With this film, the adhesion of the transfer layer can be improved. Defects are corrected by pressing the transfer film with a thermal transfer rod. This transfer process will be described with reference to FIG. FIG. 11 is an enlarged cross-sectional view showing the configuration of the corrected portion. In addition, FIG. 11 has shown the structure of the white spot location shown in FIG.

  A thermal transfer rod 43 is disposed on the mask film 5. The thermal transfer rod is provided on the repair head. The thermal transfer rod 43 is provided so as to be movable up and down. When the transfer layer 18 b of the transfer film 18 is attached, the thermal transfer rod 43 moves downward to press the transfer film 18 against the substrate 6. Here, the transfer film 18 is provided with an oxygen blocking layer, a base layer, an antistatic layer, and the like, which are omitted in the drawing. When the transfer film 18 is pressed by the thermal transfer rod 43, the configuration shown in FIG.

  By pressing the thermal transfer rod 43, the mask film 5 having an opening is sandwiched between the substrate 6 and the transfer film 18. Accordingly, the transfer layer 18 b is pressed against the defect position of the substrate 6 through the opening of the mask film 5. Since the opening is provided at the same size and the same position as the place where the colored layer 61 is removed by laser ablation, it coincides with the place that needs to be corrected. By transferring the transfer layer 18b through the mask film 5, the transfer layer 18b adheres to the substrate 6 at the opening. On the other hand, the transfer layer 18 b is attached to the upper surface of the mask film 5 in a region other than the opening.

  As described above, by transferring the transfer layer 18b serving as the colored layer through the opening of the mask film 5, it is possible to prevent the transfer layer 18b from adhering to a region other than the defective portion. As a result, the transfer layer 18b can be transferred only to the defective portion with a simple configuration, and the defect can be corrected accurately. Further, since the transfer layer 18b is not attached to an extra portion, it is not necessary to remove the extra transfer layer 18b in a later step, and productivity can be improved.

  Further, in this embodiment, the transfer layer 18b is pressed through the thermoplastic resin layer 18d. The thermoplastic resin layer 18 d has elasticity, and functions as a cushion layer when the transfer film 18 is pressed against the substrate 6. Thereby, the step on the substrate caused by the colored layer 62, the BM 64, and the mask film 5 is absorbed, so that the transfer layer 18b can be accurately transferred. Since the thermoplastic resin layer 18d has a thickness of 20 μm, for example, even if the colored layer has a thickness of 2 μm, the BM has a thickness of 2 μm, and the mask film 5 has a thickness of 8 μm, it absorbs the level difference caused by these and accurately transfers it. be able to.

  Here, while the transfer layer 18b is thermally transferred by pressing the thermal transfer rod 43, UV light is irradiated from the back surface side of the substrate 6 by the UV light source 52 of the light source head 37 shown in FIG. Thereby, the adhesiveness with respect to the board | substrate 6 of the transfer layer 18b can be improved. The irradiation amount of UV light from the back side is, for example, about 50 mJ.

  After the thermal transfer rod 43 is raised and separated from the substrate 6, the transfer film 18 is held. Raise the film holder. As a result, the transfer film 18 is separated from the substrate 6. At the same time, the mask film fixing jig is raised to separate the mask film 5 from the substrate 6. Thereby, the mask film 5 having the transfer layer 18b attached to the upper surface is peeled off from the substrate. As a result, the configuration shown in FIG. Thus, the transfer layer 18b can be thermally transferred by a dry process. Further, after raising the mask film fixing jig, the mask film reel 8 is rotated. If the thermoplastic resin layer 18d or the like adheres to the substrate 6 side, a shower spray process is performed with a weak alkaline aqueous solution to remove the thermoplastic resin layer 18d in a subsequent cleaning step. Of course, the thermoplastic resin layer 18d is removed by a method such as scraping with a polishing tape or wiping with a cloth tape. As a result, as shown in FIG. 11B, the transfer layer 18b serving as a colored layer is transferred to the position of the white defect.

  By using the mask film 5 in this manner, characteristics such as thickness, color, and transmittance of the layer transferred as the colored layer can be easily controlled. That is, by forming the transfer layer 18b of the transfer film 18 with desired characteristics, the corrected colored layer can be corrected so as to be in approximately the same state as a normal colored layer. Thereby, accurate defect correction can be performed. Further, by transferring using the mask film 5, the adhesion of the transfer layer can be improved. In the thermal transfer process described above, to increase the transfer speed. The substrate 6 may be preheated.

  After peeling the mask film 5 from the substrate 6, the repair head is moved so that the UV light source 13 is disposed on the transfer portion. Then, UV light is irradiated from a UV light source 13 provided on the surface side of the substrate 6. Thereby, UV light is irradiated from both surfaces of the transfer layer 18b. Therefore, the transfer layer 18b can be uniformly irradiated with UV light, and the transfer layer 18b made of a photosensitive resin is uniformly cured. The optical system 41 may be provided with a lens, a filter, or the like for the UV light source 13. Further, a heater rod having a temperature higher than that of the thermal transfer rod 43 may be provided in the repair head. Then, the transferred transfer layer 18 b may be heated by pressing the heater rod against the substrate 6.

  Here, the shape of the film opening of the mask film 5 is determined by the beam forming mechanism 2 using the beam forming apparatus 200 according to the present embodiment. That is, a film opening having a shape corresponding to the shape of the beam aperture 201 of the beam shaping apparatus 200 is formed. By correcting the defect through the film opening, it is possible to prevent the transfer layer from being transferred to other than the defective pixel. Therefore, defects can be corrected with high accuracy, and productivity can be improved.

  In addition, you may correct | amend other than said correction process. For example, the present invention can be used for a defect correction apparatus that does not use a mask film. In this case, the defective portion is irradiated with laser light to remove the defective colored layer. That is, the defect may be corrected by directly irradiating the pattern with pulsed laser light. It is also possible to remove the pattern of the colored layer and form a correction pattern.

  Here, when correcting a display device such as a liquid crystal display device, a defect may be corrected for each pixel. For example, after the colored layer of the entire defective pixel is removed with a laser, transfer is performed through the film opening of the mask film. In this case, it is necessary to remove the color filter in a shape corresponding to the pixel of the display device. That is, it is necessary to remove only the colored layer 61 without removing the BM 64 shown in FIG. In this case, the positional accuracy of the beam forming apparatus 200 is important.

  Next, a configuration for performing feedback control based on the detection result in the position detection unit 160 will be described with reference to FIG. FIG. 12 is a block diagram illustrating a configuration of an information processing device for performing Ford back in the variable shutter device 100 according to the present embodiment. In addition to feedback position control, the information processing apparatus 170 performs control for the above-described defect detection and defect correction. About this, since the same conventional control can be used, description is abbreviate | omitted. The information processing apparatus 170 is a PC or the like as described above. By this information processing device 170, the drive current is feedback-controlled. Specifically, the information processing apparatus 170 performs PID control of the drive current according to the position detection result. That is, the drive current is determined according to the current detection position and target position.

  The information processing apparatus 170 is provided with a correction table 171. The correction table 171 includes a storage device such as a memory, and stores table data for correcting the linearity of the photodetector 166. For example, when PSD is used as the photodetector 166, its linearity is 1% and may not be sufficient. In this case, table data for position correction is created by irradiating the colored layer of the color filter, which is an actual sample, with laser light. That is, in the correction table 171, the position detected by the photodetector 166 that is a PSD and the actual position of the shutter plate 120 are stored in association with each other. The position of the shutter plate 120 is corrected according to the table data stored in the correction table 171. This correction table is created for all shutter plates 120. Accordingly, eight types of table data are created here.

  In order to create the correction table 171, the shutter plate 120 is driven one by one. Specifically, the other seven shutter plates 120 are fixed at the full-field open position, and one shutter plate 120 is gradually opened. Each time the position of the shutter plate 120 is changed, the colored layer of the substrate 6 is irradiated with pulsed laser light. Here, the laser beam is irradiated to the colored layer at a portion that may be damaged. Of course, a dummy substrate for creating a correction table may be used. Then, the incident position of the laser beam is confirmed by the CCD camera 12. The table data is determined by comparing the position on the CCD camera with the position detected by the photodetector 166. Then, the entire movable range is moved to create the correction table 171. Thereby, the position detected by the photodetector is corrected.

  The above processing is performed on all shutter plates 120. As a result, not only 0 ° and 90 ° but also 45 ° correction can be performed. That is, the position of the hypotenuse of the openings 121a and 121b can be accurately detected. Further, a lens distortion function measured in advance is given to the correction table 171. Thereby, the influence by distortion of the objective lens which projects the beam aperture 201 can be removed. Therefore, processing without distortion can be performed in the entire field of view.

  For the position control of the shutter plate 120, the correction table 171 is referred to. Specifically, the target position of each shutter plate 120 is set in the position setting unit 173. That is, the target position is set in the position setting unit 173 according to the pixel to be corrected. First, a drive current is supplied to move to this target position. Then, during the movement of the shutter plate 120, the light that has passed through the position detection light transmitting portion 122 is detected by the photodetector 166. Then, the detection result is corrected by the correction table 171. Thereby, the current position of the shutter plate 120 can be detected. Further, the control unit 172 determines the drive current based on the current position of the shutter plate 120 and the target position set in the position setting unit 173. Then, the determined drive current is supplied to each coil wiring 141. This is repeated to perform feedback control.

  When the shutter plate 120 is moved, the shutter plate 120 is accelerated at a constant acceleration. When the predetermined speed is reached, the current is stopped and the shutter plate 120 is moved at a constant speed. When the target position is approached, the shutter plate 120 is decelerated by reversing the current. At this time, it is determined that the target position is approached based on the detected position. Thereby, it can be moved in a short time. Moreover, it is possible to prevent the coil wiring 141 from being heated by flowing a current for a certain period of time.

  Further, a signal indicating that the shutter plate 120 has moved to the target position may be used as a trigger for the laser light source 1. That is, a movement completion signal indicating that all the shutter plates 120 have reached the target position is input from the information processing apparatus 170 to the laser light source 1. The laser light source 1 emits pulsed laser light using the movement completion signal as a trigger signal. That is, a movement completion signal indicating that the shutter plate has moved to the target position is input to the laser light source 1. Then, the driver of the laser light source 1 emits pulsed laser light based on the movement completion signal. Thereby, a beam can be irradiated via the beam aperture 201 having a target shape. Therefore, the irradiation position can be accurately controlled.

  Usually, a YAG laser can emit pulse laser light for about 20 to 200 shots per second. Furthermore, the positioning time of the variable shutter devices 100 and 101 is 5 msec or less. Therefore, the beam aperture 201 can have a different shape for each shot. That is, a laser beam can be irradiated to a different position for each pulse. Of course, an overlapping region may be irradiated with a plurality of pulse laser beams. That is, two or more pulses having the same shape and the same position may be irradiated. In this manner, the position of the beam aperture 201 and the opening shape can be changed according to the pulse of the pulse laser beam.

  The total thickness of the four shutter plates 120 is 0.4 mm. Therefore, the total thickness of the shutter plate 120 is sufficiently thinner than the depth of focus. Therefore, the image of the beam aperture 201 is not blurred and can be controlled with high positional accuracy. Thereby, a defect can be corrected reliably.

  In the case of a defect correction apparatus for a liquid crystal display device, the defect may form a beam according to the pixel shape. That is, for a pixel determined to be defective, it is necessary to remove the entire colored layer of the pixel with laser light. Further, in the active matrix liquid crystal display device, the pattern shape of the colored layer may be a complicated shape. For example, since BM is formed in the TFT portion of the pixel, the colored layer pattern of the pixel may have a complicated shape as shown in FIG.

  When the pixel pattern 209 as shown in FIG. 13 is used as the irradiation region, the shutter plate 120 is driven to form a vertically long octagonal beam aperture. Then, pulse laser light is irradiated through a beam aperture. Thereby, the pattern of the area 210a is removed. Further, the beam aperture is narrowed in the X direction and the Y direction. Thereby, an octagonal beam aperture having a narrow width and a short length in the vertical direction is formed. Then, pulse laser light is irradiated through a beam aperture. Thereby, the pattern of the area 210b is removed. Finally, a triangular beam aperture is formed. Irradiate pulsed laser light through a beam aperture. Thereby, the pattern of the area 210c is removed. In this way, defects can be corrected even for complex shapes. Part of each region overlaps each other.

  Furthermore, as shown in FIG. 14, the square-shaped pixel 211 may be corrected. Here, the angle of the pixel 211 is deviated from 45 °. That is, it is not parallel to the hypotenuse of the openings 121a and 121b. In this case, the defect can be corrected by increasing the number of shots. Specifically, a parallelogram beam aperture is formed. Then, pulse laser light is irradiated through a beam aperture. Thereby, the pattern of the area 210a is removed. Next, the parallelogram beam aperture is translated and irradiated with pulsed laser light. Thereby, the pattern of the area 210b is removed. At this time, only the position of the beam aperture changes, and the aperture shape does not change.

  When the upper half of the square pixel 211 is irradiated with pulsed laser light, the beam aperture is changed to a parallelogram in the reverse direction. In other words, the angle of the hypotenuse is reversed by 90 °. When the pulse laser beam is irradiated through the parallelogram beam aperture in the reverse direction, the pattern of the region 210e is removed. At this time, the size of the parallelogram has not changed. Then, the parallelogram in the opposite direction is translated, and pulsed laser light is sequentially irradiated to the area 210h. As a result, the colored layer having the character-shaped pattern is removed. Here, if the number of shots is increased, the correction time becomes longer, but the error between the pixel shape and the irradiation region can be reduced. In this manner, the defect pattern is removed and the defect is corrected by irradiating the pulse laser beam. As a result, as shown in FIG. 10B, defects can be accurately removed. Of course, the correction can be made not only for the V-shaped but also for the V-shaped pixel and the pixel bent in a complicated manner. That is, the shape of the beam aperture 201 may be set according to the shape of the pixel, and the defect may be removed with a plurality of shots.

  Furthermore, as shown in FIG. 11, a transfer layer corresponding to the pattern can be transferred to the portion from which the pattern has been removed. That is, by using a transfer film having a transfer layer, correction according to the pattern is possible. In this case, it is preferable to transfer via the mask film 5 described above. By using the mask film 5, it is possible to prevent the transfer layer from being transferred other than the removed portion. Therefore, accurate defect correction is possible. Furthermore, the correction according to the pattern is not limited to that using a transfer film. For example, the correction may be made by applying a resin solution to the removed portion through the film opening.

  Here, the laser beam is irradiated while the beam aperture 201 is gradually opened or closed. Thereby, a slope process can be given to the pattern of the mask film 5 or a colored layer. For example, when the beam aperture 201 is gradually narrowed at the same position, a step-like film opening can be formed in the mask film 5 as shown in FIG. That is, the edge of the film opening can be processed into a tapered shape. FIG. 15 is a side cross-sectional view schematically showing the configuration of the defective portion. In FIG. 15, the mask film 5 is penetrated by 4 pulses. Thereby, the film opening part without a steep slope can be formed.

  As a result, the defect can be reliably corrected. For example, when the above-mentioned transer is used as a transfer film, there is a case where it cannot be reliably corrected at an edge portion. That is, if there is a steep edge around the defective portion, it is difficult to transfer to the edge portion. Further, if there is a steep edge in the film opening of the mask film, the transfer layer may be peeled off from the substrate 6 when the mask film 5 is peeled off. In order to solve this problem, it is preferable to form the pattern of the colored layer and the film opening in a step shape. As a result, a step-like slope is formed and can be reliably corrected.

  In the example shown in FIG. 15, the colored layer 61 is processed into a staircase shape with four shots. Here, the shape of the beam aperture 201 in each shot is gradually reduced. That is, the laser beam for 4 pulses is irradiated while the beam aperture 201 is closed. Thereby, a staircase-like edge can be created. Furthermore, the step difference of the staircase can be reduced by adjusting the power per shot of the pulse laser beam and the number of shots.

  Furthermore, it is possible to remove and correct defects without using the mask film 5. For example, the pattern of the defect portion is removed by direct irradiation with laser light. And the correction pattern according to a pattern is formed in the location from which the pattern was removed. The correction pattern can be formed by, for example, an inkjet method. That is, the correction pattern is formed by applying the resin solution only to the removed portion. Then, the shape of the beam aperture 201 can be changed according to the pulse, and the edge of the pattern remaining at the defective portion can be processed into a step shape.

  In addition, although the defect correction apparatus which corrects the colored layer of a color filter was demonstrated, this invention is not limited to this. For example, the correction target can be a TFT array substrate of a display device or a pattern substrate such as a semiconductor substrate. The beam forming apparatus 200 according to the present embodiment is suitable for a defect correction apparatus that performs fine processing of a pattern substrate. Furthermore, the beam shaping apparatus 200 may be applied to an exposure apparatus. As described above, by removing the defective portion with the defect correcting apparatus having the beam shaping apparatus, accurate defect correction can be performed in a short time. Therefore, productivity can be improved. Moreover, a pattern board without a defect can be manufactured by adding a process for correcting these defects to the manufacturing process of the pattern board. That is, after a predetermined pattern is formed on the substrate by a photolithography method or the like, a defect is detected by a defect detection mechanism provided in the defect correction apparatus. Then, the defect is corrected in the above process for this defect. Thereby, the productivity of the pattern substrate can be improved. By synchronizing the stage movement and the slit movement and combining an exposure light source, an arbitrary pattern having a complicated shape can be easily exposed at high speed without a mask pattern. Also, the exposure amount within the pattern can be easily controlled.

  In the above description, the configuration for shaping the light beam has been described. However, the beam shaping apparatus 200 can be used for other beams. For example, a charged particle beam such as an electron beam or an ion beam may be formed. That is, the beam shaping apparatus 200 may be disposed in the beam path. In this case, the material and thickness of the shutter plate 120 may be determined according to the type and energy of the beam. Further, the variable shutter device 100 described above may be used for other than beam shaping. For example, the variable shutter device 100 can be used for applications that block a part of the flow of gas, fluid, or energy.

  In addition, you may utilize the drive part 150 which consists of the magnet body 130 mentioned above and the wiring board 140 as a linear drive device. In this case, an object to be moved is attached to the wiring board 140. Thereby, a plurality of target objects can be independently moved straight in the X direction. In this case, the linear drive device includes a plurality of wiring boards provided corresponding to the plurality of target objects, and coil wirings formed in a spiral shape on the plurality of wiring boards. Further, a magnetic field in a direction crossing the current path portion in the Y direction in the coil wiring 141 is generated by the magnet provided so as to sandwich the current path in the Y direction of the coil wiring. In this way, a magnetic field is generated in a direction crossing a part of the coil wiring by the magnet pair arranged so as to sandwich a part of the coil wiring 141. Thereby, the magnet body 130 and the wiring board 140 function as a linear motor. A plurality of target objects can be moved independently with a simple configuration. In this case, the magnet body 130 is fixed to a gantry or the like. The target object is preferably a plate-like object.

  Further, the position detection unit 160 may be provided in the linear drive device. In this case, a through hole may be provided in the target object to form the position detecting light transmitting portion 122 and the light transmitting portion 123. Further, when it is difficult to form a through hole in the target object, a substrate having the position detecting light transmitting portion 122 and the light transmitting portion 123 may be attached to the target object or the wiring substrate 140. Further, the position detection unit 160 may be provided on a part of the wiring board 140. For example, a predetermined number of through-holes can be provided in a sufficiently large wiring substrate 140 to form the position detecting light transmitting portion 122 and the light transmitting portion 123. Furthermore, a substrate having the position detecting light transmitting portion 122 and the light transmitting portion 123 may be attached to the wiring substrate 140. As described above, the position detecting translucent portion 122 is provided at a location that moves in accordance with the movement of the wiring board 140. Thereby, the position of the target object can be accurately controlled.

  Thus, the linear drive device, the variable shutter device 100, and the beam shaping device 200 according to the present embodiment can be moved at high speed with a simple structure. Therefore, the processing time can be shortened. The variable shutter device 100 is preferably provided with four shutter plates 120. Thereby, opening shape can be made into various shapes. Furthermore, by providing the position detection unit 160, the position accuracy can be improved. Such a beam shaping apparatus is suitable for a beam irradiation apparatus such as a defect correction apparatus. Furthermore, the application of defect correction can be widened by forming a beam with the beam forming apparatus 200. For example, the taper shape can be easily processed, and the productivity can be improved.

It is a front view which shows typically the structure of the beam shaping apparatus using the variable shutter apparatus concerning embodiment of this invention. It is a perspective view which shows typically the structure of the variable shutter apparatus concerning embodiment of this invention. It is sectional drawing which shows the structure of the magnet body used for the variable shutter apparatus concerning embodiment of this invention. It is a front view which shows the structure of the wiring board used for the variable shutter apparatus concerning embodiment of this invention. It is a side view which shows the connection part of the wiring board and shutter board which are used for the variable shutter apparatus concerning embodiment of this invention. It is a front view which shows the connection part of the wiring board and shutter board which are used for the variable shutter apparatus concerning embodiment of this invention. It is a figure which shows the example of the beam aperture formed by the beam shaping apparatus concerning embodiment of this invention. It is a figure which shows typically the structure of the position detection part of the variable shutter apparatus concerning embodiment of this invention. It is a side view which shows typically the structure of the defect correction apparatus concerning embodiment of this invention. It is side surface sectional drawing which expands and shows the structure of the defect part corrected with the defect correction apparatus concerning this invention. It is side surface sectional drawing which expands and shows the structure of the defect part corrected with the defect correction apparatus concerning this invention. It is a block diagram which shows typically the structure of the information processing apparatus used for the variable shutter apparatus concerning this invention. It is a figure which shows an example of the shape of the pattern which can be corrected with the defect correction apparatus concerning this invention. It is a figure which shows the other example of the shape of the pattern which can be corrected with the defect correction apparatus concerning this invention. It is a side cross-section head which shows the composition of a defective part typically.

Explanation of symbols

1 Laser light source, 2 Beam shaping mechanism, 3 Half mirror, 4 Objective lens,
5 mask film, 6 substrate, 7 stage, 8 mask film reel,
9 Lamp light source, 10 Wavelength variable filter, 11 Half mirror, 12 CCD camera,
13 UV light source, 18 transfer film, 37 light source head, 41 optical system,
43 thermal transfer rod, 51 illumination light source, 52 UV light source,
61 red colored layer, 62 green colored layer, 63 blue colored layer,
64 black matrix, 65 foreign matter, 66 white defect,
100 variable shutter device, 101 variable shutter device, 103 linear guide,
120 shutter plate, 121 opening, 122 position detecting light transmitting portion, 123 light transmitting portion,
130 magnet body, 131 yoke, 132 magnet, 133 magnet,
134 magnets, 135 magnets, 137 magnet pairs,
138 Magnet pair 140 Wiring board, 141 Coil wiring, 142 Front surface, 143 Back surface,
145 Flexible wiring section, 146, supply wiring, 147 terminal, 149 through-hole 150 drive section, 160 detection section, 161 photodiode array,
162 photodiode, 164 incident surface, 165 exit surface, 166 photodetector,
200 beam shaping apparatus, 201 beam aperture, 209 pixel pattern,
210 areas, 211 pixels

Claims (22)

A linear drive device that independently moves a plurality of target objects superimposed on each other ,
A plurality of wiring boards provided corresponding to the plurality of target objects;
Coil wiring formed on each of the plurality of wiring boards;
A magnet pair disposed so as to sandwich a part of the coil wiring, and generating a magnetic field in a direction across the coil wiring,
A plurality of coil wirings of the wiring board in a superimposed state are arranged between the magnet pairs so that a magnetic field generated by the magnet pair crosses the coil wirings of the plurality of wiring boards.
A flexible wiring part in which a supply wiring for supplying current to the coil wiring is formed is provided at an end of the wiring board opposite to the side on which the target object is provided,
A linear drive device in which the flexible wiring portion extends to the outside of the magnet pair and is bent . Of the plurality of wiring boards, the flexible wiring portion of the wiring board disposed on one side of the magnet pair is bent to one side of the magnet pair,
  2. The linear drive device according to claim 1, wherein among the plurality of wiring boards, the flexible wiring portion of the wiring board disposed on the other side of the magnet pair is bent to the other side of the magnet pair. The target object is attached to one surface of the wiring board,
  The surface of the wiring board on which the target object is provided faces each other in the adjacent wiring board, or the surface on the opposite side of the surface on which the target object is provided on the wiring board faces each other. The linear drive device according to 1 or 2. A position detection unit having a light transmission part for a position detection part provided corresponding to the plurality of target objects and a light transmission part;
The position detecting translucent part moves according to the movement of the target object, and the position detecting translucent part corresponding to one of the target objects corresponds to the other target object. Arranged so as to deviate from
The translucent unit has a predetermined length in the moving direction of the target object, and the translucent unit corresponding to one target object and the position detecting translucent unit corresponding to another target object; Arranged to overlap ,
In the position detection unit,
A light source that emits light to the light transmitting portion and the position detecting light transmitting portion;
A light detector for detecting the light from the light source via the light transmitting portion for position detection and the light transmitting portion;
Linear drive according to claim 1, 2 or 3 to measure the position of the wiring board on the basis of the detection result of the photodetector. The linear drive device according to claim 4 , wherein the current supplied to the coil wiring is feedback-controlled based on a detection result of the position detection unit. A variable shutter device capable of changing an aperture shape,
A linear drive device according to any one of claims 1 to 5 ,
A plurality of shutter plates to be the plurality of target objects,
An opening is formed in each of the plurality of shutter plates,
A variable shutter device in which the opening shape is changed by displacing the shutter plate. The variable shutter device according to claim 6 , wherein an opening having an oblique side inclined from a direction parallel to a moving direction and a direction perpendicular to the moving direction is formed in at least one of the plurality of shutter plates. Forming an opening having the oblique side in at least two of the plurality of shutter plates;
The variable shutter device according to claim 7 , wherein the oblique sides provided on the two shutter plates in which the openings having the oblique sides are formed have different angles. Arranged so that the end of the shutter plate and the end of the wiring board overlap,
The variable shutter device according to any one of claims 6 to 8 , wherein the shutter plate is attached to a surface on an opposite direction side in two adjacent wiring substrates among the plurality of wiring substrates. The variable shutter device according to claim 6, wherein the shutter plate is a titanium plate. A variable shutter device according to any one of claims 6 to 10 ,
A beam forming apparatus in which openings of the plurality of shutter plates are overlapped to form a beam aperture.   The beam shaping device according to claim 11, wherein the two variable shutter devices are arranged to intersect each other. A beam source;
The beam shaping device according to claim 11 or 12, which is disposed in a path of a beam generated from the beam generation source,
A beam irradiation device for forming a spot shape of the beam by a beam aperture of the beam shaping device. 14. The beam irradiation apparatus according to claim 13, wherein a movement completion signal indicating that the shutter plate has moved to a target position is used as a trigger for the beam generation source. A defect correction method for correcting defects by irradiating light onto a pattern substrate on which a predetermined pattern is formed,
Supplying a current to the coil wiring provided in the beam shaping apparatus according to claim 11 or 12, and changing the beam aperture according to the shape of the defect to be corrected;
Allowing light from a light source to enter the beam shaping device;
Irradiating the defect portion of the pattern substrate with light that has passed through the beam aperture of the beam shaping device. The light source is a pulsed laser light source;
The defect correction method according to claim 15, wherein the shape of the beam aperture is changed in accordance with a pulse of the pulse laser beam.   The defect correction method according to claim 14, wherein the pulse laser beam is emitted based on a movement completion signal indicating that the shutter plate has moved to a target position. By irradiating the pulsed laser beam, the pattern of the defective portion is removed,
The defect correction method according to claim 16 or 17, wherein a correction pattern corresponding to the pattern is formed at a defect portion from which the pattern has been removed.   19. The defect correction method according to claim 18, wherein the edge of the pattern remaining in the defect portion is processed in a step shape by changing the shape of the beam aperture according to the pulse of the pulse laser beam. . Irradiating the pulsed laser light to the mask film arranged corresponding to the defective part of the substrate, forming a film opening corresponding to the defective part in the mask film,
The defect correction method according to claim 16, wherein the pattern substrate is irradiated with pulsed laser light through the film opening to remove the pattern of the defect portion. By changing the shape of the beam aperture according to the pulse of the pulsed laser light, the edge of the film opening is processed into a step shape,
The defect correction method according to claim 20, wherein a correction pattern corresponding to the pattern is formed on the pattern substrate through the film opening processed into the stepped shape. A method of manufacturing a patterned substrate on which a predetermined pattern is formed,
Forming a pattern on the substrate, detecting defects on the substrate,
The manufacturing method of the pattern board | substrate which corrects a defect with the defect correction method in any one of Claims 15 thru | or 21 with respect to the defect location where the said defect was detected.

Images