JP5133271B2 - Proximity exposure apparatus, substrate support method for proximity exposure apparatus, and display panel substrate manufacturing method - Google Patents

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, a substrate support method for the proximity exposure apparatus, and a display panel using the same. More particularly, the present invention relates to a proximity exposure apparatus suitable for exposing a large substrate, a substrate support method for the proximity exposure apparatus, and a display panel substrate manufacturing method using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  The proximity exposure apparatus includes a chuck that supports a substrate and a mask holder that holds a mask, and performs exposure by bringing the mask held by the mask holder and the substrate supported by the chuck very close to each other. Conventionally, there are chucks that have a flat surface and those that have a plurality of pin-shaped protrusions on the surface. In the latter, the substrate is supported at a plurality of points by pin-shaped convex portions, and the space between the portion other than the pin-shaped convex portions and the substrate is evacuated to support the substrate by vacuum suction. In such a chuck, in order to vacuum-suck a large substrate evenly, the space between the substrate and the portion other than the pin-shaped convex portion and the substrate is divided into a plurality of vacuum compartments for evacuation. Therefore, a bank (line) for forming a vacuum section is provided on the surface of the chuck.

  In a substrate that transmits light, such as a glass substrate, the light transmitted through the substrate during exposure is reflected by the chuck, passes through the substrate again, and reaches the surface of the substrate. The phenomenon of being baked on may occur. This phenomenon is called “backside transfer”. In a conventional chuck having a flat front surface, dirt on the back surface of the substrate is accumulated on the chuck, and the back surface transfer occurs due to the dirt.

  On the other hand, in a chuck having pin-shaped convex portions on the front surface, the occurrence of back surface transfer due to accumulation of dirt is small. However, when back surface transfer occurs and the surface shape of the chuck is baked onto the surface of the substrate, the pin-shaped convex portions are small and difficult to recognize by the human eye, but there is no problem, but the bank that forms the vacuum compartment is However, there is a problem that it is easily recognized by human eyes because of a regular shape such as a straight line. On the other hand, Patent Document 1 discloses a technique in which a bank that forms a vacuum section of a chuck is configured by an irregular line so that even if back surface transfer occurs, it is difficult to be recognized by human eyes.

JP 2005-332910 A

  Conventionally, a chuck is manufactured by processing a member made of a metal material such as aluminum, and the entire chuck is constituted by one member. However, with the recent increase in the screen size of display panels, the size of the substrate increases, so that the size of the chuck also increases, making it difficult to process and transport the chuck. Therefore, it has become necessary to divide the chuck into a plurality of members and configure the chuck with a plurality of members.

  In order to improve exposure accuracy with a proximity exposure apparatus, the substrate must be supported more flat during exposure. Therefore, a high flatness is required for the chuck that supports the substrate. In particular, the demand for the flatness of the chuck increases as the size of the substrate increases. However, when the chuck is divided into a plurality of members, it is difficult to install each member so that the surface height is exactly the same, and a minute step is generated at the boundary between the members. .

  In a chuck having pin-shaped convex portions on the surface, when the chuck is divided into a plurality of members, the vacuum section is also divided at the boundary between the members, and the vacuum sections are arranged on both sides of the boundary. It becomes. 12A is a cross-sectional view of a chuck having vacuum sections on both sides of the boundary, and FIG. 12B is a partial cross-sectional side view showing the chuck and the substrate when there is a step in the boundary. In FIG. 12A, the chuck 50 is constituted by two chuck members 50a and 50b. A plurality of pin-shaped convex portions 51 are provided on the surfaces of the chuck members 50a and 50b. A bank 52 is provided at the edge of the surface of each chuck member 50a, 50b, and vacuum sections are formed on both sides of the boundary 50c between the chuck member 50a and the chuck member 50b.

  As shown in FIG. 12B, when the substrate 1 is mounted on the chuck 50, each vacuum section is evacuated by the suction holes 53 to vacuum-suck the substrate 1. At this time, if the installation heights of the chuck members 50a and 50b are slightly different and there is a step at the boundary 50c between them, as shown in FIG. 12 (b), the substrate 1 is rapidly distorted following the shape of the step, There is a problem that uneven exposure occurs when the substrate 1 is exposed.

  An object of the present invention is to suppress uneven exposure due to a difference in installation height of each member when the chuck is composed of a plurality of members. Another object of the present invention is to manufacture a large display panel substrate with a high yield.

The proximity exposure apparatus of the present invention includes a chuck that supports a substrate and a mask holder that holds the mask, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. in the exposure apparatus, chuck, a plurality of chuck members having one or more vacuum sections for vacuum suction of the substrate, in a region including the boundary between the chuck member and the tea click member, non-vacuum compartment without vacuum suction of the substrate It is what has.

Further, the substrate support method of the proximity exposure apparatus of the present invention comprises a chuck for supporting the substrate and a mask holder for holding the mask, and a fine gap is provided between the mask and the substrate to form a mask pattern. a substrate supporting method of proximity exposure apparatus for transferring the substrate, constitute a chuck of a plurality of chuck members, the provided one or more vacuum compartments for vacuum suction of the substrate to each chuck member, the chuck member and tea click A non-vacuum section that does not vacuum-suck the substrate is provided in a region including the boundary with the member, and the substrate is vacuum-sucked by the vacuum section of each chuck member.

Configure chuck a plurality of chuck members, one or more vacuum sections for vacuum suction of the substrate provided in each chuck member, in the region including the boundary between the chuck member and the tea click member, non-vacuum without vacuum suction of the substrate Since the partition is provided and the substrate is vacuum-sucked by the vacuum compartment of each chuck member, the installation height of each chuck member is slightly different, and even if there is a step at the boundary between the chuck member and the chuck member, it is mounted on the chuck. Since the substrate is not vacuum-sucked in the region including the boundary, the substrate is gently deformed without following the step. Therefore, uneven exposure due to a difference in installation height of each chuck member is suppressed.

  Further, in the proximity exposure apparatus of the present invention, each chuck member is formed by a plurality of convex portions that support the substrate, a bank that forms a vacuum compartment in a space between the portion other than the convex portion and the substrate, and the bank. It has an adsorption hole for evacuating the vacuum compartment. Further, the substrate support method of the proximity exposure apparatus according to the present invention provides a plurality of convex portions on each chuck member, supports the substrate by the plurality of convex portions, and places a bank in a space between the portion other than the convex portions and the substrate. A vacuum compartment is formed by evacuating the vacuum compartment. Since each chuck member is provided with a plurality of protrusions and the substrate is supported by the plurality of protrusions, dirt on the back surface of the substrate is difficult to deposit on the chuck, and the occurrence of back surface transfer due to dirt accumulation is suppressed.

  Furthermore, the proximity exposure apparatus of the present invention includes a chuck support base that supports the back surface of each chuck member at a plurality of locations, and a plurality of height adjustment mechanisms that adjust the height at which the chuck support base supports the back surface of each chuck member. And at least one of the plurality of chuck members has at least one opening for operating the height adjusting mechanism and a lid attached to the opening, and does not vacuum-suck the substrate around the opening It has a non-vacuum compartment.

  Further, the substrate support method of the proximity exposure apparatus according to the present invention is such that each chuck member is mounted on a chuck support base, and the back surface of each chuck member is supported at a plurality of locations by the chuck support base. A plurality of height adjusting mechanisms for adjusting the height of the back surface of the chuck member, at least one of the plurality of chuck members, at least one opening for operating the height adjusting mechanism, and a lid attached to the opening And a non-vacuum compartment that does not vacuum-adsorb the substrate around the opening, and the substrate is vacuum-adsorbed by the vacuum compartment of each chuck member.

  A plurality of height adjustment mechanisms for adjusting the height at which the chuck support base supports the back surface of each chuck member are provided, and at least one of the plurality of chuck members for operating the height adjustment mechanism is provided. An opening and a lid attached to the opening are provided, a non-vacuum section that does not vacuum-suck the substrate is provided around the opening, and the substrate is vacuum-sucked by the vacuum section of each chuck member. Substantially different from the installation height, even if there is a step at the boundary between the chuck member and the lid, the substrate mounted on the chuck is not vacuum-sucked in the region including the boundary, so that it gently deforms without following the step. Therefore, uneven exposure due to the difference between the lid mounting height and the chuck member installation height is suppressed.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses, or uses the substrate support method of any of the above-described proximity exposure apparatuses to form a substrate. The substrate is exposed in support. Since uneven exposure due to a difference in the installation height of each chuck member or a difference in the installation height of the lid and the installation height of the chuck member is suppressed, the occurrence of defective products is reduced.

According to the proximity exposure apparatus and the substrate support method of the proximity exposure apparatus of the present invention, the chuck is constituted by a plurality of chuck members, and each chuck member is provided with one or more vacuum sections for vacuum-adsorbing the substrate, and the chuck member. and in a region including a boundary between the tea click member, the substrate provided with the non-vacuum compartment without vacuum suction, by vacuum suction of the substrate by vacuum sections of the chuck members, due to a difference in installation height of each chuck member Uneven exposure can be suppressed.

  Furthermore, according to the proximity exposure apparatus and the substrate support method of the proximity exposure apparatus of the present invention, each chuck member is provided with a plurality of protrusions, the substrate is supported by the plurality of protrusions, and the portions other than the protrusions By forming a vacuum section with a bank in the space with the substrate and evacuating the vacuum section, it is possible to suppress the back surface transfer from occurring due to contamination on the chuck.

  Furthermore, according to the proximity exposure apparatus and the substrate support method of the proximity exposure apparatus of the present invention, each chuck member is mounted on the chuck support base, and the back surface of each chuck member is supported at a plurality of locations by the chuck support base, A plurality of height adjustment mechanisms for adjusting the height at which the chuck support base supports the back surface of each chuck member are provided, and at least one of the plurality of chuck members for operating the height adjustment mechanism is provided. An opening and a lid attached to the opening are provided, a non-vacuum section that does not vacuum-suck the substrate is provided around the opening, and the substrate is vacuum-sucked by the vacuum section of each chuck member. Exposure unevenness due to the difference in installation height can be suppressed.

  According to the method for manufacturing a display panel substrate of the present invention, uneven exposure due to a difference in installation height of each chuck member or a difference in installation height of the lid and the installation height of the chuck member is suppressed, and generation of defective products is reduced. Therefore, a large display panel substrate can be manufactured with a high yield.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. 2A is a top view of the chuck of the proximity exposure apparatus according to the embodiment of the present invention, and FIG. 2B is a side view of the chuck and the chuck support base. It is a figure which shows the vacuum division of the chuck | zipper of the proximity exposure apparatus by one Embodiment of this invention. 4A is a cross-sectional view taken along the line AA in FIG. 2A, and FIG. 4B is a partial cross-sectional side view showing the chuck and the substrate when there is a step at the boundary. FIG. 5A is a top view of the chuck support, and FIG. 5B is a side view of the chuck support. It is a partial cross section side view of the height adjustment mechanism provided in the chuck | zipper support stand. It is the figure which expanded the part of the lid | cover of the chuck member 10a. It is a partial cross section side view of the BB part of FIG. It is a partial cross section side view of the CC section of FIG. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device. 12A is a cross-sectional view of a chuck having vacuum sections on both sides of the boundary, and FIG. 12B is a partial cross-sectional side view showing the chuck and the substrate when there is a step in the boundary.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support 9, a chuck 10, and a mask holder 20. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, the chuck 10 is in a load / unload position where the substrate 1 is loaded and unloaded. At the load / unload position, the substrate 1 is carried into the chuck 10 and the substrate 1 is carried out of the chuck 10 by a substrate transfer robot (not shown). The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot.

  A mask holder 20 that holds the mask 2 is installed above the exposure position where the substrate 1 is exposed. The mask holder 20 holds the periphery of the mask 2 by vacuum suction. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  The chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIG. 1). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves along the Y guide 6 in the Y direction (the depth direction in FIG. 1). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the chuck 10.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Then, the substrate 1 is positioned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction (vertical direction in FIG. 1) by a Z-tilt mechanism (not shown).

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support base 9 is provided with a Z-tilt mechanism, The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chuck 10 in the Z direction.

  2A is a top view of the chuck of the proximity exposure apparatus according to the embodiment of the present invention, and FIG. 2B is a side view of the chuck and the chuck support base. In the present embodiment, the chuck 10 includes three chuck members 10a, 10b, and 10c. However, the present invention is not limited to this, and the chuck 10 may be composed of two or four or more chuck members. By configuring the chuck 10 with a plurality of chuck members, the chuck 10 can be easily processed and transported for each chuck member even if the overall size of the chuck 10 is large.

  In FIG. 2A, a convex portion (not shown) and a bank 12 are provided on the surface of each chuck member 10a, 10b, 10c. The convex portion has a pin shape with a diameter of several mm, and a plurality of convex portions are provided on the surface of each chuck member 10a, 10b, 10c at a predetermined interval. When the substrate 1 is mounted on the chuck 10, the convex portions support the substrate 1 at a plurality of points. At this time, a space is formed between the portion other than the convex portion on the surface of the chuck 10 and the substrate 1. The bank 12 is a continuous wall having a predetermined width, and forms a vacuum compartment in a space between the substrate 1 and a portion other than the convex portion on the surface of the chuck 10.

  Note that the bank 12 is not a straight line but an irregular line so that it is difficult for the human eye to recognize the back surface transfer, but in FIG. 2A, the bank 12 is easy to see. The edges of are indicated by straight lines. Further, in addition to the convex portion and the bank 12, the chuck members 10a, 10b, and 10c are provided with suction holes for evacuating the vacuum section and through holes through which the push-up pins pass. They are omitted in (a).

  FIG. 3 is a view showing the vacuum compartment of the chuck of the proximity exposure apparatus according to the embodiment of the present invention. In FIG. 3, regions 10 f to 10 z surrounded by broken lines and shaded on the chuck members 10 a, 10 b, and 10 c are vacuum sections formed by the banks 12. A region including a boundary 10d between the chuck member 10a and the chuck member 10b, a region having a predetermined distance D from the boundary 10d, and a region 10e between the chuck member 10a and the chuck member 10c, and a region having a predetermined distance D from the boundary 10e are defined as a vacuum section. Rather, it is a non-vacuum compartment.

  In the present embodiment, the chuck member 10a is provided with a total of 13 rectangular or square vacuum compartments 10f to 10r, and the chuck members 10b and 10c are provided with a total of four vacuum compartments 10s to 10v and 10w to 10z. However, the shape and number of the vacuum compartments are not limited thereto.

  4A is a cross-sectional view taken along the line AA in FIG. 2A, and FIG. 4B is a partial cross-sectional side view showing the chuck and the substrate when there is a step at the boundary. As shown in FIG. 4A, a plurality of convex portions 11 are provided on the surfaces of the chuck members 10a and 10b. A bank 12 is provided at a distance of a predetermined distance D from the boundary 10d between the chuck member 10a and the chuck member 10b. The bank 12 is provided on the right side from the bank 12 of the chuck member 10a, and on the left side from the bank 12 of the chuck member 10b. A vacuum compartment is formed. Each vacuum compartment is provided with a suction hole 13 for evacuating the vacuum compartment, and the suction hole 13 is connected to a vacuum facility (not shown). The region from the bank 12 of the chuck member 10a to the bank 12 of the chuck member 10b including the boundary 10d between the chuck member 10a and the chuck member 10b is a non-vacuum section.

  As shown in FIG. 4B, when the substrate 1 is mounted on the chuck 10, each vacuum section is evacuated by the suction holes 13 and vacuum-sucks the substrate 1. At this time, even if the installation height of the chuck members 10a and 10b is slightly different and there is a step at the boundary 10d between the chuck member 10a and the chuck member 10b, the substrate 1 mounted on the chuck 10 is a region including the boundary 10d. Because it is not vacuum-sucked, it deforms gently without following the steps. Therefore, uneven exposure due to the difference in installation height between the chuck members 10a and 10b is suppressed. The same applies to the chuck member 10a and the chuck member 10c.

  In FIG.2 (b), the chuck | zipper support stand 9 supports the back surface of each chuck | zipper member 10a, 10b, 10c in multiple places. As will be described later, the chuck support base 9 is provided with a plurality of height adjustment mechanisms that adjust the height at which the chuck support base 9 supports the back surfaces of the chuck members 10a, 10b, and 10c. Also, a plurality of height adjustment mechanisms for adjusting the height at which the chuck support 9 supports the back surface of the chuck member 10a are provided near the center of the back surface of the chuck member 10a, as will be described later.

  In FIG. 2A, a plurality of circular openings are provided near the center of the chuck member 10a, and a lid 14 is attached to the openings. In the present embodiment, after the chuck members 10a, 10b, and 10c are mounted on the chuck support base 9, the height adjustment mechanism provided on the chuck support base 9 is operated from the outside of the chuck 10, so that the back surface of the chuck member 10a. A height adjusting mechanism provided near the center of the chuck is operated from the opening to adjust the height at which the chuck support 9 supports the back surface of each chuck member 10a, 10b, 10c. Even if the size of the entire chuck 10 is large and the tool does not reach the height adjustment mechanism provided near the center of the back surface of the chuck member 10a from the outside of the chuck 10, it is provided near the center of the back surface of the chuck member 10a. Since the height adjusting mechanism can be easily operated from the opening, the flatness of the chuck 10 can be improved.

  In the present embodiment, twelve openings are provided in the vicinity of the central portion of the chuck member 10a, but the position and number of the openings are not limited to this.

  FIG. 5A is a top view of the chuck support, and FIG. 5B is a side view of the chuck support. The chuck support 9 includes a frame 30, a height adjustment mechanism including an adjustment screw 31, and a receiving part 35. The frame 30 is mounted on the θ stage 8 of FIG. The frame 30 has a plurality of spokes having a predetermined thickness extending radially or vertically and horizontally, and a rim having a predetermined thickness is attached to the middle and the tip of each spoke to form a lattice-shaped frame. . On the upper surface of the frame 30, a height adjusting mechanism including the adjusting screw 31 and a receiving portion 35 with which the height adjusting mechanism provided near the center of the back surface of the chuck member 10a contacts are attached.

  In the present embodiment, the height adjusting mechanism including the adjusting screw 31 is attached at 82 places and the receiving portion 35 is attached at 12 places. However, the height adjusting mechanism and the receiving portion 35 including the adjusting screw 31 are provided. These numbers and their arrangement are appropriately determined according to the size and shape of the chuck member.

  In FIG. 2B, a plurality of support portions 15 with which the adjusting screws 31 are in contact are provided on the back surfaces of the chuck members 10a, 10b, and 10c. The adjusting screw 31 contacts the support portion 15 provided on the back surface of each chuck member 10a, 10b, 10c, and supports the back surface of each chuck member 10a, 10b, 10c at a plurality of points.

  FIG. 6 is a partial cross-sectional side view of the height adjusting mechanism provided on the chuck support. The height adjustment mechanism includes a screw hole provided in the frame 30, an adjustment screw 31, a spring washer 32, a flat washer 33, and a set nut 34. The support portion 15 provided on the back surface of each chuck member 10a, 10b, 10c includes a screw receiver 16, a cover 17, and a bolt 18.

  The head of the adjustment screw 31 forms a part of a spherical surface, and the apex thereof is in contact with the screw receiver 16. A spring washer 32 is inserted between the head of the adjustment screw 31 and the cover 17, and the cover 17 is fixed to the screw receiver 16 with a bolt 18. By inserting the spring washer 32 between the head of the adjusting screw 31 and the cover 17, the lateral displacement of each chuck member 10a, 10b, 10c is prevented.

  A screw portion 31 a of the adjustment screw 31 is screwed into a screw hole provided in the frame 30. A flat washer 33 and a set nut 34 are attached to the screw portion 31 a of the adjustment screw 31, and the adjustment screw 31 is fixed to the frame 30 by the set nut 34. The height of the point where the adjusting screw 31 supports the back surface of each chuck member 10a, 10b, 10c is adjusted by loosening the locking nut 34, adjusting the screwing amount of the adjusting screw 31, and tightening the locking nut 34 again. The

  FIG. 7 is an enlarged view of the lid portion of the chuck member 10a. In FIG. 7, a plurality of convex portions 11 are provided at predetermined intervals on the surfaces of the chuck member 10 a and the lid 14. A bank 12 is provided around the opening of the chuck member 10 a, and a vacuum compartment is formed outside the bank 12. The vacuum compartment formed outside the bank 12 is provided with a suction hole 13 for evacuating the vacuum compartment, and the suction hole 13 is connected to a vacuum facility (not shown). Inside the bank 12, the periphery of the opening including the boundary 14a between the chuck member 10a and the lid 14 is a non-vacuum compartment. In the peripheral part of the lid 14, screw holes for screwing set screws 47, 48, 49 described later are provided at a plurality of locations.

  8 is a partial cross-sectional side view of the BB portion of FIG. FIG. 9 is a partial cross-sectional side view of the CC section of FIG. In FIG. 8, a support member 40 that supports the lid 14 is attached around the opening on the back surface of the chuck member 10a. The support member 40 is fixed to the back surface of the chuck member 10a by a bolt 45. The height adjustment mechanism provided near the center of the back surface of the chuck member 10 a includes a screw hole provided in the support member 40, an adjustment screw 41, a spring washer 42, and a set nut 44. . The receiving portion 35 provided on the upper surface of the frame 30 includes a screw receiver 36, a cover 37, and a bolt 38.

  The head of the adjustment screw 41 forms a part of a spherical surface, and its apex is in contact with the screw receiver 36. A spring washer 42 is inserted between the head of the adjustment screw 41 and the cover 37, and the cover 37 is fixed to the screw receiver 36 by a bolt 38. By inserting the spring washer 42 between the head of the adjustment screw 41 and the cover 37, the lateral displacement of the chuck member 10a is prevented.

  The screw portion 41 a of the adjustment screw 41 is screwed into a screw hole provided in the support member 40. A groove (not shown) for turning the adjustment screw 41 from above is provided at the upper end of the screw portion 41a of the adjustment screw 41. A lock nut 44 is attached to the screw portion 41 a of the adjustment screw 41, and the adjustment screw 41 is fixed to the support member 40 by the lock nut 44. The height at which the chuck support 9 supports the back surface of the chuck member 10a is adjusted by loosening the lock nut 44, adjusting the screwing amount of the adjustment screw 41, and tightening the lock nut 44 again. After performing these operations from the opening without attaching the lid 14 to the opening of the chuck member 10a, the lid 14 is attached to the opening.

  In FIG. 9, the set screw 48 is screwed into a screw hole provided in the peripheral portion of the lid 14 and is fixed by a set screw 49. The set screw 48 protrudes from the bottom surface of the lid 14 and contacts the support member 40. In the present embodiment, the mounting height of the lid 14 is adjusted by removing the set screw 49, adjusting the screwing amount of the set screw 48, and tightening the set screw 49 again. The mounting height of the lid 14 can be easily adjusted using the set screw 48 protruding from the bottom surface of the lid 14. After adjusting the mounting height of the lid 14, the lid 14 is fixed to the support member 40 with bolts 46 and the bolts 46 are fixed with set screws 47 in FIG. 8.

  In FIG. 8, when the substrate 1 is mounted on the chuck 10, the vacuum section formed outside the bank 12 of the chuck member 10 a is evacuated by the suction holes 13 and vacuum-sucks the substrate 1. At this time, the mounting height of the lid 14 is slightly different from the installation height of the chuck member 10a, and even if there is a step at the boundary 14a between the chuck member 10a and the lid 14, the substrate 1 mounted on the chuck 10 has the boundary 14a. Since it is not vacuum-sucked in the region including, it is gently deformed without following the step. Therefore, uneven exposure due to the difference between the mounting height of the lid 14 and the installation height of the chuck member 10a is suppressed.

According to the embodiment described above, the chuck 10 is composed of a plurality of chuck members 10a, 10b, and 10c, and one or more vacuum sections 10f to 10z that vacuum-suck the substrate 1 to the chuck members 10a, 10b, and 10c. the provided substrate chuck member and tea click member and the boundary 10d, the region including the 10e, the substrate 1 by providing a non-vacuum compartment without vacuum suction, the chuck members 10a, 10b, the vacuum sections 10f~10z of 10c By vacuum-adsorbing 1, it is possible to suppress uneven exposure due to differences in the installation height of the chuck members 10 a, 10 b, and 10 c.

  Furthermore, each chuck member 10 a, 10 b, 10 c is provided with a plurality of convex portions 11, the substrate 1 is supported by the plurality of convex portions 11, and a space between the portion other than the convex portions 11 and the substrate 1 is vacuumed by the bank 12. By forming the compartments 10f to 10z and evacuating the vacuum compartments 10f to 10z, it is possible to suppress the back surface transfer from occurring due to the accumulation of dirt on the chuck 10.

  Further, the chuck members 10a, 10b, and 10c are mounted on the chuck support base 9, and the back surfaces of the chuck members 10a, 10b, and 10c are supported by the chuck support base 9 at a plurality of locations. A plurality of height adjusting mechanisms for adjusting the heights supporting the back surfaces of 10a, 10b, and 10c are provided, and at least one of the plurality of chuck members 10a, 10b, and 10c is used for operating the height adjusting mechanism. At least one opening and a lid 14 attached to the opening are provided, a non-vacuum compartment that does not vacuum-suck the substrate 1 is provided around the opening, and the substrate 1 is placed by the vacuum compartments 10f to 10z of the chuck members 10a, 10b, and 10c. By vacuum suction, it is possible to suppress uneven exposure due to the difference between the mounting height of the lid 14 and the installation height of the chuck member.

  Each of the chuck members is exposed by exposing the substrate using the proximity exposure apparatus of the present invention, or by supporting the substrate using the substrate support method of the proximity exposure apparatus of the present invention and exposing the substrate. To prevent uneven exposure due to the difference in installation height or the difference between the installation height of the lid and the installation height of the chuck member, and to reduce the occurrence of defective products, manufacturing large display panel substrates with good yield. Can do.

  For example, FIG. 10 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 11 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 10, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 11, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the proximity exposure apparatus of the present invention or the substrate support method of the proximity exposure apparatus of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support stand 10 Chuck 10a, 10b, 10c Chuck member 11 Protrusion part 12 Bank 13 Adsorption hole 14 Cover 15 Support part 16, 36 Screw holder 17, 37 Cover 18, 38 Bolt 20 Mask holder 30 Frame 31, 41 Adjustment screw 32, 42 Spring washer 33 Flat washer 34, 44 Set nut 35 Receiving part 40 Support member 45, 46 Bolt 47, 48, 49 Set screw

Claims (8)

In a proximity exposure apparatus that includes a chuck that supports a substrate and a mask holder that holds a mask, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate.
The chuck includes a plurality of chuck members having one or more vacuum sections for vacuum suction of the substrate, in a region including the boundary between the chuck member and the tea click member, having a non-vacuum compartment without vacuum suction of the substrate Proximity exposure apparatus characterized by this.   Each chuck member includes a plurality of convex portions that support the substrate, a bank that forms a vacuum compartment in a space between the substrate and the portion other than the convex portion, and a suction hole that vacuums the vacuum compartment formed by the bank The proximity exposure apparatus according to claim 1, wherein: A chuck support that supports the back surface of each chuck member at multiple locations;
A plurality of height adjustment mechanisms for adjusting the height at which the chuck support base supports the back surface of each chuck member;
At least one of the plurality of chuck members has at least one opening for operating the height adjusting mechanism and a lid attached to the opening, and vacuum-sucks the substrate around the opening. The proximity exposure apparatus according to claim 1, further comprising a non-vacuum section that does not perform. A substrate support method for a proximity exposure apparatus, comprising a chuck for supporting a substrate and a mask holder for holding a mask, and providing a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. ,
The chuck is composed of a plurality of chuck members,
One or more vacuum sections for vacuum suction of the substrate to each chuck member is provided, in a region including the boundary between the chuck member and the tea click member, provided non-vacuum compartment without vacuum suction of the substrate, the vacuum of each chuck member A substrate support method for a proximity exposure apparatus, wherein a substrate is vacuum-sucked by a partition. A plurality of convex portions are provided on each chuck member, and the substrate is supported by the plurality of convex portions,
5. The method of supporting a substrate of a proximity exposure apparatus according to claim 4, wherein a vacuum compartment is formed by a bank in a space between the portion other than the convex portion and the substrate, and the vacuum compartment is evacuated. Each chuck member is mounted on a chuck support base, and the back surface of each chuck member is supported at multiple locations by the chuck support base.
A plurality of height adjustment mechanisms for adjusting the height at which the chuck support base supports the back surface of each chuck member are provided,
At least one of the plurality of chuck members is provided with at least one opening for operating the height adjusting mechanism, and a lid attached to the opening,
6. The substrate support of a proximity exposure apparatus according to claim 4, wherein a non-vacuum section that does not vacuum-suck the substrate is provided around the opening, and the substrate is vacuum-sucked by the vacuum section of each chuck member. Method.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate is exposed by supporting the substrate using the substrate supporting method of the proximity exposure apparatus according to any one of claims 4 to 6.

Images