JP5141502B2 - Chip metal plate resistor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a chip-type metal plate resistor having a low resistance value used for detecting a current value of various electronic devices and a manufacturing method thereof.

  As shown in FIG. 7, a conventional chip-type metal plate resistor of this type includes a resistor 1 composed of a metal plate, a pair of electrodes 2 provided on the lower surfaces of both ends of the resistor 1, The structure includes a pair of electrodes 2 on the lower surface of the resistor 1 and an insulating layer 3 formed on the upper surface of the resistor 1.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Special table 2003-518330 gazette

  In the above-described conventional chip-type metal plate resistor, the resistor 1 itself generates heat. Therefore, the size of the chip-type metal plate resistor must be made to correspond to the rating (temperature of the resistor 1). As a result, there has been a problem that miniaturization cannot be achieved.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems, and to provide a chip-type metal plate resistor that can be miniaturized.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention is composed of one common terminal, a plurality of individual terminals, and a metal plate, and one end is connected to the upper surface of the common terminal and the other end is the plurality. A plurality of resistors connected to the upper surface of the individual terminal, and in a direction parallel to the direction in which the common terminal and the individual terminal are arranged, the width of the common terminal is wider than the width of the individual terminal, and The dimension in which the resistor is connected to the common terminal is made wider than the dimension in which the resistor is connected to the individual terminal. According to this configuration, the width of the common terminal is made larger than the width of the plurality of individual terminals. The size of the resistor connected to the common terminal is made wider than the size of the resistor connected to the individual terminal, so that the heat generated by the resistor is increased more quickly and quickly to the common terminal. Can escape, , Since all of the plurality of resistors is connected to a large common terminal can escape the heat generated by each resistor also to quickly mounting substrate via the large common terminal. As a result, the heating temperature of the resistor when a current is applied can be kept low, and the size of the chip-type metal plate resistor can be made smaller than the size corresponding to the rating, thereby reducing the size. It has the effect that it becomes possible.

  The invention according to claim 2 of the present invention is such that, in particular, three individual terminals and three resistors are provided, respectively, and a current is alternately applied to the three resistors. According to this configuration, Since one resistor generates heat, the heat can be dissipated by other resistors, common terminals, and individual terminals, thereby reducing the heating temperature of the resistor when current is applied. Since it can be suppressed, the size of one resistor can be made smaller than the size corresponding to the rating, and this has the effect of enabling miniaturization.

  According to a third aspect of the present invention, there is provided a metal plate having a through hole in a central portion thereof, an upper surface of a portion serving as a common terminal in the chip-type metal plate resistor of the metal plate, and a plurality of individual terminals. A step of connecting a plurality of resistors across the through-hole to the upper surface of the portion to be formed, and a portion to be the plurality of individual terminals, between each of the plurality of resistors and the plurality of resistors. A step of forming a groove on the outside, a step of forming notches for adjusting a resistance value in the plurality of resistors, and injecting a resin having a low viscosity from between each of the plurality of resistors, Forming a first protective film on the back surface of the plurality of resistors, the gaps between the plurality of resistors, the grooves and the outside of the plurality of resistors, and leaving the periphery of the metal plate, Of the metal plate and the plurality of resistors. Forming a second protective film on the surface, and further, in a direction parallel to the direction in which the common terminals and the individual terminals are arranged, the width of the common terminals is wider than the width of the individual terminals, and The dimension in which the resistor is connected to the common terminal is made wider than the dimension in which the resistor is connected to the individual terminal. According to this manufacturing method, between each of the plurality of resistors and a plurality of Since the grooves on the outside of the resistor are filled with a resin having a low viscosity, the individual terminals can be reliably insulated with the resin, thereby forming notches in a plurality of resistors and causing resistance. This has the effect of preventing the resistance value from changing after the value is adjusted.

  As described above, the chip-type metal plate resistor according to the present invention has a common terminal having a width wider than that of the individual terminal, and the resistor is connected to the common terminal. The size of the resistor is wider than that of the resistor, so that the heat generated by the resistor can be released to the common terminal more quickly, and all of the resistors are connected to the large common terminal. Therefore, the heat generated by each resistor can be quickly released to the mounting board through the large common terminal. As a result, the heating temperature of the resistor when a current is applied can be kept low, and the size of the chip-type metal plate resistor can be made smaller than the size corresponding to the rating, thereby reducing the size. It has an excellent effect that it becomes possible.

  Hereinafter, a chip-type metal plate resistor according to an embodiment of the present invention will be described with reference to the drawings.

  1 is a top view of a main part of a chip-type metal plate resistor according to an embodiment of the present invention, FIG. 2 is a top view of the chip-type metal plate resistor, and FIG. 3 is an AA in FIGS. It is line sectional drawing.

  As shown in FIGS. 1 to 3, the chip-type metal plate resistor according to one embodiment of the present invention includes one common terminal 11, first to third individual terminals 12 a to 12 c, and a metal plate. And the first to third resistors having one end 13a connected to the upper surface of the common terminal 11 and the other end 13b connected to the upper surfaces of the first to third individual terminals 12a to 12c. 14a to 14c, and the width W1 of the common terminal 11 is set to the first to third in a direction p parallel to the direction in which the common terminal 11 and the first to third individual terminals 12a to 12c are arranged. The individual terminals 12a to 12c are wider than the width W2, and the first to third resistors 14a to 14c are connected to the common terminal 11, and the resistor 14a to 14c has the first to first dimensions t1. Third individual terminals 12a to 12 It is obtained by wider than the dimension t2 that is connected to.

  In the above configuration, the common terminal 11 is made of a linear metal made of Cu, and one end portions 13a of the first to third resistors 14a to 14c are respectively formed on the upper surface of the common terminal 11. It is connected.

  The first to third individual terminals 12a to 12c are made of a metal made of Cu or CuNi, and the first individual terminal 12a, the second individual terminal 12b, and the third individual terminal 12c. The other end portion 13b of the first resistor 14a, the second resistor 14b, and the third resistor 14c is connected to the upper surface of the first resistor 14a. And these 1st-3rd individual terminals 12a-12c are arrange | positioned via the fixed space | interval. In FIG. 1, all of the first to third individual terminals 12 a to 12 c are located in the same direction as viewed from the common terminal 11, but this is not always necessary.

  Further, the first to third resistors 14a to 14c are made of a metal plate mainly composed of Cu or Ni made of CuNi, NiCr, manganin or the like, and the first to third resistors. 14a to 14c are formed with notches (not shown) for adjusting the resistance value.

  At this time, one end 13a of the first resistor 14a is connected to the upper surface of the common terminal 11, and the other end 13b is connected to the upper surface of the first individual terminal 12a. One end 13a of the second resistor 14b is connected to the upper surface of the common terminal 11, and the other end 13b is connected to the upper surface of the second individual terminal 12b. Further, one end 13a of the third resistor 14c is connected to the upper surface of the common terminal 11, and the other end 13b is connected to the upper surface of the third individual terminal 12c. That is, the first to third resistors 14a to 14c are arranged in parallel. Of the first to third resistors 14a to 14c, the second resistor 14b is located between the first resistor 14a and the third resistor 14c (inside).

  The first to third resistors 14a to 14c are connected to the common terminal 11 and the first to third individual terminals 12a to 12c by a method such as welding or rolling. The common terminal 11 and the first to third individual terminals 12a to 12c are respectively formed with recesses opened on the upper surface, and both end portions 13a of the first to third resistors 14a to 14c are formed in these recesses. You may make it mount 13d.

  Here, the resistor used for current value detection requires a low resistance value of, for example, 50 mΩ or less in order to reduce the resistance value change due to heat generation during application. For this reason, in one embodiment of the present invention, A metal is adopted as the material of the resistors 14a to 14c. Since this metal has better heat dissipation than ceramics such as alumina, the heat generated by the resistors 14a to 14c can be released to the mounting substrate more effectively.

  Further, in the direction p parallel to the direction in which the common terminal 11 and the first individual terminal 12a are arranged, the width W1 of the common terminal 11 is made wider than the width W2 of the first individual terminal 12a, and the first resistor 14a. The dimension t1 connected to the common terminal 11 is made larger than the dimension t2 where the first resistor 14a is connected to the first individual terminal 12a. This relationship is the same for the second individual terminal 12b and the second resistor 14b, and the third individual terminal 12c and the third resistor 14c.

  In addition, the top and back surfaces of the first to third resistors 14a to 14c, the gaps of the first to third resistors 14a to 14c, and the gaps of the first to third individual terminals 12a to 12c, respectively. An insulating layer 15 made of an insulating material such as an epoxy resin or a polyimide resin is provided on the outside of the first resistor 14a and the outside of the third resistor 14c. Furthermore, the plating layer 16 which consists of Sn is given to the surface of the common terminal 11 and the 1st-3rd individual terminal 12a-12c.

  Next, the manufacturing method of the chip-type metal plate resistor in one embodiment of the present invention will be described.

  First, as shown in FIG. 4A, a metal plate 17 made of a metal plate made of Cu and having a through hole 17a at the center is prepared. At this time, the width W1 of the portion 18 serving as the common terminal 11 in the chip-type metal plate resistor of the metal plate 17 is set such that the first, second, and third individual terminals 12a are opposed to the portion 18 through the through hole 17a. , 12b, 12c is made wider than the width W2. In addition, although this metal plate 17 is spreading continuously in the vertical direction and the horizontal direction, only one metal plate 17 will be described in the following description.

  Next, as shown in FIGS. 4B and 4C, first to third resistors 14a to 14c made of a metal plate mainly composed of Cu or Ni made of CuNi, NiCr, manganin or the like are formed. It connects by the method of welding, rolling, etc. to the upper surface of the part 18 used as the common terminal 11, and the upper surface of the part 19 used as the 1st-3rd individual terminals 12a-12c so that it may straddle the through-hole 17a in order. At this time, one end 13a of each of the first to third resistors 14a to 14c is connected to the upper surface of the common terminal 11, and the other end 13b of each of the first to third resistors 14a to 14c is connected to the upper surface of the common terminal 11. It connects with the upper surface of the 1st-3rd individual terminal 12a-12c. FIG. 4 (c) shows a cross-sectional view taken along the line BB in FIG. 4 (b).

  Further, the first to third resistors 14a to 14c are formed by individually cutting one metal band, and one chip-type metal plate resistor is composed of a plurality of metal pieces cut from adjacent locations. If the resistors 14a to 14c constituting the resistor are formed, variations in TCR and resistance values between the first to third resistors 14a to 14c are reduced in one chip-type metal plate resistor.

  Next, as shown to Fig.5 (a), in the part 19 used as the 1st-3rd separate terminal 12a-12c, between each of the 1st-3rd resistors 14a-14c, and 1st A groove 20 is formed outside the resistor 14a and outside the third resistor 14c.

  Next, as shown in FIG. 5B, a notch 21 for adjusting the resistance value is formed in the first to third resistors 14a to 14c.

  Next, as shown in FIG.5 (c), while arrange | positioning the contact plate 22a on the lower surface of the metal plate 17, the end surface in which the groove | channel 20 of the part 19 used as the 1st-3rd individual terminals 12a-12c was formed. The abutting plate 22b is disposed on the substrate, and a resin such as a liquid or paste-like low-viscosity epoxy resin or polyimide resin is injected from between the first to third resistors 14a to 14c. Thereby, the back surface of the 1st-3rd resistor 14a-14c, each clearance gap between the 1st-3rd resistor 14a-14c, the groove | channel 20, the outer side of the 1st resistor 14a, and the 3rd resistor A first protective film 23 is formed outside 14c.

  As described above, the grooves 20 formed between the first to third resistors 14a to 14c, outside the first resistor 14a, and outside the third resistor 14c are in a state of low viscosity. Since it is made to fill with resin, between the 1st-3rd individual terminal 12a-12c can be reliably insulated with resin, Thereby, it is notch 21 to the 1st-3rd resistor 14a-14c. Can be prevented after the first to third individual terminals 12a to 12c are in contact with each other.

  Next, as shown in FIG. 6A, the metal plate 17 is made of epoxy resin, polyimide resin, or the like on the upper surface of the metal plate 17 and the first to third resistors 14a to 14c, leaving the periphery of the metal plate 17. A second protective film 24 is formed by attaching a resin sheet. Then, the first protective film 23 and the second protective film 24 are cured to form the insulating layer 15.

  Finally, as shown in FIG. 6B, after the metal plate 17 is cut into individual pieces at a predetermined position 25, the first protective film 23 and the second protective film 24 of the metal plate 17 are used. A plated layer 16 (not shown in FIG. 6) made of Sn is formed on the uncovered portion to obtain the chip-type metal plate resistor shown in FIGS.

  In the description of the manufacturing method of the chip-type metal plate resistor described above, FIGS. 4 (a) (b), 5 (a) (b) (c), and 6 (a) (b) are perspective views. FIG. 4C is a cross-sectional view.

  In the embodiment of the present invention described above, the width W1 of the common terminal 11 is set to the first to the first widths in the direction p parallel to the direction in which the common terminal 11 and the first to third individual terminals 12a to 12c are arranged. While making the width W2 of the third individual terminals 12a to 12c wider, the dimension t1 at which the first to third resistors 14a to 14c are connected to the common terminal 11 is set to the first to third. Since the resistors 14a to 14c are wider than the dimension t2 to which the first to third individual terminals 12a to 12c are connected, more heat is generated in the first to third resistors 14a to 14c, And it can escape to the common terminal 11 which is wider and wider in the lateral direction (large in volume) more quickly, and all of the first to third resistors 14a to 14c are connected to the large common terminal 11. Because of each resistance Heat generated in 14a~14c also can be released to quickly mounting substrate via the large common terminal 11. As a result, since the heat generation temperature of the first to third resistors 14a to 14c when current is applied can be kept low, the size of the chip-type metal plate resistor is made smaller than the size corresponding to the rating. Thus, the effect that the size can be reduced can be obtained.

  That is, since the joint area of the common terminal 11 with the mounting substrate is large and the volume of the solder for mounting is large, the thermal resistance is reduced, thereby making it easier for heat to escape by the common terminal 11. As a result, the rate of temperature rise can be suppressed, and the temperature of the hot spot is also lowered.

  In addition, since the chip-type metal plate resistor according to the embodiment of the present invention is a so-called multiple type, it is not necessary to mount the chip-type metal plate resistor a plurality of times, and only one mounting is sufficient. .

  Also, since the width of the common terminal 11 is wide, the resistance measurement result hardly changes even if the probe contact point in the resistance measurement is shifted, which is advantageous in terms of productivity and characteristics. is there.

  Furthermore, since the heat generated in the first to third resistors 14a to 14c can be effectively dissipated to the mounting substrate, the chip-type metal plate resistor can be reduced in size and power can be increased. It is.

  In the chip-type metal plate resistor according to the embodiment of the present invention described above, three resistors have been described. However, the number of resistors is not limited to three. Here, when three resistors are provided, the resistor can be used as a three-phase motor current value detecting resistor. In this case, since current is alternately applied to the three resistors 14a to 14c, it is the one resistor that generates heat, whereby the other resistors 14a to 14c, the common terminal 11 and the individual terminals 12a Since the heat can be dissipated at ˜12c, the heating temperature of the resistor when the current is applied can be kept low. As a result, since the size of one resistor can be made smaller than the size corresponding to the rating, compared to the case where the resistor having the same size as the rating is used as in the conventional case, it is composed of three resistors. Miniaturization becomes possible.

  That is, by turning on and off the current in order for the three resistors 14a to 14c, two resistors to which no current is applied are generated. And since the resistor to which this electric current is not applied can be used as a heat radiator, the heat generation temperature of the resistor to which the electric current is applied can be lowered.

  Therefore, in the conventional chip-type metal plate resistor, when the three chip-type metal plate resistors are arranged close to each other in parallel, the size of the chip-type metal plate resistor becomes a size corresponding to the rating. In one embodiment of the present invention, as described above, a resistor to which no current is applied is used as a radiator, so that the temperature of the resistor when a current is applied can be kept low. As a result, the size of the chip-type metal plate resistor is larger than that of the conventional single chip-type metal plate resistor, but only three chip-type metal plate resistors are joined (corresponding to the rating). It can be made smaller than the size of.

  The chip-type metal plate resistor according to the present invention has an effect that a small size is possible, and in particular, a low-resistance chip-type metal plate resistor used for detecting a current value of various electronic devices. It becomes useful by applying.

The top view of the principal part of the chip type metal plate resistor in one embodiment of the present invention Top view of the chip-type metal plate resistor A-A line sectional view in FIGS. 1 and 2 (A)-(c) The figure which shows the manufacturing method of the same chip type metal plate resistor (A)-(c) The figure which shows the manufacturing method of the same chip type metal plate resistor (A) (b) The figure which shows the manufacturing method of the same chip type metal plate resistor Perspective view of a conventional chip-type metal plate resistor

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Common terminal 12a-12c Individual terminal 13a One end part of a resistor 13b Other end part of a resistor 14a-14c Resistor 17 Metal plate 17a Through-hole 18 Part used as a common terminal 19 Part used as an individual terminal 20 Groove 21 Notch 23 First protective film 24 Second protective film

Claims (3)

A plurality of resistors configured by one common terminal, a plurality of individual terminals, and a metal plate, and having one end connected to the top surface of the common terminal and the other end connected to the top surfaces of the plurality of individual terminals The width of the common terminal is larger than the width of the individual terminal in a direction parallel to the direction in which the common terminal and the individual terminal are arranged, and the resistor is connected to the common terminal. A chip-type metal plate resistor in which the resistor is wider than the dimension in which the resistor is connected to the individual terminal. 2. The chip-type metal plate resistor according to claim 1, wherein three individual terminals and three resistors are provided, and a current is alternately applied to the three resistors. In the metal plate having a through hole in the center, a plurality of resistors are provided on the upper surface of the portion serving as a common terminal and the upper surface of the portion serving as a plurality of individual terminals in the chip-type metal plate resistor of the metal plate. A step of connecting so as to straddle a through hole, a step of forming a groove between each of the plurality of resistors and the outside of the plurality of resistors, in the portions to be the plurality of individual terminals, Forming a notch for adjusting a resistance value in the resistor, and injecting a resin having a low viscosity from between each of the plurality of resistors, the back surface of the plurality of resistors, the plurality of resistors Forming a first protective film on the outside of each gap, the groove, and the plurality of resistors, and leaving a peripheral portion of the metal plate on the top surfaces of the metal plate and the plurality of resistors. Forming the protective film 2 The width of the common terminal is wider than the width of the individual terminal in a direction parallel to the direction in which the common terminal and the individual terminal are arranged, and the resistor is connected to the common terminal. A chip-type metal plate resistor manufacturing method in which the resistor is wider than the dimension in which the resistor is connected to the individual terminal.

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