JP5145679B2 - Image display medium and manufacturing method thereof - Google Patents

Description

  The present invention relates to an image display medium and a method for manufacturing the same, and more specifically, the occurrence of a short circuit between electrodes is effectively prevented, and the display portion has high reliability, few defects, high quality, simple and inexpensive image. The present invention relates to a display medium and a manufacturing method capable of efficiently manufacturing the image display medium with a small environmental load.

  In recent years, in addition to paper media and electronic display devices as image display media, the contents of both have been combined, and the display contents are electrically rewritten among display media that have the advantages of paper and retain visibility and portability. An image display medium called “electronic paper” or “digital paper” that can be used is attracting attention. That is, cards (for example, commuter pass, examination ticket, membership card, ID card, cash card, credit card, merchandise distribution tag, etc.) having a non-contact IC represented by RFID (RF tag) are widely used. Accordingly, there has been a growing demand for rewritable display of characters, graphics, and the like on these cards, so that there is a great demand for “electronic paper” and the like.

  Among these “electronic paper” technologies, high-definition display can be achieved in a short time with simple power supply means, and non-contact writing can be performed on the display surface. The optical writing type “electronic paper” technology that is expected to be applied is attracting attention (see Patent Document 1). When manufacturing flexible "electronic paper" used in such IC cards, a liquid crystal layer is provided between flexible substrates on which thin film electrodes have been formed in advance, and then bonded to each other and then cut into the desired shape. doing. In this case, if the thin film electrode formed on the substrate has the entire shape, no special processing is required and the cost can be reduced. There is a problem that peeling or rolling occurs, or a short circuit occurs between thin film electrodes due to moisture present on the cut surface.

In order to improve such a problem, the thin film electrode of one of the substrates is prevented from being exposed at the cut portion as follows. That is, after forming a thin film electrode on the entire surface of the substrate, a predetermined portion of the thin film electrode is removed by etching or the like. Between such substrates with thin film electrodes, a liquid crystal layer having a size corresponding to the entire surface of the substrate including the portion removed by etching as described above is provided, and after bonding, the thin film electrode after a predetermined portion is removed This is dealt with by cutting into a desired shape that is slightly larger than the planar size. However, the etching process must be long and expensive, and in the process of removing the etching process liquid from the substrate with the thin film electrode (cleaning process performed after the etching process), the etching liquid on the substrate due to insufficient cleaning. If this remains, the portion becomes a defect as it is, or a defect such as a repellency occurs in the portion when the layer is formed. Furthermore, there are currently problems such as an increase in environmental load due to disposal of the etching solution.
JP 2005-18348 A

  The present invention has been made in view of the above-described background art, and the occurrence of a short circuit between electrodes is effectively prevented, and the display portion has high reliability, few defects, high quality, simple and inexpensive image display. An object of the present invention is to provide a manufacturing method capable of efficiently manufacturing a medium and the image display medium with a small environmental load.

  In order to achieve the above object, according to the present invention, the following image display medium and a manufacturing method thereof are provided.

[1] A first stacked body in which a first thin film electrode and a first display layer are formed on a first substrate, and a region (removed portion) on the second substrate that is a predetermined distance away from the periphery. And the second display layer having the removal cross section on the same plane as the removal cross section of the second thin film electrode is formed. and a second laminate, a picture image display medium comprising the above orientation of the first display layer and the second display layer are opposed, the first display layer, the second The second thin film electrode is bent so as to be in contact with the surface of the substrate, and the first stacked body and the second substrate are in contact with each other at least at a part of the removal portion. Image display medium .

[ 2 ] The image display medium according to [1], wherein the removed portion of the second thin film electrode and the second display layer is formed by laser processing.

[ 3 ] The image display medium according to [1], wherein the first display layer and the second display layer include a liquid crystal layer and a photoconductor layer.

[ 4 ] The image display medium according to [1], wherein the second display layer is the photoconductor layer, and the removed portion of the photoconductor layer is removed.

[ 5 ] The image display medium according to [1], further comprising an adhesive layer between the first display layer and the second display layer.

[ 6 ] The image display medium according to claim 1, wherein an angle formed by the removal cross section and the surface of the second substrate is smaller than 90 degrees.

[ 7 ] The above [1], further comprising first and second extraction electrodes connected to the surfaces of the first and second thin film electrodes for electrical connection with the outside. ] The image display medium as described in.

[ 8 ] The image display medium according to [1], further comprising a protective layer covering the whole.

[ 9 ] A first step of preparing a first stacked body in which a first thin film electrode and a first display layer are formed on a first substrate; a second thin film electrode on the second substrate; A second stacked body on which a second display layer is formed is prepared, and a predetermined distance from the periphery of the second substrate of the second thin film electrode and the second display layer in the second stacked body. A second step of removing a region (removed portion) separated by a distance so that the second display layer has a removed cross section on the same plane as a removed cross section of the second thin film electrode, and the first stack and said the body second laminate to a process for the preparation of the first display layer and the third step and the including images display medium and the second display layer are bonded in a direction opposite In the third step, the first laminated body and the second laminated body, the first display layer is a surface of the second substrate. The second thin film electrode is bent so as to be in contact with the first thin film electrode, and the first stacked body and the second substrate are bonded so as to be in contact with at least a part of the removed portion. A method for manufacturing an image display medium .

[ 10 ] The method for manufacturing an image display medium according to [ 9 ], wherein in the second step, the removed portions of the second thin film electrode and the second display layer are removed by laser processing. .

[ 11 ] The method for producing an image display medium according to [ 9 ], wherein a liquid crystal layer is used as the first display layer, and a photoconductor layer is used as the second display layer.

[ 12 ] The image display medium according to [ 9 ], wherein in the first step, an adhesive layer is further laminated on the first display layer to form a first laminate. Manufacturing method.

[ 13 ] The image display medium according to [ 9 ], wherein in the second step, an angle formed by the removal cross section and the surface of the second substrate is made smaller than 90 degrees. Production method.

[ 14 ] The method further includes a fourth step of connecting the first and second extraction electrodes for electrical connection to the outside to the surfaces of the first and second thin film electrodes. The method for producing an image display medium according to [ 9 ].

[ 15 ] The method for producing an image display medium as described in [ 9 ], further comprising a fifth step of forming a protective layer covering the whole.

  The image display medium according to claim 1 of the present invention effectively prevents the occurrence of a short circuit between the electrodes, and realizes a high-quality, simple and inexpensive configuration with high reliability of the display portion, few defects, and the like. .

With the image display medium according to claim 2 of the present invention, the above-described effects can be exhibited smoothly and reliably.

With the image display medium according to claims 3 to 8 of the present invention, an optical writing type “electronic paper” that exhibits the above-mentioned effects smoothly and reliably is realized.

By the method for manufacturing an image display medium according to claim 9 of the present invention, the occurrence of a short circuit between electrodes is effectively prevented, the display portion has high reliability, few defects, high quality, simple and inexpensive image display. The medium is efficiently manufactured with a low environmental load.

By the method for manufacturing an image display medium according to the tenth aspect of the present invention, the above-described effects can be exhibited smoothly and reliably.

By the method for manufacturing an image display medium according to claims 11 to 15 of the present invention, an optical writing type “electronic paper” that exhibits the above-described effects smoothly and reliably is efficiently manufactured.

[First Embodiment]
(Configuration of image display medium)
1A and 1B show an image display medium according to a first embodiment of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line AA, and FIG. (D) is CC line sectional drawing which expanded partially.

  As shown in FIG. 1, an image display medium 10 according to the present embodiment includes a first laminate 1 in which a first thin film electrode 1b and a first display layer 3a are formed on a first substrate 1a. The second laminated body 2 in which the second thin film electrode 2b and the second display layer 3b from which the region (removed portion) E away from the periphery by a predetermined distance D is removed are formed on the second substrate 2a. Are arranged in a direction in which the first display layer 3a and the second display layer 3b face each other.

  In FIG. 1, a liquid crystal layer is used as the first display layer 3a and a photoconductor layer is used as the second display layer 3b, and the second display layer (photoconductor layer) 3b is removed. The case where the part E was removed is shown. In FIG. 1, the first display layer 3a (liquid crystal layer) is disposed on the first thin film electrode 1b side, and the second display layer (photoconductor layer) 3b is disposed on the second thin film electrode 2b side. Although the case where it arrange | positions is shown, these may be arrange | positioned conversely.

  In the image display medium 10 of the present embodiment, the adhesive layer 4 is disposed between the first display layer 3a (liquid crystal layer) and the second display layer (photoconductor layer) 3b. . When the image display medium 10 is actually manufactured, the adhesive layer 4 may be disposed in advance on the liquid crystal layer 3a side or on the photoconductor layer 3b side, but ensures the adhesion between the upper and lower substrates. Therefore, it is preferable to provide it on the side not to be removed. Further, the arrangement of the adhesive layer 4 may be omitted.

  Further, in the image display medium 10 of the present embodiment, the first and second takeouts for electrical connection with the outside connected to the surfaces of the first and second thin film electrodes 1b and 2b. Electrodes 1c and 2c are arranged.

  Furthermore, in the image display medium 10 according to the present embodiment, full surface electrodes formed on the entire surfaces of the first and second substrates 1a and 2a are used as the first and second thin film electrodes 1b and 2b. .

  The image display medium 10 in the present embodiment is used as an IC card or the like to which a display function using “electronic paper” such as an optical writing type, a toner display type, and an electrophoretic method is added. Hereinafter, each component will be specifically described.

(Laminate)
The first stacked body 1 is configured by forming a first thin film electrode 1b and a first display layer 3a on a first substrate 1a. In the second stacked body 2, the second thin film electrode 2 b and the second display layer 3 b are formed on the second substrate 2 a by removing the region (removed portion) E away from the periphery by a predetermined distance D. Configured.

<Board>
As the first and second substrates 1a and 2a constituting the first and second laminates 1 and 2, at least one on the display side is, for example, polyethylene terephthalate (PET) having a thickness of 50 to 150 μm. The thing comprised so that it might consist of transparent resin materials, such as the above, can be mentioned.

<Thin film electrode>
As 1st and 2nd thin film electrode 1b, 2b which comprises the 1st and 2nd laminated bodies 1 and 2, at least one located in the display side is 10-200 nm indium tin oxide (ITO), for example, What was comprised so that it might consist of a transparent electrode which consists of zinc oxide etc. can be mentioned.

<Display layer>
The first display layer 3a and the second display layer 3b constituting the first and second laminates 1 and 2 are different depending on the type of the image display medium 10, for example, a layer having liquid crystal, colored particles, or the like. Can be mentioned. When the image display medium 10 is an optical writing type “electronic paper” as in the present embodiment, it is preferable that the first display layer 3a includes a liquid crystal layer and a photoconductor layer 3b. In the present embodiment, a case where a liquid crystal layer is used as the first display layer 3a and a photoconductor layer is used as the second display layer 3b will be described. In addition to this, for example, a light absorption layer that absorbs light A structure in which a photoconductor layer whose resistance value is reduced by light irradiation is laminated in order from the display surface side, or a structure in which a light absorption layer, a photoconductor layer, an isolation layer, and a liquid crystal layer are laminated in order from the display surface side. You may have.

  Examples of the liquid crystal layer 3a include polymer-dispersed liquid crystals and microencapsulated liquid crystals (for example, those configured to have microcapsules in which cholesteric liquid crystals are enclosed). Examples of the photoconductor layer 3b include a charge transport layer and a pair of charge generation layers stacked on both sides of the charge transport layer. Thereby, since an alternating voltage can be applied to the liquid crystal layer 3a, deterioration of the liquid crystal layer 3a can be suppressed, and the driving voltage can be lowered and the lifetime of the electronic paper can be increased. Furthermore, in addition to the above, the first display layer 3a and the second display layer 3b may be microencapsulated electrophoretic elements, gyricon elements, or the like. Examples of a method for joining the display layer 3 and the thin film electrodes 1b and 2b include bonding by application, pressure bonding, and the like.

The method of forming the removed portion E of the second thin film electrode 2b and the second display layer (photoconductor layer) 3b described later is not particularly limited as long as it does not affect the display quality of the medium. A method by laser processing can be mentioned as a preferred example. Examples of such laser processing include CO ₂ laser processing. By controlling the power of the laser beam, the irradiation region, etc., the range, depth, etc. of the removed portion can be controlled with high definition.

(Adhesive layer)
In the present embodiment, the adhesive layer 4 is disposed in order to improve the bondability between the first display layer 3a and the second display layer 3b. Examples of such an adhesive layer 4 include acrylic and urethane adhesives and pressure-sensitive adhesives. The thickness of the adhesive layer is, for example,
It is preferable that it is 1-10 micrometers.

(Extraction electrode)
The first and second extraction electrodes 1c and 2c are made of, for example, a metal such as Ni having a thickness of 100 to 200 μm, and have higher rigidity or hardness than the first and second thin film electrodes 1b and 2b. It is preferable.

(Protective layer)
In the present embodiment, although not shown, it is preferable to further include a protective layer covering the whole. As such a protective layer, for example, a thermoplastic film made of a transparent thermoplastic resin using PET (polyethylene terephthalate), amorphous PET (PET-G), polyvinyl chloride, polyester, or a combination thereof. Can be mentioned. Such a thermoplastic film is formed, for example, by thermocompression bonding a thermoplastic member to the surface of the image display medium 10 using a bonding tool. In this case, it is preferable to have an extraction hole for connecting to the first and second extraction electrodes 1c and 2c from the outside. In order to prevent wear of the extraction hole, a metal pipe such as Ni or stainless steel is fitted into the extraction hole, and the first and second extraction electrodes 1c and 2c are wired in the metal pipe. It may be.

(IC chip)
In this embodiment mode, although not illustrated, an IC chip such as a wireless tag may be mounted in a predetermined area as necessary.

(Production of image display medium)
FIG. 2 is a cross-sectional view showing the manufacturing process of the image display medium according to the first embodiment of the present invention in the order of steps, in which (a) shows the first thin film electrode and the first display on the first substrate. A first step of preparing a first laminate in which a layer and an adhesive layer are formed, and (b) is a second step in which a second thin film electrode and a second display layer are formed on a second substrate. A second body is prepared, and a second thin film electrode and a second display layer in the second stacked body are removed by removing a region (removed portion) away from the periphery of the second substrate by a predetermined distance. Step (c) is a third step of bonding the first laminate and the second laminate in the direction in which the first display layer and the second display layer face each other. (D) After the combination, the obtained image display media are shown.

(First step)
As shown in FIG. 2A, a first thin film electrode 1b made of ITO is formed on a first substrate 1a made of PET by sputtering to form a first substrate laminate S1. Next, the first display layer (liquid crystal layer) 3a and the adhesive layer 4 are stacked and arranged on the first thin film electrode 1b to form the first stacked body. Here, there is no restriction | limiting in particular as a lamination | stacking and arrangement | positioning method of the 1st display layer (liquid crystal layer) 3a and the adhesive bond layer 4, Although the method currently used widely can be used, The method by application | coating is a point of cost. preferable.

(Second step)
As shown in FIG. 2B, a second thin film electrode 2b made of ITO is formed on a second substrate 2a made of PET to form a second substrate laminate S2. A second display layer (photoconductor layer) 3b is laminated and disposed on the second substrate laminate 2. Here, there is no restriction | limiting in particular as a lamination | stacking and arrangement | positioning method of the photoconductor layer 3b, Although the method used widely can be used, The method by application | coating is preferable at the point of cost. Next, laser light is irradiated from the photoconductor layer 3b side, and a region separated by a predetermined distance D from the peripheral edges of the second substrate 2b and the photoconductor layer 3b (removed portion E (see FIG. 1A)). ) Is removed to form the second laminate 2.

(Third step)
As shown in FIG.2 (c), the 1st laminated body 1 and the 2nd laminated body 2 are bonded together. In this case, for example, the first laminated body 1 and the second laminated body 2 fixed on the stand are heated from the vertical direction with a cushioning material sandwiched between them using a bonding tool (for example, 60 to 150 ° C. ) And applying pressure (for example, 0.1 to 1 N / mm ² ). Further, for example, heating and pressurization may be performed under the same conditions from both the front and back surfaces of the first laminate 1 and the second laminate 2 by using a laminating method using a heating roller. Moreover, you may use an adhesive agent for a joint surface.

  After the first laminated body 1 and the second laminated body 2 are bonded together, the image display medium 10 shown in FIG. 2D is obtained by punching into the planar shape shown in FIG. Here, FIG. 2D corresponds to FIG. As shown in FIG. 2 (d), the region (removed portion E (see FIG. 1 (a)) separated by a predetermined distance D from the peripheral edges of the second substrate 2b and the photoconductor layer 3b is removed. The adhesive layer 4 which is the lowermost layer portion of the first laminated body 1 is bent so as to be in contact with the surface of the second substrate 2a so as to cover the second thin film electrode 2b and short-circuit with the first thin film electrode 1b. Is effectively prevented.

(Fourth process)
Next, first and second extraction electrodes 1c and 2c (see FIG. 1A) for electrical connection with the outside are connected to the surfaces of the first and second thin film electrodes 1b and 2b. To do.

(Fifth step)
Next, if necessary, an IC chip such as a wireless tag is mounted and a protective layer covering the whole is formed.

  In this way, an image display medium that is less likely to be short-circuited, in which the region (removed portion E (see FIG. 1A)) that is a predetermined distance D away from the periphery of the second substrate 2b and the photoconductor layer 3b is removed. 10 can be obtained. In addition, since the method of this embodiment uses a laser beam for removing the removed portion E and the like, patterning by etching is unnecessary, does not give an excessive load to the environment, and defects caused by etching. The image display medium 10 with high quality and low cost can be produced without generating the above.

(Another example of manufacturing an image display medium)
FIG. 3 is an explanatory view showing another manufacturing process of the image display medium according to the first embodiment of the present invention in the order of steps. FIG. 3A shows the formation of the first thin film electrode on the first substrate. And (b) is a step of forming a first display layer and an adhesive layer on the first substrate laminate to obtain the first laminate, (c) These are the top view and sectional drawing which show the process of forming the 1st cut part in order to form the connection part with an extraction electrode in the 1st laminated body, respectively. FIG. 4 is an explanatory view showing the manufacturing process after the manufacturing process shown in FIG. 3 in the order of processes. FIG. 4A shows a second substrate laminate in which a second thin film electrode is formed on a second substrate. (B) is a step of forming a second display layer on the second substrate laminate, and (c) is a second step for forming a connection portion with the extraction electrode on the second laminate. (D) is a step (d) in which a region (removal portion) of the second thin film electrode and the second display layer in the second stacked body that is separated from the peripheral edge of the second substrate by a predetermined distance is removed. It is the top view and sectional drawing which show the process to remove, respectively.

(First step)
In another example of manufacturing the image display medium below, three image display media 10 shown in FIG. 1A are manufactured at the same time. As shown in FIG. 3A, a first thin film electrode 1b made of ITO is formed on a first substrate 1a made of PET by sputtering to form a first substrate laminate S1. Next, as shown in FIG. 3 (b), the first display layer (liquid crystal layer) 3a and the adhesive layer 4 are laminated and arranged on the entire surface of the first thin film electrode 1b to form the first laminated body. Set to 1. Here, there is no restriction | limiting in particular as a lamination | stacking and arrangement | positioning method of the 1st display layer (liquid crystal layer) 3a and the adhesive bond layer 4, Although the method currently used widely can be used, The method by application | coating is a point of cost. preferable. Next, as shown in FIG. 3C, in order to form a connection portion with the extraction electrode (see FIG. 1A) for electrical connection with the outside, the first substrate laminate S1 is formed. Then, the first cut layer 1d is formed by cutting the first display layer (liquid crystal layer) 3a and part of the adhesive layer 4 so as to penetrate.

(Second step)
As shown in FIG. 4A, a second thin film electrode 2b made of ITO is formed on a second substrate 2a made of PET to form a second substrate laminate S2. Next, as shown in FIG. 4B, a second display layer (photoconductor layer) 3b is laminated and disposed on the second substrate laminate S2. Here, there is no restriction | limiting in particular as a lamination | stacking and arrangement | positioning method of the photoconductor layer 3b, Although the method used widely can be used, The method by application | coating is preferable at the point of cost. Next, as shown in FIG. 4C, in order to form a connection portion with the extraction electrode (see FIG. 1A) for electrical connection with the outside, the second substrate laminate S2 is formed. Then, a second cut portion 2d is formed by cutting a part of the second display layer (photoconductor layer) 3b. Next, as shown in FIG. 4D, laser light is irradiated from the photoconductor layer 3b side, and a region (a predetermined distance D away from the periphery of the second thin film electrode 2b and the photoconductor layer 3b). The removed portion E (see FIG. 1A)) is removed, and the second stacked body 2 is formed.

(Subsequent processes)
FIG. 5 is a plan view showing a state in which the laminates formed with the cut portions shown in FIGS. 3 and 4 are bonded together. FIG. 6 is a plan view showing a state in which the bonded body of the first laminated body and the second laminated body shown in FIG. 5 is punched into the shapes of three image display media. FIG. 7 is a plan view showing a layer peeling portion for peeling the layer for connection with the extraction electrode and stripping the electrode portion in the punched body shown in FIG.

  Hereinafter, steps subsequent to the second step will be described with reference to FIGS. As shown in FIG. 5, the 1st laminated body 1 in which the 1st cut part 1d obtained by the 1st process was formed, and the 2nd cut part 2d obtained by the 2nd process were formed. The second laminate 2 is bonded together. Thereafter, the bonded body is punched at a portion of a punching line L indicated by a two-dot chain line, and formed into three punched bodies shown in FIG. In FIG. 5, among the three quadrangular shapes surrounded by the punching line L, the hatched portion of the one located on the left side shows the second cut portion 2d of the second laminate 2, and is located in the middle. The hatched portion shows the first cut portion 1d of the first laminate 1, and the hatched portion of the first laminate 1 is the first and second of the first and second laminates 1 and 2. The cut portions 1d and 2d of FIG.

  FIG. 6 shows a state in which three punched bodies (first and second laminated bodies 1 and 2) are formed by punching at the portion of the punching line L as described above. This punched body corresponds to a shape obtained by removing the first and second extraction electrodes 1c and 2c from the shape in FIG.

  As shown in FIG. 7, each of the three punched bodies (first and second laminated bodies 1 and 2) shown in FIG. 3b and the adhesive layer 4 are peeled off to expose the first and second thin film electrodes 1b and 2b, thereby enabling connection with the first and second extraction electrodes 1c and 2c. In addition, although this layer peeling process showed the case where it performed after the punching process, if it is after formation of a layer (1st and 2nd display layer 3a, 3b and adhesive layer), 1st and 2nd It may be performed before the cut portions 1d and 2d are formed, or may be performed before the punching step.

  Next, the first and second extraction electrodes 1c and 2c are connected to the exposed portions of the first and second thin film electrodes 1b and 2b, and an IC chip such as a wireless tag is mounted if necessary. At the same time, a protective layer covering the whole is formed.

  In this way, an image display medium that is less likely to be short-circuited, in which the region (removed portion E (see FIG. 1A)) that is a predetermined distance D away from the periphery of the second substrate 2b and the photoconductor layer 3b is removed. Three 10 can be obtained simultaneously.

[Second Embodiment]
(Configuration of image display medium)
FIG. 8 is a cross-sectional view showing a portion corresponding to the portion shown in FIG. 1D in the first embodiment of the image display medium according to the second embodiment of the present invention.

As shown in FIG. 8 , the basic configuration of the image display medium 10 according to the second embodiment is the same as that of the first embodiment shown in FIG. In the case of the image display medium 10 according to the embodiment, the end surface after removing the second thin film electrode 2b and the removed portion E (see FIG. 1A) of the photoconductor layer 3b and the second substrate 2a. The angle (cut angle) θ formed with the surface is 90 degrees in the case of the first embodiment, but is smaller than this, that is, the lowermost layer portion of the first laminate 1. When the adhesive layer 4 is bent so as to be in contact with the surface of the second substrate 2a to cover the second thin film electrode 2b, the angle is increased, for example, θ = 30 to 60 degrees. Furthermore, it is comprised so that a short circuit can be prevented reliably. The method for controlling the cut angle θ is not particularly limited. For example, the incident angle θ of the laser beam (the angle between the laser beam and the normal of the surface of the second substrate 2a (90−θ)). However, it can control to be set to 60 to 30 degrees and irradiate laser light.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention. In addition, the constituent elements of the above-described embodiments may be arbitrarily combined within a scope that does not depart from the spirit of the invention.

  The image display medium of the present invention can be used as an RFID (RF tag) as an application such as “electronic paper” or “digital paper” that can maintain the visibility and portability and can electrically rewrite display contents. Cards (eg, commuter pass, examination ticket, membership card, ID card, cash card, credit card, merchandise distribution tag, etc.) and information media (eg, books, advertisements, etc.) equipped with representative non-contact ICs It is effectively used in various industrial fields that deal with, for example, transportation industry, medical industry, financial industry, distribution industry, publishing industry, information transmission industry, electronic equipment manufacturing industry, and the like.

The image display medium which concerns on the 1st Embodiment of this invention is shown, (a) is a top view, (b) is AA sectional view, (c) BB sectional drawing, (d) is It is CC sectional view taken on the line which expanded partially. It is sectional drawing which shows the manufacturing process of the image display medium which concerns on the 1st Embodiment of this invention in order of a process, (a) is a 1st thin film electrode, a 1st display layer, and an adhesive agent on a 1st board | substrate. A first step of preparing a first laminated body in which a layer is formed, and (b) preparing a second laminated body in which a second thin film electrode and a second display layer are formed on a second substrate. And (c) removing a region (removed portion) of the second thin film electrode and the second display layer in the second stacked body that is separated from the peripheral edge of the second substrate by a predetermined distance (c). ) Is a third step of bonding the first stacked body and the second stacked body in the direction in which the first display layer and the second display layer face each other, (d) Each of the obtained image display media is shown. It is explanatory drawing which shows the other manufacturing process of the image display medium based on the 1st Embodiment of this invention in process order, (a) forms a 1st thin film electrode on a 1st board | substrate, and is 1st. (B) is a step of forming a first display layer and an adhesive layer on the first substrate laminate to form a first laminate, and (c) is a first laminate. It is the top view and sectional drawing which show the process cut | disconnected in order to form an electrode part in the laminated body of, respectively. It is explanatory drawing which shows the manufacturing process after the manufacturing process shown in FIG. 3 in order of a process, (a) is the process of forming a 2nd thin film electrode on a 2nd board | substrate, and setting it as a 2nd board | substrate laminated body, (B) is a step of forming a second display layer on the second substrate laminate, (c) is a step of cutting to form an electrode portion on the second laminate, and (d) is a step of forming a second display layer. FIG. 10 is a plan view and a cross-sectional view showing a step of removing a region (removed portion) of the second thin film electrode and the second display layer in the stacked body of FIG. It is a top view which shows the state which bonded together the laminated body in which the cut part shown in FIG.3 and FIG.4 was formed. FIG. 6 is a plan view showing a state in which the bonded body of the first laminated body and the second laminated body shown in FIG. 5 is punched into the shapes of three image display media. It is a top view which shows the layer peeling part for peeling a layer for the connection with an extraction electrode in the punching body shown in FIG. 6, and exposing an electrode part. It is sectional drawing which shows the part corresponding to the part which FIG.1 (d) shows in 1st Embodiment of the image display medium which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st board | substrate laminated body 1a 1st board | substrate 1b 1st thin film electrode 1c 1st extraction electrode 1d 1st cut part 2 2nd board | substrate laminated body 2a 2nd board | substrate 2b 2nd thin film electrode 2c 2nd 2 extraction electrode 2d 2nd cut part 3 Display layer 3a Liquid crystal layer 3b Photoconductor layer 4 Adhesive layer 10 Image display medium D Distance E from peripheral edge Removal part (corresponding removal part)
F layer peeling portion S1 first laminate S2 second laminate θ cut angle

Claims (15)

A first laminate in which a first thin film electrode and a first display layer are formed on a first substrate;
On the second substrate, the second thin film electrode from which the region (removed portion) separated from the peripheral edge by a predetermined distance is removed, and the region corresponding to the removed portion is removed and the second thin film electrode is removed. images of the second display layer having a removal cross-section on the section in the same plane and a second stack formed, the first display layer and the second display layer including in a direction opposite A display medium ,
The first display layer is bent so as to be in contact with the surface of the second substrate to cover the second thin film electrode, and the first stacked body and the second substrate include the removed portion. An image display medium which contacts at least a part of the image display medium .   The image display medium according to claim 1, wherein the removed portion of the second thin film electrode and the second display layer is formed by laser processing.   The image display medium according to claim 1, wherein the first display layer and the second display layer include a liquid crystal layer and a photoconductor layer.   The image display medium according to claim 1, wherein the second display layer is the photoconductor layer, and the removed portion of the photoconductor layer is removed.   The image display medium according to claim 1, further comprising an adhesive layer between the first display layer and the second display layer.   The image display medium according to claim 1, wherein an angle formed by the removal cross section and the surface of the second substrate is smaller than 90 degrees.   The first and second extraction electrodes connected to the surfaces of the first and second thin film electrodes for electrical connection with the outside are further provided. Image display medium.   The image display medium according to claim 1, further comprising a protective layer covering the whole. A first step of preparing a first stacked body in which a first thin film electrode and a first display layer are formed on a first substrate;
A second stacked body in which a second thin film electrode and a second display layer are formed on a second substrate is prepared, and the second thin film electrode and the second display layer in the second stacked body are prepared. An area (removed portion) that is a predetermined distance away from the peripheral edge of the second substrate is removed so that the second display layer has a removed section on the same plane as the removed section of the second thin film electrode. A second step of:
And said second laminate and the first laminate of the first display layer and the third step and the including images display medium and the second display layer are bonded in a direction opposite A manufacturing method comprising :
In the third step, the second thin film electrode is formed by bending the first stacked body and the second stacked body so that the first display layer is in contact with the surface of the second substrate. And the first laminated body and the second substrate are bonded together so as to be in contact with at least a part of the removed portion . 10. The method for manufacturing an image display medium according to claim 9 , wherein, in the second step, the removed portions of the second thin film electrode and the second display layer are removed by laser processing. The method for manufacturing an image display medium according to claim 9 , wherein a liquid crystal layer is used as the first display layer, and a photoconductor layer is used as the second display layer. The method for manufacturing an image display medium according to claim 9 , wherein, in the first step, an adhesive layer is further laminated on the first display layer to form a first laminate. 10. The method of manufacturing an image display medium according to claim 9 , wherein, in the second step, an angle formed by the removal cross section and the surface of the second substrate is made smaller than 90 degrees. 10. The method according to claim 9 , further comprising a fourth step of connecting first and second extraction electrodes for electrical connection to the outside to the surfaces of the first and second thin film electrodes. The manufacturing method of the image display medium as described in 1 .. The method for manufacturing an image display medium according to claim 9 , further comprising a fifth step of forming a protective layer covering the whole.

Images