JP5149072B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting apparatus that cuts a workpiece held on a chuck table with a cutting blade rotated at high speed.

  In a cutting machine that uses a cutting blade to cut or cut a workpiece such as a semiconductor, glass, ceramics, metal, or other electronic component material, the depth of cut (cutting depth) into the workpiece is reduced. Maintaining a constant value at a predetermined value is an important factor.

  For this reason, generally, the cutting means is cut and fed with reference to the holding surface of the chuck table that holds the workpiece, and the amount of cut into the workpiece is obtained from the uncut amount from the holding surface of the chuck table. The method is taken (for example, refer patent document 1).

JP 2002-59365 A

  However, when the amount of cut into the work piece is obtained by such a method, since the cutting is performed at a position where the distance from the holding surface of the chuck table is constant, the thickness variation or warpage of the work piece, or If the workpiece is a bonded substrate and there are deformations due to poor bonding, etc., the actual cutting amount will vary, and it is necessary to keep the cutting amount constant. There is a problem that the amount of cut is not obtained.

  The present invention has been made in view of the above, and even if the workpiece has deformation such as thickness variation or warpage, the workpiece can be cut at a certain depth by a predetermined cutting amount. It aims at providing the cutting device which can be performed.

  In order to solve the above-described problems and achieve the object, a cutting apparatus according to the present invention includes a chuck table for holding a workpiece, and cutting for cutting a workpiece held on the chuck table by a predetermined cutting amount. Means, a machining feed means for relatively moving the chuck table and the cutting means, a cutting feed means for moving the cutting means in a direction perpendicular to the chuck table, and the cutting feed means A cutting device including a cutting feed control means for controlling the rotation spindle, the cutting means comprising: a rotary spindle; a rotary drive means for rotationally driving the rotary spindle; and a disk-shaped cutting blade mounted on the rotary spindle. The cutting feed control means includes a load state detection unit that detects a load state of the rotation driving means at the time of cutting, and Based on the correlation between the cutting amount of the cutting blade with respect to the workpiece and the load state of the rotation driving means, the load state detected by the load state detection unit becomes a load state corresponding to the predetermined cutting amount. And a control unit for controlling the cutting and feeding means.

  In the cutting device according to the present invention, the cutting feed control unit is obtained by measuring a load state of the rotation driving unit when the cutting amount of the cutting blade with respect to the workpiece is changed. A storage unit that stores in advance the correlation between the load state and the cut amount, and the control unit detects the load state detected by the load state detection unit based on the correlation stored in the storage unit. The cutting feed means is controlled so as to be in a load state corresponding to a predetermined cutting amount.

  In the cutting device according to the present invention as set forth in the invention described above, the load state detected by the load state detector is a load current value of the rotation driving means.

  The cutting device according to the present invention has a correlation in which a load state measured by a rotation driving means for rotating the rotary spindle indicates a load value corresponding to a cutting amount when the cutting blade cuts into the workpiece. By controlling the cutting feed means so that the load state of the rotation driving means detected by the load state detection unit becomes a load state corresponding to a predetermined cutting amount, thickness variation on the workpiece or Even if there is deformation such as warping, there is an effect that the workpiece can be cut at a certain depth by a predetermined cutting amount.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS A cutting apparatus that is the best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is an external perspective view showing an example of a cutting apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an extracted configuration around the cutting means. The cutting apparatus 10 according to the present embodiment is applied to a cutting apparatus that cuts a workpiece W along a planned division line. As shown in FIG. 12, a transport unit 13, a cleaning unit 14, and a transport unit 15, a chuck table 20, an imaging unit 30, and a cutting unit 40.

  The cassette unit 11 accommodates a plurality of workpieces W in a state of being integrated with the frame F via the holding tape T. The unloading / unloading means 12 unloads the workpiece W accommodated in the cassette unit 11 to a placement area that can be conveyed by the conveying unit 13 and loads the workpiece W that has been subjected to the cutting process into the cassette unit 11. The conveyance means 13 conveys the workpiece W carried out to the placement area by the carry-in / out means 12 onto the chuck table 20. Further, the cleaning means 14 cleans the workpiece W processed by the cutting means 40. The conveying means 15 conveys the workpiece W processed by the cutting means 40 from the chuck table 20 to the cleaning means 14.

  The cutting means 40 is a cylindrical housing including a rotary spindle 42 to which a disc-like cutting blade 41 is detachably mounted, and a rotary drive means 43 such as a motor that rotatably supports and rotates the rotary spindle 42. 44, and the cutting blade 41 acts on the workpiece W held on the chuck table 20 to perform cutting. Here, the cutting blade 41 is an electroformed blade in which diamond abrasive grains are hardened by Ni plating, for example.

  As shown in FIG. 2, the imaging means 30 is provided on the side of the housing 44 and is a microscope equipped with a CCD camera or the like that images the surface of the workpiece W held on the chuck table 20. This is for alignment used for positioning the cutting blade 41 with respect to the division line to be cut.

  As shown in FIG. 2, the chuck table 20 having the holding surface 21 that holds the workpiece W is connected to a driving source 50 and is rotatable. The drive source 50 is fixed to the moving base 51. Here, the cutting apparatus 10 includes a processing feed means 60, a cutting feed means 70, and an index feed means 80 for performing a feed operation necessary for the cutting operation.

  The processing feed means 60 is for processing and feeding the chuck table 20 relative to the cutting means 40 in the X-axis direction by moving the movable base 51 in the X-axis direction. The processing feed means 60 includes a ball screw 61 disposed in the X-axis direction, a pulse motor 62 connected to one end of the ball screw 61, and a pair of guide rails 63 arranged in parallel with the ball screw 61. A nut (not shown) provided at the lower part of the moving base 51 is screwed into the ball screw 61. The ball screw 61 is driven by the pulse motor 62 and rotates, and the moving base 51 is guided by the guide rail 63 and moves in the X-axis direction.

  The cutting feed means 70 moves the support portion 52 that supports the housing 44 of the cutting means 40 in the Z-axis direction with respect to the wall portion 53, thereby moving the cutting means 40 up and down to control the amount of cutting with respect to the workpiece W. Is to do. The notch feeding means 70 includes a ball screw 71 disposed in the Z-axis direction on one surface of the wall portion 53, a pulse motor 72 for rotating the ball screw 71, and a pair arranged in parallel to the ball screw 71. The guide rail 73 and a nut (not shown) inside the support portion 52 are screwed into the ball screw 71. The support portion 52 is driven by the pulse motor 72 and is guided by the guide rail 73 as the ball screw 71 rotates to move up and down in the Z-axis direction, and the cutting blade of the cutting means 40 supported by the support portion 52. 41 is also configured to move up and down in the Z-axis direction.

  The index feeding means 80 moves the wall portion 53 that supports the housing 44 of the cutting means 40 via the support portion 52 in the Y-axis direction, thereby moving the cutting means 40 relative to the chuck table 20 in the Y-axis direction. It is for indexing and feeding. The index feeding means 80 includes a ball screw 81 disposed in the Y-axis direction, a pulse motor 82 connected to one end of the ball screw 81, and a pair of guide rails 83 arranged in parallel with the ball screw 81. A nut (not shown) provided inside the moving base 54 formed integrally with the wall portion 53 is screwed to the ball screw 81. The ball screw 81 is driven and rotated by the pulse motor 82, and accordingly, the moving base 54 is guided by the guide rail 83 and moves in the Y-axis direction.

  The cutting apparatus 10 having such a configuration allows the cutting means 40 to cut the workpiece 41 on the chuck table 20 with a predetermined cutting amount by cutting the cutting blade 41 rotated at a high speed by the cutting feed means 70. On the other hand, when the chuck table 20 is relatively processed and fed in the X-axis direction by the machining feed means 60, the division line on the workpiece W can be cut to form a cutting groove. The cutting of the next scheduled division line in the same direction is performed by indexing and feeding the cutting blade 41 of the cutting means 40 relative to the chuck table 20 by the index feeding means 80 in the Y-axis direction by the division planned line width. Repeat as well. Then, after forming cutting grooves for all the division lines in the same direction, the workpiece W is rotated by 90 ° by the rotation of the chuck table 20, and cutting is performed for all the division lines newly arranged in the X-axis direction. By repeating the same cutting process by means 40, the device is divided into individual devices.

  Further, the cutting apparatus 10 according to the present embodiment includes a cutting feed control unit 90 that controls the cutting feed unit 70. Here, the cutting feed control means 90 includes a load current detection unit 91 as a load state detection unit, a storage unit 92, and a control unit 93. The load current detection unit 91 is connected to the rotation drive unit 43 in the cutting unit 40, and detects the load current value of the rotation drive unit 43 that rotates the rotation spindle 42 during cutting as a value indicating a load state. .

  The storage unit 92 is composed of, for example, a non-volatile memory, and in advance, in each cutting amount when the cutting amount of the cutting blade 41 with respect to the workpiece W is changed by changing the cutting feed amount by the cutting feed means 70. This is for storing in advance the correlation between the load current value acquired by measuring the load current value (load state) of the rotation driving means 43 and the cut amount. FIG. 3 is an explanatory diagram of a data example illustrating an example of a correlation between a load current value acquired in advance and a cutting amount. FIG. 4 illustrates a load current value and a cutting amount based on the data example illustrated in FIG. It is a graph which shows correlation of these. The correlation information stored in the storage unit 92 may be numerical data as shown in FIG. 3 or function data corresponding to a graph as shown in FIG. According to the results shown in FIG. 3 and FIG. 4, when cutting a workpiece W made of a difficult-to-cut material such as glass, ceramics, or metal, it is measured from the rotational drive means 43 that rotationally drives the rotary spindle 42. It can be seen that the load current value indicates a value corresponding to the cutting amount when the cutting blade 41 cuts into the workpiece W. That is, it can be seen that the load current value and the cutting amount have a substantially proportional correlation.

  Based on the correlation between the cutting amount of the cutting blade 41 with respect to the workpiece W and the load state of the rotation driving means 43, the control unit 93 is actually driven by the load current detection unit 91 during cutting. This is for feedback control of the cutting feed of the cutting means 40 by the cutting feed means 70 so that the load current value of the means 43 becomes a load current value corresponding to a predetermined cutting amount set in the cutting process. In the correlation as shown in FIG. 3 or FIG. 4, if the predetermined cutting amount is set to 100 μm, for example, the control unit 93 is detected by the load current detection unit 91 and is fed back. Even if the load current value of 43 changes, the cutting feed of the cutting blade 41 by the cutting feed means 70 is controlled so that the load current value corresponding to a predetermined cutting amount of 100 μm = 1.23A.

  In such a configuration, consider a case in which a cutting process for forming a cutting groove is performed on a workpiece W made of a bonded substrate as shown in FIG. The workpiece W shown in FIG. 5 is obtained by bonding the substrate W1 and the substrate W2, and shows an example in which the deformed portion B is generated on the surface of the workpiece W due to the poorly bonded portion A. ing. In this case, when the cutting amount c of the cutting blade 41 with respect to the workpiece W is controlled with reference to the holding surface 21 of the chuck table 20 as in the prior art, cutting is performed according to the line L1 shown in the enlarged portion of FIG. In the deformed portion B, the cut amount c becomes large.

  On the other hand, in the present embodiment, when a predetermined cutting amount c is set, the control unit 93 constantly monitors and detects the load current value of the rotation driving unit 43 detected by the load current detection unit 91. When this load current value deviates from the load current value corresponding to the predetermined cut amount c, the cutting feed means 70 is controlled so that it immediately becomes the load current value corresponding to the predetermined cut amount c. For example, when the workpiece W as shown in FIG. 5 is cut, when the cutting progresses and the cutting blade 41 reaches the deformed portion B, the amount of cutting by the cutting blade 41 increases as long as the line L1 is followed. As a result, the load current value of the rotation driving means 43 detected in this way increases. Therefore, the control unit 93 controls the cutting feed means 70 so as to obtain a load current value corresponding to the predetermined cutting amount c, and moves the cutting blade 41 in the upward direction. As a result, the load current value returns to the load current value corresponding to the predetermined cut amount c, and the cut amount of that portion becomes the predetermined cut amount c. In this way, in the case of the present embodiment, cutting is performed along the line L0 according to the shape of the deformed portion B. Even in the deformed portion B, the desired cutting amount c is maintained. This is not limited to the deformed portion due to the bonding failure of the bonded substrate, and the same applies to the case where the workpiece W has deformation such as thickness variation and warpage.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. In the present embodiment, the load current detection unit 91 is provided to detect the load current value as the load state of the rotation detection unit 43. However, the load state to be detected is not limited to the load current value, for example, The rotational speed of the rotation driving means 43 may be detected. In this case, the cutting feed control means 90 correlates the rotational speed obtained by measuring the rotational speed of the rotation driving means 43 when the cutting amount of the cutting blade 41 with respect to the workpiece W is changed and the cutting amount. The relationship is stored in the storage unit in advance, and the control unit 93 causes the rotation number detected by the rotation number detection unit to be a rotation number corresponding to a predetermined cutting amount based on the correlation stored in the storage unit. It is sufficient to control the cutting and feeding means 70.

It is an appearance perspective view showing an example of a cutting device of an embodiment of the invention. It is a perspective view which extracts and shows the structure around a cutting means. It is explanatory drawing of the example of data which shows an example of the correlation of the load current value acquired beforehand and the amount of cutting. It is a graph which shows the correlation with the load current value based on the example of data shown in FIG. 3, and the cutting amount. It is a schematic diagram which shows the example of control at the time of the groove | channel process to a bonding board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Cutting apparatus 20 Chuck table 40 Cutting means 41 Cutting blade 42 Rotating spindle 43 Rotation drive means 60 Process feed means 70 Cutting feed means 90 Cutting feed control means 91 Load current detection part (load state detection part)
92 Storage Unit 93 Control Unit W Workpiece

Claims (3)

A chuck table for holding a workpiece, a cutting means for cutting a workpiece held on the chuck table by a predetermined cutting amount, a processing feed means for relatively moving the chuck table and the cutting means, A cutting apparatus comprising: a cutting feed means for moving the cutting means in a direction perpendicular to the chuck table; and a cutting feed control means for controlling the cutting feed means;
The cutting means comprises a rotary spindle, a rotary drive means for driving the rotary spindle to rotate, and a disc-shaped cutting blade attached to the rotary spindle,
The cutting feed control means includes
A load state detection unit for detecting a load state of the rotation driving means at the time of cutting;
Based on the correlation between the cutting amount of the cutting blade with respect to the workpiece and the load state of the rotation driving means, the load state detected by the load state detection unit becomes a load state corresponding to the predetermined cutting amount. A control unit for controlling the cutting feed means;
A cutting apparatus comprising: The cutting feed control means includes
A storage unit that stores in advance the correlation between the load state and the cut amount acquired by measuring the load state of the rotation driving unit when the cut amount of the cutting blade with respect to the workpiece is changed;
The control unit controls the cutting and feeding means based on the correlation stored in the storage unit so that the load state detected by the load state detecting unit becomes a load state corresponding to the predetermined cutting amount. The cutting apparatus according to claim 1.   The cutting apparatus according to claim 1 or 2, wherein the load state detected by the load state detection unit is a load current value of the rotation driving means.

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