JP5157315B2 - Piezoelectric device manufacturing method, piezoelectric device, and electronic apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a piezoelectric device including a piezoelectric vibrator and an electronic component, a piezoelectric device, and an electronic apparatus.

There are various types of piezoelectric devices, and one of them, a piezoelectric oscillator, has a configuration including a piezoelectric vibrator and an oscillation circuit. In the piezoelectric oscillator disclosed in Patent Document 1, the IC chip constituting the oscillation circuit is fixed to the piezoelectric vibrator. Further, this piezoelectric oscillator has a substrate having a larger plane size than the piezoelectric vibrator, and has a conduction terminal portion, a connection terminal portion, and the like on its upper surface, and a mounting terminal portion on its lower surface. The piezoelectric vibrator is fixed to the upper surface of the substrate with the surface opposite to the surface on which the IC chip is fixed facing the substrate. Then, in plan view, the above-described conduction terminal portions and the like are provided on the outer side of the piezoelectric vibrator in the substrate, and these terminal portions and the IC chip are electrically connected by wires. Such an IC chip and a piezoelectric vibrator are sealed with resin.
JP 2006-50529 A

  The piezoelectric oscillator described above is cut into individual pieces by cutting a substrate or a resin at the time of manufacture, and the side surface is made of a resin and a substrate. That is, the piezoelectric vibrator cannot be seen from the outside of the piezoelectric oscillator. This is because the above-described terminal portion is provided outside the piezoelectric vibrator in the planar direction, and therefore, it must be cut larger than the planar size of the piezoelectric vibrator. For this reason, in this piezoelectric oscillator, the plane size cannot be reduced.

  In addition, in the conventional piezoelectric device, when cutting for individualization, a part of the side wall of the piezoelectric vibrator is also cut to expose the side face of the piezoelectric vibrator on the surface of the device, and a compact configuration can be found. Absent.

  In recent years, various electronic devices such as digital mobile phones have been downsized. For this reason, a user who uses a piezoelectric oscillator must mount an electronic device such as a piezoelectric oscillator in a limited space of an electronic device, and therefore requires a reduction in the size of the electronic device. However, the above-described piezoelectric device cannot meet this requirement because the planar size becomes large.

  An object of the present invention is to provide a method for manufacturing a miniaturized piezoelectric device and a piezoelectric device. Moreover, it aims at providing the electronic device using this piezoelectric device.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1] Electronic components and previously separated piezoelectric vibrators are arranged in a plurality of device formation regions on a sheet substrate, respectively, and the piezoelectric vibrators and the electronic components arranged in the device formation regions are arranged. A method for manufacturing a piezoelectric device, comprising sequentially conducting a step of conducting and a step of cutting the base of the piezoelectric vibrator and the sheet substrate into pieces for each device forming region.
As a result, the substrate and the side surfaces of the piezoelectric vibrator after being singulated can be exposed to the surface of the piezoelectric device to form the same surface, so that the planar size of the piezoelectric device can be reduced. Further, since the piezoelectric device is formed by cutting a part of the base of the piezoelectric vibrator, it can be made smaller than the plane size of the piezoelectric vibrator. Furthermore, in order to manufacture a piezoelectric device, since a part of the base of the piezoelectric vibrator is cut, the interval between the piezoelectric devices arranged on the sheet substrate can be reduced. Thereby, the number of piezoelectric vibrators arranged on one sheet substrate can be increased, and the number of piezoelectric devices obtained from one sheet substrate can be increased.

Application Example 2 In the step of conducting the piezoelectric vibrator and the electronic component, the piezoelectric vibrator is disposed above the electronic component, and the piezoelectric vibrator and the electronic component are disposed for each device formation region. The method for manufacturing a piezoelectric device according to Application Example 1, wherein a step of covering the electronic component with a resin mold material is performed before the step of dividing into individual pieces.
Since the piezoelectric device has a two-story structure of the piezoelectric vibrator and the electronic component, the plane size can be reduced. In addition, the piezoelectric device is not provided with a resin molding material on the upper portion, and the piezoelectric vibrator is exposed on the upper surface, so that the height can be reduced.

Application Example 3 Arranging an electronic component on the first surface side of the sheet substrate , arranging a connection member on the first surface side of the sheet substrate , and viewing the first surface in plan view A step of disposing a piezoelectric vibrator on the sheet substrate via the connecting member so as to overlap with an electronic component; filling a space between the piezoelectric vibrator and the sheet substrate with a resin mold material; and at least the piezoelectric vibrator A method for manufacturing a piezoelectric device comprising: sequentially covering a side surface of the piezoelectric device with the resin mold material; and cutting the base of the piezoelectric vibrator, the sheet substrate, and the resin mold material together. .

  Since the piezoelectric device has a two-story structure of the piezoelectric vibrator and the electronic component, the planar size can be reduced. The lower and side surfaces of the piezoelectric vibrator are covered with a resin mold material, and the upper part of the piezoelectric vibrator is also covered with the resin mold material depending on the form of the invention. Thereby, the piezoelectric vibrator can be protected, and the reliability of the piezoelectric device is improved. Furthermore, each side surface of the piezoelectric vibrator, the substrate, and the resin mold material is exposed on the side surface of the piezoelectric device after being singulated, and each side surface is in the same plane. Thereby, the planar size of the piezoelectric device can be reduced.

Application Example 4 The step of covering with the resin mold material fills the space between the piezoelectric vibrator and the sheet substrate with the resin mold material, and covers the side surface of the piezoelectric vibrator and the upper part of the piezoelectric vibrator. The method for manufacturing a piezoelectric device according to Application Example 3, wherein a step of removing the resin mold material covering the upper portion of the piezoelectric vibrator is performed after the step of covering with the resin mold material.
In such a piezoelectric device, a space between the piezoelectric vibrator and the sheet substrate is filled with a resin molding material, but the upper portion of the piezoelectric vibrator is exposed to the outside of the device. Therefore, the height of the piezoelectric device can be reduced and the electronic component can be protected with the resin mold material.

Application Example 5 The piezoelectric device manufacturing method according to Application Example 3 or 4, wherein the step of covering with the resin mold material covers the castellation formed on the side surface of the piezoelectric vibrator with the resin mold material. Method.
The step of covering the castellation can be performed simultaneously with the step of covering at least the periphery of the electronic component with the resin mold material. Thereby, the castellation can be protected. When a resin mold material is provided on the upper part of the piezoelectric vibrator and a resin mold material is provided between the substrate and the piezoelectric vibrator (intermediate part), the upper and middle parts are covered with the resin mold material covering the castellation. The resin mold material can be connected. Therefore, the resin mold material can be integrated, and the reliability of the piezoelectric device is further improved.

Application Example 6 Any one of Application Examples 1 to 5, wherein the base of the piezoelectric vibrator is cut by cutting a side wall of a package base constituting the piezoelectric vibrator or a base plate constituting the piezoelectric vibrator. A method for manufacturing a piezoelectric device according to claim 1.
Since the piezoelectric device is formed by cutting a side wall of the piezoelectric vibrator or a part of the base plate, the planar size can be further reduced.

Application Example 7 The method for manufacturing a piezoelectric device according to any one of Application Examples 1 to 6, wherein the piezoelectric vibrator is separated into pieces in advance.
By using individual piezoelectric vibrators, various types of piezoelectric vibrators can be mounted on the piezoelectric device. In addition, the frequency of the piezoelectric vibrator may be adjusted in the state of being singulated, and product inspection is performed in the state of being singulated, so that only products that operate normally can be mounted on the piezoelectric device. Therefore, the generation of defective piezoelectric devices can be reduced.

Application Example 8 A piezoelectric device manufactured by the method for manufacturing a piezoelectric device according to any one of the application examples described above .
Thereby, the planar size of the piezoelectric device can be reduced.

[Application Example 9] An electronic apparatus having the piezoelectric device according to Application Example 8 mounted thereon.
Some electronic devices tend to be more compact. In such an electronic apparatus, a space for mounting various electronic devices such as a piezoelectric device is limited. However, since the piezoelectric device having the above-described features is miniaturized at least in a planar direction, Can be mounted in the space.

  In the following, the best embodiments of a method for manufacturing a piezoelectric device, a piezoelectric device and an electronic apparatus according to the present invention will be described. The schematic configuration of the piezoelectric device is as follows. FIG. 1 is a cross-sectional view of a piezoelectric device. The piezoelectric device 10 has a substrate 12, and an external terminal 14 is provided on the other surface of the substrate 12. An insulating film 16 is provided on one surface of the substrate 12. An electronic component 32 is disposed on the insulating film 16, and the electronic component 32 and the external terminal 14 are electrically connected. Further, a connection member arranging electrode 18 exposed from the insulating film 16 is provided on one surface of the substrate 12. A connection member 30 is provided on the connection member arrangement electrode 18, and a piezoelectric vibrator 40 is provided on the connection member 30. Thereby, the piezoelectric device 10 has a structure in which the electronic component 32 and the piezoelectric vibrator 40 are arranged in the height direction.

  The piezoelectric vibrator 40 includes a package 44 and a piezoelectric vibrating piece 42. The package 44 includes a package base 46 (base) having a recessed portion 48 and a lid 58 joined to the upper surface of the package base 46. The lid 58 hermetically seals the recessed portion 48. The package base 46 includes a mount electrode 50 on the bottom surface (the bottom surface of the recessed portion 48) and a transducer terminal 52 on the back surface, and the mount electrode 50 and the transducer terminal 52 are electrically connected to each other. Yes. A conductive adhesive 54 is provided on the mount electrode 50, and the piezoelectric vibrating piece 42 is electrically and mechanically connected by the conductive adhesive 54. The piezoelectric vibrating piece 42 may be a piezoelectric vibrating piece using an AT-cut piezoelectric substrate or the like, a tuning fork type piezoelectric vibrating piece, a surface acoustic wave element piece, or the like.

The connecting member 30 described above is electrically and mechanically connected to the vibrator terminal 52. Further, the connection member arranging electrode 18 that is electrically connected to the mount electrode 50 via the connection member 30 and the vibrator terminal 52 is electrically connected to the electronic component 32. Thereby, the piezoelectric vibrating piece 42 and the electronic component 32 are electrically connected. A resin mold material 38 is provided between the substrate 12 and the piezoelectric vibrator 40, and a resin mold material 38 is provided on the piezoelectric vibrator 40 except for the lid 58. The side surfaces of the piezoelectric vibrator 40 (package base 46), the resin mold material 38, and the substrate 12 form the same surface.

  The manufacturing method of such a piezoelectric device 10 is as follows. 2 to 4 are explanatory views of the manufacturing process of the piezoelectric device. First, a process of arranging the electronic component 32 and the like on the sheet substrate 20 will be described. First, as shown in FIG. 2A, an insulating sheet substrate 20 is prepared. The sheet substrate 20 has a plurality of device formation regions. A plurality of external terminals 14 are provided on the other surface of the sheet substrate 20 for each device formation region. Note that the sheet substrate 20 becomes the substrate 12 when the device is cut for each device forming region in order to separate the piezoelectric devices 10.

  Further, on one surface of the sheet substrate 20, a wire bonding electrode (not shown), a connection member arranging electrode 18, a shield electrode (not shown), and the like are provided for each device formation region. The wire bonding electrode is an electrode to which a wire 36 for conducting with the electronic component 32 is bonded when the electronic component 32 is mounted. The wire bonding electrode is provided on the sheet substrate 20 so as to be arranged around the electronic component 32. The connection member arrangement electrode 18 is an electrode on which a connection member 30 for mounting the piezoelectric vibrator 40 on the sheet substrate 20 is arranged. At least two of the plurality of connection member arranging electrodes 18 (electrodes that are electrically connected to the piezoelectric vibrating piece 42) are electrically connected to the wire bonding electrodes via the wiring pattern 22.

  The shield electrode is arranged to be positioned below the electronic component 32 when the electronic component 32 is mounted. The shield electrode is electrically connected to the external terminal 14 (ground terminal) that becomes a ground potential via the wiring pattern 22 and the like. The shield electrode prevents adverse effects from electromagnetic noise applied from the outside of the piezoelectric device 10. A part of the wire bonding electrode and the shield electrode are connected to the conduction portion 24 via a wiring pattern 22 routed in a device formation region on the sheet substrate 20. The conduction portion 24 is provided through the sheet substrate 20 and is electrically connected to the external terminal 14. The conductive portion 24 may be a via hole, for example.

An insulating film 16 is provided on the sheet substrate 20, the wiring pattern 22, and the shield electrode except for the connection member arranging electrode 18 and the wire bonding electrode. The insulating film 16 may be a resist film, for example. Since the wiring pattern 22, the conductive portion 24, and the shield electrode are covered with the insulating film 16, they are not short-circuited with other wiring patterns 22 and the like, and the electrons fixed on the insulating film 16 are described later. There is no direct short circuit with the component 32. Therefore, since the wiring pattern 22 and the conductive portion 24 can be arranged below the electronic component 32, the sheet substrate 20 having a single-layer structure can be used, and the wiring pattern 22 can be routed freely. The degree of freedom of the position where the conductive portion 24 is provided is improved.
The insulating film 16 may be provided only on the lower side of the electronic component 32.

  Next, as illustrated in FIG. 2B, the connection member 30 is provided on the connection member arrangement electrode 18. The connection member 30 has conductivity, and may be a solder ball, for example. Further, the connecting member 30 may be a member formed by solder plating a core formed of a copper ball or a resin ball. Thus, by making the connecting member 30 have a double structure, the core serves as a spacer, and the height of the piezoelectric vibrator 40 disposed on the connecting member 30 from the sheet substrate 20 is constant. And the electrical and mechanical connection between the connection member arranging electrode 18 and the piezoelectric vibrator 40 is ensured.

  Next, as shown in FIG. 2C, the electronic component 32 is disposed on the insulating film 16 in each device formation region. The electronic component 32 is fixed using, for example, a bonding material such as an adhesive or a tape. This bonding material is preferably non-conductive. The electronic component 32 may be provided with a circuit (oscillation circuit) that supplies an electric signal to the piezoelectric vibrator 40 to oscillate and amplify it, and is an integrated circuit (IC) chip. On the active surface of the electronic component 32, a wire bonding pad 34 is provided. The electronic component 32 is mounted with the active surface facing upward and the inactive surface facing the sheet substrate 20 side.

  Next, as shown in FIG. 2D, a wire 36 is bonded to the wire bonding pad 34 and the wire bonding electrode, and these are made conductive. When bonding the wire 36, first, one end of the wire 36 is bonded to the wire bonding electrode and the wire 36 is pulled up, and then the wire 36 is pulled out in the lateral direction to be bonded to the wire bonding pad 34. Then it can be cut. By using such a reverse bonding method, the wire 36 and the corner of the electronic component 32 are not in contact with each other, and even when the distance between the wire bonding electrode and the electronic component 32 is short, the wire bonding is performed. Can be done. As described above, the connection member 30 and the electronic component 32 are electrically connected, and the electronic component 32 and the external terminal 14 are electrically connected.

  Secondly, a process of arranging the piezoelectric vibrator 40 and the like will be described. First, as shown in FIG. 3A, the piezoelectric vibrator 40 is arranged for each device formation region. That is, the piezoelectric vibrator 40 is disposed on the connection member 30 and the vibrator terminal 52 of the piezoelectric vibrator 40 and the connection member 30 are joined. Accordingly, the piezoelectric device 10 has a structure in which the electronic component 32 and the piezoelectric vibrator 40 are two-storied, and the electronic component 32 and the piezoelectric vibrator 40 arranged in each device formation region are electrically connected via the connection member 30. To do. The back surface of the piezoelectric vibrator 40 and the wire 36 are not in contact.

  Next, as shown in FIG. 3B, a resin molding material 38 is poured so that the lid 58 of the piezoelectric vibrator 40 is covered. As a result, the space between the sheet substrate 20 and the piezoelectric vibrator 40 is filled with the resin molding material 38 and the upper part of the piezoelectric vibrator 40 is also covered with the resin.

  Next, as illustrated in FIG. 3C, the plate-shaped member 39 is brought into contact with the surface of the lid 58 and moved in parallel to remove the resin mold material 38 that covers the surface of the lid 58. When the resin mold material 38 is cured, the space between the sheet substrate 20 and the piezoelectric vibrator 40 is filled with the resin mold material 38.

Thirdly, a process of dividing the piezoelectric device 10 into individual pieces will be described. As shown in FIG. 4A, each device formation region is cut into individual pieces. Specifically, a portion indicated by a broken line in FIG. 4A, that is, a part of the side wall 56 of the piezoelectric vibrator 40 (package base 46), the sheet substrate 20, and the resin molding material 38 are cut. By this cutting, the side surfaces of the piezoelectric vibrator 40, the resin molding material 38, and the substrate 12 form the same surface. Even when a part of the side wall 56 of the piezoelectric vibrator 40 is cut, the inside (the recessed portion 48) of the piezoelectric vibrator 40 remains hermetically sealed.
The separated piezoelectric device 10 is as shown in FIG. Thus, the manufacture of the piezoelectric device 10 is completed.

Since the piezoelectric device 10 manufactured in this way includes the piezoelectric vibrator 40 and the oscillation circuit (electronic component 32), it becomes a piezoelectric oscillator. In addition to the oscillation circuit, the electronic component 32 includes a voltage control circuit, a temperature compensation circuit, a circuit capable of setting an arbitrary output frequency by programming, a date from a frequency signal output from the piezoelectric vibrator 40, etc. It is also possible to provide a circuit for generating and outputting the digital data, and a drive / detection circuit for the gyro sensor. The piezoelectric device 10 having such a circuit is a piezoelectric oscillator, a real-time clock device, a gyro sensor, or the like having a voltage control function and a temperature compensation function.

  And according to the manufacturing method demonstrated above and the piezoelectric device 10 obtained by this manufacturing method, each side surface of the board | substrate 12, the piezoelectric vibrator 40, and the resin mold material 38 is exposed to the surface, and the same surface is formed. Therefore, the planar size of the piezoelectric device 10 can be reduced. Since the piezoelectric device 10 is formed by cutting a part of the side wall 56 of the piezoelectric vibrator 40, the piezoelectric device 10 can be made smaller than the planar size of the piezoelectric vibrator 40. In the piezoelectric device 10, the piezoelectric vibrator 40 and the electronic component 32 have a two-story structure, and the connection member 30, the wire 36, and the like are housed in the area in the plane direction of the piezoelectric vibrator 40. it can. Furthermore, since the lid 58 of the piezoelectric vibrator 40 is exposed at the upper part of the piezoelectric device 10, the piezoelectric device 10 can be reduced in height.

  In addition, since a part of the side wall 56 of the piezoelectric vibrator 40 is cut, the interval between the piezoelectric devices 10 arranged on the sheet substrate 20 can be reduced. For this reason, the number of piezoelectric vibrators 40 arranged on one sheet substrate 20 can be increased as compared with the conventional case where the side walls of the piezoelectric vibrator are not cut. That is, the device forming area provided on one sheet substrate 20 can be increased, and the number of piezoelectric devices 10 obtained from one sheet substrate 20 can be increased.

  In addition, since the space between the piezoelectric vibrator 40 and the substrate 12 is filled with the resin molding material 38, the electronic component 32, the connection member 30 and the wire 36 can be insulated, and the electronic component 32 and the like from an external impact or the like. Can be protected, and the reliability of the piezoelectric device 10 is improved.

  In addition, when the piezoelectric vibrator 40 that is separated into individual pieces is used, various types of piezoelectric vibrators 40 can be mounted on the piezoelectric device 10. In addition, the frequency of the piezoelectric vibrator 40 may be adjusted in the state of being singulated, and product inspection is performed in the state of being singulated, so that only products that operate normally can be mounted on the piezoelectric device 10. Therefore, the generation of defective products of the piezoelectric device 10 can be reduced.

  The piezoelectric device 10 shown in FIG. 1 or the like has the vibrator terminal 52 exposed on the side surface thereof, but may be configured such that the vibrator terminal 52 is not exposed on the side surface. That is, even when part of the side wall 56 of the piezoelectric vibrator 40 is cut, the vibrator terminal 52 is provided inside the peripheral edge of the package base 46 after the cutting. Thereby, the side surface of the vibrator terminal 52 is covered with the resin molding material 38 and is not exposed to the side surface of the piezoelectric device 10. In this case, since the vibrator terminal 52 can be prevented from being affected by outside air, water vapor, or the like, it can be prevented from being affected by changes in the oscillation frequency.

  In the above-described embodiment, the lid 58 of the piezoelectric vibrator 40 is exposed on the upper surface of the piezoelectric device 10. However, the upper surface of the piezoelectric device may be covered with the resin mold material 38. That is, the resin mold material 38 is injected between the piezoelectric vibrator 40 and the sheet substrate 20 shown in FIG. 3B without performing the process described with reference to FIG. After the step of covering the upper portion with the resin molding material 38, a step of cutting a part of the side wall 56 of the piezoelectric vibrator 40, the sheet substrate 20 and the resin molding material 38 as shown in FIG. 4A may be performed. . And the piezoelectric device 60 which concerns on the 1st modification obtained by this process comes to show in FIG. 5 (A). Accordingly, the lid 58 (not shown in FIG. 5A) of the piezoelectric vibrator 40 can be protected by the resin molding material 38, and the reliability of the piezoelectric device 60 is improved.

Further, as shown in FIG. 5B as a second modification, the piezoelectric device 62 may have a form in which the upper portion thereof is completely exposed from the resin molding material 38. In the piezoelectric device 10 described with reference to FIG. 1 and the like, the upper surface of the lid 58 of the piezoelectric vibrator 40 is not covered with the resin mold material 38, but the resin mold material 38 is provided on the side of the lid 58. Therefore, as shown in FIG. 5B, the piezoelectric device 62 can be configured such that the resin molding material 38 is not provided on the side as well as the upper surface of the lid 58 of the piezoelectric vibrator 40.

  Moreover, there exists a thing of the form shown in FIG. 6 as a 3rd modification. Here, FIG. 6A is a plan view of a piezoelectric vibrator according to this modification, and FIG. 6B is a perspective view of the piezoelectric device according to this modification. In FIG. 6, illustration of the recessed portion 48, the mount electrode 50, and the vibrator terminal 52 is omitted. Some piezoelectric vibrators 64 are provided with castellations 66 at the four corners of the package base 46 as shown in FIG. The castellation 66 is formed by providing a recess at a corner along the height direction of the package base 46 and metalizing the surface of the recess. For example, via this castellation 66, the mount electrode 50 provided on the bottom surface of the recessed portion 48 and the vibrator terminal 52 provided on the back surface of the package base 46 are electrically connected.

  The piezoelectric device 68 using the piezoelectric vibrator 64 may be manufactured in the same manner as the embodiment described with reference to FIGS. When the piezoelectric device 68 formed on the sheet substrate 20 is singulated (in the process shown in FIG. 4A), the piezoelectric vibrator 64 may be cut at a position indicated by a broken line in FIG. . The piezoelectric device 68 manufactured in this way is as shown in FIG. 6B, and a castellation 66 formed on the piezoelectric vibrator 64 is filled with the resin mold material 38. Also in this case, the side surfaces of the piezoelectric vibrator 64, the substrate 12, and the resin mold material 38 are in the same plane. 6B shows a form in which the resin molding material 38 is also provided on the upper portion of the piezoelectric device 68, but the lid 58 of the piezoelectric vibrator 64 is piezoelectric as shown in FIG. 1 and FIG. 5B. The form exposed on the upper surface of the device 68 may be used.

  Furthermore, there exists a thing of the form shown in FIG. 7 as a 4th modification. The piezoelectric device 70 according to the fourth modified example is different from the piezoelectric device 10 according to the above-described embodiment in the configuration of the piezoelectric vibrator. The piezoelectric vibrator 72 of this modification has a plate-like base plate 74 as a base on which the piezoelectric vibrating piece 42 is mounted. The base plate 74 has a mount electrode 50 on its upper surface and a vibrator terminal 52 on its lower surface. The mount electrode 50 and the vibrator terminal 52 are electrically connected. On the mount electrode 50, the piezoelectric vibrating piece 42 is electrically and mechanically connected by a conductive adhesive 54. A seam ring 76 is provided on the base plate 74 and is disposed around the piezoelectric vibrating piece 42. The piezoelectric vibrating piece 42 and the seam ring 76 are not in contact with each other. A lid 58 is disposed on the seam ring 76 to hermetically seal the piezoelectric vibrating piece 42.

  Such a piezoelectric vibrator 72 is disposed on the connection member 30 disposed on the substrate 12. As a result, the piezoelectric device 70 has a two-story structure. A resin molding material 38 is provided between the piezoelectric vibrator 72 and the substrate 12, and a resin molding material 38 is provided around the piezoelectric vibrator 72 excluding the upper surface of the lid 58. The side surfaces of the piezoelectric vibrator 72 (base plate 74), the resin mold material 38, and the substrate 12 form the same surface.

  In order to manufacture the piezoelectric device 70, the piezoelectric vibrator 72 in which the piezoelectric vibrating piece 42, the seam ring 76, and the lid 58 are arranged on the base plate 74 is formed. On the other hand, in order to arrange the electronic component 32 and the like on the sheet substrate 20, the process described with reference to FIG. Thereafter, the piezoelectric vibrator 72 is mounted on the sheet substrate 20, and the electronic component 32 and the piezoelectric vibrator 72 are brought into conduction for each device formation region. Next, the resin component material 38 covers the electronic component 32, the piezoelectric vibrator 72, and the like. Then, the base plate 74, the sheet substrate 20, and the resin mold material 38 are cut, and the piezoelectric devices 70 are separated into pieces for each device formation region.

  Accordingly, the side surfaces of the piezoelectric vibrator 72, the resin molding material 38, and the substrate 12 form the same surface, and the piezoelectric device 70 can be reduced in planar size. Moreover, since the piezoelectric vibrator 72 can be made thinner than the piezoelectric vibrator 40 of the above-described embodiment, the piezoelectric device 70 according to this modification can be made thinner.

The piezoelectric device 70 shown in FIG. 7 has a configuration in which the upper surface of the lid 58 is not covered with the resin mold material 38. However, the piezoelectric device 70 may have a configuration in which the upper surface of the lid 58 is covered with the resin mold material 38.
Moreover, the piezoelectric device 70 shown in FIG. 7 has a configuration in which the vibrator terminal 52 is exposed on the side surface. However, the piezoelectric device 70 may have a configuration in which the vibrator terminal 52 is not exposed on the side surface.

  The piezoelectric vibrator 72 described above is separated into pieces in advance. However, the piezoelectric vibrator 72 may be formed using a sheet-like base plate 74 in which a plurality of device formation regions are formed. That is, the piezoelectric vibrating piece 42, the seam ring 76, and the lid 58 are arranged for each device forming region of the sheet-like base plate 74 to form the piezoelectric vibrator 72 connected to each other. Then, the sheet-like piezoelectric vibrator 72 is disposed on the sheet substrate 20 via the connection member 30 and then covered with the resin mold material 38. Thereafter, the base plate 74, the sheet substrate 20, and the resin molding material 38 are cut to singulate the piezoelectric device 70 into individual pieces. In this way, the piezoelectric device 70 may be manufactured.

  Further, the piezoelectric device may have a configuration in which the resin mold material 38 is not provided. This is because, after the step of placing the piezoelectric vibrator 40 in each piezoelectric device forming region of the sheet substrate 20 (step shown in FIG. 3A), a part of the side wall 56 of the piezoelectric vibrator 40 and the base plate 74 and the sheet. A step of cutting the substrate 20 may be performed. Even in such a piezoelectric device, the side surface of the piezoelectric vibrator 40 and the side surface of the substrate 12 are in the same plane, and the planar size is reduced.

  Furthermore, the piezoelectric device may have a configuration in which only the periphery of the electronic component 32 is covered with the resin mold material 38 as well as a form in which the space between the sheet substrate 20 and the piezoelectric vibrator 40 is filled with the resin mold material 38. Thereby, the electronic component 32 can be protected by the resin molding material 38.

  The piezoelectric device described above can be mounted on various electronic devices. Hereinafter, a digital mobile phone will be described as an example of the electronic apparatus. FIG. 8 is a schematic configuration diagram of a digital cellular phone. The digital cellular phone 100 includes a transmission / reception signal transmission unit 102, a reception unit 104, and the like, and a central processing unit (CPU) 106 that controls them is connected to the transmission unit 102 and the reception unit 104. In addition to modulation and demodulation of transmission / reception signals, the CPU 106 controls the information input / output unit 108 including a display unit and operation keys for inputting information, and the memory 110 including RAM, ROM, and the like. For this reason, a piezoelectric oscillator 112 is attached to the CPU 106, and a clock signal output from the piezoelectric oscillator 112 is used. The CPU 106 is connected to a temperature compensated piezoelectric oscillator 114, and the temperature compensated piezoelectric oscillator 114 is connected to the transmitting unit 102 and the receiving unit 104. Thus, even if the basic clock from the CPU 106 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated piezoelectric oscillator 114 and supplied to the transmitting unit 102 and the receiving unit 104. The piezoelectric devices 10, 60, 62, 68, 70 described above can be used for the piezoelectric oscillator 112 and the temperature compensated piezoelectric oscillator 114.

  Since the digital cellular phone 100 has been downsized in recent years, the space for mounting various electronic devices including piezoelectric devices is limited. However, the piezoelectric devices 10, 60, 62, 68, and 70 described above are limited. Etc. are miniaturized at least in the plane direction, so that the piezoelectric devices 10, 60, 62, 68, 70, etc. can be mounted in the space.

It is sectional drawing of a piezoelectric device. It is explanatory drawing of the process of arrange | positioning an electronic component etc. on a sheet | seat board | substrate. It is explanatory drawing of the process of arrange | positioning a piezoelectric vibrator etc. FIG. It is explanatory drawing of the process of dividing a piezoelectric device into pieces. It is a perspective view of the piezoelectric device which concerns on the 1st, 2nd modification. It is a perspective view of the piezoelectric device which concerns on a 3rd modification. It is sectional drawing of the piezoelectric device which concerns on a 4th modification. It is a schematic block diagram of a digital mobile phone.

Explanation of symbols

10, 60, 62, 68, 70 ......... piezoelectric device, 12 ..... substrate, 14 .... external terminal, 20 ..... sheet substrate, 30 .... connecting member, 32 .... electronic component, 38. ......... Resin molding material, 40, 64, 72 ......... Piezoelectric vibrator, 46 ......... Package base, 56 ......... Side wall, 58 ......... Lid, 66 ......... Castellation, 74 ......... Base Board, 100 ... Digital mobile phone.

Claims (6)

Placing electronic components and pre-divided piezoelectric vibrators in a plurality of device formation regions on the sheet substrate, and electrically connecting the piezoelectric vibrators arranged in each device formation region and the electronic components;
Cutting the base of the piezoelectric vibrator and the sheet substrate and separating each device forming region;
A method for manufacturing a piezoelectric device, wherein the steps are performed in order. Arranging electronic components on the first surface side of the sheet substrate;
A connection member is disposed on the first surface side of the sheet substrate, and a piezoelectric vibrator is disposed on the sheet substrate via the connection member so as to overlap the electronic component in a plan view of the first surface. And a process of
Filling the space between the piezoelectric vibrator and the sheet substrate with a resin mold material, and covering at least a side surface of the piezoelectric vibrator with the resin mold material;
Cutting the base of the piezoelectric vibrator, the sheet substrate and the resin mold material together;
A method for manufacturing a piezoelectric device, wherein the steps are performed in order. The step of covering with the resin mold material is a step of filling the space between the piezoelectric vibrator and the sheet substrate with the resin mold material and covering the side surface of the piezoelectric vibrator and the upper portion of the piezoelectric vibrator,
The method for manufacturing a piezoelectric device according to claim 2, wherein after the step of covering with the resin mold material, a step of removing the resin mold material covering the upper portion of the piezoelectric vibrator is performed.   4. The method of manufacturing a piezoelectric device according to claim 2, wherein the step of covering with the resin mold material covers the castellation formed on the side surface of the piezoelectric vibrator with the resin mold material.   5. The piezoelectric device according to claim 1, wherein the base of the piezoelectric vibrator is cut by cutting a side wall of a package base constituting the piezoelectric vibrator or a base plate constituting the piezoelectric vibrator. Device manufacturing method.   6. The method of manufacturing a piezoelectric device according to claim 2, wherein the piezoelectric vibrator is separated into pieces in advance.

Images