JP5201933B2 - Non-heat treated surface type IC tag mat - Google Patents

Description

  The present invention relates to a mat suitable for rental with an IC tag attached as a data carrier for merchandise management, and more particularly to a mat with a treated surface type IC tag in which an IC tag is attached to an adhesion treated surface formed on a mat substrate. is there.

  In rental mats and the like, as shown in Patent Documents 1 and 2, a data carrier is provided in the mat in order to perform product management in quality control and inventory management. IC tags for laundry are used for this type of data carrier.

In the case of a rental mat, the mat is collected after use by the user, and the collected mat is washed and reused. Therefore, the mat washing is repeatedly performed. For this reason, the laundry IC tag is required to have cleaning durability. Therefore, an IC tag having a hard package structure as shown in Patent Documents 1 and 2 is used, and is housed inside the mat to provide strong protection.
JP-A-6-327542 JP 2000-279312 A

  In the conventional mat, if the IC tag is attached while being exposed to the mat, the floor surface may be damaged by the hard package, or the tag may be peeled off due to a pedestrian load or a collision due to the passage of luggage. For this reason, the IC tag is embedded in the mat so that the IC tag is not exposed.

  In the case of a conventional tag-embedded mat, as shown in Patent Documents 1 and 2, an IC tag is embedded in a mat base material, unvulcanized rubber is attached so as to close the tag, and the unvulcanized rubber is added. Sulfurized and sealed. However, in the IC tag embedding mat using such a vulcanization bonding method, the number of parts of the reinforcing member for IC protection (Kevlar fiber etc.) increases (see Patent Document 1), and energy costs and work in the vulcanization process are increased. There has been a problem that the manufacturing cost such as the cost is increased.

  The present invention has been made in view of the above problems, and provides a treated surface type IC tag-attached mat that can reduce the cost of attaching an IC tag and can be attached with an IC tag with durability. The purpose is to do.

  In the present invention, instead of a conventional hard hard package having an IC tag encapsulating package structure, a flexible package having flexibility is used for the entire package or a part of the jacket portion, thereby embedding the tag in the mat. Focusing on the point that the above vulcanization treatment can be made unnecessary, it was made in view of the necessity of strengthening the state of tag adhesion to the mat substrate surface accompanying the change from the tag embedding method to the tag direct attachment method. The first aspect of the present invention is a flat IC tag in which an IC tag is attached to a predetermined portion of a base material surface of a mat base material, and the IC tag is a flexible surface made of a flexible material on both surfaces or one surface. The predetermined portion of the base material surface is roughened and / or primed to form a treated surface, the flexible surface of the flat IC tag faces outward and the back side faces the treated surface. Is a processing surface type IC tag attached mat was wearing.

  According to a second aspect of the present invention, in the first aspect, the predetermined portion of the substrate surface is formed of a shallow concave portion, the bottom surface of the concave portion is the processing surface, and the flat IC tag is accommodated in the concave portion. The processing surface type IC tag-attached mat adhered to the processing surface.

  According to a third aspect of the present invention, there is provided a treatment surface type IC tag-attached mat according to the second aspect, wherein the depth of the concave portion is equal to or greater than half the thickness of the flat IC tag.

  According to a fourth aspect of the present invention, in the first, second, or third aspect, the flat IC tag has a substantially trapezoidal cross section in which an outer peripheral portion has a tapered surface that tapers upward. It is a mat with a treated surface type IC tag in which the bottom surface of the IC tag is bonded to the treated surface.

  According to a fifth aspect of the present invention, in the fourth aspect, the flat IC tag is accommodated in the concave portion with a part of the flat IC tag protruding, and the tapered surface is formed on an outer peripheral portion of the protruding portion. The processed surface type IC tag-attached mat.

  According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the mat substrate is a mat with a treated surface type IC tag, wherein the mat base material is made of synthetic rubber or synthetic resin.

  According to the first aspect of the present invention, using an IC tag composed of a flat IC tag whose both surfaces or one surface is a flexible surface made of a flexible material, a predetermined portion of the base material surface of the mat substrate is subjected to rough surface treatment and / or Alternatively, the surface of the flat IC tag is treated with a primer, the flexible surface of the flat IC tag faces outward, and the back side surface is adhered to the processing surface. Therefore, the flexible surface is matted without embedding the IC tag in the mat. It can be attached in a state exposed to the outside. Therefore, the work necessary for attaching the IC tag is only the pre-adhesion treatment work applied to the base material surface by rough surface treatment and / or primer treatment and the simple tag attaching work to the base material surface. The energy cost required for heating in the conventional vulcanization process is not required at all, and the cost of attaching the IC tag can be greatly reduced. Moreover, the flexible material of the flat IC tag can withstand repeated cleaning, and further during cleaning or use. It is possible to provide a mat with a treated surface type IC tag that has a durability that can absorb the pedestrian's load and the external force and impact force of passing luggage and prevents the tag from peeling off and realizes low cost. it can.

  The rough surface treatment is mainly performed by physical pretreatment by surface polishing. In the case of surface polishing, a belt-type sander, a small router, a cup brush or the like is used to form fine irregularities on the substrate surface. In the case of the primer treatment, which is a chemical pretreatment, a rubber-soluble primer is applied to the tag attachment site to facilitate fusion with the adhesive. In addition, as the adhesion pretreatment work to be performed on the substrate surface, physical pretreatment and chemical pretreatment in which the primer treatment is performed after surface polishing can be used in combination.

  The flat IC tag according to the present invention may have a tag package structure in which at least one surface is formed with a flexible surface made of a flexible material. As a tag package structure form, for example, a full soft package in which an electronic component of an IC tag and an antenna member are encapsulated in an elastic synthetic resin and made flexible as a whole can be used. Alternatively, a hard hard member and a flexible soft member may be combined. In the case of a combined configuration, the electronic component and the antenna member may be included in either a hard member or a soft member. For example, the electronic component and the antenna member are soft-molded with an elastic synthetic resin, and are formed on one of the package surfaces. A double package formed with a hard synthetic resin can be used.

  Synthetic rubber or synthetic resin having mat elasticity can be used for the mat base material according to the present invention. Tag adhesives include acrylic resin adhesives (adhesives based on acrylic resins and derivatives), acrylic resin emulsion adhesives (adhesives based on acrylic resin emulsions), urethane resin adhesives (Adhesive with urethane group (-NHCOO-)), resin adhesive such as epoxy resin adhesive (adhesive mainly composed of epoxy resin), and cyanoacrylate adhesive (2-cyanoacrylate ester) Monomer-based adhesives), styrene-butadiene rubber solution-based adhesives (adhesives based on copolymers of styrene and butadiene rubber), modified silicone adhesives (with methyldimethoxysilyl groups at the ends) And an adhesive mainly composed of polypropylene oxide (modified silicone). For the application of the adhesive to the treated surface, a nozzle spray, a roll coater, or the like may be used in addition to a simple manual operation using an instrument such as a brush, spatula, or roller.

  According to the second aspect of the present invention, the predetermined portion of the base material surface is formed of a shallow concave portion, the bottom surface of the concave portion is used as the processing surface, and the flat IC tag is accommodated in the concave portion. Since they are bonded, the flat IC tag can be accommodated in the recess to reduce the influence of external impacts and the like, and a mat with a treated surface type IC tag having more durability can be obtained. In order to avoid impact from the outside, it is preferable that the flat IC tag is stored in the concave portion so that the flexible surface does not protrude more than the base material surface and penetrates deeper than the base material surface. If this happens, dust will accumulate, so it is preferable that the flexible surface and the substrate surface be flush with each other.

  According to the third aspect of the present invention, the flat IC tag is housed in the concave portion so that the depth of the concave portion is 1/2 or more of the thickness of the flat IC tag. The external force does not lead the IC tag to peeling. Furthermore, the protruding portion of the flat IC tag absorbs the pedestrian's load, the external force of passing the baggage and the impact force, and does not give the tag a peel force (that is, a force in the peeling direction), thereby improving the peeling prevention effect. A mat with a treated surface type IC tag can be realized. Moreover, by setting the amount of protrusion on the upper surface of the flat IC tag, the effect of preventing peeling can be maintained even if a part of the flat IC tag is protruded, so that the shallow concave portion can be used, and the processing operation of the concave portion is extremely difficult. It is simple and can reduce processing time and cost. In the conventional hard package tag embedding method, in order to embed a package having a thickness of about 2 mm, it is necessary to form a recess of 2 mm or more, and the shaving work is troublesome. Therefore, it is only necessary to perform a slight grinding work such as a sander, so that the recessed portion machining work can be performed in a short time, and the work burden and work cost in tagging can be reduced.

  According to a fourth aspect of the present invention, the flat IC tag has a substantially trapezoidal cross section in which an outer peripheral portion has a tapered surface that tapers upward, and the bottom surface of the flat IC tag is bonded to the processing surface. Therefore, the external force applied to the upper part of the flat IC tag, for example, the external force in the cleaning process, the external force of the pedestrian's load or the passage of the load, and the impact force can be alleviated by the formation of the tapered surface, and the peeling prevention effect is great. A mat with a treated surface type IC tag can be realized.

  According to the fifth aspect of the present invention, the flat IC tag is accommodated in the recess in a state in which a part of the flat IC tag protrudes, and the tapered surface is formed on the outer periphery of the protruding portion. Even if a part of the flat IC tag protrudes from the base surface, the impact force due to contact with the pedestrian's legs (toes, etc.) or luggage is applied to the protruding part of the flat IC tag. A mat with a treated surface type IC tag that can be relaxed by formation and has a large peeling prevention effect can be realized. In addition, even if a part of the flat IC tag is protruded, the peeling prevention effect is maintained, so that it can be accommodated in the shallow concave portion, and as described above, the concave portion processing operation is extremely simple, and the processing time is reduced.・ Cost reduction can be realized.

  According to the sixth aspect of the present invention, since the mat base material is made of synthetic rubber or synthetic resin, the pre-bonding processing operation can be easily performed, and the IC tag can be placed in the mat only by a simple pasting operation. It can be attached without being buried, and the attachment cost of the IC tag can be greatly reduced. As the synthetic rubber, NBR (nitrile butadiene rubber) and EPDM (ethylene propylene diene rubber) can be used, and a more elastic sponge-shaped NBR foam material may be used. As the synthetic resin, urethane resin or the like can be used.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a mat with a treated surface type IC tag according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a longitudinal sectional partial view of a mat with a treated surface type IC tag according to the present invention. This mat includes a rubber rubber 1 as a mat base material, a base fabric 2 bonded to the surface of the rubber rubber 1, and a large number of piles 3 planted on the base fabric 2. The base fabric 2 and a large number of piles 3 are called a mat raw fabric, and a turf-like sheet, a sponge sheet, a nonwoven fabric sheet, a cloth-like sheet, etc. are used for this. For the rubber rubber 1, synthetic rubber or synthetic resin such as NBR, NBR foam, EPDM, or the like can be used.

  A flat IC tag 6 is attached to the back surface 4 of the rubber rubber 1 as a non-contact data carrier for merchandise management. The flat IC tag 6 is a disk-shaped IC tag molded with a flexible resin in a thin plate shape having a diameter of about 10 mm and a thickness of 0.5 mm to 1.5 mm. The mold 9 of the flat IC tag 6 is made of an elastomer or a thermosetting rubber material, and has a flexible tag structure in which the entire tag is freely bent. The electronic component module 7 and the antenna member 8 are covered and protected in the mold 9.

  The flat IC tag 6 is attached by forming the bonding treatment surface 5 at the tag attachment location on the rubber substrate surface rear surface 4 in the following procedure. First, the processing surface 5 is formed as a pre-bonding process on the tag attachment portion on the back surface 4 of the rubber rubber 1. The adhesion pretreatment includes physical pretreatment by surface polishing and chemical pretreatment such as primer treatment, and these may be used in combination. In the case of surface polishing, fine irregularities are formed on the rubber surface using a belt type sander, a small router or a cup brush. In the case of primer treatment, a rubber-soluble primer is applied to the tag attachment site to facilitate fusion with the adhesive.

  After the processing surface 5 is formed at the tag attachment location on the back surface 4, an adhesive is applied to the processing surface 5 to form the adhesive layer 10, and then the back side surface is bonded with the one surface 11 of the flat IC tag facing outward. The flat IC tag 6 is attached by being attached to the agent layer 10.

  In this embodiment, the flat IC tag 6 which is a flexible surface made of a flexible material on both sides is used, and the back surface of the flat IC tag 6 is a flexible surface on the treatment surface 6 of the back surface 4 of the rubber rubber 1 which has been pre-bonded. Is attached to the outside. Therefore, the IC tag can be attached in a state where the flexible outer surface of the flat IC tag 6 is exposed toward the outside of the mat without being embedded in the mat. In addition, since the work necessary for attaching the IC tag is only the above-mentioned pre-bonding process and the simple work of attaching the tag, the energy cost required for the heating in the conventional tag embedding vulcanization process is not required. Attaching cost can be greatly reduced, and the flat IC tag 6 can withstand repeated washing and absorb pedestrian weights and external collision forces to prevent tag peeling. Cost reduction can be realized. Speaking of specific implementation effects, in the case of conventional tag vulcanization tag attachment, the processing capacity was only 16 tags per hour, but in this embodiment, the tag processing capacity per hour. Can be improved to about 5 times.

  FIG. 2 shows an embodiment using a flat IC tag 20 having a substantially trapezoidal cross-section package structure in which a taper surface tapering upward is formed on the outer periphery of the package. As shown in FIG. 2 (2 A), a tapered surface 21 is formed on the outer periphery of the upper portion of the mold portion 25 of the flat IC tag 20. In the flexible resin mold part 25, the electronic component module 22 and the antenna member 23 are covered and protected. (2B) is the adhesive layer with the flat IC tag 20 facing the processing surface 24 that has been pre-bonded to the back side of the rubber rubber 28 and the upper surface 26 of the flat IC tag 20 facing outward as in the embodiment of FIG. The sticking state stuck by No. 27 is shown. According to the present embodiment, since the bottom surface of the flat IC tag 20 is bonded to the processing surface 24 so as to protrude outward, an external force applied to the upper portion of the flat IC tag 20, for example, during a cleaning operation or a pedestrian load or luggage It is possible to relieve the external force and impact force of the passage of the surface, and it is possible to realize a mat with a treated surface type IC tag having a large peeling preventing effect.

  FIG. 3 is a partial longitudinal sectional view of the mat according to the embodiment in which the IC tag is embedded in the mat. (3A) of FIG. 3 is a case where the thin disc-shaped flat IC tag 6 of the embodiment of FIG. 1 is embedded, and the same members as in FIG. On the back surface 33 side of the rubber rubber 32 of the mat base material, a shallow concave portion 30 is formed at a location where the flat IC tag 6 is attached. The recess 30 is formed by a scraping operation using a sander or the like used for the surface polishing. A treatment surface 31 subjected to the pre-bonding treatment is formed on the bottom surface of the recess 30, and the flat IC tag 6 is attached to the adhesive layer 10 applied to the treatment surface 31. The flat IC tag 6 is accommodated and stuck in the recess 30 flush with the back surface 33.

  (3B) of FIG. 3 is a case where the flat IC tag 20 having a substantially trapezoidal section with a taper in the embodiment of FIG. 2 is embedded, and the same members as those in FIG. Also in this case, similarly to (3B), the treatment surface 41 by the pre-bonding treatment is formed on the bottom surface of the shallow recess 40 formed on the back surface 43 side of the rubber rubber 42, and the adhesive layer 27 applied to the treatment surface 41 is flattened. The IC tag 20 is attached. The flat IC tag 20 is accommodated and stuck in the recess 40 flush with the back surface 43.

  In the embodiment of (3A) and (3B) of FIG. 3, since the flat IC tag is placed and stuck in the recesses 30 and 40, it is possible to reduce the influence of external impact and the like, and to be more durable It is possible to realize a mat with a processing surface type IC tag with abundant quality. In addition, in the embodiment of (3A), the flat IC tag is placed in the recess in the flexible surface of the tag and the rubber base material. Since the surface is made flush, dust accumulation does not occur, and by burying the recesses, it is possible to avoid external impact and maintain durability.

  Further, since the flat IC tags 6 and 20 have a thin shape, they can be attached with the shallow concave portions 30 and 40. Therefore, the processing operation of the recess is extremely simple, and the processing time and cost can be reduced. In the conventional hard package tag embedding method, in order to embed a package having a thickness of about 2 mm, it is necessary to form a recess having a thickness of 2 mm or more. Moreover, the process which seals the reinforcement member which protects a hard package tag, and also the rubber member which obstruct | occludes it was required. In the case of FIG. 3, since the shallow concave portion is sufficient, it is possible to perform the concave portion processing work in a short time by performing a slight grinding work such as a sander. The burden and work cost can be reduced.

  Regarding the embodiment in which the flat IC tags 6 and 20 are embedded in the shallow concave portions 30 and 40, in terms of the specific durability in relation to the mat rubber material, in the case of the conventional tag embedding vulcanization tag attachment, NBR In this case, when the cleaning is repeated about 50 times, the tag peels off, and in the case of the NBR foam material, it is about 2 times. According to the above, the NBR and the NBR foam material were not peeled off at all even when washing was repeated 100 times or more, and EPDM could be used up to about 50 times.

  When (3A) and (3B) in FIG. 3 are compared, the latter case is different in terms of protecting the external force. In the case of (3A), when the flat IC tag 6 having a flat disk shape is accommodated, since the flat IC tag 6 has flexibility, there is a possibility that an external member may bite into and peel off from the concave portion 30 and a slight gap. . On the other hand, even when the surfaces are flush with each other, the external force protection can be enhanced by using the flat IC tag 20 having a substantially disk-like package structure chamfered by the tapered surface 21 as shown in (3B). That is, since the upper surface 32 of the flat IC tag 30 faces outward and is flush with the back surface 43 and is flush with the recess 40, there is a space between the inner surface of the recess 40 and the tapered surface 21. However, since the flat IC tag 20 is flexible, even if an external member (floor surface unevenness or the like) bites into the space, the taper surface 21 does not act as a peeling force, and the flat IC tag 20 A sticking state can be maintained stably. In order to further enhance the external force protection, a wrapping structure with the flange 44 of (3B) may be used. When the recess 40 is formed, the flange 44 is easily formed by machining the inner peripheral portion of the recess 40 using a sander having an acute edge to form a flange shape spreading toward the bottom surface side. By storing the tag so that the periphery of the flat IC tag 20 is wrapped in the ridge-shaped recess, the ridge 44 is covered on the tapered surface 21, and the external force peeling can be prevented more firmly.

  In the present invention, if the tag receiving recess is made shallower, the burden of the recess forming operation can be further reduced. (4A) of FIG. 4 shows an embodiment in which the upper surface 11 of the flat IC tag 6 protrudes upward from a shallow recess 34 (depth is shallower than the recess 30 of FIG. 3). 4, the same members as those in (3A) of FIGS. 1 and 3 are denoted by the same reference numerals. In this case, since the protruding portion of the flat IC tag 6 does not give a peel force (that is, a force in the peeling direction) to the tag due to the pedestrian's load or the external force and the impact force of passing the load, The protrusion height is ½ or less of the thickness T of the flat IC tag 6, that is, the thickness of the adhesive layer 10 is extremely thin, and if the thickness is ignored, the depth D of the recess 34 is set to be small. It is preferable to set it to 1/2 or more of thickness T.

  FIG. 5 is an explanatory diagram for explaining the peel force when the elastic flat object 50 is attached. It is assumed that the flat object 50 having a thickness T is bonded to the floor surface 52 with an adhesive 53, and the height from the floor surface 52 to the center of the flat object 50 is H (˜T / 2). As shown in FIG. 5 (5A), when an external force F is applied to the end of the flat object 50 at a position higher than the height H, the flat object 50 is adhered to the floor surface, and the upper side is elastically deformed 51. To do. For this reason, even if the vertical component force Fn and the parallel component force Fp of the external force F act on the deformed surface, the flat object 50 does not act as a peeling force and does not separate from the floor surface 52. As shown in (5B), even if the external force F decreases to the center of the flat object 50, the shearing force along the bonding surface acts as a drag force, so that the end of the flat object 50 is only elastically deformed 51, so that the peeling is not caused. Does not occur. However, when the external force F is applied below the center of the flat object 50, an elastic deformation 51 that is biased toward the lower end of the flat object 50 occurs. At this time, the vertical component force Fn of the external force F branches into a vertical component force Fn1 and a horizontal component force Fn2, and the vertical component force Fn1 acts on the flat object 50 as a peeling force. Therefore, in the embodiment of FIG. 4, the protrusion height from the rubber back surface 28 of the flat IC tag 6 is set to be equal to or less than ½ of the thickness T of the flat IC tag 6 so that the peeling force against such peeling does not occur. During the process or from the load of the pedestrian, the external force of passing the load and the impact force, the tag is not peeled, that is, not peeled off.

  In order to avoid external impact, it is preferable that the flat IC tag 6 is placed in the recess so that the upper surface of the flat IC tag 6 is flush with the rubber back surface 33 as shown in FIG. In the embodiment of (4A) of No. 4, it is possible to prevent peeling even if a part of the flat IC tag 6 is protruded by appropriately setting the protrusion amount of the upper surface of the flat IC tag 6 obtained from the viewpoint of the peel force. Since it can be maintained, it is possible to use the shallow concave portion 34. Further, the machining operation of the concave portion 34 can be extremely simplified, and the advantage that the machining time and cost can be reduced can be obtained. In addition, as shown to (4B), you may form the taper surface 35 in the part protruded from the rubber back surface 33. FIG. That is, similarly to (3B) in FIG. 3, the tapered surface 35 can alleviate the influence of external force applied to the protruding portion and further improve the durability.

  The flat IC tag according to the present invention may have a tag package structure in which at least one surface is formed with a flexible surface made of a flexible material. FIG. 6 shows a tag package structure as a dual package in which an electronic component module 61 and an antenna member 62 are soft-molded with a flexible resin mold 64 and covered with a hard synthetic resin mold 63 covering one of the package surfaces. The embodiment of the used flat IC tag 60 is shown. In FIG. 6, the same members as those in FIG. The double package is formed by separately forming a flexible resin mold 64 and a hard synthetic resin mold 63 and bonding or bonding them together. In the case of FIG. 6, the hard synthetic resin mold 63 has a truncated cone shape with a substantially trapezoidal cross section in which a tapered surface 21 is formed on the outer peripheral portion as shown in FIG. The circular flexible resin mold 64 is bonded and housed in the housing portion. In this case, the flat IC tag 60 is attached by attaching the lower surface of the hard synthetic resin mold 63 via the adhesive layer 10 to the treatment surface 5 on which the pre-bonding treatment of the back surface 4 of the rubber rubber 1 is performed. According to the present embodiment, the surface of the flat IC tag 60 that protrudes to the outside is the flexible resin mold surface 65, and the soft and hard package structure covers the periphery with the hard synthetic resin mold 63. In addition, it is possible to realize a mat with a double-sided adhesive IC tag that has a durability-rich flexibility even if it is affected by contact with the outside or washing.

  The present invention is not limited to the above-described embodiments and modifications, and includes various modifications and design changes within the technical scope without departing from the technical idea of the present invention. Needless to say.

  INDUSTRIAL APPLICABILITY The present invention can realize a mat with a treated surface type IC tag having flexibility that is rich in durability even under the influence of washing or the like, and is particularly suitable for a rental mat that is repeatedly washed repeatedly. It is.

It is a longitudinal cross-section fragmentary view of the processing surface type | mold IC tag attachment mat | matte which concerns on this invention. It is the mat | matte longitudinal cross-section partial view which shows embodiment using the flat IC tag 20 and the flat IC tag 20 which have the package structure of a substantially trapezoidal cross section. It is a mat longitudinal cross-section fragmentary view which shows embodiment which embed | buried and attached the IC tag to the mat. It is a mat | matte longitudinal cross-section partial view which shows embodiment which made the upper surface of the flat IC tag 6 protrude upwards from the recessed part 34. FIG. It is a figure for demonstrating the peel force in embodiment of FIG. It is a figure which shows embodiment using the flat IC tag of another package structure used for this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Rubber rubber 2 Base cloth 3 Pile 4 Back surface 5 Processing surface 6 Flat IC tag 7 Electronic component module 8 Antenna member 9 Mold 10 Adhesive layer 11 One surface of the flat IC tag 12 Sheet 20 Flat IC tag 21 Tapered surface 22 Electronic component module 23 Antenna Member 24 Processing surface 25 Mold part 26 Upper surface 27 Adhesive layer 28 Rubber rubber 30 Recess 31 Processing surface 32 Rubber rubber 33 Back surface 34 Shallow recess 40 Recess 41 Processing surface 42 Rubber rubber 43 Back surface 44 庇 50 Flat object 51 Elastic deformation 52 Floor surface 53 Adhesive 60 flat IC tag 61 electronic component module 62 antenna member 63 hard synthetic resin mold 64 flexible resin mold W1 length W2 width F external force Fn vertical component force Fp parallel component force

Claims (4)

In a mat in which an IC tag is attached to a predetermined portion of the base material surface of the mat base material, the IC tag includes a flat IC tag whose both surfaces or one surface is a flexible surface made of a flexible material, and the predetermined portion of the base material surface A treated surface obtained by roughening and / or treating with a primer to form a treated surface, with the flexible surface of the flat IC tag facing outward and the back surface thereof bonded to the treated surface through an adhesive layer without heating. Type IC tag-attached mat, wherein the predetermined portion of the base material surface is a concave portion having a depth of 1/2 or more with respect to the thickness of the flat IC tag, and the bottom surface of the concave portion is used as the processing surface. the flat IC tag is installed in the recess, the flexible surface of the flat IC tag is exposed in contact with the floor surface those, unheated surface on which the flexible surface and wherein the able to be deformed according to unevenness of the floor surface Type mat with IC tag. 2. The non-heat- treated surface according to claim 1, wherein the flat IC tag has a substantially trapezoidal cross section in which an outer peripheral portion has a tapered surface that tapers upward, and the bottom surface of the flat IC tag is bonded to the processing surface. Type mat with IC tag. 3. The non-heat- treated surface type IC tag according to claim 2 , wherein the flat IC tag is accommodated in the concave portion with a part of the flat IC tag protruding, and the tapered surface is formed on an outer peripheral portion of the protruding portion. mat. The mat with an unheat- treated surface type IC tag according to claim 1 , 2 or 3 , wherein the mat substrate is made of synthetic rubber or synthetic resin.

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