JP5206498B2 - Deterioration diagnosis apparatus and deterioration diagnosis method - Google Patents

Description

  The present invention relates to a deterioration diagnosis apparatus, a processing apparatus with a deterioration diagnosis apparatus, and a deterioration diagnosis method.

  It is important that various devices have high reliability.

  For this reason, for example, in a semiconductor integrated circuit, a BIST (Built In Self Test) circuit for executing a self-diagnosis is provided inside, and a test different from the operation processing of a normal circuit is performed at power-on or at regular intervals. A method is generally known (see, for example, Patent Document 1).

JP 2003-68865 A

  However, when the apparatus is inspected at a predetermined cycle, the longer the cycle, the lower the frequency of inspection, and the longer the time from failure occurrence to detection. On the other hand, if the cycle is short, the time from failure occurrence to detection can be shortened. However, since the frequency of inspection increases, a lot of time is required for inspection time different from normal arithmetic processing.

  As described above, it has been difficult to inspect the apparatus at an appropriate timing.

  An object of the present invention is to provide a deterioration diagnosis apparatus, a processing apparatus with a deterioration diagnosis apparatus, and a deterioration diagnosis method that solve the above-described problems.

  The present invention comprises inspection means for inspecting a processing apparatus to be inspected, and deterioration detection means for detecting correlation deterioration that is deterioration of an object that deteriorates in correlation with the processing apparatus, and the inspection means comprises: Provided is a deterioration diagnosis apparatus characterized in that the processing apparatus is inspected when the correlation deterioration is detected by the deterioration detection means.

  Moreover, this invention provides the processing apparatus with a deterioration diagnostic apparatus characterized by including the deterioration diagnostic apparatus of this invention, and the said processing apparatus.

  The present invention further includes an inspection process for inspecting a processing apparatus to be inspected, and a deterioration detection process for detecting a correlation deterioration that is a deterioration of an object that deteriorates in correlation with the processing apparatus. There is provided a deterioration diagnosis method characterized in that the inspection step is performed when the correlation deterioration is detected by a step.

  According to the present invention, the processing apparatus can be inspected at an appropriate timing.

It is a block diagram which shows the structure of the deterioration diagnostic apparatus which concerns on 1st Embodiment. It is a block diagram which shows the structure of the deterioration detection apparatus with which the deterioration diagnostic apparatus which concerns on 1st Embodiment is provided. It is a circuit diagram which shows an example of the deterioration tolerance circuit with which the deterioration detection apparatus of the deterioration diagnostic apparatus which concerns on 1st Embodiment is provided. It is a circuit diagram which shows an example of the deterioration circuit with which the deterioration detection apparatus of the deterioration diagnostic apparatus which concerns on 1st Embodiment is provided. It is a block diagram which shows the structure of the deterioration determination circuit with which the deterioration detection apparatus of the deterioration diagnostic apparatus which concerns on 1st Embodiment is provided. It is a time chart for demonstrating operation | movement of the deterioration detection apparatus of the deterioration diagnostic apparatus which concerns on 1st Embodiment. It is a block diagram which shows the structure of the test | inspection apparatus with which the deterioration diagnostic apparatus which concerns on 1st Embodiment is provided. It is a flowchart which shows the flow of the process by the deterioration diagnostic apparatus which concerns on 1st Embodiment. It is a flowchart which shows the flow of a process in the test | inspection process of FIG. 8 in the case of 1st Embodiment. It is a block diagram which shows the structure of the deterioration diagnostic apparatus which concerns on 2nd Embodiment. It is a block diagram which shows the structure of the deterioration detection apparatus with which the deterioration diagnostic apparatus which concerns on 2nd Embodiment is provided. It is a time chart for demonstrating operation | movement of the deterioration detection apparatus of the deterioration diagnostic apparatus which concerns on 2nd Embodiment. It is a block diagram which shows the structure of the test | inspection apparatus with which the deterioration diagnostic apparatus which concerns on 2nd Embodiment is provided. It is a flowchart which shows the flow of a process in the test | inspection process of FIG. 8 in the case of 2nd Embodiment. It is a block diagram which shows the structure of the deterioration diagnostic apparatus which concerns on 3rd Embodiment. It is a flowchart which shows the flow of a process in the test | inspection process of FIG. 8 in the case of 3rd Embodiment. It is a block diagram which shows the structure of the test | inspection apparatus with which the deterioration diagnostic apparatus which concerns on 4th Embodiment is provided. It is a block diagram which shows the structure of the test | inspection apparatus with which the deterioration diagnostic apparatus which concerns on 5th Embodiment is provided. It is a flowchart which shows the flow of a process by the deterioration diagnostic apparatus which concerns on 5th Embodiment. FIG. 20 is a flowchart showing the flow of processing in the inspection processing with deterioration timer initialization of FIG. 19 in the case of the fifth embodiment. FIG. FIG. 20 is a flowchart showing the flow of processing in the inspection processing by the deterioration timer in FIG. 19 in the case of the fifth embodiment. FIG. 20 is a flowchart showing the flow of processing in the inspection processing with deterioration timer initialization of FIG. 19 in the case of the sixth embodiment. FIG. FIG. 20 is a flowchart showing a flow of processing in inspection processing by the deterioration timer in FIG. 19 in the case of the seventh embodiment. It is a flowchart which shows the flow of a process by the deterioration diagnostic apparatus which concerns on 8th Embodiment. It is a flowchart which shows the flow of a process in the test | inspection period change process of FIG. 24 in the case of 8th Embodiment. It is a flowchart which shows the flow of a process in the test | inspection process by the timer of FIG. 24 in the case of 8th Embodiment. It is a flowchart which shows the flow of a process in the test | inspection process by the timer of FIG. 24 in the case of 9th Embodiment. It is a circuit diagram which shows the structure of the deterioration circuit of the deterioration detection apparatus with which the deterioration diagnostic apparatus which concerns on 10th Embodiment is provided. It is a block diagram which shows the structure of the deterioration detection apparatus group with which the deterioration diagnostic apparatus which concerns on 11th Embodiment is provided. It is a block diagram which shows the structure of the deterioration detection apparatus with which the deterioration diagnostic apparatus which concerns on 12th Embodiment is provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

[First Embodiment]
FIG. 1 is a block diagram showing a configuration of a degradation diagnosis apparatus 100 according to the first embodiment, FIG. 2 is a block diagram showing a configuration of a degradation detection apparatus 40 included in the degradation diagnosis apparatus 100, and FIG. FIG. 4 is a circuit diagram showing an example of a deterioration circuit 43 provided in the deterioration detection device 40, FIG. 5 is a block diagram showing a configuration of a deterioration determination circuit 44 provided in the deterioration detection device 40, and FIG. 6 is a time chart for explaining the operation of the deterioration detection device 40, FIG. 7 is a block diagram showing the configuration of the inspection device 20 provided in the deterioration diagnosis device 100, and FIG. 8 is a flowchart showing the flow of processing by the deterioration diagnosis device 100. FIG. 9 is a flowchart showing the flow of processing in the inspection processing (step S3) of FIG.

  A degradation diagnosis apparatus (or a processing apparatus with a degradation diagnosis apparatus) 100 according to the present embodiment is correlated with the inspection apparatus 20 and the control apparatus 10 as inspection means for inspecting the processing apparatus 30 to be inspected, and the processing apparatus 30. A deterioration detecting device 40 as a deterioration detecting means for detecting a correlation deterioration which is a deterioration of a subject to be deteriorated (for example, a deterioration circuit 43), and the inspection means detects a correlation deterioration by the deterioration detecting device 40. Next, the processing device 30 is inspected. In addition, the deterioration diagnosis apparatus 100 according to the present embodiment is a processing apparatus with a deterioration diagnosis apparatus that includes a deterioration diagnosis apparatus (a portion other than the processing apparatus 30 in the deterioration diagnosis apparatus 100) and the processing apparatus 30. is there. Further, in the degradation diagnosis method according to the present embodiment, the correlation degradation that is the degradation of the inspection process for inspecting the processing device 30 to be inspected and the subject (for example, the degradation circuit 43) that deteriorates in a correlated manner with the processing device 30. And a deterioration detecting step for detecting the correlation, and an inspection step is performed when correlation deterioration is detected by the deterioration detecting step. Details will be described below.

  First, the overall configuration of the deterioration diagnosis apparatus 100 will be described.

  As shown in FIG. 1, a deterioration diagnosis apparatus (or a processing apparatus with a deterioration diagnosis apparatus) 100 according to this embodiment includes an inspection apparatus 20 that inspects a processing apparatus 30, a processing apparatus 30 that is an inspection target, and a processing apparatus. The deterioration detection device 40 that detects the correlation deterioration, which is a deterioration correlated with the deterioration of 30, and the control device 10 that controls the operation of the processing device 30 are provided.

  The deterioration detection device 40, the inspection device 20 and the processing device 30 are each a semiconductor integrated circuit or at least include a semiconductor integrated circuit. Note that the processing device 30 may be, for example, a hard disk including a semiconductor integrated circuit.

  When an input value is input to the processing device 30, the processing device 30 is configured to generate an output value by performing a predetermined process on the input value and output the generated output value. Yes. In the normal processing (step S1 in FIG. 8), the processing device 30 performs predetermined processing on the processing input 56 input to the processing device 30, and the processing result obtained by this processing is used as the processing output 57. Output.

  Here, specifically, the processing performed by the processing device 30 is, for example, a predetermined operation (addition, subtraction, multiplication, division, or an arbitrary combination thereof). When the processing performed by the processing device 30 is addition, in a state where the processing device 30 is operating normally, for example, when “1” and “2” are input as the processing input 56, the processing output 57 Becomes “3”.

  The deterioration detection device 40 outputs a deterioration detection signal 51 indicating whether or not there is a correlation deterioration, which is a deterioration correlated with the deterioration of the processing device 30, to the inspection device 20. That is, the deterioration detection signal 51 indicating that the correlation deterioration is detected when the correlation deterioration is detected, and the deterioration detection signal 51 indicating that the correlation deterioration is not detected when the correlation deterioration is not detected. Each is output to the inspection device 20.

  When the deterioration detection signal 51 indicating that the correlation deterioration has been detected is input from the deterioration detection device 40, the inspection device 20 determines that the processing device 30 needs to be inspected, and inspects the processing device 30. . In this inspection, first, an inspection input value 52 and an inspection control signal 53 are output to the processing device 30.

  Here, the inspection control signal 53 includes, for example, a control signal that instructs the start of the inspection. Specifically, the control signal for instructing the start of inspection is, for example, a control signal for instructing input switching between the processing input 56 and the inspection input value 52 and output switching between the processing output 57 and the inspection output value 54. Is included.

  When the inspection control signal 53 instructing the start of the inspection is input from the inspection device 20, the processing device 30 temporarily stops (saves) the processing for the processing input 56, while processing for the inspection input value 52. The test state is shifted to. Then, the processing device 30 outputs the processing result obtained by the processing on the inspection input value 52 to the inspection device 20 as the inspection output value 54. That is, the processing device 30 is in a state of selecting the inspection input value 52 as an input value to the processing device 30 in accordance with the inspection control signal 53 from the inspection device 20.

  Here, the processing performed by the processing device 30 on the inspection input value 52 and the content of the processing performed by the processing device 30 on the processing input 56 are similar to each other (for example, the same calculation).

  The inspection device 20 inspects the processing device 30 by determining the inspection output value 54 input from the processing device 30, and outputs the result to the control device 10 as the inspection result output 55.

  The control device 10 determines the state of the processing device 30 according to the inspection result output 55 input from the inspection device 20, and controls the operation of the processing device 30 according to the determination result. That is, when the inspection result output 55 indicating that the processing device 30 has deteriorated is input, it is determined that the processing device 30 has actually deteriorated, and the normal processing is stopped (not temporarily stopped). , A complete stop) is output to the processing device 30. On the other hand, when the inspection result output 55 indicating that the processing device 30 has not actually deteriorated is input, a control signal 63 for instructing the resumption of the normal processing is output to the processing device 30.

  The processing device 30 stops the normal processing when the control signal 63 instructing the stop of the normal processing is input from the control device 10. Specifically, since it has already stopped temporarily, the state is maintained. On the other hand, when the control signal 63 instructing the resumption of the normal process is input from the control device 10, the normal process is resumed. That is, the processing device 30 performs processing on the processing input 56 input to the processing device 30 and returns to a state in which a processing output 57 is output as the processing result.

  Next, the configuration of the deterioration detection device 40 will be described.

  As shown in FIG. 2, the deterioration detection device 40 includes, for example, an oscillation circuit 41, a deterioration resistance circuit 42, a deterioration circuit (subject) 43, and a deterioration determination circuit 44.

  The deterioration circuit 43 is a circuit configured in the same manner as an inspection target circuit (not shown) which is a part or the whole circuit of the processing device 30. For this reason, the deterioration circuit 43 deteriorates in correlation with the processing device 30. Further, the deterioration resistant circuit 42 is a circuit similar to the deterioration circuit 43. However, the deterioration-resistant circuit 42 is configured so that the deterioration amount of the deterioration-resistant circuit 42 is so small that it can be ignored as compared with the deterioration amount of the deterioration circuit 43. In other words, the deterioration resistant circuit 42 is configured so as not to deteriorate with time.

  As a result, the duty ratio of the deterioration-resistant circuit output 59 that is an output through the deterioration-resistant circuit 42 does not change regardless of the presence or absence of deterioration, but the duty ratio of the deterioration circuit output 60 that is an output through the deterioration circuit 43 is deteriorated. The circuit 43 changes due to deterioration.

  As shown in FIG. 3, the anti-degradation circuit 42 is specifically configured as a CMOS inverter including a PMOS transistor 64 and an NMOS transistor 65, for example. Similarly, the degradation circuit 43 is specifically configured as a CMOS inverter including a PMOS transistor 66 and an NMOS transistor 67, as shown in FIG.

  Here, the withstand voltage of at least one of the electric devices constituting the degradation circuit 43 (for example, the PMOS transistor 66 and the NMOS transistor 67) is the same as that of the electrical device constituting the degradation resistance circuit 42 (for example, the PMOS transistor 64 and the NMOS transistor). It is set lower than the breakdown voltage of the transistor 65).

  Specifically, for example, both the PMOS transistor 64 and the NMOS transistor 65 of the degradation resistant circuit 42 are set to have a relatively high breakdown voltage. On the other hand, for the degradation circuit 43, the breakdown voltage of one PMOS transistor 66 is set to a breakdown voltage as high as the PMOS transistor 64 and the NMOS transistor 65 of the degradation resistance circuit 42, but the other NMOS transistor 67 The breakdown voltage is set lower than that of the PMOS transistor 66.

  Thereby, the deterioration amount of the deterioration-resistant circuit 42 is reduced to a negligible level as compared with the deterioration amount of the deterioration circuit 43. In the deterioration circuit 43, since the NMOS transistor 67 is likely to deteriorate, the deterioration of the NMOS transistor 67 can be particularly detected.

  Here, the anti-degradation circuit 42 is operated under the same operating conditions as the inspection target circuit of the processing device 30, for example. Since the withstand voltage 42 is so high that it does not deteriorate with time, the deterioration-resistant circuit 42 is substantially maintained in the initial state of the circuit to be inspected regardless of the elapsed time.

  In addition, if the deterioration circuit 43 is operated under the same operating conditions as the inspection target circuit of the processing device 30, the deterioration amount of the deterioration circuit 43 becomes approximately the same as that of the inspection target circuit of the processing device 30.

  On the other hand, it is preferable that the deterioration of the processing apparatus 30 can be detected before the processing apparatus 30 actually deteriorates. For this reason, by operating the deterioration circuit 43 under the operating condition in which the deterioration progresses more than the circuit to be inspected of the processing device 30 (as compared with the anti-deterioration circuit 42) (for example, always operating under such an operating condition) It is preferable that the deterioration amount of the deterioration circuit 43 is made larger than the deterioration amount of the circuit to be inspected by the processing device 30, and the deterioration circuit 43 is deteriorated faster than the processing device 30. The operating conditions under which deterioration proceeds are, for example, operating at a high voltage, operating at a high frequency, operating at a high temperature, or a combination of any two or more of these. It is possible to operate under conditions.

  In this way, the deterioration circuit 43 is deteriorated with time to the same degree or more as the inspection target circuit of the processing device 30.

  Note that the deterioration circuit 43 and the deterioration resistance circuit 42 may be operated under an operation condition in which the deterioration proceeds more than the operation condition of the processing device 30. Since the deterioration-resistant circuit 42 is less deteriorated than the circuit to be inspected and the deterioration circuit 43 of the processing device 30, the deterioration-resistant circuit 42 can be prevented from being substantially deteriorated even when operated in this way.

  In addition, the breakdown voltage of the circuit to be inspected and the degradation resistant circuit 42 of the processing apparatus 30 may be higher than that of the degradation circuit 43 (the breakdown voltage of the degradation circuit 43 is lower than that of the inspected circuit and degradation resistant circuit 42 of the processing apparatus 30). May be).

  In addition, it is preferable that the operating voltages of the deterioration circuit 43 and the deterioration resistance circuit 42 are voltages that do not greatly exceed the breakdown voltage of the electrical devices (for example, the PMOS transistor 64 and the NMOS transistor 65) that constitute the deterioration resistance circuit 42.

  Further, the deterioration determination circuit 44 of the deterioration detection device 40 detects the correlation deterioration based on the difference in deterioration amount between the deterioration resistance circuit 42 and the deterioration circuit 43.

  The deterioration determination circuit 44 generates and outputs a deterioration detection signal 51 based on, for example, a comparison of the duty ratios of signals between the deterioration resistant circuit output 59 and the deterioration circuit output 60.

  Specifically, for example, as shown in FIG. 5, the deterioration determination circuit 44 of the deterioration detection device 40 includes, for example, a phase comparison circuit 45 and a time / digital conversion circuit 46.

  The oscillation circuit 41 outputs a common oscillation circuit output 58 (see FIG. 6), which is a pulse signal having a predetermined cycle, to the deterioration resistance circuit 42 and the deterioration circuit 43.

  The degradation resistance circuit 42 outputs a degradation resistance circuit output 59 that is a pulse signal corresponding to the oscillation circuit output 58 input from the oscillation circuit 41 to the degradation determination circuit 44 (phase comparison circuit 45 thereof). The degradation circuit 43 outputs a degradation circuit output 60 that is a pulse signal corresponding to the oscillation circuit output 58 input from the oscillation circuit 41 to the degradation determination circuit 44 (phase comparison circuit 45 thereof).

  The phase comparison circuit 45 outputs the phase difference between the deterioration resistance circuit output 59 input from the deterioration resistance circuit 42 and the deterioration circuit output 60 input from the deterioration circuit 43 to the time / digital conversion circuit 46 as a phase comparison circuit output 61. To do. That is, the phase comparison circuit 45 responds to a timing difference (phase difference) between, for example, the rising timing of a certain pulse of the degradation resistant circuit output 59 and the rising timing of the pulse of the degradation circuit output 60 corresponding to this pulse. The pulse signal having the pulse width is output to the time / digital conversion circuit 46 as the phase comparison circuit output 61. The time / digital conversion circuit 46 converts the pulse width of the pulse input from the phase comparison circuit 45 into a digital signal, and outputs the conversion result to the inspection apparatus 20 as a deterioration detection signal 51.

  Specifically, as shown in FIG. 6, there is no deterioration in the first period of the oscillation circuit output 58, and there is no phase difference between the deterioration resistant circuit output 59 and the deterioration circuit output 60. That is, the pulse P0a of the deterioration resistant circuit output 59 and the pulse P0b of the deteriorated circuit output 60 corresponding to the pulse P0a have the same rising timing. In this case, the phase comparison circuit output 61 does not have a pulse waveform, and the value of the deterioration detection signal 51 from the time / digital conversion circuit 46 is “0”.

  Further, as shown in FIG. 6, since the deterioration has progressed in the second period of the oscillation circuit output 58, the duty ratio of the deterioration circuit output 60 becomes small (the pulse width becomes narrow), and the deterioration resistance circuit output 59 and There is a phase difference from the degradation circuit output 60. That is, the pulse P1a of the deterioration resistant circuit output 59 and the pulse P1b of the deteriorated circuit output 60 corresponding to the pulse P1a are different in the rising timing by (T1b−T1a). Therefore, the phase comparison circuit output 61 becomes a pulse P1c having a pulse width corresponding to the timing difference (T1b−T1a). The time / digital conversion circuit 46 converts the pulse width of the pulse P1c into a digital value, and outputs the conversion result as the deterioration detection signal 51. For example, when the pulse width of the pulse P1c is converted to a digital value “1”, the value of the deterioration detection signal 51 is “1”.

  Further, as shown in FIG. 6, since the deterioration further progressed in the third period of the oscillation circuit output 58, the duty ratio of the deterioration circuit output 60 is further reduced (pulse width is further narrowed), and the anti-degradation circuit The phase difference between the output 59 and the degraded circuit output 60 is increased. Similarly, the pulse P2a of the deterioration resistant circuit output 59 and the pulse P2b of the deteriorated circuit output 60 corresponding to the pulse P2a are different in the rising timing by (T2b−T2a). Therefore, the phase comparison circuit output 61 is a pulse P2c having a pulse width corresponding to the timing difference (T2b-T2a). The time / digital conversion circuit 46 converts the pulse width of the pulse P2c into a digital value, and outputs the conversion result as the deterioration detection signal 51. For example, when the pulse width of the pulse P2c is converted to the digital value “2”, the value of the deterioration detection signal 51 is “2”.

  The pulse width of the phase comparison circuit output 61 may be the same as the timing difference between the rising timing of a certain pulse of the degradation resistant circuit output 59 and the rising timing of the pulse of the degradation circuit output 60 corresponding to this pulse. Alternatively, a pulse width that is not the same as the timing difference but has a correlation with the timing difference may be used.

  Here, the pulse width of the phase comparison circuit output 61 increases as the deterioration of the deterioration circuit 43 progresses. That is, the deterioration detection signal 51 that is a value obtained by digitally converting the pulse width is a signal indicating the degree of deterioration (deterioration amount) of the deterioration circuit 43.

  Thus, the deterioration detection device 40 detects the deterioration amount of the deterioration circuit 43 that deteriorates in correlation with the processing device 30 and outputs the detected deterioration amount as the deterioration detection signal 51. More specifically, the deterioration determination circuit 44 detects the correlation deterioration based on the difference between the deterioration resistant circuit output 59 and the deterioration circuit output 60.

  Next, the configuration of the inspection apparatus 20 will be described.

  As illustrated in FIG. 7, the inspection apparatus 20 includes, for example, an inspection control unit 21, an inspection expected value output unit 22, an inspection input value output unit 23, and a comparison unit 24.

  The deterioration detection signal 51 from the deterioration detection device 40 is input to the inspection control unit 21, the inspection expected value output unit 22, and the inspection input value output unit 23, respectively.

  The inspection control unit 21 outputs an inspection control signal 53 corresponding to the value of the deterioration detection signal 51 to the processing device 30. The inspection input value output unit 23 outputs the inspection input value 52 to the processing device 30 according to the value of the deterioration detection signal 51. The inspection expected value output unit 22 outputs the inspection expected value 62 to the comparison unit 24 according to the value of the deterioration detection signal 51. In addition, the processing device 30 outputs an inspection output value 54 obtained by performing a predetermined process on the inspection input value 52 input from the inspection device 20 to the inspection device 20. The comparison unit 24 of the inspection device 20 compares the inspection expected value 62 input from the inspection expected value output unit 22 with the inspection output value 54 input from the processing device 30, and the inspection result corresponding to the comparison result The output 55 is output to the control device 10.

  In the case of this embodiment, the inspection control unit 21, the inspection expected value output unit 22, and the inspection input value output unit 23, for example, have detected correlation deterioration if the value of the deterioration detection signal 51 is “1” or more. It is determined that the processing device 30 needs to be inspected. Then, the inspection control unit 21 outputs an inspection control signal 53 including a control signal instructing the start of the inspection to the processing device 30, and the inspection input value output unit 23 outputs the inspection input value 52 to the processing device 30. The expected value output unit 22 outputs the inspection expected value 62 to the comparison unit 24.

  Here, it is assumed that the processing performed by the processing device 30 is addition, for example. In this case, when the test input value output unit 23 outputs, for example, a combination of numerical values “1” and “2” as the test input value 52, the test expected value 62 output by the test expected value output unit 22 is The answer to the combination is “3”.

  In this case, if the processing device 30 is operating normally (if the processing device 30 has not yet deteriorated), the processing device 30 outputs an inspection output value 54 of “3” to the inspection device 20. . In this case, the comparison unit 24 compares “3” of the inspection output value 54 input from the processing device 30 with “3” of the inspection expected value 62, determines that both match, An inspection result output 55 indicating that the output value 54 matches the expected inspection value 62 is output to the control device 10. In other words, the inspection result output 55 in this case indicates that the processing apparatus 30 has not actually deteriorated yet.

  On the other hand, if the processing device 30 is not operating normally (if the processing device 30 has already deteriorated), the processing device 30 inspects an inspection output value 54 (for example, “4”) different from “3”. Output to the device 20. The comparison unit 24 compares “4” of the inspection output value 54 input from the processing device 30 with “3” of the expected inspection value 62, determines that both are inconsistent, and the inspection output value 54 An inspection result output 55 indicating that the expected inspection value 62 does not match is output to the control device 10. In other words, the inspection result output 55 in this case indicates that the processing device 30 is actually deteriorated.

  When the inspection result output 55 indicating that the inspection output value 54 matches the inspection expected value 62 is input, the control device 10 indicates that the processing device 30 has not actually deteriorated yet. When the inspection result output 55 is input), it is determined that the processing device 30 has not actually deteriorated, and a control signal 63 for instructing the resumption of normal processing is output to the processing device 30.

  On the other hand, when the inspection result output 55 indicating that the inspection output value 54 and the inspection expected value 62 are inconsistent is input (the inspection result output 55 indicating that the processing device 30 is actually deteriorated is input). If it is determined that the processing device 30 has actually deteriorated, a control signal 63 for instructing the processing device 30 to stop the normal processing (not a temporary stop but a complete stop) is sent to the processing device 30. Output.

  Thus, the inspection apparatus 20 and the control apparatus 10 inspect the processing apparatus 30 based on the comparison between the output value (inspection output value 54) from the processing apparatus 30 in the inspection state and the inspection expected value 62. .

  Next, the operation of the deterioration diagnosis apparatus 100 will be described with reference to the flowcharts of FIGS.

  As shown in FIG. 8, the deterioration diagnosis device 100 normally performs normal processing (step S1) and determination processing whether or not deterioration (correlation deterioration) correlated with the deterioration of the processing device 30 is detected (step S2). ) And repeatedly.

  In the normal process (step S1), the processing device 30 performs a predetermined process on the process input 56 and outputs the process result as a process output 57.

  The degradation detection device 40 and the inspection device 20 perform a correlation degradation monitoring process during the normal process (step S1). That is, the deterioration detection device 40 generates a digital value as described above, and outputs the digital value as the deterioration detection signal 51 to the inspection device 20. Further, the inspection control unit 21, the inspection expected value output unit 22, and the inspection input value output unit 23 of the inspection apparatus 20 monitor the value of the deterioration detection signal 51 (for example, monitoring whether it is “1” or more). Do each.

  As described above, in step S1, correlation degradation is detected (monitored) in parallel with the processing device 30 performing normal processing.

  As long as deterioration of the processing device 30 is not detected in step S1 (specifically, unless the deterioration detection signal 51 has a value equal to or greater than “1”) (N in step S2), step S1 and step S2 Repeat.

  When the correlation deterioration is detected (specifically, when the deterioration detection signal 51 has a value of “1” or more) (Y in step S2), the process proceeds to step S3 for inspecting the processing device 30. .

  In the inspection process of step S3 of FIG. 8, the inspection control unit 21 first performs a normal process saving process (a temporary stop process of the normal process) as shown in FIG. That is, the inspection control unit 21 outputs a control signal instructing the processing device 30 to start inspection (step S4).

  Further, the expected test value output unit 22 outputs the expected test value 62 to the comparison unit 24, and the test input value output unit 23 outputs the test input value 52 to the processing device 30 (step S6). When the processing device 30 receives the inspection control signal 53 from the inspection control unit 21, the processing device 30 temporarily stops the processing for the processing input 56, while performing the processing for the inspection input value 52. Then, the processing device 30 outputs the processing result obtained by the processing on the inspection input value 52 to the inspection device 20 as the inspection output value 54 (step S7). Then, the comparison unit 24 of the inspection device 20 determines whether or not the inspection output value 54 input from the processing device 30 matches the inspection expected value 62 input from the inspection expected value output unit 22 ( In step S8), an inspection result output 55 indicating the determination result is output to the control device 10. That is, when the inspection output value 54 matches the inspection expected value 62 (Y in step S8), this is indicated (in other words, the processing device 30 has not yet deteriorated). When the inspection output value 54 and the inspection expected value 62 do not match (N in step S8), an inspection result output 55 indicating that (in other words, indicating that the processing device 30 has deteriorated) is displayed. Output to the control device 10.

  When the inspection result output 55 indicating that the inspection output value 54 matches the expected inspection value 62 is input, the control device 10 sends a control signal 63 for instructing the resumption of normal processing to the processing device 30. The data is output (step S9). When the control signal 63 instructing resumption of normal processing is input from the control device 10, the processing device 30 performs processing on the processing input 56 input to the processing device 30 and performs processing as a result of the processing. The state where the output 57 is output is restored. In addition, the degradation detection device 40 and the inspection device 20 continue to perform degradation monitoring processing correlated with the degradation of the processing device 30. That is, the process proceeds to step S1 in FIG.

  Further, when the inspection result output 55 indicating that the inspection output value 54 and the inspection expected value 62 do not coincide with each other is input, the control device 10 sends a control signal 63 for instructing to stop the normal processing to the processing device. 30 (step S10). The processing device 30 stops the normal processing when the control signal 63 instructing the stop of the normal processing is input from the control device 10. That is, since it has already stopped temporarily, the state is maintained.

  The deterioration diagnosis device 100 performs such a series of operations as a deterioration diagnosis operation of the processing device 30.

  According to the first embodiment as described above, the inspection apparatus 20 and the control apparatus 10 as inspection means for inspecting the processing apparatus 30 to be inspected, and the correlation deterioration that is a deterioration correlated with the deterioration of the processing apparatus 30. A deterioration detecting device 40 as a deterioration detecting means for detecting the deterioration, and the inspection means inspects the processing device 30 when correlation deterioration is detected by the deterioration detecting device 40. Can be done at the timing. In other words, online degradation diagnosis for diagnosing the processing device 30 including the semiconductor integrated circuit during normal processing can be performed at an appropriate timing. Thereby, even if there is a difference between individual processing devices 30 or a failure occurrence rate due to the use environment, the inspection can be performed at appropriate timing.

  Further, the deterioration detection device 40 includes a deterioration circuit 43 that deteriorates with time to the same degree as or more than that of the processing device 30, a deterioration resistance circuit 42 that does not substantially deteriorate with time, and a deterioration determination circuit 44. 44 detects the correlation deterioration based on the difference between the deterioration amounts of the deterioration-resistant circuit 42 and the deterioration circuit 43, so that the correlation deterioration can be detected appropriately.

  Further, the deterioration detection device 40 includes an oscillation circuit 41 that inputs the same pulse signal to the deterioration resistance circuit 42 and the deterioration circuit 43, and the deterioration resistance circuit 42 outputs a deterioration resistance circuit output 59 based on the pulse signal. The deterioration circuit 43 outputs the deterioration circuit output 60 based on the pulse signal, and the deterioration determination circuit 44 detects the correlation deterioration based on the difference between the deterioration resistance circuit output 59 and the deterioration circuit output 60. Deterioration can be detected easily and reliably. In this way, by using the signal from the oscillation circuit 41 (oscillation circuit output 58) as a common input for the deterioration-resistant circuit 42 and the deterioration circuit 43, the determination criterion can be made common and the determination becomes easy.

  Further, the deterioration detection device 40 includes a phase comparison circuit 45 and a time / digital conversion circuit 46. The phase comparison circuit 45 corresponds to the phase difference between the deterioration resistance circuit output 59 and the deterioration circuit output 60. The time / digital conversion circuit 46 outputs a digital signal having a value corresponding to the pulse width of the pulse output from the phase comparison circuit 45 as a correlation deterioration detection signal (deterioration detection signal 51). Therefore, the deterioration detection signal 51 can be appropriately generated and output.

  Further, the deterioration-resistant circuit 42 is operated under the same operating conditions as the processing device 30, and the deterioration circuit 43 is operated under the operating conditions in which the deterioration proceeds more than the deterioration-resistant circuit 42, so that the deterioration amount of the deterioration circuit 43 can be reduced. The deterioration amount of the circuit to be inspected 30 can be made larger, and the deterioration circuit 43 can be deteriorated slightly faster than the processing device 30. Accordingly, it is possible to detect the deterioration of the processing device 30 before the processing device 30 actually deteriorates.

  Further, the withstand voltage of at least one of the electric devices (for example, the PMOS transistor 66 and the NMOS transistor 67) constituting the deterioration circuit 43 is the same as that of the electric device (for example, the PMOS transistor 64 and the NMOS transistor) constituting the deterioration resistance circuit 42 65) and the breakdown voltage of the electric device constituting the processing apparatus 30 is set lower than that, the deterioration circuit 43 can be deteriorated faster than the deterioration resistance circuit 42 and the processing apparatus 30, and the deterioration of the processing apparatus 30 can be prevented. Will be able to be detected.

[Second Embodiment]
FIG. 10 is a block diagram showing the configuration of the degradation diagnosis apparatus 200 according to the second embodiment, FIG. 11 is a block diagram showing the configuration of the degradation detection apparatus 40 included in the degradation diagnosis apparatus 200, and FIG. 12 is the case of this embodiment. FIG. 13 is a block diagram showing a configuration of the inspection apparatus 20 provided in the deterioration diagnosis apparatus 200, and FIG. 14 is an inspection process in this embodiment (step S3 in FIG. 8). It is a flowchart which shows the flow of the process in).

  The deterioration diagnosis apparatus 200 according to the present embodiment is different from the first embodiment in that it detects the level of correlation deterioration and performs different inspections according to the detected level of correlation deterioration. Then, it is the same as that of the degradation diagnostic apparatus 100 which concerns on the above-mentioned 1st Embodiment.

  As shown in FIG. 10, in the case of the present embodiment, the deterioration detection device 40 uses the inspection device 20 for the deterioration level detection signal 1 indicating the level of correlation deterioration instead of the deterioration detection signal 51 (FIG. 1) indicating the presence or absence of correlation deterioration. Output for. That is, as shown in FIG. 11, the deterioration detection device 40 includes a deterioration level determination circuit 2 instead of the deterioration determination circuit 44 (FIG. 2), and this deterioration level determination circuit 2 is shown in FIGS. The deterioration level detection signal 1 is output.

  In the case of this embodiment, specifically, for example, the deterioration level determination circuit 2 can have the same configuration as the deterioration determination circuit 44 (FIG. 2), and the deterioration level detection signal 1 is also the deterioration detection signal 51 ( The same signal as in FIG.

  That is, in the case of this embodiment, the deterioration detection device 40 detects the deterioration amount of the deterioration circuit 43 that deteriorates in correlation with the processing device 30, and outputs the detected deterioration amount as the deterioration level detection signal 1.

  For example, as shown in FIG. 12, when the value of the deterioration level detection signal 1 is “0”, it indicates that no correlation deterioration is detected. Further, when the value of the deterioration level detection signal 1 is “1” or more, it indicates that the correlation deterioration is detected. Among these, when the value of the degradation level detection signal 1 is “1”, it indicates that the level of correlation degradation is the first level, and when the value of the degradation level detection signal 1 is “2”, the correlation When the deterioration level is the second level, and the value of the deterioration level detection signal 1 is “3” (not shown), it indicates that the correlation deterioration level is the third level. In this embodiment, for example, an example in which the deterioration level is detected in three levels as described above will be described. However, the number of deterioration levels may be two, or may be four or more. good.

  In the present embodiment, the inspection apparatus 20 performs different types of inspections according to the level of correlation deterioration.

  When the value of the deterioration level detection signal 1 is “1” or more, the inspection device 20 determines that the processing device 30 has deteriorated for convenience, and inspects the processing device 30.

  That is, in the present embodiment, the deterioration level detection signal 1 from the deterioration detection device 40 is input to the inspection control unit 21, the inspection expected value output unit 22, and the inspection input value output unit 23, respectively. For example, if the value of the degradation level detection signal 1 is “1” or more, the inspection control unit 21, the inspection expected value output unit 22, and the inspection input value output unit 23 determine that the processing device 30 needs to be inspected. . Then, the inspection control unit 21 outputs an inspection control signal 53 including a control signal instructing the start of the inspection to the processing device 30. Further, the inspection input value output unit 23 outputs the inspection input value 52 corresponding to the level of the correlation deterioration (corresponding to the value of the deterioration level detection signal 1) to the processing device 30, and the inspection expected value output unit 22 is correlated deterioration. The inspection expected value 62 corresponding to the level of (in accordance with the value of the deterioration level detection signal 1) is output to the comparison unit 24.

  Here, the inspection according to the level of correlation deterioration includes, for example, increasing the number of processes to be performed by the processing device 30 as the level of correlation deterioration is higher. Specifically, for example, when the processing by the processing device 30 is an operation as described above, the number of numerical combinations to be output as the inspection input value 52 and the number of numerical values to be output as the inspection expected value 62 are as follows: The higher the level of correlation degradation, the better. Specifically, for example, when the correlation degradation is at the first level, a set of numerical values (for example, a combination of “1” and “2”) is output as the inspection input value 52, and the inspection expected value 62 is output. As a single numerical value (for example, “3” as an answer to the combination of “1” and “2”). When the correlation deterioration is at the second level, for example, two sets of numerical values (for example, a combination of “1” and “2” and a combination of “2” and “3”) are used as the inspection input value 52. And two numerical values (for example, “3” and “5”) are output as the expected inspection value 62. Similarly, when the correlation deterioration is at the third level, for example, three numerical combinations are output as the inspection input value 52, and three numerical values are output as the inspection expected value 62. In this way, by changing the number of processes to be performed by the processing device 30 according to the level of correlation deterioration, the processing device 30 can be inspected with different accuracy according to the level of correlation deterioration. This is because, for example, deterioration that cannot be detected simply by performing an operation on a combination of numerical values can be detected by performing an operation on a combination of two numerical values, or two numerical values can be detected. This is because deterioration that cannot be detected simply by performing an operation on a combination of the two can be detected by performing an operation on a combination of three numerical values.

  In addition, when the processing device 30 performs a plurality of processes, it is preferable to instruct the processing device 30 to sequentially perform the plurality of processes at an appropriate timing. In other words, when the inspection includes a plurality of steps, it is preferable that the inspection control signal 53 includes a control signal for causing the inspection step to proceed to the next step. Thus, in the case of this embodiment, it is preferable to output the inspection control signal 53 corresponding to the level of correlation deterioration (corresponding to the value of the deterioration level detection signal 1).

  For example, the processing device 30 sequentially processes the combination of numerical values included in the inspection input value 52 and outputs the processing result to the inspection device 20 as the inspection output value 54.

  When the inspection output values 54 input from the processing device 30 and the inspection expected values 62 input from the inspection expected value output unit 22 all match, the comparison unit 24 checks the inspection output value 54. And the inspection expected value 62 are all matched (in other words, the processing device 30 has not yet deteriorated), and the inspection result output 55 is output to the control device 10.

  Further, the comparison unit 24 does not match at least one of the inspection output values 54 input from the processing device 30 and the inspection expected values 62 input from the inspection expected value output unit 22. If it becomes, an inspection result output 55 indicating that (in other words indicating that the processing device 30 has deteriorated) is output to the control device 10.

  Thus, in this embodiment, the inspection apparatus 20 compares the output value from the processing apparatus 30 in the inspection state with the inspection expected value 62 corresponding to the inspection input value 52 input according to the level of correlation deterioration. Based on the above, the processing device 30 is inspected.

  Next, the operation of the deterioration diagnosis apparatus 200 will be described with reference to the flowcharts of FIGS.

  Also in the present embodiment, the degradation diagnosis apparatus 200 performs the operation shown in FIG. 8 in the same manner as in the first embodiment. When correlation deterioration is detected (specifically, when the deterioration level detection signal 1 has a value of “1” or more) (Y in step S2 in FIG. 8), the processing device 30 is inspected. The process proceeds to step S3.

  In the inspection process in step S3 of FIG. 8, as shown in FIG. 14, the inspection control unit 21 first performs a normal process saving process (a temporary stop process of the normal process) as in the first embodiment. (Step S4).

  Subsequently, the inspection apparatus 20 determines the level of correlation deterioration. That is, each of the inspection control unit 21, the inspection expected value output unit 22, and the inspection input value output unit 23 determines whether the correlation deterioration level is the first to third levels (step S5).

  When the level of correlation deterioration is the first level (“1” in step S5), the inspection input value output unit 23 outputs the inspection input value 52 of the first level to the processing device 30. Specifically, for example, a combination of numerical values (for example, a combination of “1” and “2”) is output (step S6-1). In addition, the expected test value output unit 22 outputs the first level expected test value 62 to the comparison unit 24. Specifically, for example, an operation answer (for example, “3”) for one combination of numerical values is output. Further, the inspection control unit 21 outputs a first level inspection control signal 53 to the processing device 30. Specifically, for example, only the control signal that instructs the start of the inspection is output.

  When the correlation deterioration level is the second level (“2” in step S5), the inspection input value output unit 23 outputs the second level inspection input value 52 to the processing device 30. Specifically, for example, two combinations of numerical values (for example, a combination of “1” and “2” and a combination of “2” and “3”) are output (step S6-2). In addition, the expected test value output unit 22 outputs the second level expected test value 62 to the comparison unit 24. Specifically, for example, the answer to the calculation for the combination of two numerical values (for example, “3” and “5”) is output. Further, the inspection control unit 21 outputs a second level inspection control signal 53 to the processing device 30. Specifically, for example, a control signal for instructing the start of inspection and a control signal for causing the inspection step to proceed to the next step are output. Here, the control signal for causing the inspection step to proceed to the next step is, for example, from the first step to the second step for calculating the inspection step for the first combination (for example, the combination of “1” and “2”). It is a signal that causes the process to switch to the second step for performing the calculation for the first combination (for example, the combination of “2” and “3”) to be performed after a predetermined timing from the input timing of the inspection control signal 53. .

  Similarly, when the level of correlation deterioration is the third level (“3” in step S5), the test input value output unit 23 outputs the third level test input value 52 to the processing device 30 (step S6-). 3). Further, the expected test value output unit 22 outputs the third level expected test value 62 to the comparison unit 24. Further, the inspection control unit 21 outputs a third level inspection control signal 53 to the processing device 30. Specifically, for example, a control signal for instructing the start of inspection and a control signal for causing the inspection step to proceed to the next step are output.

  When the processing device 30 receives the inspection control signal 53 from the inspection control unit 21, the processing device 30 temporarily stops the processing for the processing input 56, while performing the processing for the inspection input value 52. Then, the processing device 30 sequentially outputs the processing results obtained by the processing on the numerical values of the combinations included in the inspection input value 52 as the inspection output value 54 to the inspection device 20 (step S7). Then, the comparison unit 24 of the inspection device 20 matches each of the inspection output values 54 sequentially input from the processing device 30 with each of the inspection expected values 62 input from the inspection expected value output unit 22. (Step S8), an inspection result output 55 indicating the determination result is output to the control device 10. That is, the comparison unit 24 indicates that the processing device 30 has not yet deteriorated when the inspection output value 54 input from the processing device 30 and the inspection expected value 62 from the inspection expected value output unit 22 all match. Is output to the control device 10. On the other hand, if at least one of the inspection output value 54 and the inspection expected value 62 does not match, an inspection result output 55 indicating that the processing device 30 has deteriorated is output to the control device 10. .

  When the inspection result output 55 indicating that the inspection output value 54 matches the expected inspection value 62 is input, the control device 10 sends a control signal 63 for instructing the resumption of normal processing to the processing device 30. The data is output (step S9). When the control signal 63 for instructing resumption of normal processing is input from the inspection device 20, the processing device 30 performs processing on the processing input 56 input to the processing device 30 and performs processing as the processing result. The state where the output 57 is output is restored. In addition, the degradation detection device 40 and the inspection device 20 continue to perform degradation monitoring processing correlated with the degradation of the processing device 30. That is, the process proceeds to step S1 in FIG.

  Further, when the inspection result output 55 indicating that the inspection output value 54 and the inspection expected value 62 do not coincide with each other is input, the control device 10 sends a control signal 63 for instructing to stop the normal processing to the processing device. 30 (step S10). The processing device 30 stops the normal processing when the control signal 63 instructing the stop of the normal processing is input from the inspection device 20.

  According to the second embodiment as described above, the following effects are obtained in addition to the effects obtained by the first embodiment.

  First, the deterioration detection device 40 detects the level of correlation deterioration, and the inspection device 20 performs different inspections according to the level of correlation deterioration detected by the deterioration detection device 40. Therefore, according to the level of correlation deterioration. Inspection with high accuracy. Specifically, for example, when the degree of deterioration is light (for example, in the case of the first level), the inspection input value 52 with a small number of processes by the processing device 30 is output, and when the degree of deterioration is heavy (for example, the first level) In the case of the second and third levels), the inspection input value 52 having a large number of processes by the processing device 30 is output, so that the inspection with appropriate accuracy according to the level of correlation deterioration can be performed.

  Further, the deterioration detection device 40 includes a deterioration circuit 43 that deteriorates with time to the same degree as or more than that of the processing device 30, a deterioration resistance circuit 42 that does not substantially deteriorate with time, and a deterioration level determination circuit 2. Since the determination circuit 2 detects the level of correlation deterioration based on the difference in deterioration amount between the deterioration resistance circuit 42 and the deterioration circuit 43, the level of correlation deterioration can be detected appropriately.

  Further, the deterioration detection device 40 includes an oscillation circuit 41 that inputs the same pulse signal to the deterioration resistance circuit 42 and the deterioration circuit 43, and the deterioration resistance circuit 42 outputs a deterioration resistance circuit output 59 based on the pulse signal. The degradation circuit 43 outputs a degradation circuit output 60 based on this pulse signal, and the degradation level determination circuit 2 determines the level of correlation degradation based on the difference in degradation amount between the degradation resistance circuit output 59 and the degradation circuit output 60. Therefore, the level of correlation deterioration can be detected easily and reliably.

  Further, the deterioration detection device 40 includes a phase comparison circuit 45 and a time / digital conversion circuit 46. The phase comparison circuit 45 corresponds to the phase difference between the deterioration resistance circuit output 59 and the deterioration circuit output 60. The time / digital conversion circuit 46 outputs a digital signal having a value corresponding to the pulse width of the pulse output from the phase comparison circuit 45 as a correlation degradation level detection signal (degradation level detection signal 1). ), The deterioration level detection signal 1 can be appropriately generated and output.

[Third Embodiment]
FIG. 15 is a block diagram showing the configuration of the deterioration diagnosis apparatus 300 according to the third embodiment, and FIG. 16 is a flowchart showing the flow of processing in the inspection processing (step S3 in FIG. 8) in the case of this embodiment.

  The present embodiment is different from the second embodiment only in the points described below, and the other points are the same as those of the second embodiment.

  In the deterioration diagnosis device 300 according to the present embodiment, when it is determined that the processing device 30 has deteriorated (N in Step S8), the normal processing is not immediately stopped (Step S10), but the operation of the processing device 30 is performed. The condition is relaxed and a re-inspection command is output to the inspection apparatus 20 (step S12), and in a state where the operation condition is relaxed, it is determined whether or not the processing apparatus 30 operates normally (step S8). . If the processing device 30 operates normally by relaxing the operating conditions of the processing device 30 (Y in step S8), the normal processing is resumed and the processing device 30 operates normally even if the operating conditions are relaxed to the lower limit. If not (N in Step S11), the normal process is stopped (Step S10).

  As shown in FIG. 15, the control device 10 of the deterioration diagnosis device 300 according to the present embodiment is a case where it is determined that the processing device 30 has deteriorated, and the operating conditions of the processing device 30 can be relaxed. In this case, operation condition relaxation command signals 3 and 4 for commanding relaxation of operation conditions are output to the deterioration detection device 40 and the processing device 30, respectively, and a re-inspection of the processing device 30 is instructed to the inspection device 20. The re-inspection command signal 5 is output.

  Here, the operating conditions include, for example, voltage, frequency, temperature, and the like. In addition, relaxation of operating conditions includes, for example, lowering voltage, lowering frequency, lowering temperature, and the like.

  In addition, the operation condition may be relaxed only once (one step), or may be performed a plurality of times (multiple steps).

  Hereinafter, the operation will be described in detail.

  The flowchart of FIG. 16 is different from the flowchart of FIG. 14 only in that step S11 and step S12 are added, and the other points are the same as those in FIG.

  As shown in FIG. 16, in the case of the present embodiment, the control device 10 does not immediately stop the normal processing (step S10) when it is determined that the processing device 30 has deteriorated (N in step S8). First, it is determined whether or not the operating conditions of the processing device 30 can be relaxed (step S11). The determination of whether or not the operating condition can be relaxed is performed based on whether or not the operating condition is relaxed to a predetermined lower limit value, for example.

  If the operating condition can be relaxed, in other words, for example, if the operating condition has not yet been relaxed to the predetermined lower limit (Y in step S11), the control device 10 instructs the operating condition to be relaxed. The relaxation command signals 3 and 4 are output to the deterioration detection device 40 and the processing device 30, respectively. On the other hand, for the inspection device 20, the control device 10 outputs a re-inspection command signal 5 for instructing the re-inspection of the processing device 30 (step S12).

  When the operating condition relaxation command signal 4 is input, the processing device 30 relaxes the operating condition of the processing device 30 by one level. That is, for example, the operating voltage of the processing device 30 is reduced. Similarly, when the operation condition relaxation command signal 3 is input, the deterioration detection device 40 relaxes the operation conditions of the deterioration resistance circuit 42 and the deterioration circuit 43 of the deterioration detection device 40 by one level.

  When the operating condition is relaxed, the deterioration detection device 40 outputs a deterioration detection signal 51 in that state to the inspection device 20.

  When the reinspection command signal 5 is input, the inspection device 20 performs the processing from step S5 in the same manner as in the second embodiment. That is, in the next step S7, the processing device 30 is inspected with the operating conditions relaxed, and in step S8 following the step S7, the processing device 30 inspected with the operating conditions relaxed. It is determined whether or not the output value 54 matches the expected inspection value 62.

  When the processing device 30 operates normally in the state where the operating condition is relaxed (Y in step S8), the return processing of the normal process (step S9) is performed while the operating condition is maintained in the relaxed state.

  Further, when the processing device 30 does not operate normally even when the operating conditions are relaxed (N in step S8), it is determined whether or not the operating conditions can be further relaxed (step S11). That is, if the operating conditions have not yet been relaxed up to the predetermined lower limit (Y in step S11), the operating conditions are further relaxed by one step and a re-inspection is instructed (step S12), and the processing from step S5 is performed again Do.

  Thereafter, if the processing device 30 does not operate normally even when the operating conditions are relaxed to the lower limit (when N is determined in step S8), N is also determined in the subsequent step S11, and normal processing is stopped (step S10).

  According to the third embodiment as described above, when the control device 10 determines that the processing device 30 has deteriorated as a result of the inspection, in the state where the operating conditions of the processing device 30 are relaxed, When the inspection apparatus 20 is again inspected for the processing apparatus 30 and it is determined that the processing apparatus 30 has not deteriorated in this second inspection, the operating condition is maintained in a relaxed state. When the appearance of deterioration is reduced by the relaxation, the normal processing can be continued with the operating conditions relaxed, and the life of the processing apparatus 30 can be extended.

[Fourth Embodiment]
FIG. 17 is a block diagram illustrating a configuration of the inspection apparatus 20 included in the deterioration diagnosis apparatus according to the fourth embodiment.

  In the case of the present embodiment, not only the processing device 30 is inspected when correlation deterioration is detected, but also the processing device 30 is inspected at predetermined intervals (predetermined time intervals) using a timer. The other points are the same as in the second embodiment.

  As shown in FIG. 17, the deterioration diagnosis apparatus inspection device 20 according to this embodiment includes a timer 14. The timer 14 is initialized (reset) in response to a command from the inspection control unit 21. When the timer 14 is initialized, it starts time measurement and outputs the measurement time to the inspection control unit 21.

  The inspection control unit 21 inspects the processing device 30 when the measurement time of the timer 14 reaches a predetermined time. That is, when the measurement time reaches a predetermined time, the inspection control unit 21 outputs an inspection control signal 53 that instructs the start of the inspection to the processing device 30. At the same time, a command for outputting the expected inspection value 62 to the comparison unit 24 is output to the expected inspection value output unit 22, and an inspection input value 52 is output to the processing device 30 for the inspection input value output unit 23. Each command to be output is output.

  According to the fourth embodiment, the inspection device 20 of the deterioration diagnosis device includes the timer 14, and the processing device 30 is inspected every time a predetermined time is counted by the timer 14, so that only the detection of the correlation deterioration is triggered. Instead, the processing device 30 can be inspected as a trigger when a predetermined time elapses.

[Fifth Embodiment]
FIG. 18 is a block diagram showing the configuration of the inspection apparatus 20 included in the deterioration diagnosis apparatus according to the fifth embodiment, FIG. 19 is a flowchart showing the flow of processing by the deterioration diagnosis apparatus according to the fifth embodiment, and FIG. FIG. 21 is a flowchart showing the flow of processing in the inspection process (step S15) using the deterioration timer of FIG. 19, and FIG. 21 is a flowchart showing the flow of processing in the inspection process with initialization of deterioration timer 19 (step S13).

  The present embodiment is different from the second embodiment only in the points described below, and the other points are the same as those of the second embodiment.

  As illustrated in FIG. 18, the inspection device 20 of the deterioration diagnosis apparatus according to the present embodiment includes, for example, individual timers for each level of correlation deterioration (for example, first to third levels). That is, the first deterioration timer 11 corresponds to the first level, the second deterioration timer 12 corresponds to the second level, and the third deterioration timer 13 corresponds to the third level.

  Each of the deterioration timers 11 to 13 is initialized (reset) in response to a command from the inspection control unit 21. When each of the timers 11 to 13 is initialized, it starts time measurement and outputs the measurement time to the inspection control unit 21.

  The inspection control unit 21 monitors a predetermined time for each of the deterioration timers 11 to 13. That is, for example, the measurement time is 3 hours for the first deterioration timer 11, the measurement time is 2 hours for the second deterioration timer 12, and the measurement time is 1 hour for the third deterioration timer 13. Each of them will be monitored.

  When the predetermined time (for example, 3 hours) is counted by the first deterioration timer 11 corresponding to the first level, the inspection control unit 21 performs the same inspection as when the correlation deterioration is determined to be the first level. I do. Similarly, when a predetermined time (for example, 2 hours) is timed by the second deterioration timer 12 corresponding to the second level, the same inspection as when the correlation deterioration is determined to be the second level is performed. When a predetermined time (for example, 1 hour) is counted by the third deterioration timer 13 corresponding to the three levels, the same inspection as that performed when the correlation deterioration is determined to be the third level is performed.

  The operation will be described below.

  In FIG. 19, step S1 and step S2 are the same as those in the second embodiment.

  In the case of Y in step S2, inspection processing with deterioration timer initialization is performed (step S13). In the inspection process with deterioration timer initialization (step S13), the process of FIG. 20 is performed.

  The inspection process with initialization of the deterioration timer in FIG. 20 is an initialization process (step S16) of the first to third deterioration timers 11 to 13, as compared with the inspection process in the case of the second embodiment (FIG. 14). -1, S16-2, and S16-3) are different only in that they are added, and the other points are the same as the inspection processing in the second embodiment.

  That is, the initialization process (step S16-1) of the first deterioration timer 11 corresponding to the first level is inserted between step S6-1 and step S7. In this initialization process, the inspection control unit 21 initializes the first deterioration timer 11. Similarly, an initialization process (step S16-2) of the second deterioration timer 12 corresponding to the second level is inserted between step S6-2 and step S7. In this initialization process, the inspection control unit 21 initializes the second deterioration timer 12. Similarly, an initialization process (step S16-3) of the third deterioration timer 13 corresponding to the third level is inserted between step S6-3 and step S7. In this initialization process, the inspection control unit 21 initializes the third deterioration timer 13.

  In the inspection process with initialization of the deterioration timer in FIG. 20, when the result is Y in step S8 and the process returns to the normal process, the process from step S1 in FIG. 19 is performed again.

  Further, in the case of N in step S2 of FIG. 19, the inspection control unit 21 determines whether any one of the deterioration timers 11 to 13 has counted a predetermined time (arrival of a predetermined period) (step S14).

  When any one of the deterioration timers 11 to 13 measures a predetermined time (Y in Step S14), an inspection process using the deterioration timer is performed (Step S15). In the inspection process (step S15) by the deterioration timer, the process of FIG. 21 is performed.

  The inspection process by the deterioration timer in FIG. 21 is the same as the inspection process in the second embodiment in that it includes step S17 instead of step S5 in the inspection process (FIG. 14) in the second embodiment. The other points are the same as the inspection processing in the second embodiment.

  That is, in the inspection process by the deterioration timer of FIG. 21, as in the second embodiment, after performing step S <b> 4, the inspection control unit 21 determines that the deterioration timers of the deterioration timers 11 to 13 measure the predetermined time. Which one is determined (step S17).

  If the deterioration timer that has timed the predetermined time is the first deterioration timer 11 (“1” in step S17), the inspection control unit 21 notifies the inspection input value output unit 23 and the inspection expected value output unit 22 to that effect. To notify. Subsequently, the same inspection as when the correlation deterioration is at the first level is performed (steps S6-1 to S7).

  Similarly, when the deterioration timer that has timed the predetermined time is the second deterioration timer 12 (“2” in step S17), the inspection control unit 21 informs that fact by the inspection input value output unit 23 and the inspection expected value. The output unit 22 is notified. Subsequently, the same inspection as when the correlation deterioration is at the second level is performed (steps S6-2 to S7).

  Similarly, when the deterioration timer that has timed the predetermined time is the third deterioration timer 13 (“3” in step S17), the inspection control unit 21 notifies the inspection input value output unit 23 and the inspection expected value. The output unit 22 is notified. Subsequently, the same inspection as when the correlation deterioration is at the third level is performed (steps S6-3 to S7).

  In the inspection process by the deterioration timer in FIG. 21, when the result is Y in step S8 and the process returns to the normal process, the process from step S1 in FIG. 19 is performed again.

  In the case of N in step S14 in FIG. 19, the processing from step S1 is performed again.

  According to the fifth embodiment as described above, the inspection apparatus 20 includes the individual timers 11 to 13 for each level of correlation deterioration, and each time a predetermined time is counted by the timers 11 to 13. Since the processing device 30 is inspected, not only the detection of the correlation deterioration is used as a trigger for each level of the correlation deterioration, but also the inspection can be started with the elapse of a predetermined time as a trigger.

  Further, when the inspection is performed based on the detection of the correlation deterioration, the timers 11 to 13 corresponding to the detected correlation deterioration level among the timers 11 to 13 are initialized. Can be adjusted so that it is not higher than necessary.

  In the present embodiment, the example in which the level of correlation degradation is three and the number of timers 11 to 13 is three has been described, but the number of levels of correlation degradation and the number of timers are two or There may be four or more.

[Sixth Embodiment]
FIG. 22 is a flowchart showing the flow of processing by the deterioration diagnosis apparatus according to the sixth embodiment, and is a flowchart showing the flow of processing in the inspection process with initialization of deterioration timer (step S13) in FIG.

  The deterioration diagnosis apparatus according to this embodiment is configured in the same manner as the deterioration diagnosis apparatus 300 (FIG. 15) according to the third embodiment, and the inspection apparatus 20 is the fifth embodiment (FIG. 18). It is configured in the same way.

  As shown in FIG. 22, the deterioration diagnosis apparatus according to the present embodiment performs the same processing as in the fifth embodiment until step S8 in the inspection process with initialization of deterioration timer (step S13 in FIG. 19). .

  However, in the case of this embodiment, when it is determined that the processing device 30 has deteriorated (N in Step S8), the processing from Step S5 through Step S11 and Step S12 is performed as in the third embodiment. The processing of step S11 and step S10 is performed.

  That is, when it is determined that the processing device 30 has deteriorated (N in step S8), the normal processing is not immediately stopped (step S10), but the operating conditions of the processing device 30 are relaxed and the inspection device 20 is not affected. Then, a re-inspection command is output (step S12), and in a state where the operating conditions are relaxed, it is determined whether or not the processing device 30 operates normally (step S8). If the processing device 30 operates normally by relaxing the operating conditions of the processing device 30 (Y in step S8), the normal processing is resumed and the processing device 30 operates normally even if the operating conditions are relaxed to the lower limit. If not (N in Step S11), the normal process is stopped (Step S10).

  According to the sixth embodiment as described above, an effect obtained by combining the effect obtained by the third embodiment and the effect obtained by the fifth embodiment can be obtained.

[Seventh Embodiment]
FIG. 23 is a flowchart showing a flow of processing by the deterioration diagnosis apparatus according to the seventh embodiment, and is a flowchart showing a flow of processing in the inspection processing (step S15) by the deterioration timer of FIG.

  The deterioration diagnosis apparatus according to the present embodiment is configured in the same manner as the deterioration diagnosis apparatus according to the sixth embodiment.

  As shown in FIG. 23, the deterioration diagnosis apparatus according to the present embodiment performs the same processing as in the fifth and sixth embodiments up to step S8 in the inspection process (step S15 in FIG. 19) using the deterioration timer. Do.

  However, in the case of this embodiment, when it is determined that the processing device 30 has deteriorated (N in Step S8), the processing from Step S17 is performed through the processing of Step S11 and Step S12, as in the third embodiment. The processing of step S11 and step S10 is performed.

  That is, when it is determined that the processing device 30 has deteriorated (N in step S8), the normal processing is not immediately stopped (step S10), but the operating conditions of the processing device 30 are relaxed and the inspection device 20 is not affected. Then, a re-inspection command is output (step S12), and in a state where the operating conditions are relaxed, it is determined whether or not the processing device 30 operates normally (step S8). If the processing device 30 operates normally by relaxing the operating conditions of the processing device 30 (Y in step S8), the normal processing is resumed and the processing device 30 operates normally even if the operating conditions are relaxed to the lower limit. If not (N in Step S11), the normal process is stopped (Step S10).

  According to the seventh embodiment as described above, an effect obtained by combining the effect obtained by the fifth or sixth embodiment and the effect obtained by the third embodiment can be obtained.

[Eighth Embodiment]
FIG. 24 is a flowchart showing the flow of processing by the degradation diagnosis apparatus according to the eighth embodiment, FIG. 25 is a flowchart showing the flow of processing in the inspection cycle changing process (step S19) in FIG. 24, and FIG. It is a flowchart which shows the flow of a process by the test | inspection process (step S21) by a timer.

  In the present embodiment, the type of inspection is not changed according to the level of correlation deterioration, but the inspection period (time interval) is changed according to the level of correlation deterioration.

  The deterioration diagnosis apparatus according to the present embodiment is configured in the same manner as the deterioration diagnosis apparatus according to the fourth embodiment. That is, the inspection device 20 includes a timer 14 (FIG. 17).

  The operation will be described below.

  In FIG. 24, first, the inspection control unit 21 initializes the timer 14 (step S18). Subsequently, step S1 and step S2 are performed in the same manner as in the second embodiment.

  When Y is determined in step S2, the inspection cycle changing process (step S19) is performed. In this inspection cycle changing process (step S19), the process of FIG. 25 is performed.

  That is, in the inspection cycle changing process (step S19), first, the deterioration level determination process (step S5) is performed in the same manner as the inspection process (FIG. 14) in the second embodiment.

  When the level of correlation deterioration is the first level (“1” in step S5), the inspection control unit 21 performs a process of changing the inspection period to a first level period (for example, 3 hours) (step S5). S22-1), this inspection cycle changing process is terminated.

  Similarly, when the level of correlation deterioration is the second level (“2” in step S5), the inspection control unit 21 performs a process of changing the inspection period to a second level period (for example, 2 hours). (Step S22-2) When the level of correlation deterioration is the third level (“3” in Step S5), a process of changing the inspection cycle to a third level cycle (for example, 1 hour) is performed (Step S22-2). S22-3), and the inspection cycle changing process ends.

  Subsequent to step S19 or when N is determined in step S2, the process proceeds to step S20. In step S20, the inspection control unit 21 determines whether the measurement time by the timer 14 has reached a predetermined inspection cycle.

  When the measurement time by the timer 14 becomes a predetermined inspection cycle (Y in Step S20), the process proceeds to Step S21, and inspection processing by the timer is performed.

  In step S21, the process of FIG. 26 is performed.

  The process of FIG. 26 is not provided with steps S5, S6-1, S6-2, and S6-3 in comparison with the inspection process (FIG. 14) in the case of the second embodiment described above. It differs from the inspection process (FIG. 14) in the case of 2nd Embodiment only in the point provided with, and other points are the same as this inspection process.

  The processes after step S6 in FIG. 26 are the same as the inspection process (FIG. 9) in the first embodiment, and thus the description thereof is omitted.

  After step S21, the process from step S1 is performed.

  According to the eighth embodiment as described above, the inspection device 20 includes the timer 14, and the processing device 30 is inspected every time a predetermined time is counted by the timer 14, so the fourth embodiment described above. The same effect can be obtained. In addition, since the inspection cycle (the length of the predetermined time measured by the timer 14) is changed according to the correlation deterioration level, the processing device 30 can be inspected at an appropriate time interval according to the correlation deterioration level. it can.

[Ninth Embodiment]
FIG. 27 is a flowchart showing the flow of processing by the deterioration diagnosis apparatus according to the ninth embodiment, and is a flowchart showing the flow of processing in the inspection processing (step S21) by the timer of FIG.

  The deterioration diagnosis apparatus according to the present embodiment is configured in the same manner as the deterioration diagnosis apparatus 300 (FIG. 15) according to the third embodiment, and the inspection apparatus 20 is configured in the same manner as in the eighth embodiment. Has been.

  As shown in FIG. 27, the degradation diagnosis apparatus according to the present embodiment performs the same processing as in the eighth embodiment up to step S8 in the inspection processing by the timer (step S21 in FIG. 24).

  However, in the case of this embodiment, when it is determined that the processing device 30 has deteriorated (N in Step S8), the processing from Step S6 through Step S11 and Step S12 is performed as in the third embodiment. The processing of step S11 and step S10 is performed.

  That is, when it is determined that the processing device 30 has deteriorated (N in step S8), the normal processing is not immediately stopped (step S10), but the operating conditions of the processing device 30 are relaxed and the inspection device 20 is not affected. Then, a re-inspection command is output (step S12), and in a state where the operating conditions are relaxed, it is determined whether or not the processing device 30 operates normally (step S8). If the processing device 30 operates normally by relaxing the operating conditions of the processing device 30 (Y in step S8), the normal processing is resumed and the processing device 30 operates normally even if the operating conditions are relaxed to the lower limit. If not (N in Step S11), the normal process is stopped (Step S10).

  According to the ninth embodiment as described above, an effect obtained by combining the effect obtained by the third embodiment and the effect obtained by the eighth embodiment can be obtained.

[Tenth embodiment]
FIG. 28 is a circuit diagram showing a configuration of the deterioration circuit 43 of the deterioration detection device provided in the deterioration diagnosis device according to the tenth embodiment.

  In each of the above embodiments, for example, as shown in FIG. 4, the withstand voltage of the PMOS transistor 66 is as high as that of the PMOS transistor 64 (FIG. 3) and the NMOS transistor 65 (FIG. 3) of the degradation resistant circuit 42. The example in which the NMOS transistor 67 is set to have a lower withstand voltage than the PMOS transistor 66 has been described.

  On the other hand, in the present embodiment, for example, as shown in FIG. 28, the breakdown voltage of the NMOS transistor 67 is as high as the PMOS transistor 64 (FIG. 3) and the NMOS transistor 65 (FIG. 3) of the degradation resistant circuit 42. The withstand voltage is set, and the PMOS transistor 66 is set to have a withstand voltage lower than that of the NMOS transistor 67.

  In this case, in the deterioration circuit 43, the PMOS transistor 66 is likely to deteriorate, so that the deterioration of the PMOS transistor 66 can be particularly detected.

  In the case of the present embodiment, the same effects as those of the first to ninth embodiments can be obtained.

[Eleventh embodiment]
FIG. 29 is a block diagram showing a configuration of the degradation detection device group 15 provided in the degradation diagnostic device according to the eleventh embodiment.

  The degradation diagnosis apparatus according to this embodiment includes, for example, a degradation detection apparatus group 15 shown in FIG. 29 instead of the degradation detection apparatus 40 of each degradation diagnosis apparatus according to the second to tenth embodiments. .

  As shown in FIG. 29, the deterioration detection device group 15 includes a plurality of deterioration detection devices (for example, two deterioration detection devices 40a and 40b).

  Each of the degradation detection devices 40a and 40b detects different types of correlation degradation (or levels of correlation degradation).

  Here, examples of the type of deterioration include deterioration due to light or heat and deterioration due to vibration.

  When detecting deterioration due to light or heat as the correlation deterioration, the deterioration detection device (for example, the first deterioration detection device 40a) is configured in the same manner as the deterioration detection device 40 in the second to ninth embodiments, for example. good. For this reason, the first deterioration level detection signal 1a output from the first deterioration detection device 40a is, for example, the same as the deterioration level detection signal 1 in the second to ninth embodiments.

  Further, in the case of deterioration due to vibration, it is expected that a state in which no output can be obtained even when an input is given to a circuit (for example, the deterioration circuit 43) due to an instantaneous large damage. For this reason, the deterioration detection device (for example, the second deterioration detection circuit 40b) may be a circuit having a function of determining whether an output is obtained with respect to an input, for example. For this reason, the second deterioration level detection signal 1b output from the second deterioration detection device 40b may be, for example, a binary signal (“0” or “1”).

  The inspection device 20 receives deterioration level detection signals 1a and 1b from the deterioration detection devices 40a and 40b. The inspection apparatus 20 determines whether or not the inspection of the processing apparatus 30 is necessary for each type of deterioration based on the deterioration level detection signals 1a and 1b, and performs inspection when it is determined that inspection is necessary. In addition, this inspection can be different for each type of deterioration and further for each level of deterioration.

  According to the eleventh embodiment as described above, a plurality of deterioration detection devices 40a and 40b are provided, and each of the deterioration detection devices 40a and 40b detects a different type of correlation deterioration. Since the inspection according to the type can be performed, the reliability of the inspection can be increased. In addition, since it is not necessary to perform an inspection according to the deterioration that has not been detected, the inspection time can be shortened.

  Of course, the number of types of degradation to be detected and the number of degradation detection devices may be three or more.

[Twelfth embodiment]
FIG. 30 is a block diagram illustrating a configuration of a deterioration detection device 40 included in the deterioration diagnosis device according to the twelfth embodiment.

  As shown in FIG. 30, in the case of the present embodiment, the deterioration detection device 40 is not provided with the oscillation circuit 41 and is different from the first embodiment only in the points described below. This is the same as in the first embodiment.

  The degradation resistance circuit 42 and the degradation circuit 43, for example, have a common input voltage as an input, and the comparison result (logic “1” or logic “0”) between this input voltage and a predetermined threshold voltage is degradation resistance. It is a circuit that outputs the circuit output 59 and the degraded circuit output 60, respectively. However, the threshold voltage changes (lowers) with deterioration. For this reason, when the deterioration circuit 43 deteriorates, as a result of the change (decrease) in the threshold voltage, the logical value of the deterioration circuit output 60 also changes. For example, the deterioration resistance circuit 42 and the deterioration circuit 43 output a logic “1” if the input voltage is higher than the threshold voltage and a logic “0” if the input voltage is lower than the threshold voltage, respectively. Specifically, for example, if the input voltage is 0.9 V and the initial threshold voltage of the anti-degradation circuit 42 and the degradation circuit 43 is 1.0 V, the degradation circuit 43 is logical if it is not degraded. When “0” is output as the degradation circuit output 60 and the threshold value becomes, for example, 0.8 V due to degradation, the logic “1” is output as the degradation circuit output 60. On the other hand, since the deterioration-resistant circuit 42 is not substantially deteriorated, the logic “0” is continuously output as the deterioration-resistant circuit output 59.

  The deterioration determination circuit 44 outputs a comparison result between the deterioration resistant circuit output 59 and the deterioration circuit output 60 as the deterioration detection signal 51. That is, when the degradation resistant circuit output 59 and the degraded circuit output 60 match (both logic “0”), a degradation detection signal 51 (for example, “0”) indicating that fact is output. On the other hand, when the degradation resistant circuit output 59 and the degraded circuit output 60 do not match (the degraded circuit output 60 is “1”), a degradation detection signal 51 (for example, “1”) indicating that fact is output.

  The inspection apparatus 20 can determine the presence or absence of correlation deterioration based on the value of the deterioration detection signal 51. That is, for example, if the value of the deterioration detection signal 51 is “0”, it can be determined that there is no deterioration, and if it is “1”, it can be determined that there is deterioration.

  In the case of the present embodiment, the deterioration determination circuit 44 constantly compares the deterioration-resistant circuit output 59 from the deterioration-resistant circuit 42 with the deterioration circuit output 60 from the deterioration circuit 43, so that the deterioration-resistant circuit output 59 and Correlation degradation can be detected without synchronization with the degradation circuit output 60.

  In the twelfth embodiment, the example in which the correlation deterioration is detected using the voltage has been described. However, the types of signals input to the deterioration-resistant circuit 42 and the deterioration circuit 43 include current, frequency, A pulse width or the like may be used.

  The present invention has been described with reference to the above embodiment, but the present invention is not limited to the configuration of the above embodiment, and various modifications that can be made by those skilled in the art within the scope of the present invention. Of course, modifications are included.

  For example, in each of the above-described embodiments, the example in which the deterioration detection device (deterioration detection devices 40, 40a, and 40b) includes the deterioration circuit 43 and the deterioration resistance circuit 42 has been described, but the deterioration resistance circuit 42 may not be provided. good. However, in this case, for example, the value of the deterioration circuit output 60 output from the deterioration circuit 43 in the initial state is stored as a reference, and the deterioration level is determined based on the comparison between the stored value and the deterioration circuit output 60. The detection signal 1, the deterioration level detection signals 1a and 1b, or the deterioration detection signal 51 may be generated and output.

  In each of the above embodiments, the example in which the processing device 30 is inspected based on whether or not the inspection output value 54 and the inspection expected value 62 match each other has been described. The processing apparatus 30 may be inspected based on the length of time from the output to 30 to the time when the inspection output value 54 is input to the inspection apparatus 20. Further, when there are a plurality of processing devices 30 to be inspected, the percentage of the inspection output values 54 from the processing devices 30 out of these processing devices 30 is based on the expected inspection value 62. You may make it perform the test | inspection (determination of the presence or absence of deterioration) collectively with respect to the some processing apparatus 30. FIG.

  Further, the deterioration circuit 43 (for example, a CMOS inverter) may be configured by an NMOS transistor having a low breakdown voltage and a PMOS transistor having a low breakdown voltage. In this case, when any one of these transistors deteriorates, the correlation deterioration can be detected.

  In each of the above-described embodiments, the example in which the deterioration circuit 43 and the deterioration-resistant circuit 42 are CMOS inverters has been described. However, the deterioration circuit 43 and the deterioration-resistant circuit 42 are not limited to CMOS inverters.

  In each of the above embodiments, the example in which the inspection input value 52 and the inspection expected value 62 are determined in advance has been described. However, for example, it may be determined (newly generated) according to the level of deterioration. .

DESCRIPTION OF SYMBOLS 1 Degradation level detection signal 1a 1st degradation level detection signal 1b 2nd degradation level detection signal 2 Degradation level determination circuit 3 Operating condition relaxation command signal 4 Operating condition relaxation command signal 5 Re-inspection command signal 10 Controller (constitutes inspection means) )
11 First degradation timer 12 Second degradation timer 13 Third degradation timer 14 Timer 15 Degradation detection device group 20 Inspection device (constitutes inspection means)
21 Inspection Control Unit 22 Inspection Expected Value Output Unit 23 Inspection Input Value Output Unit 24 Comparison Unit 30 Processing Device 40 Degradation Detection Device (Structures Degradation Detection Unit)
40a Deterioration detection device (constituting deterioration detection means)
40b Deterioration detection device (constituting deterioration detection means)
41 Oscillation circuit 42 Anti-deterioration circuit 43 Deterioration circuit (subject)
44 Degradation judgment circuit (degradation judgment means)
45 Phase comparison circuit 46 Time / digital conversion circuit 51 Deterioration detection signal 52 Inspection input value 53 Inspection control signal 54 Inspection output value 55 Inspection result output 56 Processing input 57 Processing output 58 Oscillation circuit output 59 Anti-degradation circuit output 60 Degradation circuit output 61 Phase comparison circuit output 62 Expected inspection value 63 Control signal 64 PMOS transistor 65 NMOS transistor 66 PMOS transistor 67 NMOS transistor 100 Deterioration diagnosis device (processing device with deterioration diagnosis device)
200 Deterioration diagnosis device (processing device with deterioration diagnosis device)
300 Deterioration diagnosis device (Processing device with deterioration diagnosis device)
P0a pulse P0b pulse P1a pulse P1b pulse P1c pulse P2a pulse P2b pulse P2c pulse

Claims (25)

Inspection means for inspecting a processing apparatus to be inspected;
A deterioration detecting means for detecting a correlation deterioration which is a deterioration of the subject which deteriorates in correlation with the processing apparatus;
With
The deterioration diagnosis apparatus, wherein the inspection means inspects the processing apparatus when the deterioration of the correlation is detected by the deterioration detection means. The deterioration detecting means also detects the level of correlation deterioration,
The deterioration diagnosis apparatus according to claim 1, wherein the inspection unit performs the inspections different from each other according to the level of the correlation deterioration detected by the deterioration detection unit. When an input value is input to the processing device, the processing device is configured to generate an output value by performing a predetermined process on the input value, and output the generated output value.
The inspection means includes
When the correlation deterioration is detected by the deterioration detecting means, an inspection input value is output to the processing device, and the processing device is shifted to an inspection state, whereby the inspection input value is transferred to the processing device. Control the processor to select as the input value of
The deterioration diagnosis apparatus according to claim 1, wherein the processing apparatus is inspected based on a comparison between an output value from the processing apparatus in the inspection state and an inspection expected value. When an input value is input to the processing device, the processing device is configured to generate an output value by performing a predetermined process on the input value, and output the generated output value.
The inspection means includes
The inspection input value corresponding to the level of the correlation deterioration detected by the deterioration detection means is output to the processing device, and the processing device is shifted to the inspection state, whereby the inspection input value is transferred to the processing device. Control the processor to select as the input value of
3. The processing apparatus is inspected based on a comparison between an output value from the processing apparatus in the inspection state and an inspection expected value corresponding to the input inspection input value. Deterioration diagnostic apparatus as described. The deterioration detecting means includes
A deterioration circuit as the subject that deteriorates with time to the same degree or more as the processing apparatus; and
A deterioration-resistant circuit that does not substantially deteriorate with time;
Deterioration determination means;
With
5. The deterioration diagnosis according to claim 1, wherein the deterioration determination unit detects the correlation deterioration based on a difference in deterioration amount between the deterioration-resistant circuit and the deterioration circuit. apparatus. The deterioration detecting means includes
A deterioration circuit as the subject that deteriorates with time to the same degree or more as the processing apparatus; and
A deterioration-resistant circuit that does not substantially deteriorate with time;
Deterioration determination means;
With
5. The deterioration diagnosis apparatus according to claim 2, wherein the deterioration determination unit detects the level of correlation deterioration based on a difference in deterioration amount between the deterioration-resistant circuit and the deterioration circuit. The deterioration detecting means includes
An oscillation circuit that inputs the same pulse signal to the deterioration-resistant circuit and the deterioration circuit,
The degradation resistant circuit outputs a degradation resistant circuit output based on the pulse signal,
The degradation circuit outputs a degradation circuit output based on the pulse signal,
The deterioration determining means includes
6. The deterioration diagnosis apparatus according to claim 5, wherein the correlation deterioration is detected based on a difference between the deterioration resistant circuit output and the deterioration circuit output. The degradation determination means includes a phase comparison circuit and a time / digital conversion circuit,
The phase comparison circuit outputs a pulse having a pulse width corresponding to a phase difference between the deterioration resistant circuit output and the deterioration circuit output,
8. The deterioration according to claim 7, wherein the time / digital conversion circuit outputs a digital signal having a value corresponding to a pulse width of a pulse output from the phase comparison circuit as the correlation deterioration detection signal. Diagnostic device. The deterioration detecting means includes
An oscillation circuit that inputs the same pulse signal to the deterioration-resistant circuit and the deterioration circuit,
The degradation resistant circuit outputs a degradation resistant circuit output based on the pulse signal,
The degradation circuit outputs a degradation circuit output based on the pulse signal,
The deterioration determining means includes
The degradation diagnosis apparatus according to claim 6, wherein the level of correlation degradation is detected based on a difference between the degradation resistant circuit output and the degraded circuit output. The degradation determination means includes a phase comparison circuit and a time / digital conversion circuit,
The phase comparison circuit outputs a pulse having a pulse width corresponding to a phase difference between the deterioration resistant circuit output and the deterioration circuit output,
10. The time / digital conversion circuit outputs a digital signal having a value corresponding to a pulse width of a pulse output from the phase comparison circuit as a detection signal of the correlation deterioration level. Deterioration diagnosis device.   The deterioration diagnosis apparatus according to any one of claims 5 to 10, wherein the deterioration circuit is operated under an operation condition in which deterioration proceeds more than the deterioration-resistant circuit.   The operating conditions in which the deterioration proceeds more than the deterioration-resistant circuit are operated at a higher voltage than the deterioration-resistant circuit, operated at a higher frequency than the deterioration-resistant circuit, and higher temperature than the deterioration-resistant circuit. The deterioration diagnosis apparatus according to claim 11, wherein the condition is at least one of the following conditions.   The withstand voltage of at least one electric device constituting the deterioration circuit is lower than the withstand voltage of the electric device constituting the deterioration resistance circuit. Deterioration diagnosis device.   The deterioration diagnosis apparatus according to claim 1, wherein the inspection unit includes a timer and inspects the processing apparatus every time a predetermined time is counted by the timer.   The inspection unit includes an individual timer for each level of correlation deterioration, and inspects the processing device each time a predetermined time is counted by the timers. 6. The deterioration diagnosis apparatus according to any one of 6, 9, and 10.   16. The timer corresponding to the detected level of correlation deterioration is initialized among the timers when the inspection is performed based on detection of the correlation deterioration. Deterioration diagnosis device.   The inspection means includes a timer, and inspects the processing device every time a predetermined time is counted by the timer, and changes the predetermined time according to the level of correlation deterioration. The deterioration diagnosis apparatus according to any one of claims 2, 4, 6, 9, and 10. If the inspection means determines that the processing apparatus has deteriorated as a result of the inspection,
In the state where the operating conditions of the processing apparatus are relaxed, the inspection is performed again. When it is determined that the processing apparatus is not deteriorated in the second inspection, the operating conditions are maintained in a relaxed state. The deterioration diagnostic apparatus according to any one of claims 1 to 17, wherein A plurality of the deterioration detection means,
19. The deterioration diagnosis apparatus according to claim 1, wherein each of the deterioration detection units detects different types of correlation deterioration. The deterioration diagnostic apparatus according to any one of claims 1 to 19,
The processing device;
A processing apparatus with a deterioration diagnosis apparatus, comprising: An inspection process for inspecting a processing apparatus to be inspected;
A deterioration detecting step of detecting a correlation deterioration that is a deterioration of the subject that deteriorates in correlation with the processing apparatus;
With
A deterioration diagnosis method, wherein the inspection step is performed when the correlation deterioration is detected by the deterioration detection step. In the deterioration detection step, the level of the correlation deterioration is also detected,
The deterioration diagnosis method according to claim 21, wherein in the inspection step, the inspections different from each other are performed according to the level of the correlation deterioration. The deterioration detection step is performed in parallel with the processing device performing normal processing,
23. The inspection step is performed after performing a saving step for temporarily stopping normal processing of the processing apparatus when the correlation deterioration is detected in the deterioration detecting step. The deterioration diagnosis method described in 1.   As a result of the inspection, when it is determined that the processing device has deteriorated, the normal processing is stopped, whereas when it is determined that the processing device has not deteriorated, the normal processing is resumed. 24. The deterioration diagnosis method according to claim 23.   As a result of the inspection, if it is determined that the processing apparatus has deteriorated, the inspection is performed again in a state where the operating conditions of the processing apparatus are relaxed. The deterioration diagnosis method according to any one of claims 21 to 24, wherein when it is determined that the deterioration has not occurred, the operation condition is maintained in a relaxed state.

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