JP5258078B2 - Polycarbonate resin composition having high fluidity - Google Patents
Polycarbonate resin composition having high fluidity Download PDFInfo
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- JP5258078B2 JP5258078B2 JP2006298768A JP2006298768A JP5258078B2 JP 5258078 B2 JP5258078 B2 JP 5258078B2 JP 2006298768 A JP2006298768 A JP 2006298768A JP 2006298768 A JP2006298768 A JP 2006298768A JP 5258078 B2 JP5258078 B2 JP 5258078B2
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- polycarbonate resin
- resin composition
- high fluidity
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- 229920005668 polycarbonate resin Polymers 0.000 title claims description 30
- 239000004431 polycarbonate resin Substances 0.000 title claims description 30
- 239000000203 mixture Substances 0.000 title claims description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- -1 amide compound Chemical class 0.000 claims description 17
- 150000007524 organic acids Chemical class 0.000 claims description 14
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 8
- 229920000638 styrene acrylonitrile Polymers 0.000 claims description 8
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 claims description 5
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 4
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 claims description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 239000011342 resin composition Substances 0.000 claims description 3
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 claims description 2
- 239000005639 Lauric acid Substances 0.000 claims description 2
- 235000021314 Palmitic acid Nutrition 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 229960002446 octanoic acid Drugs 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 claims 1
- 238000002156 mixing Methods 0.000 description 13
- 239000000178 monomer Substances 0.000 description 9
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- PFBWBEXCUGKYKO-UHFFFAOYSA-N ethene;n-octadecyloctadecan-1-amine Chemical compound C=C.CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC PFBWBEXCUGKYKO-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005027 hydroxyaryl group Chemical group 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011145 styrene acrylonitrile resin Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 2
- OXDXXMDEEFOVHR-CLFAGFIQSA-N (z)-n-[2-[[(z)-octadec-9-enoyl]amino]ethyl]octadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)NCCNC(=O)CCCCCCC\C=C/CCCCCCCC OXDXXMDEEFOVHR-CLFAGFIQSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- KPQOXMCRYWDRSB-UHFFFAOYSA-N 1-(2-chlorophenyl)pyrrole-2,5-dione Chemical compound ClC1=CC=CC=C1N1C(=O)C=CC1=O KPQOXMCRYWDRSB-UHFFFAOYSA-N 0.000 description 1
- FDLFMPKQBNPIER-UHFFFAOYSA-N 1-methyl-3-(3-methylphenoxy)benzene Chemical compound CC1=CC=CC(OC=2C=C(C)C=CC=2)=C1 FDLFMPKQBNPIER-UHFFFAOYSA-N 0.000 description 1
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- GRCXOICCGCYITB-UHFFFAOYSA-N 4-[2-[2-[2-(4-hydroxyphenyl)-3-methylphenyl]propan-2-yl]-6-methylphenyl]phenol Chemical compound CC1=CC=CC(C(C)(C)C=2C(=C(C)C=CC=2)C=2C=CC(O)=CC=2)=C1C1=CC=C(O)C=C1 GRCXOICCGCYITB-UHFFFAOYSA-N 0.000 description 1
- RQTDWDATSAVLOR-UHFFFAOYSA-N 4-[3,5-bis(4-hydroxyphenyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC(C=2C=CC(O)=CC=2)=CC(C=2C=CC(O)=CC=2)=C1 RQTDWDATSAVLOR-UHFFFAOYSA-N 0.000 description 1
- XHDKBYRAWKLXGE-UHFFFAOYSA-N 4-[4,6-bis(4-hydroxyphenyl)-4,6-dimethylhept-1-en-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CC(C)(C=1C=CC(O)=CC=1)CC(=C)C1=CC=C(O)C=C1 XHDKBYRAWKLXGE-UHFFFAOYSA-N 0.000 description 1
- CIEGINNQDIULCT-UHFFFAOYSA-N 4-[4,6-bis(4-hydroxyphenyl)-4,6-dimethylheptan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C)(C=1C=CC(O)=CC=1)CC(C)(C)C1=CC=C(O)C=C1 CIEGINNQDIULCT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000004790 diaryl sulfoxides Chemical class 0.000 description 1
- 150000001987 diarylethers Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、高流動性を有するポリカーボネート樹脂組成物に関する。詳細には、ポリカーボネート樹脂に非ゴム強化スチレン系樹脂ならびに、特定の有機酸およびアミド化合物を特定量配合することにより、極めて優れた流動性を有するポリカーボネート樹脂組成物、およびそれからなる成形品に関する。 The present invention relates to a polycarbonate resin composition having high fluidity. More specifically, the present invention relates to a polycarbonate resin composition having extremely excellent fluidity by blending a specific amount of a non-rubber reinforced styrene resin and a specific organic acid and an amide compound with a polycarbonate resin, and a molded article comprising the same.
ポリカーボネート樹脂は透明性、耐衝撃性および耐熱性に優れ、電気、電子、IT等の分野の数多くの製品に広く使用されている。近年これらの分野では、製品の薄肉化に伴い材料の高い流動性が要望されている。よって、当該分野においては、耐衝撃性および難燃性などを損なわずに、流動性をもバランス良く具備した材料が市場において要求されている。 Polycarbonate resins are excellent in transparency, impact resistance and heat resistance, and are widely used in many products in fields such as electricity, electronics and IT. In these fields in recent years, high fluidity of materials has been demanded as products become thinner. Therefore, in this field, there is a demand in the market for materials that have a good balance of fluidity without impairing impact resistance and flame retardancy.
ポリカーボネート樹脂の高流動化に際し、出願人は既にポリカーボネート樹脂に、有機酸及びアミド化合物を配合し高流動性を有するポリカーボネート樹脂組成物に関する発明を完成し出願を行った(特許文献1)。 At the time of increasing the fluidity of the polycarbonate resin, the applicant has already filed an application regarding a polycarbonate resin composition having high fluidity by blending an organic acid and an amide compound in the polycarbonate resin (Patent Document 1).
しかしながら電気、電子、IT等の分野では、さらに高い流動性が必要とされる場合があり、さらなる高流動性を付与するべく、改良が求められてきた。 However, in fields such as electricity, electronics, and IT, even higher fluidity may be required, and improvements have been sought to provide even higher fluidity.
本発明者らは、かかる問題点に鑑み鋭意検討を行った結果、ポリカーボネート樹脂に、非ゴム強化スチレン系樹脂ならびに特定の有機酸およびアミド化合物を特定量配合することにより、組成物の耐熱性や耐衝撃性を損なうことなく、その流動性を著しく改善することに成功し、本発明に到達したものである。 As a result of intensive studies in view of such problems, the present inventors have formulated a specific amount of a non-rubber reinforced styrene resin and a specific organic acid and amide compound in a polycarbonate resin, thereby improving the heat resistance of the composition. The present invention has been achieved by successfully improving the fluidity without impairing the impact resistance.
すなわち本発明は、ポリカーボネート樹脂(A)85〜95重量%、非ゴム強化スチレン系樹脂(B)5〜15重量%からなる樹脂成分100重量部あたり、有機酸(C)0.01〜0.6重量部およびアミド化合物(D)0.4〜1.0重量部からなる高流動性を有するポリカーボネート樹脂組成物、およびそれを用いて成形されてなる成形品を提供するものである。
That is, the present invention relates to an organic acid (C) of 0.01 to 0.00 per 100 parts by weight of a resin component consisting of 85 to 95% by weight of a polycarbonate resin (A) and 5 to 15% by weight of a non-rubber reinforced styrene resin (B). The present invention provides a polycarbonate resin composition having a high fluidity comprising 6 parts by weight and amide compound (D) 0.4 to 1.0 part by weight, and a molded product formed by using the polycarbonate resin composition.
本発明の熱可塑性樹脂組成物は、耐熱性、耐衝撃性等を大きく損なうことなく流動性を顕著に向上させていることから、電気、電子、IT等各種分野における軽量・薄肉化、意匠性などが要求される製品に対して好適に使用することが可能であり、工業的利用価値が高い。 The thermoplastic resin composition of the present invention has significantly improved fluidity without greatly impairing heat resistance, impact resistance, etc., so that it is light and thin in various fields such as electricity, electronics, IT, and design. It can be suitably used for products that require a high degree of industrial utility value.
以下に、本発明について詳細に説明する。 The present invention is described in detail below.
本発明にて使用されるポリカーボネート樹脂(A)とは、種々のジヒドロキシジアリール化合物とホスゲンとを反応させるホスゲン法、またはジヒドロキシジアリール化合物とジフェニルカーボネートなどの炭酸エステルとを反応させるエステル交換法によって得られる重合体であり、代表的なものとしては、2,2−ビス(4−ヒドロキシフェニル)プロパン(通称ビスフェノールA)から製造されたポリカーボネート樹脂が挙げられる。 The polycarbonate resin (A) used in the present invention is obtained by a phosgene method in which various dihydroxydiaryl compounds and phosgene are reacted, or a transesterification method in which a dihydroxydiaryl compound and a carbonate such as diphenyl carbonate are reacted. A typical example of the polymer is a polycarbonate resin produced from 2,2-bis (4-hydroxyphenyl) propane (commonly referred to as bisphenol A).
上記ジヒドロキシジアリール化合物としては、ビスフェノールAの他に、ビス(4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)エタン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)オクタン、ビス(4−ヒドロキシフェニル)フェニルメタン、2,2−ビス(4−ヒドロキシフェニル−3−メチルフェニル)プロパン、1,1−ビス(4−ヒドロキシ−3−第三ブチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−ブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジクロロフェニル)プロパンのようなビス(ヒドロキシアリール)アルカン類、1,1−ビス(4−ヒドロキシフェニル)シクロペンタン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサンのようなビス(ヒドロキシアリール)シクロアルカン類、4,4′−ジヒドロキシジフェニルエーテル、4,4′−ジヒドロキシ−3,3′−ジメチルジフェニルエーテルのようなジヒドロキシジアリールエーテル類、4,4′−ジヒドロキシジフェニルスルフィドのようなジヒドロキシジアリールスルフィド類、4,4′−ジヒドロキシジフェニルスルホキシド、4,4′−ジヒドロキシ−3,3′−ジメチルジフェニルスルホキシドのようなジヒドロキシジアリールスルホキシド類、4,4′−ジヒドロキシジフェニルスルホン、4,4′−ジヒドロキシ−3,3′−ジメチルジフェニルスルホンのようなジヒドロキシジアリールスルホン類等が挙げられる。 Examples of the dihydroxydiaryl compound include bisphenol 4-, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, 2, 2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxyphenyl-3-methylphenyl) propane, 1,1-bis (4-hydroxy-3) -Tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2-bis ( Bis (hydroxyaryl) alkanes such as 4-hydroxy-3,5-dichlorophenyl) propane, 1,1- (4-hydroxyphenyl) cyclopentane, bis (hydroxyaryl) cycloalkanes such as 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3 Dihydroxy diaryl ethers such as 3,3'-dimethyldiphenyl ether, dihydroxy diaryl sulfides such as 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxy-3,3 ' Dihydroxy diaryl sulfoxides such as dimethyldiphenyl sulfoxide, dihydroxy diary such as 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfone Sulfone, and the like.
これらは単独または2種類以上混合して使用されるが、これらの他に、ピペラジン、ジピペリジルハイドロキノン、レゾルシン、4,4′−ジヒドロキシジフェニル等を混合して使用してもよい。 These may be used alone or in combination of two or more. In addition to these, piperazine, dipiperidyl hydroquinone, resorcin, 4,4′-dihydroxydiphenyl, and the like may be used in combination.
さらに、上記のジヒドロキシアリール化合物と以下に示すような3価以上のフェノール化合物を混合使用してもよい。3価以上のフェノールとしてはフロログルシン、4,6−ジメチル−2,4,6−トリ−(4−ヒドロキシフェニル)−ヘプテン、2,4,6−ジメチル−2,4,6−トリ−(4−ヒドロキシフェニル)−ヘプタン、1,3,5−トリ−(4−ヒドロキシフェニル)−ベンゾール、1,1,1−トリ−(4−ヒドロキシフェニル)−エタンおよび2,2−ビス−〔4,4−(4,4′−ジヒドロキシジフェニル)−シクロヘキシル〕−プロパンなどが挙げられる。 Furthermore, the above dihydroxyaryl compound and a trivalent or higher phenol compound as shown below may be used in combination. Trihydric or higher phenols include phloroglucin, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) -heptene, 2,4,6-dimethyl-2,4,6-tri- (4 -Hydroxyphenyl) -heptane, 1,3,5-tri- (4-hydroxyphenyl) -benzol, 1,1,1-tri- (4-hydroxyphenyl) -ethane and 2,2-bis- [4 4- (4,4'-dihydroxydiphenyl) -cyclohexyl] -propane and the like.
ポリカーボネート樹脂(A)の粘度平均分子量には特に制限はないが、成形加工性、強度の面より通常10000〜100000、より好ましくは15000〜30000、さらに好ましくは17000〜26000である。また、かかるポリカーボネート樹脂を製造するに際し、分子量調整剤、触媒等を必要に応じて使用することができる。 Although there is no restriction | limiting in particular in the viscosity average molecular weight of polycarbonate resin (A), Usually, it is 10,000-100000, More preferably, it is 15000-30000, More preferably, it is 17000-26000 from the surface of moldability and intensity | strength. Moreover, when manufacturing this polycarbonate resin, a molecular weight modifier, a catalyst, etc. can be used as needed.
本発明にて使用される非ゴム強化スチレン系樹脂(B)とは、芳香族ビニル単量体成分(a)からなる重合体またはそれと共重合可能なモノマーからなる共重合体が挙げられる。 Examples of the non-rubber reinforced styrene resin (B) used in the present invention include a polymer composed of an aromatic vinyl monomer component (a) or a copolymer composed of a monomer copolymerizable therewith.
芳香族ビニル単量体成分(a)としては、例えばスチレン、α−メチルスチレン、o−、m−、p−メチルスチレン、ビニルキシレン、エチルスチレン、ビニルナフタレン等が挙げられ、これらを一種または二種以上使用することができる。好ましくはスチレンが使用される。 Examples of the aromatic vinyl monomer component (a) include styrene, α-methylstyrene, o-, m-, p-methylstyrene, vinylxylene, ethylstyrene, vinylnaphthalene, and the like. More than seeds can be used. Styrene is preferably used.
芳香族ビニル単量体成分(a)と共重合可能なモノマーとしては、シアン化ビニル単量体(b)が挙げられる。 Examples of the monomer copolymerizable with the aromatic vinyl monomer component (a) include a vinyl cyanide monomer (b).
シアン化ビニル単量体成分(b)としては、例えばアクリロニトリル、メタアクリロニトリル等が挙げられ、これらを一種または二種以上使用することができる。好ましくは、アクリロニトリルが使用される。 Examples of the vinyl cyanide monomer component (b) include acrylonitrile, methacrylonitrile and the like, and these can be used alone or in combination. Preferably, acrylonitrile is used.
非ゴム強化スチレン系樹脂(B)としては、ポリスチレン、スチレン−アクリロニトリル(SAN)樹脂などが挙げられ、好適にはSAN樹脂が用いられる。 Examples of the non-rubber reinforced styrene resin (B) include polystyrene and styrene-acrylonitrile (SAN) resin, and a SAN resin is preferably used.
SAN樹脂においては、上記(a)、(b)の各成分の組成比には特に制限はなく、用途に応じて調整可能であるが、好ましくは、(a)成分が95〜50重量%、(b)成分が5〜50重量%であり、さらに好ましくは(a)が90〜65重量%、(b)が10〜35重量%である。また、SAN樹脂には、上記の成分(a)、(b)の他に、これらの成分と共重合可能な単量体を本発明の目的を損なわない範囲で使用することができる。 In the SAN resin, the composition ratio of the components (a) and (b) is not particularly limited and can be adjusted according to the use. Preferably, the component (a) is 95 to 50% by weight, (B) A component is 5 to 50 weight%, More preferably, (a) is 90 to 65 weight%, (b) is 10 to 35 weight%. In addition to the above components (a) and (b), a monomer copolymerizable with these components can be used in the SAN resin as long as the object of the present invention is not impaired.
そのような共重合可能な単量体としては、アクリル酸、メタアクリル酸などのα,β−不飽和カルボン酸、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、ブチル(メタ)アクリレート、2−エチル(メタ)アクリレート、2−エチルヘキシルメタクリレート等のα,β−不飽和カルボン酸エステル類;無水マレイン酸、無水イタコン酸等のα,β−不飽和ジカルボン酸無水物類;マレイミド、N−メチルマレイミド、N−エチルマレイミド、N−フェニルマレイミド、N−o−クロロフェニルマレイミド等のα,β−不飽和ジカルボン酸のイミド化合物類;等を挙げることができ、これらの単量体は一種または二種以上で使用することができる。 Examples of such copolymerizable monomers include α, β-unsaturated carboxylic acids such as acrylic acid and methacrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl ( Α, β-unsaturated carboxylic acid esters such as (meth) acrylate, 2-ethyl (meth) acrylate, 2-ethylhexyl methacrylate; α, β-unsaturated dicarboxylic acid anhydrides such as maleic anhydride and itaconic anhydride; And imide compounds of α, β-unsaturated dicarboxylic acids such as maleimide, N-methylmaleimide, N-ethylmaleimide, N-phenylmaleimide, N-o-chlorophenylmaleimide, and the like. Can be used alone or in combination of two or more.
非ゴム強化スチレン系樹脂(B)の配合比率は、ポリカーボネート樹脂(A)および(B)を基準として、5〜15重量%の範囲である。配合比率が5重量%未満であると流動性が劣り、また15重量%を超えると衝撃強度が劣るので好ましくない。より好ましくは、5〜10重量%の範囲である。 The blending ratio of the non-rubber reinforced styrene resin (B) is in the range of 5 to 15% by weight based on the polycarbonate resins (A) and (B). If the blending ratio is less than 5% by weight, the fluidity is inferior, and if it exceeds 15% by weight, the impact strength is inferior. More preferably, it is in the range of 5 to 10% by weight.
本発明にて使用される有機酸(C)としては種々のタイプのものを使用することができる。例えば、炭素数6〜30の脂肪酸が挙げられ、カプリル酸、カプリン酸、ラウリル酸、パルミチン酸、ステアリン酸、アラキジン酸などが代表的な化合物として例示される。とりわけカプリン酸が好適に用いられる。
As the organic acid (C) used in the present invention, various types can be used. For example, a C6-C30 fatty acid is mentioned, A caprylic acid, capric acid, lauric acid, a palmitic acid, a stearic acid, an arachidic acid etc. are illustrated as a typical compound. In particular, capric acid is preferably used.
有機酸(C)の配合量は、ポリカーボネート樹脂(A)および非ゴム強化スチレン系樹脂(B)からなる樹脂成分100重量部あたり、0.01〜0.6重量部である。配合量が0.01重量部未満では流動性が劣り、また0.6重量部を超えると衝撃強度が低下するので好ましくない。より好適な配合量としては、0.05〜0.2重量部の範囲である。 The compounding amount of the organic acid (C) is 0.01 to 0.6 parts by weight per 100 parts by weight of the resin component comprising the polycarbonate resin (A) and the non-rubber reinforced styrene resin (B). If the blending amount is less than 0.01 parts by weight, the fluidity is inferior, and if it exceeds 0.6 parts by weight, the impact strength decreases, which is not preferable. A more preferable blending amount is in the range of 0.05 to 0.2 parts by weight.
アミド化合物(D)は、下記一般式(1)で示される化合物である。
一般式(1)
R1−CONH−(CH2)n−NHCO−R2
ただし、R1およびR2は直鎖または分岐鎖の炭素数6〜30のアルキル基であり、nは2〜6の整数である。具体的には、エチレンビスステアリルアミド、エチレンビスオレイルアミド等が挙げられ、とりわけエチレンビスステアリルアミドが好適に使用される。
The amide compound (D) is a compound represented by the following general formula (1).
General formula (1)
R1-CONH- (CH 2) n -NHCO-R2
However, R1 and R2 are linear or branched alkyl groups having 6 to 30 carbon atoms, and n is an integer of 2 to 6. Specific examples include ethylene bisstearyl amide and ethylene bis oleyl amide, and ethylene bisstearyl amide is particularly preferably used.
アミド化合物(D)の配合量は、ポリカーボネート樹脂(A)および非ゴム強化スチレン系樹脂(B)からなる樹脂成分100重量部あたり、0.4〜1.0重量部である。配合量が0.4重量部未満では流動性が劣り、また1.0重量部を超えると衝撃強度が低下するので好ましくない。より好適な配合量としては、0.5〜0.8重量部の範囲である。 The compounding amount of the amide compound (D) is 0.4 to 1.0 part by weight per 100 parts by weight of the resin component composed of the polycarbonate resin (A) and the non-rubber reinforced styrene resin (B). If the blending amount is less than 0.4 parts by weight, the fluidity is inferior, and if it exceeds 1.0 parts by weight, the impact strength decreases, which is not preferable. A more preferable blending amount is in the range of 0.5 to 0.8 parts by weight.
本発明の、高流動性を有するポリカーボネート樹脂組成物の各種成分の混合方法には特に制限はなく、任意の混合機、例えばタンブラー、リボンブレンダー、高速ミキサー等で混合し、通常の一軸または二軸押出機等で容易に溶融混練することができる。 The mixing method of various components of the polycarbonate resin composition having high fluidity of the present invention is not particularly limited, and is mixed with an arbitrary mixer such as a tumbler, ribbon blender, high-speed mixer, etc., and is usually uniaxial or biaxial. It can be easily melt-kneaded with an extruder or the like.
また、混合時、必要に応じて他の公知の添加剤、例えば離型剤、紫外線吸収剤、充填剤、衝撃改良剤、帯電防止剤、酸化防止剤、熱安定剤、その他の難燃剤、難燃助剤(有機金属塩等)、染顔料、展着剤(エポキシ大豆油、流動パラフィン等)等を配合することができる。 In addition, other known additives such as mold release agents, ultraviolet absorbers, fillers, impact modifiers, antistatic agents, antioxidants, heat stabilizers, other flame retardants, other difficult additives may be added at the time of mixing. Combustion aids (organic metal salts, etc.), dyes and pigments, spreading agents (epoxy soybean oil, liquid paraffin, etc.) can be blended.
充填剤としては、例えばガラス繊維、ガラスビーズ、ガラスフレーク、炭素繊維、タルク、クレー、マイカ、チタン酸カリウムウィスカー、ホウ酸アルミニウムウィスカー、ワラストナイト、シリカ等が挙げられる。 Examples of the filler include glass fiber, glass bead, glass flake, carbon fiber, talc, clay, mica, potassium titanate whisker, aluminum borate whisker, wollastonite, silica and the like.
以下に本発明を実施例により具体的に説明するが、本発明はこれら実施例により何ら制限されるものではない。なお、特に断りのない限り「%」及び「部」は重量基準に基づく。 EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, “%” and “parts” are based on weight.
使用した配合成分の詳細は、以下のとおりである。
・ポリカーボネート樹脂(以下、PCと略記)
住友ダウ社製 カリバー 200−20(分子量:18600)
・SAN樹脂
日本A&L社製 MD−1(以下SANと略記)
・有機酸
カプリン酸(日本油脂社製NAA−102)
・アミド化合物
エチレンビスステアリルアミド(日本油脂社製アルフロー H−50TF)
The details of the used blending components are as follows.
・ Polycarbonate resin (hereinafter abbreviated as PC)
Caliber 200-20 (molecular weight: 18600) manufactured by Sumitomo Dow
-SAN resin MD-1 made by Japan A & L (hereinafter abbreviated as SAN)
・ Organic acid Capric acid (NAA-102 manufactured by NOF Corporation)
Amide compound Ethylene bisstearyl amide (Alfro H-50TF manufactured by NOF Corporation)
各種配合成分を表1および表2に示す配合比率にて一括してタンブラーに投入し、10分間乾式混合した後、二軸押出機(神戸製鋼所製KTX37)を用いて、溶融温度240℃にて混練し、熱可塑性樹脂組成物のペレットを得た。得られたペレットから、以下の評価を行った。ペレットの射出成形加工には、日本製鋼社製J100E−C5射出成形機を用いた。 Various blending components are collectively put into a tumbler at the blending ratios shown in Tables 1 and 2, and after 10 minutes of dry mixing, using a twin screw extruder (KTX37 manufactured by Kobe Steel) to a melting temperature of 240 ° C. And kneaded to obtain pellets of the thermoplastic resin composition. The following evaluation was performed from the obtained pellets. A J100E-C5 injection molding machine manufactured by Nippon Steel Co., Ltd. was used for the pellet injection molding process.
(1)アルキメデススパイラルフロー流動性
溶融温度250℃、射出圧力1600kg/cm2の条件下、アルキメデススパイラルフロー金型を使用して、流路厚み1mmでの流動長さを測定した。流動長さが170mm以上を合格とした。
(1) Archimedes spiral flow fluidity The flow length at a channel thickness of 1 mm was measured using an Archimedes spiral flow mold under the conditions of a melting temperature of 250 ° C. and an injection pressure of 1600 kg / cm 2 . A flow length of 170 mm or more was regarded as acceptable.
(2)アイゾット衝撃試験
溶融温度280℃の条件下、アイゾット衝撃試験用試験片を加工し、ASTM D256に準拠し、アイゾット衝撃強度を測定した。測定温度は23℃、試験片の厚みは3.2mmである。衝撃値が10Kg・cm/cm以上を合格とした。
(2) Izod impact test
A specimen for an Izod impact test was processed under the condition of a melting temperature of 280 ° C., and the Izod impact strength was measured in accordance with ASTM D256. The measurement temperature is 23 ° C., and the thickness of the test piece is 3.2 mm. An impact value of 10 kg / cm / cm or more was regarded as acceptable.
表1のとおり、ポリカーボネート樹脂組成物が本発明の構成を満足する場合(実施例1〜6)にあっては、全ての評価項目にわたりその規格を満足していた。 As shown in Table 1, when the polycarbonate resin composition satisfied the configuration of the present invention (Examples 1 to 6), the standard was satisfied over all evaluation items.
表2で示したとおり、ポリカーボネート樹脂組成物が本発明の構成を満足しない場合においては、それぞれ次の欠点を有していた。
比較例1はSANが配合されない場合であり、流動性が劣る結果となった。
比較例2はSANが規定量を超えて配合されている場合であり、耐衝撃性が劣る結果となった。
比較例3は有機酸及びアミド化合物が配合されない場合であり、流動性が劣る結果となった。
比較例4はアミド化合物が規定量を超えて配合されている場合であり、耐衝撃性が劣る結果となった。
比較例5は有機酸が規定量を超えて配合されている場合であり、耐衝撃性が劣る結果となった。
As shown in Table 2, when the polycarbonate resin composition did not satisfy the constitution of the present invention, each had the following drawbacks.
Comparative Example 1 was a case where SAN was not blended, and resulted in poor fluidity.
Comparative Example 2 was a case where SAN was blended in excess of the specified amount, resulting in poor impact resistance.
Comparative Example 3 was a case where no organic acid and amide compound were blended, resulting in poor fluidity.
Comparative Example 4 was a case where the amide compound was blended in excess of the specified amount, resulting in poor impact resistance.
Comparative Example 5 was a case where the organic acid was blended in excess of the specified amount, resulting in poor impact resistance.
Claims (6)
一般式(1)
R1−CONH−(CH2)n−NHCO−R2
ここで、R1、R2は直鎖または分岐鎖の炭素数6〜30のアルキル基であり、nは2〜6の整数である。 The polycarbonate resin composition having high fluidity according to claim 1 , wherein the amide compound ( D ) is a compound represented by the following general formula (1).
General formula (1)
R1-CONH- (CH2) n-NHCO-R2
Here, R1 and R2 are linear or branched alkyl groups having 6 to 30 carbon atoms, and n is an integer of 2 to 6.
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| TWI549986B (en) | 2011-05-19 | 2016-09-21 | 三菱瓦斯化學股份有限公司 | A high-flow polycarbonate copolymer, a method for producing a high molecular weight aromatic polycarbonate resin, and an aromatic polycarbonate compound |
| KR20140086738A (en) | 2012-12-28 | 2014-07-08 | 제일모직주식회사 | Resin compositions and articles including the same |
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| JP4372431B2 (en) * | 2003-02-19 | 2009-11-25 | ユーエムジー・エービーエス株式会社 | Colored resin composition and molded product thereof |
| JP4721669B2 (en) * | 2004-07-30 | 2011-07-13 | 住化スタイロンポリカーボネート株式会社 | Polycarbonate resin composition |
| JP2006232876A (en) * | 2005-02-22 | 2006-09-07 | Sumitomo Dow Ltd | Flame-retardant polycarbonate resin composition |
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