JP5311486B2 - Hybrid integrated circuit for microwave - Google Patents

Description

  The present invention relates to a microwave hybrid integrated circuit, and more specifically, a module support substrate having a plurality of cavities in which a plurality of modules each composed of a circuit element such as an active element and a passive element are sealed, and the module The present invention relates to a microwave hybrid integrated circuit including a sealing substrate that seals a support substrate and insulatively supports a plurality of connection terminals that are electrically connected to each module.

  Integrated circuits (ICs), which are representative of semiconductor devices, are broadly classified into monolithic ICs and hybrid integrated circuits (hereinafter also simply referred to as HICs) in terms of system configuration. The monolithic IC is configured such that an active element such as a transistor and a passive element such as a capacitor are integrated on a single semiconductor substrate as necessary to exhibit a desired function. On the other hand, the HIC electrically connects a plurality of modules (hereinafter also simply referred to as HIC modules) each having a circuit board on which circuit elements constituting individual semiconductor devices or ICs and peripheral circuits associated therewith are mounted. Thus, it is configured to exhibit a desired function.

  Here, since the HIC has a degree of freedom that each HIC module can be configured by using circuit elements having high performance such as high frequency characteristics and high output characteristics, it becomes possible to achieve multi-function and high gain. It is widely applied to electronic devices such as communication devices used in the microwave region.

  FIG. 5 is a plan view showing a configuration of an HIC created by a technique related to the present invention (hereinafter referred to as a related technique), and FIG. 6 is a cross-sectional view taken along the line BB in FIG. As shown in FIGS. 5 and 6, the HIC 100 includes a plurality of (for example, two) semiconductor devices or ICs and circuit elements 101 each constituting a peripheral circuit and the like associated therewith mounted on a circuit board 102. Module support substrate 105 having two cavities 104A and 104B to be sealed by module 103, and two connection terminals for sealing module support substrate 105 and being electrically connected to each module 103 A metal package (sealing container) 109 that insulates and supports the input terminal 106 and the output terminal 107 through the sealing glass 108 is provided.

  The module support substrate 105 is provided with three lateral walls 105A to 105C to partition the two cavities 104A and 104B. Further, through lines (feed-through lines) 110A to 110C are provided at the bottoms of the horizontal walls 105A to 105C, respectively. Further, between the input terminal 106 and one end of the through line 110A, between the other end of the through line 110A and one end of the one circuit board 102, and between the other end of the one circuit board 102 and one end of the through line 110B. , Between the other end of the through line 110B and one end of the other circuit board 102, between the other end of the other through line 110B and one end of the through line 110C, and between the other end of the through line 110C and the output terminal 107. Bonding wires 111 are connected to a total of six locations. The internal spaces of the cavities 104A and 104B are sealed by internal covers 112A and 112B made of an insulating substrate, respectively, and the internal space of the metal package 109 is sealed by an external cover 113 made of metal. In FIG. 5, the inner covers 112 </ b> A and 112 </ b> B and the outer cover 113 are shown in an opened state for easy understanding of the contents. Furthermore, in order to maintain the characteristics of the HIC 100 stably, each internal space is filled with an inert gas such as nitrogen that prevents oxidation of each module 103. Reference numeral 114 denotes a frame for positioning and fixing the module support substrate 105 in the internal space of the metal package 109.

  By the way, in the HIC 100 produced by the related technology, as apparent from FIGS. 5 and 6, both the input terminal 106 and the output terminal 107 are arranged in the internal space of the metal package 109. There is a problem that the isolation between them is insufficient. Thus, in a state where the isolation between the terminals 106 and 107 is not sufficiently ensured, the microwave signal (RF signal) between the terminals 106 and 107 before and after the metal package 109 is hermetically sealed by the outer cover 113. ) Fluctuates in the leakage state, and this causes a disadvantage that the characteristic change becomes large. In addition, the following problems also occur based on insufficient isolation between the terminals 106 and 107. That is, when the HIC 100 is assembled, it is necessary to perform electrical adjustment of each module 103 mounted on the module support board 105. This is because electrical adjustment is performed while a signal is sent from the input terminal 106 to the output terminal 107 and the output signal is observed. It is performed in a state where the inner cover of the necessary module cavity is opened (the outer cover 113 is also opened). Alternatively, the module may be adjusted by using a measurement probe with the inner cover opened without passing a signal between the terminals 106 and 107. For example, when the electrical adjustment of the module 103 in the cavity 104B is performed, only the inner cover 112B is opened and the electrical adjustment of the module 103 is performed.

  However, in any of these adjustment methods, when the inner cover 112B is opened, sufficient isolation cannot be secured between the cavity 104B and both the terminals 106 and 107. Change is inevitable. In particular, when a module having a large gain is used, oscillation may occur due to feedback between the terminals 106 and 107 and the cavities 104A and 104B, and the function of the module may be impaired. In addition, in order to increase the functionality and gain of the HIC 100, it becomes necessary to divide each module and ensure the isolation of each component. Therefore, the size of the metal package 109 is increased accordingly, This also becomes a cause of difficulty in reducing the size and weight of electronic devices to which the HIC 100 is applied.

  From such a point of view, an improvement measure for providing an electrical partition between both terminals 106 and 107 in the metal package 109 to ensure sufficient isolation is considered. Since the structure and improvement work are complicated, an increase in the cost of the HIC 100 is unavoidable and impractical.

  On the other hand, Patent Document 1 discloses an HIC for reducing the number of parts constituting a package and improving the efficiency of assembly work. FIG. 7 is a cross-sectional view illustrating a configuration of a hybrid integrated circuit (HIC 200) described in Patent Document 1. In FIG. As shown in FIG. 1, the HIC 200 described in Patent Document 1 is for electromagnetic shielding between the power supply circuit unit 207 and the pulse transformer unit 202 and the communication control circuit unit 203 on the same surface (one side) of the substrate 201. It is mounted via the metal plate 211 and is entirely housed in the metal container 212. An external connection pin 205 is connected to the opposite side of the substrate 201.

  In addition, Patent Document 2 discloses a connection structure between microwave electronic components that can eliminate electrical interference generated between microwave electronic components. In the connection structure, the output terminal of one microwave electronic component and the input terminal of the other microwave electronic component are connected by a high-frequency transmission line, and the output terminal and the input terminal are connected in an external conductor. A conductive partition plate is provided for containment.

Japanese Utility Model Publication No. 02-127070 JP-A-63-310203

  Incidentally, in the HIC described in Patent Document 1, a plurality of connection terminals are not insulated from each other in the internal space of the sealing container. As is apparent from FIG. Even if 211 is provided, both the external connection pins 205 corresponding to the same connection terminal are disposed in the internal space of the metal container 212, so that the isolation between the two pins 205 is insufficient. Problems similar to those of related technologies occur. In the HIC 200 described in Patent Document 1, the electromagnetic shielding metal plate 211 is used for electromagnetic shielding between the power supply circuit unit 207, the pulse transformer unit 202, and the communication control circuit unit 203. Further, the metal container 212 shown in the HIC 200 is not configured to insulate and support the plurality of connection terminals 6A and 6B unlike the metal package 9 which is a premise of the present invention. As is apparent, the periphery of the external connection pins 205 is not insulated from the external atmosphere.

  Moreover, in the connection structure between the electronic components for microwaves of patent document 2, the conductive partition plate which encloses the output terminal of one microwave electronic component and the input terminal of the other microwave electronic component in an external conductor However, as mentioned in the description of the related art, including the electromagnetic shielding partition plate 211 described in Patent Document 1, the structure and improvement work of the metal package become complicated, so that the cost of the HIC increases. Inevitable and impractical.

  The present invention has been made in view of the above circumstances, and in a configuration including a sealing container that insulates and supports a plurality of connection terminals that are electrically connected to a plurality of modules, isolation between the plurality of connection terminals is achieved. An object of the present invention is to provide a microwave hybrid integrated circuit that can be sufficiently secured.

In order to solve the above-described problems, the present invention provides a module support substrate having a plurality of cavities in which a plurality of modules each composed of a circuit element are sealed, and sealing the module support substrate. The present invention relates to a microwave hybrid integrated circuit including a sealing container that insulates and supports a plurality of connection terminals that are electrically connected to each other, and the connection terminal for input and the connection terminal for output are inserted from the outside, And it is arrange | positioned in the aspect which each edge part exposes to the internal space of the said cavity which is mutually different , It is characterized by the above-mentioned.

According to the microwave hybrid integrated circuit of the present invention, a module support substrate having a plurality of cavities in which a plurality of modules each composed of circuit elements are sealed, and the module support substrate are sealed, and each module is sealed. And a sealing container that insulates and supports a plurality of connection terminals that are electrically connected to each other, wherein the connection terminal for input and the connection terminal for output are penetrated from the outside and are different from each other. Since each end is exposed in the internal space of the cavity, sufficient isolation between the plurality of connection terminals can be ensured.

1 is a plan view showing a configuration of a microwave hybrid integrated circuit according to an embodiment of the present invention. It is AA arrow sectional drawing of FIG. It is process drawing which shows the assembly method of the hybrid integrated circuit in process order. It is process drawing which shows the assembly method of the hybrid integrated circuit in process order. It is a top view which shows the structure of the hybrid integrated circuit produced by related technology. It is BB arrow sectional drawing of FIG. 10 is a cross-sectional view showing a configuration of a hybrid integrated circuit described in Patent Document 1. FIG.

  A module having two cavities 4A and 4B in which two modules 3 each mounted on a circuit board 2 are mounted with individual semiconductor devices or ICs and circuit elements 1 constituting peripheral circuits associated therewith. The support substrate 5 and the module support substrate 5 are sealed, and the input terminal 6 and the output terminal 7 which are two connection terminals electrically connected to each module 3 are respectively connected through the sealing glass 8. In the configuration including the metal package 9 for insulating support, the input terminal 6 and the output terminal 7 are arranged so that the ends thereof are exposed in the internal spaces of the corresponding cavities 4A and 4B of the module support substrate 5, respectively. Both terminals 6 and 7 are insulated from each other in the internal space of the metal package 9.

Embodiment

FIG. 1 is a plan view showing the configuration of a microwave hybrid integrated circuit according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIGS. FIGS. 4D and 4E are process diagrams showing the assembly method of the hybrid integrated circuit in the order of steps.
In the microwave hybrid integrated circuit 20 of this embodiment, as shown in FIGS. 1 and 2, circuit elements 1 constituting individual semiconductor devices or ICs and peripheral circuits associated therewith are mounted on a circuit board 2. The module support substrate 5 having two cavities 4A and 4B to be sealed, and the module support substrate 5 are sealed and electrically connected to each module 3 respectively. A metal package (sealing container) 9 is provided that insulates and supports the input terminal 6 and the output terminal 7 that are individual connection terminals via a sealing glass 8. As the module support substrate 5, for example, a multilayer wiring substrate made of ceramic or the like that is generally excellent in realizing high-density wiring is used.

  The module support substrate 5 is provided with three lateral walls 5A to 5C, and the two cavities 4A and 4B are partitioned. A through-line (feed-through line) 10 is provided at the bottom of only the central lateral wall 5B among the lateral walls 5A to 5C. Here, as will be described later in the assembling method, the bottom surface of the module support substrate 5 is provided with a through hole 15 penetrating into the cavities 4A and 4B in advance, and both terminals are provided in the through hole 15 as described above. 6 and 7 are integrally insulated and supported through the sealing glass 8, and the metal convex part 16 that is integrated with the metal package 9 so as to become a part of the metal package 9 protrudes. Yes. With such a configuration, the input terminal 6 and the output terminal 7 are arranged so that the end portions thereof are exposed in the internal spaces of the corresponding cavities 4 </ b> A and 4 </ b> B of the module support substrate 5. Reference numeral 14 denotes a frame for positioning and fixing the module support board 5 in the internal space of the metal package 9, and reference numeral 17 denotes a relay board arranged on each metal protrusion 16.

  Between the input terminal 6 and one end of one relay board 17, between the other end of one relay board 17 and one end of one circuit board 2, the other end of one circuit board 2, and one end of the penetration line 10 Between the other end of the through line 10 and one end of the other circuit board 2, between the other end of the other circuit board 2 and one end of the other relay board 17, and the other end of the other relay board 17 Bonding wires 11 are connected to a total of six locations between the output terminals 7. The internal spaces of the cavities 4A and 4B are sealed with internal covers 12A and 12B made of an insulating material, respectively, and the internal space of the metal package 9 is sealed with an external cover 13 made of metal. In FIG. 1, the inner covers 12 </ b> A and 12 </ b> B and the outer cover 13 are shown in an opened state for easy understanding of the contents. The inner covers 12A and 12B are for obtaining division of the internal function of the HIC module, which is the original purpose of the cavities 4A and 4B. On the other hand, the external cover 13 is for keeping airtightness in the metal package 9 including the module support substrate 5 composed of a multilayer wiring board or the like. The input terminal 6 and the output terminal 7 are kept airtight by the optimum thickness, diameter, etc. of the sealing glass 8, and without damaging the airtightness of the cavities 4 </ b> A and 4 </ b> B in the module support substrate 5. Transmission of the RF signal can be realized. Further, each internal space is filled with an inert gas such as nitrogen that prevents oxidation of each module 3 in order to maintain the characteristics of the HIC 20 stably.

  In the hybrid integrated circuit 20 having the above-described configuration, the RF signal input from the input terminal 6 is input to one circuit element 1 constituting the module 3 in one cavity 4A via one relay substrate 17, and the through line 10 Is transmitted to the other cavities 4B. The RF signal transmitted in this way is input to the other circuit elements 1 constituting the module 3 in the same manner as the input portion, and is output from the output terminal 7 to the outside of the module 3 via the other relay board 17.

Next, the assembly method of the hybrid integrated circuit 20 according to this embodiment will be described in the order of steps with reference to FIGS.
First, as shown in FIG. 3 (a), a metal that is located inside a metal package 9 surrounded by a frame 14 and in which both terminals 6 and 7 are insulated and supported integrally through a sealing glass 8, respectively. A metal package 9 is prepared in which the protrusions 16 are integrated so as to maintain airtightness. The metal protrusions 16 are integrally formed by cutting or the like when the metal package 9 is formed.

  Next, as shown in FIG. 3B, the module support substrate 5 having two cavities 4A and 4B in the metal package 9 is fixed with an adhesive or the like. As a result, the end of the input terminal 6 is exposed in one cavity 4A, and the end of the output terminal 7 is exposed in the other cavity 4B. Subsequently, one module 3 composed of one circuit element 1 and circuit board 2 is mounted in one cavity 4A of the module support substrate 5, and another circuit element 1 and circuit board 2 are mounted in another cavity 4B. The other module 3 is mounted. Further, the relay substrate 17 is fixed on the metal convex portion 15 with an adhesive or the like.

  Next, as shown in FIG. 3C, between the input terminal 6 and one end of one relay board 17, between the other end of one relay board 17 and one circuit board 2 by a normal wire bonding method. Between one end, between the other end of one circuit board 2 and one end of the through line 10, between the other end of the through line 10 and one end of the other circuit board 2, and the other end of the other circuit board 2 The bonding wires 11 are connected to a total of six locations between one end of the other relay substrate 17 and between the other end of the other relay substrate 17 and the output terminal 7. As a result, an electrical path is formed between the input terminal 6 and the output terminal 7.

  Next, electrical adjustment of each module 3 arranged in each cavity 4A, 4B is performed. For example, when the electrical adjustment of the module 3 in the other cavity 4B is performed, as shown in FIG. 4D, the inside of the one cavity 4A is temporarily closed by the inner cover 12A, and the other cavity is closed. With only 4B open, a signal is sent from the input terminal 6 to the output terminal 7, and the module is electrically adjusted while observing the output signal. Or you may make it adjust by using a measurement probe in the state which opened the internal cover, without sending a signal between both the terminals 6 and 7. FIG. As described above, since the input terminal 6 and the output terminal 7 are not arranged in the same space, electrical adjustment can be performed in a state in which the isolation between the terminals 6 and 7 is sufficiently ensured.

  Next, as shown in FIG. 4 (e), the other cavity 4B is closed by the inner cover 12B, and only one cavity 4A is opened, and the module is electrically adjusted according to the above. When the electrical adjustment is completed, the inner covers 12A and 12B are fixed on the lateral walls 5A to 5C by soldering or the like in an inert gas atmosphere such as nitrogen gas, and the cavities 4A and 4B are sealed. Subsequently, the outer cover 13 is fixed on the frame body 14 by welding or the like in an inert gas atmosphere such as nitrogen gas, and the metal package 9 is sealed, thereby completing the hybrid integrated circuit 20 of FIGS. 1 and 2. To do.

  According to the hybrid integrated circuit 20 of this embodiment assembled as described above, a plurality of connection terminals (input terminal 6 and output terminal 7) conduct microwave signals in the internal space of the sealed container. Since the two terminals 6 and 7 are sufficiently isolated from each other by being arranged so as to be insulated from each other, between the terminals 6 and 7 even before and after the metal package 9 is hermetically sealed by the outer cover 13. The inconvenience that fluctuations in the leakage state of the microwave signal do not occur and the characteristics change greatly is eliminated. Also, based on the fact that sufficient isolation is ensured between the terminals 6 and 7, even when the electrical adjustment of each module 3 is performed, even if the inner cover of the necessary module cavity is opened, Similarly, large changes in characteristics can be avoided.

  In particular, even when a module with a large gain is used, oscillation does not occur due to feedback between the terminals 6 and 7 and the cavities 4A and 4B, and the function of the module can be prevented from being impaired. Even when the HIC 20 is multi-functional and has a high gain, it is not necessary to divide each module, so that the size of the metal package 9 can be kept substantially the same as the related technology. The device can be reduced in size and weight.

As described above, according to the hybrid integrated circuit 20 of this embodiment, the two modules 3 in which the circuit elements 1 constituting the individual semiconductor devices or ICs and the peripheral circuits associated therewith are mounted on the circuit board 2 are provided. The module support board 5 having two cavities 4A and 4B to be sealed, and the input which is the two connection terminals that seal the module support board 5 and are electrically connected to each module 3, respectively. In the configuration including the metal package 9 that insulates and supports the terminal 6 and the output terminal 7 via the sealing glass 8, the input terminal 6 and the output terminal 7 respectively correspond to the corresponding cavities 4 </ b> A and 4 </ b> B of the module support substrate 5. The terminals 6 and 7 are arranged in the internal space of the metal package 9 because their ends are exposed in the internal space. It is insulated.
Therefore, in the configuration including the sealing container that insulates and supports the plurality of connection terminals that are electrically connected to the plurality of modules, sufficient isolation between the plurality of connection terminals can be ensured. Moreover, although the module support board | substrate 5 demonstrated in the example using a multilayer wiring board, it is not restricted to this.

  In this embodiment, an example in which two cavities are provided in the module support substrate 5 has been described as an example, but the number of cavities can be arbitrarily increased according to the function, purpose, application, etc. of the HIC. Further, the position of the through hole 15 provided on the bottom surface of the module support substrate 5 is a position where the end portions of the input terminal 6 and the output terminal 7 can be exposed in the cavities 4A, 4B of the module support substrate 5. You can choose arbitrarily. The number of input terminals 6 and output terminals 7 can be arbitrarily selected as necessary.

  The present invention is not limited to the use for the microwave region, but can be applied to all uses using a digital circuit. In particular, as the number of input / output terminals of the HIC module and the cavity in the module support board increase due to multiple functions and high functions, it becomes necessary to reduce the isolation and signal leakage of each component. The effect is sufficiently exerted by applying the invention.

DESCRIPTION OF SYMBOLS 1 Circuit element 2 Circuit board 3 Module 4A, 4B Cavity 5 Module support board 6 Input terminal (connection terminal)
7 Output terminal (connection terminal)
8 Sealing glass 9 Metal package (sealing container)
DESCRIPTION OF SYMBOLS 10 Through-line 11 Bonding wire 12A, 12B Inner cover 13 Outer cover 14 Frame 15 Hole 16 Metal convex part 17 Relay substrate

Claims (7)

A module support substrate having a plurality of cavities in which a plurality of modules each composed of circuit elements are sealed, and the module support substrate are sealed, and a plurality of connection terminals that are electrically connected to the modules are insulated. A microwave hybrid integrated circuit comprising a supporting sealing container,
The connection terminal for input and the connection terminal for output are arranged from the outside, and arranged in such a manner that the respective end portions are exposed in the internal spaces of the cavities different from each other .
A hybrid integrated circuit for microwaves. It said module supporting substrate, a microwave hybrid integrated circuit according to claim 1, wherein Tei Rukoto is composed of a multilayer wiring board. It said module supporting substrate, a microwave hybrid integrated circuit according to claim 1, wherein the Tei Rukoto composed of ceramic. The sealing container, according to claim 1, 2 or 3 microwave hybrid integrated circuit wherein Tei Rukoto composed of metal. Wherein the internal space of the sealed container, microwave hybrid integrated circuit according to claim 4, wherein Tei Rukoto sealed by the metal cover. Wherein in the internal space and the internal space of the cavity of the sealed container, microwave hybrid integrated circuit according to any one of claims 1 to 5 inert gas, characterized in Tei Rukoto filled. Each of the plurality of connection terminals has a metal convex portion integrally insulated and supported by the sealing container as a part of the sealing container, and the metal convex portion is a bottom surface of the module support substrate. The hybrid integrated circuit for microwaves according to any one of claims 1 to 6 , wherein the hybrid integrated circuit for microwaves is disposed so as to protrude into a through hole provided in a part of the microwave.

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