JPH0732227B2 - Microwave circuit - Google Patents

Description

DETAILED DESCRIPTION [Outline] A ceramic having a multilayer structure in which input / output electrodes are provided on a side wall,
A microwave circuit encapsulating a microwave IC chip, the microwave IC chip and the input / output electrodes, and between the microwave IC chips are connected to each other by strip lines provided on the inner layer surface, respectively. (EN) Provided is a compact microwave circuit which can obtain a characteristic impedance and has a small leakage of a high frequency electromagnetic field.

[Industrial application field]

The present invention relates to improvement of a microwave circuit in which a microwave IC chip is sealed with ceramic.

In recent years, with the progress of integrated circuit technology, amplifiers, mixers,
A small microwave IC chip provided with a unit function such as a voltage controlled oscillator is provided, and a microwave circuit in which these microwave IC chips are connected as desired is used in communication equipment.

[Conventional technology]

FIG. 3 is a cross-sectional view of a conventional microwave circuit, in which microwave IC chips 1A and 1B having different functions are separately packaged in ceramic.

Then, the lower surface of the ceramic package 2 is brought into close contact with the upper surface of the circuit board 6 made of a ceramic substrate, a printed circuit board or the like for mounting.

More specifically, a rectangular ceramic package 2 is provided with a recess having a step on the peripheral edge in the center thereof, and the microwave IC chip is mounted in the recess. In addition, a large number of conductor film patterns radially connected to the side wall surface are formed on the step surface of the recess.

On the other hand, an electrode 4 is formed at a desired position from the side wall to the bottom surface of the ceramic package 2 and is connected to one end of each conductor film pattern.

Further, the terminal of the portion formed on the stepped surface of the conductor film pattern and the circuit pattern of the microwave IC chip (input / output pattern, bias pattern, earth pattern, etc.) are wire-bonded by a connecting wire 5 made of, for example, a gold wire. It is connected.

Further, a cap 3 made of, for example, a metal plate is fixed to the ceramic package 2 to seal the microwave IC chip.

The electrodes 4 of each ceramic package 2 are aligned with the pads 7 formed on the upper surface of the circuit board 6 and fixed by soldering to mount the microwave circuit on the circuit board 6.

The output of the microwave IC chip 1A is output electrode-conductor pattern 8 formed on the circuit board 6-microwave IC chip
It is input to the microwave IC chip 1B via the input electrode on the 1B side.

[Problems to be solved by the invention]

As described above, the conventional microwave circuit is formed on the circuit board 6 by sealing the microwave IC chip in each ceramic package 2 and mounting the bottom surface of the ceramic package 2 in close contact with the circuit board 6. The connection is made through the conductor pattern 8 described above.

Therefore, the number of ceramic packages is large, which is an obstacle to miniaturization of the microwave circuit.

Further, there is a problem that a high-frequency electromagnetic field leaks from the conductor film pattern in the ceramic package and the conductor pattern 8 portion of the circuit board 6 and adversely affects other circuits.

Furthermore, it is difficult to make the connection between the conductor pattern 8 and the electrode 4 have a desired impedance, and it is difficult to connect the microwave IC chips with a predetermined characteristic impedance (for example, 50Ω). .

The present invention was created in view of these points.
It is an object of the present invention to provide a compact microwave circuit which has a predetermined characteristic impedance, has a small leakage of high-frequency electromagnetic fields, and is small.

[Means for solving problems]

In order to solve the above problems, the microwave circuit of the present invention is a microwave circuit for inputting and outputting a high-frequency signal through a plurality of microwave IC chips, in which a plurality of recesses are formed in a ceramic package having a ceramic multilayer structure. A plurality of microwave IC chips are respectively mounted in the plurality of recesses, and the plurality of microwave IC chips are connected to each other by a strip line provided on the interior surface of the ceramic multi-layer structure. A ground film is formed on at least a plurality of microwave IC chip mounting surfaces and the interior surface on which the strip line is provided, and the upper, lower, and side portions of the ceramic package, and the upper surface of the plurality of ceramic packages is formed. A plurality of microwave IC chips are individually sealed using a plurality of conductor caps on the grounded film. .

[Action]

According to the above-mentioned means of the present invention, the strip lines 21, 21A
Since the ground film is formed on the upper and lower surfaces and the side surfaces, there is no risk of high-frequency electromagnetic fields leaking, and there is no risk of electromagnetic fields of other circuits entering.

Further, by selecting the line width of the strip line and the dielectric constant of the ceramic package 50, it is easy to obtain a predetermined characteristic impedance.

Furthermore, since a plurality of microwave IC chips are mounted on the same ceramic package 50, the outer dimensions of the ceramic package can be reduced by reducing the mounting interval.

〔Example〕

First, the present invention will be briefly described. As shown in the principle view shown in the plan view of FIG. 1A, the sectional view taken along the chain line AA of FIG. 1B, and the sectional view taken along the chain line BB of FIG.
Is a multilayer structure composed of ceramic substrates 51, 52, 53, 54, and there is a step on the bonding surface between the third layer ceramic substrate 53 and the fourth layer ceramic substrate 5 at a desired location of the ceramic package 50. A recess is provided, and the microwave IC is placed in this recess.
Chip 1 is mounted. Then, strip lines 21, 21A, which are input / output transmission lines, are radially provided on the stepped surface of the recess.

The strip line 21 is connected to the input / output electrode 20 provided from the side wall to the bottom surface of the ceramic package 50, and the strip line 21A is connected to another microwave IC chip (not shown).

Further, a strip line 31, which is a bias transmission line, is formed on the step surface as desired, and the strip lines 21, 21A, 3
A ground film 14 is formed on the entire surface except 1.

Second layer ceramic substrate 52 and third layer ceramic substrate 53
The ground film 13 is provided on the entire surface excluding the portion of the via hole 40 on the bonding surface with, and the ground film is formed on the lower surface of the first-layer ceramic substrate 51, that is, substantially the entire lower surface of the ceramic package 50.
Formed 11.

First layer ceramic substrate 51 and second layer ceramic substrate 52
A strip line 31A connected to the bias electrode 30 is provided at a desired position on the bonding surface of the, and formed on the bonding surface between the third-layer ceramic substrate 53 and the fourth-layer ceramic substrate 54 via the via hole 40. It is connected to the strip line 31.

A ground electrode 10 is provided at a desired position on the side wall of the ceramic package 50, and is connected to the ground films 11, 13, 14 and the ground film 15 formed on the upper surface of the fourth layer ceramic substrate 54, respectively.

The microwave IC chip 1 is mounted in the recess of the ceramic package 50, and the input / output patterns of the microwave IC chip 1 are strip lines 21 and 21A via the connection lines 5, respectively.
Connected to. In addition, the bias pattern of the microwave IC chip 1 is connected to the strip line 31 via another connection line 5.
Connected to. Further, the ground pattern of the microwave IC chip 1 is wire-bonded to the ground film 14 via another connecting wire 5.

The opening surface of the recess is covered with a cap 3 made of a metal plate to seal the microwave IC chip 1.

Hereinafter, the present invention will be described in more detail. The same reference numerals denote the same objects throughout the drawings.

FIG. 2 is a diagram of an embodiment of the present invention, (a) is a plan view before mounting a cap, (b) is a chain line AA shown in (a).
Sectional view of a portion, (c) is a sectional view of a chain line BB shown in (a), (d) is a sectional view of a chain line CC shown in (a), and (e) is shown in (a). It is sectional drawing of a dashed-dotted line DD section.

As shown in FIG. 2A, the rectangular ceramic package 50 has a four-layer structure in which ceramic substrates 51, 52, 53, 54 are laminated.

Each corner of the ceramic package 50 has a third
Square-shaped concave portions 60A, 60B, 60C and 60D having steps are provided on the bonding surface between the layer ceramic substrate 53 and the fourth layer ceramic substrate 54.

On the side wall of the ceramic package 50 on the side of the recesses 60A and 60D, an input electrode 20A is provided facing the recess 60A and an output electrode 20B is provided facing the recess 60D from the side wall to the bottom surface.

In addition, a ground electrode is provided between the input electrode 20A and the output electrode 20B.
10A is provided.

Further, bias electrodes 30A, 30B, 30C, 30D, 30E, 30F and ground electrodes 10B, 10C, 10D are provided at desired positions on the other side walls of the ceramic package 50, respectively.

On the step surface of the recess 60A, a strip line 21 connected to the input electrode 20A provided on the side wall and a strip line 21A connected to the recess 60B are provided. 31 is provided.

On the step surface of the recess 60B, the strip line 21A connected to the recess 60A and the strip line connected to the adjacent recess 60C
21A and is provided. Further, strip lines 31 serving as a bias transmission line are radially provided.

The strip line 21A connected to the recess 60D adjacent to the strip line 21A connected to the recess 60B is provided on the step surface of the recess 60C.
And a strip line 31 serving as a bias transmission line is provided radially.

A strip line 21A connected to the recess 60C and a strip line 21 connected to the output electrode 20B provided on the side wall are provided on the step surface of the recess 60D, and strip lines 31 serving as a bias transmission line are radially provided.

As shown in FIG. 2C, the ground film 14 is formed on the entire bonding surface of the third-layer ceramic substrate 53 and the fourth-layer ceramic substrate 54 except the strip lines 21, 21A and 31. I am doing it.

Further, the ground film 13 is provided on the entire bonding surface between the second-layer ceramic substrate 52 and the third-layer ceramic substrate 53 except the via hole 40, and the lower surface of the first-layer ceramic substrate 51, that is, the ceramic. The ground film 11 is formed on almost the entire lower surface of the package 50.

These ground films 11, 13, 14 and the ground film 15 formed on the upper surface of the fourth-layer ceramic substrate 54 are the ground electrodes 10A, 10A.
It is connected to B, 10C and 10D respectively.

As shown in FIGS. 2 (a), (d), and (e), a strip line 31A connected to the bias electrode 30 is formed at a desired position on the first-layer ceramic substrate 51 and the second-layer ceramic substrate 52.
And is connected to the strip line 31 formed on the boundary surface between the third-layer ceramic substrate 53 and the fourth-layer ceramic substrate 54 through the via hole 40.

The microwave IC chips 1A, 1B, 1C, and 1D have different unit functions, and the microwave IC chip 1A has a concave portion.
60A, microwave IC chip 1B
IC chip 1C is recessed 60C, microwave IC chip 1D is recessed 6
They are mounted on 0D respectively.

The input / output pattern of each microwave IC chip is connected to the strip lines 21 and 21A, which are input / output transmission lines, via the connection line 5. The bias pattern is connected to the strip line 31 via another connection line 5, and the ground pattern is connected via another connection line 5 to the ground film 14.
It is connected to the wire bonding.

Further, a cap 3 made of a metal plate is capped on the opening surface of each of the recesses 60A, 60B, 60C, 60D to seal the microwave IC chip.

Although the illustrated example is a microwave circuit in which four microwave IC chips are packaged in ceramic, the present invention is not limited to four microwave IC chips, and one or a plurality of other microwave IC chips may be used. It goes without saying that it can be applied to each microwave circuit.

〔The invention's effect〕

As described above, the present invention provides a microwave IC chip,
A microwave circuit in which an input / output electrode is provided on a side wall portion, is sealed with a multilayer ceramic package, and a microwave IC chip and an input / output electrode and between microwave IC chips are connected by a strip line, Predetermined characteristic impedance is easily obtained, there is no leakage of high frequency electromagnetic field,
In addition, the microwave circuit is small in size, and has an excellent effect in practical use.

[Brief description of drawings]

FIG. 1 is a diagram showing the principle of the present invention, (a) is a plan view, (b) is a cross-sectional view taken along the chain line A-A shown in (a), and (c) is a cross-sectional view taken along the broken line BB shown in (a). FIG. 2 is a diagram of an embodiment of the present invention, (a) is a plan view before mounting a cap, (b) is a cross-sectional view taken along the chain line AA shown in (a), and (c) is ( a) a chain line BB cross-sectional view, (d) a chain line CC cross-sectional view shown in (a), (e) a chain line DD cross-sectional view shown in (a), and FIG. FIG. In the figure, 1,1A, 1B, 1C, 1D are microwave IC chips, 2,5
0 is a ceramic package, 3 is a cap, 10,10A, 10B,
10C, 10D is a ground electrode, 20 is an input / output electrode, 20A is an input electrode, 20B is an output electrode, 21, 21A, 31, 31A are strip lines,
30,30A, 30B, 30C, 30D, 30E, 30F are bias electrodes, 11,13,1
Reference numerals 4 and 15 denote ground films, respectively.

Claims (1)

[Claims] 1. In a microwave circuit for inputting and outputting a high-frequency signal through a plurality of microwave IC chips, a plurality of recesses are formed in a ceramic package having a ceramic multilayer structure, and the plurality of recesses are provided in the plurality of recesses. Each of the microwave IC chips is mounted, and the plurality of microwave IC chips are connected to each other by a strip line provided on the interior surface of the ceramic multilayer structure, and at least the plurality of interior surfaces of the ceramic multilayer structure are connected. A microwave IC chip mounting surface and an interior surface on which the strip line is provided, and an earth film formed on the upper, lower and side portions of the ceramic package, and an earth film formed on the plurality of ceramic packages. In the above, a plurality of microwave IC chips are individually sealed using a plurality of conductor caps. B-wave circuit.