JP5318615B2 - Electronic component holder and electronic component peeling method - Google Patents

Description

  The present invention relates to an electronic component holder and an electronic component peeling method used when holding, variously processing, transporting, peeling, and the like of electronic components typified by semiconductor chips and semiconductor wafers.

  A conventional electronic component holder is not shown, but it is a stretchable adhesive that covers a hollow holding frame and a hollow portion of the holding frame so that an electronic component represented by a semiconductor chip or a semiconductor wafer can be peeled and held. It is equipped with a holding film, and is used for holding electronic components, various processing, transporting, peeling, and the like (see Patent Document 1). The pressure-sensitive adhesive holding film is formed by laminating a pressure-sensitive adhesive made of gel such as acrylic or silicone on the surface of a film substrate.

  When an electronic component is held by such an electronic component holder, the electronic component may be pressed and held on the surface of the adhesive holding film. On the other hand, when peeling and removing the electronic component from the electronic component holder, the adhesive holding film is vertically stretched (expanded) by pressing a plurality of push-up pins on the back surface of the adhesive holding film from below. The electronic component may be partially peeled from the surface of the holding film, and then the electronic component may be removed from the surface of the adhesive holding film by suction peeling with an adsorption collet.

JP 2004-327801 A

  The conventional electronic component holder is configured as described above, and the adhesive holding film is formed by laminating the adhesive on the film base material, so that the adhesive may remain on the electronic component. is there. Also, since the adhesive holding film is stretched in the vertical direction, there is no major problem when the electronic component is a relatively large semiconductor chip, but when the electronic component is a thin semiconductor chip of 50 μm or less, the semiconductor chip is Risk of damage. Furthermore, it is inappropriate when the electronic component is a semiconductor wafer having a large area.

  The present invention has been made in view of the above, and prevents the adhesive from remaining on the electronic component, and further, the electronic component holder and the peeling of the electronic component that do not cause damage to the thin electronic component due to the stretching of the adhesive holding film. It aims to provide a method.

In order to solve the above-mentioned problems in the present invention, a heat-resistant hollow holding frame and a stretchable flexible adhesive holding that covers the hollow portion of the holding frame and holds a thin electronic component in a peelable manner. A film, and after heat processing the electronic component, by stretching the adhesive holding film in the horizontal direction with a stretching tool, to peel the electronic component from the adhesive holding film,
In consideration of the coefficient of thermal expansion of the adhesive holding film, the peripheral edge of the adhesive holding film is previously stretched and fixed to the holding frame,
An adhesive holding film is formed by blending release particles with a self-adhesive elastomer, the average particle size of the release particles is in the range of 1 μm to the thickness of the elastomer, and the adhesive holding film is used as a holding region for electronic components. And is formed between the periphery of the holding region and the inner peripheral surface of the holding frame, and is partitioned into an extra region that is previously stretched and fixed to the peripheral surface of the holding frame,
A stretching tool is pressed against the holding area of the pressure-sensitive adhesive holding film and fitted into a hollow stretched inner frame that stretches the pressure-sensitive adhesive holding film in the horizontal direction. Consists of a stretching outer frame that regulates stretching of the film,
After heat-processing the electronic component held on the adhesive holding film, the adhesive holding film is sandwiched between the stretching inner frame and the stretching outer frame of the stretching tool, and the surplus area of the adhesive retaining film is stretched and expanded in the horizontal direction. The holding region surface of the holding film is roughened by the protrusion of the release particles, and the electronic component is peeled off .

  The holding frame preferably includes a hollow holding inner frame and a hollow holding outer frame that is detachably fitted to the holding inner frame via the peripheral edge portion of the adhesive holding film.
Moreover, the back surface of the pressure-sensitive adhesive holding film can be formed uneven.

Further, in the present invention, in order to solve the above-mentioned problem , a thin electronic component is held on the adhesive holding film of the electronic component holder according to claim 1, 2, or 3, and the electronic component is heated and processed. An electronic component peeling method for peeling an electronic component from an adhesive holding film by stretching the holding film in a horizontal direction with a stretching tool ,
After heat-processing the electronic component held on the adhesive holding film, the adhesive holding film is sandwiched between the stretching inner frame and the stretching outer frame of the stretching tool, and the excess area of the adhesive retaining film is stretched and expanded in the horizontal direction to hold the adhesive. It is characterized by peeling the electronic component by roughening the surface of the holding region of the film by the protruding protruding particles .

  Here, the holding frame in the claims is preferably a holding inner frame and a holding outer frame, but may be a single frame. The holding frame can be formed in a ring shape, a rectangular frame, a polygonal frame, or the like. The thin electronic component includes at least one semiconductor chip and a semiconductor wafer (φ200 mm, 300 mm, 450 mm type, etc.).

  The surplus area of the adhesive holding film is preferably endless. In addition, the stretching of the adhesive holding film does not ask for uniaxial stretching or biaxial stretching. The stretching means is not particularly limited, but a stretching tool composed of a stretching inner frame and a stretching outer frame is preferable. Furthermore, the electronic component holder according to the present invention can be used for at least holding of an electronic component, various types of processing (for example, room temperature processing, printing processing, heating processing), inspection, conveyance, peeling, and the like. The heat processing includes at least the formation of a laminating adhesive and solder reflow.

  According to the present invention, when removing an electronic component from the electronic component holder, the excess region of the adhesive holding film is stretched in a substantially horizontal direction, and the surface of the adhesive holding film is roughened by the release particles, and the electronic component is removed from the surface. The part may be partially peeled, and then the electronic part may be completely peeled off from the surface of the adhesive holding film.

According to the present invention, since a self-adhesive pressure-sensitive adhesive holding film is used instead of using a pressure-sensitive adhesive laminated film, it is possible to effectively suppress the pressure-sensitive adhesive from remaining in an electronic component. There is an effect. Also, the adhesive holding film is not horizontally pushed up and stretched, but the adhesive holding film is stretched in the horizontal direction. Therefore, in addition to a relatively large semiconductor chip, the electronic component is a small thin semiconductor having an electronic component of 50 μm or less. Even in the case of a chip, there is little risk of damaging the semiconductor chip. In the case where the electronic component is a semiconductor wafer having a large area, the risk of breakage can be similarly suppressed.
Also, considering the coefficient of thermal expansion of the adhesive holding film, the peripheral edge of the adhesive holding film is stretched and fixed in advance to the holding frame, so when the electronic component holder is held and heated, The pressure-sensitive adhesive holding film is thermally expanded and bent, and there is no problem in stretching the pressure-sensitive adhesive holding film in the horizontal direction. In addition, the stretching tool is fitted into a hollow stretched inner frame that is pressed against the pressure-sensitive adhesive holding film to stretch the pressure-sensitive adhesive holding film in the horizontal direction, and the stretched inner frame is fitted via an excess region of the pressure-sensitive adhesive holding film, Therefore, the adhesive holding film can be stretched in the horizontal direction with a simple configuration. Furthermore, since the upper limit value of the average particle size of the release particles is the thickness of the adhesive holding film, it becomes possible to prevent the electronic component from being difficult to adhere as the release particles protrude.

If the holding frame is composed of a hollow holding inner frame and a hollow holding outer frame that is detachably fitted to the holding inner frame via the peripheral edge of the adhesive holding film, the adhesive holding can be performed with a simple configuration. The film can be easily fixed while being stretched, or the adhesive holding film can be quickly removed.
Moreover, if the back surface of the pressure-sensitive adhesive holding film is formed to be uneven, it is possible to appropriately propagate the stretching force from the surplus area of the pressure-sensitive adhesive holding film to the holding area and improve the peelability of the electronic component.

It is a section explanatory view showing typically the use state in the embodiment of the electronic component holder and electronic component peeling method concerning the present invention. It is a section explanatory view showing typically an embodiment of an electronic component holder concerning the present invention. It is plane explanatory drawing which shows typically the adhesion holding film and electronic component in embodiment of the electronic component holder which concerns on this invention. It is plane explanatory drawing which shows typically the adhesion holding film and other electronic component in embodiment of the electronic component holder which concerns on this invention. It is a section explanatory view showing typically a 2nd embodiment of an electronic component holder concerning the present invention, and a peeling method of an electronic component. It is a fragmentary sectional view showing typically a 3rd embodiment of an electronic component holder concerning the present invention, and a peeling method of an electronic component.

  Hereinafter, a preferred embodiment of an electronic component holder according to the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 4, the electronic component holder according to the present embodiment includes a hollow holding frame 1, And a stretchable adhesive holding film 20 that covers the hollow portion of the holding frame 1 and holds the thin electronic component 10 in a peelable manner. The adhesive holding film 20 is horizontally stretched by a stretching tool 30 as a stretching means. By extending and expanding the required number of times, the electronic component 10 is peeled from the surface of the adhesive holding film 20 using the release particles 22 in the adhesive holding film 20.

  As shown in FIGS. 1 and 2, the holding frame 1 is formed into a planar ring shape using a predetermined material having heat resistance. The material of the holding frame 1 is not particularly limited, and examples thereof include glass, stainless steel, PPS, liquid crystal polymer, and thermosetting resin represented by phenol.

  The thin electronic component 10 is not particularly limited as shown in FIGS. 1 to 4, but is a small thin semiconductor chip 11 of, for example, 50 μm or less, or a brittle planar circular semiconductor wafer 12 thinly ground. Is given.

  As shown in FIG. 1, the adhesive holding film 20 is formed into a flexible flat circular thin film by embedding the release particles 22 in a self-adhesive elastomer 21 and is in a state of being tensioned to the holding frame 1. Alternatively, it is fixed in a stretched and expanded state in advance, and the peeling particles 22 partially protrude from the mirror surface during stretching and expansion (see the arrow in FIG. 1) to facilitate peeling of the adhered electronic component 10. It works as follows.

  As shown in FIGS. 1, 3, and 4, the adhesive holding film 20 has a central portion partitioned into a holding region 23 for the electronic component 10, and the periphery of the holding region 23 and the inner peripheral surface of the holding frame 1. Is formed in a surplus area 24, and the peripheral edge portion of the surplus area 24 is fixed to the peripheral surface of the holding frame 1. The method for fixing the adhesive holding film 20 to the holding frame 1 is not particularly limited, and examples thereof include an adhesive, a double-sided adhesive material, a method using rivets, a fitting method, and a sandwiching method.

  However, if the electronic component holder is used in a heating process in the temperature range exceeding 200 ° C, such as the formation of laminated adhesive (DAF) such as epoxy resin or solder reflow, the adhesive strength of the adhesive or double-sided adhesive material Therefore, a method of using rivets, a method of fitting, and a method of clamping are preferable.

  The elastomer 21 of the adhesive holding film 20 includes thermoplastic elastomers and rubbers that are easy to manufacture and inexpensive, and thermoplastic elastomers include olefins, styrenes, urethanes, polyesters, etc. EPDM, silicone rubber, fluorine rubber composition, butyl rubber, butadiene rubber, natural rubber and the like. Among these materials, when the electronic component holder is used in the heating process, it is preferable to select a silicone rubber or a fluororubber composition having excellent heat resistance as the elastomer 21.

  Silicone rubber is classified into an addition reaction type and a condensation reaction type by a curing reaction. This condensation reaction type includes an organic peroxide vulcanization type and a type that condenses by removing water, acetic acid, amines, oximes, and the like. are categorized. The addition reaction type silicone rubber is mainly composed of an organopolysiloxane having an aliphatic unsaturated group, and the organohydrogenpolysiloxane is composed of a crosslinking agent, a catalyst comprising a platinum compound, a reaction inhibitor comprising an acetylene alcohol, and the like. Prepared. In some cases, various additives such as a reinforcing agent made of silicon oxide powder, a heat-resistant agent, a flame retardant, a flow control agent, and an adhesion aid are blended to provide a function. The mixing ratio of these main components, crosslinking agent, catalyst, reaction inhibitor, and various additives can be freely selected. Further, the curing method and curing conditions of the silicone rubber are not particularly limited.

Various types of fluororubber compositions can be used as the first component fluororubber. Specifically, a vinylidene fluoride copolymer, for example, a copolymer of at least one selected from vinylidene fluoride and tetrafluoroethylene and propylene hexafluoride, vinylidene fluoride, tetrafluoroethylene, five Copolymer of at least one selected from propylene fluoride and hexafluoropropylene and a monomer copolymerizable therewith (for example, ether bond to side chain such as trifluoroethylene trifluoromethyl ether) , Olefins such as ethylene, propylene and isobutylene, halogenated olefins such as trifluoroethylene and monochlorotrifluoroethylene, perfluorobutylethylene (C ₄ F ₉ CH═CH ₂ ), perfluorohexaethylene ( _{C 6 F 13 CH = CH 2} ), perfluorooctyl ethylene les Olefins having _{(C 9 F 17 CH = CH} 2) fluorinated alkyl groups such as perfluoro perfluorovinyl ether, alkyl - halogenated ethers such as fluorovinyl ether, ethers such as ethyl vinyl ether) and the like, These can be used alone or in combination of two or more.

  Specific examples of such fluororubbers include DuPont's VITON series, 3M's Florel series, Daikin Industries' Daiel series, JSR / Asahi Glass's Afras series, Asahimont's Technoflon series, Dow Chemical Kalrez or the like can be used. In addition, SIFEL is available as a fluororubber made by Shin-Etsu Chemical Co., Ltd. as a fluororubber that is cured by hydrosilylation reaction by introducing silicon compounds into halogenated ethers such as perfluoroperfluorovinyl ether and alkyl-fluorovinyl ether. It is also possible to do.

  The release particle 22 is not particularly limited, but is an inorganic particle having a low linear expansion coefficient compared to the elastomer 21, particularly a regular / indeterminate particle having a low aspect ratio that contributes to the convenience of removing the electronic component 10. Preferably there is. The release particles 22 may be agglomerated particles in addition to independent particles such as beads. Examples of such release particles 22 include polymer particles such as polyethylene and acrylic, glass particles, silica particles, ceramic particles, carbon particles, and calcium carbonate. Among these, inorganic particles are preferable in consideration of the case where the electronic component holder is used in a high-temperature heating process.

  Regarding the particle size of the release particles 22, that is, the average particle size α, if the average particle size α of the release particles 22 is too small, the stretching expansion stress peels the electronic component 10 when the adhesive holding film 20 is stretched and expanded. It should be noted that it becomes difficult to act as a vector. For example, when the primary particles of the release particles 22 are 0.02 μm silica, highly cohesive silica such as wet silica is dispersed in the silicone rubber in a cloudy state and dispersed as aggregated particles larger than the wavelength of visible light. However, if this is formed into a film, the electronic component 10 can be peeled off by stretching.

  On the other hand, dry silica is dispersed in silicone rubber in a transparent state and dispersed as aggregated particles smaller than the wavelength of visible light. However, when this is formed into a film, the electronic component 10 may be peeled off by stretching. Can not. For these reasons, the average particle diameter α of the release particles 22 needs to be at least 1 μm because the wavelength of visible light is several μm when the electronic component 10 is peeled by stretching.

  About the upper limit of the average particle diameter α of the release particles 22, when the release particles 22 larger than the thickness of the adhesive holding film 20 are blended, the release particles 22 protrude and cannot adhere the electronic component 10. The thickness of the adhesive holding film 20 becomes the upper limit value. That is, since the lower limit of the average particle diameter α of the release particles 22 is 1 μm, the range of the average particle diameter α of the release particles 22 is 1> This is a range represented by a formula of α> t.

  In the case where the adhesive holding film 20 is stretched and expanded as many times as necessary, for example, in the case where the film is stretched and expanded in advance before stretching and extended, the release particles 22 are larger than the thickness of the adhesive holding film 20 at the time of non-stretching expansion. Since the peeling particles 22 protrude and interfere with the adhesion of the electronic component 10, the thickness of the adhesive holding film 20 becomes the upper limit.

  Here, the thickness at the time of non-stretching expansion of the adhesive holding film 20 is t, the adhesive holding film 20 is stretched and expanded in advance to an X times area, and further stretched and expanded to the area of the adhesive holding film 20 to be an electronic component. When 10 is peeled off, the thickness of the stretched and expanded adhesive holding film 20 is t / X. Therefore, in the case where the release particles 22 are not protruded with such a thickness, the range of the average particle diameter α of the release particles 22 is a range represented by a formula of 1> α> t / X.

  In addition, about the matrix in which 1 micrometer or less exfoliation particle 22 is mix | blended with the adhesion holding film 20 from the beginning, 1 micrometer or more exfoliation particle 22 can be mix | blended. For example, a silicone rubber mixed with dry silica is dispersed with a particle shape of visible light or less and hardly propagates peeling due to expansion. However, if peeling particles 22 of 1 μm or more are blended, peeling due to expansion can be propagated. it can. In addition, when the electronic component holder is used in the heating process, it is preferable to refrain from using wet silica because the surface is active and adheres to the electronic component 10 and is difficult to remove.

  The addition amount of the release particles 22 is not particularly limited, but if the addition amount is large, it is difficult to adhere the electronic component 10. For example, when the particle size of the release particles 22 is 1 to 5 μm, it can be added up to about 30 phr, and when the particle size of the release particles 22 is 5 to 20 μm, it can be added up to about 10 phr. Moreover, when the particle size of the peeling particle 22 exceeds 20 micrometers, it can mix | blend to about 5 phr. In any case, if it is less than 0.1 phr, the peeling effect of the electronic component 10 cannot be expected, so 0.1 phr or more is preferable.

  What is necessary is just to determine the adhesive force and peeling force of the adhesive holding | maintenance film 20 with the surface state in the to-be-adhered surface of the electronic component 10. FIG. Further, the peeling force can be adjusted by adjusting the hardness of the electronic component 10 and the smoothness of the adhesive holding film 20.

  As shown in FIG. 1, the stretching tool 30 is in contact with the holding region 23 on the back surface of the pressure-sensitive adhesive holding film 20 so as to stretch the pressure-sensitive adhesive holding film 20 in the horizontal direction. A stretched outer frame 32 that is fitted from the surface side through the surplus region 24 of the adhesive holding film 20 and regulates the stretching of the adhesive holding film 20 is configured. The extending inner frame 31 and the extending outer frame 32 are each formed into a planar ring shape using, for example, the same material as that of the holding frame 1 or nylon resin.

  In the above configuration, when the electronic component 10 is held by the electronic component holder, the electronic component 10 may be pressed and held in the holding region 23 on the surface of the adhesive holding film 20. On the other hand, when peeling and removing the electronic component 10 from the electronic component holder, the adhesive holding film 20 is sandwiched between the stretched inner frame 31 and the stretched outer frame 32 of the stretching tool 30, and the excess of the adhesive retaining film 20 The region 24 is expanded (expanded) in the horizontal direction, and the holding region 23 on the surface of the adhesive holding film 20 is roughened by the protrusion of the release particles 22, and the electronic component 10 is partially peeled from the holding region 23.

  At this time, the adhesive holding film 20 is preferably stretched and expanded equally from the center to a concentric circle from the viewpoint of preventing uneven peeling. Then, the work can be completed by removing the electronic component 10 from the holding region 23 of the adhesive holding film 20 by suction peeling with a suction collet.

  In addition, when the electronic component 10 is held by the electronic component holder and is put into the heating process, first, the adhesive holding film 20 is thermally expanded and loosened with heating, and the adhesive holding film 20 is expressed by Equation 1. Are expanded and expanded in advance to an X-fold area, and fixed to the holding frame 1. When the adhesive holding film 20 is fixed to the holding frame 1 in this way, the electronic component 10 is pressed and held in the holding region 23 of the adhesive holding film 20 at room temperature T1 ° C., and the electronic component 10 is heated at a temperature T2 ° C. higher than room temperature. Is processed.

X ≧ {δ × (T2−T1)} ² (Formula 1)
δ: Linear expansion coefficient of the adhesive holding film

  The preliminary stretching / expansion method is not particularly limited. For example, the adhesive retaining film 20 is stretched in the horizontal direction in advance by a dedicated jig or stretching device in consideration of the thermal expansion coefficient of the adhesive retaining film 20 on the retaining frame 1. For example, a method for expanding and fixing it.

  When the electronic component 10 is subjected to heat treatment, the stretched adhesive holding film 20 is sandwiched between the stretched inner frame 31 and the stretched outer frame 32 of the stretching tool 30, and the surplus region 24 of the adhesive retaining film 20 is further stretched and expanded in the horizontal direction. Then, after the holding area 23 of the adhesive holding film 20 is roughened by the protrusion of the release particles 22 and the electronic component 10 is partially peeled from the holding area 23, the electronic component 10 is adsorbed from the adhesive holding film 20 by an adsorption collet. Remove and remove.

  According to the above configuration, since the self-adhesive pressure-sensitive adhesive holding film 20 is used instead of the pressure-sensitive adhesive laminated film 20, it is possible to effectively prevent and prevent the pressure-sensitive adhesive from remaining in the electronic component 10. can do. Further, the adhesive holding film 20 is not pushed up and stretched in the vertical direction, but is stretched in the horizontal direction, so that the electronic component 10 is 50 μm or less in addition to the relatively large semiconductor chip 11. Even in the case of a small and thin semiconductor chip 11, there is no possibility of damaging the semiconductor chip 11. Similarly, when the electronic component 10 is a semiconductor wafer 12 having a large area, it is possible to suppress and prevent the possibility of breakage.

  Next, FIG. 5 shows a second embodiment of the present invention. In this case, the holding frame 1 includes a hollow holding inner frame 2 and a peripheral portion of the adhesive holding film 20 on the holding inner frame 2. It is made to form from the hollow holding | maintenance outer frame 3 which fits detachably through.

The holding inner frame 2 and the holding outer frame 3 are each formed into a planar ring shape using the same material as the holding frame 1. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.
In this embodiment, the same effect as the above embodiment can be expected, and the adhesive holding film 20 is not riveted but is detachably held between the holding inner frame 2 and the holding outer frame 3. The adhesive holding film 20 can be quickly removed or replaced with a simple configuration.

  Next, FIG. 6 shows a third embodiment of the present invention. In this case, the back surface 25 of the non-adhesive adhesive holding film 20 of the electronic component 10 is formed to be uneven, and the adhesive holding film 20 is stretched and expanded. It is trying to improve the propagating property.

  The method for forming the back surface 25 of the pressure-sensitive adhesive holding film 20 with irregularities is not particularly limited. For example, a method of transferring the irregularities by embossing or a film containing wrinkles (trade name: Mattle Mirror). Etc. are adopted. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the back surface 25 of the adhesive holding film 20 is formed in irregularities to reduce the friction coefficient. For example, the adhesive holding film 20 is sandwiched by the stretching tool 30. Even so, it is possible to prevent a decrease in the propagation property of the stretch expansion of the adhesive holding film 20. Therefore, it is obvious that the stretch expansion can be properly propagated from the surplus area 24 of the adhesive holding film 20 to the holding area 23 to improve the peelability of the electronic component 10. Moreover, when arrange | positioning the holding frame 1 on a base etc., it can also prevent effectively that the back surface 25 of the adhesion holding | maintenance film 20 adheres to a base etc., and obstructs removal.

  The thin electronic component 10 may be a component other than the plurality of semiconductor chips 11 and the semiconductor wafer 12. Moreover, in the said embodiment, although the adhesion holding film 20 was extended | stretched in the horizontal direction with the extending | stretching tool 30, you may extend | stretch in the horizontal direction with another extending | stretching means.

  Embodiments of an electronic component holder and an electronic component peeling method according to the present invention will be described below together with comparative examples.

  First, glass beads which are exfoliated particles having an average particle size of 30 μm in both the A and B liquids of addition reaction type silicone rubber (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-1950) containing dry silica as a filler. 2 phr (Sumitomo 3M, product name: S60) was added and mixed. When the glass beads were added and mixed in this way, the A and B liquids were mixed and the mixed solution was heated to 150 ° C. while being pressed by a press machine to produce a film having a thickness of 30 μm and a diameter of 400 mm in a flat circular shape.

  Next, a mirror surface made of PET having a thickness of 50 μm was superimposed on the surface of the film to transfer the mirror surface, and a roughened PET film was superimposed on the back surface of the film to transfer the rough surface. Once the film has been transferred, the mirror film and the PET film are peeled off, the film is fixed to a stainless steel ring, set in an oven at 200 ° C. for 4 hours, and subjected to secondary vulcanization to form an adhesive holding film. Manufactured. The stainless steel ring had an inner diameter of 38 mm and an outer diameter of 50 mm.

  The produced adhesion-holding film was used for adhesion holding of the semiconductor chip in the heating step of laminating and curing the epoxy resin on the semiconductor chip at 200 ° C. for 1 hour, that is, the DAF formation step. Specifically, the semiconductor chip is adhesively held on the adhesive holding film at 25 ° C., the semiconductor chip and the epoxy resin are laminated at 25 ° C., and the epoxy resin is laminated at 200 ° C. for 1 hour, and then the adhesive is adhered. The semiconductor chip was removed from the holding film at 25 ° C.

The linear expansion coefficient of the silicone rubber adhesive holding film was measured and found to be 2.85 × 10 ⁻⁴ / ° C. in the temperature range of 25 to 200 ° C. When using such a pressure-sensitive adhesive film in the above temperature environment, it is necessary to use the pressure-sensitive adhesive film extended from the above-described formula 1 by 4.99 × 10 ⁻² (4.99%). Therefore, in order to prevent wrinkles from occurring on the adhesive holding film under heating at 200 ° C., the area of the adhesive holding film is 11% (1.10 times) which is the square of 4.99% (1.0499 times). ) It needs to be expanded.

  Next, in order to manufacture an electronic component holder, first, an adhesive holding film is adhesively fixed to a stainless steel preparation ring with an acrylic double-sided tape, and a square with a side of 50 mm is formed at the center of the back surface of the adhesive holding film. I drew it with a magic pen and observed it as a guideline for expansion. The preparation ring had an inner diameter of 325 mm and an outer diameter of 350 mm. Moreover, although the pressure-sensitive adhesive holding film was strained, it was not stretched and expanded.

  When a square was drawn on the adhesive holding film, the peripheral part of the adhesive holding film removed between the holding inner frame and the holding outer frame of the holding frame was sandwiched, and the excess part was cut to manufacture an electronic component holder. The holding inner frame of the holding frame is made of a liquid crystal polymer and has an inner diameter of 227 mm and an outer diameter of 237 mm. The holding outer frame is made of a liquid crystal polymer and has an inner diameter of 247 mm and an outer diameter of 237 mm.

  When only the holding inner frame was pressed against the pressure-sensitive adhesive holding film and expanded, one side of the square extended to 56 mm. In addition, when an electronic component holder was manufactured by sandwiching an adhesive holding film between the holding inner frame and the holding outer frame of the holding frame, one side of the square was extended to 57 mm, and the adhesive holding film was extended 1.25 times. expanded.

  Next, 10 semiconductor chips, which are electronic components, are placed on a smooth stage, an electronic component holder is stacked on the plurality of semiconductor chip pieces, and a roller is pressed against the back surface of the adhesive holding film. A plurality of semiconductor chips were adhered and held on the surface. Each semiconductor chip had a thickness of 100 μm and a size of 3 × 5 mm.

  After a plurality of semiconductor chips are adhered and held on the adhesive holding film, an epoxy resin is laminated and applied to the semiconductor chips, set in a heating furnace at 200 ° C. for 60 minutes and then returned to room temperature, and then left for 30 minutes. The temperature dropped to room temperature. In this state, an attempt was made to pick up the semiconductor chip with vacuum tweezers, but it could not be removed. In addition, no wrinkles were generated in the adhesive holding film, and abnormalities such as disordered arrangement and overlapping of the plurality of semiconductor chips were not confirmed.

  Next, the adhesive holding film of the electronic component holder was sandwiched between the stretched inner frame and the stretched outer frame of the stretching tool, and the surplus area of the adhesive retaining film was stretched and expanded in the horizontal direction, so that a part of the semiconductor chip was lifted. The stretching inner frame of the stretching tool was made of nylon resin, and had a diameter of 195 mm and a diameter of 203 mm. The stretched outer frame was made of nylon resin, and had an inner diameter of 203 mm and an outer diameter of 210 mm.

  When only the stretched inner frame was pressed into contact with the adhesive holding film using a dedicated stage and stretched and expanded, one side of the square extended to 63 mm (area 1.59 times). At this time, since the back surface of the adhesive holding film was rough, there was no frictional resistance against the stretched outer frame, and the adhesive holding film could be smoothly stretched and expanded. When the adhesive holding film was stretched and expanded, the electronic component holder was moved to a predetermined location, and when the semiconductor chip was picked up from the adhesive holding film with vacuum tweezers, it could be safely and reliably removed.

  An adhesion-retaining film having a white color tone was produced from the addition reaction type silicone rubber, and then an electronic component holder was produced in the same manner as in Example 1, and the adhesion-holding film was stretched and expanded by 15%. The addition-reactive silicone rubber is composed of 100 phr of a base compound containing 25% by weight of wet silica (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-153U) and 2.5 phr of a curing agent (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name C-153A). A rubber having a solvent of 0.03 phr (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name CatPL2) and a reaction control agent of 0.25 phr (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-153A) was used. The wet silica was silica having a primary particle size of 0.02 μm and a secondary particle size of 8 μm.

  As in Example 1, a plurality of semiconductor chips are adhered and held on the surface of the adhesive holding film of the electronic component holder, and the adhesive holding film of the electronic component holder is sandwiched between the stretching inner frame and the stretching outer frame of the stretching tool, The adhesive holding film was stretched and expanded in the horizontal direction. When only the stretched inner frame was press-contacted to the adhesive holding film using a dedicated stage and stretched and expanded, one side of the square was stretched to 60 mm (area 1.44 times). At this time, since the back surface of the adhesive holding film was rough, there was no frictional resistance against the stretched outer frame, and the adhesive holding film could be smoothly stretched and expanded.

  Addition-reactive silicone rubber (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-1950) with glass beads (manufactured by Sumitomo 3M Co., Ltd .: trade name iMK30) that are exfoliated particles having an average particle size of 18 μm in both A and B liquids. 1 phr of each was added and mixed, and then an electronic component holder was manufactured in the same manner as in Example 1. The adhesive holding film was not stretched. Similar to Example 1, a plurality of semiconductor chips were temporarily adhered to the surface of the adhesive holding film of the electronic component holder, set in a vacuum chamber and decompressed, and the plurality of semiconductor chips were adhesively held on the surface of the adhesive holding film. .

  As in Example 1, a plurality of semiconductor chips are adhered and held on the surface of the adhesive holding film of the electronic component holder, and the adhesive holding film of the electronic component holder is sandwiched between the stretching inner frame and the stretching outer frame of the stretching tool, The adhesive holding film was stretched and expanded in the horizontal direction. When only the stretched inner frame was press-contacted to the adhesive holding film using a special stage and stretched and expanded, one side of the square was stretched to 55 mm.

  Thereafter, the stretching tool was removed from the adhesive holding film of the electronic component holding tool, and the adhesive holding film was stretched and expanded 20% in the horizontal direction so that one side of the square extended to 60 mm, but the semiconductor chip did not peel off. Furthermore, when the adhesive holding film was stretched and expanded by 30% in the horizontal direction, the adhered semiconductor chip was lifted for the first time and peeled off.

  Addition-reactive silicone rubber (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-1950) with glass beads (manufactured by Sumitomo 3M Co., Ltd .: trade name iMK30) that are exfoliated particles having an average particle size of 18 μm in both A and B liquids. 3 phr of each was added and mixed, and then an electronic component holder was manufactured in the same manner as in Example 1. The adhesive holding film was not stretched. Similar to Example 1, a plurality of semiconductor chips were temporarily adhered to the surface of the adhesive holding film of the electronic component holder, set in a vacuum chamber and decompressed, and the plurality of semiconductor chips were adhesively held on the surface of the adhesive holding film. .

  As in Example 1, a plurality of semiconductor chips are adhesively held on the surface of the adhesive holding film of the electronic component holder, and the adhesive holding film of the electronic component holder is sandwiched between the extending inner frame and the extending outer frame of the extending tool, The holding film was stretched and expanded in the horizontal direction. When only the stretched inner frame was press-contacted to the adhesive holding film using a special stage and stretched and expanded, one side of the square was stretched to 55 mm. Thereafter, the stretching tool was removed from the adhesive holding film of the electronic component holding tool, and the adhesive holding film was stretched and expanded 20% in the horizontal direction so that one side of the square was extended to 60 mm. As a result, the adhered semiconductor chip was lifted and peeled for the first time. .

  Addition-reactive silicone rubber (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-1950) with glass beads (manufactured by Sumitomo 3M Co., Ltd .: trade name iMK30) that are exfoliated particles having an average particle size of 18 μm in both A and B liquids. 5 phr of each was added and mixed, and then an electronic component holder was manufactured in the same manner as in Example 1. The adhesive holding film was not stretched. Similar to Example 1, a plurality of semiconductor chips were temporarily adhered to the surface of the adhesive holding film of the electronic component holder, set in a vacuum chamber and decompressed, and the plurality of semiconductor chips were adhesively held on the surface of the adhesive holding film. .

  As in Example 1, a plurality of semiconductor chips are adhesively held on the surface of the adhesive holding film of the electronic component holder, and the adhesive holding film of the electronic component holder is sandwiched between the extending inner frame and the extending outer frame of the extending tool, The holding film was stretched and expanded in the horizontal direction. Only the stretched inner frame was pressed against the adhesive holding film using a dedicated stage and stretched and expanded by 10%. As a result, one side of the square stretched to 55 mm. At this time, the adhered semiconductor chip was lifted and peeled off.

Comparative example

  A transparent adhesive holding film was produced from the addition reaction type silicone rubber, and then an electronic component holder was produced in the same manner as in Example 1, and the adhesive holding film was stretched and expanded by 15%. The addition reaction type silicone rubber includes silicone rubber added by 30% by weight of dry silica (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-1950A) and silicone rubber added by 30% by weight of dry silica (manufactured by Shin-Etsu Chemical Co., Ltd.). : Brand name KE-1950B) mixed at 1: 1. The dry silica was silica having a primary particle size of 0.02 μm and a secondary particle size of 1 μm or less.

  As in Example 1, the semiconductor chip was picked up from the adhesive holding film with vacuum tweezers, but the average particle size of the silica particles as the release particles was small, and the back surface of the adhesive holding film was not rough. The propagation property of the stretch expansion of the adhesive holding film was lowered, and the semiconductor chip could not be removed safely and reliably.

DESCRIPTION OF SYMBOLS 1 Holding frame 2 Holding inner frame 3 Holding outer frame 10 Electronic component 11 Semiconductor chip 12 Semiconductor wafer 20 Adhesive holding film 21 Elastomer 22 Release particle 23 Holding area 24 Surplus area 25 Back surface 30 Stretching tool (stretching means)
31 Stretched inner frame 32 Stretched outer frame

Claims (4)

A heat-resistant hollow holding frame, and a stretchable flexible adhesive holding film that covers the hollow portion of the holding frame and holds a thin electronic component in a peelable manner , and heat-processed the electronic component After that, by stretching the adhesive holding film in the horizontal direction with a stretching tool, an electronic component holding tool for peeling the electronic component from the adhesive holding film,
In consideration of the coefficient of thermal expansion of the adhesive holding film, the peripheral edge of the adhesive holding film is previously stretched and fixed to the holding frame,
An adhesive holding film is formed by blending release particles with a self-adhesive elastomer, the average particle size of the release particles is in the range of 1 μm to the thickness of the elastomer, and the adhesive holding film is used as a holding region for electronic components. And is formed between the periphery of the holding region and the inner peripheral surface of the holding frame, and is partitioned into an extra region that is previously stretched and fixed to the peripheral surface of the holding frame,
A stretching tool is pressed against the holding area of the pressure-sensitive adhesive holding film and fitted into a hollow stretched inner frame that stretches the pressure-sensitive adhesive holding film in the horizontal direction. Consists of a stretching outer frame that regulates stretching of the film,
After heat-processing the electronic component held on the adhesive holding film, the adhesive holding film is sandwiched between the stretching inner frame and the stretching outer frame of the stretching tool, and the surplus area of the adhesive retaining film is stretched and expanded in the horizontal direction. An electronic component holder characterized in that the holding region surface of the holding film is roughened by protruding protruding particles to peel the electronic component. The electronic component holder according to claim 1, wherein the holding frame includes a hollow holding inner frame and a hollow holding outer frame that is detachably fitted to the holding inner frame via a peripheral edge portion of the adhesive holding film. . The electronic component holder according to claim 1 or 2, wherein the back surface of the pressure-sensitive adhesive holding film is formed to be uneven . The adhesive holding film of the electronic component holder according to claim 1, 2 or 3 holds the thin electronic component, heat-processes the electronic component, and then stretches the adhesive holding film in the horizontal direction with a stretching tool. An electronic component peeling method for peeling an electronic component from an adhesive holding film ,
After heat-processing the electronic component held on the adhesive holding film, the adhesive holding film is sandwiched between the stretching inner frame and the stretching outer frame of the stretching tool, and the excess area of the adhesive retaining film is stretched and expanded in the horizontal direction to hold the adhesive. A method for peeling an electronic component, characterized in that the surface of the film holding region is roughened by protruding protruding particles to peel the electronic component.

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