JP5356842B2 - Light irradiation apparatus and light irradiation method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light irradiation apparatus and method of power saving type, capable of avoiding wasteful light irradiation by uniformizing as much as possible the light volume projected from a light emitting source. <P>SOLUTION: A light irradiation apparatus 10 performs light irradiation to an adhesive sheet S to which a semiconductor wafer W1 is pasted through an optical reactive type adhesive layer SA. It includes a light emitting source 11 extending in planner direction of the surface of the adhesive layer SA, a first condensing means 12 which condenses light from the light emitting source 11 to form line beam P, and a pair of second condensing means 13 which condenses such light that has not been condensed with the first condensing means, to be superposed on the line beam P. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a light irradiation apparatus and a light irradiation method, and more particularly to a light irradiation apparatus and a light irradiation method capable of irradiating light to an adhesive sheet having a photoreactive adhesive layer attached to a semiconductor wafer or the like.

  In a processing apparatus for a semiconductor wafer (hereinafter simply referred to as “wafer”), a protective adhesive sheet is applied to the circuit surface of the wafer to perform back surface grinding, or a dicing tape is applied to a plurality of chips. A process of tidy up is performed. The adhesive sheet used for such treatment employs an ultraviolet curable (photoreactive) adhesive as the adhesive, and after the treatment as described above, the ultraviolet ray (light) is adhered by an ultraviolet irradiation device. By irradiating the adhesive, the adhesive is cured to weaken the adhesive force, and the wafer can be prevented from being broken and easily peeled off.

  As a known ultraviolet irradiation device, as shown in FIG. 5, a configuration including a mercury lamp 30 constituting an ultraviolet light source and a light collecting plate 31 for condensing the light of the mercury lamp 30 is known. The ultraviolet irradiation device irradiates the adhesive sheet S, which mounts the wafer W on the ring frame RF, with ultraviolet rays, thereby causing the adhesive layer of the adhesive sheet S to undergo a curing reaction (for example, see Patent Document 1). ).

JP-A-9-162141

However, the ultraviolet irradiation device as described above has a high amount of light at the central portion of the adhesive sheet S, and the amount of light tends to decrease toward the left and right ends in FIG. This is because a large amount of light leaks outward from both ends of the mercury lamp 30 in the extending direction.
Therefore, as shown in the light amount graph of FIG. 5, when the necessary light amount to the adhesive sheet S corresponding to the end portion of the wafer W is secured, the light amount Q inside the wafer W is wasted power consumption. Inconvenience.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the object thereof is to average the amount of light irradiated from the light emitting source to the irradiated object as much as possible to avoid unnecessary light irradiation. An object of the present invention is to provide a power saving type light irradiation apparatus and light irradiation method.

In order to achieve the above object, the present invention provides a light irradiation apparatus that performs light irradiation on an irradiated object.
A light emitting source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated object, and a predetermined angular range among light emitted in a direction orthogonal to the extending direction of the light emitting source A first condensing unit that condenses light within the surface to form line light on the irradiated surface, and a part of the light that is not collected by the first condensing unit to collect the line light. and a second condensing means for superimposing on said first condensing means and at least one of the second condensing unit, adopts a configuration in which, condensed position is Ru provided adjustably.

Further, the present invention provides a light irradiation apparatus for irradiating light onto an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer, along the adhesive layer at a position facing the adhesive layer. A light emitting source extending in a straight line and a light within a predetermined angle range of light emitted in a direction perpendicular to the extending direction of the light emitting source is condensed to form line light on the adhesive layer. 1 light collecting means, and a second light collecting means for collecting a part of the light not collected by the first light collecting means and superimposing the light on the line light, the second light collecting means the is focused on the line light corresponding to the radial outer peripheral portion of the semiconductor wafer, at least one of the first focusing means and the second focusing means includes a condenser positions Ru provided adjustably, The structure is adopted.

Further, the present invention provides a light irradiation method for irradiating an irradiated object with light, using a light emitting source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated object, Of the light emitted in a direction orthogonal to the extending direction of the source, the light within a predetermined angle range is condensed by the first condensing means to form line light on the irradiated surface, Part of the light that has not been collected by the light collecting means is condensed by the second light collecting means and superimposed on the line light, and at least one of the first light collecting means and the second light collecting means is collected . We light irradiation by adjusting the focusing position, adopt a method called.

Furthermore, the present invention provides a light irradiation method in which light irradiation is performed on an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer, and the adhesive layer is positioned along the adhesive layer at a position facing the adhesive layer. A light source extending in a straight line is used, and light within a predetermined angle range is collected by the first light collecting means among the light emitted in a direction orthogonal to the extending direction of the light source. Line light is formed, a part of the light that has not been collected by the first light collecting means is condensed by the second light collecting means and superimposed on the line light, and the second light collecting means method wherein is focused on the corresponding line light radially outer peripheral portion of the semiconductor wafer, you light irradiation by adjusting at least one collection point of the first condenser means and the second focusing means, that It is preferable to adopt.

According to the present invention, by superimposing the line light condensed by the second light collecting means on the line light condensed by the first light collecting means, the area where the light quantity tends to be insufficient only by the first light collecting means. Can supplement the light. As a result, as in the conventional example, when the necessary light amount to the adhesive sheet S corresponding to the end portion of the wafer W is secured, it is possible to keep the wasteful light amount Q at the center portion low.
In particular, when an ultraviolet curable adhesive sheet is affixed to a semiconductor wafer, the adhesive sheet on the outer peripheral side of the semiconductor wafer can be reliably photoreacted without causing damage to the semiconductor wafer. Can be easily and reliably peeled off.
Furthermore, in the case where at least one condensing position of the first condensing means and the second condensing means can be adjusted, it is possible to deal with irradiated objects having different sizes, and the light irradiation apparatus It becomes possible to improve versatility.

The schematic front view of the light irradiation apparatus which concerns on this embodiment. 1 is a schematic perspective view of the light irradiation device of FIG. The partial cross section side view of the light irradiation apparatus of FIG. The schematic front view similar to FIG. 1 which shows a modification. The schematic front view which shows the conventional light irradiation apparatus.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  1 to 3, the light irradiation apparatus 10 has a wafer W1 attached to the inner peripheral side of the ring frame RF via an adhesive sheet S having a photoreactive (ultraviolet curable) adhesive layer SA on the upper surface side. It is configured as a device for irradiating the irradiated object W with light (ultraviolet rays). In the present embodiment, the adhesive sheet S is formed with an adhesive layer SA on one surface of the base sheet, and the adhesive layer SA is an irradiated surface. Note that the adhesive layer SA is not a precise surface, but is a very thin layer, and in the present invention, it will be described as a surface (irradiated surface). Further, the irradiated object W is supported via a support means (not shown), and is provided so as to be relatively movable in the left-right direction in FIG. 3 with respect to a light emitting source 11 and first and second light collecting means 12 and 13 described later. ing.

  The light irradiation device 10 includes a light emission source 11 that emits light below the irradiated object W in FIG. 1, a first light collecting unit 12 that is disposed so as to accommodate the light emission source 11, and a light emission in FIG. A pair of second condensing means 13 disposed on the left and right sides of the source 11 is provided. The light emitting source 11 is disposed so as to extend linearly along the adhesive layer SA at a position facing the adhesive layer SA, and the electrodes 15 are positioned at both left and right ends in FIG.

  The first condensing means 12 is made of a mirror, mirror-finished metal or the like, has a length for accommodating the light emitting source 11, and has a substantially U-shaped shape with an opening width gradually increasing toward the upper side. None, line light P extending in a direction orthogonal to the plane of the paper in FIG. 3 by condensing light within a predetermined angle of light emitted in a direction orthogonal to the extending direction (Y-axis direction) of the light source 11 Are provided. Here, the “predetermined angle range” refers to an angle θ formed by two straight lines connecting the center of the light source 11 and the upper end of the first light collecting unit 12 as shown in FIG. This is the range subtracted from The irradiated object W is configured such that the adhesive layer SA moves relative to the focal point P. The first light condensing means 12 is provided so that the light condensing position can be adjusted via an adjusting means (not shown), whereby the width of the line light P in the left-right direction in FIG. 3 can be changed. ing.

  The second condensing means 13 is made of a mirror, mirror-finished metal, or the like, and is provided in a substantially U-shape having an open side in a direction facing each other and an open width gradually increasing. As shown in FIG. 1, the second light collecting means 13 is provided on the left and right sides of the first light collecting means 12, and collects a part of the light that is not collected by the first light collecting means 12. An effect of superimposing on the line light P is achieved. In the present embodiment, although not particularly limited, each of the second light condensing means 13 is provided in a curved shape so that the lower end sides approach each other. Note that the second light collecting means 13 on the right side in FIG. 1 condenses the light on the line light corresponding to the adhesive sheet S portion attached to the left outer peripheral region of the wafer W1, while the second light collecting means on the left side. Reference numeral 13 is configured to condense light onto the line light corresponding to the adhesive sheet S portion attached to the right outer peripheral region of the wafer W1. Each of the second light condensing means 13 is provided so that the light condensing position can be adjusted via an adjusting means (not shown), so that even if the size of the wafer W1 changes variously, the size can be accommodated. And it is comprised so that light can be condensed to an appropriate part.

  In addition, the light irradiation apparatus 10 and the support means (not shown) for supporting the irradiation object W are disposed in a predetermined case capable of forming an inert gas atmosphere such as nitrogen gas, and thereby, oxygen contained in the atmosphere. The curing inhibition can be prevented in advance.

  Light irradiation to the adhesive sheet S by the light irradiation device 10 is performed by a support means (not shown) that supports the irradiated object W moving in the direction of arrow A in FIG. Is called. At this time, the adhesive layer SA is transported on the virtual plane T shown in FIG. When the irradiated object W passes over the light emitting source 11, the line light P scans the adhesive sheet S from the lower surface side, whereby the adhesive layer SA of the adhesive sheet S is photocured. At this time, the second light condensing means 13 irradiates a portion where the light amount tends to be relatively insufficient, that is, the adhesive sheet S portion corresponding to the outer peripheral portion of the wafer W1, so that it is shown in FIG. As described above, as a result of the light amount difference being small with respect to the light amount in the central portion, it is possible to obtain a sufficient light amount for photocuring the adhesive layer SA even if the supply power is reduced as a whole.

  Therefore, according to such an embodiment, the light leakage of the light source 11 can be used effectively, the power supplied to the light irradiation device 10 can be reduced, and the adhesive sheet S corresponding to the wafer W1 can be reduced. The adhesive sheet S can be easily and reliably peeled off by irradiating the entire region with a necessary amount of ultraviolet rays.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

For example, the relative position of each part constituting the light irradiation apparatus 10 according to the present invention, that is, the layout is not limited to the illustrated configuration example, and the position can be changed vertically or horizontally. Accordingly, the term indicating the direction can be the lower surface, the lower portion, the upper and lower sides, and the like by changing the layout of each part of the apparatus, and these changed modes are included as equivalent to the present invention.
Furthermore, as shown in FIG. 4, the second light collecting means 13 may be divided into a plurality of divided types, and they can be individually adjusted. Moreover, the 2nd condensing means 13 can also be integrally provided in the length direction both ends of the 1st condensing means.
Further, as the light source constituting the light source 11, adoption of a mercury lamp, a halogen lamp, a fluorescent lamp, a metal halide lamp, a light emitting diode or the like is not hindered.

  Further, the irradiated object W is not limited to the one having the above configuration, and the wafer W1 may be a silicon wafer or a compound wafer.

DESCRIPTION OF SYMBOLS 10 Light irradiation apparatus 11 Light emission source 12 1st condensing means 13 2nd condensing means P line light S Adhesive sheet SA Adhesive layer (irradiation surface)
W Object to be irradiated W1 Semiconductor wafer

Claims (4)

In the light irradiation device for irradiating the irradiated object with light,
A light source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated body;
First condensing means for condensing light within a predetermined angle range of light emitted in a direction perpendicular to the extending direction of the light emitting source to form line light on the irradiated surface;
Condenses a portion of the light which has not been condensed in the first condensing means and a second condensing means for superimposing on said line light,
At least one of said 1st condensing means and 2nd condensing means is provided so that a condensing position can be adjusted, The light irradiation apparatus characterized by the above-mentioned. In a light irradiation device that performs light irradiation on an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer,
A light emitting source extending linearly along the adhesive layer at a position facing the adhesive layer;
First condensing means for condensing light within a predetermined angle range of light emitted in a direction perpendicular to the extending direction of the light emitting source to form line light on the adhesive layer;
A second condensing unit that condenses a part of the light not collected by the first condensing unit and superimposes the light on the line light;
The second condensing means condenses on the line light corresponding to the radially outer peripheral portion of the semiconductor wafer ,
At least one of said 1st condensing means and 2nd condensing means is provided so that a condensing position can be adjusted, The light irradiation apparatus characterized by the above-mentioned . In the light irradiation method of irradiating the irradiated object with light,
Using a light emitting source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated body,
Of the light emitted in a direction perpendicular to the extending direction of the light emitting source, the light within a predetermined angle range is condensed by the first condensing means to form line light on the irradiated surface,
A portion of the light that has not been collected by the first light collecting means is condensed by the second light collecting means and superimposed on the line light;
A light irradiating method characterized in that at least one of the first condensing means and the second condensing means is adjusted for light irradiation. In the light irradiation method of performing light irradiation on an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer,
  Using a light emitting source extending linearly along the adhesive layer at a position facing the adhesive layer,
  Of the light emitted in a direction perpendicular to the extending direction of the light emitting source, the light within a predetermined angle range is condensed by the first light collecting means to form line light on the adhesive layer,
  A portion of the light that has not been collected by the first light collecting means is condensed by the second light collecting means and superimposed on the line light,
  The second condensing means condenses on the line light corresponding to the radially outer peripheral portion of the semiconductor wafer,
  A light irradiating method characterized in that at least one of the first condensing means and the second condensing means is adjusted for light irradiation.

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