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JP5364435B2 - Mold for optical elements - Google Patents
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JP5364435B2 - Mold for optical elements - Google Patents

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JP5364435B2
JP5364435B2 JP2009111493A JP2009111493A JP5364435B2 JP 5364435 B2 JP5364435 B2 JP 5364435B2 JP 2009111493 A JP2009111493 A JP 2009111493A JP 2009111493 A JP2009111493 A JP 2009111493A JP 5364435 B2 JP5364435 B2 JP 5364435B2
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optical element
mold
film
trioxide
molding
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JP2010260750A (en
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征史 五十川
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Olympus Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold for an optical element which is excellent in releasability in molding under a high temperature and is long in service life. <P>SOLUTION: The mold 1 for an optical element is used for press-molding an optical element made of glass, wherein the outermost surface layer on at least the molding face of the mold 1 comprises a didysprosium trioxide film 3. By forming the didysprosium trioxide film 3 as the outermost surface of the mold base 2, good releasing property for glass is obtained and degradation caused by oxidation, chemical reaction with glass or diffusion of elements is improved, thereby extending the service life of the mold 1 for an optical element. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は、ガラスからなる光学素子をプレス成形するのに用いられる光学素子用成形型に関する。   The present invention relates to an optical element mold used for press molding an optical element made of glass.

光学ガラス材を加熱し、押圧手段により所望形状にプレス成形して、光学素子とする方法は以前より一般的に知られている。特に、近年は、光学系の高性能化に伴い、非球面形状のみならず自由曲面形状等の複雑な形状の光学素子を大量で安く生産することが望まれている。光学素子を安価に生産するためには、成形型の長寿命化が必須の条件であるが、様々な金属酸化物やアルカリ成分などを含む反応性の高いガラスを高温下で使用するため、型の劣化が激しくなっている。   A method of heating an optical glass material and press-molding it into a desired shape by a pressing means to form an optical element has been generally known. In particular, in recent years, with the improvement in performance of optical systems, it has been desired to produce optical elements having complicated shapes such as free-form surfaces as well as aspherical shapes in large quantities at low cost. In order to produce optical elements at a low cost, it is essential to extend the life of the mold. However, because highly reactive glass containing various metal oxides and alkali components is used at high temperatures, The deterioration of

光学ガラス材をプレス成形する温度は、ガラスの転移点にもよるが、一般的に400℃〜800℃である。この温度での成形では、元素の拡散が生じ易く、特に光学ガラス材に含まれるアルカリ金属等の成分や雰囲気中の酸素分子は化学反応や粒界拡散し易い。そのため型とガラスが接触する成形面の劣化が成形型の寿命を左右しており、これに対抗するため、成形型の表面には硬質膜等の処理が行われている。
従来、このようなガラス成形に用いられる成形型に対しては、特許文献1に記載されるように、型基材の表面にTiN層を形成したり、特許文献2に記載されるように、白金系合金膜を被覆することがなされている。
The temperature at which the optical glass material is press-molded is generally 400 ° C. to 800 ° C., although it depends on the glass transition point. In the molding at this temperature, element diffusion is likely to occur, and in particular, components such as alkali metals contained in the optical glass material and oxygen molecules in the atmosphere easily undergo chemical reaction and grain boundary diffusion. Therefore, the deterioration of the molding surface where the mold and the glass are in contact affects the life of the molding die, and in order to counter this, the surface of the molding die is treated with a hard film or the like.
Conventionally, for a mold used for such glass molding, as described in Patent Document 1, a TiN layer is formed on the surface of a mold substrate, or as described in Patent Document 2, A platinum alloy film is coated.

しかしながら、型基材の表面にTiN層を形成したものは、型温度が高くなると雰囲気中の酸素やガラス中の酸化物からの酸素供給により、TiNが酸化する。特に高温下(例えば、500℃以上)での連続成形においては、酸化の影響によりガラスとの離型性が悪くなり、その結果としてガラスとの融着が生じ、離型性が低下している。   However, in the case where the TiN layer is formed on the surface of the mold base, TiN is oxidized by oxygen supply from oxygen in the atmosphere or oxides in the glass when the mold temperature increases. In particular, in continuous molding at high temperatures (for example, 500 ° C. or higher), the releasability from glass is deteriorated due to the effect of oxidation, and as a result, fusion with the glass occurs and the releasability is reduced. .

一方、白金系合金膜を被覆した型においては、ガラスとの離型性は良好である反面、連続成形においては膜剥離が生じている。白金系合金には酸素やガラス成分元素が粒界拡散により侵入し易く、拡散侵入した成分が中間層や基材の元素と反応して化合物を生成するためである。これにより、白金系合金膜下で反応した化合物成分の反応成長と、ガラス成形時の熱サイクルとにより膜剥離が生じている。   On the other hand, a mold coated with a platinum-based alloy film has good mold releasability from glass, but film peeling occurs in continuous molding. This is because oxygen and glass component elements easily penetrate into the platinum-based alloy due to grain boundary diffusion, and the diffused and penetrated components react with the elements of the intermediate layer and the base material to form a compound. As a result, film peeling occurs due to the reactive growth of the compound components that have reacted under the platinum-based alloy film and the thermal cycle during glass forming.

以上のいずれの従来の成形型においても、連続成形の際には酸素やガラス成分との反応により型が劣化するため、成形型の寿命が非常に短い問題を有しており、この問題を解決するために、特許文献3に示す、型母材の成形面がイリジウム酸化物を主成分とする膜層からなる光学素子用成形型が提案されている。   In any of the above conventional molds, the mold deteriorates due to reaction with oxygen and glass components during continuous molding, so the mold has a very short life, and this problem is solved. In order to achieve this, there has been proposed a mold for an optical element, as shown in Patent Document 3, in which a molding surface of a mold base material is a film layer mainly composed of iridium oxide.

特開昭59−123629号公報JP 59-123629 A 特開昭62−3031号公報JP 62-3031 A 特開2001−89164号公報JP 2001-89164 A

しかしながら、上記特許文献3に示す光学素子用成形型においても、Tg点(ガラス転移点)が高いために成形温度が高い(例えば、800℃以上)例えばランタン系のような硝材を用いる場合には、成形面のイリジウム酸化物が昇華して消耗する恐れがあった。   However, the optical element molding die shown in Patent Document 3 also has a high Tg point (glass transition point) and therefore has a high molding temperature (for example, 800 ° C. or higher), for example, when a glass material such as a lanthanum is used. The iridium oxide on the molding surface may be sublimated and consumed.

本発明はこのような従来の問題点を考慮してなされたものであり、高温下での成形において離型性が良好であり、且つ長寿命の光学素子用成形型を提供することを目的とする。   The present invention has been made in consideration of such conventional problems, and an object thereof is to provide a mold for an optical element that has good releasability in molding at high temperature and has a long life. To do.

上記課題を解決するために、この発明は以下の手段を提案している。
本発明の光学素子用成形型は、ガラスからなる光学素子のプレス成形に用いる光学素子用成形型において、前記光学素子用成形型の少なくとも成形面の最表層が三酸化二ジスプロジウムよりなる膜層からなり、前記最表層の膜層が50nm以上2000nm以下の厚さであることを特徴としている。
なお、三酸化二ジスプロジウムからなる膜層は、製造時に酸化の仕方のバラツキが起こりやすいが、ジスプロジウム原子の酸化数をxとして、+2.5≦x≦+3.5の範囲内であれば良い。また、不可避の微量の不純物は混入しても性能に問題はない。
In order to solve the above problems, the present invention proposes the following means.
The optical element molding die of the present invention is a film layer in which at least the outermost layer of the optical element molding die is made of didysprodium trioxide in the optical element molding die used for press molding of an optical element made of glass. Tona is, is characterized in that the outermost layer of the film layer is a thickness of less than 2000nm or 50nm.
It should be noted that the film layer made of didysprodium trioxide is likely to vary in the way of oxidation during production, but if the oxidation number of the dysprodium atom is x and is within the range of + 2.5 ≦ x ≦ + 3.5 good. In addition, there is no problem in performance even if inevitable trace amounts of impurities are mixed.

ガラス成形においては、主に成形型とガラスが接触する成形面の劣化が寿命を左右する。この発明では、三酸化二ジスプロジウム(Dy23)の作用に着目し、成形型の少なくとも最表層に三酸化二ジスプロジウムよりなる膜層を形成することによって成形型の延命化を図っている。成形型の劣化要因としては、雰囲気中の酸素による型表面の酸化があるが、三酸化二ジスプロジウムは元来安定な酸化物であるため、酸化進行による劣化はない。 In glass molding, the deterioration of the molding surface where the mold and glass are in contact mainly affects the life. In this invention, paying attention to the action of didysprodium trioxide (Dy 2 O 3 ), the life of the mold is extended by forming a film layer made of didysprodium trioxide on at least the outermost layer of the mold. Yes. As a deterioration factor of the mold, there is oxidation of the mold surface by oxygen in the atmosphere. However, since didysprodium trioxide is originally a stable oxide, there is no deterioration due to the progress of oxidation.

従って、この発明の光学素子用成形型によれば、成形型の少なくとも最表層に三酸化二ジスプロジウムよりなる膜層を形成することにより、ガラスの離型性が良く、酸化やガラスとの化学反応や元素拡散に伴う劣化が改善される。従って、成形型の寿命を延ばすことができるとともに、光学素子を安価に提供することが可能となる。
また、融点が約2400℃である三酸化二ジスプロジウムで最表層を形成することで、例えば、1000℃程度という高温下で成形を行うことができる。
Therefore, according to the mold for optical elements of the present invention, by forming a film layer made of didysprodium trioxide on at least the outermost layer of the mold, the releasability of the glass is good, and the chemical reaction with oxidation or glass Deterioration due to reaction and element diffusion is improved. Therefore, the lifetime of the mold can be extended and the optical element can be provided at low cost.
Further, by forming the outermost layer with didysprodium trioxide having a melting point of about 2400 ° C., the molding can be performed at a high temperature of about 1000 ° C., for example.

成形型の成形面の最表層に用いる膜としての三酸化二ジスプロジウムの膜層は、50nm以上の厚さであれば十分にその作用効果を得ることができる。しかし50nm未満の厚さでは、膜厚が結晶粒の大きさと非常に近くなるため、粒子脱落などによる部分欠陥の可能性が大きくなり好ましくない。 Film layer trioxide dysprosium as a membrane used in the outermost layer of the mold of the molding surface, if more than 50nm thick can be obtained sufficiently advantages thereof. However, if the thickness is less than 50 nm, the film thickness becomes very close to the size of the crystal grains, which increases the possibility of partial defects due to particle dropout and the like, which is not preferable.

また、上記の光学素子用成形型において、型母材と前記最表層との間に中間層を備え、前記中間層はタンタル原子を含有し、前記型母材側から前記最表層側に移るに従って、前記中間層中の酸素原子の割合を増加させるように構成されていることがより好ましい。
この発明によれば、中間層により型母材と最表層との密着力を向上させることができる。
Further, in the above optical element molding die, an intermediate layer is provided between the mold base material and the outermost layer, the intermediate layer contains tantalum atoms, and moves from the mold base side to the outermost layer side. More preferably, the intermediate layer is configured to increase the proportion of oxygen atoms.
According to this invention, the adhesive force between the mold base material and the outermost layer can be improved by the intermediate layer.

本発明の光学素子用成形型によれば、高温下での成形における離型性を良好にするとともに、型の寿命を長くすることができる。   According to the optical element molding die of the present invention, it is possible to improve the releasability in molding at a high temperature and to prolong the life of the die.

本発明の第1実施形態の光学素子用成形型の断面図である。It is sectional drawing of the shaping | molding die for optical elements of 1st Embodiment of this invention. 本発明の第2実施形態の光学素子用成形型の断面図である。It is sectional drawing of the shaping | molding die for optical elements of 2nd Embodiment of this invention.

(第1実施形態)
以下、本発明に係る光学素子用成形型の第1実施形態を、図1を参照しながら説明する。
光学素子用成形型1の型母材2は、所望の最終製品に対応した形状と概略近い形状に加工した後、その凹型の成形部表面2aをダイヤモンド砥石を用いた研削加工により所望の最終形状に対応した形状に加工し、その後、鏡面研磨を施して作製される。
(First embodiment)
Hereinafter, a first embodiment of an optical element molding die according to the present invention will be described with reference to FIG.
The mold base material 2 of the optical element mold 1 is processed into a shape substantially similar to the shape corresponding to the desired final product, and then the concave molded portion surface 2a is ground by using a diamond grindstone. It is fabricated by processing into a shape corresponding to the above and then mirror polishing.

次に、真空チャンバー内に、型母材2を設置し、型母材2を200℃に加熱して保温する。そして、真空チャンバー内に酸素ガスを導入して、真空チャンバー内の圧力を10-2Paとした状態で、RFスパッタ法により金属ジスプロジウムターゲットを用いてスパッタを行う。金属ジスプロジウムのスパッタ粒子は、雰囲気の酸素ガスにより酸化され、そのほとんどが安定な三酸化二ジスプロジウム(Dy23)になり、型母材2の成形部表面2aに三酸化二ジスプロジウム膜3を成形する。本実施形態では、型母材2の成形部表面2aに膜層は1つだけ形成されるので、この三酸化二ジスプロジウム膜3が最表層の膜層となると同時に、三酸化二ジスプロジウム膜3の形成後は、この膜の表面が光学素子用成形型1の成形面となる。なお、三酸化二ジスプロジウムの融点は約2400℃であるため、700℃程度の成形温度までは問題なく使用できる。 Next, the mold base material 2 is installed in the vacuum chamber, and the mold base material 2 is heated to 200 ° C. and kept warm. Then, oxygen gas is introduced into the vacuum chamber, and sputtering is performed using a metal dysprodium target by an RF sputtering method in a state where the pressure in the vacuum chamber is 10 −2 Pa. Sputtered particles of metal dysprodium are oxidized by oxygen gas in the atmosphere, most of which becomes stable didysprodium trioxide (Dy 2 O 3 ), and didysprodium trioxide is formed on the molding part surface 2 a of the mold base 2. The membrane 3 is formed. In the present embodiment, since only one film layer is formed on the molding part surface 2a of the mold base material 2, the didysprodium trioxide film 3 becomes the outermost film layer and, at the same time, the didysprodium trioxide film. After the formation of 3, the surface of this film becomes the molding surface of the optical element molding die 1. In addition, since the melting point of didysprodium trioxide is about 2400 ° C., it can be used up to a molding temperature of about 700 ° C. without any problem.

表1に示すように、本実施形態の光学素子用成形型1として、型母材2の材質及び最表層の三酸化二ジスプロジウム膜3の厚さを変えて、試料1〜試料3を製造した。   As shown in Table 1, samples 1 to 3 are manufactured as the optical element molding die 1 of the present embodiment by changing the material of the mold base material 2 and the thickness of the outermost layer of dysprodium trioxide film 3. did.

Figure 0005364435
Figure 0005364435

型母材2の材質として、試料1ではWC(炭化タングステン)、試料2ではランタン系ガラス(Tg点が738℃)、試料3ではSiO2(二酸化ケイ素)を用いた。また、三酸化二ジスプロジウム膜3の厚さは、試料1では50nm、試料2及び試料3では200nmとなっている。
この三酸化二ジスプロジウム膜3の厚さは、50nm以上、2000nm以下であることが好ましい。三酸化二ジスプロジウム膜3の厚さが50nmより薄くなると、膜厚が結晶粒の大きさと非常に近くなるため粒子脱落などによる部分欠陥の可能性が大きくなる。一方、三酸化二ジスプロジウム膜3の厚さが2000nmを超えると、厚くなりすぎて三酸化二ジスプロジウム膜3の強度が低下してしまう。
As the material of the mold base material 2, WC (tungsten carbide) was used in sample 1, lanthanum-based glass (Tg point is 738 ° C.) in sample 2 , and SiO 2 (silicon dioxide) was used in sample 3. The thickness of the didysprodium trioxide film 3 is 50 nm for the sample 1 and 200 nm for the sample 2 and the sample 3.
The thickness of the didysprodium trioxide film 3 is preferably 50 nm or more and 2000 nm or less. If the thickness of the didysprodium trioxide film 3 is less than 50 nm, the film thickness becomes very close to the size of the crystal grains, so that the possibility of partial defects due to particle dropping increases. On the other hand, when the thickness of the didysprodium trioxide film 3 exceeds 2000 nm, the thickness of the didysprodium trioxide film 3 becomes too thick and the strength of the didysprodium trioxide film 3 is lowered.

この光学素子用成形型1を循環式等温成形機に組付け、ランタン系のL−LAH85(オハラ社製)を硝材として用いて、成形温度700℃で光学素子であるガラスのプレス成形試験を行った。
なお、L−LAH85は、Tg点が614℃、At点(ガラス屈伏点)が659℃となっている。
This optical element molding die 1 is assembled in a circulation type isothermal molding machine, and a lanthanum-based L-LAH85 (manufactured by OHARA) is used as a glass material to perform a press molding test of glass as an optical element at a molding temperature of 700 ° C. It was.
Note that L-LAH85 has a Tg point of 614 ° C. and an At point (glass deformation point) of 659 ° C.

光学素子を窒素雰囲気中で成形した結果を表1の成形性の列に示す。
試料1では、光学素子を500ショット成形した時点で三酸化二ジスプロジウム膜3が剥離した。試料2及び試料3では、光学素子を1000ショット成形した時点でも光学素子用成形型1に不具合は無かった。
なお、上記の試験において雰囲気のみを大気中に変え、上記の試料1〜試料3を用いて光学素子を成形した結果も、表1に示す窒素雰囲気中の試験結果と同様の成形性を示した。
The results of molding the optical element in a nitrogen atmosphere are shown in the moldability column of Table 1.
In Sample 1, the didysprodium trioxide film 3 was peeled off when the optical element was molded into 500 shots. In Sample 2 and Sample 3, there was no problem in the optical element mold 1 even when the optical element was 1000 shot-molded.
In the above test, only the atmosphere was changed to the atmosphere, and the result of molding the optical element using the above Sample 1 to Sample 3 also showed the same moldability as the test result in the nitrogen atmosphere shown in Table 1. .

L−LAH85は、加熱されて軟化すると含有成分の一部が揮発するため、一般的に、光学素子の成形時に微量の揮発成分が光学素子用成形型1に付着する。
光学素子用成形型1による成形時に、L−LAH85である硝材と三酸化二ジスプロジウム膜3とが直接接触するが、硝材と三酸化二ジスプロジウム膜3とがどちらも酸化物であるために互いの間で化学結合を起こしにくく、光学素子の焼き付きや、揮発成分の三酸化二ジスプロジウム膜3への堆積が起こらず、光学素子を良好に成形することができることが分かった。
Since L-LAH85 is heated and softened, a part of the contained components volatilizes. Therefore, generally, a small amount of volatile components adhere to the optical element mold 1 during molding of the optical element.
At the time of molding by the optical element molding die 1, the glass material which is L-LAH85 and the didysprodium trioxide film 3 are in direct contact with each other, but both the glass material and the didysprodium trioxide film 3 are oxides. It has been found that chemical bonding is difficult to occur between each other, and the optical element can be satisfactorily molded without causing seizure of the optical element or deposition of volatile components on the didysprodium trioxide film 3.

こうして、本発明の第1実施形態の光学素子用成形型1によれば、型母材2に三酸化二ジスプロジウム膜3を形成し、光学素子用成形型1の成形面の最表層を三酸化二ジスプロジウム膜3にすることにより、ガラスの離型性が良く、酸化やガラスとの化学反応や元素拡散に伴う劣化が改善される。従って、光学素子用成形型1の寿命を延ばすことができるとともに、光学素子を安価に提供することが可能となる。
また、最表層の三酸化二ジスプロジウム膜3を50nm以上の厚さとすることで、十分にその作用効果を得ることができる。しかし50nm未満の厚さでは、膜厚が結晶粒の大きさと非常に近くなるため、粒子脱落などによる部分欠陥の可能性が大きくなり好ましくない。
また、融点が約2400℃である三酸化二ジスプロジウムによる三酸化二ジスプロジウム膜3を最表層に用いることで、高温下で成形を行うことができる。
Thus, according to the optical element molding die 1 of the first embodiment of the present invention, the dysprodium trioxide film 3 is formed on the mold base material 2 and the outermost surface layer of the molding surface of the optical element molding die 1 is divided into three layers. By using the didysprodium oxide film 3, the releasability of the glass is good, and deterioration due to oxidation, chemical reaction with glass, and element diffusion is improved. Therefore, the lifetime of the optical element mold 1 can be extended, and the optical element can be provided at low cost.
Further, by setting the outermost layer of dysprodium trioxide film 3 to a thickness of 50 nm or more, the function and effect can be sufficiently obtained. However, if the thickness is less than 50 nm, the film thickness becomes very close to the size of the crystal grains, which increases the possibility of partial defects due to particle dropout and the like, which is not preferable.
Further, by using the dysprodium trioxide film 3 made of didysprodium trioxide having a melting point of about 2400 ° C. as the outermost layer, molding can be performed at a high temperature.

(第2実施形態)
以下、本発明に係る光学素子用成形型の第2実施形態を、図2を参照しながら説明するが、前記実施形態と同一の部位には同一の符号を付してその説明は省略し、異なる点についてのみ説明する。
本実施形態の光学素子用成形型6には、型母材2と三酸化二ジスプロジウム膜3との間に中間層4が形成されている。そして、表2に示すように、本実施形態の光学素子用成形型6として、型母材2の材質、中間層4の材質、及び最表層の材質と厚さを変えて、試料4〜試料8、比較例1及び比較例2を製造した。
(Second Embodiment)
Hereinafter, the second embodiment of the optical element molding die according to the present invention will be described with reference to FIG. Only the differences will be described.
In the optical element molding die 6 of this embodiment, an intermediate layer 4 is formed between the die base material 2 and the didysprodium trioxide film 3. And as shown in Table 2, as the optical element molding die 6 of this embodiment, the material of the mold base material 2, the material of the intermediate layer 4, and the material and thickness of the outermost layer were changed, and the samples 4 to 4 were changed. 8, Comparative Example 1 and Comparative Example 2 were produced.

Figure 0005364435
Figure 0005364435

試料4〜試料7において、中間層4は厚さ100nmの膜層を4つ重ねた状態に形成され、中間層4全体としての厚さは400nmとなっている。
中間層4は、その全体にタンタル原子を含有しており、中間層4を構成する4つの膜層の中で、最も型母材2側の膜層は金属タンタルで形成され、最も三酸化二ジスプロジウム膜3側の膜層は酸化タンタル(Ta25)で形成されている。そして、中間層4を構成する4つの膜層は、型母材2側から三酸化二ジスプロジウム膜3側に移るに従って、膜層の組成中の酸素原子の割合が一定の割合で増加するように構成されている。すなわち、酸化タンタルの組成中の酸素原子の割合が、(5/7)の式により約71%となるので、型母材2側から2番目の膜層中の酸素原子の割合は約24%、型母材2側から3番目の膜層中の酸素原子の割合は約48%となるように構成した。
このように、試料4〜試料7における中間層4は、4つの膜層により、型母材2側から三酸化二ジスプロジウム膜3側まで組成を4段階に段階的に変化させて形成されている。
また、試料8においては、型母材2側から、三酸化二ジスプロジウム膜3側に移るにしたがって、中間層4中の酸素原子の割合を連続的に0〜71%まで変化させ、中間層4全体の厚さを400nmとした。このように、試料8における中間層4は、組成を連続的に変化させて形成させられている。
また、比較例1における中間層4は厚さ100nmの金属クロムで、比較例2における中間層4は厚さ100nmの金属チタンで、それぞれ形成されている。
In Samples 4 to 7, the intermediate layer 4 is formed in a state where four film layers having a thickness of 100 nm are stacked, and the thickness of the intermediate layer 4 as a whole is 400 nm.
The intermediate layer 4 contains tantalum atoms in its entirety. Among the four film layers constituting the intermediate layer 4, the film layer closest to the mold base material 2 is formed of metal tantalum, and most bismuth trioxide. The film layer on the dysprodium film 3 side is formed of tantalum oxide (Ta 2 O 5 ). In the four film layers constituting the intermediate layer 4, the proportion of oxygen atoms in the composition of the film layer increases at a constant rate as it moves from the mold base 2 side to the didysprodium trioxide film 3 side. It is configured. That is, since the proportion of oxygen atoms in the composition of tantalum oxide is about 71% according to the formula (5/7), the proportion of oxygen atoms in the second film layer from the mold base material 2 side is about 24%. The proportion of oxygen atoms in the third film layer from the mold base material 2 side was configured to be about 48%.
In this manner, the intermediate layer 4 in the samples 4 to 7 is formed by four film layers, with the composition being changed in four steps from the mold base material 2 side to the didysprodium trioxide film 3 side. Yes.
Further, in the sample 8, the oxygen atom ratio in the intermediate layer 4 is continuously changed from 0 to 71% as it moves from the mold base material 2 side to the didysprodium trioxide film 3 side. The total thickness of 4 was 400 nm. Thus, the intermediate layer 4 in the sample 8 is formed by changing the composition continuously.
Further, the intermediate layer 4 in Comparative Example 1 is formed of metal chromium with a thickness of 100 nm, and the intermediate layer 4 in Comparative Example 2 is formed of metal titanium with a thickness of 100 nm.

これらの中間層4は、三酸化二ジスプロジウム膜3等の最表層が形成される前に、真空チャンバー内において形成される。例えば、試料4〜試料7における中間層4は、RFスパッタ法により金属タンタルターゲットを用いて各膜層を形成する毎に真空チャンバー内の酸素ガス濃度を高める、という既知の手法で形成される。   These intermediate layers 4 are formed in a vacuum chamber before the outermost layer such as the didysprodium trioxide film 3 is formed. For example, the intermediate layer 4 in the samples 4 to 7 is formed by a known technique of increasing the oxygen gas concentration in the vacuum chamber every time each film layer is formed using a metal tantalum target by RF sputtering.

上記第1実施形態と同様に、この光学素子用成形型6を循環式等温成形機に組付け、L−LAH85を硝材として用いて光学素子の成形試験を行った。なお、比較例1の最表層は、互いに等しいモル数のIrとPtとで構成された膜層である。
光学素子を窒素雰囲気中で成形した結果を表2の成形性の列に示す。
試料4〜試料7は、三酸化二ジスプロジウム膜3の厚さのみを変えたものである。三酸化二ジスプロジウム膜3の厚さが30nmの試料4では、光学素子を300ショット成形した時点で三酸化二ジスプロジウム膜3が剥離した。そして、三酸化二ジスプロジウム膜3の厚さが50nm、200nm及び500nmの試料5、試料6及び試料7では、光学素子を1000ショット成形した時点でも光学素子用成形型1に不具合は無かった。また、試料8は、中間層4の組成変化を連続的にし、最表層の三酸化二ジスプロジウム膜3の厚さを200nmにしたものであるが、光学素子を1000ショット成形したときにも不具合は無かった。
Similarly to the first embodiment, the optical element molding die 6 was assembled in a circulation type isothermal molding machine, and an optical element molding test was performed using L-LAH85 as a glass material. The outermost layer of Comparative Example 1 is a film layer composed of Ir and Pt having the same number of moles.
The results of molding the optical element in a nitrogen atmosphere are shown in the moldability column of Table 2.
Samples 4 to 7 are obtained by changing only the thickness of the didysprodium trioxide film 3. In the sample 4 in which the thickness of the didysprodium trioxide film 3 was 30 nm, the didysprodium trioxide film 3 was peeled off when 300 shots of the optical element were formed. In Sample 5, Sample 6, and Sample 7 in which the thickness of the didysprodium trioxide film 3 was 50 nm, 200 nm, and 500 nm, there was no problem in the optical element mold 1 even when the optical element was molded into 1000 shots. Sample 8 is obtained by continuously changing the composition of the intermediate layer 4 and setting the thickness of the outermost layer of dysprodium trioxide film 3 to 200 nm. There was no.

一方、中間層4が金属クロムで、最表層が厚さ200nmのIr−Ptで形成された比較例1では、光学素子を100ショット成形した時点から光学素子に焼き付きとクモリが発生してしまい良品が得られなかった。そして、中間層4が金属チタンで、最表層が厚さ100nmのTiNで形成された比較例2では、光学素子を10ショット成形した時点で光学素子に焼き付きとクモリが発生した。
なお、上記試験において雰囲気のみを大気中に変え、上記の試料4〜試料8、比較例1及び比較例2を用いて光学素子を成形した結果も、表2に示す窒素雰囲気中の試験結果と同様の成形性を示した。
On the other hand, in Comparative Example 1 in which the intermediate layer 4 is made of metallic chromium and the outermost layer is made of Ir-Pt having a thickness of 200 nm, the optical element is seized and spoiled from the time when the optical element is molded 100 shots. Was not obtained. In Comparative Example 2 in which the intermediate layer 4 was formed of metal titanium and the outermost layer was formed of TiN having a thickness of 100 nm, the optical element was seized and spoiled when 10 shots of the optical element were formed.
In addition, the result of having shape | molded the optical element using said sample 4-sample 8, the comparative example 1 and the comparative example 2 also changed the atmosphere in air | atmosphere in the said test also with the test result in nitrogen atmosphere shown in Table 2. Similar moldability was exhibited.

試料5の試験結果、及び前記第1実施形態における試料1の試験結果から、型母材2の材質と最表層である三酸化二ジスプロジウム膜3の厚さが同じであっても、型母材2と三酸化二ジスプロジウム膜3との間に、型母材2側の組成が金属タンタルで三酸化二ジスプロジウム膜3側の組成が酸化タンタルという中間層4を設けることで、三酸化二ジスプロジウム膜3が型母材2から剥離し難くなることが分かった。   From the test result of the sample 5 and the test result of the sample 1 in the first embodiment, even if the material of the mold base material 2 and the thickness of the outermost layer of the dysprodium trioxide film 3 are the same, By providing an intermediate layer 4 having a metal tantalum composition on the mold base 2 side and a tantalum trioxide composition on the mold base material 2 side between the material 2 and the didysprodium trioxide film 3, trioxide It was found that the didysprodium film 3 was difficult to peel from the mold base material 2.

こうして、本発明の第2実施形態の光学素子用成形型6によれば、中間層4の型母材2側をWCとの接合が容易な金属タンタルとし、三酸化二ジスプロジウム膜3側を三酸化二ジスプロジウムとの接合が容易な酸化タンタルとしている。このため、前記第1実施形態の効果に加えて、型母材2と三酸化二ジスプロジウム膜3との密着力を向上させることができる。   Thus, according to the mold 6 for an optical element of the second embodiment of the present invention, the mold base 2 side of the intermediate layer 4 is made of metal tantalum that can be easily bonded to WC, and the didysprodium trioxide film 3 side is Tantalum oxide is easy to bond with didysprodium trioxide. For this reason, in addition to the effect of the first embodiment, the adhesion between the mold base material 2 and the didysprodium trioxide film 3 can be improved.

なお、上記実施形態では、試料4ないし試料7の中間層4は4つの膜層からなり、型母材2側から最表層である三酸化二ジスプロジウム膜3側に移るに従って、中間層4中の酸素原子の割合を4段階に増加させるように形成されている。しかし、中間層4は、2層以上で中間層4中における酸素原子の割合を増加させる段階数が2段階以上であれば数に制限はない。また、試料8では、型母材2側から三酸化二ジスプロジウム膜3側に移るに従って、中間層4中における酸素原子の割合が、減少することなく単調に増加するように構成されているが、中間層4内における酸素原子の割合は、型母材2側から三酸化二ジスプロジウム膜3側に向かい単調に増加している必要はなく、酸素原子の割合が一定になる領域があるなどしても良い。
また、上記実施形態では、中間層4は型母材2側から三酸化二ジスプロジウム膜3側に移るに従って、中間層4の組成を金属タンタルから酸化タンタルに変化させた。しかし、中間層4の組成はこの限りでなく、例えば、型母材2側から三酸化二ジスプロジウム膜3側に移るに従って、金属クロムから酸化クロムに、金属チタンから酸化チタンにそれぞれ変化させるように構成しても良い。
In the above embodiment, the intermediate layer 4 of the samples 4 to 7 is composed of four film layers, and the intermediate layer 4 is moved from the mold base material 2 side to the outermost layer of the dysprodium trioxide film 3 side. It is formed so as to increase the proportion of oxygen atoms in four stages. However, the number of intermediate layers 4 is not limited as long as the number of steps is two or more and the number of steps of increasing the proportion of oxygen atoms in the intermediate layer 4 is two or more. Further, the sample 8 is configured such that the proportion of oxygen atoms in the intermediate layer 4 increases monotonously without decreasing as it moves from the mold base 2 side to the didysprodium trioxide film 3 side. The ratio of oxygen atoms in the intermediate layer 4 does not have to increase monotonously from the mold base 2 side toward the didysprodium trioxide film 3 side, and there is a region where the ratio of oxygen atoms is constant. You may do it.
Moreover, in the said embodiment, the composition of the intermediate | middle layer 4 was changed from the metal tantalum to the tantalum oxide as the intermediate | middle layer 4 moved to the dysprodium trioxide film | membrane 3 side from the type | mold base material 2 side. However, the composition of the intermediate layer 4 is not limited to this. For example, the metal chromium is changed from chromium oxide to metal oxide and from titanium metal to titanium oxide as the mold base material 2 side is moved to the didysprodium trioxide film 3 side. You may comprise.

以上、本発明の第1実施形態及び第2実施形態について図面を参照して詳述したが、具体的な構成はこの実施形態に限られるものではなく、本発明の要旨を逸脱しない範囲の構成の変更等も含まれる。
例えば、上記第1実施形態及び第2実施形態では、硝材にランタン系のL−LAH85を用いた。しかし、これに限ることなく、例えば硝材に酸化チタン系のL−TIM28(オハラ社製)を用いることもできる。L−TIM28を用いて上記第1実施形態及び第2実施形態の光学素子用成形型で光学素子の成形試験を行ったところ、表1及び表2に示す試験結果とほぼ同様の結果となった。
As mentioned above, although 1st Embodiment and 2nd Embodiment of this invention were explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The structure of the range which does not deviate from the summary of this invention Changes are also included.
For example, in the first embodiment and the second embodiment, lanthanum-based L-LAH85 is used as the glass material. However, without being limited thereto, for example, titanium oxide-based L-TIM28 (manufactured by OHARA) may be used as the glass material. When an optical element molding test was performed with the optical element molds of the first and second embodiments using L-TIM 28, the test results shown in Tables 1 and 2 were almost the same. .

また、上記第1実施形態及び第2実施形態では、光学素子用成形型の全表面に三酸化二ジスプロジウム膜を形成しても良い。このように構成することで、光学素子用成形型を窒素のような非酸化雰囲気ガスを用いることなく大気中でも使用できるようになるので、光学素子の製造コストを下げることができる。   Moreover, in the said 1st Embodiment and 2nd Embodiment, you may form a didysprodium trioxide film | membrane on the whole surface of the shaping | molding die for optical elements. With this configuration, the optical element molding die can be used in the air without using a non-oxidizing atmosphere gas such as nitrogen, so that the manufacturing cost of the optical element can be reduced.

また、上記第1実施形態及び第2実施形態では、光学素子成形型の成形面に二酸化レニウム膜を用いたが、これに限らず、三酸化二ジスプロジウム膜3をRFスパッタ法により成形した。しかし、三酸化二ジスプロジウム膜3の成形はRFスパッタ法に限ることなく、イオンプレーティング法、アークイオンプレーティング法、反応性プラズマ成膜、酸化ルテニウムをターゲットにした成膜等、三酸化二ジスプロジウムの成膜が可能な手段であれば良い。
また、上記第1実施形態及び第2実施形態における型母材2の材質として、窒化珪素、窒化アルミニウム、アルミナ等を用いても良い。
Moreover, in the said 1st Embodiment and 2nd Embodiment, although the rhenium dioxide film was used for the shaping | molding surface of an optical element shaping | molding die, not only this but the didysprodium trioxide film | membrane 3 was shape | molded by RF sputtering method. However, the formation of the dysprodium trioxide film 3 is not limited to the RF sputtering method, but includes ion plating, arc ion plating, reactive plasma deposition, deposition using ruthenium oxide as a target, and the like. Any means capable of forming dysprodium can be used.
Further, as the material of the mold base material 2 in the first and second embodiments, silicon nitride, aluminum nitride, alumina or the like may be used.

1、6 光学素子用成形型
2 型母材
2a 成形部表面
1, 6 Optical element molding die 2 Mold base material 2a Molded part surface

Claims (2)

ガラスからなる光学素子のプレス成形に用いる光学素子用成形型において、前記光学素子用成形型の少なくとも成形面の最表層が三酸化二ジスプロジウムよりなる膜層からなり、
前記最表層の膜層が50nm以上2000nm以下の厚さであることを特徴とする光学素子用成形型。
In the mold for an optical element used in the press molding of the optical element made of glass, Ri Do from the membrane layer outermost layer is made of trioxide dysprosium at least the molding surface of the mold for the optical element,
The outermost film layer has a thickness of not less than 50 nm and not more than 2000 nm .
型母材と前記最表層との間に中間層を備え、
前記中間層はタンタル原子を含有し、前記型母材側から前記最表層側に移るに従って、前記中間層中の酸素原子の割合を増加させるように構成されていることを特徴とする請求項1記載の光学素子用成形型。
An intermediate layer is provided between the mold base material and the outermost layer,
Claim 1, wherein the intermediate layer contains tantalum atom, according proceeds from the basic material side to the outermost layer side, characterized in that it is configured to increase the proportion of oxygen atoms in the intermediate layer The mold for optical elements described.
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