JP5406088B2 - Manufacturing method of mask for printing - Google Patents

Description

  The present invention relates to a method for manufacturing a printing mask suitable for, for example, screen printing.

  As this type of printing mask, for example, in Patent Document 1, a screen is bonded on a sheet, a resist is applied on the sheet, a desired pattern is formed, and an electrode is exposed on the screen bare from the resist pattern. It is disclosed that a printing mask having a desired pattern can be obtained by forming a deposited metal.

JP-A-51-78406

  In this way, electrodeposition from resist patterning is performed collectively on one substrate, but it is manufactured separately in resist patterning process and electrodeposition process, that is, mesh with resist patterning is prepared However, if it is manufactured by placing it on a substrate and electrodepositing it, the resist patterning step and the electrodeposition step can be performed separately, and thus it is excellent in mass productivity.

  However, when the resist patterning process and the electrodeposition process are performed separately, it is difficult to satisfactorily place the resist formed on the mesh on the substrate. If the substrate and the resist are not in close contact with each other, there is a problem in that an electrodeposited metal wraps around between the substrate and the resist, and an accurate printed pattern cannot be obtained.

  An object of the present invention is to provide a method for manufacturing a printing mask that can improve the adhesion between a substrate and a resist when the substrate and the mesh are overlapped to solve the above-described problems.

  In the present invention, a resist pattern 22 corresponding to a printing pattern is formed on the mesh 5, a mesh 5 on which the resist pattern 22 is formed and the substrate 20 are brought together, and the mesh 5 exposed from the resist pattern 22 by plating. And a step of forming the plating layer 23 and a step of removing the substrate 20. Further, the step of bringing the mesh 5 on which the resist pattern 22 is formed and the substrate 20 together is performed by the magnetic force generation means 6 that generates a magnetic force. Further, the resist pattern 22 is formed to have a thickness larger than that of the mesh 5.

  According to the present invention, since the adhesion between the resist pattern 22 and the substrate 20 is improved, plating can be performed in a good state, and thus the printing mask 1 having a highly accurate printing pattern is obtained. Can do.

It is a perspective view of the mask for printing. It is process explanatory drawing of the manufacturing method of the printing mask which concerns on 1st Example. FIG. 3 is a supplementary explanatory diagram regarding FIG.

  The printing mask of the present invention will be described. The printing mask 1 of the present invention has a large number of openings 2 patterned in a desired printing pattern by plating electroconductive or vapor deposition on a conductive mesh 5. Is stretched in a tensioned state with respect to the frame 4 to obtain a printing plate as shown in FIG. The mesh 5 has conductivity, for example, a type in which fine metal wires such as stainless steel and aluminum are knitted, and a surface woven with resin fibers such as polytetrafluoroethylene, polyethylene, and polyimide is plated to impart conductivity. Or a type in which a metal material such as nickel or copper is directly plated to form a mesh, to which a magnetic material such as iron or nickel is added. Next, a method for manufacturing the printing mask 1 according to this embodiment will be described.

  First, for example, a negative type liquid photoresist is uniformly applied to a thickness of 1 to 50 μm and dried on the surface of the mesh 5 of the above type, or a film-like photoresist having a thickness of 1 to 50 μm is laminated. This photoresist is preferably formed to have a thickness greater than that of the mesh 5. Next, a negative type print pattern film corresponding to the print pattern is brought into close contact with the photoresist, and each process of baking, development and drying is performed to form a desired resist pattern 22 as shown in FIG. . Of course, the photoresist and the printed pattern film may be positive type instead of negative type.

Next, the resist pattern 22 and the substrate 20 are brought into close contact with each other, and the mesh 5 and the substrate 20 are brought close together. As means for bringing the resist pattern 22 and the substrate 20 into close contact with each other, there are various means such as pressure bonding means for pressing and adhering, adhesion means for adhering to each other, and adsorbing means for attracting and adhering to each other. Means for making close contact by magnetic force using means 6 will be described. Specifically, as shown in FIG. 2B, the mesh 5 having the resist pattern 22 is preferably placed on a stainless steel substrate 20 in a tensioned state, and the mesh 5 of the substrate 20 is disposed. A magnet 6 is disposed as a magnetic force generating means 6 on the side opposite to the placed side. As the substrate 20, a conductive substrate or an insulating substrate provided with conductivity is used. Moreover, it is preferable to arrange the magnet 6 so that the outer shape of the mesh 5 is equal to or larger than the outer shape of the mesh 5 so as to face the mesh 5. In this embodiment, the sheet-shaped magnet 6 is adopted. In addition, as shown in FIG. 3, by placing a flat plate jig 25 on the magnet 6 via an elastic mat 26 such as a sponge, the mesh 5 is pressed in the direction of the flat plate jig 25 and tension is applied. It is also possible to set it to a state. Here, the magnetic force may be generated at least at the stage of placing the mesh 5 on the substrate 20 and plating, but the mask may be manufactured under the condition of generating the magnetic force from beginning to end. The magnetic force generating means 6 is not limited to a magnet or an electromagnet. Further, the magnetic force generating means 6 may not be provided separately, and for example, the substrate 20 itself may be magnetic or may be provided with the magnetic force generating means 6.

  Next, a metal such as copper, nickel, nickel-cobalt, etc. is plated, and as shown in FIG. 2C, a plating layer 23 is formed on the substrate 20 and not covered with the resist pattern 22 of the mesh 5. The resist pattern 22 is formed to a thickness of about 1 to 50 μm, which is about the same as or lower than the resist pattern 22. Here, before the plating layer 23 is formed, in order to improve the plating around the mesh 5, it is preferable to perform an activation process on at least the surface of the mesh 5 exposed from the resist pattern 22, for example, FIG. As shown to b), it is good to form the surface plating layer 24, such as nickel and copper, on the mesh 5 surface. Of course, the entire surface of the mesh 5 may be activated, and in that case, it may be performed before the resist pattern 22 is formed on the mesh 5. In the above plating, the outer peripheral portion 5a is not subjected to plating by masking the outer peripheral portion 5a of the mesh 5 between the outer periphery of the plating layer 23 and the frame 4 so as to perform plating. The frame tension tension pressure of the mesh 5 may be kept constant.

  Finally, the magnet 6 is removed, and the substrate 20 and the resist pattern 22 are removed, whereby the printing mask 1 as shown in FIG. 2D is obtained.

In this embodiment, a resist pattern 22 having a thickness approximately the same as the thickness of the mesh 5 may be used. However, the mesh 5 and the resist pattern 22 are made different in thickness, that is, FIG. As shown in FIG. 3, a resist pattern 22 having a thickness larger than that of the mesh 5 may be used so that the resist pattern 22 protrudes from the mesh 5. Thus, the resist pattern 22 can be reliably adhered to the substrate 20, and the former is a surface contact with the mesh 5 while the latter is a local contact with the resist pattern 22. 22 can be firmly attached onto the substrate 20. In addition, since the resist pattern 22 to be in local contact is made of a resin softer than metal, it can be placed on the substrate 20 with good followability. In addition, since the magnet (magnetic force generating means) 6 is arranged, the mesh 5 can be attracted to the substrate 20 side by the magnetic force. As described above, the resist pattern 22 and the substrate 20 can be firmly adhered to each other by the local contact and follow-up effect by the resist pattern 22 and the attracting effect by the magnet (magnetic force generating means) 6. Therefore, it is possible to prevent the penetration and wraparound of the plating between the resist pattern 22 and the substrate 20, so that the printing mask 1 having a printing pattern with high accuracy can be obtained.

  In the present embodiment, the mesh 5 is magnetic. However, the mesh 5 may be non-magnetic. For example, the non-magnetic mesh 5 is disposed on the substrate 20, and the substrate 20 and the mesh 5 are magnetized ( The substrate 20 and the mesh 5 can be brought into close contact with each other by being sandwiched between the magnetic force generating means 6. In this case, if the magnet 6 on the non-magnetic mesh 5 side covers the entire surface of the mesh 5, the plating layer 23 cannot be formed successfully during the subsequent plating, but the magnet 6 is disposed only on the resist pattern 22. If this is done, this can be prevented. Further, a part of the surface of the non-magnetic mesh 5 may be provided with magnetism, and the surface of the non-magnetic mesh 5 exposed from the resist pattern 22 may be magnetized from the state shown in FIG. If the surface covered with the resist pattern 22 of the nonmagnetic mesh 5 is magnetized, the adhesion between the resist pattern 22 and the substrate 20 can be made stronger. It can be. This may be one in which a magnetic material is embedded in the resist pattern 22.

DESCRIPTION OF SYMBOLS 1 Mask for printing 2 Opening 4 Frame 5 Mesh 6 Magnetic force generation means (magnet)
20 Substrate 22 Resist pattern 23 Plating layer

Claims (3)

Forming a resist pattern (22) corresponding to the print pattern on the mesh (5);
Drawing the mesh (5) on which the resist pattern (22) is formed and the substrate (20) together;
Forming a plating layer (23) on the mesh (5) exposed from the resist pattern (22);
And a step of removing the substrate (20).   2. The printing mask according to claim 1, wherein the step of drawing the mesh (5) on which the resist pattern (22) is formed and the substrate (20) is performed by a magnetic force generating means (6) for generating a magnetic force. Manufacturing method.   The method for manufacturing a printing mask according to claim 1 or 2, wherein the thickness of the resist pattern (22) is larger than the thickness of the mesh (5).