JP5777928B2 - Manufacturing method of mask for printing - Google Patents

Description

  The present invention is a printing mask suitably used for various paste printing in an electronic component manufacturing process and various paste printing in a circuit board manufacturing process, in particular, a metal film pattern corresponding to a printing pattern is bonded to a mesh. The present invention relates to a method for manufacturing a printed mask.

  Patent Document 1 (Japanese Patent Laid-Open No. 08-183151) discloses a step of forming a metal film pattern (meaning a metal film corresponding to a printing pattern) on one surface of a base plate by electroforming, and a mesh on the metal film pattern. A step of directly pressing and adhering, a step of bonding at least a metal film pattern and a mesh through a plating film by electrolytic plating, a step of separating the metal film pattern from the base plate by pulling the mesh away from the base plate, A method of manufacturing a printing mask provided with the above is disclosed.

  By the way, in this printing mask manufacturing method, the “step of pressing the mesh directly on the metal film pattern to be in close contact” and the “step of separating the mesh from the base plate by separating the mesh from the base plate” are adopted. Therefore, the following problems occur.

  In other words, in the “step of directly pressing the mesh against the metal film pattern to make it closely contact”, the tension of the mesh itself is increased by the pressing, so that the mesh is stretched. On the other hand, in the “step of separating the metal film pattern from the base plate by separating the mesh from the base plate”, the mesh that has been stretched is restored by its own elasticity, so that the mesh is shrunk.

  In short, since the metal film pattern is bonded to the stretched mesh, when the mesh shrinks, the same shrinkage occurs in the metal film pattern, and the metal film pattern is deformed. Since the metal film pattern formed on one surface of the base plate corresponds to the printing pattern in the first place, if the metal film pattern after being bonded to the mesh is deformed as described above, the deformation is caused by the deformation. The dimensional accuracy and position accuracy of the metal film pattern in the mask are lowered, and the printing accuracy of the printing mask is lowered.

Japanese Patent Laid-Open No. 08-183151

  The objective of this invention is providing the manufacturing method of the mask for printing which can prevent the deformation | transformation which arises in this metal film pattern when joining the metal film pattern corresponding to a printing pattern to a mesh.

In order to achieve the above object, the present invention provides a method for manufacturing a printing mask configured by bonding a metal film pattern corresponding to a printing pattern to a mesh, wherein the bonding of the metal film pattern and the mesh is (1 ) Placing the mesh on the metal film pattern formed on one surface of the base plate; and (2) pressing a pressing member made of a liquid permeable elastic body against the mesh using a support plate. Attaching the mesh to the metal film pattern; (3) joining the metal film pattern and the mesh through a plating film; and (4) separating the pressing member from the mesh; and And separating the metal film pattern from the base plate by separating the plate from the mesh.

  According to the present invention, since the mesh is brought into close contact with the metal film pattern by pressing the pressing member against the mesh placed on the metal film pattern, the mesh is pressed when the pressing member is pressed against the mesh. There is no elongation. That is, since the metal film pattern is bonded to a mesh that does not stretch, the metal film pattern after being bonded to the mesh does not deform as before, and the metal in the printing mask is caused by the deformation. It is possible to prevent the dimensional accuracy and position accuracy of the film pattern from being lowered, and to ensure high printing accuracy for the printing mask.

  In addition, since the pressing member that plays the role of bringing the mesh into close contact with the metal film pattern has liquid permeability, and the fresh plating solution is supplied to the mesh and the metal film pattern through the pressing member, the metal film pattern and the mesh It is possible to satisfactorily form a plating film that joins. In other words, since the plating film can be well formed and the thickness thereof can be made uniform, it is possible to avoid variations in the bonding strength between the metal film pattern and the mesh in the printing mask due to the thickness variation. The printing durability of the mask can be improved.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

FIG. 1 is an explanatory view of an embodiment (a method for producing a printing mask) of the present invention. FIG. 2 is an explanatory view of one embodiment (a method for producing a printing mask) of the present invention. FIG. 3 is an explanatory view of one embodiment (a method for producing a printing mask) of the present invention. FIG. 4 is an explanatory view of one embodiment (a method for producing a printing mask) of the present invention. FIG. 5 is an explanatory view of one embodiment (a method for producing a printing mask) of the present invention. FIG. 6 is an explanatory view of one embodiment (a method for producing a printing mask) of the present invention. FIG. 7 is an explanatory view of an embodiment (a method for producing a printing mask) of the present invention. FIG. 8 is an explanatory view of an embodiment (a method for producing a printing mask) of the present invention. FIG. 9 is an explanatory diagram of one embodiment (a method for producing a printing mask) of the present invention. FIG. 10 is an explanatory diagram of an embodiment (a method for producing a printing mask) of the present invention. FIG. 11 is a cross-sectional view corresponding to FIG. 6 showing a modification of the first unit and the third unit in the embodiment shown in FIGS. FIGS. 12A and 12B are a cross-sectional view corresponding to FIG. 8 and a cross-sectional view corresponding to FIG. 10, showing a second unit modification example in the embodiment shown in FIGS. 1 to 10.

<< One Embodiment of the Present Invention >>
Hereinafter, an embodiment of the present invention (a method for manufacturing a printing mask) will be described with reference to FIGS.

When manufacturing the printing mask MP (see FIG. 10), first,
First unit U1 shown in FIG. 4 (unit in which metal film pattern 13 is formed on the upper surface of base plate 11 by electroforming)
-2nd unit U2 shown in FIG. 4 (unit comprised by affixing the mesh 22 on the lower surface of the frame 21)
-3rd unit U3 shown in FIG. 5 (unit comprised by providing the pressing member 32 in the lower surface of the support plate 31)
Prepare.

<Production method of first unit U1>
When the first unit U1 shown in FIG. 4 is manufactured, as shown in FIG. 1, a base plate 11 having a flat upper surface is prepared, and subsequently, a recess 12a corresponding to the printing pattern is formed on the upper surface of the base plate 11. A resist film pattern 12 having '(which means a patterned resist film) is formed.

  The base plate 11 is made of a conductor such as stainless steel and has a thickness of 5 mm, for example. The resist film pattern 12 ′ is formed by a positive type or negative type photolithography method (including processes for applying a resist agent, exposing, developing, and cleaning), and has a thickness of, for example, 30 μm. Although the recess 12a 'reaches the upper surface of the base plate 11, there is no depression or the like on the upper surface of the base plate 11 that contacts the bottom of the recess 12a'.

  Subsequently, as shown in FIG. 2, the resist film pattern 12 ′ is used to form a metal film pattern 13 (print pattern) on a portion (recess 12 a ′) where the resist film pattern 12 ′ does not exist on the upper surface of the base plate 11. Corresponding metal film).

  The metal film pattern 13 is made of a conductor such as nickel and has a thickness of 20 μm, for example. The metal film pattern 13 is formed by electrolytic plating. The reason why the thickness T13 of the metal film pattern 13 (see FIG. 3A) is smaller than the thickness T12 ′ of the resist film pattern 12 ′ (see FIG. 3A) is that the thickness of the metal film pattern 13 This is a consideration for preventing the metal film pattern 13 from being damaged when the thickness T13 exceeds the thickness T12 ′ of the resist film pattern 12 ′.

  Subsequently, as shown in FIG. 3B, the upper surface of the resist film pattern 12 ′ is polished by a polishing method such as mechanical polishing, and the height T12 ′ of the resist film pattern 12 ′ is set to the height of the metal film pattern 13. The thickness T12 is the same as the thickness T13. As a result, the upper surface of the polished resist film pattern 12 and the upper surface of the metal film pattern 13 are flush with each other and become one surface parallel to the upper surface of the base plate 11.

  In other words, the resist film pattern 12 having the same thickness T12 as the thickness T13 of the metal film pattern 13 is formed on the upper surface of the base plate 11 of the first unit U1 in a portion where the metal film pattern 13 does not exist. Yes.

<Method for Producing Second Unit U2>
When the second unit U2 shown in FIG. 4 is produced, the frame body 21 having an outer shape substantially coincident with the outer shape of the base plate 11 of the first unit U1, and the mesh 22 in a state where tension is applied by a tensioning machine or the like. Then, the outer peripheral portion of the mesh 22 is bonded to the lower surface of the frame body 21.

  The frame body 21 consists of rigid materials, such as aluminum, and the thickness is 10-35 mm, for example. The mesh 22 is a braided metal wire such as a stainless steel wire (see FIG. 8). The wire diameter of the metal wire is, for example, 14 to 30 μm, and the numerical aperture / inch is, for example, 200 to 900. In addition, the mesh 22 is bonded to the lower surface of the frame body 21 with a cyanoacrylate adhesive or the like in a state where there is no looseness or distortion.

  In the drawing, the second unit U2 is shown as a direct attachment type, but a combination tension type, for example, an outer peripheral portion of a non-metal mesh surrounding the metal mesh is bonded to the lower surface of the frame 21 May be the second unit U2.

<Method for Producing Third Unit U3>
When the third unit U3 shown in FIG. 5 is manufactured, the support plate 31 having an outer shape substantially coincident with the outer shape of the frame body 21 of the second unit U2, and the pressing member 32 having an outer shape smaller than the outer shape of the support plate 31. Then, the upper surface of the pressing member 32 is bonded to the center of the lower surface of the support plate 31.

  The support plate 31 is made of a conductor such as stainless steel and has a thickness of 5 mm, for example. The pressing member 32 is made of a liquid-permeable elastic body such as foamed urethane, filter paper, or nonwoven fabric, and has a thickness of, for example, 8 mm. The contour of the lower surface parallel to the lower surface of the support plate 31 is the metal film pattern 13 of the first unit U1. It is larger than the outline. The reason why the pressing member 32 is formed of a liquid-permeable elastic body is consideration for easily performing subsequent pressing and plating film formation.

<Manufacturing method of printing mask MP>
In the manufacture of the printing mask MP, first, as shown in FIG. 4, the lower surface of the mesh 22 of the second unit U2 is placed on the upper surfaces of the resist film pattern 12 and the metal film pattern 13 of the first unit U1. Here, “placement” means “place and place”, and no load other than the weight of the second unit U 2 is applied to the mesh 22.

  Subsequently, as shown in FIG. 5, the lower surface of the pressing member 32 of the third unit U3 covers the upper surface of the metal film pattern 13 of the first unit U1 on the upper surface of the mesh 22 of the second unit U2. Placed on.

  Subsequently, as shown in FIG. 6, the support plate 31 of the third unit U3 is pushed down, and the lower surface thereof is pressed against the upper surface of the mesh 22 of the second unit U2 while compressing the pressing member 32. Is adhered to the upper surface of the metal film pattern 13 of the first unit U1.

  By pressing the lower surface of the pressing member 32 against the upper surface of the mesh 22 placed on the upper surface of the metal film pattern 13, the lower surface of the mesh 22 is brought into close contact with the upper surface of the metal film pattern 13. The mesh 22 does not stretch when pressed against the upper surface of the mesh 22.

  Further, since the upper surface of the metal film pattern 13 is flush with the upper surface of the resist film pattern 12, even when the pressing force of the lower surface of the pressing member 32 against the upper surface of the mesh 22 is large or the rigidity of the mesh 22 is low, the mesh 22 When the lower surface of the metal film pattern 13 is brought into close contact with the upper surface of the metal film pattern 13, distortion based on a step between the upper surface of the metal film pattern 13 and the upper surface of the resist film pattern 12 does not occur in the mesh 22.

  Furthermore, since the pressing member 32 is provided on the lower surface of the support plate 31, the pressing of the lower surface of the pressing member 32 against the upper surface of the mesh 22 can be accurately performed using the support plate 31.

  Furthermore, since the lower surface of the pressed down support plate 31 abuts on the upper surface of the frame body 21, the amount by which the support plate 31 is pressed down can be easily controlled by the distance between the lower surface of the support plate 31 and the upper surface of the frame body 21 before being pressed down. it can.

  Subsequently, the first unit U1, the second unit U2, and the third unit U3 are used with appropriate fasteners (not shown) so that the lower surface of the mesh 22 is held in close contact with the upper surface of the metal film pattern 13. And integrate.

  Subsequently, as shown in FIG. 7, the integrated first unit U1, second unit U2, and third unit U3 are immersed in the plating solution PS in the plating tank PB, and the base plate of the first unit U1. Electrolytic plating is performed using 11 as a cathode and the support plate 31 of the third unit U3 as an anode.

  This electrolytic plating forms a plating film 41 made of nickel or the like. By the electrolytic plating, as shown in FIG. 8, the surface of the mesh 22 and the interface between the metal film pattern 13 and the mesh 22 are formed. A plating film 41 is formed, and the metal film pattern 13 and the mesh 22 are joined via the plating film 41 formed at the interface between the metal film pattern 13 and the mesh 22.

  The thickness of the plating film 41 formed on the surface of the mesh 22 and the interface between the metal film pattern 13 and the mesh 22 varies depending on the electrolytic plating time or the like, but if a thickness of at least 1 μm is obtained, the metal film The pattern 13 and the mesh 22 can be sufficiently joined.

  Further, the pressing member 23 that serves to bring the lower surface of the mesh 22 into close contact with the upper surface of the metal film pattern 13 has liquid permeability, and the fresh plating solution PS passes through the pressing member 23 and the mesh 22 and the metal film pattern 13. Therefore, the plating film 41 that joins the metal film pattern 13 and the mesh 22 can be satisfactorily formed.

  Subsequently, the first unit U1, the second unit U2, and the third unit U3 after the metal film pattern 13 and the mesh 22 are joined via the plating film 41 are taken out from the plating tank PB, and the fasteners are removed. Release the integration.

  Subsequently, as shown in FIG. 9, the support plate 31 of the third unit U3 is moved upward to separate the pressing member 32 from the mesh 22, and the base plate 11 of the first unit U1 is moved downward, or The frame 21 of the second unit U <b> 2 is moved upward to pull the base plate 11 away from the mesh 22.

  When the base plate 11 is pulled away from the mesh 22, the metal film pattern 13 bonded to the mesh 22 is peeled off from the upper surface of the base plate 11, whereby the metal film pattern 13 corresponding to the printing pattern is bonded to the mesh 22. The configured printing mask MP (see FIG. 10) is manufactured.

<Effect obtained by the manufacturing method>
(Effect 1) The lower surface of the mesh 22 is pressed against the upper surface of the metal film pattern 13 by pressing the lower surface of the mesh 22 placed on the upper surface of the metal film pattern 13 while compressing the pressing member 32. Therefore, when the lower surface of the pressing member 32 is pressed against the upper surface of the mesh 22, the mesh 22 does not stretch. In other words, since the metal film pattern 13 is bonded to the mesh 22 where no elongation has occurred, the metal film pattern 13 after being bonded to the mesh 22 is not deformed as before, and printing is caused by the deformation. It is possible to prevent the dimensional accuracy and position accuracy of the metal film pattern 13 in the printing mask MP from being lowered, and to ensure high printing accuracy for the printing mask MP.

  (Effect 2) The pressing member 23 that plays the role of bringing the lower surface of the mesh 22 into close contact with the upper surface of the metal film pattern 13 has liquid permeability, and the fresh plating solution PS passes through the pressing member 23 and the mesh 22 and the metal film. Since it is supplied to the pattern 13, the plating film 41 for joining the metal film pattern 13 and the mesh 22 can be satisfactorily formed. That is, since the plating film 41 can be satisfactorily formed and the thickness thereof can be made uniform, it is possible to avoid variations in the bonding strength between the metal film pattern 13 and the mesh 22 in the printing mask MP due to thickness variations. The printing durability of the printing mask MP can be improved.

  (Effect 3) Since the upper surface of the metal film pattern 13 is flush with the upper surface of the resist film pattern 12, even when the pressing force of the lower surface of the pressing member 32 against the upper surface of the mesh 22 is large or the rigidity of the mesh 22 is low, When the lower surface of the mesh 22 is brought into close contact with the upper surface of the metal film pattern 13, distortion based on the level difference between the upper surface of the metal film pattern 13 and the upper surface of the resist film pattern 12 does not occur in the mesh 22. That is, even if the lower surface of the pressing member 32 is pressed against the upper surface of the mesh 22 placed on the upper surface of the metal film pattern 13, a flat state can be secured to the mesh 22, and therefore the lower surface of the mesh 22 with respect to the upper surface of the metal film pattern 13. The mesh 22 and the metal film pattern 13 can be joined well.

  (Effect 4) Since the pressing member 32 is provided on the lower surface of the support plate 31, it is possible to accurately press the lower surface of the pressing member 32 against the upper surface of the mesh 22 using the support plate 31. That is, the support plate 31 can be configured separately from the pressing member 32 and can be pressed in the same manner. However, when the support plate 31 and the pressing member 32 are integrated, the upper surface of the mesh 22 is pressed. The operation of pressing the lower surface of the member 32 can be easily performed.

  (Effect 5) Since the lower surface of the depressed support plate 31 abuts on the upper surface of the frame body 21, the amount of depression of the support plate 31 can be easily reduced by the distance between the lower surface of the support plate 31 and the upper surface of the frame body 21 before the depression. Can be controlled. That is, the operation of pressing the lower surface of the pressing member 32 against the upper surface of the mesh 22 can be easily performed as compared with the case where the pressing amount of the support plate 31 is controlled while sensing.

  (Effect 6) Since the base plate 11 is used as a cathode when forming the plating film 41 and the support plate 31 is used as an anode when forming the plating film 41, the cathode and anode are formed when the plating film 41 is formed. It is not necessary to arrange separately. Moreover, since the cathode (base plate 11) and the anode (support plate 31) face each other across the region where the plating film 41 is to be formed, the plating film 41 can be formed efficiently.

<< Modification of First Unit U1 and Third Unit U3 >>
<Modification 1>
In the embodiment, the base plate 11 of the first unit U1 is formed from a conductor and the base plate 11 is used as a cathode when forming the plating film 41, and the support plate 31 of the third unit U3 is formed from a conductor. The support plate 31 is used as an anode when forming the plating film 41, but the base plate 11 of the first unit U1 is formed of an insulator and the cathode when forming the plating film 41 is used as the base. You may arrange | position separately on the outer side of the board 11. FIG. Further, the support plate 31 of the third unit U3 may be formed of an insulator, and an anode for forming the plating film 41 may be separately disposed outside the support plate 31.

<Modification 2>
In the embodiment, the base plate 11 of the first unit U1 is formed from a conductor, and the support plate 31 of the third unit U3 is formed from a conductor. However, as shown in FIG. A first unit U1 ′ formed of an insulator such as resin or polyvinyl chloride and provided with an electrode layer 14 made of a conductor such as stainless steel on the upper surface side of the base plate 11 is manufactured. May be used as a cathode when the plating film 41 is formed. Further, a third unit U3 ′ is produced in which the support plate 31 is formed of an insulator such as acrylic resin or polyvinyl chloride, and the electrode layer 33 made of a conductor such as stainless steel is provided on the lower surface side of the support plate 31. The electrode layer 33 may be used as an anode when forming the plating film 41.

  If both the electrode layers 14 and 33 of the aspect shown in FIG. 11 are employ | adopted, the flow of the electric current at the time of forming the plating film 41 is controlled, and formation of the plating film 41 can be performed more efficiently.

<< Modification of Second Unit U2 >>
<Modification 1>
In the above-described embodiment, the mesh 22 of the second unit U2 is shown by knitting metal wires in a lattice shape. However, the mesh 22 may be made by knitting non-metal wires such as plastic wires in a lattice shape. good.

  In this case, since it is difficult to join the metal film pattern 13 and the mesh 22 through the plating film 41 formed at the interface between the metal film pattern 13 and the mesh 22, FIG. As shown in FIG. 5, it is preferable to adjust the electrolytic plating time and the like so that a plating film 41 ′ covering the portion of the mesh 22 located above the metal film pattern 13 is formed. When the plating film 41 ′ shown in FIG. 12A is formed, the metal film pattern 13 bonded to the mesh 22 is peeled off from the upper surface of the base plate 11 by separating the base plate 11 from the mesh 22. Thus, the printing mask MP (see FIG. 12B) configured by joining the metal film pattern 13 corresponding to the printing pattern to the mesh 22 can be manufactured in the same manner as the one embodiment.

<Modification 2>
In the above-described embodiment and Modification 1, the mesh 22 is a metal wire or non-metal wire braided in a lattice shape, but instead of a sheet-like one in which a large number of holes are formed in a predetermined arrangement. You may use for.

  DESCRIPTION OF SYMBOLS 11 ... Base plate, 12 ... Resist film pattern, 13 ... Metal film pattern, 14 ... Electrode layer, 21 ... Frame, 22 ... Mesh, 31 ... Support plate, 32 ... Pressing member, 33 ... Electrode layer, 41, 41 ' ... Plating film, MP ... Printing mask.

Claims (8)

In the manufacturing method of the mask for printing constituted by joining the metal film pattern corresponding to the printing pattern to the mesh,
The metal film pattern and the mesh are joined by (1) placing the mesh on the metal film pattern formed on one surface of the base plate, and (2) transmitting the mesh with the support plate. Pressing the pressing member made of a liquid elastic body while compressing it to make the mesh adhere to the metal film pattern; and (3) joining the metal film pattern and the mesh through a plating film; 4) Pulling the pressing member away from the mesh and separating the metal plate pattern from the base plate by separating the base plate from the mesh.
A method for producing a mask for printing. As the base plate, a resist film pattern having the same thickness as the metal film pattern is formed on a portion of the surface of the base plate where the metal film pattern does not exist,
The method for producing a printing mask according to claim 1. Provided the pressing member on one side of the support plate, performing pressing of the pressing member with the support plate,
The method for producing a printing mask according to claim 1 or 2. The base plate is formed from a conductor, and the base plate is used as a cathode when forming the plating film.
The manufacturing method of the mask for printing of any one of Claims 1-3 characterized by the above-mentioned. The support plate is formed from a conductor, and the support plate is used as an anode when forming the plating film.
The manufacturing method of the mask for printing of any one of Claims 1-4 characterized by the above-mentioned. The base plate is formed from an insulator, and an electrode layer is provided on the one surface side of the base plate, and the electrode layer is used as a cathode when forming the plating film.
The manufacturing method of the mask for printing of any one of Claims 1-3 characterized by the above-mentioned. The support plate is formed of an insulator, and an electrode layer is provided on the one surface side of the support plate, and the electrode layer is used as an anode when forming the plating film.
The method for manufacturing a printing mask according to any one of claims 1 to 3 and 6, wherein: The press mask made of the liquid-permeable elastic body is at least one selected from foamed urethane, filter paper, and non-woven fabric. Method.

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