JP5473641B2 - Laser processing machine - Google Patents

Description

  The present invention relates to a laser processing machine provided with a dust collector.

  Conventionally, a laser beam irradiation device that irradiates a processing region of a plate-like workpiece having at least four sides or more, and a tension device that holds the workpiece while applying a tensile force by two opposing chucks. A moving device that moves the workpiece to form a plurality of machining areas on the workpiece in a state where the workpiece is pulled by the tension device, and is irradiated with laser light from the workpiece A dust collecting device having a size covering the whole of the plurality of processing regions on the back side of the surface to be formed, two holding devices each holding the side of the workpiece in a direction perpendicular to the tensile force; A laser processing apparatus provided with an adjusting device that moves one of the holding devices in a direction perpendicular to the tensile force is disclosed (for example, see Patent Document 1).

  In this laser processing apparatus, when performing non-through-hole processing, a tension device that holds a workpiece while applying a tensile force by two opposite chucks, and the workpiece is pulled by the tension device. A moving device for moving the work piece to form a plurality of work areas on the work piece in a state, and the whole of the plurality of work areas on the back side of the surface irradiated with laser light of the work piece A dust collecting device having a size extending over two sides, two holding devices each holding a side of the workpiece perpendicular to the tensile force, and an adjusting device for moving one of the holding devices in a direction perpendicular to the tensile force Hold the work piece with.

  In addition, when performing through-hole machining, an adsorption device provided with a plurality of adsorption holes for adsorbing workpieces is arranged between the dust collectors, and the gas flow inside the dust collector is stopped by a stop device. The workpiece is held by the suction device, and the workpiece is held by the pulling device and the holding device.

JP 2009-6356 A

  However, according to the above conventional technique, there is a problem that the number of apparatuses for holding the workpiece is large and the configuration of the laser processing apparatus is complicated. Moreover, since there is no dust collector above the workpiece (workpiece), there is a problem that machining dust adheres to the workpiece.

  The present invention has been made in view of the above, and by providing an upper dust collector above the workpiece, it is possible to reduce the adhesion of machining dust on the workpiece and to have a simple structure. The purpose is to obtain a processing machine. In addition, the center part of the workpiece is lifted by the suction force of the upper dust collector, causing processing defects due to defocusing of the laser focused light, and in the worst case, the workpiece is attracted to the upper dust collector. It aims at obtaining the laser processing machine which is not.

In order to solve the above-described problems and achieve the object, the present invention includes a lower dust collection chamber formed therein, and a lower dust collection port communicating with the lower dust collection chamber is provided on a work placement surface, A plurality of processing tables capable of holding the workpiece on the workpiece mounting surface, an upper dust collection chamber is formed inside, and an upper dust collection port communicating with the upper dust collection chamber is provided on the lower surface, above the processing table. Suction force adjustment for adjusting the upper dust collector disposed, the dust collector connected to the upper dust collection chamber and the lower dust collection chamber, and the suction force of the upper dust collection port or the lower dust collection port The suction force adjusting device adjusts the suction force of the upper dust collection port or the suction force of the lower dust collection port when there is a machining table on which the workpiece is not placed during laser machining. Features.

  According to the present invention, it is possible to obtain a laser processing machine that can reduce the adhesion of machining dust on the workpiece and that the workpiece central portion does not float by the suction force of the upper dust collector. There is an effect.

FIG. 1 is a perspective view showing a schematic configuration of a dust collecting apparatus according to an embodiment of a laser beam machine of the present invention. FIG. 2 is a top view showing the processing table of the embodiment. FIG. 3 is a longitudinal sectional view showing a processing table according to the embodiment. FIG. 4 is a longitudinal sectional view showing the upper dust collector of the embodiment.

  Embodiments of a laser beam machine according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment.
FIG. 1 is a perspective view showing a schematic configuration of a dust collecting apparatus according to an embodiment of a laser beam machine according to the present invention. As shown in FIG. 1, the laser beam machine 90 according to the embodiment is a multi-table type laser beam machine including four machining tables 10 and two machining heads 20 each having an fθ lens. . The laser processing machine 90 of the embodiment is a multi-table type laser processing machine, and the laser processing machine of the present invention includes one processing table 10 and one processing head 20. Alternatively, a plurality of processing tables 20 may be provided.

  FIG. 2 is a top view showing the processing table of the embodiment, and FIG. 3 is a longitudinal sectional view showing the processing table of the embodiment. As shown in FIGS. 2 and 3, the machining table 10 of the embodiment has a rectangular parallelepiped shape and a lower dust collection chamber 11 formed therein. A plurality of lower dust collection ports 13 communicating with the lower dust collection chamber 11 are provided on the work placement surface 12 of the processing table 10. The lower dust collecting chamber 11 is connected to a dust collector 50 (see FIG. 1) via a lower dust collecting pipe 51 and a merging pipe 54.

  A large number of suction holes 14 are provided on the outer peripheral portion of the work placement surface 12 of the processing table 10. The suction hole 14 communicates with an annular suction chamber 15 formed in the inner periphery of the processing table 10. A vacuum suction machine (not shown) is connected to the suction chamber 15 via a suction pipe 16. A workpiece 30 (for example, a circuit board of an electronic device to be processed with a through hole) 30 placed on the workpiece placement surface 12 is sucked and held by suction of the vacuum suction machine (that is, suction by the suction hole 14). . As shown in FIG. 1, an electromagnetic opening / closing valve 17 is provided at an intermediate portion of the suction pipe 16 so that suction of each processing table 10 can be individually turned ON / OFF. Although the outer peripheral portion of the workpiece 30 may be clamped to the processing table, the laser processing apparatus 90 of the embodiment adopts a vacuum suction method to simplify the apparatus.

  FIG. 4 is a longitudinal sectional view showing the upper dust collector of the embodiment. As shown in FIGS. 1 and 4, the upper dust collector 40 of the embodiment is attached to the lower side of the processing head 20 that irradiates the workpiece 30 with the focused laser beam 21 by the fθ lens, and above the processing table 10. Be placed. The upper dust collector 40 is formed in a substantially octagonal box shape, the inside is an upper dust collecting chamber 41, and an upper dust collecting port 42 is provided at the center of the lower surface. The upper dust collection port 42 also serves as an exit for the focused laser beam 21.

  The upper dust collecting chamber 41 is connected to a single dust collector 50 through an upper dust collecting pipe 52, a variable throttle valve 53 and a merging pipe 54. The dust collection from the lower dust collection port 13 and the dust collection from the upper dust collection port 42 can be performed by separate dust collectors. In that case, however, an extra space is required for the dust collector, and the maintenance work is increased. The introduction cost is also high. By collecting the dust from the lower dust collection port 13 and collecting the dust from the upper dust collection port 42 with one dust collector 50, the above-mentioned problems can be solved.

  The variable throttle valve 53 restricts the air passage cross-sectional area of the upper dust collecting pipe 52 and adjusts the suction force (negative pressure) of the upper dust collecting port 42 according to a command from a control device (not shown). Thereby, the ratio of the suction force of the lower dust collection port 13 and the suction force of the upper dust collection port 42 can be adjusted. A variable throttle valve 53 is provided in the lower dust collection pipe 51, and the suction force of the lower dust collection port 13 is adjusted to adjust the ratio of the suction force of the lower dust collection port 13 and the suction force of the upper dust collection port 42. May be.

  A pressure sensor 55 is connected to the lower dust collecting pipe 51. The pressure detection value (negative pressure) of the lower dust collecting pipe 51 detected by the pressure sensor 55 can be sent to the control device, and the variable throttle valve 53 can be adjusted based on the pressure detection value. The variable throttle valve 53 constitutes a suction force adjusting device.

  Although not shown, the laser processing machine 90 according to the embodiment includes a loader that loads (loads) the workpiece 30 onto the four processing tables 10. The loader detects the number of workpieces 30 to be loaded and transmits it to the control device.

  In addition, the control device determines the machining conditions of the workpiece 30 from the machining program (for example, the number of through holes, the total area of the through holes, the bending rigidity, weight, thickness, size, surface roughness, machining position, etc. of the workpiece 30). ).

  Next, the operation of the laser beam machine 90 according to the embodiment will be described. Prior to laser processing of the through holes of the work 30 and the like, when the work 30 is loaded onto the four processing tables 10 by the loader, the loader detects the number of work 30 to be loaded and transmits the detection result to the control device. To do.

  Since the suction force (negative pressure) of the lower dust collection port 13 of the processing table 10 contributes to the suction of the workpiece 30 to the processing table 10 together with the suction force of the suction hole 14, the number of workpieces 30 loaded is three. If the number is less than one, air flows in from the lower dust collection port 13 and the suction hole 14 of the processing table 10 on which the workpiece 30 is not placed (the electromagnetic on-off valve 17 of the processing table 10 on which the workpiece 30 is not placed). If air is closed, air does not flow from the suction hole 14.) Since the suction force of the processing table 10 on which the work 30 is placed decreases and the central portion of the work 30 tends to be lifted, control is performed. When commanded by the apparatus, the air passage cross-sectional area of the upper dust collecting pipe 52 is throttled by the variable throttle valve 53 to reduce the suction force of the upper dust collecting port 42 (the variable throttle valve 53 is provided in the lower dust collecting pipe 51. If the variable throttle valve 5 Open, increase the suction force of the lower dust collection port 13. Or less, the same.).

  When the number of through holes in the work 30 or the total area of the through holes is large, air flows into the lower dust collection port 13 from the through holes and the suction force of the work table 10 on which the work 30 is placed is reduced. Since the central portion of the work 30 tends to be lifted, the command from the control device is used to restrict the air passage cross-sectional area of the upper dust collecting pipe 52 by the variable throttle valve 53, thereby reducing the suction force of the upper dust collecting port 42. .

  In this case, the suction force of the upper dust collection port 42 may be continuously reduced so as to be inversely proportional to the number of through holes or the total area of the through holes, or the number of through holes or the total area of the through holes may be reduced. A threshold value is set, and when the threshold value is exceeded, the suction force of the upper dust collection port 42 may be lowered stepwise (the same applies hereinafter).

  When the bending rigidity of the work 30 is low, when the weight is light, or when the thickness is thin, the central portion of the work 30 tends to be lifted. The air passage cross-sectional area of the pipe 52 is reduced, and the suction force of the upper dust collection port 42 is reduced.

  When the work 30 is small and the suction hole 14 of the processing table 10 and a part of the lower dust collection port 13 are exposed, the suction hole 14 (the electromagnetic on-off valve 17 of the processing table 10 in which a part of the suction hole 14 is exposed is closed). By doing so, air does not flow in from the suction holes 14) and air flows in from a part of the lower dust collection port 13, the suction force of the processing table 10 decreases, and the workpiece 30 tends to rise. Therefore, a command is issued from the control device, the air passage cross-sectional area of the upper dust collecting pipe 52 is throttled by the variable throttle valve 53, and the suction force of the upper dust collecting port 42 is lowered.

  When the surface roughness of the workpiece 30 is rough, air flows into the suction hole 14 and the lower dust collection port 13 from the gap between the workpiece 30 and the workpiece placement surface 12, and the suction force of the processing table 10 decreases. Since the work 30 tends to be lifted, a command is issued from the control device, the air passage cross-sectional area of the upper dust collecting pipe 52 is throttled by the variable throttle valve 53, and the suction force of the upper dust collecting port 42 is lowered.

  When the through-hole processing is performed in the region of the lower dust collection port 13 of the work 30, air flows from the lower dust collection port 13, the adsorption force of the work 30 is reduced, and the work 30 tends to be lifted. Instructed from the control device, the air passage cross-sectional area of the upper dust collecting pipe 52 is throttled by the variable throttle valve 53, and the suction force of the upper dust collecting port 42 is lowered.

  The decrease in the work 30 attraction force of the processing table 10 due to the various causes described above is caused in the lower dust collection pipe 51 (on the upstream side of the variable throttle valve 53 when the variable throttle valve 53 is installed in the lower dust collection pipe 51). The increase in suction negative pressure can be detected by the pressure sensor 55, and the pressure detection value (negative pressure) of the lower dust collection pipe 51 detected by the pressure sensor 55 is sent to the control device, and the variable throttle valve is based on the pressure detection value. The aperture amount of 53 can be adjusted.

  As described above, the laser processing machine according to the present invention is useful for a laser processing machine including an upper dust collector.

DESCRIPTION OF SYMBOLS 10 Processing table 11 Lower dust collection chamber 12 Workpiece mounting surface 13 Lower dust collection port 14 Suction hole 15 Suction chamber 16 Suction tube 17 Electromagnetic on-off valve 20 Processing head 21 Focused laser beam 30 Work 40 Upper dust collector 41 Upper dust collection chamber 42 Upper dust collection port 50 Dust collector 51 Lower dust collection tube 52 Upper dust collection tube 53 Variable throttle valve (suction force adjusting device)
54 Junction pipe 55 Pressure sensor 90 Laser machine

Claims (6)

A plurality of processing tables, wherein a lower dust collection chamber is formed therein, a lower dust collection port communicating with the lower dust collection chamber is provided on the workpiece placement surface, and a workpiece can be held on the workpiece placement surface;
An upper dust collecting chamber is formed inside, an upper dust collecting port communicating with the upper dust collecting chamber is provided on the lower surface, and an upper dust collector disposed above the processing table;
A dust collector connected to the upper dust collecting chamber and the lower dust collecting chamber;
A suction force adjusting device for adjusting the suction force of the upper dust collection port or the suction force of the lower dust collection port;
Equipped with a,
When there is a processing table on which the workpiece is not placed during laser processing, the suction force adjusting device adjusts the suction force of the upper dust collection port or the suction force of the lower dust collection port. . A lower dust collection chamber is formed therein, a lower dust collection port communicating with the lower dust collection chamber is provided on the workpiece placement surface, and a processing table capable of holding the workpiece on the workpiece placement surface;
An upper dust collecting chamber is formed inside, an upper dust collecting port communicating with the upper dust collecting chamber is provided on the lower surface, and an upper dust collector disposed above the processing table;
A dust collector connected to the upper dust collecting chamber and the lower dust collecting chamber;
A suction force adjusting device for adjusting the suction force of the upper dust collection port or the suction force of the lower dust collection port;
With
The suction force adjusting device is a variable throttle valve installed in an upper dust collection pipe that connects the upper dust collection chamber and the dust collector, and the variable throttle valve connects the lower dust collection chamber and the dust collector. The laser processing machine is characterized in that the throttle amount is adjusted according to the pressure of the lower dust collecting pipe. A lower dust collection chamber is formed therein, a lower dust collection port communicating with the lower dust collection chamber is provided on the workpiece placement surface, and a processing table capable of holding the workpiece on the workpiece placement surface;
An upper dust collecting chamber is formed inside, an upper dust collecting port communicating with the upper dust collecting chamber is provided on the lower surface, and an upper dust collector disposed above the processing table;
A dust collector connected to the upper dust collecting chamber and the lower dust collecting chamber;
A suction force adjusting device for adjusting the suction force of the upper dust collection port or the suction force of the lower dust collection port;
With
The suction force adjusting device is a variable throttle valve installed in a lower dust collecting pipe that connects the lower dust collecting chamber and the dust collector, and the variable throttle valve connects the lower dust collecting chamber and the dust collector. The amount of restriction is adjusted according to the pressure upstream of the variable throttle valve of the lower dust collecting pipe. The laser beam machine according to any one of claims 1 to 3, wherein the dust collector connected to the upper dust chamber and the lower dust chamber is a single dust collector. The outer periphery of the work placement surface of the processing table is provided with suction holes for vacuum suction, and the work is sucked and held on the work placement surface . The laser beam machine according to item 1 . The suction force adjusting device can be any one of claims 1-3, characterized in that for adjusting the suction force of the suction force or the lower dust collecting port of the upper dust collection port in accordance with the machining conditions of the workpiece The laser beam machine described in 1.

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