JP5477843B2 - Mold and molding apparatus provided with the same - Google Patents

Description

  The present invention relates to a mold and a molding apparatus including the mold.

  As a resin sealing molding method for electronic parts, a transfer molding type molding apparatus is widely known in which a molding resin in a pot is pumped to a cavity by a plunger to resin mold the electronic part. An example of such a transfer molding type molding apparatus is disclosed in Patent Document 1.

JP 2001-7129 A

Usually, since the mold is constituted by assembling a plurality of mold members, there is a slight gap between the mold members. In the conventional molding resin, since the viscosity of the resin is sufficiently high, problems rarely occur when the molding resin enters the gap.
However, in recent years, molding resins with extremely low viscosity are sometimes used, and the molding resin enters the gaps between the mold members, causing problems as described below. When the resin that has entered the gap between the mold members is thermally cured by the heat of the mold, the cavity piece and the cavity insert are pushed out by the cured resin, and are displaced from the initial position. Such a failure reduces the product yield.

  For such a problem, a large die member such as a cavity piece or a cavity insert is used even if the sealing technique using an O-ring attached to an ejector pin as described in Patent Document 1 is to be diverted. It is difficult to apply. Even if an O-ring attached to an ejector pin is applicable, the mold member and the O-ring must be dimensioned very precisely, and the installation of the O-ring becomes expensive.

  Therefore, the present invention avoids the occurrence of problems due to the resin that has entered the gaps between the mold members constituting the mold, and improves the yield of the product, even if the molding resin has high fluidity. An object of the present invention is to provide a mold that has a low-cost sealing structure and a mold apparatus including the mold.

In order to solve the above problems, the present invention has the following configuration.
The mold according to an embodiment of the present invention is a mold that includes a pair of upper and lower molds, and a mold part that is provided with a thermosetting resin on a mold parting surface that is closed. A gap having an opening to be connected is formed by being sandwiched between the pair of molds, and the mold parting surface of one mold on which the cull part is formed is along the outer peripheral edge of the cull part. A shallow groove portion having a shallower depth than the cull portion connected to the cull portion is formed, and the mold parting surface of the other mold extends to face the shallow groove portion and extends from the cull portion. A cross groove is formed along a direction intersecting the outward direction of the cull portion, and the outermost peripheral position of the shallow groove portion and the outermost peripheral position of the cross groove coincide with each other, and the shallow groove portion and the The intersecting groove is formed to be connected to the gap. .
A mold mold according to another embodiment of the present invention is configured to include a pair of upper and lower molds, and clamps a substrate on which the LED element is mounted to perform resin sealing of the LED element in the cavity. A runner and a cull portion communicating with the cavity are formed on the parting surface of one mold in which the cavity having a concave portion for lens molding is formed at a position corresponding to the LED element, and the other mold The mold parting surface is provided with a pot facing the cull part, and an opening for connecting the runner to which the thermosetting resin is supplied from the pot is provided in the mold parting surface which is closed. A gap is formed between the pair of fixed mold blocks constituting either one or the other mold so as to intersect the runner in the middle of the runner. At least one of the pair of mold blocks arranged with the gap interposed therebetween, an intersecting groove is formed in the gap so as to extend along a direction intersecting the depth direction of the gap from the runner. It is formed to be connected. Here, the cross groove is formed in each of the pair of mold blocks arranged with the gap interposed therebetween, and the cross groove of one of the mold blocks and the cross of the other mold block. The groove is preferably opposed to the groove.
A mold mold according to another embodiment of the present invention is configured to include a pair of upper and lower molds, and clamps a substrate on which the LED element is mounted to perform resin sealing of the LED element in the cavity. A runner and a cull portion communicating with the cavity are formed on the parting surface of one mold in which the cavity having a concave portion for lens molding is formed at a position corresponding to the LED element, and the other mold The mold parting surface is provided with a pot opposite to the cull part, and the mold parting surface with the mold closed has an opening connected to the cavity to which thermosetting resin is supplied from the pot. The cavity is formed between a cavity piece constituting one mold and a clamper that accommodates the cavity piece, and is disposed with the gap interposed therebetween. At least one of the piece or the clamper is formed such that an intersecting groove is connected to the gap so as to extend along a direction intersecting the depth direction of the gap from the cavity. And

A mold according to another embodiment of the present invention includes a plurality of mold members, and a gap having a connection surface connected to a region to which a thermosetting resin is supplied on the mold parting surface is the mold. In the mold mold formed between the mold members, at least one of the mold members arranged with the gap interposed therebetween, with respect to the depth direction of the gap from the region where the thermosetting resin is supplied A crossing groove is formed so as to extend along the crossing direction.
The intersecting groove is formed on an outer periphery of the ejector pin so as to be connected to the gap between an ejector pin as the mold member and a mold block through which the ejector pin is inserted. To do.
Further, the intersecting groove is formed so as to be connected to the gap between the pair of mold blocks which are the mold members.
With these, by performing trial hitting (first shot) with a mold die, after the resin enters the gap portion existing along the outer periphery of the ejector pin and the gap portion between the die blocks, the outer peripheral surface of the ejector pin and The thermosetting resin that has entered the intersecting groove portion provided between the mold blocks is thermally cured, and a seal structure is formed between the outer peripheral surface of the ejector pins and the mold block by the cured resin. As a result, when the resin molding is performed after the next time (after the second shot), the thermosetting resin does not enter the outer peripheral surface of the ejector pin and the gap portion between the mold blocks. Even if the resin enters the gap, it does not exceed the position of the seal part formed in the intersecting groove between the ejector pin and the mold block, and contamination of the mold due to the ingress of the thermosetting resin is prevented. The

  The intersecting grooves are provided at a plurality of locations corresponding to the portions intersecting the runner, and each intersecting groove is formed wider than the width dimension of the runner. Thereby, the amount of the thermosetting resin entering the gap can be reduced as much as possible.

  Further, the intersecting groove is further on the outer side than the outermost peripheral position of the runner provided at both end positions in the direction intersecting the resin supply direction in the runner, and the center insert, It is more preferable that the groove insert or the clamper is formed in a single groove having an end portion on the inner side of the end position in the direction intersecting the resin supply direction. With such a configuration of the intersecting grooves, the intersecting grooves can be formed at low cost because the intersecting grooves are processed only once.

  The mold members arranged with the gap interposed therebetween are a clamper and a cavity piece. As a result, by performing trial driving with a mold, after the thermosetting resin entered the gap between the clamper and the cavity piece, it entered at the intersecting groove provided in at least one of the clamper or the cavity piece. The thermosetting resin is thermally cured, and the cured resin forms a seal structure in a gap portion including at least one intersecting groove of the clamper or the cavity piece. Thereby, when performing resin molding after the next time, the thermosetting resin does not enter the gap portion between the clamper and the cavity piece. Even if the thermosetting resin enters the gap, it does not exceed the position of the previously formed seal portion, and contamination of the mold due to the entry of the thermosetting resin is prevented.

  The intersecting grooves are formed at a plurality of locations in the depth direction of the gap. Thereby, a seal | sticker part will be formed more reliably and the approach of a thermosetting resin to the clearance gap between the mold members in the 2nd time or later can be stopped suitably.

  Further, the cross groove is formed along the outermost peripheral edge position of the cull portion in one center insert where the cull is not formed among the upper mold center insert and the lower mold center insert which are the pair of mold blocks. It is formed between the upper mold center insert and the lower mold center insert so as to be connected to the gap. As a result, the contact area between the mold block and the resin is increased at the outer peripheral edge portion of the cal part, and the thermosetting of the thermosetting resin at the outer peripheral edge part of the cal part can be promoted. It is possible to prevent the occurrence of flash flash.

  Further, the cross groove is characterized in that a cross-sectional shape in a direction orthogonal to the extending direction of the cross groove is formed in a semicircular shape. Thereby, the contact area between the thermosetting resin that has entered the gap portion and the mold member increases, and the thermosetting resin can be thermoset in a shorter time.

  Moreover, it can also be set as the invention of the molding apparatus characterized by having the mold metal mold | die described in either of the above.

  According to the mold according to the present invention and a molding apparatus equipped with the mold, a seal portion can be formed in advance with a thermosetting resin in a gap portion between mold members constituting the mold, Since the thermosetting resin does not enter before the seal portion, it is possible to suitably prevent the mold mold from being contaminated by the thermosetting resin that has entered the gap portion between the mold members during resin molding. In addition, according to the present invention, a seal structure can be formed simply by performing a so-called trial strike with a molding resin or a resin for a seal member in a mold, so that a seal structure can be formed very easily and at low cost. Is possible.

It is sectional drawing which shows schematic structure of the mold metal mold | die in this embodiment. FIG. 2 is a partially transparent plan view showing a state where a lower mold side is faced from a position directly above a cull portion of the mold mold shown in FIG. 1. FIG. 2 is an enlarged view showing a state in which the upper die and the lower die are parted in the mold shown in FIG. 1. It is an enlarged view showing the state around the cull portion at the time of the first shot. FIG. 6 is an enlarged view showing a state of a gap portion between a lower mold center insert and a cavity insert and a gap portion between an upper mold center insert and a clamper during a first shot. It is an enlarged view showing a state of a gap portion between the clamper and the cavity piece at the first shot.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing a schematic configuration of a resin molding apparatus in the present embodiment. FIG. 2 is a partially transparent plan view showing a state in which the lower mold is faced from a position directly above the cull portion of the mold shown in FIG.
In the mold mold 300 of this embodiment, the LED element 420 of the substrate 410 on which the LED element 420 that is an electronic component is mounted is resin-sealed with a thermosetting resin (hereinafter sometimes simply referred to as resin), and the lens is attached. The LED device 400 is manufactured. As shown in FIG. 1, the mold die 300 includes an upper die 100 having a cull portion 120 and a cavity piece 150 and a lower die 200 having a pot 210 and a plunger 220 and the like. The mold 300 is connected to gaps S1 to S5 formed between the mold members such as between the drive member such as an ejector pin and a fixed member such as each mold block or between the fixed members. Thus, the cross grooves 132, 142, 152, 164, 242, 244, and 252 having a semicircular cross section are formed, and the leakage of the resin 230 through the gaps S1 to S5 can be prevented.

First, the upper mold 100 will be described.
As shown in FIG. 1, the upper mold 100 includes a base 110, an upper mold center insert (cal insert) 130 in which a cull portion 120 is formed, a clamper 140, and a cavity piece 150 that is a movable member. doing. On the parting surfaces of the upper mold center insert 130 and the clamper 140, a runner 170 communicating from the cull portion 120 to the gate portion 144 formed in the clamper 140 is engraved.

  The cull portion 120 is formed in a trapezoidal cross section that gradually increases in diameter from the ceiling surface toward the parting surface side, and the shallow groove portion 122 in which the outer peripheral edge portion of the parting surface expands further outward with a required depth. (See FIGS. 1 and 2). The depth of the shallow groove portion 122 is 0.1 mm to 0.2 mm. 1 to 3, the width dimension and the depth dimension of the shallow groove portion 122 are exaggerated.

  Further, the upper mold center insert 130 is provided with an ejector pin 160 provided so as to penetrate the upper mold center insert 130 in the thickness direction and protrude into the cull portion 120. The ejector pin 160 is inserted into a mounting hole 162 formed in the base portion 110 and the upper mold center insert 130. The mounting hole 162 opens at the inner top surface of the cull portion 120, and has a diameter of the end portion on the cull portion 120 side having a predetermined width and a smaller diameter than that on the base 110 side. Specifically, the diameter of the small diameter portion 162 </ b> A of the insertion hole 162 is formed to be about 1 μm larger than the outer dimension of the ejector pin 160. The small-diameter portion 162A is formed over a range that is above the height position where the resin 230 pumped from the pot 210 by the plunger 220 can enter.

  A gap S1 is formed between the ejector pin 160 and the insertion hole 162 due to the difference in diameter. When resin molding is performed by the mold 300, the resin 230, which is pumped from the pot 210 to the cull portion 120 by the plunger 220, enters (inflows) into the gap S1 and is thermally cured in the apparatus, and the ejector pin 160 is cured by the cured resin. And other movable parts may cause malfunctions and the like. However, since the clearance S1 between the ejector pin 160 and the insertion hole 162 cannot be eliminated from the viewpoint of mounting workability and processing cost, processing for preventing the molding resin from entering the clearance S1 during resin molding is performed. I need it.

  Here, a seal portion is formed in the vicinity of the end portion of the ejector pin 160 on the side of the cull portion 120. Specifically, on the parting surface of the mold 300, the inner bottom portion in a direction orthogonal to the depth direction of the gap S1 having a connection surface (opening portion) connected to the cull portion 120 that is a region to which the resin 230 is supplied. A crossing groove 164 is formed. The intersecting groove 164 is provided along the outer peripheral surface of the ejector pin 160. The intersecting grooves 164 can be formed by lathe processing or the like. In FIG. 1, one intersecting groove 164 is formed in the ejector pin 160, but a plurality of intersecting grooves 164 may be formed in one ejector pin 160 in the range of the narrow diameter portion 162 </ b> A of the mounting hole 162. . However, all the intersecting grooves 164 are disposed in the range of the small diameter portion 162 </ b> A of the mounting hole 162. In addition, the number of formed other cross grooves described later may be one or plural.

  A gap S <b> 2 also exists between the upper mold center insert 130 and the clamper 140 constituting the upper mold 100. The clamper 140 is a container for the cavity piece 150. FIGS. 1 and 3 show a configuration in which one cavity piece 150 is accommodated in the clamper 140, but it is of course possible to accommodate a plurality of cavity pieces 150. FIG. In the gap S2 between the upper mold center insert 130 and the clamper 140, a problem due to resin leakage occurs as in the gap S1 around the ejector pin 160 described above. Therefore, a direction orthogonal to the depth direction of the gap S2 with respect to the gap S2 having a contact surface (communication portion with the runner 170) that is in contact with the runner 170, which is a region to which the resin 230 is supplied, on the parting surface of the mold 300. Cross grooves 132 and 142 having inner bottom portions are formed. The intersecting grooves 132 and 142 have the same function as the intersecting grooves 164 provided around the ejector pin 160.

  Further, it may be disposed only on either the upper mold center insert 130 or the clamper 140. Furthermore, although the structural example arrange | positioned facing the crossing grooves 132 and 142 is demonstrated, after arrange | positioning to the upper mold | type center insert 130 side along the depth direction from the runner 170 side of the clearance gap S2, it is further depth. Arbitrary arrangement | positioning forms are employable in the form etc. which arrange | position the crossing grooves 132 and 142 alternately, such as arrange | positioning at the clamper 140 side in a direction. The intersecting grooves 132 and 142 can be formed by, for example, milling.

  The intersecting grooves 132 and 142 extend so as to intersect the runner 170 in a direction that intersects perpendicularly with the extending direction of the runner 170 engraved in the upper mold center insert 130 and the clamper 140. Further, the intersecting grooves 132 and 142 do not communicate with the edge portions of the upper mold center insert 130 and the clamper 140 in the direction in which they intersect on the same plane as the extending direction of the intersecting grooves 132 and 142, and the upper mold center insert 130 and the clamper 140 are formed in a range from the both end edges to the inner position. This prevents the resin 230 that has entered the intersecting grooves 132 and 142 from leaking from the formation surface of the intersecting grooves 132 and 142 to the other outer peripheral surface.

  A gap S <b> 3 exists between the clamper 140 and the cavity piece 150. As with the gaps S1 and S2, the gap S3 also causes a problem due to the resin 230 entering. Therefore, the gap S3 between the clamper 140 and the cavity piece 150 is also formed with an intersecting groove 152 having an inner bottom surface that is recessed in a direction perpendicular to the depth direction of the gap S3 (the same direction as the gap S2). As described above, the cavity piece 150 is accommodated in the internal space of the through hole formed in the clamper 140 in a state where the upper end edge is suspended from the base block 110 by the spring 180. Further, the planar position of the outer peripheral edge of the cavity piece 150 is located in the planar area of the cavity space 190. That is, with respect to the gap S <b> 3 of the cavity piece 150, the intersecting groove 152 is formed only for the cavity piece 150. The intersecting grooves 152 are formed so as to go around the outer peripheral surface of the cavity piece 150.

Next, the lower mold 200 will be described.
As shown in FIG. 3, the lower mold 200 includes a lower mold center insert 240 that accommodates the pot 210 and the plunger 220, a cavity insert 250, and a chase block 260. Lower mold center insert 240 and cavity insert 250 are assembled to chase block 260. The pot 210 and the plunger 220 are assembled so as to pass through the lower mold center insert 240 and the chase block 260. The cavity insert 250 holds the substrate 410 at a predetermined position.

  As shown in FIG. 2, an intersecting groove 242 is formed on the parting surface side of the lower mold center insert 240 at a portion corresponding to the outer peripheral edge of the shallow groove portion 122 of the cull portion 120 of the upper mold center insert 130. The intersecting groove 242 is engraved along the outer peripheral edge of the cull portion 120 so as to face the shallow groove portion 122 of the cull portion 120 of the upper mold center insert 130. The width dimension and the depth dimension of the intersecting groove 242 are preferably about 0.2 mm and 0.1 to 0.2 mm, respectively. As shown in FIGS. 1 to 3, the outermost peripheral edge position of the intersecting groove 242 and the outermost peripheral edge position of the shallow groove portion 122 are formed so as to coincide with each other. The intersecting groove 242 is a flash beam generated by the resin 230 pumped to the cull portion 120 during molding leaking through the gap S5 between the clamp surfaces of the upper mold center insert 130 and the lower mold center insert 240. It is for preventing. The cross groove 242 increases the contact area with the mold 300 per unit volume of the resin 230 that is pumped to the cull portion 120 together with the shallow groove portion 122 of the cull portion 120, and the resin in the shallow groove portion 122 and the cross groove 242 portion. It functions as a thermosetting accelerator that quickly heats 230.

  Between the lower mold center insert 240 and the cavity insert 250, a gap S4 having a contact surface with the runner 170, which is a supply region of the resin 230, as between the upper mold center insert 130 and the clamper 140 of the upper mold 100. Occurs. When the resin 230 supplied into the pot 210 is pressure-fed to the runner 170 by the plunger 220, the resin 230 enters the gap S4 when passing over the gap S4 located in the middle of the runner 170. For this reason, again, in the gap S4 between the lower mold center insert 240 and the cavity insert 250, intersecting grooves 244 and 252 having inner bottom surfaces in the direction orthogonal to the depth direction of the gap S4 are formed. The intersecting grooves 244 and 252 formed in the lower mold center insert 240 and / or the cavity insert 250 can be formed in the same manner as the intersecting grooves 132 and 142 of the upper mold 100.

Next, the state when the seal structures of the cross grooves 132, 142, 152, 164, 242, 244, 252 provided for the gaps S1 to S5 are formed will be described.
A first shot (trial shot) is performed using a molding apparatus (not shown) including the mold 300 described in the present embodiment. As the resin 230 used at this time, the sealing resin of the substrate 410 on which the LED element 420 as a resin molded product is mounted can be used, but the intersecting grooves 132, 142, provided for the gaps S1 to S5, respectively. A dedicated resin for forming a sealing structure of 152, 164, 242, 244, 252 (for example, a silicone resin that does not contain a filler such as silica to prevent wear of the mold) can also be used. Regardless of which resin is used, normal manufacturing conditions (molding conditions during mass production) can be adopted as the molding conditions.

The formation process of the seal structure in each part will be described according to the order in which the resin 230 supplied to the pot 210 is supplied in the mold 300 having the upper mold 100 and the lower mold 200 described above.
First, the resin 230 is put into the pot 210 in the mold open state as shown in FIG. At least one of the upper mold 100 and the lower mold 200 is driven by a driving means (not shown), and the parting surfaces of the upper mold 100 and the lower mold 200 are brought into contact with each other as shown in FIG. And clamping with a predetermined force. The resin 230 put into the pot 210 is already melted by the heating means in the mold 300. Subsequently, the plunger 220 is driven toward the parting surface by a plunger driving means (not shown) to move up, and the molten resin 230 is pumped from the pot 210 to the cull portion 120.

  Most of the resin 230 that is pumped to the cull portion 120 flows into the runner 170 but also tries to flow into the gaps S1 and S5. At this time, as shown in FIG. 4A, the resin 230 is filled in the intersecting groove 164 disposed in the middle of the gap S1, and at the end of the shallow groove 122 (before the gap S5). The arranged intersection grooves 242 are filled. In the gap S <b> 5, the resin 230 filled in the shallow groove portion 122 is filled in the intersecting groove 242. In this case, the resin 230 that is about to flow into the gap S5 cannot directly flow into the gap S5, and is heated by the shallow groove portion 122 and the intersecting groove 242 that are in the heated state. In addition, since the shallow groove portion 122 and the intersecting groove 242 have a sufficiently larger cross-sectional area than the gap S5, the flow rate of the resin 230 can be kept low, and the distance between the mold wall surfaces through which the resin 230 passes (contacts) can be reduced. The resin 230 can be reliably and efficiently heated by promoting the transfer of heat from the mold wall surface.

  Thereby, before the resin 230 flows into the gap S5, the viscosity of the resin 230 can be increased to be the cured resin 234, and flash burr from the outer peripheral edge of the cull portion 120 can be prevented by entering the resin 230 into the gap S5. It is possible to do. Even if the resin 230 flows into the gap S5, the viscosity is already sufficiently high, so that the resin 230 is immediately thermoset and only a small amount of flash burr is formed.

  On the other hand, the resin 230 that has entered the mounting hole 162 from the gap S1 between the mounting hole 162 and the ejector pin 160 has a large amount of heat transferred from the mold surface in the range in front of the intersecting groove 164 in the gap S1, but the small diameter portion 162A. Since the cross-sectional area is narrow, it passes at a higher flow rate than other parts, and the thermosetting of the resin 230 does not proceed sufficiently. However, the flow rate of the resin 230 is reduced in the intersecting grooves 164 and is efficiently heated by the ejector pins 160 and the upper mold center insert 130. As described above, the resin 230 can be cured by increasing the viscosity of the resin 230 in the same manner as the gap S5, so that the resin 230 can enter the deeper side than the intersecting groove 164 of the small diameter portion 162A. Can be prevented.

Even if the resin 230 flows into the back of the small-diameter portion 162A, the viscosity is already sufficiently high, so that the resin 230 can be immediately thermoset and cured in the small-diameter portion 162A. Further, the cured resin 234 becomes thick at the intersecting groove 164 portion of the ejector pin 160, an anchor effect is obtained, and it is difficult for the ejector pin 160 to fall off. Further, since the cross-sectional shape of the cross groove 164 has a semi-circular shape, it is possible to guide the resin 230 which has flowed into the small diameter portion 162A along the side surface of the ejector pin 160 to the inner bottom surface of the cross groove 164, Since the resin 230 can be heated on the upper mold center insert 130 side having a larger heat capacity, the resin 230 can be reliably cured to prevent resin leakage.

  Subsequently, when the thermosetting of the resin 230 is completed and the mold 300 is opened, the ejector pin 160 is driven and moved downward to push out the cured resin 234 of the cull portion 120. At this time, as shown in FIG. 4B, the cured resin 234 of the cull part 120 and the cured resin 234 on the outer periphery of the ejector pin 160 are separated from the ceiling surface of the cull part 210 to the lower side of the cross groove 164 by gravity. Separation is performed at a portion with low strength (in this example, the ceiling surface). Therefore, the cured resin 234 remains in the ejector pin 160 in the range from the cross groove 164 to the ceiling portion of the cull portion 120 as shown in FIG. The remaining cured resin 234 seals the gap S1 during subsequent resin molding. Such a seal structure can prevent the resin 230 from entering the gap S1. In this case, the cured resin 234 that seals by being pressed by the resin 230 that is about to enter the gap S1 shrinks in the depth direction of the mounting hole 162 and expands in the radial direction. Therefore, the gap S1 is reliably sealed to prevent resin leakage. can do.

As described above, in the gap S1 around the ejector pin 160, the resin 230 from the runner 170 is surely flowed out by filling the intersecting groove 164 with the resin 230 and accelerating the curing at the first resin sealing. Can be prevented. Also, in the second and subsequent resin sealing steps, the resin 230 can be more reliably prevented from flowing out by the seal structure (cured resin 234) formed at the first resin sealing, so that the resin leakage can be efficiently and reliably performed. Can be prevented.
Although the sliding resistance of the ejector pin 160 is slightly increased by the seal structure (cured resin 234) formed on the outer peripheral surface of the ejector pin 160 in the gap S1, it is sufficiently small with respect to the driving force of the ejector pin 160. This does not hinder the drive of the ejector pin 160. Further, since the seal structure of the gap S1 remains in that position unless the mold 300 is disassembled, it can be reused as a seal structure. The seal structure of gaps S2 to S4 described later can be reused in the same manner.

  On the other hand, the cured resin 234 thermally cured by the shallow groove portion 122 and the intersecting groove 242 provided for the gap S5 is removed from the mold 300 while being connected to the cured resin 234 of the cull portion 120 when the mold is opened. Therefore, unlike the cured resin 234 in the gap S1, the cured resin 234 that cures at the shallow groove portion 122 and the intersecting groove 242 and seals the gap S5 is molded every time resin molding is performed. Thus, in the cull portion 120, a cured resin 234 that functions as a seal structure of the gap S1 of the ejector pin 160 to prevent resin leakage, and a cured resin 234 that prevents the occurrence of flash burrs in the gap S5 between the clamp surfaces. Are provided to effectively avoid the occurrence of defects due to resin leakage in the cull portion 120.

  In the mold 300 closed as shown in FIG. 3, the resin 230 pumped from the cull portion 120 first passes through a runner 170 connected to the cull portion 120. In the mold 300, there is a gap S2 of the upper mold 100 and a gap S4 of the lower mold 200 so as to intersect with the runner 170. Trying to enter S4. On the other hand, in the present embodiment, resin leakage is prevented by forming cross grooves 132, 142, 244, 252 in the gaps S2, S4 between the upper mold 100 and the lower mold 200. These intersecting grooves 132, 142, 244, and 252 have the same function of accelerating resin curing as the intersecting grooves 164 provided for the gap S 1 around the ejector pin 160. To do.

  As shown in FIG. 5A, most of the resin 230 that passes through the runner 170 flows into the cavity space. Moreover, it also enters gaps S2 and S4 extending in the direction (here, the vertical plane direction) perpendicular to the parting plane (here, horizontal plane) and the extending direction of runner 170. Accordingly, the resin 230 is filled in each of the intersecting grooves 132 and 142 provided for the gap S2 and the intersecting grooves 244 and 252 provided for the gap S4. Even in the range before the intersecting grooves 132, 142, 244, and 252 of the gaps S2 and S4, the resin 230 passes at a higher flow rate than other parts. Therefore, although the resin 230 does not sufficiently cure by heat, the resin 230 is a metal that forms gaps S2 and S4 by reducing the flow velocity in the intersecting grooves 132, 142, 244, and 252 on the runner 170 side (first stage). The viscosity of the resin 230 can be increased by efficient heating by the mold member.

  Further, as shown in FIG. 5 (A), even if the resin 230 passes through the first-stage intersecting grooves 132, 142, 244, 252 of the gaps S2, S4 and enters further into the gaps S2, S4. As shown in FIG. 5 (B), it can be reliably cured by the cross grooves 132, 142, 244, 252 on the back side (second stage). By providing the plurality of intersecting grooves 132, 142, 244, 252 in this way, it is particularly advantageous when using the resin 230 having a low viscosity at the time of melting.

  Next, as shown in FIG. 5C, the resin 230 of the runner 170 is thermally cured to form a cured resin 234, and then the mold 300 is opened as shown in FIG. 5D. At this time, as shown in FIG. 5D, by separating the cured resin 234 of the runner 170 from the lower mold 200, a contact surface (communication portion) between the cured resin 234 of the gap S4 and the cured resin 234 of the runner 170 is obtained. ), The cured resin 234 between the runner 170 and the gap S4 is separated. Further, the ejector pin 160 is protruded to remove the cull from the upper mold 100, and the cured resin 234 is separated at the contact surface between the gap S2 and the runner 170. The resin-sealed product together with the cured resin 234 of the runner 170 from the mold mold 300. Take out. As a result, the cured resin 234 is left in the gaps S2 and S4 as shown in FIG.

As described above, in the range from the intersecting grooves 132 and 142 and the intersecting grooves 244 and 252 to the communication portion with the runner 170, the sealing structure is formed by the cured resin 234 as shown in FIG. Is formed. Thereby, the entrance of the resin 230 can be prevented in the same manner as the cured resin 234 in the cross groove 164. In this case, it has a resin leakage preventing function similar to like in the case of the gap S1, when resin sealing the first, and can prevent the outflow of the resin 230 surely in the subsequent resin sealing step.

In particular, the gap S4 between the lower mold center insert 240 and the cavity insert 250 is sealed with the cured resin 234 in advance before the mass production process, so that further entry of the resin 230 into the gap S4 can be prevented. That is, during the mass production process, for example, the resin 230 is repeatedly entered into the gap S4 by resin sealing a plurality of times, and the gap S4 is widened to prevent the cavity insert 250 from being displaced. Convenient in terms.
In the present embodiment in which the LED element 420 of the substrate 410 on which the LED element 420 is mounted is sealed with a resin to manufacture the LED device 400 with a lens, or in a form in which electronic components are sealed with a matrix-shaped cavity, This is extremely effective in the manufacture of electronic components in which the positional relationship between the resin sealing body and the cavity is important.

  Next, in the mold 300 that is closed as shown in FIG. 3, the resin 230 that has passed through the runner 170 is supplied to the cavity space 190 through the gate 144. In the upper mold 100, since the gap S3 exists around the cavity piece 150 constituting the cavity space 190 (in other words, between the clamper 140 and the cavity piece 150), it is supplied into the cavity space 190. Resin 230 tends to enter the gap S3. On the other hand, in this embodiment, the cross groove 152 is formed with respect to the gap S3 to prevent resin leakage. The intersecting groove 152 has the same function as the intersecting grooves 132, 142, 164, 244, and 252 provided for the gaps S 1, S 2, and S 4 around the ejector pin 160, and therefore has a difference. Is mainly explained.

  Between the clamper 140 and the cavity piece 150, there is a gap S3 extending in a direction (vertical plane direction) perpendicular to the parting surface (horizontal plane) and connected to the cavity space 190, as shown in FIG. ing. Therefore, in the mold mold 300 which is closed, a part of the resin 230 to be filled in the cavity space 190 enters the gap S3 as shown in FIG. The resin 230 that has entered from the gap S3 is thermally cured within the range of the intersecting groove 152 or less like the resin 230 in the gaps S2 and S4, and becomes a cured resin 234 as shown in FIG. 6B. Thereafter, as shown in FIG. 6C, when all of the resin 230 filled in the cavity space 190 is cured and becomes the cured resin 234, the mold 300 is opened. After the mold 300 is opened, the ejector pins 160 are protruded, and as shown in FIG. 6D, the LED device is connected at the contact surface (communication portion) between the gap S3 and the cavity space 190 that is the resin supply region. The 400 cured resin 234 and the cured resin 234 in the gap S3 are separated from each other.

  Since the intersecting groove 152 is engraved so as to go around the outer peripheral surface of the cavity piece 150, the resin 230 that has entered from the gap S 3 existing on the outer peripheral face of the cavity piece 150 also goes around the outer peripheral surface of the cavity piece 150. As shown in FIG. 6 (E), a seal structure made of a cured resin 234 is formed in the gap S3. With this seal structure, the new resin 230 does not enter the position that was the gap S3 after the second shot. The sealing structure by the cured resin 234 formed in the gap S3 basically remains, but does not affect the expansion and contraction operation of the spring 180 that suspends the cavity piece 150 from the base 110. Of course.

Although the present invention has been described in detail based on the embodiment, the present invention is not limited to this embodiment. For example, in the present embodiment, an embodiment in which the pot 210 and the plunger 220 are accommodated in the lower mold 200 is described, but it is needless to say that these may be accommodated in the upper mold 100.
Further, in the present embodiment, the gap S1 existing between the planar position of the pot 210 and the plunger 220 and the outer position of the cavity space 190 (the part farthest from the pot 210 and the plunger 220 in the cavity space 190). Are arranged for all of S5 to S5, but at least one of the intersecting grooves 132, 142, 152,. It may be arranged. Moreover, although the structure which provides the shallow groove part 122 and the crossing groove | channel 242 along the outer periphery of the cull part 120 was demonstrated, you may arrange | position along the outer periphery of the runner 170, and along the outer periphery of the cavity space 190. It may be arranged.

Moreover, although the form which formed the cross groove (132, 142, 152, ...) of the cross-sectional semicircle shape in each of the clearance gaps S1-S5 is demonstrated, the cross groove (132, cross-section of a semicircular cross section) is demonstrated. 142, 152,...), And a groove whose cross-sectional shape is rectangular, U-shaped, or V-shaped.
And although the form in which the seal structure obtained by the resin 230 entering the gaps S1 to S5 and thermosetting remains has been described, it is of course possible for these seal structures to drop off for some reason. However, since these sealing structures can be formed even with a molding resin at the time of mass production, the grooves according to the present embodiment (the above embodiments) in the direction intersecting the depth direction of the respective gaps S1 to S5. Then, if the cross grooves (132, 142, 152,...) Are formed, the seal structure can always be repaired or renewed at the time of resin molding.

Moreover, in this embodiment, although the board | substrate 410 which mounted the LED element 420 as an electronic component which is a resin molded product is illustrated, the resin molded product is not limited to this. It may be a sealing target that seals one surface of a formed product on which an electronic component is not mounted, such as a wafer mold.
In addition, the ejector pin 160 has been described with respect to the configuration example provided so as to be able to protrude into the cull portion 120, but may be provided so as to be able to protrude into the cavity space 190.

100 Upper mold 120 Cull part 122 Shallow groove part 130 Upper mold center insert 140 Clamper 150 Cavity piece 160 Ejector pin 170 Runner 200 Lower mold 234 Cured resin 240 Lower mold center insert 250 Cavity insert 300 Mold mold 400 LED device 410 Substrate 420 LED element S1, S2, S3, S4, S5 Gap 132, 142, 152, 164, 242, 244, 252 Crossing groove

Claims (5)

In mold that consists a pair of dies vertically,
Gap having an opening portion connected to cull the thermosetting resin is supplied in the mold closing is mold parting plane, which is formed sandwiched between the pair of molds,
A shallow groove portion having a shallower depth than the cull portion connected to the cull portion is formed along the outer peripheral edge of the cull portion on the mold parting surface of one mold in which the cull portion is formed,
The other mold parting surface of the mold, the shallow extends opposite the groove, intersecting grooves as intends along a direction intersecting the direction from the cull part outwardly of the cull section Formed ,
The mold mold , wherein the outermost peripheral position of the shallow groove portion and the outermost peripheral position of the intersecting groove coincide with each other, and the shallow groove portion and the intersecting groove are connected to the gap . In a mold that is configured with a pair of upper and lower molds , clamps the substrate on which the LED element is mounted, and performs resin sealing of the LED element in the cavity,
A runner and a cull portion communicating with the cavity are formed on the parting surface of one mold in which the cavity having a concave portion for lens molding is formed at a position corresponding to the LED element,
The mold parting surface of the other mold is provided with a pot facing the cull part,
A fixed pair of gaps having an opening connected to the runner to which the thermosetting resin is supplied from the pot on the mold parting surface closed with the mold constitutes one of the one or the other mold. is formed in the intermediate portion of the runner between the mold blocks to intersect with the runner,
At least one of the pair of mold blocks arranged with the gap interposed therebetween, an intersecting groove is connected to the gap so as to extend along a direction intersecting the depth direction of the gap from the runner. molding die, characterized in that it is formed so as to. In each of the pair of mold blocks arranged with the gap in between, the intersecting groove is formed,
3. The mold according to claim 2, wherein the intersecting groove of one mold block and the intersecting groove of the other mold block face each other. In a mold that is configured with a pair of upper and lower molds , clamps the substrate on which the LED element is mounted, and performs resin sealing of the LED element in the cavity,
A runner and a cull portion communicating with the cavity are formed on the parting surface of one mold in which the cavity having a concave portion for lens molding is formed at a position corresponding to the LED element,
The mold parting surface of the other mold is provided with a pot facing the cull part,
A gap having an opening connected to the cavity to which the thermosetting resin is supplied from the pot on the mold parting surface that is closed with the mold includes a cavity piece constituting one mold and a clamper that accommodates the cavity piece. It is formed between the,
At least one of the cavity piece or the clamper arranged with the gap interposed therebetween, an intersecting groove is connected to the gap so as to extend along a direction intersecting the depth direction of the gap from the cavity. molding die, characterized in that it is formed so as to. A molding apparatus comprising the mold according to any one of claims 1 to 4 .