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JP5493485B2 - Thermal spray coating apparatus and power feeding method to wire - Google Patents
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JP5493485B2 - Thermal spray coating apparatus and power feeding method to wire - Google Patents

Thermal spray coating apparatus and power feeding method to wire Download PDF

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JP5493485B2
JP5493485B2 JP2009142220A JP2009142220A JP5493485B2 JP 5493485 B2 JP5493485 B2 JP 5493485B2 JP 2009142220 A JP2009142220 A JP 2009142220A JP 2009142220 A JP2009142220 A JP 2009142220A JP 5493485 B2 JP5493485 B2 JP 5493485B2
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wire
thermal spray
contact
spray coating
hole
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JP2010285675A (en
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英爾 塩谷
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Nissan Motor Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
    • B05B7/22Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc
    • B05B7/222Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc using an arc
    • B05B7/224Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc using an arc the material having originally the shape of a wire, rod or the like

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Nozzles (AREA)

Description

本発明は、溶融させた溶射材料を被溶射物に向けて噴射することにより溶射皮膜を形成する溶射皮膜形成装置及びワイヤへの給電方法に関し、詳細には、ワイヤへの給電技術に関する。   The present invention relates to a thermal spray coating forming apparatus for forming a thermal spray coating by injecting a molten thermal spray material toward an object to be sprayed, and a power feeding method to a wire, and more particularly to a power feeding technique to a wire.

例えば、旋回する溶射ガンの中央に溶射材料となるワイヤを溶射の進行に合わせて送給し、プラズマ発生部がワイヤに向かってプラズマを噴射することでワイヤを溶かし、溶滴となった溶射金属を被溶射物に吹き付けることで溶射皮膜を形成する溶射皮膜形成装置が提案されている(例えば、特許文献1に記載)。   For example, a wire that becomes a thermal spray material is fed to the center of a revolving spray gun in accordance with the progress of thermal spraying, and the plasma generating part sprays plasma toward the wire to melt the wire and form a thermal sprayed metal There has been proposed a thermal spray coating forming apparatus for forming a thermal spray coating by spraying a sprayed material on the object to be sprayed (for example, described in Patent Document 1).

特許文献1に記載の溶射皮膜形成装置では、送給されるワイヤをコンタクトチップ(ワイヤ用電極)に形成したワイヤ送給孔に送給させ、前記ワイヤを板バネでワイヤ送給孔の内壁に押し付けて接触させることで、該ワイヤに給電してプラズマを発生させる構造を採用している。   In the thermal spray coating forming apparatus described in Patent Document 1, a wire to be fed is fed into a wire feeding hole formed in a contact chip (wire electrode), and the wire is applied to an inner wall of the wire feeding hole by a leaf spring. A structure is adopted in which plasma is generated by supplying power to the wire by pressing and contacting.

特開2003−33877号公報JP 2003-33877 A

特許文献1に記載の構造では、前記したようにコンタクトチップ内部に設けた板バネの一定したバネ力で前記ワイヤをワイヤ送給孔の内壁に押し付けて前記ワイヤに給電する構造となっている。   In the structure described in Patent Document 1, as described above, the wire is pressed against the inner wall of the wire feed hole by a constant spring force of the leaf spring provided inside the contact chip, and the wire is fed with power.

そのため、特許文献1に記載の構造では、ワイヤとの接触点が少ないことにより該ワイヤへの給電状態が不安定になり易く、プラズマアークが安定しない。また、この構造では、板バネで押圧されたワイヤがワイヤ送給孔内壁に対して押し続けられることで局所的に摩耗が進行し易く、コンタクトチップの寿命が短くなる。   For this reason, in the structure described in Patent Document 1, since the number of contact points with the wire is small, the power supply state to the wire is likely to be unstable, and the plasma arc is not stable. Further, in this structure, since the wire pressed by the leaf spring is continuously pressed against the inner wall of the wire feed hole, wear tends to progress locally, and the life of the contact tip is shortened.

そこで、本発明は、ワイヤとコンタクトチップとの接点を多くできプラズマアークの安定化を図ると共に、コンタクトチップの寿命を延ばすことのできる溶射皮膜形成装置及びワイヤへの給電方法を提供することを目的とする。   Therefore, the present invention has an object to provide a thermal spray coating forming apparatus and a method for supplying power to a wire that can increase the number of contacts between the wire and the contact tip, stabilize the plasma arc, and extend the life of the contact tip. And

本発明の溶射皮膜形成装置では、コンタクトチップを、本体部と、この本体部の軸方向に貫通するワイヤ送給孔と、このワイヤ送給孔に収容されて前記ワイヤと接触する導電性を有した複数個の給電部材と、により構成する。   In the thermal spray coating forming apparatus of the present invention, the contact tip has a main body portion, a wire feed hole that penetrates in the axial direction of the main body portion, and a conductive material that is accommodated in the wire feed hole and comes into contact with the wire. And a plurality of power feeding members.

本発明のワイヤへの給電方法は、コンタクトチップに貫通するワイヤ送給孔に、ワイヤに接触する導電性を有した複数個の給電部材を設け、そのワイヤ送給孔に送給されるワイヤを給電部材に接触させて該ワイヤに給電するようにする。   In the method for feeding power to the wire of the present invention, a plurality of power feeding members having conductivity in contact with the wire are provided in the wire feeding hole penetrating the contact chip, and the wire fed to the wire feeding hole is provided. Power is supplied to the wire in contact with the power supply member.

本発明の溶射皮膜形成装置によれば、導電性を有した複数個の給電部材をワイヤ送給孔に収容させたので、ワイヤ送給孔に送給されたワイヤがその周囲を取り囲む複数個の給電部材と接触することになり、これら複数個の給電部材を介して前記ワイヤへ給電することができる。従って、本発明では、ワイヤとコンタクトチップとの接点が多くなり、該ワイヤへの給電状態が安定し、プラズマアークを安定発生させることができる。   According to the thermal spray coating forming apparatus of the present invention, since the plurality of conductive power supply members are accommodated in the wire feed holes, the plurality of wires fed to the wire feed holes surround the periphery thereof. It comes into contact with the power supply member, and power can be supplied to the wire via the plurality of power supply members. Therefore, in the present invention, the number of contacts between the wire and the contact tip is increased, the power supply state to the wire is stabilized, and the plasma arc can be stably generated.

一方、本発明のワイヤへの給電方法によれば、コンタクトチップに貫通するワイヤ送給孔に導電性を有した複数個の給電部材を設けると、このワイヤ送給孔に送給されるワイヤが複数個の給電部材と接触することになり、それらワイヤと給電部材の複数接点での接触によって前記ワイヤへの給電状態が安定し、プラズマアークを安定させて発生させることが可能となる。   On the other hand, according to the power feeding method to the wire of the present invention, when a plurality of power feeding members having conductivity are provided in the wire feeding hole penetrating the contact chip, the wire fed to the wire feeding hole is A plurality of power supply members are brought into contact with each other, and a contact state of the wires and the power supply members at a plurality of contact points stabilizes the power supply state to the wires, thereby making it possible to stably generate a plasma arc.

図1は実施形態1の溶射皮膜形成装置の全体図である。FIG. 1 is an overall view of a thermal spray coating forming apparatus according to a first embodiment. 図2は実施形態1のコンタクトチップとそのコンタクトチップが取り付けられる溶射ガン先端部分を示す図である。FIG. 2 is a view showing the contact tip of the first embodiment and the tip portion of the spray gun to which the contact tip is attached. 図3は実施形態1のコンタクトチップの分解斜視図である。FIG. 3 is an exploded perspective view of the contact chip according to the first embodiment. 図4は実施形態1のコンタクトチップのワイヤ送給孔にワイヤが送給された状態を示す断面図であり、(A)はワイヤの送給開始状態、(B)はワイヤの送給が進んだ状態をそれぞれ示す。4A and 4B are cross-sectional views showing a state in which the wire is fed into the wire feeding hole of the contact chip according to the first embodiment. FIG. 4A is a wire feeding start state, and FIG. Each state is shown. 図5は実施形態2のコンタクトチップの断面図であり、ワイヤ送給孔の内面に本体部の軸方向に沿って凸条部を設けた例を示す。FIG. 5 is a cross-sectional view of the contact tip according to the second embodiment, showing an example in which a convex strip is provided along the axial direction of the main body on the inner surface of the wire feed hole. 図6は実施形態3のコンタクトチップの分解斜視図であり、コンタクトチップを本体部と装着部に分けると共に、これらを2分割タイプとした例を示す。FIG. 6 is an exploded perspective view of the contact chip of the third embodiment, and shows an example in which the contact chip is divided into a main body part and a mounting part, and these are divided into two types. 図7は実施形態4のコンタクトチップの分解斜視図であり、コンタクトチップを2分割タイプとした例を示す。FIG. 7 is an exploded perspective view of the contact chip of the fourth embodiment, showing an example in which the contact chip is divided into two types.

以下、本発明を適用した具体的な実施形態について図面を参照しながら詳細に説明する。   Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings.

「実施形態1」
図1は実施形態1の溶射皮膜形成装置の全体図、図2は実施形態1のコンタクトチップとそのコンタクトチップが取り付けられる溶射ガン先端部分を示す図、図3は実施形態1のコンタクトチップの分解斜視図、図4は実施形態1のコンタクトチップのワイヤ送給孔にワイヤが送給された状態を示す断面図であり、(A)はワイヤの送給開始状態、(B)はワイヤの送給が進んだ状態をそれぞれ示す。
Embodiment 1”
1 is an overall view of a thermal spray coating forming apparatus according to the first embodiment, FIG. 2 is a diagram showing a contact tip according to the first embodiment and a tip portion of a thermal spray gun to which the contact tip is attached, and FIG. 3 is an exploded view of the contact tip according to the first embodiment. FIG. 4 is a cross-sectional view showing a state in which the wire is fed to the wire feeding hole of the contact chip of Embodiment 1, (A) is a wire feeding start state, and (B) is a wire feeding state. It shows the state where the salary has advanced.

溶射皮膜形成装置1は、図1に示すように、溶融金属を被溶射物に向けて噴射する溶射ガン2と、この溶射ガン2にワイヤ3を供給するワイヤ供給手段4と、溶射ガン2にガス(プラズマガス)を供給するガス供給手段と、溶射ガン2にアトマイズエアーを供給するエアー供給手段と、プラズマを発生させるプラズマ発生手段と、を備えている。   As shown in FIG. 1, the thermal spray coating forming apparatus 1 includes a thermal spray gun 2 that injects molten metal toward an object to be sprayed, a wire supply unit 4 that supplies a wire 3 to the thermal spray gun 2, and a thermal spray gun 2. Gas supply means for supplying gas (plasma gas), air supply means for supplying atomized air to the spray gun 2, and plasma generation means for generating plasma are provided.

溶射ガン2は、この溶射ガン2を旋回(回転)させるための主軸5の先端に取り付けられている。主軸5は、ハウジング6内に設けられたモータ7からの回転力をタイミングベルト8を介して伝達されることで、その先端に取り付けた溶射ガン2を回転させる。図1では、モータ7は、矢印Xで示す方向に溶射ガン2を回転させる。この溶射ガン2の中心には、前記した主軸5を軸方向に貫通して形成されたワーク送り孔9を通して溶射材料となるワイヤ3が送給されるようになっている。ワーク送り孔9は、ワイヤ3をガイドして送給するために、該ワイヤ3の直径よりも多少大きな直径を有した貫通孔として形成されている。   The thermal spray gun 2 is attached to the tip of the main shaft 5 for turning (rotating) the thermal spray gun 2. The main shaft 5 transmits the rotational force from the motor 7 provided in the housing 6 via the timing belt 8 to rotate the thermal spray gun 2 attached to the tip thereof. In FIG. 1, the motor 7 rotates the thermal spray gun 2 in the direction indicated by the arrow X. A wire 3 serving as a thermal spray material is fed to the center of the thermal spray gun 2 through a work feed hole 9 formed through the main shaft 5 in the axial direction. The work feed hole 9 is formed as a through-hole having a diameter slightly larger than the diameter of the wire 3 in order to guide and feed the wire 3.

ワイヤ供給手段4は、リール10に巻かれたワイヤ3を複数個の送給駆動ローラ11とバネでこの送給駆動ローラ11にワイヤ3を押し付ける送給補助ローラ12とを有し、これら送給駆動ローラ11と送給補助ローラ12とで、前記主軸5を通して溶射ガン2へとワイヤ3を送給させる。このワイヤ供給手段4では、溶射の進行(溶射量の増減に応じて)に合わせて、前記ワイヤ3の送り速度を可変して前記溶射ガン2へワイヤ3を送給するようになっている。   The wire supply means 4 includes a plurality of feed drive rollers 11 and a feed auxiliary roller 12 that presses the wire 3 against the feed drive roller 11 with springs. The wire 3 is fed to the thermal spray gun 2 through the main shaft 5 by the driving roller 11 and the feeding auxiliary roller 12. In the wire supply means 4, the wire 3 is fed to the spray gun 2 while changing the feed speed of the wire 3 in accordance with the progress of spraying (in accordance with the increase or decrease of the spray amount).

ガス供給手段及びエアー供給手段は、プラズマガス(ガス)を供給するガス供給部13と、アトマイズエアーを供給するエアー供給部14と、ガスエアーの経路であるロータリージョイント15と、を有している。ガス供給部13から供給されたプラズマガスとエアー供給部14から供給されたアトマイズエアーは、前記主軸5に形成されたそれぞれの供給路(図示は省略する)を介して前記溶射ガン2に供給されるようになっている。   The gas supply unit and the air supply unit include a gas supply unit 13 that supplies plasma gas (gas), an air supply unit 14 that supplies atomized air, and a rotary joint 15 that is a path of gas air. The plasma gas supplied from the gas supply unit 13 and the atomized air supplied from the air supply unit 14 are supplied to the thermal spray gun 2 via respective supply paths (not shown) formed in the main shaft 5. It has become so.

プラズマ発生手段は、電源部16と、この電源部16のプラス極と接続される一方の電極と、電源部16のマイナス極と接続される他方の電極17と、を有している。他方の電極17は、前記溶射ガン2に形成されたガス噴出孔(図示は省略する)の近傍に固定されている。一方の電極は、ワイヤ3を内部に接触させて送給させる導電性を有したコンタクトチップ18からなる。   The plasma generating means has a power supply unit 16, one electrode connected to the positive electrode of the power supply unit 16, and the other electrode 17 connected to the negative electrode of the power supply unit 16. The other electrode 17 is fixed in the vicinity of a gas ejection hole (not shown) formed in the thermal spray gun 2. One electrode is formed of a contact tip 18 having conductivity for bringing the wire 3 into contact with the inside and feeding it.

溶射ガン2には、ガス供給部13からガス噴出孔へとプラズマガスを供給するためのガス供給路が形成されている。また、溶射ガン2には、エアー供給部14からエアー噴出孔へとアトマイズエアーを供給するためのエアー供給路が形成されている。エアー噴出孔は、ガス噴出孔を中心として取り囲むように複数形成されている。   The thermal spray gun 2 is provided with a gas supply path for supplying plasma gas from the gas supply unit 13 to the gas ejection holes. The spray gun 2 is formed with an air supply path for supplying atomized air from the air supply unit 14 to the air ejection hole. A plurality of air ejection holes are formed so as to surround the gas ejection hole.

前記コンタクトチップ18は、図2に示すように、前記主軸5に形成されたワーク送り孔9と連通する貫通孔19とその貫通孔19の出口付近に形成された雌ねじ部20とを有したワイヤ供給用ガイド21に対して着脱自在に取り付けられている。このコンタクトチップ18は、例えば導電性材料からなり、一方の電極として機能する。   As shown in FIG. 2, the contact tip 18 has a through hole 19 communicating with the work feed hole 9 formed in the main shaft 5 and a female screw portion 20 formed in the vicinity of the outlet of the through hole 19. It is detachably attached to the supply guide 21. The contact chip 18 is made of, for example, a conductive material and functions as one electrode.

前記コンタクトチップ18は、図3及び図4に示すように、前記ワイヤ供給用ガイド21の雌ねじ部20に螺合される装着部18Aと、この装着部18Aに着脱自在とされる本体部18Bと、これら装着部18A及び本体部18Bを共に軸方向に貫通するワイヤ送給孔22と、このワイヤ送給孔22内に収容されて前記ワイヤ3と接触する導電性を有した複数個の給電部材23と、を備えている。   As shown in FIGS. 3 and 4, the contact chip 18 includes a mounting portion 18A that is screwed into the female screw portion 20 of the wire supply guide 21, and a main body portion 18B that is detachably attached to the mounting portion 18A. A wire feeding hole 22 that penetrates both the mounting portion 18A and the main body portion 18B in the axial direction, and a plurality of power feeding members that are accommodated in the wire feeding hole 22 and contact the wire 3 23.

前記装着部18Aは、ワイヤ供給用ガイド21の雌ねじ部20と螺合する雄ねじ部24と、本体部18Bと着脱自在に連結される連結部25と、からなる。連結部25は、一面側を開放させた円筒体として形成され、他面側に雄ねじ部24を形成している。この連結部25の円筒部内面には、前記本体部18Bに対して螺合して結合される連結用雌ねじ部26が形成されている。   18 A of said mounting parts consist of the external thread part 24 screwed together with the internal thread part 20 of the wire supply guide 21, and the connection part 25 connected detachably with the main-body part 18B. The connecting portion 25 is formed as a cylindrical body with one surface opened, and a male screw portion 24 is formed on the other surface side. On the inner surface of the cylindrical portion of the connecting portion 25, a connecting female screw portion 26 is formed that is screwed into the main body portion 18B.

前記本体部18Bは、前記装着部18Aとの連結側を円筒形状となし、ワイヤ出口側を漏斗形状としている。この本体部18Bには、前記装着部18Aの前記連結用雌ねじ部26と螺合して該装着部18Aに該本体部18Bを結合させる連結用雄ねじ部27が形成されている。   The main body portion 18B has a cylindrical shape on the connection side with the mounting portion 18A, and a funnel shape on the wire outlet side. The main body portion 18B is formed with a connecting male screw portion 27 that is screwed with the connecting female screw portion 26 of the mounting portion 18A to couple the main body portion 18B to the mounting portion 18A.

前記ワイヤ送給孔22は、結合された装着部18Aと本体部18Bを共に軸方向に貫通して形成される貫通孔とされている。このワイヤ送給孔22は、前記装着部18Aを貫通する第1送給孔22Aと、前記本体部18Bを貫通する第2送給孔22Bとからなる。第1送給孔22Aは、ワイヤ3を遊嵌させる断面円形状をなすストレート孔として形成されている。第2送給孔22Bは、内部空間を充分広くした大径孔22B1と、その大径孔22B1からワイヤ出口28に向かって先つぼみ形状とされる円錐孔22B2と、ワイヤ出口28のストレート孔22B3と、により形成されている。   The wire feed hole 22 is a through-hole formed so as to penetrate the combined mounting portion 18A and main body portion 18B in the axial direction. The wire feed hole 22 includes a first feed hole 22A that penetrates the mounting portion 18A and a second feed hole 22B that penetrates the main body portion 18B. The first feeding hole 22A is formed as a straight hole having a circular cross section into which the wire 3 is loosely fitted. The second feed hole 22B includes a large-diameter hole 22B1 having a sufficiently large internal space, a conical hole 22B2 that is formed in a tip shape from the large-diameter hole 22B1 toward the wire outlet 28, and a straight hole 22B3 in the wire outlet 28. And formed by.

前記給電部材23は、例えば金、白金、銅等の如き導電性に優れた鋼球からなる。この給電部材23は、ボール形状をなし、前記した本体部18Bの大径孔22B1と円錐孔22B2に多数個まとめて収容される。給電部材23の数は、ワイヤ3の送給に支承を来さない程度の数とされると共に、互いの給電部材23同士が接触した状態を維持する程度の数とされる。ここで使用する給電部材23の直径R1は、例えばワイヤ3の直径R2を1.6mmとし且つワイヤ出口28のストレート孔22B3の直径R3を1.7mmとした場合、このストレート孔22B3とワイヤ3との隙間Cである0.1mmよりも大きな寸法とする。また、給電部材23の直径R1は、ワイヤ3と大径孔22B1及び円錐孔22B2の内壁間の距離Wよりも小さい寸法とする。具体的には、給電部材23の直径R1は、1mm〜2mmとすることが好ましい。   The power supply member 23 is made of a steel ball having excellent conductivity such as gold, platinum, copper, or the like. The power supply member 23 has a ball shape and is accommodated in a large number in the large-diameter hole 22B1 and the conical hole 22B2 of the main body 18B. The number of power supply members 23 is set to a number that does not provide support for feeding the wire 3 and is a number that maintains the state where the power supply members 23 are in contact with each other. The diameter R1 of the power supply member 23 used here is, for example, when the diameter R2 of the wire 3 is 1.6 mm and the diameter R3 of the straight hole 22B3 of the wire outlet 28 is 1.7 mm, the straight hole 22B3 and the wire 3 The dimension is larger than 0.1 mm, which is the gap C. The diameter R1 of the power supply member 23 is smaller than the distance W between the wires 3 and the inner walls of the large-diameter hole 22B1 and the conical hole 22B2. Specifically, the diameter R1 of the power feeding member 23 is preferably 1 mm to 2 mm.

以上のように構成されたコンタクトチップ18は、前記ワイヤ供給用ガイド21の雌ねじ部20に雄ねじ部24を螺合させることで前記溶射ガン2に取り付けられて、前記電源部16のプラス極と接続される。その結果、コンタクトチップ18は、一方の電極となる。   The contact tip 18 configured as described above is attached to the thermal spray gun 2 by screwing the male screw portion 24 with the female screw portion 20 of the wire supply guide 21 and is connected to the positive electrode of the power supply portion 16. Is done. As a result, the contact chip 18 becomes one electrode.

次に、上述のように構成された溶射皮膜形成装置を使用して被溶射物に溶射皮膜を形成する方法並びにワイヤへの給電方法について説明する。   Next, a method for forming a thermal spray coating on the object to be sprayed using the thermal spray coating apparatus configured as described above and a method for supplying power to the wire will be described.

先ず、本体部22Bのワイヤ出口28に形成されるストレート孔22B3に丸棒等からなる栓を詰めてワイヤ出口28を仮封止した後、この本体部22Bの大径孔22B1及び円錐孔22B2内に複数個の給電部材23を入れる。そして、本体部18Bに装着部18Aを螺合し結合させることで、コンタクトチップ18を完成させる。次に、このコンタクトチップ18を、溶射ガン2のワイヤ供給用ガイド21に取り付ける。   First, a straight hole 22B3 formed in the wire outlet 28 of the main body portion 22B is filled with a plug made of a round bar or the like to temporarily seal the wire outlet 28, and then inside the large diameter hole 22B1 and the conical hole 22B2 of the main body portion 22B. A plurality of power supply members 23 are placed in the. Then, the contact portion 18 is completed by screwing and coupling the mounting portion 18A to the main body portion 18B. Next, the contact tip 18 is attached to the wire supply guide 21 of the thermal spray gun 2.

コンタクトチップ18がワイヤ供給用ガイド21に取り付けられたらガス供給部13からプラズマガスを主軸5を介して溶射ガン2のガス供給路へ供給する。同じく、エアー供給部14からアトマイズエアーを主軸5を介して溶射ガン2のエアー供給路へ供給する。すると、前記プラズマガスは、ガス噴出孔から外部へと噴射される。一方、アトマイズエアーは、前記ガス噴出孔より噴射されたプラズマガスを取り囲むようにして各エアー噴出孔から外部へと噴射される。   When the contact tip 18 is attached to the wire supply guide 21, plasma gas is supplied from the gas supply unit 13 to the gas supply path of the thermal spray gun 2 through the main shaft 5. Similarly, atomized air is supplied from the air supply unit 14 to the air supply path of the thermal spray gun 2 via the main shaft 5. Then, the plasma gas is ejected from the gas ejection hole to the outside. On the other hand, atomized air is jetted from the air jet holes to the outside so as to surround the plasma gas jetted from the gas jet holes.

次に、ワイヤ供給手段4によってワイヤ3を送給する。ワイヤ3は、主軸5のワーク送り孔9を介して溶射ガン2に設けたワイヤ供給用ガイド21の貫通孔19より前記コンタクトチップ18のワイヤ送給孔22へと送給される。ワイヤ供給手段4から供給されるワイヤ3は、リール10に巻かれた状態で使用されるため、巻き癖が残った湾曲状態でワイヤ送給孔22に供給される。   Next, the wire 3 is fed by the wire supply means 4. The wire 3 is fed from the through hole 19 of the wire supply guide 21 provided in the spray gun 2 to the wire feed hole 22 of the contact tip 18 through the work feed hole 9 of the main shaft 5. Since the wire 3 supplied from the wire supply means 4 is used while being wound around the reel 10, the wire 3 is supplied to the wire feed hole 22 in a curved state in which the curl remains.

前記ワイヤ送給孔22に送給されたワイヤ3は、装着部18Aの第1送給孔22Aに入り込む。この時、ワイヤ3は、第1送給孔22Aがストレート孔形状であるため、引っ掛かることなくスムーズに孔奥へと入り込む。また、ワイヤ3は、この第1送給孔22Aのストレート孔形状により真っ直ぐ孔奥へと案内される。   The wire 3 fed to the wire feed hole 22 enters the first feed hole 22A of the mounting portion 18A. At this time, since the first feed hole 22A has a straight hole shape, the wire 3 smoothly enters the hole without being caught. Further, the wire 3 is guided straight into the back of the hole by the straight hole shape of the first feeding hole 22A.

そして、ワイヤ3は、本体部18Bの大径孔22B1及び円錐孔22B2内に収容された複数個の給電部材23の中を通って孔奥へと送給され、ストレート孔22B3を仮封止していた栓を押しやってワイヤ出口28から外方へ突出する。ワイヤ出口28からワイヤ3が外方へ突き出ることで、このワイヤ出口28からの給電部材23の飛び出しが防止される。ワイヤ3は、リール10に巻回されて巻き癖がついていることからワイヤ送給孔22内で湾曲し、コンタクトチップ18の入口と出口で当該コンタクトチップ18に接触する。   Then, the wire 3 passes through the plurality of power supply members 23 accommodated in the large-diameter hole 22B1 and the conical hole 22B2 of the main body portion 18B, and is fed to the back of the hole to temporarily seal the straight hole 22B3. The stopper is pushed out and protrudes outward from the wire outlet 28. Since the wire 3 protrudes outward from the wire outlet 28, the feeding member 23 is prevented from jumping out from the wire outlet 28. Since the wire 3 is wound around the reel 10 and has wrinkles, the wire 3 is curved in the wire feed hole 22 and comes into contact with the contact tip 18 at the inlet and outlet of the contact tip 18.

また、ワイヤ3は、複数個の給電部材23と常に接触しながら送給されることになる。給電部材23は、導電性を有した銅等の鋼球であるため、ワイヤ3の送給により回転しながら該ワイヤ3と接触することになる。また、給電部材23は、互いに接触した状態を維持し且つ少なくとも幾つかの給電部材23が大径孔22B1及び円錐孔22B2の内壁面と接触する状態を維持する。   Further, the wire 3 is fed while always in contact with the plurality of power supply members 23. Since the power supply member 23 is a steel ball such as copper having conductivity, the power supply member 23 comes into contact with the wire 3 while rotating by feeding the wire 3. The power supply member 23 maintains a state in which the power supply members 23 are in contact with each other and maintains a state in which at least some of the power supply members 23 are in contact with the inner wall surfaces of the large-diameter hole 22B1 and the conical hole 22B2.

このように、ワイヤ3がコンタクトチップ18のワイヤ送給孔22内で複数個の給電部材23と接触することで、コンタクトチップ18から給電部材23を介してワイヤ3に給電され、当該ワイヤ3自体が一方の電極(プラス極)になる。   In this way, when the wire 3 comes into contact with the plurality of power supply members 23 in the wire feed hole 22 of the contact chip 18, power is supplied from the contact chip 18 to the wire 3 via the power supply member 23, and the wire 3 itself. Becomes one of the electrodes (positive electrode).

そして、ワイヤ3は、ワイヤ出口28でストレート孔22B3により真っ直ぐ外へ飛び出る。つまり、ワイヤ3は、ガス噴出孔の前方へ供給されることになる。   The wire 3 jumps straight out at the wire outlet 28 through the straight hole 22B3. That is, the wire 3 is supplied to the front of the gas ejection hole.

そして、コンタクトチップ18とワイヤ3との接触状態が維持された状態で、一方の電極となるコンタクトチップ18とガス噴出孔近傍に設けた他方の電極13間に電圧を印加して通電する。すると、これら電極間にプラズマが発生する。ガス噴出孔から噴射されるプラズマガスは、前記プラズマにより燃焼されて燃焼炎となる。   Then, in a state where the contact state between the contact tip 18 and the wire 3 is maintained, a voltage is applied between the contact tip 18 serving as one electrode and the other electrode 13 provided in the vicinity of the gas ejection hole to energize. Then, plasma is generated between these electrodes. The plasma gas ejected from the gas ejection holes is burned by the plasma and becomes a combustion flame.

前記ワイヤ3は、この燃焼炎によって溶融されて溶融金属となる。溶融金属は、エアー噴出孔から噴射されるアトマイズエアーにより溶射フレームとなって被溶射物に向けて噴射され、被溶射物表面に溶射皮膜として形成される。前記被溶射物への溶射時には、モータ7を駆動して主軸5を回転させ、この主軸5の先端に取り付けた溶射ガン2を旋回させる。   The wire 3 is melted by the combustion flame to become a molten metal. The molten metal becomes a sprayed frame by atomized air sprayed from the air ejection holes and is sprayed toward the sprayed material, and is formed as a sprayed coating on the surface of the sprayed material. At the time of spraying on the sprayed object, the motor 7 is driven to rotate the main shaft 5 and the spray gun 2 attached to the tip of the main shaft 5 is turned.

前記ワイヤ3は、被溶射物への溶射の進行に合わせて送給されるようになっている。例えば、溶射量が多くなればワイヤ3をより多く溶射ガン2へ送給し、溶射量が少なくなればワイヤ3の送給量を減らす。このように、ワイヤ3の送給量変動が生じると、湾曲したワイヤ3とコンタクトチップ18との接触部位であるワイヤ送給孔22の入口と出口が摩耗するが、複数個の給電部材23がワイヤ3と常に接触するため、ワイヤ3への通電状態が安定する。つまり、複数個の給電部材23がワイヤ3と接触することで、ワイヤ3とコンタクトチップ18との接点が多くでき、プラズマアークを安定させることができる。   The wire 3 is fed in accordance with the progress of thermal spraying on the object to be sprayed. For example, when the spraying amount increases, the wire 3 is supplied to the spraying gun 2 more, and when the spraying amount decreases, the feeding amount of the wire 3 is reduced. As described above, when the feed amount variation of the wire 3 occurs, the entrance and the exit of the wire feed hole 22 which is the contact portion between the curved wire 3 and the contact tip 18 are worn, but a plurality of power supply members 23 are formed. Since it is always in contact with the wire 3, the energization state to the wire 3 is stabilized. That is, when the plurality of power supply members 23 come into contact with the wire 3, the number of contacts between the wire 3 and the contact tip 18 can be increased, and the plasma arc can be stabilized.

被溶射物への溶射が進行すると、ワイヤ3の送給により給電部材23が接触摩耗してその大きさが次第に小さくなり、給電部材23全体が、図4(A)の初期状態から図4(B)に示すようにワイヤ出口28へと下がって行く。この時、ワイヤ送給孔22のうち円錐孔22B2を漏斗形状としたので、給電部材23のそれぞれが互いに接触した状態を維持しながらワイヤ出口28へと下がる。そのため、溶射を続けてもワイヤ3と複数個の給電部材23との接触状態が維持され、前記ワイヤ3に対する給電状態が安定する。   As the thermal spraying on the object to be sprayed proceeds, the power supply member 23 is contacted and worn by the feeding of the wire 3, and the size of the power supply member 23 gradually decreases, and the entire power supply member 23 is changed from the initial state of FIG. Go down to wire outlet 28 as shown in B). At this time, since the conical hole 22B2 of the wire feeding hole 22 has a funnel shape, the power feeding members 23 are lowered to the wire outlet 28 while maintaining a state where they are in contact with each other. Therefore, even if spraying is continued, the contact state between the wire 3 and the plurality of power supply members 23 is maintained, and the power supply state with respect to the wire 3 is stabilized.

なお、実施形態1では、給電部材23をボール形状としたが、完全なる球状でなくてもよい。   In the first embodiment, the power supply member 23 has a ball shape, but may not have a perfect spherical shape.

実施形態1の溶射皮膜形成装置によれば、導電性を有した複数個の給電部材23をワイヤ送給孔22に収容させたので、ワイヤ送給孔22に送給されたワイヤ3がその周囲を取り囲む複数個の給電部材23と接触することになり、これら複数個の給電部材23を介して前記ワイヤ3へ給電することができる。従って、本発明では、ワイヤ3とコンタクトチップ18との接点が多くなり、該ワイヤ3への給電状態が安定し、プラズマアークを安定発生させることができる。したがって、実施形態1によれば、溶射の進行に合わせて送給されるワイヤ3に対するコンタクトチップ18の安定した接触状態を維持して通電状態を安定化でき、コンタクトチップ18の寿命を延ばすことができる。   According to the thermal spray coating forming apparatus of the first embodiment, since the plurality of conductive power feeding members 23 are accommodated in the wire feeding holes 22, the wires 3 fed to the wire feeding holes 22 are surrounded by the surroundings. The plurality of power supply members 23 surrounding the wire 3 are in contact with each other, and power can be supplied to the wire 3 through the plurality of power supply members 23. Therefore, in the present invention, the number of contacts between the wire 3 and the contact tip 18 is increased, the power supply state to the wire 3 is stabilized, and a plasma arc can be stably generated. Therefore, according to the first embodiment, it is possible to maintain a stable contact state of the contact tip 18 with the wire 3 fed in accordance with the progress of thermal spraying, stabilize the energized state, and extend the life of the contact tip 18. it can.

また、実施形態1の溶射皮膜形成装置によれば、ワイヤ送給孔22をワイヤ出口28に向かって先つぼみ形状としたので、この先つぼみ形状によって給電部材23同士が常に接触する状態を維持する。   Moreover, according to the thermal spray coating formation apparatus of Embodiment 1, since the wire feed hole 22 was made into the shape of a tip toward the wire exit 28, the state where the electric power feeding members 23 always contact each other is maintained by this tip-down shape.

また、実施形態1の溶射皮膜形成装置によれば、給電部材23は摩耗して先つぼみとされたワイヤ出口28へと移動して該ワイヤ3との接触状態を維持するため、ワイヤ3との接触及び給電部材23同士の接触等で摩耗し小さくなってもワイヤ出口28へと移動し、給電部材23同士及び給電部材23とワイヤ3との接触状態を維持させることができ、コンタクトチップ18の寿命を延ばすことが可能となる。   In addition, according to the thermal spray coating forming apparatus of the first embodiment, the power supply member 23 is worn and moved to the wire outlet 28 that is pointed, so that the contact state with the wire 3 is maintained. Even if the contact and the contact between the power supply members 23 become worn and become small, the wire exit 28 can be moved to maintain the contact state between the power supply members 23 and between the power supply member 23 and the wire 3. The service life can be extended.

また、実施形態1の溶射皮膜形成装置によれば、給電部材23を鋼球としたので、球状の性質としてワイヤ3の送給によって回転し易く偏摩耗もし難くなり、摩耗後もワイヤ3との接触状態を維持することができる。   Further, according to the thermal spray coating forming apparatus of the first embodiment, since the power supply member 23 is a steel ball, the spherical property makes it easy to rotate by feeding the wire 3 and difficult to cause uneven wear. The contact state can be maintained.

また、実施形態1の溶射皮膜形成装置によれば、給電部材23の直径R1を少なくともワイヤ出口28とこのワイヤ出口28を通る前記ワイヤ3との隙間Cよりも大としたので、ワイヤ出口28から給電部材23が飛び出るのを防止することができる。   Further, according to the thermal spray coating forming apparatus of the first embodiment, the diameter R1 of the power supply member 23 is at least larger than the gap C between the wire outlet 28 and the wire 3 passing through the wire outlet 28. The feeding member 23 can be prevented from popping out.

また、実施形態1のワイヤへの給電方法によれば、コンタクトチップ18に貫通するワイヤ送給孔22に、ワイヤ3に接触する導電性を有した複数個の給電部材23を設け、そのワイヤ送給孔22に送給されるワイヤ3を給電部材23に接触させて該ワイヤ3に給電するため、ワイヤ3と給電部材23との接触点が増えることから、ワイヤ3への給電状態が安定する。その結果、プラズマアークを安定して発生させることができる。   Further, according to the power feeding method to the wire of the first embodiment, a plurality of power feeding members 23 having conductivity in contact with the wire 3 are provided in the wire feeding hole 22 penetrating the contact chip 18, and the wire feeding is performed. Since the wire 3 fed to the supply hole 22 is brought into contact with the power supply member 23 to supply power to the wire 3, the number of contact points between the wire 3 and the power supply member 23 increases, so that the power supply state to the wire 3 is stabilized. . As a result, a plasma arc can be generated stably.

「実施形態2」
図5は実施形態2のコンタクトチップの断面図である。
“Embodiment 2”
FIG. 5 is a cross-sectional view of the contact chip of the second embodiment.

実施形態2では、ワイヤ送給孔22の内面に本体部18Bの軸方向に沿って凸条部29を設けた構成としている。具体的には、コンタクトチップ18のうち本体部18Bの大径孔22B1と円錐孔22B2の内面に、この本体部18Bの中心へ突出し且つこの本体部18Bの軸方向へ連続するように断面矩形状をなす凸条部29を形成している。この実施形態では、3つの凸条部29を、前記本体部18Bの内部空間を略3等分する位置に設けている。これにより、ワイヤ3は、3つの凸条部29で挟まれた中央部に送給されることになる。   In Embodiment 2, it is set as the structure which provided the protruding item | line part 29 along the axial direction of the main-body part 18B in the inner surface of the wire feed hole 22. As shown in FIG. Specifically, the contact chip 18 has a rectangular cross-section so as to protrude from the inner surface of the large-diameter hole 22B1 and the conical hole 22B2 of the main body 18B to the center of the main body 18B and continue in the axial direction of the main body 18B. Is formed. In this embodiment, the three ridges 29 are provided at positions that divide the internal space of the main body 18B into approximately three equal parts. As a result, the wire 3 is fed to the central portion sandwiched between the three ridges 29.

実施形態2の溶射皮膜形成装置によれば、前記凸条部29を本体部18の内部空間に軸方向に沿って設けているので、この凸条部29に給電部材23が接触してその接点が増えることにより、給電部材23とコンタクトチップ18との接触状態が安定し、ワイヤ3への給電状態をより一層安定化させることができる。   According to the thermal spray coating forming apparatus of the second embodiment, since the ridge portion 29 is provided in the internal space of the main body portion 18 along the axial direction, the power feeding member 23 contacts the ridge portion 29 and the contact point thereof. As a result, the contact state between the power supply member 23 and the contact chip 18 is stabilized, and the power supply state to the wire 3 can be further stabilized.

「実施形態3」
図6は実施形態3のコンタクトチップの分解斜視図である。
Embodiment 3”
FIG. 6 is an exploded perspective view of the contact chip according to the third embodiment.

実施形態3では、装着部18Aと本体部18Bとからなるコンタクトチップ18を、ワイヤ3の送給方向である軸方向に沿ってコンタクトチップ18を2分割した構造としている。その他の構造は、実施形態1のコンタクトチップ18の構造と同一であるため、ここでは同一部材には実施形態1で使用した符号と同一の符号を付し、その説明は省略するものとする。   In the third embodiment, the contact chip 18 including the mounting portion 18A and the main body portion 18B has a structure in which the contact chip 18 is divided into two along the axial direction that is the feeding direction of the wire 3. Since the other structure is the same as the structure of the contact chip 18 of the first embodiment, the same members are denoted by the same reference numerals as those used in the first embodiment, and description thereof is omitted here.

実施形態3の2分割タイプのコンタクトチップ18を使用した場合は、実施形態1のコンタクトチップ18と同様、ワイヤ送給孔22に送給されたワイヤ3がその周囲を取り囲む複数個の給電部材23と接触して、これら複数個の給電部材23を介して前記ワイヤ3へ給電することができる。従って、実施形態3によれば、ワイヤ3とコンタクトチップ18との接点が複数個の給電部材23によって増え、該ワイヤ3への給電状態が安定し、プラズマアークを安定発生させることができる。   When the two-divided contact tip 18 of the third embodiment is used, a plurality of power supply members 23 surrounding the periphery of the wire 3 fed to the wire feed hole 22 as in the contact tip 18 of the first embodiment. Can be supplied to the wire 3 via the plurality of power supply members 23. Therefore, according to the third embodiment, the number of contacts between the wire 3 and the contact tip 18 is increased by the plurality of power supply members 23, the state of power supply to the wire 3 is stabilized, and a plasma arc can be stably generated.

「実施形態4」
図7は実施形態4のコンタクトチップの分解斜視図である。
“Embodiment 4”
FIG. 7 is an exploded perspective view of the contact chip of the fourth embodiment.

実施形態1では、コンタクトチップ18を装着部18Aと本体部18Bとで構成したが、実施形態4では、装着部18Aと本体部18Bとに分けるのではなくこれらを最初から一体化したコンタクトチップ30とし、そのコンタクトチップ30をワイヤ3の送給方向である軸方向で2分割した構造とする。また、2分割された2つのチップ30A、30Bのワイヤ送給孔22には、実施形態2で形成した凸条部29を形成してある。この実施形態4では、実施形態1のコンタクトチップ18と同一構成部位には同一の符号を付し、その説明は省略するものとする。   In the first embodiment, the contact chip 18 is composed of the mounting portion 18A and the main body portion 18B. In the fourth embodiment, the contact chip 30 is integrated from the beginning instead of being divided into the mounting portion 18A and the main body portion 18B. The contact chip 30 is divided into two in the axial direction that is the feeding direction of the wire 3. Further, the ridges 29 formed in the second embodiment are formed in the wire feeding holes 22 of the two chips 30A and 30B divided into two. In the fourth embodiment, the same components as those of the contact chip 18 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

実施形態4のコンタクトチップ30を使用した場合は、やはり実施形態1のコンタクトチップ18と同様、ワイヤ送給孔22に送給されたワイヤ3がその周囲を取り囲む複数個の給電部材23と接触して、これら複数個の給電部材23を介して前記ワイヤ3へ給電することができる。また、ワイヤ送給孔22にコンタクトチップ30の軸方向に沿って形成された凸条部29によって、給電部材23とコンタクトチップ30との接触状態が安定し、ワイヤ3への給電状態をより一層安定化させることができる。   When the contact tip 30 of the fourth embodiment is used, the wire 3 fed to the wire feed hole 22 is in contact with a plurality of power supply members 23 surrounding the periphery thereof, as in the contact tip 18 of the first embodiment. Thus, power can be supplied to the wire 3 through the plurality of power supply members 23. Further, the protruding portion 29 formed in the wire feed hole 22 along the axial direction of the contact chip 30 stabilizes the contact state between the power supply member 23 and the contact chip 30, and further increases the power supply state to the wire 3. Can be stabilized.

本発明は、溶融させた溶射材料を被溶射物に向けて噴射することにより溶射皮膜を形成する溶射皮膜形成装置に利用することができる。   INDUSTRIAL APPLICABILITY The present invention can be used for a thermal spray coating forming apparatus that forms a thermal spray coating by spraying a molten thermal spray material toward a sprayed object.

1…溶射皮膜形成装置
2…溶射ガン
3…ワイヤ
4…ワイヤ供給手段
5…主軸
13…ガス供給部
14…エアー供給部
17…電極(他方の電極)
18…コンタクトチップ(一方の電極)
18A…装着部
18B…本体部
20…雌ねじ部(ワイヤ供給用ガイドに形成された雌ねじ部)
22…ワイヤ送給孔
22A…第1送給孔(装着部に形成された送給孔)
22B…第2送給孔(本体部に形成された送給孔)
23…給電部材
28…ワイヤ出口
29…凸条部
DESCRIPTION OF SYMBOLS 1 ... Sprayed-film formation apparatus 2 ... Spray gun 3 ... Wire 4 ... Wire supply means 5 ... Main shaft 13 ... Gas supply part 14 ... Air supply part 17 ... Electrode (other electrode)
18 ... Contact chip (one electrode)
18A ... Mounting part 18B ... Main body part 20 ... Female thread part (female thread part formed in the wire supply guide)
22 ... Wire feeding hole 22A ... First feeding hole (feeding hole formed in the mounting portion)
22B ... 2nd feeding hole (feeding hole formed in the main-body part)
23 ... Power feeding member 28 ... Wire outlet 29 ... Projection

Claims (6)

溶射ガンに取り付けた一方の電極となるコンタクトチップ内に溶射材料となるワイヤを送給し、該コンタクトチップとガス噴出孔近傍に設けた他方の電極間にプラズマを発生させ、そのプラズマによりガス噴出孔から噴射されるガスを燃焼させて前記ワイヤを溶融し、その溶融した溶融金属を被溶射物に向けて噴射して被溶射物表面に溶射皮膜を形成する溶射皮膜形成装置において、
前記コンタクトチップは、本体部と、この本体部の軸方向に貫通するワイヤ送給孔と、このワイヤ送給孔内に収容されて前記ワイヤと接触する導電性を有した複数個の給電部材と、からなる
ことを特徴とする溶射皮膜形成装置。
A wire serving as a thermal spray material is fed into a contact tip serving as one electrode attached to the spray gun, and plasma is generated between the contact tip and the other electrode provided in the vicinity of the gas ejection hole. In the thermal spray coating forming apparatus that burns the gas injected from the holes to melt the wire, and injects the molten metal toward the thermal spray to form a thermal spray coating on the surface of the thermal spray,
The contact chip includes a main body portion, a wire feeding hole penetrating in the axial direction of the main body portion, and a plurality of power feeding members having electrical conductivity which are accommodated in the wire feeding hole and come into contact with the wire. An apparatus for forming a sprayed coating, comprising:
請求項1に記載の溶射皮膜形成装置であって、
前記ワイヤ送給孔は、ワイヤ出口に向かって先つぼみ形状である
ことを特徴とする溶射皮膜形成装置。
The thermal spray coating forming apparatus according to claim 1,
The said wire feed hole is a tip shape toward the wire exit. The thermal spray coating formation apparatus characterized by the above-mentioned.
請求項1又は請求項2に記載の溶射皮膜形成装置であって、
前記給電部材は、鋼球からなる
ことを特徴とする溶射皮膜形成装置。
The thermal spray coating apparatus according to claim 1 or 2,
The power supply member is made of a steel ball.
請求項3に記載の溶射皮膜形成装置であって、
前記給電部材の直径は、少なくともワイヤ出口とこのワイヤ出口を通る前記ワイヤとの隙間よりも大である
ことを特徴とする溶射皮膜形成装置。
The thermal spray coating forming apparatus according to claim 3,
A diameter of the power supply member is at least larger than a gap between a wire outlet and the wire passing through the wire outlet.
少なくとも請求項1から請求項4の何れか1項に記載の溶射皮膜形成装置であって、
前記ワイヤ送給孔の内面に、前記本体部の軸方向に沿って凸条部を設けた
ことを特徴とする溶射皮膜形成装置。
The spray coating apparatus according to any one of claims 1 to 4, wherein:
A thermal spray coating forming apparatus, wherein a protrusion is provided along the axial direction of the main body on the inner surface of the wire feed hole.
溶射ガンに取り付けた一方の電極となるコンタクトチップ内に溶射材料となるワイヤを送給し、該コンタクトチップとガス噴出孔近傍に設けた他方の電極間にプラズマを発生させ、そのプラズマによりガス噴出孔から噴射されるガスを燃焼させて前記ワイヤを溶融し、その溶融した溶融金属を被溶射物に向けて噴射して被溶射物表面に溶射皮膜を形成する溶射皮膜形成装置におけるワイヤへの給電方法において、
前記コンタクトチップに貫通するワイヤ送給孔に、前記ワイヤに接触する導電性を有した複数個の給電部材を設け、前記ワイヤ送給孔に送給される前記ワイヤを前記給電部材に接触させて該ワイヤに給電する
ことを特徴とするワイヤへの給電方法。
A wire serving as a thermal spray material is fed into a contact tip serving as one electrode attached to the spray gun, and plasma is generated between the contact tip and the other electrode provided in the vicinity of the gas ejection hole. Electric power is supplied to the wire in the thermal spray coating forming apparatus that burns the gas injected from the holes to melt the wire, and injects the molten metal toward the thermal spray to form a thermal spray coating on the surface of the thermal spray. In the method
A plurality of power supply members having conductivity that come into contact with the wire are provided in a wire feed hole that penetrates the contact chip, and the wire fed to the wire feed hole is brought into contact with the power feed member. Supplying power to the wire. A method of supplying power to the wire.
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