JP5503333B2 - Laser processing machine - Google Patents

Description

  The present invention relates to a laser processing machine that processes a thin plate-like workpiece such as a flexible printed circuit board with a laser, and more particularly to a laser processing machine that can remove wrinkles of a workpiece before processing with a laser.

Conventionally, a flexible printed circuit board has been processed by a laser processing machine because of its thin thickness even by using a build-up method, even if it is a high multilayer substrate. Thus, when processing a workpiece | work with a laser processing machine, laser processing is performed in the state which mounted the workpiece | work on the workpiece | work mounting surface of the processing table, and was fixed by adsorb | sucking to a workpiece | work mounting surface. However, in the case of a thin substrate with a small thickness, the rigidity of the substrate is low, so that wrinkles (unevenness) may be formed during suction. In laser processing, if the depth of focus of the laser exceeds an allowable value, normal processing cannot be performed, and such wrinkles may cause processing defects. This allowable value is, for example, about ± 30 to 100 μm for a CO ₂ laser and about ± 100 to 200 μm for a UV laser. Therefore, if the wrinkle height difference exceeds this allowable value, accurate machining cannot be performed.

  For this reason, the structure which removes the wrinkle of a sheet-like workpiece | work is known (refer patent document 1). In the case of the structure described in Patent Document 1, a pressing member is arranged above the workpiece placement surface, and the pressing member is lowered in a state where the sheet-like workpiece is arranged so as to straddle the workpiece placement surface. Thus, the entire surface of the sheet-like workpiece is pressed once to remove wrinkles, and then the workpiece is adsorbed to the workpiece placement surface.

JP 2006-136897 A

  However, in the case of the structure described in Patent Document 1 described above, the wrinkles are removed before the workpiece is attracted to the workpiece placement surface, and the roll-shaped sheet is held so as to straddle the workpiece placement surface. The wrinkle is removed. On the other hand, workpieces to be processed by a laser processing machine include not only roll-shaped sheets but also thin plate-shaped ones having a predetermined area. Such a thin plate-like workpiece needs to be removed after it is adsorbed to the workpiece mounting surface, and such a thin plate-like workpiece is removed with the structure described in Patent Document 1. That is not suitable.

  That is, in the case of the structure described in Patent Document 1, the entire surface of the sheet-like workpiece placed on the workpiece placement surface is pressed by the pressing member at a time to remove wrinkles, so that the workpiece is attracted to the workpiece placement surface. In the fixed state, due to the frictional force between the pressing surface of the pressing member and the wrinkle, the wrinkle is pressed against the pressing surface before being stretched and bent at the wrinkled portion, which may reduce the yield.

  In the case of the structure described in Patent Document 1, the holding member needs to be large enough to hold the entire surface of the workpiece, and thus the entire apparatus is inevitably increased in size. If the pressing member is made smaller than the entire surface of the workpiece, it is necessary to change the position of the pressing member against the workpiece many times in order to remove wrinkles on the entire surface of the workpiece. That is, it is necessary to repeat the process of pressing the pressing member in a predetermined area, then raising the pressing member, moving to the next area, and pressing again on this area. As a result, the time (tact time) required for loading and unloading the workpiece from the laser processing machine to unloading is increased.

  In view of such circumstances, the present invention was invented to realize a laser processing machine capable of suppressing a decrease in yield due to workpiece processing, shortening tact time, and further reducing the size of the entire apparatus. .

The present invention provides a laser processing apparatus for laser processing a thin plate-like workpiece (W) placed on a workpiece placement surface (41) of a machining table (4).
It is arranged opposite to the processing table (4), is relatively movable in parallel with the work mounting surface (41) with respect to the processing table (4), and is centered on a rotation axis (73) perpendicular to the moving direction. As a rotatable roller (72),
By moving the roller (72) and the processing table (4) relative to each other while bringing the roller (72) into contact with the surface of the work (W) placed on the work placement surface (41). , the roller (72) by rolling on the surface of the workpiece (W), in the laser machining apparatus characterized by removing the wrinkles of the work (W).

Note that removing wrinkles is to make the difference in level of the wrinkle unevenness smaller than the allowable value of the focal depth of the laser used for laser processing. For example, when a CO ₂ laser is used for laser processing, the height difference is set to less than ± 30 μm. In addition, when using a UV laser, it is less than ± 100 μm.

Preferably, it has reciprocating means (71, 83) for reciprocating the roller (72) in the pressing direction against the work placing surface (41),
The reciprocating means (71, 83) can press the roller (72) against the work (W) placed on the work placement surface (41) with a predetermined force.

More preferably, the surface of the roller (72) can adsorb foreign matter adhering to the surface of the workpiece (W) when the roller (72) and the processing table (4) are moved relative to each other .

More preferably, the workpiece (W) is detachable, and the workpiece placement surface (41) is between the workpiece placement surface (41) and a position away from the workpiece placement surface (41). Moving means (8) movable in a direction parallel to
The roller (72) is fixed to the moving means (8), and the moving means (8) places the work (W) on the work placing surface (41), and the work placing surface (41). When moving to a position deviated from (), wrinkles of the workpiece (W) are removed while abutting on the surface of the workpiece (W) placed on the workpiece placement surface (41).

  In addition, although the code | symbol in the said parenthesis is for contrast with drawing, it does not have any influence on description of a claim by this.

According to the present invention according to claim 1, the roller rolls on the surface of the workpiece to remove wrinkles of the work, can reduce the frictional force between the roller surface and wrinkles, the wrinkles without wrinkles is extended It is possible to suppress bending at the portion, and to suppress a decrease in yield when removing wrinkles on the workpiece. Also, since the wrinkles of the workpiece are removed by rolling the roller, it is possible to remove wrinkles with an area larger than the surface area of the roller by simply passing the roller while rolling on the workpiece, and the tact time is shortened. it can. In particular, if the length of the roller is equal to or greater than the width of the workpiece, the wrinkle of the entire workpiece can be removed and the tact time can be shortened by passing the roller once while rolling on the workpiece. Furthermore, the roller only needs to have a length corresponding to at least the width of the workpiece, and it is not necessary to make the surface area a size corresponding to the entire surface of the workpiece (that is, it is not necessary to increase the outer diameter more than necessary). The entire device can be downsized.

  According to the second aspect of the present invention, since the reciprocating means for reciprocating the roller with respect to the workpiece placement surface is provided, it is not necessary to strictly regulate the positional relationship between the roller and the workpiece placement surface, and a manufacturing error is caused. Variations in product accuracy due to can be suppressed. In other words, if there is no reciprocating means, it is necessary to properly arrange the roller with respect to the workpiece mounting surface in consideration of the thickness of the workpiece, and to move in this state. there is a possibility. On the other hand, if the roller can be reciprocated with respect to the workpiece mounting surface by the reciprocating means, the roller can be appropriately arranged on the workpiece mounting surface by the reciprocating means, and variations in product systems due to manufacturing errors are suppressed. It is done. Further, if the pressing force of the roller against the workpiece is adjusted by the reciprocating means, processing according to the material of the workpiece can be performed.

  According to the third aspect of the present invention, since wrinkles can be removed and foreign matters on the workpiece can be removed, the efficiency is good. Further, if foreign matter on the workpiece can be removed, it is possible to prevent a processing defect from being caused by laser processing performed thereafter.

  According to the fourth aspect of the present invention, since the roller can be moved together with the moving means for moving the workpiece, the apparatus can be simplified. Further, when the moving means places the work on the work placement surface and retracts from the work placement surface, wrinkles can be removed by the rollers, and the efficiency can be improved and the tact time can be shortened.

1 is a schematic configuration diagram showing a laser processing apparatus according to a first embodiment of the present invention. The principal part enlarged view for demonstrating the process of removing a wrinkle in 1st Embodiment. The principal part enlarged view for demonstrating the process of removing the conveyance and wrinkle of a workpiece | work in the 2nd Embodiment of this invention. The principal part enlarged view of the component of a roller and the electrostatic attraction | suction means in the 3rd Embodiment of this invention.

<First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS. 1 and 2. First, the laser processing apparatus 1 of this embodiment will be briefly described with reference to FIG. The laser processing apparatus 1 includes a portal column 3 and a processing table 4 arranged on a bed 2. In the column 3, a laser oscillator 31, a plurality of mirrors 32 a and 32 b, a galvano scanner 33, and an fθ lens 34 are provided. The mirror 32b, the galvano scanner 33, and the fθ lens 34 are disposed in the laser irradiation head 35. The laser irradiation head 35 is disposed to face the upper surface of the processing table 4.

  The laser beam L emitted from the laser oscillator 31 is guided to the galvano scanner 33 in the laser irradiation head 35 through the mirrors 32a and 32b. Then, the laser beam L is scanned by the galvano scanner 33 in two orthogonal axes (X-axis and Y-axis directions described below) and condensed by the fθ lens 34 to be placed on the processing table 4. A thin plate-like workpiece W such as a printed circuit board is processed while being scanned.

  Further, the machining table 4 is arranged on a Y table 5 movable in the left-right direction (Y-axis direction) in FIG. 1, and the Y table 5 is an X table movable in the front-back direction (X-axis direction) in FIG. 6 is arranged. The X table 6 is placed on a pair of guide rails 61 disposed on the bed 2 in the X-axis direction, and the guide rail 61 is driven by a driving source such as a servo motor (not shown) and power transmission means such as a ball screw. It can move along. The Y table 5 is placed on a pair of guide rails 51 arranged in the Y-axis direction on the X table 6 and is driven by a drive source such as a servo motor (not shown) and power transmission means such as a ball screw. It can move along the guide rail 51. With this configuration, the processing table 4 can reciprocate in the X-axis direction and the Y-axis direction, which are orthogonal two-axis directions. And the relative movement of the process table 4 and the laser irradiation head 35 is enabled.

  Further, a hollow portion is provided in the processing table 4, and this hollow portion is connected to a vacuum source such as a vacuum pump (not shown). In addition, a plurality of holes are formed in the workpiece placement surface 41 on which the workpiece W is placed on the surface of the processing table 4 and communicates the outside with the hollow portion. When the vacuum part is depressurized by the vacuum part, the hollow part becomes negative pressure, and the workpiece W placed on the workpiece placement surface 41 is sucked and fixed through the plurality of holes. The workpiece placement surface 41 and the XY plane are parallel.

  A roller unit 7 is fixed at a position adjacent to the laser irradiation head 35 of the column 3. The roller unit 7 includes a drive cylinder 71 that is a reciprocating means disposed so as to protrude from the column 3 toward the processing table 4, and a roller 72 that is rotatably supported at the tip of the drive cylinder 71. The

  The drive cylinder 71 is driven by hydraulic pressure or air pressure, and is driven in the vertical direction (Z-axis direction) in FIG. A rotating shaft 73 disposed in the X-axis direction is supported at the tip of the drive cylinder 71, and a roller 72 made of an elastic material such as rubber is attached to the rotating shaft 73 via a bearing or the like. It is supported rotatably around the center. The roller 72 has an outer peripheral surface made of a cylindrical surface whose axial length is larger than the width of the workpiece W in the X-axis direction. The reciprocating means may be a ball screw mechanism that is rotationally driven by a drive source such as a servo motor, for example, in addition to the drive cylinder 71.

  The roller unit 7 described above reciprocates the roller 72 in the Z-axis direction by the drive cylinder 71, and moves the roller 72 to and from the processing table 4. The roller 72 can be pressed against the workpiece W placed on the workpiece placement surface 41 of the processing table 4 with a predetermined force. This pressing force can be adjusted according to the material of the workpiece W, for example, according to the material and thickness of the workpiece W.

  The machining process of the workpiece W by the laser machining apparatus 1 configured as described above will be described. First, the work W is placed on the work placement surface 41 of the processing table 4 by a transport device (not shown) so that the longitudinal direction is substantially parallel to the Y-axis direction. And the vacuum source connected to the hollow part of the process table 4 is driven, and the workpiece | work W is adsorb | sucked and fixed to the workpiece | work mounting surface 41. FIG. In this state, the roller 72 is present at a position off the workpiece placement surface 41 on the processing table 4. In addition, wrinkles as shown in FIG. If the workpiece W is fixed to the workpiece placement surface 41, the X and Y tables 6 and 5 are driven to move one end of the workpiece W on the machining table 4 in the Y-axis direction to a position facing the roller 72. .

  Next, the drive cylinder 71 is driven to move the roller 72 toward the workpiece W, and the roller 72 is pressed against one end portion in the Y-axis direction with a predetermined force. The positional relationship in the Y-axis direction at this time is as shown in FIG. The positional relationship in the X-axis direction is a position where the width of the workpiece W in the X-axis direction is within the range of the length of the roller 72 in the X-axis direction. Preferably, the central portions of the roller 72 and the workpiece W in the X-axis direction are substantially matched.

  From this state, the machining table 4 is moved to one end side in the Y-axis direction (left side in FIG. 1, direction of arrow α in FIGS. 1 and 2). Then, while the roller 72 is in contact with the surface of the workpiece W, the roller 72 rotates about the rotation shaft 73 arranged in the X-axis direction perpendicular to the moving direction in the direction of arrow β in FIGS. Rolling on the surface of the workpiece W while pressing with a predetermined force. At this time, as shown in FIGS. 2A to 2B, the wrinkles of the workpiece W are stretched and removed by the rolling of the roller 72. Specifically, the height difference of the wrinkle unevenness is made smaller than the allowable value of the focal depth of the laser used for laser processing. When the roller 72 reaches the other end in the Y-axis direction of the workpiece W or passes through the other end, the movement of the processing table 4 in the Y-axis direction is stopped and the roller 72 is driven by the drive cylinder 71. Is moved away from the processing table 4 and the pressing force by the roller 72 is released.

  If the wrinkles of the workpiece W are removed, the processing table 4 is moved to a position facing the laser irradiation head 35. Then, the predetermined area of the processing part of the workpiece W is positioned with respect to the laser irradiation head 35, and the predetermined area of the workpiece W is processed by the laser beam. Next, the machining table 4 is moved in the X and Y axis directions, and the next area of the workpiece W is similarly machined. After the laser processing is completed, the vacuum source is stopped, and the suction of the workpiece W to the workpiece placement surface 41 is released. Thereafter, the processed workpiece W is unloaded from the processing table 4 by the transport device.

  According to the present embodiment, the wrinkles of the work W are removed by rolling the roller 72 on the surface of the work W, so that the frictional force between the surface of the roller 72 and the wrinkles can be reduced, and the wrinkles can be reduced without the wrinkles being stretched. It is possible to suppress bending at a portion, and to suppress a decrease in yield when removing wrinkles of the workpiece W. Further, since the length of the roller 72 is made larger than the width of the workpiece W, the wrinkle of the entire workpiece W can be removed by only passing the roller 72 once while rolling on the workpiece W, and the tact time is shortened. it can. Further, the length of the roller 72 corresponds to the width of the workpiece W, and it is not necessary to make the surface area corresponding to the entire surface of the workpiece W, so that the entire apparatus can be reduced in size.

  In addition, since the drive cylinder 71 for reciprocating the roller 72 with respect to the workpiece placement surface 41 is provided, it is not necessary to strictly regulate the positional relationship between the roller 72 and the workpiece placement surface 41, and the product accuracy due to manufacturing errors can be reduced. Variation can be suppressed. Further, if the pressing force of the roller 72 against the workpiece W is adjusted by the drive cylinder 71, processing according to the material of the workpiece W can be performed.

  In this embodiment, the laser irradiation head 35 and the roller unit 7 are fixed to the column 3 and the processing table 4 is moved. However, the laser irradiation head 35 and the roller unit 7 are movable, and the processing table 4 is It may be fixed. In this case, it is preferable that the roller unit 7 is fixed to the laser irradiation head 35 and the roller unit 7 is moved by the same drive source. In this case, the processing table 4 may be movable in the X-axis direction, and the laser irradiation head 35 and the roller unit 7 may be movable in the Y-axis direction. Further, the laser irradiation head 35 may be fixed and the roller unit 7 may be movable in the Y-axis direction. In this case, the machining table 4 can be moved in the X and Y axis directions. When the laser machining is performed, the machining table 4 is moved, and when the wrinkles of the workpiece W are removed by the roller 72, the roller unit 7 is moved. Let

<Second Embodiment>
A second embodiment of the present invention will be described with reference to FIG. The present embodiment is the same as the first embodiment described above except that the roller 72 is fixed to the carrier 8 which is a transport device that transports the workpiece W. Therefore, the overlapping description and illustration will be omitted or simplified, and the following description will be focused on parts that are different from the first embodiment.

  The carrier 8 can detach the workpiece W and can move in a direction parallel to the workpiece placement surface 41 between the workpiece placement surface 41 of the processing table 4 and a position away from the workpiece placement surface 41. It is a simple moving means. For this purpose, the carrier 8 is provided with a plurality of suction pads 82 on the side of the base 81 facing the work placement surface 41. The base 81 can be moved in a direction parallel to the workpiece placement surface 41 by a driving means (not shown), and can be moved to and away from the workpiece placement surface 41 by a reciprocating means 83. That is, it can reciprocate in the Y-axis direction and the Z-axis direction in FIG. Examples of such drive means and reciprocating means 83 include a drive source such as a servo motor and a power transmission means such as a ball screw. Note that the reciprocating means 83 may be a drive cylinder driven by hydraulic pressure or air pressure.

  Further, the plurality of suction pads 82 are arranged side by side in the X and Y axis directions so as to be arranged substantially evenly on the entire surface of the workpiece W. In addition, each tip surface is located on a virtual plane substantially parallel to the workpiece placement surface 41. In addition, a plurality of holes exist in each of the front end surfaces and are connected to a vacuum source (not shown). Then, the vacuum source is driven in a state where the plurality of suction pads 82 are brought close to or in contact with the surface of the workpiece W, whereby the workpiece W is sucked and supported by the plurality of suction pads 82 through the holes on the front end surface. It is possible.

  Further, the roller 72 is rotatably supported at a position outside the position where the suction pad 82 of the base 81 is disposed. In the case of the present embodiment, unlike the first embodiment, the roller 72 is not supported by the drive cylinder, and the X-axis is provided at the tip of the arm portion 74 provided on the side of the base portion 81 facing the workpiece placement surface 41. A roller 72 is supported so as to be rotatable about a rotation shaft 73 arranged in parallel with the direction. In the present embodiment, the roller unit 70 is configured by the arm portion 74, the roller 72, and the reciprocating means 83 for reciprocating the base portion 81 in the Z-axis direction. Accordingly, the reciprocating means 83 of the base 81 also serves as a reciprocating means for reciprocating the roller 72.

  However, the roller 72 can be reciprocated with respect to the base 81 by reciprocating means such as the drive cylinder 71 as in the first embodiment. Further, when the drive cylinder 71 is driven by air pressure in this configuration, a vacuum source connected to the plurality of suction pads 82 can be used as the drive source. For example, a switching valve is provided at a branch portion (for example, in the base 81) between the drive cylinder 71 and the plurality of suction pads 82 in the middle of the path connected to the vacuum source, and either the drive cylinder 71 or the plurality of suction pads 82 Can be connected to a vacuum source and switched according to the use situation.

  Further, the roller 72 is disposed so as to protrude toward the workpiece placement surface 41 from the tips of the plurality of suction pads 82 in the Z-axis direction. For this reason, the position of the roller 72 in the Y-axis direction is separated from the plurality of suction pads 82 so as to be removed from the processing table 4 with all the plurality of suction pads 82 positioned on the workpiece placement surface 41. It is arranged. When the roller 72 is reciprocated with respect to the base 81 by reciprocating means such as the drive cylinder 71, the roller 72 protrudes from the tips of the plurality of suction pads 82 when the roller 72 removes wrinkles. You may do it. In this case, if the roller 72 is positioned on the opposite side of the work placement surface 41 from the tip of the suction pad 82 in a state where all of the plurality of suction pads 82 are located on the work placement surface 41, the Y axis The position in the direction may be on the processing table 4.

  The machining process of the workpiece W of the present embodiment configured as described above will be described. First, the carrier 8 is moved onto the workpiece W placed at a position (standby position) deviated from the workpiece placement surface 41, and the vacuum source is operated to suck and support the workpiece W on the plurality of suction pads 82. . Note that the standby position where the workpiece W is placed is a position deviated from the other end side of the workpiece placement surface 41 in the Y-axis direction (corresponding to the right side in FIG. 1). Next, the carrier 8 is moved from the standby position to one end side in the Y-axis direction (corresponding to the left side in FIG. 1) in parallel with the workpiece placement surface 41. At this time, the carrier 8 is moved at a raised position sufficiently away from the processing table 4 as shown by a chain line in FIG. 3A so that the roller 72 does not interfere with the processing table 4. Then, the carrier 8 is positioned on the workpiece placement surface 41 (carrying-in process). Next, as shown by the solid line in FIG. 3A, the carrier 8 is lowered toward the workpiece placement surface 41, the workpiece W is placed on the workpiece placement surface 41, and then the vacuum source is stopped. Then, the suction by the plurality of suction pads 82 is released (placement step).

  Next, the vacuum source connected to the processing table 4 is operated, and the workpiece W is attracted and fixed to the workpiece placement surface 41. Further, the carrier 8 (the roller 72 when the roller unit 70 has a reciprocating means) is raised and then moved to the other end in the Y-axis direction, or the X and Y tables 6 and 5 (see FIG. 1). ) To move one end portion of the workpiece W on the processing table 4 in the Y-axis direction to a position facing the roller 72. Then, the roller 72 is moved toward the workpiece W, and the roller 72 is pressed against one end portion in the Y-axis direction with a predetermined force. From this state, while the movement of the processing table 4 is stopped, the carrier 8 is moved to the other end side in the Y-axis direction as indicated by an arrow γ in FIG. Then, while the roller 72 is in contact with the surface of the workpiece W, the roller 72 rotates around the rotation shaft 73 arranged in the X-axis direction that is perpendicular to the moving direction in the direction of arrow β in FIG. Rolls on the surface of the workpiece W while pressing W with a predetermined force. At this time, as shown in FIGS. 3A to 3B, the wrinkles of the work W are stretched and removed by the rolling of the roller 72. Even after removing the wrinkles of the workpiece W, the carrier 8 moves in the Y-axis direction as it is and returns to the standby position described above.

  That is, the roller 72 fixed to the carrier 8 places the workpiece when the carrier 8 places the workpiece W on the workpiece placement surface 41 and moves (returns) to a standby position that is out of the workpiece placement surface 41. The wrinkles of the workpiece W are removed while contacting the surface of the workpiece W placed on the placement surface 41. In other words, in the case of the present embodiment, the returning process of the carrier 8 to the standby position and the flattening process for removing wrinkles of the work W are performed simultaneously.

  If the wrinkles of the workpiece W are removed, the workpiece W is subjected to laser processing, and after the laser processing is finished, the vacuum source is stopped and the suction of the workpiece W to the workpiece placement surface 41 is released. Thereafter, the carrier 8 is moved again onto the workpiece placement surface 41 and further lowered to bring the plurality of suction pads 82 into contact with the surface of the workpiece W after processing. Then, the vacuum source connected to the plurality of suction pads 82 is operated to lift the carrier 8 in a state where the workpieces W are sucked and supported by the plurality of suction pads 82, and the work W is unloaded from the processing table 4.

  According to the present embodiment configured as described above, since the roller 72 can be moved together with the carrier 8 that transports the workpiece W, the apparatus can be simplified. That is, it is not necessary to separately provide a driving means for moving the roller 72. Further, when the carrier 8 places the workpiece W on the workpiece placement surface 41 and retracts from the workpiece placement surface 41, wrinkles can be removed by the roller 72, and the efficiency can be improved and the tact time can be shortened.

  In the present embodiment, the processed workpiece W is attracted to the carrier 8 and conveyed, but the workpiece W is not wrinkled again during this suction. That is, the work W before the wrinkle is removed has a distortion, and the wrinkle is generated by the distortion when the work W is attracted to the work placement surface 41. On the other hand, when the wrinkle is removed by the roller 72, the distortion is also corrected. Therefore, even if the workpiece W is sucked by the carrier 8, the wrinkle does not occur.

<Third Embodiment>
A third embodiment of the present invention will be described with reference to FIG. In the present embodiment, the above-described first embodiment or the above-described second embodiment except that the surface of the roller 72 can adsorb foreign matter attached to the workpiece W (see FIGS. 1 to 3). It is the same. Therefore, overlapping descriptions and illustrations are omitted or simplified, and the following description will focus on parts that are different from the first and second embodiments.

  In the case of this embodiment, the power source 9 is connected to the rotating shaft 73 of the roller 72 in order to allow the foreign matter to be attracted to the surface of the roller 72. That is, the roller 72 is formed by disposing an elastic layer 75 such as urethane rubber around a rotating shaft 73 made of a conductive metal such as an aluminum alloy. A power source 9 is connected to the rotating shaft 73. When a voltage is applied to the rotating shaft 73 by the power source 9, the surface of the roller 72 is charged. Therefore, if the roller 72 is rolled on the surface of the workpiece W in this state, foreign matters such as dust on the workpiece W can be attracted to the surface of the roller 72 by static electricity. That is, the surface of the roller 72 is electrostatically charged so that the foreign matter adhering to the surface of the work W can be electrostatically attracted when the roller 72 and the processing table 4 (see FIGS. 1 to 3) move relative to each other. Yes. On the other hand, the foreign matter adsorbed on the surface of the roller 72 can be easily detached by stopping the voltage application by the power source 9 or applying a voltage having a polarity opposite to that at the time of foreign matter adsorption.

  According to this embodiment, since wrinkles can be removed and foreign matter on the workpiece W can be removed, the efficiency is high. In addition, if laser processing is performed in a state where foreign matter is present on the surface of the workpiece W, processing defects may occur due to the presence of the foreign matter. If foreign matter on the workpiece W can be removed, processing is performed by subsequent laser processing. Defects can be prevented from occurring. In addition, since the foreign matter adsorbed on the roller 72 can be easily detached, the surface of the workpiece W is not damaged by the foreign matter when the wrinkle of the workpiece W is removed again by the roller 72.

  In the present embodiment, the configuration in which the surface of the roller 72 is charged and the foreign matter is electrostatically attracted has been described. However, the foreign matter may be attracted to the surface of the roller 72 in other configurations. For example, the surface of the roller 72 may be covered with a weak adhesive material. The adhesiveness is preferably set to such an extent that foreign matter can be adsorbed by the roller 72 and the adsorbed foreign matter can be easily removed.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 2 Bed 3 Column 35 Laser irradiation head 4 Processing table 41 Workpiece mounting surface 5 Y table 6 X table 7, 70 Roller unit 71 Drive cylinder (reciprocating means)
72 Roller 73 Rotating shaft 8 Carrier (moving means)
81 Base 82 Suction pad 83 Reciprocating means 9 Power supply W Workpiece

Claims (4)

In a laser processing apparatus that performs laser processing on a thin plate-like workpiece placed on a workpiece placement surface of a machining table,
The roller is disposed facing the processing table, is relatively movable in parallel with the work placement surface with respect to the processing table, and has a roller that is rotatable about a rotation axis perpendicular to the moving direction.
While abutting the roller on the surface of the workpiece placed on the workpiece placement surface, by relatively moving the said and the roller machining table, by the roller rolls on the surface of the workpiece, A laser processing apparatus for removing wrinkles on a workpiece. Reciprocating means for reciprocating the roller in the pressing direction against the workpiece placement surface;
2. The laser processing apparatus according to claim 1, wherein the reciprocating means is capable of pressing the roller against a work placed on the work placing surface with a predetermined force. 3. The laser processing apparatus according to claim 1, wherein the surface of the roller is capable of adsorbing foreign matter adhering to the surface of the workpiece when the roller and the processing table are relatively moved. A moving means that is detachable and capable of moving in a direction parallel to the workpiece placement surface between the workpiece placement surface and a position away from the workpiece placement surface;
The roller is fixed to the moving means, and when the moving means places a work on the work placement surface and moves to a position off the work placement surface, the roller is placed on the work placement surface. 4. The laser processing apparatus according to claim 1, wherein wrinkles of the workpiece are removed while abutting against a surface of the placed workpiece. 5.

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