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JP5526966B2 - Vehicle lighting - Google Patents
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JP5526966B2 - Vehicle lighting - Google Patents

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JP5526966B2
JP5526966B2 JP2010094937A JP2010094937A JP5526966B2 JP 5526966 B2 JP5526966 B2 JP 5526966B2 JP 2010094937 A JP2010094937 A JP 2010094937A JP 2010094937 A JP2010094937 A JP 2010094937A JP 5526966 B2 JP5526966 B2 JP 5526966B2
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electronic circuit
circuit board
light source
support member
light
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JP2011228041A (en
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貴英 石田
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Nissan Motor Co Ltd
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Description

本発明は、車両に適用される車両用灯具に関する。   The present invention relates to a vehicular lamp applied to a vehicle.

車両用灯具として例えば下記特許文献1には、光源部からの光を前方に向けて反射させる反射部と、光源部が取り付けられて該光源部から発生する熱を放熱する放熱部となるフィン部とを備える構造が開示されている。   As a vehicular lamp, for example, in Patent Document 1 below, a reflection unit that reflects light from a light source unit forward and a fin unit that is attached to the light source unit and serves as a heat dissipation unit that dissipates heat generated from the light source unit. Is disclosed.

特開2004−111297号公報JP 2004-1111297 A

ところで、上記した従来の車両用灯具にあっては、光源部からの熱をフィン部でのみ放熱することを前提としているため、特に光源を複数設けるなどして光量を増大させる場合には、その分発熱量が多大となってフィン部を大きくする必要が生じ、灯具全体の大型化を招くものとなる。   By the way, in the above-mentioned conventional vehicle lamp, since it is premised that the heat from the light source part is radiated only at the fin part, especially when the light quantity is increased by providing a plurality of light sources or the like, The amount of generated heat becomes enormous and the fin portion needs to be enlarged, leading to an increase in the overall size of the lamp.

そこで、本発明は、灯具全体の大型化を抑えつつ、発熱量の多大化に対応できるようにすることを目的としている。   Accordingly, an object of the present invention is to be able to cope with an increase in the amount of heat generation while suppressing an increase in the size of the entire lamp.

本発明は、光源及び該光源を取り付けた電子回路基板を備える光生成部を支持しつつ光生成部で発生する熱を吸収する支持部材を有し、この支持部材は光源からの光を反射する反射部を一体的に備えている車両用灯具であって、前記支持部材は、電子回路基板の光源と反対側の裏面が接触する基板支持部と、この基板支持部に連続して形成されて電子回路基板を両側から挟み込む挟持部と、この挟持部に連続して形成されて光源を覆う反射部と、を備え、前記挟持部は、基板支持部の一部を構成して電子回路基板の光源と反対側の裏面が接触する下板部と、反射部に連続して電子回路基板の光源側の表面が接触する上板部と、を有し、下板部と上板部とで電子回路基板を両側から挟み込むことを特徴とする。 The present invention has a support member that absorbs heat generated in the light generation unit while supporting the light generation unit including the light source and the electronic circuit board to which the light source is attached , and the support member reflects light from the light source. A vehicular lamp that is integrally provided with a reflecting portion , wherein the supporting member is formed continuously with a substrate supporting portion that contacts a back surface opposite to the light source of the electronic circuit substrate, and the substrate supporting portion. A sandwiching part that sandwiches the electronic circuit board from both sides, and a reflection part that is formed continuously with the sandwiching part and covers the light source, and the sandwiching part constitutes a part of the board support part to form an electronic circuit board A lower plate portion that is in contact with the back surface on the opposite side of the light source, and an upper plate portion that is in contact with the light source side surface of the electronic circuit board in succession to the reflection portion. The circuit board is sandwiched from both sides .

本発明によれば、光源を備えた光生成部で発生する熱を、光生成部を支持する支持部材に放熱させるとともに、反射部を支持部材と一体的に設けることで、反射部と支持部材との間の熱伝導率を向上させ、反射部でも効率的に放熱させるようにしたので、放熱専用の部材を増やすことなく放熱面積を大きくすることができ、灯具全体の大型化を抑えつつ発熱量の多大化に対応することができる。
また、本発明では、光生成部は光源を取り付けた電子回路基板を備え、この電子回路基板の光源と反対側の裏面を支持部材に接触させている。このため、電子回路基板の一部を利用して支持部材で支持できるとともに、発熱する電子回路基板を支持部材に効率よく放熱することができる。
また、本発明では、支持部材は、光生成部の光源を除く一部を両側から挟み込む挟持部を備えている。このため、挟持部によって電子回路基板を精度よく固定保持できるとともに、電子回路基板から発生する熱を挟持部に効率よく放熱することができる。電子回路基板を精度よく固定保持することで、光源と反射部との相互の位置精度も確保できるので、反射部で反射した光の放射方向を安定化させることができる。
さらに、本発明では、支持部材は、電子回路基板の光源と反対側の裏面に接触する基板支持部と、この基板支持部に連続して形成されて光生成部の光源を除く一部を両側から挟み込む挟持部と、この挟持部に連続して形成されて光源を覆う反射部と、を備えている。このため、別途専用の放熱フィンのような放熱部を設けることなく、これら基板支持部,挟持部及び反射部が放熱部となって放熱面積を大きく形成でき、光生成部から発生した熱を効率よく放熱することができる。
According to the present invention, the heat generated in the light generation unit including the light source is radiated to the support member that supports the light generation unit, and the reflection unit and the support member are provided integrally with the support member. The heat conductivity between the two and the reflector is improved so that heat can be efficiently dissipated even at the reflector. It is possible to cope with an increase in quantity.
In the present invention, the light generation unit includes an electronic circuit board to which a light source is attached, and the back surface of the electronic circuit board opposite to the light source is in contact with the support member. Therefore, a part of the electronic circuit board can be supported by the support member, and the generated electronic circuit board can be efficiently radiated to the support member.
Moreover, in this invention, the supporting member is provided with the clamping part which clamps one part except the light source of a light generation part from both sides. For this reason, the electronic circuit board can be fixed and held with high accuracy by the sandwiching portion, and heat generated from the electronic circuit substrate can be efficiently radiated to the sandwiching portion. By accurately fixing and holding the electronic circuit board, it is possible to secure mutual positional accuracy between the light source and the reflecting portion, so that the radiation direction of the light reflected by the reflecting portion can be stabilized.
Further, in the present invention, the support member includes a substrate support part that contacts the back surface opposite to the light source of the electronic circuit board, and a part of the support member that is formed continuously with the substrate support part except for the light source. And a reflection part that is formed continuously from the clamping part and covers the light source. For this reason, without providing a heat radiating part such as a dedicated heat radiating fin, the board support part, the sandwiching part, and the reflecting part can be a heat radiating part to form a large heat radiating area and efficiently generate heat generated from the light generating part. It can dissipate heat well.

本発明の一実施形態に係わる車両用灯具を示す図2のA−A断面図である。It is AA sectional drawing of FIG. 2 which shows the vehicle lamp concerning one Embodiment of this invention. 図1の車両用灯具を備える車両における車両用灯具周辺の正面図である。It is a front view of the vehicle lamp periphery in a vehicle provided with the vehicle lamp of FIG. (a)は図1の車両用灯具におけるデイライトランプの斜視図、(b)はデイライトランプの分解斜視図である。(A) is a perspective view of the daylight lamp in the vehicle lamp of FIG. 1, (b) is an exploded perspective view of the daylight lamp. 他の実施形態を示す図3(b)に対応する斜視図である。It is a perspective view corresponding to Drawing 3 (b) showing other embodiments.

以下、本発明の実施の形態を図面に基づき説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図2に示すように、車両として例えば自動車の前部に設けてあるヘッドランプ1の上部に、図3(a)に示すデイライトランプ3を設けている。なお、図2のA−A断面図である図1において、矢印FRで示す方向が車両前方で、矢印UPで示す方向が車両上方である。   As shown in FIG. 2, a daylight lamp 3 shown in FIG. 3A is provided on the upper part of a headlamp 1 provided as a vehicle, for example, at the front of an automobile. In FIG. 1, which is a cross-sectional view taken along the line AA of FIG. 2, the direction indicated by the arrow FR is the front of the vehicle, and the direction indicated by the arrow UP is the upper side of the vehicle.

デイライトランプは、日中に点灯させる灯具として、乗用車やトラック、タクシー、バイクなどの車両に適用されている。走行中にデイライトランプを備えた車両を見た場合に、その車両をデイライトランプの点灯によって視認しやすくなっている。しかし、日中点灯し続けるため、バッテリの消耗が激しくなり、省電力であるLEDランプが一般的に採用されている。   Daylight lamps are applied to vehicles such as passenger cars, trucks, taxis, and motorcycles as lamps that are lit during the day. When a vehicle equipped with a daylight lamp is viewed during traveling, the vehicle is easily visible by turning on the daylight lamp. However, since it continues to be lit during the daytime, battery consumption is severe and LED lamps that save power are generally employed.

上記したデイライトランプ3は、図3(b)に示すように、光源である複数(ここでは3個)のLED5と該LED5を取り付けてある電子回路基板7とを備える光生成部としてのランプユニット9と、このランプユニット9を支持すべく取り付けてある支持部材11とを有している。   As shown in FIG. 3B, the daylight lamp 3 described above includes a plurality of (here, three) LEDs 5 as light sources and an electronic circuit board 7 to which the LEDs 5 are attached. It has a unit 9 and a support member 11 attached to support the lamp unit 9.

支持部材11は、図1にも示すように、電子回路基板7が接触する基板支持部13と、基板支持部13の車両後方側に位置して電子回路基板7の端部を挟持する挟持部15と、挟持部15の車両前方側に位置してLED5の光を反射させる反射部17とを備えている。   As shown in FIG. 1, the support member 11 includes a substrate support portion 13 that contacts the electronic circuit board 7 and a clamping portion that is located on the vehicle rear side of the substrate support portion 13 and sandwiches an end portion of the electronic circuit board 7. 15 and a reflecting portion 17 that is located on the vehicle front side of the sandwiching portion 15 and reflects the light of the LED 5.

支持部材11の基板支持部13は、複数のLED5の配列方向に相当する車幅方向(図1中で紙面に直交する方向)に長い長方形状の板状に形成してあり、電子回路基板7の上面に設けたLED5と反対側の裏面7aが接触する基板接触面13aを上面に備えている。   The substrate support portion 13 of the support member 11 is formed in a rectangular plate shape that is long in the vehicle width direction (direction orthogonal to the paper surface in FIG. 1) corresponding to the arrangement direction of the plurality of LEDs 5, and the electronic circuit board 7. The upper surface is provided with a substrate contact surface 13a that contacts the back surface 7a opposite to the LED 5 provided on the upper surface.

支持部材11の挟持部15は、基板支持部13の車両後方側(図1中で左側)の一部である端部を含む下板部15aと、下板部15aの車両後方側の端部から上方に向けて立ち上がる端板部15bと、端板部15bの上端部から車両前方(図1中で右側)に向けて延びる上板部15cとを備えている。すなわち、挟持部15の下板部15aは、基板支持部13に連続して一体的に形成されている。   The holding portion 15 of the support member 11 includes a lower plate portion 15a including an end portion that is a part of the substrate support portion 13 on the vehicle rear side (left side in FIG. 1), and an end portion on the vehicle rear side of the lower plate portion 15a. And an upper plate portion 15c extending from the upper end portion of the end plate portion 15b toward the front of the vehicle (right side in FIG. 1). That is, the lower plate portion 15 a of the sandwiching portion 15 is formed continuously and integrally with the substrate support portion 13.

上記した挟持部15における下板部15aと上板部15cとの間の隙間の間隔は、電子回路基板7の厚さとほぼ同等としてある。したがって、図3(b)のようにランプユニット9を支持部材11の前方の開口部19から挿入することで、図1のように電子回路基板7の端部が、下板部15aと上板部15cとの間に挟持されて固定保持されることになる。   The gap between the lower plate portion 15a and the upper plate portion 15c in the clamping portion 15 is substantially equal to the thickness of the electronic circuit board 7. Therefore, by inserting the lamp unit 9 through the opening 19 in front of the support member 11 as shown in FIG. 3B, the end of the electronic circuit board 7 is connected to the lower plate 15a and the upper plate as shown in FIG. It is sandwiched and held between the portion 15c.

また、支持部材11の反射部17は、図3に示すように、複数のLED5に対応して3個設けてあり、挟持部15の上板部15cに連続して一体的に形成されている。この反射部17は、LED5を覆うようにして該LED5側が凹曲面となる反射面17aを備えている。   Further, as shown in FIG. 3, three reflecting portions 17 of the support member 11 are provided corresponding to the plurality of LEDs 5, and are formed continuously and integrally with the upper plate portion 15 c of the sandwiching portion 15. . The reflecting portion 17 includes a reflecting surface 17a that covers the LED 5 and has a concave curved surface on the LED 5 side.

このように構成した支持部材11は、伝熱効率の高い部材、例えばアルミニウムなどの金属で全体を一体的に構成している。また、反射面17aは、LED5の光を図1中の矢印Bで示す車両前方に向けて反射するような凹曲面に形成した上で、該凹曲面の表面に対し、反射フィルムを貼り付けるか、あるいは、鏡面加工を施している。   The support member 11 configured as described above is integrally formed of a member having high heat transfer efficiency, for example, a metal such as aluminum. Further, the reflection surface 17a is formed in a concave curved surface that reflects the light of the LED 5 toward the front of the vehicle indicated by the arrow B in FIG. 1, and a reflection film is attached to the surface of the concave curved surface. Or, mirror finish is given.

そして、このようなデイライトランプ3は、その支持部材11を、図1に示す取付ブラケット25に固定している。また、開口部19の前方には、前記したヘッドランプ1と共用する透明な樹脂板(またはガラス板)21が配置されている。   Such a daylight lamp 3 has its support member 11 fixed to a mounting bracket 25 shown in FIG. A transparent resin plate (or glass plate) 21 shared with the headlamp 1 is disposed in front of the opening 19.

次に作用を説明する。デイライトランプ3は、LED5が点灯することで、LED5が発生する光を反射面17aで反射して図1の矢印Bで示すように、車両前方を照射する。   Next, the operation will be described. When the LED 5 is turned on, the daylight lamp 3 reflects the light generated by the LED 5 on the reflecting surface 17a and irradiates the front of the vehicle as indicated by an arrow B in FIG.

このようなデイライトランプ3は、点灯時に、ランプユニット9を構成するLED5や電子回路基板7が発熱する。特に、車両使用時もしくは走行時に、日中であっても点灯し続けるため、発熱量が多大となる。ランプユニット9から発生した熱は、電子回路基板7の裏面7aに接触している基板支持部13に直接吸収されて外部に放熱される。   When such a daylight lamp 3 is lit, the LED 5 and the electronic circuit board 7 constituting the lamp unit 9 generate heat. In particular, when the vehicle is used or running, it keeps lighting even during the daytime. The heat generated from the lamp unit 9 is directly absorbed by the substrate support portion 13 that is in contact with the back surface 7a of the electronic circuit substrate 7, and is radiated to the outside.

また、挟持部15は、電子回路基板7を巻き込むようにして支持しているため、電子回路基板7を精度よく固定するとともに、電子回路基板7から発生する熱を、上記した基板支持部13と同様に直接吸収して外部に放熱する。さらに、反射面17aを備える反射部17は、LED5から発生する光を反射面17aで反射するともに、上記ランプユニット9から発生した熱を間接的に吸収して外部に放熱する。   In addition, since the clamping unit 15 supports the electronic circuit board 7 so as to be wound around, the clamping unit 15 fixes the electronic circuit board 7 with high accuracy and also generates heat generated from the electronic circuit board 7 with the above-described board support unit 13. Similarly, it absorbs directly and dissipates heat to the outside. Furthermore, the reflection part 17 provided with the reflection surface 17a reflects the light generated from the LED 5 by the reflection surface 17a and indirectly absorbs the heat generated from the lamp unit 9 and dissipates it to the outside.

その際、電子回路基板7に接触している基板支持部13や挟持部15が、電子回路基板7にその大部分が接触していない反射部17よりも高温となるため、これら基板支持部13や挟持部15で吸収した熱の一部は、反射部17に伝達されて外部に放熱される。   At this time, the substrate support portion 13 and the sandwiching portion 15 that are in contact with the electronic circuit board 7 are at a higher temperature than the reflection portion 17 that is not in most contact with the electronic circuit board 7. Part of the heat absorbed by the sandwiching part 15 is transmitted to the reflection part 17 and radiated to the outside.

すなわち、本実施形態では、反射部17を含む支持部材11全体が放熱部となっているおり、LED5を備えたランプユニット9で発生する熱を、ランプユニット9を支持する支持部材11に放熱させるとともに、反射部17を支持部材11と一体的に設けることで、反射部17と支持部材11との間の熱伝導率を向上させ、反射部17でも効率的に放熱させるようにしている。   That is, in the present embodiment, the entire support member 11 including the reflection portion 17 is a heat dissipation portion, and heat generated in the lamp unit 9 including the LEDs 5 is radiated to the support member 11 supporting the lamp unit 9. At the same time, by providing the reflection portion 17 integrally with the support member 11, the thermal conductivity between the reflection portion 17 and the support member 11 is improved, and the reflection portion 17 also efficiently dissipates heat.

このため、別途専用の放熱フィンのような放熱部を設けることなく、放熱面積を大きく形成でき、ランプユニット9から発生した熱を効率よく放熱することができる。その結果、部品点数が削減されて構造も簡素化し、車両用灯具全体の大型化を抑えつつ、発熱量の多大化に対応することができる。   For this reason, a heat radiating area can be formed large without providing a separate heat radiating part such as a dedicated heat radiating fin, and the heat generated from the lamp unit 9 can be efficiently radiated. As a result, the number of parts is reduced, the structure is simplified, and it is possible to cope with an increase in the amount of heat generated while suppressing an increase in the size of the entire vehicular lamp.

また、本実施形態では、ランプユニット9はLED5を取り付けた電子回路基板7を備え、この電子回路基板7のLED5と反対側の裏面7aを支持部材11に接触させている。このため、電子回路基板7の一部を利用して支持部材11で支持できるとともに、発熱する電子回路基板7を支持部材11に効率よく放熱することができる。   In the present embodiment, the lamp unit 9 includes the electronic circuit board 7 on which the LEDs 5 are attached, and the back surface 7 a opposite to the LEDs 5 of the electronic circuit board 7 is in contact with the support member 11. Therefore, a part of the electronic circuit board 7 can be supported by the support member 11, and the heat generated electronic circuit board 7 can be efficiently radiated to the support member 11.

また、本実施形態では、支持部材11は、ランプユニット9のLED5を除く一部を両側から挟み込む挟持部15を備えている。このため、挟持部15によって電子回路基板7を精度よく固定保持できるとともに、電子回路基板7から発生する熱を挟持部15に効率よく放熱することができる。電子回路基板7を精度よく固定保持することで、LED5と反射面17aとの相互の位置精度も確保できるので、反射面17aで反射した光の放射方向を安定化させることができる。   Moreover, in this embodiment, the supporting member 11 is provided with the clamping part 15 which clamps a part except LED5 of the lamp unit 9 from both sides. For this reason, the electronic circuit board 7 can be fixed and held with high precision by the sandwiching part 15, and heat generated from the electronic circuit board 7 can be efficiently radiated to the sandwiching part 15. By accurately fixing and holding the electronic circuit board 7, mutual positional accuracy between the LED 5 and the reflecting surface 17 a can be secured, so that the radiation direction of the light reflected by the reflecting surface 17 a can be stabilized.

さらに、本実施形態では、支持部材11は、電子回路基板7のLED5と反対側の裏面7aに接触する基板支持部13と、この基板支持部13に連続して形成されてランプユニット9のLED5を除く一部を両側から挟み込む挟持部15と、この挟持部15に連続して形成されてLED5を覆う反射部17と、を備えている。このため、別途専用の放熱フィンのような放熱部を設けることなく、これら基板支持部13,挟持部15及び反射部17が放熱部となって放熱面積を大きく形成でき、ランプユニット9から発生した熱を効率よく放熱することができる。   Further, in the present embodiment, the support member 11 is formed continuously with the substrate support portion 13 that contacts the back surface 7a opposite to the LED 5 of the electronic circuit board 7 and the LED support 5 of the lamp unit 9. A sandwiching portion 15 that sandwiches a portion other than the both sides from both sides, and a reflection portion 17 that is formed continuously with the sandwiching portion 15 and covers the LED 5. For this reason, without providing a heat radiating portion such as a dedicated heat radiating fin, the substrate support portion 13, the sandwiching portion 15, and the reflection portion 17 can be formed as a heat radiating portion so that a large heat radiating area can be formed. Heat can be radiated efficiently.

図4は、他の実施形態を示す図3に対応する斜視図である。この実施形態は、反射部17の表面に放熱用のフィン27を追加して設けている。これにより、さらに放熱効果を高めることができる。   FIG. 4 is a perspective view corresponding to FIG. 3 showing another embodiment. In this embodiment, a heat radiating fin 27 is additionally provided on the surface of the reflecting portion 17. Thereby, the heat dissipation effect can be further enhanced.

なお、上記した本実施形態では、デイライトランプ3を車両前部側に設けたが、車両後部に設けてもよい。   In the above-described embodiment, the daylight lamp 3 is provided on the vehicle front side, but may be provided on the vehicle rear side.

5 LED(光源)
7 電子回路基板
7a 電子回路基板の裏面
9 ランプユニット(光発生部)
11 支持部材
13 支持部材の基板支持部
15 支持部材の挟持部
17 支持部材の反射部
5 LED (light source)
7 Electronic circuit board 7a Back surface of electronic circuit board 9 Lamp unit (light generation part)
DESCRIPTION OF SYMBOLS 11 Support member 13 Substrate support part of support member 15 Holding part of support member 17 Reflection part of support member

Claims (1)

光源及び該光源を取り付けた電子回路基板を備える光生成部と、この光生成部を覆うようにして支持しつつ前記光生成部で発生する熱を吸収する支持部材とを有し、この支持部材は、前記光源からの光を反射する反射部を一体的に備えている車両用灯具であって、
前記支持部材は、前記電子回路基板の前記光源と反対側の裏面が接触する基板支持部と、この基板支持部に連続して形成されて前記電子回路基板を両側から挟み込む挟持部と、この挟持部に連続して形成されて前記光源を覆う反射部と、を備え
前記挟持部は、基板支持部の一部を構成して前記電子回路基板の前記光源と反対側の裏面が接触する下板部と、前記反射部に連続して前記電子回路基板の前記光源側の表面が接触する上板部と、を有し、前記下板部と前記上板部とで前記電子回路基板を両側から挟み込むことを特徴とする車両用灯具。
A light generation unit including a light source and an electronic circuit board on which the light source is mounted; and a support member that absorbs heat generated in the light generation unit while supporting the light generation unit so as to cover the light generation unit. Is a vehicular lamp that is integrally provided with a reflecting portion that reflects light from the light source ,
The support member includes a substrate support portion that contacts a back surface opposite to the light source of the electronic circuit board, a sandwich portion that is formed continuously with the substrate support portion and sandwiches the electronic circuit substrate from both sides, and the sandwiching portion. And a reflection part that is continuously formed on the part and covers the light source.
The sandwiching portion constitutes a part of a substrate support portion and contacts a lower plate portion that is in contact with a back surface on the opposite side of the light source of the electronic circuit board, and the light source side of the electronic circuit substrate that is continuous with the reflection portion. And an upper plate part that contacts the surface of the electronic circuit board, wherein the electronic circuit board is sandwiched between the lower plate part and the upper plate part .
JP2010094937A 2010-04-16 2010-04-16 Vehicle lighting Expired - Fee Related JP5526966B2 (en)

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