JP5527715B2 - Board inspection equipment - Google Patents

Description

  The present invention relates to a substrate inspection apparatus, and more particularly to replacement of a prober frame, which is a jig used for substrate inspection, and is suitable for a TFT array inspection apparatus used in LCD manufacturing.

  As a configuration in which TFTs (thin film transistors) are arranged in an array, for example, there is a liquid crystal substrate, which is used for a flat panel display (FPD) such as a liquid crystal display.

  A liquid crystal display composed of TFTs has a basic structure of a liquid crystal panel in which liquid crystal is poured between one glass substrate on which TFTs and pixel electrodes are formed and the other glass substrate on which counter electrodes are formed. .

  In the inspection of a glass substrate (hereinafter referred to as “TFT substrate”) on which a TFT and a pixel electrode are formed, there is a method for determining the state of each pixel on the substrate in a non-contact manner by using an electron beam voltage contrast technique. It is known (see, for example, Patent Document 1).

  In a TFT array inspection apparatus using voltage contrast technology, a TFT substrate to be inspected is transferred into a high-vacuum chamber, and an inspection signal is applied in a state of being placed on a stage. At this time, a TFT is detected by detecting the voltage state. Array inspection is performed

  Such a TFT array inspection apparatus includes an electron beam generation source, a secondary electron detector, and data processing means. The electron beam generation source irradiates each pixel on the TFT substrate with an electron beam, and the secondary electron detector detects secondary electrons generated by irradiating each pixel on the TFT substrate with an electron beam. The secondary electron detector outputs a signal representing a waveform corresponding to the voltage waveform of the pixel to the data processing means (computer system or the like) based on the detected amount of secondary electrons. The data processing means analyzes the output signal of the secondary electron detector and inspects the state of the pixel, in particular, the presence / absence of the pixel defect and the content of the defect.

  In the substrate inspection, the substrate to be inspected is transported on the stage in the main chamber of high vacuum, the prober frame is placed on the substrate, the electrodes of the substrate and the prober frame are brought into contact, and the prober frame to the substrate is inspected. This is done by applying a signal.

  FIG. 11 is a schematic diagram for explaining a conventional configuration of a TFT array substrate inspection apparatus. In the TFT array substrate inspection apparatus 201, a load lock chamber 203 is disposed adjacent to the main chamber 202 in order to carry the substrate to be inspected into and out of the main chamber 202. The arrangement of the main chamber and the load lock chamber is described in Patent Document 2, for example.

  The substrate to be inspected may have different specifications such as the substrate size, the shape and size of the pattern of the panel formed on the substrate, and the arrangement of the electrodes provided on the panel. In order to inspect the substrates having these various specifications, various prober frames corresponding to the respective specifications are required. Therefore, various prober frames corresponding to these various substrates are prepared and stored in the prober frame stocker 204. The prober frame corresponding to the substrate to be inspected is taken out from the prober frame stocker 204 and is stored in the main chamber. Introduction is done.

  Therefore, a prober frame stocker 204 capable of storing a plurality of prober frames is disposed adjacent to the main chamber 202, and the prober frame 210 is exchanged between the prober frame stocker 204 and the main chamber 202, so that it is suitable for an inspection object. The prober frame 210 is introduced into the main chamber 202.

  Note that a gate valve 211 is provided between the load lock chamber 203 and the atmosphere side, a gate valve 212 is provided between the load lock chamber 203 and the main chamber 202, and further, the main chamber 202 and the prober frame stocker. A gate valve 213 is provided between the terminal 204 and the terminal 204. A transport mechanism for transporting the substrate is provided in the main chamber 202 and the load lock chamber 203, and a transport mechanism for transporting the prober frame 210 is provided in the prober frame stocker 204.

  FIG. 11A to FIG. 11D show an example of the operation of replacing the prober frame. Here, an example is shown in which the prober frame introduced into the main chamber is replaced with another prober frame stored in the prober frame stocker. FIG. 11A shows a state in which the prober frame 210 a is installed in the main chamber 202 and the prober frames 210 b and 210 c are stored in the prober frame stocker 204.

  Since the main chamber 202 is normally in a vacuum state, nitrogen is introduced into the main chamber 202 to bring it to atmospheric pressure, and then the gate valve 213 is opened to move the prober frame 210a to the prober frame stocker 204 (FIG. 11B). )). Next, the prober frame stocker 204 is moved, and the stage in which the prober frame 210b to be used next is stored is aligned with the height on the main chamber 202 side (FIG. 11C). After the prober frame 210b is moved into the main chamber 202, the gate valve 213 is closed, and then the inside of the main chamber 202 is evacuated to enable inspection (FIG. 11 (d)).

US Pat. No. 5,982,190 JP 2002-252155 A (paragraphs 0017, 0018, FIG. 1)

  On the TFT array substrate, in addition to the panel, electrodes are provided in order to exchange various signals with the panel. The arrangement position of the electrodes varies depending on the panel specifications such as the number and size of the panels formed on the TFT array substrate.

  The prober frame includes contact pins that are in electrical contact with the electrodes of the TFT array substrate in order to supply inspection signals to the TFT array substrate. The contact pins need to be arranged according to the panel specifications.

  Conventionally, a dedicated prober frame in which the arrangement of contact pins according to various panel specifications is prepared and stored in a prober frame stocker, and a prober frame according to the panel specifications to be inspected is selected.

  Therefore, conventionally, there is a problem that it is necessary to prepare a dedicated prober frame for each panel specification. For example, when inspecting a TFT array substrate in which five types of panel specifications of 32 inch, 40 inch, 46 inch, 52 inch, and 60 inch are set, five types of prober frames corresponding to each panel specification are used. Must be prepared in advance.

  In order to respond to the increasing panel specifications by adding prober frames, it is necessary to prepare as many prober frames as the number of types of panel specifications. However, the number of prober frames that can be stored in the prober frame stocker cannot exceed the storage amount of the prober frame stocker, and because it is limited, it cannot cope with panel specifications that increase beyond the limit. There is.

  In addition, when responding to the increase in panel specifications by increasing the storage capacity of the prober frame stocker, it is necessary to increase the volume of the prober frame stocker. The problem of the storage location of the prober frame occurs, for example, the volume of the prober increases.

  SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-mentioned problems and to enable the prober frame to cope with various types of panel specifications without increasing the number of prober frames and the volume of the prober frame stocker in the TFT array substrate inspection apparatus. And

  In order to solve the above-mentioned object, the present invention is configured such that the arrangement position of the contact pin of the prober frame can be changed and the arrangement position of the contact pin of the prober frame is changed in the prober frame stocker. As a result, it is possible to cope with a limited number of prober frames corresponding to various types of panel specifications.

  The TFT array substrate inspection apparatus of the present invention is a TFT array inspection apparatus that applies an inspection signal to a TFT array substrate through a contact pin of a prober frame and scans the electron beam on the TFT array substrate for inspection. A main chamber for inspecting the array substrate, a load lock chamber for carrying in and out the TFT array substrate between the atmosphere side and the main chamber, and a prober frame stocker for storing the prober frame.

  The prober frame of the present invention includes a contact pin arrangement position changing unit that changes the arrangement position of the contact pins in the prober frame stocker while making the arrangement position of the contact pins freely changeable.

  According to the prober frame stocker of the present invention, the two prober frames are alternately exchanged between the prober frame stocker and the main chamber through the load lock chamber. Change the pin placement position. In the main chamber, an inspection signal is applied to the TFT array substrate through the contact pin of the prober frame.

  In the present invention, one prober frame of two prober frames is arranged in a main chamber and processing such as inspection of a TFT array substrate is performed while the other prober frame is connected to a contact pin in a prober frame stocker. In the arrangement position changing unit, the arrangement position of the contact pins is changed according to the panel specifications. With this configuration, it is possible to cope with various types of panel specifications with two prober frames without preparing a prober frame for each panel specification.

  The change of the arrangement position of the contact pin of the prober frame can be performed while inspecting the TFT array substrate using one prober frame in the main chamber, so that the contact pin is not affected by the tact time. The arrangement position of can be changed.

  The contact pin placement position changing unit of the present invention changes the contact pin placement position of the prober frame based on the panel layout information of the TFT array substrate.

  The prober frame of the present invention includes a frame bar that surrounds at least the outer periphery of the TFT array substrate, a frame bar that can be freely positioned between opposing sides of the frame frame, and a frame bar that can be freely attached and detached at any position in the length direction of the frame bar. The structure provided with the contact pin unit to perform can be used.

  The contact pin arrangement position changing unit of the present invention changes the position of the contact pin by changing the position of the frame bar with respect to the frame frame and the position of the contact pin unit on the frame bar in the prober frame having the above-described configuration. .

The change of the position of the frame bar with respect to the side of the frame frame is performed based on the panel arrangement of the panel layout information. Further, the change of the position of the contact pin unit with respect to the length direction of the frame bar is performed based on the electrode arrangement of the panel layout information.

  The TFT array substrate inspection apparatus according to the present invention includes a prober frame transfer unit that alternately switches between a prober frame stocker and a main chamber with a prober frame.

  The prober frame transport unit of the present invention includes a prober frame support unit that supports the prober frame and a top plate that closes the load lock chamber.

  When the prober frame is exchanged between the main chamber and the prober frame stocker via the load lock chamber, the top plate of the prober frame transport unit moves together with the prober frame support unit. Opened and the prober frame can be replaced.

  On the other hand, when the TFT array substrate is carried in and out between the main chamber and the load lock chamber, the upper portion of the load lock chamber can be closed and the inside of the load lock chamber can be sealed.

  According to the TFT array substrate inspection apparatus of the present invention, the prober frame is exchanged between the load lock chamber and the prober frame stocker, and the prober frame is led into and out of the main chamber with the load lock chamber. The prober frame can be exchanged between the main chamber and the lock chamber in a vacuum state. As a result, the prober frame can be replaced while the main chamber is kept in a vacuum state.

  Furthermore, since it is not necessary to return to the atmospheric pressure state, it is not necessary to stop the power source of the electron gun or the like in order to achieve the atmospheric pressure state, and so-called warm-up required to reach the driving state from the initial state by stopping the power source. Time is not required, and the inspection time can be prevented from being prolonged.

  According to the TFT array substrate inspection apparatus of the present invention, the prober frame can be adapted to various types of panel specifications without increasing the number of prober frames and the volume of the prober frame stocker.

It is a figure for demonstrating the TFT array substrate test | inspection apparatus of this invention. It is a figure for demonstrating the TFT array substrate test | inspection apparatus of this invention. It is a figure for demonstrating the structure of the prober frame of this invention. It is a figure for demonstrating the change of the arrangement position of the contact pin of the prober frame of this invention. It is a figure for demonstrating the 1st example of the change of the arrangement position of the contact pin of the prober frame of this invention, and the replacement | exchange operation | movement of a prober frame. It is a figure for demonstrating the 1st example of the change of the arrangement position of the contact pin of the prober frame of this invention, and the replacement | exchange operation | movement of a prober frame. It is a figure for demonstrating the 1st example of the change of the arrangement position of the contact pin of the prober frame of this invention, and the replacement | exchange operation | movement of a prober frame. It is a figure for demonstrating the 1st example of the change of the arrangement position of the contact pin of the prober frame of this invention, and the replacement | exchange operation | movement of a prober frame. It is a figure for demonstrating the other example of the change of the arrangement position of the contact pin of the prober frame of this invention, and the replacement | exchange operation | movement of a prober frame. It is a figure for demonstrating the other example of the change of the arrangement position of the contact pin of the prober frame of this invention, and the replacement | exchange operation | movement of a prober frame. It is the schematic for demonstrating the conventional structure of a board | substrate inspection apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The substrate to be inspected by the TFT array substrate inspection apparatus of the present invention is not limited to a TFT substrate such as a liquid crystal substrate, but can be applied to various substrates such as an organic EL substrate and a semiconductor substrate.

  In the following, the TFT array substrate inspection apparatus of the present invention will be described with reference to FIGS. 1 and 2, the configuration of the prober frame will be described with reference to FIGS. 3 and 4, and the probe pins of the prober frame will be described with reference to FIGS. The first example of the change of the arrangement position of the prober and the replacement operation of the prober frame will be described, and the second example of the change of the arrangement position of the contact pin of the prober frame and the replacement operation of the prober frame will be described with reference to FIGS. explain.

The TFT array substrate inspection apparatus of the present invention will be described with reference to FIGS.
A TFT array substrate inspection apparatus 1 shown in FIG. 1 is a TFT array inspection apparatus that applies an inspection signal to a TFT array substrate through a contact pin of a prober frame 10 and scans the TFT array substrate by scanning an electron beam. The prober frame 10 can change the arrangement position of the contact pins.

  The TFT array substrate inspection apparatus 1 includes a main chamber 2 for inspecting a substrate in a vacuum state, a load lock chamber 3 for carrying in and out the TFT array substrate between the atmosphere side and the main chamber 2, and a prober frame. And a prober frame stocker 4 for storing 10.

  A gate valve 12 is provided between the main chamber 2 and the load lock chamber 3. The TFT array substrate and the prober frame 10 are carried in and out through the gate valve 12. The main chamber 2 is provided with an electron beam source 8 and a detector (secondary electron detector) 9.

  A gate valve 11 is provided between the load lock chamber 3 and the outside. The TFT array substrate is carried in and out through the gate valve 11.

  A prober frame stocker 4 is provided above the main chamber 2. The prober frame stocker 4 includes a contact pin arrangement position changing unit 5 that changes the pin arrangement position of the contact pins of the prober frame, and prober frame holding units 6A and 6B that temporarily hold the prober frame when the prober frame is replaced.

  The prober frame holding unit 6 </ b> A holds the prober frame during the process of changing the contact pin arrangement position by the contact pin arrangement position changing unit 5. The prober frame holding unit 6B holds one prober frame when the prober frame 10A and the prober frame 10B are exchanged.

  A prober frame transfer unit 7 is provided between the main chamber 2 and the load lock chamber 3. The prober frame transport section 7 includes a prober frame support section 7a and an upper plate 7b. The prober frame support portion 7 a supports the prober frame when carrying in / out between the main chamber 2 and the load lock chamber 3. The upper plate 7b closes the opening above the load lock chamber 3 and seals the inside of the load lock chamber 3 when the TFT array substrate is carried out.

The TFT array substrate inspection apparatus 1 includes control units 21 to 28.
The inspection signal generator 21 supplies an inspection signal to the prober frame 10A carried into the main chamber 2. The scanning control unit 22 is provided in the main chamber 2 and controls scanning of the electron beam irradiated from the electron beam source 8. The prober frame movement control unit 23 controls the movement of the prober frame 10 in the main chamber 2 and between the main chamber 2 and the load lock chamber 3.

  The detection signal processing unit 24 processes the detection signal detected by the detector 9 such as a secondary electron detector. The defect detection unit 25 detects a defect of the TFT array substrate based on the signal obtained by the detection signal processing unit 24.

  The pin arrangement position control unit 26 controls the contact pin arrangement position changing unit 5 arranged in the prober frame stocker 4 based on the panel specification information. The contact pin arrangement position changing unit 5 changes the pin arrangement position of the prober frame 10 </ b> B in the prober frame stocker 4.

  The prober frame transport control unit 27 controls the prober frame transport unit 7 to transport the prober frame between the prober frame stocker 4 and the load lock chamber 3.

  The substrate transfer control unit 28 controls the gate valves 11 and 12 and the substrate transfer device (not shown) to carry out the TFT array substrate carry-out operation between the main chamber 2 and the load lock chamber 3, and the load lock chamber. The TFT array substrate is carried out between 3 and the outside.

  On the stage (not shown) in the main chamber 2, the TFT array substrate to be inspected and the prober frame 10 are transported through the load lock chamber 3, and an inspection signal is sent to the TFT array substrate by the prober frame 10. While being applied, an electron beam is irradiated from the electron beam source 8. The electron beam irradiation causes the TFT array substrate to emit secondary electrons according to the voltage state. The detector 9 (secondary electron detector) detects the secondary electrons. Since the amount of secondary electrons and the voltage state are related, the voltage waveform is obtained from the detected amount of secondary electrons, and the detected voltage waveform and the voltage waveform detected when the inspection signal is applied in the normal state are obtained. Compare. By comparing the voltage waveforms, the substrate can be inspected for defects.

  The load lock chamber 3 exchanges the prober frame 10 with the main chamber 2 in addition to carrying in and out the TFT array substrate between the load lock chamber 3 and the main chamber 2. The TFT array substrate and the prober frame 10 are moved between the chambers by a transport mechanism provided in each chamber. In addition, between the load lock chamber 3 and the atmosphere side, and between the load lock chamber 3 and the main chamber 2, the opening and closing of each gate valve 11 and 12 is controlled, and evacuation or introduction of nitrogen or the like in each chamber is performed. Control the pressure to atmospheric pressure by.

  In FIGS. 1 and 2, an exhaust mechanism for a vacuum pump or the like for evacuating the main chamber 2 and the load lock chamber 3, and a gas introduction mechanism for introducing nitrogen gas into each chamber to return it to atmospheric pressure. Omitted and not shown.

The prober frame stocker 4 is a part that stores and holds a plurality of types of prober frames , and the prober frames are carried in and out by a transport mechanism .

The upper end of the load lock chamber 3 has an opening, and the opening can be freely opened and closed by an upper plate 7b. When the opening of the load lock chamber 3 is closed by the upper plate 7b, the upper plate 7b acts as a lid for closing the load lock chamber 3. A prober frame support portion 7a that supports the prober frame 10 when the prober frame 10 is conveyed is provided below the upper plate 7b . In the state where the upper plate 7 b closes the load lock chamber 3, the prober frame support portion 7 a and the load lock chamber 3 are accommodated.

  The prober frame support portion 7a and the upper plate 7b are integrally moved up and down by a lifting mechanism (not shown).

  FIG. 2 shows a state in which the prober frame holding part 6A in the prober frame stocker 4 holds the prober frame 10A and the prober frame support part 7a of the prober frame transport part 7 supports the prober frame 10B. This state shows a state in which the prober frame support part 7a and the upper plate 7b of the prober frame transport part 7 are raised by an elevating mechanism (not shown).

In the state shown in FIG. 2 , the upper plate 7b is lifted from the load lock chamber 3 by a lifting mechanism (not shown) to open the load lock chamber 3, and the prober frame 10B supported by the prober frame support portion 7a is connected to the load lock chamber 3. Is taken out above. When the load lock chamber 3 is in a vacuum state, nitrogen gas or the like is introduced into the load lock chamber 3 before raising the upper plate 7b, and the pressure in the load lock chamber 3 is set to atmospheric pressure. .

  In addition, the prober frame support part 7a moves the prober frames 10A and 10B between the prober frame holding parts 6A and 6B of the prober frame stocker 4, thereby exchanging the prober frames.

  On the other hand, the upper plate 7b is lowered and brought into contact with the opening of the load lock chamber 3 to close the load lock chamber 3, and the prober frame support portion 7a provided at the lower portion of the upper plate 7b is placed in the load lock chamber 3. Introduce. After the upper plate 7b is lowered and the load lock chamber 3 is closed, the inside of the load lock chamber 3 is evacuated to a vacuum state, and the gate valve 12 is opened so that the main chamber 2 in a vacuum state is opened. The prober frame 10 can be replaced. For example, a roller transport mechanism can be used as the transport mechanism.

  On the stage (not shown) in the main chamber 2, the TFT array substrate to be inspected and the prober frame 10 are transported through the load lock chamber 3. An inspection signal is applied to the TFT array substrate by the prober frame 10, and an electron beam is irradiated from the electron beam source 8. By the electron beam irradiation, the TFT array substrate emits secondary electrons corresponding to the voltage state. The detector 9 (secondary electron detector) detects the emitted secondary electrons. The detection signal processing unit 24 obtains a voltage waveform from the detected amount of secondary electrons, and the defect detection unit 25 compares the detected voltage waveform with the voltage waveform detected when an inspection signal is applied in a normal state. The defect inspection of the TFT array substrate is performed.

The prober frame 10 includes contact pins that are electrically connected to the electrodes of the TFT array substrate. In order to inspect the TFT array substrate, a prober frame is arranged on the TFT array substrate placed on the stage, and the electrical connection is established between the TFT array substrate and the prober frame by bringing the electrode terminals and contact pins into contact with each other. The inspection signal is supplied to the TFT array through the connection between the contact pin and the electrode terminal. The connection between the prober frame and the stage is made by a connector provided on the prober frame and the stage side.

  FIG. 3 is a schematic view for explaining a prober frame used in the TFT array substrate inspection apparatus of the present invention. In FIG. 3, the TFT array substrate 101 to be inspected has nine panels 102, and the electrode terminal of each panel is located at one position of the panel (the position on the upper right side with respect to the TFT array substrate in FIG. 3). The panel specification and electrode arrangement of the TFT array substrate 101 can be arbitrary.

  In FIG. 3, the TFT array substrate 101 is formed with a plurality of pixels formed in a lattice pattern on an insulating substrate such as a glass substrate, with a TFT array, ITO electrodes, etc. (not shown). Wiring for supplying drive signals to the pixels is provided.

  The prober frame 10 includes a frame frame 10a that surrounds the outer periphery of the TFT array substrate 101, and a frame bar 10b that is installed between opposing sides of the frame frame 10a. The frame bar 10b is in the axial direction of at least one of the frame frames 10a. The installation position can be freely set.

  A contact pin unit 10d including a plurality of contact pins 10c is detachably provided on the frame 10a so that the arrangement position can be changed.

Prober frame 10 includes a rectangular framework 10a formed in the frame body of the outer peripheral portion so as to line of sight of the panel inner as hollow, comprises a frame bar 10b attached to the framework 10a, full Remuba 10b in the frame frame 10a On the other hand, it is arranged in the X-axis direction, and is installed at an arbitrary position in the Y-axis direction with respect to two opposite sides of the frame 10a in the Y-axis direction. In addition, in FIG. 3, although the fixing | fixed part which fixes the frame bar 10b to the frame 10a is not shown, it can fix to the arbitrary positions of the frame 10a. The frame bar 10b may be arranged in the Y direction in addition to being arranged in the X direction shown in FIG.

  The frame bar 10b is provided with frame bar wiring (not shown) along the length direction. This frame bar wiring is a wiring for applying an inspection signal to the electrode terminal of the TFT array substrate 101 from the outside of the prober frame 10 via a contact pin. For example, a member of the frame bar 10b is used for a printed circuit board. it can.

  The contact pin unit 10d is detachable at an arbitrary position in the length direction of the frame bar 10b, and includes a plurality of contact pins 10c that come into contact with the electrode terminals of the TFT array substrate 101. An inspection signal is supplied to the TFT array substrate by contact between the contact pins 10c and the electrode terminals of the TFT array substrate 101.

  In the prober frame 10, the installation position of the frame bar 10b with respect to the frame frame 10a can be changed in the Y-axis direction, and the installation position of the contact pin unit 10d with respect to the frame bar 10b can be changed in the X-axis direction. The contact pins 10c can be aligned with the electrode terminals provided on the TFT array substrate 101, and can correspond to the panel specifications.

  The change of the arrangement position of the contact pin of the prober frame of this invention is demonstrated using FIG.

  FIG. 4 shows an example in which the number of panels formed on the TFT array substrate and the arrangement positions of the electrode terminals are different.

  The TFT array substrate 101a in FIG. 4A and the TFT array substrate 101b in FIG. 4C are different in the number of panels and the arrangement positions of the electrode terminals.

In FIGS. 4 (a) to show the TFT array substrate 101a, has four panels, an example in which the electrode terminals 103 downward left position is provided for each panel, a TFT array substrate 101b shown in FIG. 4 (c) In the example, six panels are provided, and the electrode terminal 103 is provided at the lower right position of each panel.

  Accordingly, since the TFT array substrate 101a and the TFT array substrate 101b have different configurations in terms of the number of panels and the arrangement of electrode terminals, the prober frame in which the contact pin arrangement position is set corresponding to one of the TFT array substrates. Cannot be used for the other TFT array substrate.

  The prober frame 10 shown in FIG. 4B moves the frame bar 10b with respect to the frame frame in accordance with the arrangement position of the electrode terminals 103 of the TFT array substrate 101a shown in FIG. On the other hand, by changing the arrangement position of the contact pin unit 10d, the position of the contact pin 10c and the position of the electrode terminal 103 of the TFT array substrate 101a can be aligned.

  The prober frame 10 shown in FIG. 4 (d) moves the frame bar 10b relative to the frame frame in accordance with the arrangement position of the electrode terminals 103 of the TFT array substrate 101b shown in FIG. On the other hand, by changing the arrangement position of the contact pin unit 10d, the position of the contact pin 10c and the position of the electrode terminal 103 of the TFT array substrate 101a can be aligned.

  Next, in the TFT array substrate inspection apparatus 1 of the present invention, an example of changing and moving the pin arrangement position of the prober frame will be described with reference to FIGS.

  Here, the operation from the state in which one prober frame 10A is arranged in the main chamber 2 and the other prober frame 10B is arranged in the prober frame stocker 4 will be described.

  In the main chamber 2, an inspection signal for the TFT array substrate (not shown) is supplied by the prober frame 10A to inspect the substrate. In the prober frame stocker 4, the contact pins of the prober frame 10B are changed by the contact pin arrangement position changing unit 5. Change the placement position of.

  The prober frame 10B in which the change of the arrangement position of the contact pin is completed is placed on the prober frame support part 7a from the prober frame holding part 6A (FIG. 5A).

  The prober frame transport section 7 is moved upward, and the prober frame 10B placed on the prober frame support section 7a is aligned with the prober frame holding section 6B of the prober frame stocker 4 (FIG. 5B).

  The prober frame 10B is moved from the prober frame support portion 7a to the prober frame holding portion 6B and temporarily held (FIG. 5C).

  The prober frame transport section 7 is moved downward, the prober frame support section 7a is introduced into the load lock chamber 3, the upper opening portion of the load lock chamber 3 is closed by the upper plate 7b, and the load lock chamber is exhausted (( FIG. 5 (d)).

  The gate valve 12 is opened, the prober frame 10A is unloaded from the main chamber 2 to the load lock chamber 3, and placed on the prober frame support portion 7a ((a) of FIG. 6).

  The prober frame transport section 7 is moved upward, the prober frame 10A placed on the prober frame support section 7a is aligned with the prober frame holding section 6A of the prober frame stocker 4, and the prober frame 10A is positioned at the prober frame holding section. Move to 6A. The prober frame 10 </ b> A can change the contact pin placement position by the contact pin placement position changing unit 5. The change by the contact pin arrangement position changing unit 5 is performed based on the panel layout information of the TFT array substrate (FIG. 6C).

  The prober frame transport section 7 is moved upward, and the prober frame support section 7a is aligned with the prober frame holding section 6B of the prober frame stocker 4 (FIG. 6 (d)).

  The prober frame 10B held by the prober frame holding part 6B of the prober frame stocker 4 is placed on the prober frame support part 7a (FIG. 7A).

  The prober frame transport section 7 is moved downward, the prober frame support section 7a on which the prober frame 10B is placed is introduced into the load lock chamber 3, and the upper portion of the load lock chamber 3 is closed by the upper plate 7b. The lock chamber is evacuated ((b) in FIG. 7).

  The gate valve 12 is opened, and the prober frame 10B is carried from the load lock chamber 3 to the main chamber 2. As a result, the prober frame is replaced ((c) in FIG. 7).

  After the gate valve 12 is closed and the load lock chamber 3 is returned to atmospheric pressure, the gate valve 11 is opened, and the TFT array substrate 101 to be inspected is carried into the load lock chamber 3 ((d) in FIG. 7). .

  After the gate valve 11 is closed and the load lock chamber 3 is evacuated (FIG. 7C), the gate valve 12 is opened and the TFT array substrate 101 is carried into the main chamber 2 from the load lock chamber 3 (FIG. 8 (FIG. 8 (c)). a)).

  The gate valve 11 is closed, and the prober frame 10B previously carried in the main chamber 2 is moved to the TFT array substrate 101 side, and the contact pins of the prober frame 10B are brought into contact with the electrode terminals of the TFT array substrate 101. Then, an inspection signal is supplied to the TFT array substrate to inspect the TFT array substrate (FIG. 8B).

  After the inspection of the TFT array substrate is completed, the load lock chamber 3 is evacuated, the gate valve 12 is opened, and the inspected TFT array substrate 101 is carried out from the main chamber 2 to the load lock chamber 3 (FIG. 8C). .

  After the gate valve 12 is closed, the load lock chamber 3 is returned to atmospheric pressure, the gate valve 11 is opened, and the TFT array substrate 101 is unloaded. Thereafter, the TFT array substrate of the same type of panel specification is inspected.

While the TFT array substrate is being inspected , the contact pin arrangement position changing unit 5 in the prober frame stocker 4 changes the contact pin arrangement of the other prober frame 10A to the panel specification of the TFT array substrate to be inspected next. Changes are made accordingly (FIG. 8D).

  Next, in the TFT array substrate inspection apparatus 1 of the present invention, another example of the change of the pin arrangement position of the prober frame and the movement operation will be described with reference to FIGS.

  This operation example is an example in which two contact pin arrangement position changing units are provided in the prober frame stocker.

  In the main chamber 2, an inspection signal for the TFT array substrate (not shown) is supplied by the prober frame 10A to inspect the substrate. In the prober frame stocker 4, the contact pins of the prober frame 10B are changed by the contact pin arrangement position changing unit 5. Change the placement position of. At this time, the upper plate 7b of the prober frame transport unit 7 closes the open part of the load lock chamber 3 (FIG. 9A).

  The gate valve 12 is opened, the prober frame 10A is carried out from the main chamber 2 to the load lock chamber 3, and the gate valve 12 is closed (FIG. 9B).

  After returning the load lock chamber 3 to atmospheric pressure, the prober frame transport unit 7 is raised to open the open part of the load lock chamber 3, and the prober frame 10A placed on the prober frame support unit 7a is replaced with the prober frame. The position is aligned with the height of the prober frame holding portion 6A of the stocker 4 (FIG. 9C).

  The prober frame 10A is moved from the prober frame support portion 7a to the prober frame holding portion 6A of the prober frame stocker 4 (FIG. 9 (d)).

  The prober frame support part 7a is aligned with the height of the prober frame holding part 6B of the prober frame stocker 4 (FIG. 10A), and the prober frame 10B placed on the prober frame holding part 6B is replaced with the prober frame support part. It moves on 7a (FIG. 10 (b)).

  The prober frame transport unit 7 is lowered, and the prober frame 10B is moved into the load lock chamber 3. At this time, the upper plate 7b of the prober frame transport unit 7 closes the open part of the load lock chamber 3 (FIG. 10C).

  After evacuating the load lock chamber 3, the gate valve 12 is opened, and the prober frame 10B is carried into the main chamber 2 from the load lock chamber 3 (FIG. 10D).

  Thereafter, similarly to the operation shown in FIG. 8, after the gate valve 11 is closed and the load lock chamber 3 is exhausted, the gate valve 12 is opened and the TFT array substrate 101 is moved from the load lock chamber 3 into the main chamber 2. Carry in.

  The gate valve 11 is closed, and the prober frame 10B previously carried in the main chamber 2 is moved to the TFT array substrate 101 side, and the contact pins of the prober frame 10B are brought into contact with the electrode terminals of the TFT array substrate 101. An inspection signal is supplied to the TFT array substrate to inspect the TFT array substrate.

  After the inspection of the TFT array substrate is completed, the load lock chamber 3 is evacuated, the gate valve 12 is opened, and the inspected TFT array substrate 101 is carried out from the main chamber 2 to the load lock chamber 3.

  After the gate valve 12 is closed, the load lock chamber 3 is returned to atmospheric pressure, the gate valve 11 is opened, and the TFT array substrate 101 is unloaded. Thereafter, the TFT array substrate of the same type of panel specification is inspected.

  While performing this TFT array substrate, the contact pin arrangement position changing unit 5 in the prober frame stocker 4 arranges the contact pins of the other prober frame 10A according to the panel specification of the TFT array substrate to be inspected next. Change it.

  In both the replacement of the prober frame of the present invention and the replacement of the substrate, the main chamber 2 can maintain a vacuum state, and the driving state can be maintained without stopping the power source of the electron gun or the like. Can do. Therefore, by stopping the power supply, the so-called warm-up time required for driving the apparatus again can be omitted, and the downtime of the apparatus when replacing the prober frame can be shortened.

  The TFT array substrate inspection apparatus of the present invention can be applied not only to the inspection of a liquid crystal TFT substrate but also to an inspection apparatus that is performed in a vacuum, and is also suitable for an exposure apparatus using an electron beam or an ion beam, a vacuum such as an electron microscope, etc. The present invention can be applied to an apparatus using a processing chamber and a load lock chamber.

DESCRIPTION OF SYMBOLS 1 TFT array board | substrate inspection apparatus 2 Main chamber 3 Load lock chamber 4 Prober frame stocker 5 Contact pin arrangement position change part 6 Transport mechanism 6A, 6B Prober frame holding part 7 Prober frame conveyance part 7a Prober frame support part 7b Upper plate 8 Electron beam Source 9 Detector 10, 10A, 10B Prober frame 10a Frame frame 10b Frame bar 10c Contact pin 10d Contact pin unit 11, 12 Gate valve 20 Prober frame 21 Inspection signal generator 22 Scan controller 23 Prober frame movement controller 24 Detection signal Processing unit 25 Defect detection unit 26 Pin arrangement position control unit 27 Prober frame conveyance control unit 28 Substrate conveyance control unit 101, 101a, 101b Array substrate 102 Panel 103 Electrode terminal 2 1 array substrate inspecting apparatus 202 main chamber 203 load lock chamber 204 prober frame stocker 210, 210a, 210 b, 210c prober frame 211, 212 and 213 gate valve

Claims (4)

In a TFT array inspection apparatus that applies an inspection signal to a TFT array substrate through a contact pin of a prober frame and scans the electron beam on the TFT array substrate for inspection.
The prober frame can freely change the arrangement position of the contact pins,
A main chamber for inspecting the TFT array substrate in a vacuum state;
A load lock chamber for carrying in and out the TFT array substrate between the atmosphere side and the main chamber;
A prober frame stocker for storing the prober frame;
The prober frame stocker includes a contact pin arrangement position changing unit that changes an arrangement position of contact pins of the prober frame,
Through the load lock chamber, the two prober frames are alternately switched between the prober frame stocker and the main chamber,
In the prober frame stocker, the contact pin placement position changing portion changes the contact pin placement position of the prober frame,
An inspection apparatus for a TFT array substrate, wherein an inspection signal is applied to the TFT array substrate through a contact pin of a prober frame in the main chamber.   2. The TFT array substrate inspection apparatus according to claim 1, wherein the contact pin arrangement position changing unit changes the arrangement position of the contact pins of the prober frame based on the panel layout information of the TFT array substrate. The prober frame is
A frame bar that surrounds at least the outer periphery of the TFT array substrate and a frame bar that can be freely positioned between opposing sides of the frame frame;
A contact pin unit that is detachable at an arbitrary position in the length direction of the frame bar;
The contact pin arrangement position changing unit is
Based on the panel layout of the panel layout information, change the position of the frame bar relative to the side of the frame,
Based on the electrode layout of the panel layout information,
The TFT array substrate inspection apparatus according to claim 2, wherein a position of the contact pin unit is changed with respect to a length direction of the frame bar. Provided with a prober frame transfer section that is alternately replaced with a prober frame between the prober frame stocker and the main chamber;
The prober frame transport unit is
A prober frame support for supporting the prober frame;
A top plate for closing the load lock chamber,
4. The method according to claim 1, wherein when the TFT array substrate is carried in and out between the main chamber and the load lock chamber, the top plate closes an upper portion of the load lock chamber. 5. TFT array substrate inspection equipment.