JP5532926B2 - Board with pins and pins - Google Patents

Description

  The present invention relates to a board with pins and pins, and more particularly to a technique suitably used in a wiring board to which input / output terminal pins for mounting an electronic component such as a semiconductor package on the wiring board are attached.

  FIG. 1 shows a conventional example of a substrate with pins to which input / output terminal pins are attached. The substrate with pins has pin pads 2 a exposed at openings of solder resist layers 2 b formed on the surface of the wiring substrate 2. The pin 1 is composed of a cylindrical shaft portion 1a and a flange-shaped pin head portion 1b having a diameter larger than the shaft diameter formed at the tip of the shaft portion 1a. The pin head portion 1b is bonded to the pin pad 2a with the solder 3 so that the pin 1 and the wiring substrate 2 are bonded so that the pin shaft portion 1a is perpendicular to the surface of the wiring substrate 2.

  Such a substrate with pins has a problem that the reliability of bonding between the pins 1 and the wiring substrate 2 varies depending on the amount of the solder 3 that bonds the pins 1 and the pin pads 2a. For example, when the amount of the solder 3 for joining the pin 1 and the pin pad 2a is ideal, a fillet as shown in FIG. 1 is formed on the side surface 8 of the pin head 1b by the solder 3 between the pin head 1b and the pin pad 2a. Thus, the bonding reliability between the pin 1 and the wiring board 2 is maximized.

  On the other hand, if the amount of solder 3 that joins the pin 1 and the pin pad 2a is small, the fillet shape formed on the side surface 8 of the pin head portion 1b becomes insufficient as shown in FIG. The bonding reliability of 2 is reduced. Therefore, in order to form an ideal fillet as shown in FIG. 1, it is necessary to slightly increase the supply amount of the solder 3.

  On the other hand, if the amount of the solder 3 that joins the pin 1 and the pin pad 2a is large, as shown in FIG. 3, the solder 3 exceeds the side surface 8 of the pin head portion 1b and faces the pin shaft portion 1a in the pin head portion 1b. There is a possibility that the surface 10 gets wet and reaches the pin shaft portion 1a. When the solder 3 comes into contact with the pin shaft portion 1a, the stress applied to the pin 1 is transmitted to the solder 3 as it is when the electronic component is mounted on the substrate with the pin, so that the joining solder 3 is easily broken. The bonding reliability of the wiring board 2 is reduced.

For example, Patent Document 1 to Patent Document 3 describe a technique for suppressing a decrease in bonding reliability between the pin 1 and the wiring board 2 due to the amount of the solder 3 that bonds the pin 1 and the pin pad 2a. ing. In Patent Document 1, the solder 3 that joins the pin pad 2a and the pin head portion 1b does not reach the pin shaft portion 1a from the pin pad 2a beyond the peripheral portion of the pin shaft portion 1a side plane of the pin head portion 1b. There is disclosed a pin erected substrate configured so as to wet and spread on the plane of the part 1a. Moreover, in patent document 2, while the recessed part was formed in the center part of the surface at the side of the pin shaft part 1a in the pin head part 1b, it comprised so that the end of the pin shaft part 1a might be connected with the bottom face of the recessed part. A wiring board with lead pins is disclosed. Patent Document 3 discloses a wiring board with lead pins in which a concave portion is formed on the side surface of the pin head portion 1b, and the pin pad 2a and the pin head portion 1b are joined so that the solder 3 is inserted into the concave portion.
Japanese Patent No. 3550355 JP 2005-236213 A JP 2001-217342 A

  In the structures disclosed in Patent Document 1 and Patent Document 2, if the amount of the solder 3 that joins the pin 1 and the pin pad 2a is too large, the solder 3 exceeds the side surface 8 of the pin head portion 1b and the pin shaft portion 1a side. When the surface spreads wet, it is difficult to prevent reaching the pin shaft portion 1a. In addition, the structure disclosed in Patent Document 3 is intended to give the solder 3 that has entered the concave portion the function of preventing the pin from coming off in order to increase the bonding strength of the pin. That is, consideration regarding the bonding reliability between the pin 1 and the wiring board 2 is lacking, and for example, no correspondence is shown when the amount of the solder 3 is too large. As described above, in any of the techniques disclosed in the above-mentioned patent documents, it is necessary to make an effort to make the amount of the solder 3 that joins the pin 1 and the pin pad 2a ideal, but in reality, the supply amount of the solder 3 varies. As a result, the bonding reliability between the pin 1 and the wiring board 2 may be lowered.

  The present invention has been made to solve the above-described problems. In a board with a pin to which pins for input / output terminals for mounting electronic components such as a semiconductor package on a wiring board are mounted, the pin and the wiring are provided. The object is to improve the bonding reliability with the substrate.

In order to achieve such an object, a first substrate with a pin of the present invention comprises a shaft portion, a pin provided at the tip of the shaft portion and having a flange-shaped pin head portion larger in diameter than the shaft portion, and a pin pad exposed on the surface. The pin head portion and the pin pad are joined with an adhesive material, and the surface of the shaft portion side where the shaft portion of the pin head portion is provided is formed with an annular notch in a concave shape. The inner peripheral end of the notch is in contact with the surface on the shaft side, the inner peripheral end of the annular notch is separated from the shaft, and the annular notch in the pin head portion is the inner peripheral end. The deepest part is located near the side surface of the pin head from the middle between the outer peripheral end of the annular notch.

The first pin of the present invention is a pin that constitutes a substrate with a pin together with a wiring substrate having a pin pad exposed on the surface, and is provided at the shaft portion and the tip of the shaft portion and has a larger diameter than the shaft portion and a flange shape. The pin head portion has a pin head portion on which the shaft portion side surface is provided with a concave annular notch, and the inner peripheral end of the annular notch is formed on the shaft portion side surface . The inner peripheral end of the annular notch and the shaft portion are spaced apart from each other, and the annular notch in the pin head portion is located between the inner peripheral end and the outer peripheral end of the annular notch. The deepest part is located near the side.

  The outer peripheral side end of the annular notch is preferably as close to the side surface of the pin head portion as possible. Further, it is desirable that the valley portion of the annular notch is as close to the side surface of the pin head portion as possible.

  ADVANTAGE OF THE INVENTION According to this invention, in the board | substrate with a pin to which the pin for input / output terminals for mounting electronic components, such as a semiconductor package, on a wiring board was attached, the joint reliability of a pin and a wiring board improves.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Embodiment 1]
FIG. 4 is a perspective view showing a part of the substrate with pins according to the first embodiment of the invention. 5 is a perspective sectional view, and FIG. 6 is a side sectional view.

  The wiring board 2 has a pin pad 2a exposed at an opening of a solder resist layer 2b formed on the surface. The pin 1 has a cylindrical shaft portion 1a and a flange-shaped pin head portion 1b formed at the tip of the shaft portion 1a and having a diameter larger than the shaft diameter. The pin head portion 1b is bonded to the pin pad 2a with the solder 3 so that the pin 1 and the wiring substrate 2 are bonded so that the pin shaft portion 1a is perpendicular to the surface of the wiring substrate 2. An annular notch 4 is formed on a surface 10 of the pin head portion 1b facing the pin shaft portion 1a, an inner peripheral side end 5 of the annular notch 4 is in contact with the facing surface 10, and The inner peripheral end 5 of the notch 4 and the pin shaft portion 1a are spaced apart from each other, and the surface 9 of the annular notch 4 is the inner peripheral end 5 and the outer peripheral end of the annular notch 4. It exists in the pin pad 2a side with respect to the surface 12 which connects the part 6. FIG. The trough 7 of the annular notch is located in the middle between the inner peripheral end 5 and the outer peripheral end 6 of the annular notch 4.

  FIG. 7 to FIG. 12 are side cross-sectional views showing the pin head portion in the substrate with pins of the present embodiment, and show examples of the cross-sectional shape of the annular cutout formed in the pin head portion.

  The cross-sectional shape of the annular notch in FIG. 7 is such that the outer peripheral end 6 of the annular notch is not in contact with the side surface 8 of the pin head portion. The valley portion 7 of the annular notch is located closer to the side surface 8 of the pin head portion than the middle between the inner peripheral side end portion 5 and the outer peripheral side end portion 6 of the annular notch.

  The cross-sectional shape of the annular notch in FIG. 8 is such that the outer peripheral end 6 of the annular notch is in contact with the side surface 8 of the pin head portion. The valley portion 7 of the annular notch is located closer to the side surface 8 of the pin head portion than the middle between the inner peripheral side end portion 5 and the outer peripheral side end portion 6 of the annular notch.

  The cross-sectional shape of the annular notch in FIG. 9 is such that the outer peripheral end 6 of the annular notch is in contact with the side surface 8 of the pin head portion. The valley portion 7 of the annular notch is located closer to the side surface 8 of the pin head portion than the middle between the inner peripheral side end portion 5 and the outer peripheral side end portion 6 of the annular notch. Furthermore, the inner peripheral side surface 9 formed from the inner peripheral side end portion 5 of the annular notch toward the trough portion 7 of the annular notch forms a concave curved surface.

  Although not shown, the outer peripheral side end 6 is in contact with the side surface 8 of the pin head portion, and the trough portion 7 is closer to the pin shaft portion 1a than the middle between the inner peripheral side end 5 and the outer peripheral side end 6. The outer peripheral side surface 9 formed from the outer peripheral side end portion 6 toward the valley portion 7 may be configured to form a concave curved surface.

  In the cross-sectional shape of the annular notch in FIG. 10, the outer peripheral side end 6 of the annular notch is in contact with the side surface 8 of the pin head portion. The valley portion 7 of the annular notch is located closer to the side surface 8 of the pin head portion than the middle between the inner peripheral side end portion 5 and the outer peripheral side end portion 6 of the annular notch. Further, the inner peripheral side surface 9 formed from the inner peripheral side end portion 5 of the annular notch toward the annular notch valley portion 7, and the annular notch valley from the outer peripheral side end portion 6 of the annular notch. The outer peripheral side surface 9 formed toward the portion 7 forms a concave curved surface.

  The cross-sectional shape of the annular notch in FIG. 11 is such that the outer peripheral end 6 of the annular notch is in contact with the side surface 8 of the pin head portion, but the height of the outer peripheral end 6 of the annular notch is annular. It is lower than the height of the inner peripheral side end 5 of the notch. The valley portion 7 of the annular notch is located closer to the side surface 8 of the pin head portion than the middle between the inner peripheral side end portion 5 and the outer peripheral side end portion 6 of the annular notch. Further, the inner peripheral side surface 9 formed from the inner peripheral side end portion 5 of the annular notch toward the annular notch valley portion 7, and the annular notch valley from the outer peripheral side end portion 6 of the annular notch. The outer peripheral side surface 9 formed toward the portion 7 forms a concave curved surface.

  The cross-sectional shape of the annular notch in FIG. 12 is such that the outer peripheral end 6 of the annular notch is in contact with the side surface 8 of the pin head portion, but the height of the outer peripheral end 6 of the annular notch is annular. It is lower than the height of the inner peripheral side end 5 of the notch. Further, the valley portion 7 of the annular notch is at the same position as the outer peripheral side end portion 6 of the annular notch. Further, the side surface 9 formed from the inner peripheral side end 5 of the annular notch toward the outer peripheral side end 6 of the annular notch forms a concave curved surface, and the inner peripheral end of the annular notch It is located on the pin pad side with respect to the surface 12 connecting the part 5 and the outer peripheral end 6.

  Comparing the cross-sectional shapes of the annular notch shown in FIG. 7 and FIG. 8, the positions of the inner peripheral side end 5 and the trough 7 of the annular notch are the same, but the annular notch of FIG. Since the outer peripheral side end portion 6 is in contact with the side surface 8 of the pin head portion, the volume of the annular notch is larger in FIG. 8, and more solder can be collected.

  Comparing the cross-sectional shapes of the annular notches shown in FIGS. 8 and 9, the positions of the inner peripheral end 5, the outer peripheral end 6, and the trough 7 of the annular notch are the same. Since the inner peripheral side surface 9 formed from the inner peripheral side end portion 5 of the annular notch toward the valley portion 7 has a concave curved surface, the volume of the annular notch is larger in FIG. , Can collect more solder.

  Comparing the cross-sectional shapes of the annular notches shown in FIGS. 10 and 11, the positions of the inner peripheral end 5, the outer peripheral end 6 and the trough 7 of the annular notch are the same. Since the height of the outer peripheral end 6 of the annular notch is lower than the height of the inner peripheral end 5 of the annular notch, the volume of the annular notch is smaller in FIG. Become. However, since the height of the inner peripheral side end portion 5 of the annular notch in FIG. 11 is higher than the height of the outer peripheral end portion 6 of the annular notch, even in FIG. It becomes difficult to reach.

  Comparing the cross-sectional shapes of the annular notches shown in FIGS. 11 and 12, the height of the outer peripheral side end portion 6 of the annular notch is lower in FIG. The volume of the annular notch becomes smaller. However, in FIG. 12, the difference between the height of the inner peripheral side end portion 5 and the height of the outer peripheral end portion 6 of the annular notch is larger. Therefore, in FIG. It becomes difficult to reach.

  The annular notch shown in FIGS. 7 to 11 has a valley shape with a V-shaped cross section, but is a recess-like notch having a bottom of a predetermined width (for example, upside down). It is good also as a frustum or a hollow part of a column shape.

  As described above, the substrate with pins according to the present embodiment accumulates excess solder in the annular notch formed on the surface of the pin head portion facing the pin shaft portion. As a result, it is difficult for the solder to reach the pin shaft portion, and it is possible to prevent the bonding reliability between the pin and the wiring board from being lowered.

[Embodiment 2]
FIG. 13 is a side sectional view of the pin head portion of the substrate with pins according to the second embodiment of the present invention. The substrate with pins is the same as the substrate with pins of the first embodiment except that the annular surface 10 between the inner peripheral side end portion 5 of the annular notch and the pin shaft portion 1b (with the pin shaft portion 1a in the pin head portion 1b). A solder resist layer is formed on the opposite surface.

  The operation of this embodiment will be described with reference to FIG.

  When the solder resist layer is formed on the annular surface 10 between the inner peripheral end 5 of the annular notch and the pin shaft portion 1b, as shown in FIG. 13A, the annular notch 4 is formed. As a result, the surface tension of the solder 11 accumulated in the solder increases. For this reason, compared with the case where the soldering resist layer as shown in FIG.13 (b) is not formed, the quantity of the solder 11 which accumulates in the annular notch 4 increases.

  Thus, since the board | substrate with a pin of this embodiment increases the solder amount which accumulates in the annular notch formed in the surface facing a pin shaft part in a pin head part, the board | substrate with a pin of Embodiment 1 mentioned above and In comparison, the supply amount of solder can be increased, and the bonding reliability between the pins and the wiring board is further improved.

[Embodiment 3]
In the substrate with pins according to the third embodiment of the present invention, a material layer having high wettability with respect to solder is formed on the surface 9 of the annular notch in the substrate with pins according to the first embodiment.

  As described above, the pinned substrate of the present embodiment makes it easy for the solder accumulated in the annular notch to spread evenly into the annular notch due to the material layer having high wettability to the solder. For this reason, compared with the board | substrate with a pin of Embodiment 1 mentioned above, a solder becomes difficult to reach | attain even to a pin axial part, and the joining reliability of a pin and a wiring board improves more.

  In addition, in the board | substrate with a pin shown as Embodiment 1-Embodiment 3 of this invention, although the pin head part cross section has demonstrated rectangular shape, a pin head part cross section has a hemispherical shape, convex (convex) shape. Or a shape similar to these.

  As described above, the substrate with pins to which the present invention is applied includes a pin provided with a shaft portion and a flange-shaped pin head portion having a diameter larger than that of the shaft portion, and a wiring board provided with a pin pad exposed on the surface. The pin head portion and the pin pad are joined with an adhesive material, an annular notch is formed on the surface of the pin head portion facing the shaft portion, and the inner peripheral end of the annular notch is in contact with the facing surface. The inner peripheral end of the annular notch and the shaft are separated from each other, and the surface of the annular notch is on the pin pad side with respect to the surface connecting the inner peripheral end and the outer peripheral end of the annular notch. Adopt the structure in

  Further, in the substrate with pins to which the present invention is applied, a material layer for preventing the adhesion of the adhesion means is formed on the surface of the pin head portion facing the shaft portion located between the annular notch and the shaft portion. It may have an annular surface.

  Further, the substrate with pins to which the present invention is applied may be one in which a material layer having high wettability with respect to the adhesive material is formed on the surface of the annular notch in the pin head portion.

  Moreover, the board | substrate with a pin to which this invention is applied may be what the outer peripheral side edge part of the cyclic | annular notch in a pin head part is in contact with the side surface of a pin head.

  In the substrate with pins to which the present invention is applied, the deepest portion of the annular notch in the pin head portion is located near the side surface of the pin head from the middle between the inner peripheral end and the outer peripheral end. It may be.

  Further, the substrate with pins to which the present invention is applied is the innermost side surface formed from the inner peripheral side end of the annular notch in the pin head portion toward the deepest portion and / or the deepest portion from the outer peripheral side end. The outer peripheral side surface formed toward the surface may be a concave curved surface.

  A pin to which the present invention is applied is a pin that constitutes a substrate with a pin together with a wiring board having a pin pad exposed on the surface, and is provided at the shaft portion and the tip of the shaft portion and has a larger diameter than the shaft portion and a flange-shaped pin head The pin head portion is bonded to the pin pad with an adhesive material, an annular notch is formed on the surface of the pin head portion facing the shaft portion, and the inner peripheral end of the annular notch is in contact with the facing surface. The inner peripheral side end of the annular notch and the shaft part are spaced apart, and the surface of the annular notch is on the pin pad side with respect to the surface connecting the inner peripheral end and the outer peripheral end of the annular notch. Adopt a certain structure.

  In the pin to which the present invention is applied, the pin head portion has an annular shape in which a material layer for preventing adhesion of adhesion means is formed on the surface facing the shaft portion located between the annular notch and the shaft portion. It may have the following surface.

  Moreover, the pin to which the present invention is applied may be one in which a material layer having high wettability with respect to the adhesive material is formed on the surface of the annular notch in the pin head portion.

  The pin to which the present invention is applied may be one in which the outer peripheral side end of the annular notch in the pin head portion is in contact with the side surface of the pin head.

  In the pin to which the present invention is applied, the deepest portion of the annular notch in the pin head portion is positioned closer to the side surface of the pin head than the middle between the inner peripheral end and the outer peripheral end of the annular notch. You may do.

  The pin to which the present invention is applied is directed to the inner peripheral side surface formed from the inner peripheral side end portion of the annular notch in the pin head portion toward the deepest portion and / or the deepest portion from the outer peripheral side end portion. The outer peripheral side surface formed in this way may have a concave curved surface.

  According to the above-described embodiment, the annular notch is formed on the surface of the pin head portion facing the pin shaft portion, and the inner peripheral side end portion of the annular notch is separated from the pin shaft portion, and Since the surface of the annular notch is on the pin pad side with respect to the surface connecting the inner peripheral side end and the outer peripheral end of the annular notch, the solder that joins the pin and the pin pad exceeds the side surface of the pin head portion and the pin shaft portion Even if the side surface wets and spreads, the solder remains in the annular notch and does not reach the pin shaft. For this reason, even if the supply amount of the solder is increased, it is possible to prevent a decrease in the bonding reliability between the pin and the wiring board.

  Further, according to the above-described embodiment, the solder resist layer is formed on the annular surface between the inner peripheral end of the annular notch and the pin shaft portion, so that the annular notch is in the annular notch. The amount of accumulated solder increases. For this reason, compared with the case where there is no soldering resist layer, the supply_amount | feed_rate of solder can be increased more and the joining reliability of a pin and a wiring board will improve more.

  Further, according to the above-described embodiment, a material layer having high wettability with respect to the adhesive is formed on the surface of the annular notch, so that the solder accumulated in the annular notch is in the annular notch. It becomes easy to spread evenly. For this reason, compared with the case where there is no material layer with high wettability, it becomes difficult for a solder to reach | attain to a pin axial part, and the joining reliability of a pin and a wiring board improves more.

  Further, according to the above-described embodiment, in the manufacturing process of the substrate with pins, even if the amount of solder supply is large, it is possible to prevent a decrease in the bonding reliability between the pins and the wiring substrate. For this reason, the tolerance value of the variation in the solder supply amount is relaxed, and the cost of the manufacturing process can be reduced.

  The present invention has been described above with reference to the embodiments. However, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

  This application claims priority based on Japanese Patent Application No. 2007-334086 filed on Dec. 26, 2007 and Japanese Patent Application No. 2008-104543 filed on Apr. 14, 2008. , The entire disclosure of which is incorporated herein.

It is side surface sectional drawing for demonstrating the structure of a common board | substrate with a pin. It is side surface sectional drawing for demonstrating the structure of a common board | substrate with a pin. It is side surface sectional drawing for demonstrating the structure of a common board | substrate with a pin. It is the perspective view which showed a part of board | substrate with a pin concerning embodiment of this invention. It is a perspective sectional view showing a part of a substrate with a pin concerning an embodiment of the present invention. It is side surface sectional drawing which showed a part of board | substrate with a pin concerning embodiment of this invention. It is side surface sectional drawing which showed the pin head part of the board | substrate with a pin concerning embodiment of this invention. It is side surface sectional drawing which showed the pin head part of the board | substrate with a pin concerning embodiment of this invention. It is side surface sectional drawing which showed the pin head part of the board | substrate with a pin concerning embodiment of this invention. It is side surface sectional drawing which showed the pin head part of the board | substrate with a pin concerning embodiment of this invention. It is side surface sectional drawing which showed the pin head part of the board | substrate with a pin concerning embodiment of this invention. It is side surface sectional drawing which showed the pin head part of the board | substrate with a pin concerning embodiment of this invention. It is side surface sectional drawing which showed the pin head part of the board | substrate with a pin concerning embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pin 1a Pin axial part 1b Pin head part 2 Wiring board 2a Pin pad 2b Solder resist layer 3,11 Solder 4 Circular notch 5 Inner peripheral side edge 6 Outer peripheral side edge 7 Valley part 8 Pin head side surface 9 Annular cutting Surface of the notch 10 Face of the pin head part facing the pin shaft part (annular surface)
12 A surface connecting the inner peripheral end and the outer peripheral end of the annular notch

Claims (12)

A pin provided at the tip of the shaft portion and the shaft portion and having a pin head portion having a larger diameter than the shaft portion and a flange shape;
A wiring board having a pin pad exposed on the surface;
The pin head part and the pin pad are joined with an adhesive material,
An annular notch is formed in a concave shape on the surface of the pin head portion on which the shaft portion is provided, and an inner peripheral side end portion of the annular notch is in contact with the surface on the shaft portion side. , The inner peripheral side end of the annular notch and the shaft portion are spaced apart,
The pinned substrate is characterized in that the annular notch is located at the deepest portion near the side surface of the pin head from the middle between the inner peripheral end and the outer peripheral end of the annular notch. . Pinned substrate according to claim 1 wherein the annular cut-outs, the wettability higher material layer for said adhesive material, characterized in that it is formed on the surface of the pin head portion. 3. The substrate with pins according to claim 1, wherein an outer peripheral side end portion of the annular notch in the pin head portion is in contact with a side surface of the pin head. The annular notch in the pin head portion has an inner peripheral side surface formed from the inner peripheral side end portion toward the deepest portion and / or an outer peripheral side surface formed from the outer peripheral side end portion toward the deepest portion. The board | substrate with a pin of any one of Claim 1 to 3 which has comprised the curved surface. A pin provided at the tip of the shaft portion and the shaft portion and having a pin head portion having a larger diameter than the shaft portion and a flange shape;
A wiring board having a pin pad exposed on the surface;
The pin head part and the pin pad are joined with an adhesive material,
An annular notch is formed in a concave shape on the surface of the pin head portion on which the shaft portion is provided, and an inner peripheral side end portion of the annular notch is in contact with the surface on the shaft portion side. , The inner peripheral side end of the annular notch and the shaft portion are spaced apart,
The annular notch in the pin head portion is formed with a material layer having high wettability with respect to the adhesive material on a surface thereof . A pin provided at the tip of the shaft portion and the shaft portion and having a pin head portion having a larger diameter than the shaft portion and a flange shape;
A wiring board having a pin pad exposed on the surface;
The pin head part and the pin pad are joined with an adhesive material,
An annular notch is formed in a concave shape on the surface of the pin head portion on which the shaft portion is provided, and an inner peripheral side end portion of the annular notch is in contact with the surface on the shaft portion side. , The inner peripheral side end of the annular notch and the shaft portion are spaced apart,
The annular notch in the pin head portion is a substrate with pins , wherein an outer peripheral side end portion of the annular notch is in contact with a side surface of the pin head. The pin head portion has an annular surface in which a material layer for preventing adhesion of the adhesive material is formed on a surface on the shaft portion side located between the annular notch and the shaft portion. The board | substrate with a pin of any one of Claim 1 to 6 . Pins that constitute a substrate with pins together with a wiring substrate having pin pads exposed on the surface,
A shaft portion and a pin head portion that is provided at the tip of the shaft portion and has a larger diameter than the shaft portion and has a flange shape,
An annular notch is formed in a concave shape on the surface of the pin head portion on which the shaft portion is provided, and an inner peripheral side end portion of the annular notch is in contact with the surface on the shaft portion side. , The inner peripheral side end of the annular notch and the shaft portion are spaced apart,
The pin is characterized in that the annular notch in the pin head portion is located at the deepest portion near the side surface of the pin head from the middle between the inner peripheral end and the outer peripheral end of the annular notch . The pin according to claim 8 , wherein the annular notch in the pin head portion has a material layer having high wettability with respect to an adhesive material formed on a surface thereof. The pin according to claim 8 or 9 , wherein the annular notch in the pin head portion has an outer peripheral end in contact with a side surface of the pin head. The annular notch in the pin head portion has an inner peripheral side surface formed from the inner peripheral side end portion toward the deepest portion and / or an outer peripheral side surface formed from the outer peripheral side end portion toward the deepest portion. The pin according to any one of claims 8 to 10 , wherein the pin has a curved surface. The pin head portion has an annular surface in which a material layer for preventing adhesion of an adhesive material is formed on a surface on the shaft portion side located between the annular notch and the shaft portion. The pin according to any one of claims 8 to 11 .

Images