JP5540905B2 - Cover tape for packaging electronic parts - Google Patents
Cover tape for packaging electronic parts Download PDFInfo
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- JP5540905B2 JP5540905B2 JP2010127831A JP2010127831A JP5540905B2 JP 5540905 B2 JP5540905 B2 JP 5540905B2 JP 2010127831 A JP2010127831 A JP 2010127831A JP 2010127831 A JP2010127831 A JP 2010127831A JP 5540905 B2 JP5540905 B2 JP 5540905B2
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- cover tape
- electronic component
- packaging
- heat
- sealant layer
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Links
- 238000004806 packaging method and process Methods 0.000 title claims description 31
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000000565 sealant Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 11
- 239000012766 organic filler Substances 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 239000011324 bead Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 36
- 239000002245 particle Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- -1 silica and alumina Chemical class 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Description
本発明は電子部品の保管、輸送、装着に際し、電子部品を汚染から保護し、電子回路基板に実装するために整列させ、取り出せる機能を有する包装体のうち、ヒートシールされ得る電子部品包装用カバーテープに関するものである。 The present invention is an electronic component packaging cover that can be heat-sealed out of a package that has the functions of protecting electronic components from contamination, arranging them for mounting on an electronic circuit board, and taking them out when storing, transporting, and mounting the electronic components. It is about tape.
従来、ＩＣチップや表面実装部品等の電子部品の保管や搬送には、電子部品の形状に合わせ凹状に加工されたポケット部を連続的に設けたキャリアテープが広く用いられている。電子部品をキャリアテープの凹状ポケット部に収納した後は、搬送時の電子部品の落下防止や、環境異物から電子部品の保護のためにヒートシール可能なカバーテープを用いて凹状ポケット部に封がされる。 2. Description of the Related Art Conventionally, for storing and transporting electronic components such as IC chips and surface mount components, carrier tapes that are continuously provided with pocket portions that are processed into a concave shape in accordance with the shape of the electronic component are widely used. After the electronic parts are stored in the concave pocket part of the carrier tape, they are sealed in the concave pocket part using heat-sealable cover tape to prevent the electronic parts from dropping during transportation and to protect the electronic parts from environmental foreign objects. Is done.
カバーテープの保管時のブロッキングを防止や、カバーテープ使用時の繰り出し性を改善するためにカバーテープの表面に滑材を加えて滑り性が調整されることがある。 In order to prevent blocking at the time of storage of the cover tape or to improve the feeding property when the cover tape is used, a sliding material may be added to the surface of the cover tape to adjust the sliding property.
このような滑材としては、シリカ、アルミナ等の金属酸化物、タルク、マイカ等の珪酸塩、炭酸カルシウム等の炭酸塩、硫酸バリウム等の硫酸塩のような無機フィラーや、エチレン、アクリル、スチレン、アクリロニトリル、酢酸ビニル、塩化ビニル、塩化ビニリデン、メタクリロニトリルモノマー等を重合した有機フィラーがある。 Examples of such a lubricant include metal oxides such as silica and alumina, silicates such as talc and mica, carbonates such as calcium carbonate, inorganic fillers such as sulfate such as barium sulfate, ethylene, acrylic and styrene. There are organic fillers obtained by polymerizing acrylonitrile, vinyl acetate, vinyl chloride, vinylidene chloride, methacrylonitrile monomers and the like.
しかしながら滑材が表面に加えられたカバーテープは、透明性が低下するため、キャリアテープの凹状ポケット部に電子部品を挿入しカバーテープをヒートシールした後に実施される検品工程において電子部品の視認性が低下するという課題があり、市場からは、滑り性と透明性とを併せ持つカバーテープが求められている。 However, since the cover tape with the lubricant applied to the surface is less transparent, the visibility of the electronic component can be checked in the inspection process after the electronic tape is inserted into the concave pocket of the carrier tape and the cover tape is heat sealed. The market is demanding cover tapes that have both slipperiness and transparency.
本発明は前述の様な問題を解決すべく、滑り性と透明性を両立させた電子部品包装用カバーテープを提供することを目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide a cover tape for packaging electronic parts that has both slipperiness and transparency in order to solve the above-described problems.
このような目的は、以下の本発明により達成することができる。
（１）基材層上に、少なくともヒートシーラント層を備えた電子部品包装用カバーテープであって、前記ヒートシーラント層がベース樹脂と有機フィラーとを含み、前記ベース樹脂と有機フィラーとの屈折率の差が０．１以下であることを特徴とするカバーテープ。
Such an object can be achieved by the following present invention.
(1) An electronic component packaging cover tape having at least a heat sealant layer on a base material layer, wherein the heat sealant layer includes a base resin and an organic filler, and a refractive index of the base resin and the organic filler. The cover tape characterized by the difference of 0.1 or less.
（２）前記ベース樹脂がアクリル系樹脂を主成分とするものである（１）記載の電子部品包装用カバーテープ。 (2) The cover tape for packaging electronic parts according to (1), wherein the base resin contains an acrylic resin as a main component.
（３）前記有機フィラーがアクリル系樹脂を主成分とする（１）または（２）記載の電子部品包装用カバーテープ。 (3) The cover tape for packaging electronic parts according to (1) or (2), wherein the organic filler is mainly composed of an acrylic resin.
（４）前記有機フィラーが架橋されたアクリルビーズである（３）記載の電子部品包装用カバーテープ。 (4) The cover tape for electronic component packaging according to (3), wherein the organic filler is a crosslinked acrylic bead.
（５）前記有機フィラーの粒度分布幅（Ｄ９０／Ｄ１０）が１０以下である（４）記載の電子部品包装用カバーテープ。 (5) The cover tape for electronic component packaging according to (4), wherein the organic filler has a particle size distribution width (D90 / D10) of 10 or less.
（６）前記有機フィラーの平均粒径が1μｍ以上２０μｍ以下である（５）記載の電子部品包装用カバーテープ。 (6) The electronic component packaging cover tape according to (5), wherein the organic filler has an average particle size of 1 μm or more and 20 μm or less.
（７）ベース樹脂が少なくとも２種以上のモノマー成分からなる共重合体である（２）記載の電子部品包装用カバーテープ。 (7) The cover tape for packaging electronic parts according to (2), wherein the base resin is a copolymer comprising at least two monomer components.
（８）前記モノマー成分のうち一種がメタクリル酸ブチルである（７）記載の電子部品包装用カバーテープ。 (8) The electronic component packaging cover tape according to (7), wherein one of the monomer components is butyl methacrylate.
（９）前記ヒートシーラント層は、ベース樹脂１００重量部に対して、フィラーを０．１〜１０重量部含有する（１）乃至（８）のいずれかに記載の電子部品包装用カバーテープ。 (9) The cover tape for electronic component packaging according to any one of (1) to (8), wherein the heat sealant layer contains 0.1 to 10 parts by weight of filler with respect to 100 parts by weight of the base resin.
（１０）（１）乃至（９）のいずれか１項に記載の電子部品包装用カバーテープと電子部品包装用キャリアテープとがヒートシールされて得られた電子部品包装体であって、前記ヒートシーラント層と前記キャリアテープとが所定の領域でヒートシールされている電子部品包装体。 (10) An electronic component packaging body obtained by heat-sealing the electronic component packaging cover tape according to any one of (1) to (9) and the electronic component packaging carrier tape, wherein the heat An electronic component package in which a sealant layer and the carrier tape are heat sealed in a predetermined region.
本発明に従うと、アンチブロッキング性と滑り性を持ち、かつ透明性の高いカバーテープを得ることが出来る。 According to the present invention, it is possible to obtain a cover tape having anti-blocking properties and sliding properties and high transparency.
以下、本発明について図面を用いて詳細に説明する。
図１に示すように本発明のカバーテープ１０は、基材層１上に少なくともヒートシーラント層２を備えたものである。
Hereinafter, the present invention will be described in detail with reference to the drawings.
As shown in FIG. 1, the cover tape 10 of the present invention has at least a heat sealant layer 2 on a base material layer 1.
（ヒートシーラント層）
ヒートシーラント層２は、ベース樹脂とフィラーとを含むものであり、ベース樹脂とフィラーとの屈折率の差が０．１以下であることが好ましい。ヒートシーラント層中がフィラーを含有するものであるとともに、ヒートシーラント層を形成するベース樹脂とフィラーとの差が前記範囲となることにより、本発明の電子部品包装用カバーテープは、アンチブロッキング性および滑り性を維持し、かつ透明性の高いものとなる。
(Heat sealant layer)
The heat sealant layer 2 contains a base resin and a filler, and the difference in refractive index between the base resin and the filler is preferably 0.1 or less. The heat sealant layer contains a filler, and the difference between the base resin forming the heat sealant layer and the filler is within the above range, so that the electronic component packaging cover tape of the present invention has anti-blocking properties and The slipperiness is maintained and the transparency is high.
（ベース樹脂）
ヒートシーラント層２のベース樹脂は、加熱によりキャリアテープと融着する役割を果たす。ヒートシーラント層のベース樹脂としては被着体であるキャリアテープに対して熱融着可能な樹脂が用いられる。例えばアイオノマー樹脂、ポリエステル樹脂、塩化ビニル−酢酸ビニル共重合体、アクリル樹脂、アクリル系樹脂、ポリウレタン樹脂、エチレン−酢酸ビニル共重合体、エチレン−（メタ）アクリル酸共重合体、エチレン−（メタ）アクリル酸エステル共重合体、スチレンーエチレンーブチレンースチレンブロック共重合体、マレイン酸樹脂などが挙げられる。特に多種多様なキャリアテープに熱融着可能であるという観点からアクリル系樹脂が好ましい。また、アクリル系樹脂の中でもキャリアテープに対する安定したシール性を発現させるためには、２種以上のモノマー成分からなる共重合物を用いることが好ましく、更にはモノマー成分のうち１種類がメタクリル酸ブチルである共重合物であることが好ましい。
(Base resin)
The base resin of the heat sealant layer 2 serves to fuse with the carrier tape by heating. As the base resin of the heat sealant layer, a resin that can be thermally fused to a carrier tape as an adherend is used. For example, ionomer resin, polyester resin, vinyl chloride-vinyl acetate copolymer, acrylic resin, acrylic resin, polyurethane resin, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) An acrylic ester copolymer, a styrene-ethylene-butylene-styrene block copolymer, a maleic acid resin, etc. are mentioned. In particular, an acrylic resin is preferable from the viewpoint that it can be heat-sealed to a wide variety of carrier tapes. In order to develop a stable sealing property with respect to the carrier tape among acrylic resins, it is preferable to use a copolymer composed of two or more kinds of monomer components. Furthermore, one of the monomer components is butyl methacrylate. It is preferable that it is a copolymer which is.
（フィラー）
ヒートシーラント層２に含まれるフィラーは、ヒートシーラント層のベース樹脂との屈折率の差を制御するという観点から、有機フィラーを用いることが好ましい。
(Filler)
The filler contained in the heat sealant layer 2 is preferably an organic filler from the viewpoint of controlling the difference in refractive index from the base resin of the heat sealant layer.
また有機フィラーの中でもベース樹脂との屈折率の差をより制御しやすいものとするためには、アクリル樹脂を主成分とするものが好ましく、更に耐候性や耐熱性の観点からは、架橋アクリルビーズであることが好ましい。 In order to make it easier to control the difference in refractive index from the base resin among the organic fillers, those containing an acrylic resin as a main component are preferable. Further, from the viewpoint of weather resistance and heat resistance, crosslinked acrylic beads are used. It is preferable that
更に架橋アクリルビーズの中でも、滑り性と透明性を制御する観点から、粒度分布幅の狭い架橋アクリルビーズであることが望ましい。粒度分布幅は、レーザー回折式粒度分布装置（マルバーン社、Ｍａｓｔｅｒｓｉｚｅｒ ２０００）により得られるＤ９０をＤ１０で除した値が１０以下であることが好ましい。また、架橋アクリルビーズの平均粒径（Ｄ５０）は、1μｍ以上２０μｍ以下であることが望ましい。 Further, among the crosslinked acrylic beads, it is desirable that the crosslinked acrylic beads have a narrow particle size distribution width from the viewpoint of controlling slipperiness and transparency. The particle size distribution width is preferably 10 or less by dividing D90 obtained by a laser diffraction particle size distribution apparatus (Malvern, Mastersizer 2000) by D10. The average particle diameter (D50) of the crosslinked acrylic beads is preferably 1 μm or more and 20 μm or less.
（基材層）
基材層１としては、電子部品包装用カバーテープにおいて基材層として用いられる公知ものを用いることができる。具体的には、ポリエステル、ポリアミド、ポリプロピレンなどが挙げられるが、耐熱性や耐破断性の観点からは二軸延伸ポリエステルフィルムを用いることが好ましい。
(Base material layer)
As the base material layer 1, the well-known thing used as a base material layer in the cover tape for electronic component packaging can be used. Specific examples include polyester, polyamide, and polypropylene. From the viewpoint of heat resistance and rupture resistance, it is preferable to use a biaxially stretched polyester film.
（クッション層）
また、本発明の電子部品包装用カバーテープにおいては、図２に示すように、基材１とヒートシーラント層２との間にクッション層３を設け電子部品包装用カバーテープ全体のクッション性を向上させ、ヒートシール時のカバーテープと、被着体であるキャリアテープとの密着性の向上を図ることができる。
(Cushion layer)
Moreover, in the cover tape for electronic component packaging of this invention, as shown in FIG. 2, the cushion layer 3 is provided between the base material 1 and the heat sealant layer 2, and the cushioning property of the whole cover tape for electronic component packaging is improved. Thus, it is possible to improve the adhesion between the cover tape at the time of heat sealing and the carrier tape as the adherend.
クッション層３に使用される樹脂としては、柔軟性を有する直鎖状低密度ポリエチレン、低密度ポリエチレン、エラストマー系樹脂、エチレン−酢酸ビニル共重合体等が広く使用されている。 As the resin used for the cushion layer 3, flexible linear low density polyethylene, low density polyethylene, elastomer resin, ethylene-vinyl acetate copolymer, and the like are widely used.
（電子部品包装用カバーテープの製造方法）
本発明に係るカバーテープの基材層は、押出による二軸延伸フィルム単層やそれら二軸延伸をラミネートにより積層したフィルムより形成することができる。クッション層については共押出し、インフレーション、ドライラミネーション法等により積層することができる。ヒートシーラント層は、キャリアテープに対して熱融着可能な樹脂を適宜溶剤に溶解または分散させて塗工液とし、この塗工液を中間層表面にロールコーティングやグラビヤコーティングなどの公知のコーティング法で塗布し、乾燥して層を形成することができる。
(Method of manufacturing cover tape for packaging electronic parts)
The substrate layer of the cover tape according to the present invention can be formed from a biaxially stretched film single layer by extrusion or a film obtained by laminating these biaxially stretched layers by lamination. The cushion layer can be laminated by coextrusion, inflation, dry lamination, or the like. The heat sealant layer is a known coating method such as roll coating or gravure coating on the surface of the intermediate layer by dissolving or dispersing a resin that can be thermally fused to the carrier tape in a suitable solvent. Can be applied and dried to form a layer.
（電子部包装用カバーテープの使用方法）
本発明のカバーテープは、例えば、電子部品の形状に合わせ凹状ポケットが連続的に設けられた電子部品搬送用キャリアテープの蓋材として用いられる。具体的には、前記凹状ポケットの開口部を密封するようにヒートシールされる。これによりキャリアテープポケット内に収められた電子部品の搬送時の落下防止や、環境異物からの保護が可能となる。
(How to use cover tape for electronic packaging)
The cover tape of the present invention is used, for example, as a lid for a carrier tape for transporting electronic components in which concave pockets are continuously provided in accordance with the shape of the electronic component. Specifically, heat sealing is performed so as to seal the opening of the concave pocket. As a result, it is possible to prevent the electronic component stored in the carrier tape pocket from falling during transportation and to protect it from environmental foreign matter.
本発明の実施例を以下に示すがこれらの実施例によって本発明は何ら限定されるものではない。
基材層として膜厚２５μｍの二軸延伸ポリエステルフィルム（フタムラ化学、太閤ポリエステルフィルムＦＥ２０２１）を使用し、クッション層として低密度ポリエチレン（住友化学、スミカセンＧ８０１）を押出しラミネート法（押出し温度：２８０℃）により基材層上に厚みが２５μｍとなるよう製膜した。次にアクリル樹脂をトルエンに溶解した溶液に、フィラーを表１中に示す配合比となるように加え混合した後、バーコート法を用いてクッション層上に膜厚が１μｍとなるよう塗工して乾燥し、図１に示した層構成の電子部品包装用カバーテープを得た。
Examples of the present invention are shown below, but the present invention is not limited to these examples.
A biaxially stretched polyester film (Futamura Chemical, Taiho Polyester Film FE2021) with a film thickness of 25 μm is used as the base material layer, and low density polyethylene (Sumitomo Chemical, Sumikasen G801) is extruded and laminated as the cushion layer (extrusion temperature: 280 ° C.). Thus, a film was formed on the base material layer to a thickness of 25 μm. Next, after adding and mixing the filler in a solution in which the acrylic resin is dissolved in toluene so that the blending ratio shown in Table 1 is obtained, it is coated on the cushion layer to a thickness of 1 μm using the bar coating method. And dried to obtain a cover tape for packaging electronic parts having the layer structure shown in FIG.
得られたカバーテープの曇度、静止摩擦係数、６０℃の環境でカバーテープを保管した場合のブロッキングの状態を測定した。その特性評価結果を実施例及び比較例については表１に示した。 The resulting cover tape was measured for haze, static friction coefficient, and blocking state when the cover tape was stored in an environment of 60 ° C. The characteristic evaluation results are shown in Table 1 for Examples and Comparative Examples.
本発明により得られる電子部品包装用カバーテープを用いると、キャリアテープの凹状ポケット部に収納した電子部品を容易に目視検査することができ、電子部品の搬送、保管の際に使用されるキャリアテープのカバーテープとして好適である。 When the electronic component packaging cover tape obtained by the present invention is used, the electronic component housed in the concave pocket portion of the carrier tape can be easily visually inspected, and the carrier tape used for transporting and storing the electronic component. It is suitable as a cover tape.
１・・・基材層
２・・・ヒートシーラント層
３・・・クッション層
４・・・キャリアテープ
１０・・・カバーテープ
２０・・・カバーテープ
DESCRIPTION OF SYMBOLS 1 ... Base material layer 2 ... Heat sealant layer 3 ... Cushion layer 4 ... Carrier tape 10 ... Cover tape 20 ... Cover tape
Claims (2)
前記ベース樹脂と有機フィラーとの屈折率の差が０．０１であり、
前記ヒートシーラント層は、前記ベース樹脂１００重量部に対して、前記フィラーを０．１〜１０重量部含有するものである電子部品用包装用カバーテープ。 A cover tape for packaging electronic parts comprising at least a heat sealant layer on a base material layer, the heat sealant layer comprising an acrylic resin as a base resin and crosslinked acrylic beads as an organic filler,
The difference in refractive index between the base resin and the organic filler is 0.01 ,
The heat sealant layer is a cover tape for packaging electronic parts, which contains 0.1 to 10 parts by weight of the filler with respect to 100 parts by weight of the base resin.
The electronic component packaging body obtained by heat-sealing the electronic component packaging cover tape according to claim 1 and the electronic component packaging carrier tape, wherein the heat sealant layer and the carrier tape are in a predetermined region. Electronic parts packaging that is heat sealed.
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| JP2010127831A JP5540905B2 (en) | 2010-06-03 | 2010-06-03 | Cover tape for packaging electronic parts |
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| JP2010127831A JP5540905B2 (en) | 2010-06-03 | 2010-06-03 | Cover tape for packaging electronic parts |
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| JP2014094754A (en) * | 2012-11-08 | 2014-05-22 | Rohm Co Ltd | Electronic component packaging body |
| JP6065569B2 (en) * | 2012-12-14 | 2017-01-25 | 住友ベークライト株式会社 | Cover tape for electronic component packaging and electronic component package |
| JP7469914B2 (en) * | 2020-03-05 | 2024-04-17 | 住友ベークライト株式会社 | Cover tape for packaging electronic components and electronic component package |
| CN116325040B (en) | 2020-10-09 | 2025-05-30 | 株式会社村田制作所 | Film capacitor, film and metallized film |
| WO2022075359A1 (en) | 2020-10-09 | 2022-04-14 | 株式会社村田製作所 | Film capacitor, film, and metallized film |
| WO2022075357A1 (en) | 2020-10-09 | 2022-04-14 | 株式会社村田製作所 | Film capacitor, film, and metallized film |
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| JP3327387B2 (en) * | 1998-06-29 | 2002-09-24 | 住友ベークライト株式会社 | Electronic component packaging |
| JP2001071432A (en) * | 1999-09-07 | 2001-03-21 | Japan Polychem Corp | Multilayered stretched polypropylene film |
| JP2004284605A (en) * | 2003-03-20 | 2004-10-14 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
| JP4438464B2 (en) * | 2003-09-05 | 2010-03-24 | 住友ベークライト株式会社 | Cover tape for packaging electronic parts |
| JP4615984B2 (en) * | 2004-12-16 | 2011-01-19 | 電気化学工業株式会社 | Cover tape |
| CN102171109B (en) * | 2008-11-12 | 2014-07-16 | 电气化学工业株式会社 | Cover tape |
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