JP5544866B2 - Imaging device, in-vehicle imaging device, and manufacturing method of imaging device - Google Patents

Description

  The present invention relates to an imaging device used for an in-vehicle camera, a digital camera, digital video, and the like, an in-vehicle imaging device, and a manufacturing method of the imaging device.

  2. Description of the Related Art Conventionally, an imaging device having an imaging lens and an imaging element such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) has been widely applied to in-vehicle cameras, digital cameras, digital videos, and the like.

As such an imaging measure, a lens holding member that holds a lens and a substrate on which an imaging element is mounted, and the substrate is bonded and fixed to the lens holding member with two different types of adhesives, For example, it is known from Patent Document 1.
Further, in Patent Document 1, in order to increase the bonding area, a rib is formed on the outer periphery of the lens holding member. The rib and the substrate are bonded with a first adhesive, and the lens holding member main body and the substrate are bonded. Discloses a technique in which and are bonded with a second adhesive.

  However, in the technique described in Patent Document 1 above, an ultraviolet curable adhesive is provided over substantially the entire length in the longitudinal direction of the rib provided on the outer periphery of the lens holding member to bond the rib and the substrate.

For this reason, when the ultraviolet curable adhesive is cured, the amount of cure shrinkage may vary depending on the location. If this difference occurs in the longitudinal direction of the rib, the rib is inclined in the longitudinal direction, and the lens holding member And the relative positional accuracy of the substrate is deteriorated.
In addition, since the ribs are not provided symmetrically with respect to the lens optical axis, there is a possibility that the substrate may be tilted from the position where the substrate is positioned when the difference in the amount of curing shrinkage occurs between the plurality of ribs.

  SUMMARY An advantage of some aspects of the invention is to provide an imaging apparatus capable of improving the relative positional accuracy between a lens holding member and a substrate and a method for manufacturing the same. Objective.

In order to achieve the above object, the present invention provides:
A lens holding member that holds the lens, and a substrate on which the image sensor is mounted,
The substrate is an imaging device in which the distance between the substrate and the lens is adjusted, and is bonded and fixed to the rear end surface of the support wall protruding from the lens holding member by two types of adhesives,
In a portion where the support wall is bonded to the rear end surface with respect to the substrate, the first adhesive is hardened in a columnar shape with a pair of two points that are equidistant from the optical axis of the lens and at symmetrical positions. A first adhesive layer, and a second adhesive layer in which the second adhesive is cured at a place other than the first adhesive layer, and the length of the application surface of the first adhesive in the adhesive fixing portion The dimension in the direction is less than twice the dimension in the short direction of the adhesive fixing part,
The dimension in the short direction of the application surface of the first adhesive in the adhesive fixing part is within the dimension in the short direction of the adhesive fixing part,
The second adhesive fills the adhesive fixing portion other than the first adhesive layer, and the hardness of the second adhesive after curing is higher than the hardness of the first adhesive after curing. The imaging device is characterized by this.

In the invention according to claim 2, in the imaging device according to claim 1,
The second adhesive is filled after the first adhesive layer is cured.
In the invention according to claim 3 , in the imaging device according to claim 1 or 2 ,
The support wall includes a plurality of wall surfaces surrounding the optical axis,
The first adhesive layer is disposed at an end portion in the longitudinal direction of the support wall.

In the invention according to claim 4 , in the imaging device according to claim 1 or 2 ,
Only the first set of the first adhesive layer is provided.

Moreover, in invention of Claim 5 , in the imaging device of any one of Claims 1-4 ,
The first adhesive is a photo-curing adhesive, and the second adhesive is a thermosetting adhesive.

Moreover, in invention of Claim 6 , it was set as the vehicle-mounted imaging device carrying the imaging device of any one of Claims 1-5 .

Moreover, in invention of Claim 7 , It is a manufacturing method of the imaging device of any one of Claims 1-6 ,
A position adjusting step of adjusting a position between the lens and the imaging element by adjusting a distance between the substrate and the lens;
After the position adjustment step, the first adhesive layer is formed by curing the first adhesive in a column shape with two points at equal distances from the optical axis of the lens and symmetrical positions as a set. A first joining step to perform,
After the execution of the first bonding step, the second bonding step of forming the second adhesive layer by curing the second adhesive at a place other than the first adhesive layer;
It was set as the manufacturing method of the imaging device characterized by comprising.

According to the present invention, when the support wall and the substrate are bonded, the first adhesive is formed in one or a plurality of sets with two points at a symmetrical position about the lens optical axis as a set. A first adhesive layer is formed, and the second adhesive is cured at a place other than the first adhesive layer to form a second adhesive layer.
Therefore, since the first adhesive layer is cured at a plurality of points at symmetrical positions around the lens optical axis when the first adhesive is cured, the shrinkage amount in the direction along the lens optical axis at the time of curing at each point And the difference in shrinkage between the points is suppressed. For this reason, it can suppress that a board | substrate inclines with respect to a lens optical axis due to the hardening shrinkage amount of a 1st adhesive agent. Therefore, it is possible to improve the relative positional accuracy between the lens holding member and the substrate.
Further, after the substrate is positioned and fixed by the first adhesive layer, the substrate can be firmly fixed by fixing by the second adhesive layer.

Furthermore, in the invention according to claim 3 , since the first adhesive layer is disposed at the longitudinal ends of the rear end surfaces of the plurality of wall surfaces forming the support wall, the first adhesive layer is disposed on the rear end surfaces of the plurality of wall surfaces. Compared to the case where the second adhesive layer is provided at the center in the longitudinal direction, the second adhesive layer is not divided by the first adhesive layer, and the work of filling the second adhesive becomes easy.
Furthermore, when a photo-curable adhesive is used as the first adhesive, the light access region can be increased as compared with the case where the first adhesive layer is provided in the center in the longitudinal direction of the rear end surfaces of the plurality of wall surfaces. It can be widely secured, it is easy to ensure the reliability of curing, and it is easy to cure the first adhesive in a column shape in order from the surface exposed to light, and suppresses the amount of curing shrinkage in the lens optical axis direction, supporting the substrate The position accuracy with the wall can be improved.

In addition, the invention according to claim 4 can reduce variation in the amount of cure shrinkage at each point and improve positional accuracy by using only one set of the first adhesive layer, compared to the case where a plurality of sets are provided. It is possible to make it.

In the invention according to claim 5 , by using a photo-curing adhesive as the first adhesive, the curing time is short and the high positional accuracy is efficiently fixed as compared with the thermosetting adhesive. be able to. On the other hand, by using a thermosetting adhesive as the second adhesive, it is possible to reliably cure and bond even at a position where light does not reach, and to obtain high bonding strength. Therefore, it is possible to achieve both high positional accuracy and high bonding strength.

According to the sixth aspect of the present invention , it is possible to improve the relative positional accuracy between the lens holding member and the substrate and to firmly fix the lens holding member, and it is easy to fill the second adhesive material. It is possible to provide an in-vehicle imaging device capable of obtaining a high bonding strength between the substrate and the substrate.

In the invention according to claim 7 , after adjusting the relative position between the substrate and the support wall by adjusting the distance between the substrate and the lens in the position adjusting step, the lens is symmetric about the lens optical axis at the same distance from the lens optical axis. A first bonding step is performed in which the first adhesive applied by combining two points at various positions is cured to form a columnar first adhesive layer, and the support wall and the substrate are temporarily fixed.
At this time, since the first adhesive layer has a columnar shape and is arranged at two points that are symmetrical at equal distances from the lens optical axis, the amount of curing shrinkage can be suppressed. Thereby, compared with the case of non-columnar, non-equal distance from the lens optical axis and asymmetric, the dimensional difference in the direction along the lens optical axis in each first adhesive layer is suppressed, and the substrate relative to the support wall is suppressed. Inclination is suppressed, and the positional accuracy is improved.

Then, the 2nd adhesive agent is apply | coated to places other than a 1st contact bonding layer between the rear-end part of a support wall, and a board | substrate, and the 2nd joining process of hardening is performed.
Accordingly, since the second adhesive is executed after temporary fixing by the first adhesive layer, a wide bonding fixing area can be obtained and bonding strength can be ensured.
As described above, high positioning accuracy can be secured by the first joining step, and high joining strength can be secured by the second joining step.

In particular, as described in claim 5, when a photo-curing adhesive is used as the first adhesive, the amount of curing shrinkage of the first adhesive in the first joining step is suppressed, and higher positional accuracy is achieved. Can be obtained. Further, when a thermosetting adhesive is used as the second adhesive, higher bonding strength can be obtained.

1 is a perspective view illustrating an external appearance of an imaging apparatus 1 according to Embodiment 1 of the present invention. FIG. 3 is a perspective view of the imaging device 1 as viewed from the connection cord 50 side. 3 is a side view showing a state in which a cover 30 and a connection cord 50 are removed from the imaging apparatus 1. FIG. 2 is a cross-sectional view of the imaging apparatus 1 with a cover 30 and a connection cord 50 removed. FIG. FIG. 3 is a perspective view of the imaging device 1 with a cover 30 and a connection cord 50 removed from the substrate 40 side. 2 is a perspective view showing a manufacturing apparatus 90 used when manufacturing the imaging apparatus 1. FIG. 5 is a flowchart showing a flow of a manufacturing method of the imaging apparatus 1 using the manufacturing apparatus 90. It is the figure which looked at the state which pinched | interposed the board | substrate 40 with two chuck pins 70A and 70B from a different direction, (A) shows the state seen from the side, (B) shows the state seen from the front. It is a perspective view which shows the scene where positioning of the board | substrate 40 is performed using the manufacturing apparatus 90. FIG. FIG. 3 is a perspective view of the lens cell 20 of the imaging device 1 as viewed from an oblique rear side. It is an application region of the ultraviolet curable adhesive Aa and the thermosetting adhesive Ab when the rear end surfaces 211a to 214a of the wall portions 211 to 214 of the support wall 21 are viewed from the front, and includes the first adhesive layer SA and the second adhesive. It is a front view which shows the area | region in which layer SB was formed. FIG. 6 is a cross-sectional view showing a first adhesive layer SA that joins the support wall 21 and the substrate 240, and shows a state cut along line S12-S12 in FIG. FIG. 6 is a front view illustrating a region where a first adhesive layer SA and a second adhesive layer SB are formed in an imaging apparatus of Example 2. FIG. 10 is a front view illustrating a region where a first adhesive layer SA and a second adhesive layer SB are formed in an imaging apparatus of Example 3. FIG. 10 is a front view illustrating a region where a first adhesive layer SA and a second adhesive layer SB are formed in an imaging apparatus of Example 4. FIG. 10 is a front view illustrating a region where a first adhesive layer SA and a second adhesive layer SB are formed in an imaging apparatus of Example 5. It is a front view which shows the area | region in which 1st contact bonding layer SA and 2nd contact bonding layer SB were formed in the imaging device of Example 6. It is a front view which shows the area | region in which 1st contact bonding layer SA and 2nd contact bonding layer SB were formed in the imaging device of Example 7. FIG. 10 is a front view illustrating a region where a first adhesive layer SA and a second adhesive layer SB are formed in an imaging apparatus according to an eighth embodiment. It is a front view which shows the area | region in which 1st contact bonding layer SA and 2nd contact bonding layer SB were formed in the imaging device of Example 9.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings.

  Hereinafter, with reference to the drawings, an imaging device 1 according to a first embodiment of the present invention and a manufacturing method thereof will be described. The image pickup apparatus 1 according to the first embodiment is configured as an in-vehicle camera that is installed, for example, around a bumper or a license plate at the rear of the vehicle, and is attached so as to take an image of a diagonally lower part behind the vehicle. In this case, the captured image of the imaging device is transmitted to the in-vehicle computer for each imaging frame and displayed on a liquid crystal display device or the like installed in the vehicle interior.

  However, the present invention is not limited to this, and it may be configured as an in-vehicle camera that detects an obstacle by imaging the front of the vehicle. Further, the present invention is not limited to a vehicle-mounted camera, and can be applied to a digital camera, a digital video, and the like.

[Constitution]
First, the configuration of the imaging apparatus 1 according to the first embodiment will be described.
FIG. 1 is an external configuration diagram of the imaging apparatus 1. As shown in the figure, the imaging device 1 includes a lens 10, a lens cell (lens holding member) 20, a cover 30 in which a substrate 40 and the like to be described later are accommodated, and a connection cord 50.

  FIG. 2 is a diagram of the imaging device 1 as viewed from the connection cord 50 side. As illustrated, screw holes 60 and 62 for screwing to the vehicle body and screw holes 64 and 66 for screwing the connection cord 50 to the cover 30 are formed on the connection cord 50 side of the imaging apparatus 1. Yes.

  FIG. 3 is a diagram illustrating a state where the cover 30 and the connection cord 50 are removed from the imaging apparatus 1, and FIG. 4 is a cross-sectional view thereof. The lens cell 20 is a member formed of resin, for example, and holds six lenses 10 to 15.

An image sensor (imaging device) 41 is a solid-state imaging device using a CCD (Charge Coupled Device), a CMOS (Complementary Metal Oxide Semiconductor), or the like, and photoelectrically converts an image formed by the lenses 10 to 15 to generate an image signal. To the outside (for example, to an in-vehicle computer).
The lens cell 20 includes a support wall 21 formed in a substantially square tube shape on the outer periphery of a cylindrical holding portion 22 that holds the lenses 10 to 15, and the image sensor 41 is held on the front surface 40 f on the support wall 21. The substrate 40 is bonded. In the present specification, the shooting direction of the imaging apparatus 1 indicated by the arrow FR is referred to as the front, and the direction indicated by the arrow RR that is the opposite direction is referred to as the rear.

FIG. 5 is a view of what is shown in FIG. 3 as viewed from the substrate 40 side. The substrate 40 is formed in a substantially rectangular shape.
On the other hand, as shown in FIG. 10, the support wall 21 includes a first wall portion 211, a second wall portion 212, a third wall portion 213, and a fourth wall portion 214 that form wall surfaces, and four locations. In the corner portion, a groove 215 that partitions each of the wall portions 211 to 214 is formed to the vicinity of the front end in the direction along the lens optical axis OP.

The substrate 40 is bonded to the rear end surfaces 211a, 212a, 213a, and 214a of the wall portions 211 to 214 of the support wall 21 by two types of adhesives, an ultraviolet curable adhesive Aa and a thermosetting adhesive Ab, which will be described later. Has been. In the first embodiment, grooves 23 filling the adhesives Aa and Ab are formed on the rear end surfaces 211a to 214a over substantially the entire length in the longitudinal direction.
The first adhesive layer SA cured with the ultraviolet curable adhesive Aa is provided in a circle indicated by the symbol SA in FIG. 5, and the second adhesive layer SB cured with the thermosetting adhesive Ab is illustrated in FIG. Are provided in the elliptical portion indicated by the reference numeral SB. The reason why the two adhesives Aa and Ab are used without screwing or the like is to prevent an increase in size and weight.

Next, the first adhesive layer SA and the second adhesive layer SB will be described.
FIG. 11 is an application region of the ultraviolet curable adhesive Aa and the thermosetting adhesive Ab when the rear end surfaces 211a to 214a of the walls 211 to 214 are viewed from the front, and includes the first adhesive layer SA and the second adhesive layer. It is a front view which shows the area | region in which SB was formed. In the figure, the rear end surfaces 211a to 214a are not shown because they are covered with both adhesives Aa and Ab.

As shown in FIG. 11, the application region of the ultraviolet curable adhesive Aa is disposed at both ends of the first wall portion 211 and the third wall portion 213 in the longitudinal direction (the direction of the arrow da). In the first embodiment, two sets are provided with two points arranged equidistantly and symmetrically about the axis OP.
Further, the ultraviolet curable adhesive Aa is applied in the form of dots. As described above, when the ultraviolet curable adhesive Aa is applied in the form of dots, the dimension d2 of the both walls 211 and 213 in the short direction (arrow db direction) is the dimension over the entire width of both the walls 211 and 213. The longitudinal direction (arrow da direction) dimension d1 is substantially equal to the lateral direction dimension d2. Here, the columnar shape means that the application plane of the ultraviolet curable adhesive Aa is not long in one direction. For example, in the case of a quadrangle as in the first embodiment, the longitudinal dimension d1 is short. If it is less than twice the hand-direction dimension d2, it is included in the columnar shape. Moreover, the application plane shape is not limited to a square, and may be a circle.

  The ultraviolet curable adhesive Aa applied in this way is cured in a columnar shape extending in the direction along the lens optical axis OP as shown in the cross-sectional view of the first adhesive layer SA in FIG. Is formed.

  Returning to FIG. 5, the substrate 40 has substantially circular arc-shaped (not arcs protruding in a convex shape but concave shapes) at two corners located diagonally. Is formed. In addition to the image sensor 41, electronic components such as capacitors and resistors are mounted on the substrate 40, but no electronic components are mounted in predetermined areas near the defect portions 40 </ b> A and 40 </ b> B and near the outer peripheral edge.

  In addition, the lens cell 20 is similarly formed with defect portions 20A and 20B corresponding to the defect portions 40A and 40B, and has cylindrical side surfaces formed by the defect portions 40A and 20A and the defect portions 40B and 20B, respectively. The space is used as a space through which the screw penetrates when the lens cell 20 and the cover 30 are connected with two screws.

[Manufacturing process]
Next, in the manufacturing process of the imaging device 1, in particular, a process of bonding the substrate 40 to the support wall 21 of the lens cell 20 will be described.

  The defect portions 40A and 40B are used to sandwich the substrate 40 by the manufacturing apparatus 90 described below when the substrate 40 holding the image sensor 41 is bonded to the lens cell 20.

  FIG. 6 is a schematic diagram showing an external configuration of the manufacturing apparatus 90. The manufacturing apparatus 90 includes chuck pins 70A and 70B and an actuator 80.

  The chuck pins 70A and 70B include substantially cylindrical main body portions 72A and 72B, and tapered portions 74A and 74B each having a conical partial side surface shape such that the cross-sectional radius decreases as approaching the main body portions 72A and 72B. Have. The cross-sectional radii (R1) of the tapered portions 74A and 74B at least at the boundary portions 76A and 76B with the main body portions 72A and 72B are smaller than the radius (R2) of the missing portions 40A and 40B (see FIG. 8). Actually, it is desirable that the cross-sectional radius is smaller than the radius of the defective portions 40A and 40B over the entire area of the tapered portions 74A and 74B. The actuator 80 is driven by air pressure, for example, and can drive the chuck pins 70A and 70B in a desired direction.

  FIG. 7 is a flowchart showing a flow of a manufacturing method of the imaging apparatus 1 using the manufacturing apparatus 90. The imaging device 1 is manufactured according to the following flow.

First, a lens cell fixing step is performed (S100).
That is, the lens cell 20 is fixed to a fixing unit (not shown) of the manufacturing apparatus 90 (which may be a fixing unit separate from the manufacturing apparatus).

Next, a substrate clamping process is performed (S101).
That is, the substrate 40 is sandwiched between the two chuck pins 70A and 70B. FIG. 8 is a view of the state in which the substrate 40 is sandwiched between the two chuck pins 70A and 70B as seen from different directions.

  As shown in FIG. 8A, since the substrate 40 is pressed from both sides in a state of being in contact with the taper portions 74A and 74B, it gradually rises and stops in a state of being in contact with the main body portions 72A and 72B. . Therefore, it is fixed to the manufacturing apparatus 90 at a fixed relative position in the vertical direction (the cylindrical axis direction of the chuck pins 70A and 70B).

  Further, as shown in FIG. 8B, the substrate 40 is pressed by the boundary portions 76A and 76B having a radius smaller than the radius of the missing portions 40A and 40B, and therefore, the central portion of the missing portions 40A and 40B. It stops in a state where the boundary portions 76A and 76B are in contact with 40A # and 40B #. Therefore, it is fixed to the manufacturing apparatus 90 at a fixed relative position in the front-rear and left-right directions (the direction orthogonal to the cylindrical axis direction of the chuck pins 70A and 70B).

  That is, the substrate 40 is fixed to the manufacturing apparatus 90 at a certain relative position with respect to the vertical and horizontal directions.

Next, a first application process is performed (S102).
The first application step is a step of applying the ultraviolet curable adhesive Aa, and at both ends in the longitudinal direction of the first wall portion 211 and the third wall portion 213 of the support wall 21 fixed to a fixing device (not shown). The ultraviolet curable adhesive Aa is applied in the form of dots so as to form two sets of two points that are symmetrical to the lens optical axis OP. Further, in the substrate 40, the ultraviolet curable adhesive Aa may be applied in a dot-like manner to the positions facing the both ends in the longitudinal direction of the first wall portion 211 and the third wall portion 213.

Next, a positioning step is performed (S103).
That is, the moving means (not shown) is driven to transport the substrate 40 to an appropriate position on the lens cell 20. At this time, the image sensor 41 is maintained in an energized state, and the captured images are displayed on a monitor or the like, and the lens 10 to 15 and the image sensor 41 are optimized so that the focus and the left / right position are optimized while watching this. The relative position is finely adjusted (positioning). FIG. 9 is a diagram illustrating a scene where positioning is performed. The positioning is performed by sliding the substrate 40 on the lens cell 20 so that the applied ultraviolet curable adhesive Aa is surely in contact with both the substrate 40 and the support wall 21.

Next, an ultraviolet irradiation step (first bonding step) is performed (S104).
That is, when positioning is completed, ultraviolet rays are irradiated to cure the ultraviolet curable adhesive Aa to form the first adhesive layer SA, and a part of the substrate 40 and the support wall 21 of the lens cell 20 is joined. . At this time, since the ultraviolet curable adhesive Aa is disposed at both ends in the longitudinal direction of the first wall portion 211 and the third wall portion 213, the ultraviolet light is along the longitudinal direction as shown in FIG. Irradiation is possible from two directions, the direction of the arrow vr1 which is the direction and the direction of the arrow vr2 which is the direction along the short side direction, and the ultraviolet curable adhesive Aa is reliably irradiated with ultraviolet rays and cured reliably. It is possible to improve the bonding reliability of the first adhesive layer SA.

At this time, the ultraviolet curable adhesive Aa is applied to a small dot-like region, and is cured so as to form columns in order from the surface that has been exposed to the ultraviolet rays. As a result, the amount of curing shrinkage in the direction along the lens optical axis OP can be suppressed as compared with the case where the coating is applied over a wide range. In addition, since the ultraviolet curable adhesive Aa is arranged at four points that are symmetrical with respect to the lens optical axis OP, even if curing shrinkage occurs, the substrate 40 is compared with the case where it is arranged asymmetrically. Inclination can be suppressed. Therefore, it is possible to improve the relative positional accuracy between the lens cell 20 and the substrate 40. In addition, at this time, the ultraviolet curable adhesive Aa is not mixed with the thermosetting adhesive Ab, Compared with the case where both are mixed, stronger joining can be obtained.

Next, a 2nd application | coating process is implemented (S105).
In the second coating step, the thermosetting adhesive Ab is filled between the rear end surfaces 211a to 214a of the walls 211 to 214 and the substrate 40 except for the portion where the first adhesive layer SA is formed. It is a process. As the thermosetting adhesive Ab, an adhesive having higher adhesive strength after curing than the ultraviolet curable adhesive Aa is used.

  In the first embodiment, the first adhesive layer SA is provided at both longitudinal ends of the first wall portion 211 and the third wall portion 213. For this reason, when applying the thermosetting adhesive Ab, both the walls 211 and 213 need only one work for filling between the first adhesive layers SA. Compared with being provided in the middle of 213, the coating workability is excellent. In addition, since 1st contact bonding layer SA is not formed in the 2nd wall part 212 and the 4th wall part 214, the application | coating operation | work is only 1 operation | work and it is excellent in application | coating operability.

Next, a heating step (second bonding step) is performed (S106).
That is, when the application of the thermosetting adhesive Ab is completed, heat treatment is performed at an appropriate temperature, the thermosetting adhesive Ab is cured, and the main portion of the lens cell 20 and the substrate 40 is joined. The main manufacturing process is finished. Note that the heating step may be performed after being removed from the manufacturing apparatus 90, or when the heating can be performed on the manufacturing apparatus 90, the process may be performed as it is.

  By carrying out this heating step, the second adhesive layer SB filled with the thermosetting adhesive Ab in a wide range and cured while maintaining the high-accuracy position by the first adhesive layer SA allows strong adhesion. Strength can be obtained. At this time, since the bonding by the first adhesive layer SA has already been performed, the positional deviation between the substrate 40 and the lens cell 20 due to the volume change due to the thermosetting of the thermosetting adhesive Ab is unlikely to occur. If a thermosetting adhesive Ab that is softer than the ultraviolet curable adhesive Aa is used after curing, the substrate 40 can be prevented from being twisted due to uneven curing of the thermosetting adhesive Ab. is there.

[Effect of Example 1]
According to the imaging device 1 and the manufacturing method thereof according to the first embodiment, the effects listed below can be obtained.
a) When joining the support wall 21 and the substrate 40, the UV curable adhesive Aa is bonded to two pairs of columnar first adhesives with two points at symmetrical positions about the lens optical axis OP as a set. The layer SA was formed, and the thermosetting adhesive Ab was cured at a place other than the first adhesive layer SA to form the second adhesive layer SB.
Thus, since the ultraviolet curable adhesive Aa is cured at a plurality of “points” at symmetrical positions with the lens optical axis OP as the center, the ultraviolet curable adhesive Aa is applied to the rear end surfaces 211 a to 214 a of the support wall 21. Compared with the case of extending in the longitudinal direction, the amount of shrinkage and the variation in the direction along the lens optical axis OP during curing can be suppressed. In addition, since the ultraviolet curable adhesive Aa is disposed at a symmetrical position with respect to the lens optical axis OP, the substrate 40 has a lens as compared with the asymmetrical arrangement even when curing shrinkage occurs. Inclination with respect to the optical axis OP can be suppressed.
Therefore, it is possible to suppress the substrate 40 from being inclined with respect to the lens optical axis OP due to the curing shrinkage amount and variations of the ultraviolet curable adhesive Aa, and thereby the relative relationship between the lens cell 20 and the substrate 40. It is possible to improve the position accuracy. Therefore, the relative positions of the lenses 10 to 15 and the image sensor 41 are accurately determined.

b) As described above in a), since the ultraviolet curable adhesive Aa was used as the first adhesive to be cured first, compared with the case of using the thermosetting adhesive Ab, the curing time was short and the efficiency was improved. Good high positional accuracy can be fixed.
Furthermore, since the thermosetting adhesive Ab is used for the second adhesive layer SB, it is possible to reliably cure and bond even at a position where light does not reach, and obtain a high bonding strength by obtaining a wide bonding fixing area. It is possible. Therefore, it is possible to achieve both high positional accuracy and high bonding strength.

  c) Since the first adhesive layer SA obtained by curing the ultraviolet curable adhesive Aa is provided at both longitudinal ends of the first wall portion 211 and the third wall portion 213 that form the support wall 21, the first adhesive layer SA Compared with the case where the wall portions 211 to 214 are provided at the center in the longitudinal direction, the irradiation region of the ultraviolet rays at the time of curing can be secured widely, the curing reliability can be improved, and the surfaces irradiated with the ultraviolet rays are cured in order. It is easy to suppress the amount of curing shrinkage in the direction along the lens optical axis OP, and the positional accuracy between the substrate 40 and the support wall 21 can be improved. In addition, the application work in the second application process for applying the thermosetting adhesive Ab is also facilitated.

  d) Since the ultraviolet curable adhesive Aa is cured and then the thermosetting adhesive Ab is applied and cured, both the adhesives Aa and Ab are applied at the same time, and both of the adhesives Aa and Ab are partially applied. It is possible to harden each adhesive agent Aa and Ab firmly compared with what was mixed, and a stronger joint can be obtained.

  e) Since the grooves 23 are formed in the rear end surfaces 211a to 214a of the wall portions 211 to 214 of the support wall 21, the adhesives Aa and Ab enter the grooves 23 when the adhesives Aa and Ab are applied. The surface tension makes it easier for the adhesives Aa and Ab to stay on the rear end surfaces 211a to 214a, and the dripping of the adhesives Aa and AB can be suppressed.

(Other examples)
Although other embodiments will be described below, these other embodiments are modifications of the first embodiment described above, and therefore only the differences will be described, and the configuration common to the first embodiment described above will be described. The description is omitted by assigning a common reference numeral.

(Example 2)
An imaging apparatus of Example 2 will be described.
In Example 2, as shown in FIG. 13, the first adhesive layer SA obtained by curing the ultraviolet curable adhesive Aa is added to both end portions in the longitudinal direction of the second wall portion 212 and the fourth wall portion 214. It is.

Therefore, in Example 2, the bonding strength between the support wall 21 and the substrate 40 at the time when the first adhesive layer SA is formed by curing the ultraviolet curable adhesive Aa is further increased.
Other functions and effects are the same as those in the first embodiment.

(Example 3)
Next, an image pickup apparatus according to Embodiment 3 will be described.
In Example 3, as shown in FIG. 14, the first adhesive layer SA in which the ultraviolet curable adhesive Aa is cured is applied to one end in the longitudinal direction of the first wall portion 211 and the third wall at a symmetrical position. This is an example in which only one set of two points with one end in the longitudinal direction of the portion 213 is provided.

In Example 3, when the ultraviolet curable adhesive Aa is cured, when the shrinkage in the direction along the lens optical axis OP occurs, the substrate is compared with the case where a plurality of sets of the first adhesive layers SA are provided. Forty displacement points are reduced and tilting is less likely to occur.
Therefore, the positional accuracy between the lens cell 20 and the substrate 40 can be further improved.

Furthermore, in Example 3, when the lens cell 20 or the substrate 40 is deformed when heating is performed to cure the thermosetting adhesive Ab, a set of two points whose shape change has already been cured. It is difficult to transmit except for the first adhesive layer SA, and it is possible to obtain a high positional accuracy by suppressing the relative position change between the support wall 21 and the substrate 40 as compared with the case where a plurality of sets of the first adhesive layer SA are provided. It is.
Other functions and effects are the same as those in the first embodiment.

Example 4
Next, an image pickup apparatus according to Embodiment 4 will be described.
In Example 4, as shown in FIG. 15, the first adhesive layer SA obtained by curing the ultraviolet curable adhesive Aa is applied to the center in the longitudinal direction of the rear end surfaces 211 a to 214 a (not shown) of the walls 211 to 214. In this example, two sets of two points at symmetrical positions about the lens optical axis OP are provided.

  In Example 4, the direction in which the ultraviolet curable adhesive Aa is irradiated with ultraviolet rays is mainly one direction indicated by arrows vr41 to vr44, but the other functions and effects are the same as in Example 1. is there.

(Example 5)
Next, an image pickup apparatus according to Embodiment 5 will be described.
Example 5 is a modification of Example 4, and as shown in FIG. 16, the first adhesive layer SA obtained by curing the ultraviolet curable adhesive Aa is applied to the first wall portion 211 and the third wall portion 213. This is an example in which one set of two points arranged at the center in the longitudinal direction and symmetrical with respect to the lens optical axis OP is provided.
Since Example 5 has only two points of the first adhesive layer SA as compared with Example 4, even when the curing shrinkage of the ultraviolet curable adhesive Aa occurs as in Example 3, the substrate 40 Inclination hardly occurs, and high positional accuracy can be obtained.

(Example 6)
Next, an image pickup apparatus according to Embodiment 6 will be described.
As shown in FIG. 17, the support wall 621 used in this Example 6 and Examples 7 to 9 to be described later is not formed with a groove 215, and each of the walls 211 to 214 is a continuous rectangular tube shape. Is formed.

In Example 6, the first adhesive layer SA obtained by curing the ultraviolet curable adhesive Aa is disposed at four corners of the support wall 621, and the two symmetrical positions about the lens optical axis OP are arranged. This is an example in which two pairs of points are provided.
Even in the sixth embodiment, the same effects as those of the first embodiment can be obtained.

(Example 7)
In Example 7, as shown in FIG. 18, the first adhesive layer SA shown in Example 6 is provided only in a pair of diagonal two points.
Therefore, as in the third embodiment, it is possible to further improve the position accuracy.

(Example 8)
In Example 8, as shown in FIG. 19, the first adhesive layer SA is arranged in the center in the longitudinal direction of each of the walls 211 to 214, and a set of two points at symmetrical positions around the lens optical axis OP is formed. This is an example in which two sets are provided. Therefore, it is possible to obtain the same effect as that of the fourth embodiment.

Example 9
In Example 9, as shown in FIG. 20, the first adhesive layer SA shown in Example 8 is provided in only one pair of the first wall part 211 and the third base part 213. Therefore, it is possible to obtain the same effect as that of the fifth embodiment.

  The embodiments of the present invention have been described using the examples. However, the present invention is not limited to these examples, and various modifications and substitutions may be made without departing from the scope of the present invention. Can do.

  For example, although the rectangular cylindrical support walls 21 and 621 are shown as the support walls, the shape is not limited to this, and may be, for example, a cylindrical shape or a polygonal shape other than a square shape. Also good.

  In the examples, the ultraviolet curable adhesive Aa is shown as the first adhesive, and the thermosetting adhesive Ab is shown as the second adhesive. However, the present invention is not limited to this. For example, An adhesive such as a room temperature curing type or a thermoplastic type can also be used. Moreover, although the ultraviolet curable adhesive was shown as a photocurable adhesive, it is not limited to this, Other adhesives, such as a visible light curable adhesive and an anaerobic adhesive, can also be used.

  In the embodiment, the first adhesive layer is provided with 1, 2, and 4 sets. However, the number of the sets is not limited to this, and the number of sets may be 3 or 5 or more. Good.

  In the embodiment, the first application process is performed before the substrate 40 is positioned by the position adjustment process. However, the present invention is not limited to this, and the first application process is performed after the position adjustment process. You may make it perform the 1st joining process which implements a process, applies a 1st adhesive agent, and hardens this after that. Alternatively, in the first bonding step, the first adhesive may be gradually cured while being piled up.

  The present invention can be used in a camera manufacturing industry using a CCD or a CMOS.

DESCRIPTION OF SYMBOLS 1 Imaging devices 10-15 Lens 20 Lens cell (lens holding member)
21 Support walls 211a, 212a, 213a, 214a Rear end face 40 Substrate 41 Image sensor (imaging device)
Aa UV curable adhesive (first adhesive: light curable adhesive)
Ab thermosetting adhesive (second adhesive)
SA first adhesive layer SB second adhesive layer

Japanese Patent No. 3765770

Claims (7)

A lens holding member that holds the lens, and a substrate on which the image sensor is mounted,
The substrate is an imaging device in which the distance between the substrate and the lens is adjusted, and is bonded and fixed to the rear end surface of the support wall protruding from the lens holding member by two types of adhesives,
In a portion where the support wall is bonded to the rear end surface with respect to the substrate, the first adhesive is hardened in a columnar shape with a pair of two points that are equidistant from the optical axis of the lens and at symmetrical positions. A first adhesive layer, and a second adhesive layer in which the second adhesive is cured at a place other than the first adhesive layer, and the length of the application surface of the first adhesive in the adhesive fixing portion The dimension in the direction is less than twice the dimension in the short direction of the adhesive fixing part,
The dimension in the short direction of the application surface of the first adhesive in the adhesive fixing part is within the dimension in the short direction of the adhesive fixing part,
The second adhesive fills the adhesive fixing portion other than the first adhesive layer, and the hardness of the second adhesive after curing is higher than the hardness of the first adhesive after curing. An imaging apparatus characterized by that. The imaging device according to claim 1,
The image pickup apparatus, wherein the second adhesive is filled after the first adhesive layer is cured. In the imaging device according to claim 1 or 2,
The support wall includes a plurality of wall surfaces surrounding the optical axis,
The image pickup apparatus, wherein the first adhesive layer is disposed at an end portion in a longitudinal direction of the support wall. In the imaging device according to claim 1 or 2,
The imaging apparatus, wherein only the one set of the first adhesive layer is provided. The imaging apparatus according to any one of claims 1 to 4,
The imaging apparatus, wherein the first adhesive is a photo-curing adhesive, and the second adhesive is a thermosetting adhesive.   An in-vehicle imaging device equipped with the imaging device according to any one of claims 1 to 5. A method for manufacturing an imaging device according to any one of claims 1 to 6,
A position adjusting step of adjusting a position between the lens and the imaging element by adjusting a distance between the substrate and the lens;
After the position adjustment step, the first adhesive layer is formed by curing the first adhesive in a column shape with two points at equal distances from the optical axis of the lens and symmetrical positions as a set. A first joining step to perform,
After the execution of the first bonding step, the second bonding step of forming the second adhesive layer by curing the second adhesive at a place other than the first adhesive layer;
An image pickup apparatus manufacturing method comprising:

Images