JP5546472B2 - Liquid processing apparatus, liquid processing method, and recording medium storing program for executing liquid processing method - Google Patents

Description

  The present invention relates to a liquid processing apparatus that performs processing using a processing liquid, a liquid processing method, and a recording medium that records a program for executing the liquid processing method.

  In a semiconductor device manufacturing process or a flat panel display (FPD) manufacturing process, a processing liquid is supplied to a semiconductor wafer or glass substrate, which is a substrate to be processed (hereinafter referred to as “substrate” or “wafer”), to perform liquid processing. Many liquid processing processes are performed.

  As one of such liquid processing processes, there is a liquid processing process in which a processing liquid is supplied to the back surface or the peripheral portion of the substrate, and the liquid processing is performed on the back surface or the peripheral portion of the substrate with the supplied processing liquid.

  For example, in a manufacturing process of a semiconductor device or the like, a film forming process may be performed to form various thin films on the surface of the substrate. In the film forming process, a thin film may be formed not only on the surface of the substrate but also on the back surface or the peripheral edge of the substrate. It is preferable to remove the thin film formed on the back surface or the peripheral portion of the substrate because it may cause warpage of the substrate in the subsequent manufacturing process, for example, during heat treatment. Therefore, a liquid processing process may be performed in which the processing liquid is supplied to the back surface or the peripheral portion of the substrate, and the back surface or the peripheral portion of the substrate is etched by the supplied processing liquid.

  As a liquid processing apparatus that performs such a liquid processing process, a liquid processing apparatus that supplies a gas to the upper surface of the substrate and supplies a processing liquid to the lower surface of the substrate to perform liquid processing on the lower surface and the peripheral portion of the substrate. Is known (for example, see Patent Document 1). In the example shown in Patent Document 1, the liquid processing apparatus includes a substrate holding rotation unit (supporting unit), a processing liquid supply unit, and a blocking plate (top plate). The substrate holding and rotating means (support unit) rotates the substrate while holding (supporting) it substantially horizontally. The processing liquid supply means supplies the processing liquid toward the lower surface of the substrate rotated by the substrate holding and rotating means (support unit). The blocking plate (top plate) is placed on the substrate holding and rotating means so as to face the upper surface of the substrate with a predetermined gap, and is rotated together with the substrate by the substrate holding and rotating means. An opening for supplying gas to the upper surface of the substrate is formed at the approximate center of the lower surface of the blocking plate (top plate).

JP 2002-110626 A

  However, the above-described liquid processing apparatus and liquid processing method for processing a substrate using the processing liquid have the following problems.

  In the liquid processing apparatus shown in Patent Document 1, the position of the top plate with respect to the support portion cannot be accurately positioned. That is, it is impossible to accurately position the top plate with respect to the substrate held (supported) by the substrate holding / rotating means (supporting portion). As a result, the distance between the peripheral portion of the substrate and the top plate cannot be made constant along the circumferential direction of the substrate, and a large gap is generated between the substrate and the top plate in a part of the peripheral portion. is there. When a large gap is generated between the substrate and the top plate, the processing liquid supplied to the lower surface and the peripheral portion of the substrate may wrap around or scatter on the upper surface of the substrate.

  The present invention has been made in view of the above points, and is a liquid process for supplying a gas from the upper surface side of the substrate and supplying a processing liquid from the lower surface side of the substrate, and processing the lower surface of the substrate with the supplied processing liquid. In the apparatus, a liquid processing apparatus and a liquid processing method capable of accurately positioning a top plate are provided.

  In order to solve the above-described problems, the present invention is characterized by the following measures.

According to one embodiment of the present invention, in the liquid processing apparatus for supplying the gas from the upper surface side of the substrate and supplying the processing liquid from the lower surface side of the substrate, and processing the lower surface of the substrate with the supplied processing liquid, A processing container having an opening on the upper surface; a support provided in the processing container for supporting a peripheral edge of the substrate; a top plate provided so as to be movable up and down and closing the opening in a lowered state; and the top plate when part descends, it has a positioning mechanism for positioning the relative position of the top plate portion relative to the processing chamber to a predetermined position,
The positioning mechanism includes a first positioning member fixed to the top plate portion, and a second positioning member fixed to the processing container corresponding to the first positioning member, and the top plate When the portion is lowered, the relative position is determined by either one of the first positioning member and the second positioning member being locked to the other, and the first positioning member Alternatively, a liquid processing apparatus in which the second positioning member is fixed so that the fixing position can be adjusted is provided.
According to another embodiment of the present invention, a liquid processing apparatus supplies gas from the upper surface side of the substrate and supplies a processing liquid from the lower surface side of the substrate, and processes the lower surface of the substrate with the supplied processing liquid. In, a processing container having an opening on the upper surface, a support part provided in the processing container and supporting the peripheral edge of the substrate, a top plate part provided so as to be able to be raised and lowered and closing the opening in a lowered state, A positioning mechanism for positioning a relative position of the top plate portion with respect to the processing container at a predetermined position when the top plate portion is lowered, and an elevating mechanism for raising and lowering the top plate portion; There is also provided a liquid processing apparatus having a pressing member provided on the lifting mechanism side so as to be elastically deformable along the vertical direction and pressing the top plate portion closing the opening against the processing container.

Further, according to one embodiment of the present invention, a processing container having an opening on the upper surface, a support part provided in the processing container and supporting a peripheral part of the substrate, and provided so as to be movable up and down, in a lowered state. A top plate that closes the opening, and a gas is supplied from an upper surface side of the substrate supported by the support portion and a processing liquid is supplied from a lower surface side of the substrate, and the substrate is supplied by the supplied processing liquid. a liquid processing method in the liquid processing apparatus for processing a bottom surface of, when the top plate is lowered, have a positioning step of positioning the relative position of the top plate portion relative to the processing chamber to a predetermined position, The positioning step includes a first positioning member fixed to the top plate portion when the top plate portion descends, and a second position member fixed to the processing container corresponding to the first positioning member. Either one of the positioning members is the other By being engaged in, which for positioning the relative position, wherein the first positioning member and the second positioning member, the liquid processing method fixed position is adjustably secured is provided .
Further, according to one embodiment of the present invention, a processing container having an opening on the upper surface, a support part provided in the processing container and supporting a peripheral part of the substrate, and provided so as to be movable up and down, in a lowered state. A top plate that closes the opening, and a gas is supplied from an upper surface side of the substrate supported by the support portion and a processing liquid is supplied from a lower surface side of the substrate, and the substrate is supplied by the supplied processing liquid. A liquid processing method in a liquid processing apparatus for processing the lower surface of
A positioning step of positioning a relative position of the top plate portion with respect to the processing container at a predetermined position when the top plate portion is lowered;
The liquid processing apparatus has an elevating mechanism for elevating and lowering the top plate part,
In the positioning step, the top plate portion that closes the opening is pressed against the processing container by a pressing member that is elastically deformable along the vertical direction closer to the lifting mechanism than the top plate portion. A liquid processing method is provided.

  According to the present invention, in the liquid processing apparatus that supplies the gas from the upper surface side of the substrate and the processing liquid from the lower surface side of the substrate, and processes the lower surface of the substrate with the supplied processing liquid, the position of the top plate is accurately determined. It can be positioned well.

It is a top view which shows schematic structure of the liquid processing system which concerns on embodiment. It is sectional drawing of the front side along the AA line of FIG. It is sectional drawing of the side surface along the BB line of FIG. It is a schematic sectional drawing which shows the structure of the liquid processing unit which concerns on embodiment. It is the schematic sectional drawing which expanded the rotation cup vicinity of the liquid processing unit which concerns on embodiment. It is a perspective view of the rotation cup of the liquid processing unit which concerns on embodiment. It is a schematic top view which shows the structure of the liquid processing unit which concerns on embodiment. It is the schematic sectional drawing which expanded the floating member vicinity of the liquid processing unit which concerns on embodiment. It is a schematic sectional drawing which shows the structure of the liquid processing unit which concerns on the 1st modification of embodiment. It is a schematic sectional drawing which shows the structure of the liquid processing unit which concerns on the 2nd modification of embodiment.

Next, a mode for carrying out the present invention will be described with reference to the drawings. Here, the case where the present invention is applied to a liquid processing apparatus for performing back surface cleaning of a semiconductor wafer (hereinafter simply referred to as “wafer”) will be described.
(Embodiment)
First, a schematic configuration of a liquid processing system including a liquid processing unit according to an embodiment will be described with reference to FIGS. 1 to 3.

  The liquid processing unit corresponds to the liquid processing apparatus in the present invention.

  FIG. 1 is a plan view showing a schematic configuration of a liquid processing system 10 according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the front side along the line AA in FIG. 1, and FIG. It is sectional drawing of the side surface side along B line.

  In this liquid processing system 10, a wafer carrier C that houses a plurality of wafers W is placed, and a loading / unloading station (substrate loading / unloading unit) 1 for loading / unloading the wafers W and a cleaning process for the wafers W are performed. The processing station (liquid processing unit) 2 is provided. A loading / unloading station (substrate loading / unloading section) 1 and a processing station (liquid processing section) 2 are provided adjacent to each other.

  The carry-in / out station 1 includes a carrier placement unit 11, a transport unit 12, a delivery unit 13, and a housing 14. The carrier mounting unit 11 mounts a wafer carrier C that stores a plurality of wafers W in a horizontal state. The transfer unit 12 transfers the wafer W. The delivery unit 13 delivers the wafer W. The housing 14 accommodates the transport unit 12 and the transfer unit 13.

  The carrier mounting unit 11 can mount four wafer carriers C. The mounted wafer carrier C is in close contact with the vertical wall portion 12a of the housing 14, and the wafer W therein can be carried into the transfer portion 12 without being exposed to the atmosphere.

  The housing 14 includes a partition member 14 a that partitions the transport unit 12 and the transfer unit 13 vertically. The transport unit 12 includes a transport mechanism 15 and a fan filter unit (FFU) 16 that supplies clean air downflow provided above the transport mechanism 15. The transfer mechanism 15 includes a wafer holding arm 15a that holds the wafer W and a mechanism that moves the wafer holding arm 15a back and forth. The transport mechanism 15 is moved along a horizontal guide 17 (see FIG. 1) extending in the X direction which is the arrangement direction of the wafer carriers C, and a vertical guide 18 (see FIG. 2) provided in the vertical direction. It has a mechanism to move along and a mechanism to rotate in a horizontal plane. The wafer W is transferred between the wafer carrier C and the delivery unit 13 by the transfer mechanism 15.

  The delivery unit 13 includes a delivery stage 19 and a delivery shelf 20 including a plurality of placement units on which wafers W provided thereon can be placed. The delivery unit 13 delivers the wafer W to and from the processing station 2 via the delivery shelf 20.

  As shown in FIG. 3, the processing station 2 has a casing 21 having a rectangular parallelepiped shape. The processing station 2 includes a transfer chamber 21a that forms a transfer path extending in the Y direction perpendicular to the X direction, which is the arrangement direction of the wafer carriers C, in the upper portion of the casing 21, and both sides of the transfer chamber 21a. Have two unit chambers 21b and 21c. In the unit chambers 21b and 21c, a total of twelve liquid processing units 22 are arranged horizontally along the transfer chamber 21a.

  Below the unit chambers 21 b and 21 c in the housing 21, drive areas 21 d and 21 e that accommodate the drive systems of the respective liquid processing units 22 are provided. In addition, under the drive areas 21d and 21e, pipe boxes 21f and 21g, respectively, containing pipes are provided. In addition, under the piping boxes 21f and 21g, chemical solution supply units 21h and 21i are provided as processing solution storage units, respectively. On the other hand, an exhaust space 21j for exhaust is provided below the transfer chamber 21a.

  A fan filter unit (FFU) 23 is provided above the transfer chamber 21a to supply a downflow of clean air to the transfer chamber 21a. A transfer mechanism 24 is provided inside the transfer chamber 21a. The transport mechanism 24 includes a wafer holding arm 24a that holds the wafer W and a mechanism that moves the wafer holding arm 24a back and forth. Further, the transfer mechanism 24 moves along a horizontal guide 25 (see FIG. 1) provided in the transfer chamber 21a in the Y direction, and moves along a vertical guide 26 (see FIG. 3) provided in the vertical direction. And a mechanism for rotating in a horizontal plane. The transport mechanism 24 carries the wafer W in and out of each liquid processing unit 22.

  The delivery stage 19 is provided at a position higher than the carrier placement unit 11, and the liquid processing unit 22 is provided at a position higher than the delivery stage 19.

  A treatment liquid piping group 30, a drainage piping group 31, and an exhaust piping group 32 are horizontally arranged in the piping boxes 21f and 21g. The treatment liquid pipe group 30 is supplied with, for example, an SC1 pipe 30a for supplying ammonia overwater SC1 formed by mixing ammonia water and hydrogen peroxide, a DHF pipe 30b for supplying dilute hydrofluoric acid (DHF), and supplying pure water. It has a pure water pipe 30c. Further, the drainage pipe group 31 includes, for example, a drainage pipe 31a for discharging the drainage and a recovery pipe 31b for recovering the drainage. Further, the exhaust pipe group 32 includes, for example, an acid exhaust pipe 32a for exhausting acid and an alkali exhaust pipe 32b for exhausting alkali.

  The chemical solution supply unit 21h includes a first chemical solution tank 41 that is provided on the carry-in / out station 1 side and stores, for example, ammonia-hydrogenated water SC1 and a first recovery tank 42 adjacent thereto.

  As shown in FIG. 2, the first chemical tank 41 is connected with a delivery pipe 43 for delivering the chemical liquid and a return pipe 44 for returning the chemical liquid. The delivery pipe 43 is connected to one end side of the SC1 pipe 30a of the treatment liquid pipe group 30 disposed horizontally in the pipe box 21f. The return pipe 44 is connected to the other end side of the SC1 pipe 30a.

  A chemical solution supply pipe 51 is connected to the upper part of the first chemical solution tank 41, and a mixer 52 is connected to the chemical solution supply pipe 51. A pure water pipe 53, an ammonia pipe 54, and a hydrogen peroxide pipe 55 are connected to the mixer 52. In the mixer 52, pure water, ammonia, and hydrogen peroxide are mixed, and the ammonia overwater SC1 is the first. The chemical liquid tank 41 is supplied. The pure water pipe 53 is provided with a liquid flow controller (LFC) 56a and a valve 56b. The ammonia pipe 54 is provided with a liquid flow controller (LFC) 57a and a valve 57b. The hydrogen peroxide pipe 55 is provided with a liquid flow controller (LFC) 58a and a valve 58b.

  The chemical solution supply unit 21h is provided with a first recovery tank 42 that is connected to the recovery pipe 31b of the drainage pipe group 31 and collects the processed chemical liquid. The first recovery tank 42 and the first chemical liquid tank 41 are connected by a connection pipe 46, and after the recovered chemical liquid is cleaned, it can be returned to the first chemical liquid tank 41.

  On the other hand, the chemical solution supply unit 21i is provided on the carry-in / out station 1 side, for example, a second chemical solution tank 47 (see FIG. 3) for storing dilute hydrofluoric acid (DHF) and a second recovery tank (not shown) adjacent thereto. ). The DHF in the second chemical liquid tank 47 can be circulated and supplied by the DHF piping 30b in the piping boxes 21f and 21g and the like, similarly to SC1 from the first chemical liquid tank 41. Further, the recovery of DHF to the second recovery tank is performed in the same manner as the recovery of SC1 to the first recovery tank 42 through the pipe 48 (see FIG. 2).

  In addition to these chemical cleaning, rinsing and drying with pure water are performed. At this time, pure water is supplied from a pure water supply source (not shown) through the pure water pipe 30c.

  Of the drainage pipe group 31 provided in the pipe boxes 21f and 21g, a drain pipe 49 is connected to the drainage pipe 31a. The drainage from the drainage pipe 31a passes through the drain pipe 49 and is discarded to the factory pipe under the floor as a drain.

  Next, with reference to FIG. 4 to FIG. 6, a liquid processing apparatus that is the liquid processing unit 22 mounted in the liquid processing system 10 according to the present embodiment will be described. FIG. 4 is a schematic cross-sectional view showing the configuration of the liquid processing unit 22 according to the present embodiment. FIG. 5 is an enlarged schematic cross-sectional view of the vicinity of the rotating cup 71 of the liquid processing unit 22 according to the present embodiment. FIG. 6 is a perspective view of the rotating cup 71 of the liquid processing unit 22 according to the present embodiment.

  As shown in FIG. 4, the liquid processing unit 22 includes a rotating plate 60, an enclosure member 70, a rotating cup 71, a rotation driving unit 80, a substrate lifting / lowering member 90, a processing liquid supply mechanism 93, and an exhaust / drainage unit (cup) 100. , A top plate 110, an elevating mechanism 120, an inert gas supply mechanism 123, a positioning mechanism 130, and a floating member 150.

  The exhaust / drainage part (cup) 100 corresponds to the processing container in the present invention. The top plate 110 corresponds to the top plate portion in the present invention.

  As shown in FIGS. 4 and 5, the rotating plate 60 has a base plate 61 and a rotating shaft 62. The base plate 61 is provided horizontally and has a circular hole 61a in the center. The rotating shaft 62 is provided so as to extend downward from the base plate 61, and has a cylindrical shape with a hole 62a provided at the center.

  As shown in FIGS. 5 and 6, the surrounding member 70 is provided outside the periphery of the wafer W so as to surround the periphery WE of the wafer W over the entire periphery. As shown in FIG. 5, the surrounding member 70 guides the processing liquid that has processed the wafer W to the drain cup 101. Further, the surrounding member 70 has a support pin 72. The support pin 72 is provided so as to protrude inward from the lower end of the surrounding member 70. The support pins 72 support the lower surface of the peripheral edge WE of the wafer W. As shown in FIG. 6, a plurality of support pins 72 are provided at substantially equal intervals along the circumferential direction of the wafer W.

  The enclosure member 70 and the support pin 72 correspond to a support portion in the present invention.

  The rotating cup 71 is for preventing the processing liquid supplied to the lower surface side of the wafer W and splashing from the rotating wafer W to the outer peripheral side from being bounced back to the wafer W again. Further, the processing liquid that scatters from the rotating wafer W to the outer peripheral side does not enter the upper surface side of the wafer W.

  As shown in FIG. 5, the base plate 61, the surrounding member 70, and the rotary cup 71 are fastened by fitting a fastening member 74 into a hole 73 formed so as to penetrate each of them. Thereby, the base plate 61, the surrounding member 70, and the rotation cup 71 are rotatably provided as a unit.

  The rotation drive unit 80 includes a pulley 81, a drive belt 82, and a motor 83. The pulley 81 is disposed outside the peripheral edge on the lower side of the rotation shaft 62. The drive belt 82 is wound around the pulley 81. The motor 83 is connected to the drive belt 82, and rotates the rotary shaft 62 via the pulley 81 by transmitting a rotational driving force to the drive belt 82. That is, the rotation drive unit 80 rotates the base plate 61, the enclosure member 70, and the rotation cup 71 by rotating the rotation shaft 62. A bearing 63 is disposed on the outer periphery of the rotating shaft 62.

  The substrate elevating member 90 is provided in a hole 61 a of the base plate 61 and a hole 62 a of the rotating shaft 62 so as to be able to move up and down, and includes a lift pin plate 91 and a lift shaft 92. The lift pin plate 91 has a plurality of, for example, three lift pins 91a on the periphery. The lift shaft 92 extends downward from the lift pin plate 91. A processing liquid supply pipe 94 is provided at the center of the lift pin plate 91 and the lift shaft 92. In addition, a cylinder mechanism (not shown) is connected to the lower end of the lift shaft 92, and by loading and unloading the wafer W by moving the substrate lifting member 90 up and down by this cylinder mechanism.

  The processing liquid supply mechanism 93 has a processing liquid supply pipe 94. As described above, the processing liquid supply pipe 94 is provided in the lift pin plate 91 and the lift shaft 92 (in the hollow space) so as to extend in the vertical direction. The processing liquid supply pipe 94 guides the processing liquid supplied from each pipe of the processing liquid pipe group 30 to the lower surface side of the wafer W. The processing liquid supply pipe 94 communicates with a processing liquid supply port 94 a formed on the upper surface of the lift pin plate 91.

  The exhaust / drainage unit (cup) 100 includes a drainage cup 101, a drainage pipe 102, an exhaust cup 103, and an exhaust pipe 104. The exhaust / drainage part (cup) 100 has an opening 105 on the upper surface. The exhaust / drainage part (cup) 100 is mainly for recovering the gas and liquid discharged from the space surrounded by the rotary plate 60 and the rotary cup 71.

  The drainage cup 101 receives the processing liquid guided by the rotating cup 71. The drainage pipe 102 is connected to the outermost part of the bottom of the drainage cup 101, and discharges the processing liquid received by the drainage cup 101 through any pipe of the drainage pipe group 31. The exhaust cup 103 is provided outside or below the drain cup 101 so as to communicate with the drain cup 101. FIG. 4 shows an example in which the exhaust cup 103 is provided so as to communicate with the drain cup 101 at the inner periphery and below the drain cup 101. The exhaust pipe 104 is connected to the outermost part of the bottom of the exhaust cup 103, and exhausts a gas such as nitrogen gas in the exhaust cup 103 through any one of the exhaust pipe group 32.

  The top plate 110 can be moved up and down, and is provided so as to block the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 in the lowered state. The top plate 110 is provided so as to cover the wafer W supported by the support pins 72 from above when the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 is closed.

  The top plate 110 has a gap forming member 113 provided to protrude downward from the lower surface 112 of the top plate 110 in a region 111 facing the peripheral edge WE of the wafer W supported by the support pins 72 of the enclosure member 70. . The gap forming member 113 forms a gap D1 with the peripheral edge WE of the wafer W.

  When the gap forming member 113 is formed on the top plate 110, the gap D1 between the peripheral edge WE of the wafer W supported by the support pins 72 of the surrounding member 70 and the top plate 110 is equal to the center WC of the wafer W. It becomes smaller than the distance D0 with the top plate 110.

  The elevating mechanism 120 includes an arm 121 and an elevating drive unit 122. The raising / lowering drive part 122 is provided outside the exhaust / drainage part (cup) 100 and can move up and down. The arm 121 is provided so as to connect the top plate 110 and the elevation drive unit 122. That is, the elevating mechanism 120 moves the top plate 110 up and down by the elevating drive unit 122 via the arm 121.

  The inert gas supply mechanism 123 includes an inert gas supply pipe 124 and an inert gas supply source 125. The inert gas supply mechanism 123 is for supplying an inert gas such as nitrogen gas or argon gas to the upper surface side of the wafer W. The inert gas supply pipe 124 is provided so as to extend inside the top plate 110 and the arm 121. One end of the inert gas supply pipe 124 is connected to an inert gas supply source 125 that supplies an inert gas. The inert gas supply pipe 124 forms an inert gas supply port 124 a at the center of the lower surface 112 of the top plate 110.

  As shown in FIG. 4, the arm 121 may be connected at the approximate center of the top surface of the top plate 110. As a result, the inert gas supply port 124a is formed at the center of the lower surface 112 of the top plate 110, so that the inert gas can be supplied downward from the center of the top plate 110 and supplied to the wafer W. The flow rate of the inert gas can be made uniform along the circumferential direction.

  In this embodiment, as shown in FIGS. 4 and 5, a positioning mechanism that positions the relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 at a predetermined position when the top plate 110 is lowered. 130. Hereinafter, the positioning mechanism 130 will be described with reference to FIGS. 5 and 7. FIG. 7 is a schematic top view showing the configuration of the liquid processing unit 22 according to the present embodiment.

  As shown in FIG. 5, the positioning mechanism 130 includes a first positioning member 131 and a second positioning member 132.

  The first positioning member 131 is fixed to the top plate 110. The second positioning member 132 is provided corresponding to the first positioning member 131 and is fixed to the exhaust / drainage part (cup) 100. The first positioning member 131 and the second positioning member 132 are positioned when one of the first positioning member 131 and the second positioning member 132 is locked to the other when the top plate 110 is lowered. Is done.

  The first positioning member 131 is provided, for example, at a position outside the periphery of the top plate 110 and at a position overlapping the upper surface of the exhaust / drainage part (cup) 100 in a plan view, and has a convex shape downward. The convex member 133 can be included. And the 2nd positioning member 132 can be provided in the position corresponding to the convex member 133 in planar view, for example, and can contain the concave member 134 which has a concave shape toward upper direction. At this time, the convex member 133 is positioned by being fitted into the concave member 134. Alternatively, the first positioning member 131 may include a concave member, and the second positioning member 132 may include a convex member.

  When the first positioning member 131 includes the convex member 133 and the second positioning member 132 includes the concave member 134, the upper surface of the concave member 134 is directly above the convex member 133, as shown in FIG. You may have the large diameter member 135 which has a shape larger than the shape of the hole 136 formed in this. Depending on the size relationship between the length LT from the lower surface of the large-diameter member 135 to the tip of the convex member 133 and the depth LB of the hole 136 of the concave member 134, the reference for positioning in the vertical direction is slightly different. When LT> LB, the tip of the convex member 133 is brought into contact with the bottom of the hole 136 of the concave member 134, thereby positioning in the vertical direction. Further, when LT <LB, the lower surface of the large-diameter member 135 is brought into contact with the upper surface of the concave member 134, thereby positioning in the vertical direction.

  On the other hand, when the convex member 133 is provided so as to be fitted into the hole 136 of the concave member 134 without a substantial gap, the convex member 133 is fitted into the hole 136 of the concave member 134 when the top plate 110 is lowered. As a result, positioning in a plan view is performed. Further, as shown in FIG. 5, when the top plate 110 is lowered, the convex member 133 is easily fitted into the hole 136 of the concave member 134, as shown in FIG. A taper may be provided on the convex member 133 side of 136.

  As shown in FIG. 7, the positioning mechanism 130 has a plurality of pairs of member pairs including a first positioning member 131 and a second positioning member 132 along the circumferential direction at the peripheral edge of the top plate 110. Yes. In the example shown in FIG. 7, three pairs of members are provided at a position at which the entire periphery is divided into approximately three equal parts at the peripheral edge of the top plate 110. By providing a plurality of member pairs, the top plate 110 can be positioned more accurately in the horizontal plane.

  Further, the first positioning member 131 and the second positioning member 132 are arranged so that when the top plate 110 is lowered, either the first positioning member 131 or the second positioning member 132 has an outer periphery of the top plate 110. The outer side may be provided so as to be locked to the other side. Even if the alignment accuracy is equal, the alignment accuracy of the top plate 110 is further improved by the pair of the plurality of positioning members 131 and 132 being locked outward from the outer periphery of the top plate 110.

  The first positioning member 131 fixed to the top plate 110 may be fixed so that the fixing position can be adjusted. For example, the first positioning member 131 is divided into a root-side member 137 fixed to the top plate 110 and a tip-side member 138 fixed to the root-side member 137, and the root-side member of the tip-side member 138 is divided. The relative position with respect to 137 is provided so as to be adjustable by a screw or the like. As a result, the fixing position at which the first positioning member 131 is fixed to the top plate 110 can be adjusted, and the top plate 110 is vertically and horizontally aligned with respect to the exhaust / drainage part (cup) 100. The position can be aligned with higher accuracy. In FIG. 5, the front end side member 138 having a thread groove formed on the side peripheral surface is provided in the root side member 137, and the screw hole 139 having a thread groove formed on the inner peripheral surface and the nut 140 are used in the vertical direction. The example in which the relative position along is provided so that adjustment is possible is shown.

  Alternatively, the second positioning member 132 fixed to the exhaust / drainage part (cup) 100 is fixed to the root side member fixed to the exhaust / drainage part (cup) 100 and the root side member. It is also possible to divide the front end side member into the front end side member so that the relative position of the front end side member to the base side member can be adjusted by a screw or the like. Thereby, the fixing position fixed to the exhaust / drainage part (cup) 100 of the second positioning member 132 can be adjusted.

  Further, in the present embodiment, as shown in FIGS. 4 and 7, the top plate 110 and the arm 121 are connected via a floating member 150. Hereinafter, the floating member 150 will be described with reference to FIG. FIG. 8 is an enlarged schematic cross-sectional view of the vicinity of the floating member 150 of the liquid processing unit 22 according to the present embodiment.

  The floating member 150 includes a first locking member 151, a second locking member 152, and an elastic member 153. The floating member 150 includes a top plate 110 that is positioned by the positioning mechanism 130 when closing the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 in a state where the top plate 110 is lowered, This is to absorb a positional shift between the lifting mechanism 120 and the arm 121.

  The floating member 150 corresponds to the pressing member in the present invention.

  The first locking member 151 is fixed to the top plate 110. Further, the second locking member 152 is fixed to the arm 121. The first locking member 151 and the second locking member 152 are provided so as to be locked with some play, for example. That is, when the top plate 110 and the arm 121 are locked by the first locking member 151 and the second locking member 152, the relative position of the top plate 110 with respect to the arm 121 is in the vertical direction and the horizontal plane. A small distance can be displaced in the inner direction.

  The second locking member 152 fixed to the arm 121 may be fixed so that the fixing position can be adjusted. For example, in FIG. 8, an example in which the second locking member 152 made of a bolt is provided so that the relative position along the vertical direction can be adjusted in advance by a screw hole 154 and a nut 155 provided on the lower surface of the arm 121. Show. Alternatively, the first locking member 151 fixed to the top plate 110 may be provided so that the fixing position can be adjusted. As a result, the relative position of the top plate 110 with respect to the arm 121 can be adjusted in advance. Therefore, in the actual liquid processing process, the relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 can be more accurately determined. Can be aligned.

  When the top plate 110 is lowered, the elastic member 153 closes the opening 105 provided on the upper surface of the exhaust / drainage unit (cup) 100 so that the top plate 110 is pressed downward from the arm 121. It is provided so as to be elastically deformable along the vertical direction. That is, the floating member 150 presses the top plate 110 blocking the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 against the exhaust / drainage part (cup) 100 from above by the elastic member 153. Is. Thereby, when the top plate 110 descends, the position along the vertical direction and the horizontal direction of the top plate 110 accurately aligned with the relative position with respect to the exhaust / drainage part (cup) 100 by the positioning mechanism 130, The floating member 150 provided so as to be elastically deformable along the vertical direction can be held with high accuracy.

Further, the inert gas supply pipe 124 includes a first supply pipe 126 and a second supply pipe 127. One end of the first supply pipe 126 opens to the lower surface 112 of the top plate 110 to form an inert gas supply port 124 a, and the second supply pipe 127 inside the arm 121 on the other end side.
It is provided to connect with. Further, since the inert gas supply pipe 124 is provided freely with respect to the arm 121, the inert gas supply pipe 124 follows the top plate 110 when the top plate 110 is lowered and aligned by the positioning mechanism 130. It can be done.

  Further, as shown in FIG. 8, the first supply pipe 126 may have a large diameter portion 128, and the large diameter portion 128 may be locked so as to contact the first locking member 151. The first supply pipe 126 may be fitted in the top plate 110 in an airtight manner by a sealing member 129 such as an O-ring.

  Note that the floating member 150 only needs to be provided closer to the elevating mechanism 120 than the top plate 110, and may be provided, for example, between the arm 121 and the elevating drive unit 122.

  Moreover, the liquid processing system 10 has the control part 200, as shown in FIG. The control unit 200 includes a process controller 201 composed of a microprocessor (computer), and each component of the liquid processing system 10 is connected to the process controller 201 to be controlled. In addition, the process controller 201 visualizes the operation status of each component of the liquid processing system 10 and a keyboard on which a process manager inputs commands to manage each component of the liquid processing system 10. A user interface 202 including a display for displaying is connected. Further, the process controller 201 has a control program for realizing various processes executed by the liquid processing system 10 under the control of the process controller 201 and predetermined components in the liquid processing system 10 according to processing conditions. A storage unit 203 in which a control program for executing processing, that is, a recipe is stored, is connected. The recipe is stored in a storage medium (recording medium) in the storage unit 203. The storage medium (recording medium) may be a hard disk or a semiconductor memory. Moreover, you may make it transmit a recipe suitably from another apparatus via a dedicated line, for example.

  Then, if necessary, an arbitrary recipe is called from the storage unit 203 by an instruction from the user interface 202 and is executed by the process controller 201, so that a desired process in the liquid processing system 10 can be performed under the control of the process controller 201. Is performed.

  Next, a liquid processing method using the above-described liquid processing unit 22 and its operation will be described.

  In the present embodiment, the first positioning member 131 or the second positioning member 132 of the positioning mechanism 130 is divided into a root-side member 137 and a tip-side member 138, and the tip-side member 138 with respect to the root-side member 137 is divided. The relative position can be adjusted by a screw hole 139 and a nut 140 formed in the root side member 137. In the present embodiment, the floating member 150 determines the relative position of the second locking member 152 with respect to the arm 121 or the relative position of the first locking member 151 with respect to the top plate 110. ) Are formed so as to be adjustable by screw holes and nuts formed in the above. Therefore, in a state where the top plate 110 is lowered by the elevating mechanism 120 in advance, the nuts of the positioning mechanism 130 and the floating member 150 are loosened, and the positions of the first positioning member 131 and the second positioning member 132 are aligned. In this state, the relative positions of the positioning mechanism 130 and the floating member 150 are adjusted in advance by tightening the nuts and the like.

  In this way, after the relative positions of the positioning mechanism 130 and the floating member 150 are adjusted in advance, a liquid processing process is performed on the wafer W.

  The liquid treatment process corresponds to the liquid treatment method in the present invention.

  First, one wafer W is taken out from the wafer carrier C mounted on the carrier mounting unit 11 of the loading / unloading station 1 by the wafer holding arm 15a of the transfer mechanism 15, and the mounting unit of the transfer shelf 20 on the transfer stage 19 is loaded. Placed on. This operation is continuously performed. The wafers W placed on the placement unit of the delivery shelf 20 are sequentially carried by the wafer holding arm 24a of the carrying mechanism 24 of the processing station 2 and are carried into one of the liquid processing units 22.

  When the wafer W is carried into the liquid processing unit 22, the top plate 110 is raised by the elevating mechanism 120. Then, the wafer W loaded into the liquid processing unit 22 is placed on the lift pins 91a of the lift pin plate 91 positioned at the delivery position (upper position) by a cylinder mechanism (not shown).

  Next, the lift pin plate 91 is moved downward by a cylinder mechanism (not shown) and positioned at the wafer processing position. While the lift pin plate 91 is moved downward, the lower surface of the wafer W is supported by the support pins 72 provided on the enclosure member 70.

  Thereafter, the top plate 110 is lowered by the elevating mechanism 120 so as to block the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100. At this time, a positioning process is performed.

  In the positioning step, when the top plate 110 is lowered, the relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 is positioned at a predetermined position. The relative position between the first positioning member 131 and the second positioning member 132 is adjusted in advance. Accordingly, when the top plate 110 is lowered, the first positioning member 131 is locked to the second positioning member 132, so that the relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 is accurately determined. It can be positioned well.

  In addition, when the relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 is shifted due to a change over time, such as after processing many wafers W, or the relative position of the top plate 110 with respect to the lifting mechanism 120 is changed. In the case of deviation, the floating member 150 can absorb the deviation of the position. Therefore, when the top plate 110 is lowered, the relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 can be accurately positioned.

  Next, the rotation shaft 62 is driven to rotate by the rotation drive unit 80, whereby the base plate 61, the enclosure member 70, and the rotation cup 71 are rotated. Specifically, the rotating shaft 62 is rotationally driven by applying a driving force from the motor 83 to the pulley 81 via the driving belt 82. As a result, the wafer W on the support pins 72 provided on the enclosure member 70 rotates.

  At this time, the processing liquid is supplied to the lower surface of the wafer W from one of the processing liquid piping group 30 via the processing liquid supply pipe 94 of the processing liquid supply mechanism 93. Then, as shown in FIG. 4, the processing liquid supplied to the lower surface of the wafer W is moved outward from the periphery by a centrifugal force generated by the rotation of the wafer W. As the treatment liquid at this time, as described above, for example, either or both of SC1 and DHF are used.

  On the other hand, as shown in FIG. 4, an inert gas such as nitrogen gas is supplied to the upper surface of the wafer W from an inert gas supply port 124 a provided at the center of the lower surface 112 of the top plate 110. The supplied inert gas passes through the upper surface of the wafer W, then passes through the gap D1 between the wafer W and the gap forming member 113 of the top plate 110, and from the upper side of the surrounding member 70 to the outer peripheral edge and further downward. And flows from the exhaust cup 103 of the exhaust / drainage part (cup) 100 to the exhaust pipe 104. Due to the air flow of the inert gas, the processing liquid reaching the peripheral edge WE of the wafer W wraps around the upper surface of the wafer W from between the wafer W and the enclosure member 70 or between the enclosure member 70 and the rotating cup 71. This can be prevented.

  In the present embodiment, the top plate 110 is accurately positioned in the vertical direction by the positioning mechanism 130. Therefore, the relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 so that the gap D1 between the gap forming member 113 and the peripheral edge WE of the wafer W is constant along the circumferential direction of the wafer W. Can be positioned at a predetermined position. By making the gap D1 constant along the circumferential direction of the wafer W, the flow of the inert gas flowing on the upper surface side of the wafer W can be made uniform along the circumferential direction of the wafer W. Therefore, it is more reliable that the processing liquid reaching the lower surface of the peripheral edge WE of the wafer W wraps around the upper surface side of the wafer W from between the wafer W and the enclosure member 70 or between the enclosure member 70 and the rotary cup 71. Can be prevented.

  In the present embodiment, the top plate 110 is also accurately positioned in the horizontal direction by the positioning mechanism 130. Therefore, as shown in FIG. 5, the width L in the radial direction of the wafer W in the peripheral portion WE of the wafer W and on the outer peripheral side of the region facing the gap forming member 113 is in the circumferential direction of the wafer W. The relative position of the top plate 110 with respect to the exhaust / drainage part (cup) 100 can be positioned at a predetermined position so as to be constant along the line. That is, the width L can be made uniform over the entire circumference of the wafer W. By making the width L uniform over the entire circumference of the wafer W, the flow of the inert gas flowing on the upper surface side of the wafer W can be made more uniform along the circumferential direction of the wafer W. Therefore, the processing liquid that has reached the lower surface of the peripheral edge WE of the wafer W can be more reliably prevented from entering the upper surface side of the wafer W from between the wafer W, the support pins 72 and the rotating cup 71. Thereby, the volume per unit length of the space formed by the region where the wafer W and the gap forming member 113 are opposed can be made uniform over the entire circumference of the wafer W. Accordingly, the flow of the inert gas is reduced at some locations along the circumferential direction, and the processing liquid can be prevented from flowing from the location to the upper surface side of the wafer W.

  When the liquid processing process using the processing liquid as described above is completed, the supply of the processing liquid from one of the processing liquid piping group 30 to the wafer W via the processing liquid supply pipe 94 of the processing liquid supply mechanism 93 is stopped. Is done. Then, pure water is supplied to the wafer W from the pure water pipe 30 c of the processing liquid pipe group 30 through the processing liquid supply pipe 94 of the processing liquid supply mechanism 93 to perform pure water rinsing.

  Further, during the above-described liquid treatment process, the used treatment liquid reaches the drainage pipe group 31 from the drainage cup 101, and a part of the acid and alkali is recovered and the other is discarded. Further, the gas component generated in the process reaches the exhaust pipe group 32 from the exhaust cup 103 and is exhausted.

  Next, the rotating shaft 62 is rotated at a high speed by the rotation driving unit 80. As a result, the wafer W on the support pins 72 is rotated at a high speed, and the wafer W is dried. Thereafter, the motor 83 of the rotation driving unit 80 is stopped, and the rotation of the wafer W on the support pins 72 is also stopped.

  Next, the elevating mechanism 120 positions the top plate 110 at a position above the wafer W delivery position. Thereafter, the lift pin plate 91 is moved to the upper position by a cylinder mechanism (not shown), and the wafer W is raised to the delivery position (upper position).

  Next, the wafer W is unloaded from the lift pin plate 91 by the wafer holding arm 24 a of the transfer mechanism 24. In this way, processing of one wafer W is completed.

  The wafer W unloaded in this manner is unloaded from the liquid processing unit 22 by the wafer holding arm 24a of the transfer mechanism 24, placed on the transfer shelf 20 of the transfer stage 19, and held by the transfer mechanism 15 from the transfer shelf 20. It is returned to the wafer carrier C by the arm 15a.

In the present embodiment, the example in which the inert gas supply port 124a is provided at the center of the top plate 110 has been described. However, the present invention is not limited to this. For example, an inert gas supply port 124 a may be provided on the periphery of the top plate 110.
(First Modification of Embodiment)
Next, a liquid processing apparatus and a liquid processing method according to a first modification of the embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view showing the configuration of the liquid processing unit 22a according to this modification.

  The liquid processing unit 22a according to this modification is different from the liquid processing unit 22 according to the embodiment in that the top plate 110a does not have a gap forming member.

  Also in this modification, the liquid processing system 10 according to the embodiment described with reference to FIGS. 1 to 3 can be used. Further, as shown in FIG. 9, the liquid processing unit 22a mounted in the liquid processing system 10 according to this modification includes a rotating plate 60, an enclosure member 70, a rotating cup 71, a rotation driving unit 80, a substrate lifting member 90, A processing liquid supply mechanism 93, an exhaust / drainage part (cup) 100, a top plate 110 a, an elevating mechanism 120, an inert gas supply mechanism 123, a positioning mechanism 130, and a floating member 150 are included. About each part other than the top plate 110a, it is the same as that of each part of the liquid processing unit 22 demonstrated using FIG. 4 in embodiment. In FIG. 9, the same parts as those described with reference to FIG.

  On the other hand, the top plate 110a in this modification does not have a gap forming member.

  The top plate 110a can be moved up and down, and is provided so as to close the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 in the lowered state. .

  On the other hand, in the present modification, as shown in FIG. 9, the top plate 110 a is formed from the lower surface 112 of the top plate 110 a in a region facing the peripheral edge WE of the wafer W supported by the support pins 72 of the enclosure member 70. A gap forming member protruding downward is not provided. Therefore, the distance between the top plate 110a and the wafer W supported by the support pins 72 of the enclosing member 70 is substantially equal over the entire surface of the wafer W, and becomes D0. That is, the distance between the peripheral edge portion WE of the wafer W supported by the support pins 72 of the enclosing member 70 and the top plate 110a is never smaller than the distance D0 between the center portion WC of the wafer W and the top plate 110a. .

However, also in this modification, the top plate 110a is accurately positioned in the vertical direction by the positioning mechanism 130. Therefore, the relative position of the top plate 110a with respect to the exhaust / drainage part (cup) 100 is positioned at a predetermined position so that the distance between the top plate 110a and the wafer W is constant along the circumferential direction of the wafer W. Can do. Thereby, the flow of the inert gas flowing on the upper surface side of the wafer W can be made uniform along the circumferential direction of the wafer W. Therefore, the flow rate of the inert gas that flows between the wafer W and the top plate 110a to the outside of the wafer W can be made uniform. Then, the processing liquid that has reached the lower surface of the peripheral edge WE of the wafer W more reliably moves around between the wafer W and the enclosure member 70 or between the enclosure member 70 and the rotating cup 71 toward the upper surface side of the wafer W. Can be prevented.
(Second modification of the embodiment)
Next, a liquid processing apparatus and a liquid processing method according to a second modification of the embodiment of the present invention will be described with reference to FIG. FIG. 10 is a schematic cross-sectional view showing the configuration of the liquid processing unit 22b according to this modification.

  The liquid processing unit 22b according to this modification is different from the liquid processing unit 22 according to the embodiment in that the top plate 110b does not have a floating member.

  Also in this modification, the liquid processing system 10 according to the embodiment described with reference to FIGS. 1 to 3 can be used. Further, as shown in FIG. 10, the liquid processing unit 22b mounted in the liquid processing system 10 according to the present modification includes a rotating plate 60, an enclosure member 70, a rotating cup 71, a rotation driving unit 80, a substrate lifting member 90, The processing liquid supply mechanism 93, the exhaust / drainage part (cup) 100, the top plate 110b, the elevating mechanism 120b, the inert gas supply mechanism 123b, and the positioning mechanism 130 are included, but the floating member is not included. These parts other than the top plate 110b and the lifting mechanism 120b are the same as those of the liquid processing unit 22 described in the embodiment with reference to FIG. In FIG. 10, the same parts as those described with reference to FIG.

  The top plate 110b can be raised and lowered, and is provided so as to close the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 in the lowered state. . In addition, the gap forming member 113 protruding downward from the lower surface 112 of the top plate 110b is provided in a region facing the peripheral edge WE of the wafer W supported by the support pins 72 of the enclosure member 70. It is the same as the form.

  On the other hand, in this modification, since the floating member is not provided, the top plate 110b is fixed to the arm 121b as shown in FIG. Therefore, the top plate 110b is fixed to a part of the liquid processing unit 22b via the arm 121b and the elevation drive unit 122.

  Further, as shown in FIG. 10, the inert gas supply pipe 124b of the inert gas supply mechanism 123b may be integrally formed inside the arm 121b. Alternatively, as shown in FIG. It may be formed separately in the inside.

  Also in this modification, the first positioning member 131 fixed to the top plate 110b or the second positioning member 132 fixed to the exhaust / drainage part (cup) 100 is fixed as in the embodiment. The position may be fixed so as to be adjustable. For example, as described with reference to FIG. 5, the first positioning member 131 or the second positioning member 132 is divided into a root-side member and a tip-side member, and the relative position of the tip-side member with respect to the root-side member is The screw hole and the nut formed in the root side member may be adjustable. Thereby, in a state where the top plate 110b is lowered by the elevating mechanism 120b in advance, the nut of the positioning mechanism 130 is loosened, and the positions of the first positioning member 131 and the second positioning member 132 are aligned, The respective relative positions can be adjusted in advance by tightening the nut of the positioning mechanism 130.

  As a result, the relative position of the top plate 110b with respect to the exhaust / drainage part (cup) 100 is set so that the gap D1 between the gap forming member 113 and the peripheral edge WE of the wafer W is constant along the circumferential direction of the wafer W. It can be positioned at a predetermined position. By making the gap D1 constant along the circumferential direction of the wafer W, the flow of the inert gas flowing on the upper surface side of the wafer W can be made uniform along the circumferential direction of the wafer W. Further, in this modification as well, as described with reference to FIG. 5 in the embodiment, the wafer W in the peripheral portion WE of the wafer W and on the outer peripheral side of the region facing the gap forming member 113. The relative position of the top plate 110b with respect to the exhaust / drainage part (cup) 100 can be positioned at a predetermined position so that the radial width L is constant along the circumferential direction of the wafer W. Therefore, it is more reliable that the processing liquid reaching the lower surface of the peripheral edge WE of the wafer W wraps around the upper surface side of the wafer W from between the wafer W and the enclosure member 70 or between the enclosure member 70 and the rotary cup 71. Can be prevented.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be modified or changed.

DESCRIPTION OF SYMBOLS 10 Liquid processing system 22 Liquid processing unit 70 Enclosure member 72 Support pin 93 Processing liquid supply mechanism 100 Exhaust / drain part (cup)
105 Opening 110 Top plate 113 Gap forming member 123 Inert gas supply mechanism 130 Positioning mechanism

Claims (14)

In a liquid processing apparatus for supplying a gas from the upper surface side of the substrate and supplying a processing liquid from the lower surface side of the substrate, and processing the lower surface of the substrate with the supplied processing liquid,
A processing vessel having an opening on the upper surface;
A support part provided in the processing container and supporting a peripheral part of the substrate;
A top plate portion provided so as to be capable of ascending and descending and closing the opening in a lowered state;
When the top plate is lowered, it has a positioning mechanism for positioning the relative position of the top plate portion relative to the processing chamber to a predetermined position,
The positioning mechanism is
A first positioning member fixed to the top plate,
A second positioning member fixed to the processing container corresponding to the first positioning member;
Have
When the top plate part is lowered, one of the first positioning member and the second positioning member is locked to the other, thereby positioning the relative position,
The first positioning member or the second positioning member is a liquid processing apparatus in which a fixed position is fixed so as to be adjustable .   In a liquid processing apparatus for supplying a gas from the upper surface side of the substrate and supplying a processing liquid from the lower surface side of the substrate, and processing the lower surface of the substrate with the supplied processing liquid,
  A processing vessel having an opening on the upper surface;
  A support part provided in the processing container and supporting a peripheral part of the substrate;
  A top plate portion provided so as to be capable of ascending and descending and closing the opening in a lowered state;
  A positioning mechanism for positioning a relative position of the top plate portion with respect to the processing container at a predetermined position when the top plate portion is lowered;
Have
  An elevating mechanism for elevating the top plate,
  A liquid processing apparatus comprising: a pressing member that is provided on the lifting mechanism side of the top plate portion so as to be elastically deformable along a vertical direction and presses the top plate portion closing the opening against the processing container. The positioning mechanism is
A first positioning member provided on the top plate,
A second positioning member provided in the processing container corresponding to the first positioning member,
When the top plate is lowered by one of the first positioning member and the second positioning member is engaged with the other, it is to position the relative position, according to claim 2 The liquid processing apparatus as described in. The first positioning member is fixed to the top plate part,
The second positioning member is fixed to the processing container;
The liquid processing apparatus according to claim 3 , wherein the first positioning member or the second positioning member is fixed so that a fixing position can be adjusted. The positioning mechanism, so that the distance between the peripheral portion and the top plate portion of the substrate is constant along the circumferential direction of the substrate, is intended for positioning the relative position claims 1 to 4 The liquid processing apparatus in any one of. The top plate portion is provided in a region facing the peripheral portion of the substrate so as to protrude downward from the lower surface of the top plate portion, and a gap forming member that forms a gap with the peripheral portion of the substrate. Have
The liquid processing apparatus according to claim 5 , wherein the positioning mechanism is configured to position the relative position so that the gap is constant along a circumferential direction of the substrate. The positioning mechanism is a peripheral portion of the substrate, and a radial width of the substrate in a portion on the outer peripheral side of a region facing the gap forming member is constant along the circumferential direction of the substrate. The liquid processing apparatus according to claim 6 , wherein the relative position is positioned. A processing vessel having an opening on the upper surface, a support provided in the processing vessel and supporting the peripheral edge of the substrate, and a top plate that is provided so as to be movable up and down and closes the opening in a lowered state; A liquid processing method in a liquid processing apparatus for supplying a gas from the upper surface side of the substrate supported by the support portion and supplying a processing liquid from the lower surface side of the substrate, and processing the lower surface of the substrate with the supplied processing liquid Because
When the top plate is lowered, it has a positioning step of positioning the relative position of the top plate portion relative to the processing chamber to a predetermined position,
The positioning step includes a first positioning member fixed to the top plate portion when the top plate portion descends, and a second position member fixed to the processing container corresponding to the first positioning member. The relative position is determined by either one of the positioning members being locked to the other,
The liquid processing method in which the first positioning member or the second positioning member is fixed so that a fixed position can be adjusted . The liquid according to claim 8 , wherein the positioning step positions the relative position so that a distance between a peripheral edge portion of the substrate and the top plate portion is constant along a circumferential direction of the substrate. Processing method. The top plate portion is provided in a region facing the peripheral portion of the substrate so as to protrude downward from the lower surface of the top plate portion, and a gap forming member that forms a gap with the peripheral portion of the substrate. Have
The liquid processing method according to claim 9 , wherein the positioning step positions the relative position so that the gap is constant along a circumferential direction of the substrate. In the positioning step, the width in the radial direction of the substrate in the peripheral portion of the substrate and on the outer peripheral side of the region facing the gap forming member is constant along the circumferential direction of the substrate. a is for positioning the relative position, the liquid processing method according to claim 1 0. The liquid processing apparatus has an elevating mechanism for elevating and lowering the top plate part,
In the positioning step, the top plate portion that closes the opening is pressed against the processing container by a pressing member that is elastically deformable along the vertical direction closer to the lifting mechanism than the top plate portion. there, the liquid processing method according to any one of claims 11 to claim 8. A processing vessel having an opening on the upper surface, a support provided in the processing vessel and supporting the peripheral edge of the substrate, and a top plate that is provided so as to be movable up and down and closes the opening in a lowered state; A liquid processing method in a liquid processing apparatus for supplying a gas from the upper surface side of the substrate supported by the support portion and supplying a processing liquid from the lower surface side of the substrate, and processing the lower surface of the substrate with the supplied processing liquid Because
A positioning step of positioning a relative position of the top plate portion with respect to the processing container at a predetermined position when the top plate portion is lowered;
The liquid processing apparatus has an elevating mechanism for elevating and lowering the top plate part,
In the positioning step, the top plate portion that closes the opening is pressed against the processing container by a pressing member that is elastically deformable along the vertical direction closer to the lifting mechanism than the top plate portion. A liquid processing method. A computer-readable recording medium storing a program for executing a liquid processing method according to claim 8 of claims 1-3 in a computer.

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