JP5570355B2 - Embossed film manufacturing method - Google Patents

Description

The present invention relates to a method for producing an embossed film of a thermoplastic resin excellent in printing processability and adhesive coating property.

Conventionally, embossing with a metal embossing roll having a predetermined concavo-convex pattern on its surface has been performed for the purpose of imparting a design shape or functional shape to the surface of a thermoplastic resin film. In such embossing, a concavo-convex pattern is imparted by sandwiching a thermoplastic resin film heated and softened in advance between a metal embossing roll and a smooth roll having a rubber surface. When the concavo-convex pattern comes into contact with the thermoplastic resin film, the rubber surface of the smooth roll is also deformed, and as a result, the back surface of the thermoplastic resin film is uneven (this phenomenon is called back embossing). . When back embossing occurs, it becomes difficult to apply a pattern to the back surface of the embossed film by gravure printing or to apply an adhesive or the like uniformly. In addition, when embossing is performed continuously for a long time, especially when the line speed is increased for the purpose of improving productivity, the temperature of the smooth roll gradually increases due to the low thermal conductivity of rubber. There is a problem that the thermoplastic resin film is heated and softened more than necessary, and back embossing is more likely to occur, or a manufacturing trouble occurs in which the thermoplastic resin film is wound around the smooth roll.

As a method of solving the above problems, the embossed surface of the thermoplastic resin film can be easily transferred to the embossed roll by heating and softening, and the smooth roll surface can be backed by cooling and stiffening. Many proposals have been made based on the technical idea of preventing embossing and wrapping.

As one of the methods, a method is known in which the surface of the smooth roll is replaced with rubber to improve the thermal conductivity of the smooth roll by using a metal. However, in this method, the interval adjustment between the two metal rolls is extremely severe, and there is a problem that the adjustment often fails and the thermoplastic resin film is torn or the surface of the metal roll is damaged. .

Therefore, a method of using a metal endless belt instead of a metal smooth roll (for example, Patent Document 1) or a method of sandwiching a metal seamless belt between a raw film and a smooth roll having a rubber surface (for example, a patent) Document 2) has been proposed. However, these methods require large-scale equipment.

Moreover, the method of cooling a smooth roll with many cooling rolls is proposed (for example, patent document 3). In this method, the surface temperature of the embossing roll rises and falls greatly in a very short time from when the heated sheet contacts the embossing roll until it leaves the embossing roll, and as a result, fine cracks enter the chrome plating on the roll surface. There is a problem that the life of the embossing roll is shortened.

A method of cooling the smooth roll with a cooling water tank has also been proposed (for example, Patent Document 4). Here, in order to enable embossing to a sheet having a thickness of 400 μm or more, a smooth roll having a high surface hardness is used. Although the use of such a smooth roll contributes to the prevention of back embossing, it is not sufficient, and the back embossing is more likely to occur for a sheet thinner than 400 μm, so that it is difficult to apply to a sheet having a wide range of thickness. It is.

Also, a method of heating only a portion of the embossing roll immediately before contacting the sheet has been proposed (for example, Patent Document 5). This method cannot sufficiently suppress a decrease in transfer accuracy after heat-treating the embossed sheet, and there is also a problem of the life of the embossing roll due to a large increase / decrease in the surface temperature of the embossing roll.

Japanese Patent Laid-Open No. 6-246829 JP 2001-113597 A Japanese Patent Laid-Open No. 9-039092 JP 2006-272918 A Japanese Patent Laid-Open No. 2005-144697

The purpose of the present invention is to produce an embossed film of thermoplastic resin with high transfer accuracy and no back embossing by a general apparatus that uses an embossing roll and a smooth roll of rubber surface without requiring large-scale equipment. Is to provide a way to do.

When the present inventor performs embossing on a thermoplastic resin film using an embossing machine using an embossing roll and a smooth roll on the rubber surface, a specific film is provided on the surface opposite to the surface to be embossed. It has been found that the above-mentioned object can be achieved by applying embossing with an adhesive.

That is, in the present invention, the thermoplastic resin film (a) is inserted between an embossing roll having a predetermined concavo-convex pattern on the surface and a smooth roll having a rubber surface. In a method for producing an embossed film by transferring an uneven pattern on the surface,
(A) The step of bonding the film (a) and the thermoplastic resin film (a) so as to be peelable from each other after the transfer to obtain a bonded film, wherein the thermoplastic resin film (a) is thermoplastic Having a thermoplastic resin film (c) on the opposite side of the surface to be bonded to the resin film (a),
(B) The laminated film is inserted between an embossing roll and a smooth roll so that the film (a) is on the embossing roll side, and a concavo-convex pattern is transferred to the surface of the film (a) to form a laminated embossing film. And (c) peeling the film (a) from the laminated embossed film to obtain an embossed film, and the thermoplastic resin film (a) has a yield point strength of 15 N / 10 mm or more in a 100 ° C. atmosphere. It is the method characterized by having.

INDUSTRIAL APPLICABILITY The present invention can produce a thermoplastic resin film having an embossed pattern on its surface with high transfer accuracy and no back embossing without requiring a large facility. The resulting embossed film has a smooth back surface without back embossing, etc., so it is excellent in printing processability and adhesive coating properties. Therefore, it is a decorative sheet, a film surface layer, a printing film, an adhesive sheet, and a paint substitute. It is very useful as a film.

FIG. 1 is a schematic diagram illustrating one embodiment of the method of the present invention.

The method of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram showing an embodiment of the method of the present invention. First, the thermoplastic resin film (A) and the thermoplastic resin film (I) are unwound from the unwinding rolls 1 and 2, respectively, and bonded to each other by the pressing rolls 5 and 7 and the preheating roll 6 (step (process ( a)). At this time, the film (A) and the film (A) are bonded so that they can be separated from each other after the emboss transfer. Next, embossing is performed. That is, the obtained bonding film is inserted between the embossing roll 8 and the smooth roll 9 so that the film (a) is on the embossing roll 8 side, and the uneven pattern is transferred to the surface of the film (a). A laminated embossed film is obtained (step (b)). Next, the target embossed film 12 is obtained by peeling the film (a) from the obtained laminated embossed film (step (c)).

The bonding of the film (a) and the film (a) in the step (a) can be performed by known thermal temporary bonding. The temporary heat sticking can be performed by continuously passing the two films between a heated preheating roll and a pressing roll. The heating can be performed by steam, hot oil, electric heat, an infrared heater, or the like. The heating temperature is appropriately determined according to the thermal properties and distribution of the film (a) and film (a) used, and is usually 5 to 50 ° C. lower than the melting temperature or fluidization temperature of the film having lower heat resistance. Temperature. In the present invention, as understood from the fact that the film (a) to which the embossed pattern is transferred is bonded so that the film (b) and the film can be separated from each other after transfer, the film (b) Higher heat resistance than film (a). If the heat resistance of the film (a) is the same as or higher than that of the film (a), the film (a) and the film (a) are welded during embossing, making it impossible to peel off after transfer. It is. Moreover, in the said heat | fever temporary bonding, it passes between rolls so that the film (I) with higher heat resistance may become a preheating roll side.

In step (b) for embossing, the bonded film obtained in step (a) is made of a metal or ceramic embossing roll and a rubber surface having a predetermined concavo-convex pattern on the surface according to a normal method. It is carried out while being heated and pressed by inserting it between a smooth roll having The heating can be performed by steam, hot oil, electric heat, an infrared heater, or the like. The heating temperature is appropriately determined according to the thermal characteristics of film (a) and film (a) and their distribution, and is usually 1 to 50 ° C. above the glass transition point or softening point of the embossed film (a). The temperature ranges from a high temperature to a temperature 5 to 50 ° C. lower than the melting temperature or fluidization temperature of the film (a).

The embossed roll pattern is, for example, a design simulating a natural material such as a wood grain pattern or leather, a hairline pattern as if processing metal, or a geometric abstraction such as a lattice pattern, stripe pattern, or polka dot pattern. These can be used alone or in combination. Examples of the engraving method for the concavo-convex pattern include an embossing method using an engraving mill roll, an etching method using acid corrosion, a mechanical engraving method using a diamond stylus, a laser engraving method using a CO ₂ laser, a YAG laser, etc., and a sand blasting method. It is done. Further, the surface of the engraved embossing roll is desirably subjected to chrome plating, iron-phosphorus alloy plating, hard carbon treatment by PVD method or CVD method, etc. for the purpose of protection from corrosion and scratches. Of course, these methods do not limit the present invention, and the embodiment can be freely selected depending on the embossing equipment, conditions, purpose, and the like.

The step (c) for performing the peeling can be performed as follows. A part of the film (A) is peeled off from the end of the laminated embossed film obtained in the step (b) or from the position where the cut is made with a cutter such as a cutter. The boundary portion between the peeled portion and the unpeeled portion of the laminated embossed film is pressed by, for example, pinch rolls 10 and 11 as shown in FIG. 1, and the peeling is performed stably at a constant film angle. Like that. In this way, the film (a) is sequentially peeled to obtain the desired embossed film. The obtained embossed film and the remaining film (A) can be wound on winding rolls 13 and 15, respectively, as shown in FIG.

Step (c) can be performed as a series of steps with steps (a) and (b), for example, as shown in FIG. 1, or can be performed as a separate step. In the latter case, for example, after winding the laminated embossed film obtained in the step (b) once, it is attached to a winder machine in another line, and the film (A) and the film (I) are separated from each other and separated. The method of winding up is mentioned. The method for the step (c) is not limited to the above. The steps (a) and (b) are usually performed as a series of steps, but may be performed as separate steps.

The thermoplastic resin film (a) used in the present invention may be any film as long as it is a thermoplastic resin film. The thickness is not particularly limited, but is usually 50 to 500 μm, preferably 75 to 200 μm. Further, the film forming method, the presence or absence of stretching, and the stretching method (uniaxial stretching, biaxial stretching, etc.) are not particularly limited. These are appropriately selected according to the desired use of the embossed film. If the thickness is too thin, back embossing is likely to occur, and if it is too thick, tension is not easily applied when the obtained embossed film is applied to a printing machine or the like, and slack is likely to occur.

The thermoplastic resin for the film (a) is not particularly limited, but from the viewpoint of printing processability and adhesive coating property of the resulting embossed film, acrylic resin, polyester resin, polyolefin resin, polycarbonate resin, Styrenic resins and polyvinyl chloride resins are preferred.

Among these, the acrylic resin film has a high surface hardness so that it is excellent in external resistance and scratch resistance, and has good embossing workability (that is, the uneven pattern on the surface of the embossing roll is sufficiently transferred, In addition, irregularities other than the irregular pattern are not engraved on the film), which is more preferable. Furthermore, the acrylic resin film preferably has a glass transition point of 80 to 130 ° C, more preferably 90 to 120 ° C, and still more preferably 95 to 110 ° C. When the glass transition point exceeds the above upper limit, the film is difficult to soften, so that the uneven shape on the surface of the embossing roll is not sufficiently transferred or back embossing is likely to occur. If the glass transition point is less than the above lower limit, the film tends to soften, and thus the resulting embossed film has a reduced heat resistance of the embossed pattern, causing a so-called wrinkle flow, or contact from outside at high temperatures. There is a risk of deformation.

The thermoplastic resin film (A) used in the present invention functions to withstand the pressing of an embossing roll having a concavo-convex pattern on the surface and maintain the back surface smoothness of the thermoplastic resin film (A). Therefore, the thermoplastic resin film (a) needs to have sufficient heat resistance and hardness at the embossing temperature. Therefore, the thermoplastic resin film (A) has a yield point strength in a 100 ° C. atmosphere of 15 N / 10 mm or more, preferably 20 N / 10 mm or more, more preferably 25 N / 10 mm or more. When the yield point strength is less than 15 N / 10 mm, back embossing is likely to occur, and film stretching, width shrinkage, and pattern elongation are likely to occur due to embossing. The upper limit of the yield point strength is not particularly limited, but workability in the heat temporary attachment process (appropriate tension is applied to the film so that it does not wrinkle or sag evenly when the film is subjected to the heat temporary attachment process. From the viewpoint of being able to apply an appropriate tension when the laminated film is applied to an embossing machine, preferably 100 N / 10 mm or less, more preferably 60 N / 10 mm or less is recommended. Is done. The above-mentioned pattern elongation is a phenomenon in which an embossed pattern or the like is stretched by stretching the film when tension is applied to a film that does not have sufficient yield point strength. If the yield point strength of the film (a) is less than the above lower limit, the film (a) cannot sufficiently suppress the elongation of the film (a) due to the tension of the embossing machine in the embossing process. Arise.

In this specification, the yield point strength in an atmosphere of 100 ° C. is determined by using an RTG-1310 type tensile tester manufactured by A & D Co., Ltd. and a temperature chamber for Tensilon manufactured by Yashima Seisakusho Co., Ltd. The stress at the maximum peak top in the initial stage of deformation of the strain-stress curve when measured at a test speed of 300 mm / min in a 100 ° C. atmosphere using a film cut into No. 1 dumbbell shape as a test piece.

The thermoplastic resin film (A) is not particularly limited as long as it has the above yield strength, and can be appropriately selected according to the thermoplastic resin film (A) used and the embossing temperature. For example, a polyester-type resin film and a nylon-type resin film are mentioned, A polyester-type resin film is preferable. Among them, a biaxially stretched film of polyethylene terephthalate, particularly homopolyethylene terephthalate, is more preferable because of its wide application range and low cost. Although thickness is suitably selected according to embossing conditions, it is 10-250 micrometers normally, Preferably it is 30-150 micrometers, More preferably, it is 40-100 micrometers.

As described above, since the film (a) and the film (a) are bonded together so that they can be peeled from each other after transfer, the film (a) is lower in heat resistance than the film (a), Therefore, these two films are different from each other.

In the step (a) of the method of the present invention, when the bonding of the thermoplastic film (a) and the thermoplastic film (a) is performed using a steam heating type preheating roll, the temperature is at most about 150 ° C. Can only be raised by Therefore, in particular, when the thermoplastic resin film (a) has a high softening point, it is necessary to improve the adhesion with the preheating roll so that heat can be transmitted well. Since the thermoplastic resin film (A) is a hard film as described above, the adhesion with the preheating roll tends to be insufficient. The problem is that the thermoplastic film (a) laminated with the thermoplastic film (a) on the opposite side of the surface of the thermoplastic resin film (a) to be bonded to the thermoplastic film (a) is bonded. Can be solved.

Any method may be used for laminating the thermoplastic resin film (a) and the thermoplastic resin film (c) so that they are in close contact with each other so that they do not peel during embossing. Furthermore, it is preferable that they are laminated so that they can be easily peeled after embossing, because separation and recycling are possible. As a method of performing such lamination, the thermal temporary attachment described in the step (a) can be given. The temporary heat sticking is performed by continuously passing the film (I) and the film (U) between a preheating roll heated by steam, hot oil, electric heat, an infrared heater, and the like and a pressing roll.

The thermoplastic resin for the thermoplastic resin film (c) is preferably non-crystalline including polyvinyl chloride resin; PETG resin, PCTG resin and PCTA resin because it is inexpensive and easily adjusts the peel strength. Alternatively, it is selected from the group consisting of low crystalline polyester resin; polypropylene; and acrylonitrile-butadiene-styrene copolymer resin (ABS resin), and polyvinyl chloride resin and PETG resin are particularly preferable.

The thermoplastic resin film (c) is preferably selected in consideration of adhesion to the preheating roll, peel strength, contamination resistance, thermal conductivity, workability, and the like. In particular, the peel strength when affixed to a stainless steel plate in a 120 ° C. atmosphere is preferably 0.1 to 15 N / 15 mm. If the peel strength is greater than the upper limit, peeling from the heated preheating roll tends to be unstable. Moreover, in the peeling of the film (a) after embossing, pattern elongation may occur. The thickness of the film (c) is preferably 30 to 200 μm, more preferably 50 to 100 μm, from the viewpoint of thermal conductivity and workability. Furthermore, from the viewpoint of improving the heating efficiency of the film (c) when the preheating roll is heated by an infrared heater, the color tone of the film (c) is preferably a dark color such as black.

In addition, since the film (I) and the film (C) may or may not be peelable from each other, these two films may be the same or different from each other. Considering the purpose of use of (c), it is preferable that these two films are different from each other and that the heat softening temperature of the film (b) is higher than that of the film (c). There is no problem even if the film (a) and the film (c) are the same or different from each other.

As described above, the method of the present invention bonds the thermoplastic resin film (a) and the thermoplastic resin film (a) or the thermoplastic resin film (a) laminated with the thermoplastic resin film (c). This is performed by embossing and then peeling off the thermoplastic resin film (a). The embossed film thus obtained has a smooth surface with an uneven pattern on the surface of the embossing roll transferred to the surface with good accuracy, and has no back embossing on the back surface. Preferably, the ten-point average roughness (Rz) (unit: μm) of the back surface of the embossed film is 10.0 or less, more preferably 8.0 or less, and even more preferably 6.0 or less. In an embossed film with Rz exceeding 10.0, that is, an embossed film with strong back embossing, it is difficult to apply a pattern in gravure printing or to apply an adhesive or the like uniformly. The lower limit of Rz is not particularly limited. However, when embossing is performed on the front side, it is very difficult industrially to keep the back surface completely smooth, and is usually 2.0 or more. In addition, even if said Rz is 2.0 or more, as long as it is below the above upper limit value, printing on the back surface of the embossed film, application of an adhesive / adhesive, etc. and other films Lamination can be performed with good workability.

EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited to a following example. The test methods and materials used in the examples are as follows.

Test method (1) Glass transition point of film (a) Measured using TMA8310 manufactured by Rigaku Corporation.

(2) Peel strength of film (c) The surface of the stainless steel plate (SUS304) is washed with methyl isobutyl ketone and degreased, and then the thermoplastic resin film (c) and the stainless steel plate are heated at 120 ° C. and 50 kgf using a hot press device. A test piece was prepared by laminating at / cm ² for 2 minutes. Using this RTG-1310 type tensile tester manufactured by A & D Co., Ltd. and a thermostatic bath for Tensilon manufactured by Yashima Seisakusho, 180 ° peeling at a test speed of 300 mm / min. A test was conducted to measure the peel strength.

(3) Embossability The surface roughness (10-point average roughness: Rz) and gloss (60 ° gloss) of the surface of the embossed film obtained (surface having an embossed pattern) were measured and evaluated according to the following criteria. . The ten-point average roughness was measured using Handy Surf E-30A manufactured by Tokyo Seimitsu Co., Ltd., and the gloss was measured using a gloss checker manufactured by Horiba, Ltd.
A: The gloss value is less than 30 and the 10-point average roughness is 20 or more.
Δ: Gloss value is 30 or more and 10-point average roughness is 20 or more, or gloss value is less than 30 and 10-point average roughness is less than 20.
X: The gloss value is 30 or more and the 10-point average roughness is less than 20.

(4) Heat resistance of embossed pattern The obtained embossed film was immersed in a glycerin liquid heated to 130 ° C. for 30 seconds, then taken out and immediately washed with water. The surface gloss and ten-point average roughness (Rz) of this embossed film were measured by the same method as described in (3) above. These measured values were compared with the values measured in (3) above, and evaluated according to the following criteria.
○: The increase rate of gloss after immersion is within 50%, and the decrease rate of 10-point average roughness is within 50%.
Δ: Increase rate of gloss after immersion is 50% or less and decrease rate of 10-point average roughness is 50% or more, or increase rate of gloss after immersion is 50% or more and 10-point average The reduction rate of roughness is within 50%.
X: The increase rate of the gloss after immersion is 50% or more, and the decrease rate of the ten-point average roughness is 50% or more.

(5) Back embossing Ten-point average roughness (Rz) of the back surface of the obtained embossed film was measured by the same method as described in the above (3).

(6) Enter three marked lines at 1000 mm intervals in the center of the thermoplastic resin film (a) before pattern elongation embossing at 1000 mm intervals, and measure the distance L (unit: mm) between the marked lines after embossing. did. From this measurement result, the pattern elongation was calculated according to the following formula.
{(L-1000) / 1000} × 100

material
Thermoplastic resin film (A)
(A-1): Sumitomo Chemical Co., Ltd. acrylic resin film, Technoloy S001 (trade name), thickness 150 μm, glass transition point 106 ° C.
(A-2): Mitsubishi Rayon Co., Ltd. acrylic resin film, Acryprene HBA002P (trade name), thickness 100 μm, glass transition point 103 ° C.
(A-3): Sumitomo Chemical Co., Ltd. acrylic resin film, Technoloy S014G (trade name), thickness 125 μm, glass transition point 101 ° C.
(A-4): Mitsubishi Rayon Co., Ltd. acrylic resin film, Acryprene HBS010P (trade name), thickness 125 μm, glass transition point 107 ° C.
(A-5): Mitsubishi Rayon Co., Ltd. acrylic resin film, Acryprene HBA002P (trade name), thickness 100 μm, glass transition point 103 ° C.
(A-6): Kaneka Corporation's acrylic resin film, Sandulen SD010NRT (trade name), thickness 125 μm, glass transition point 108 ° C.
(A-7): Kaneka Co., Ltd. acrylic resin film, Sanduren SD014 NRLGT (trade name), thickness 50 μm, glass transition point 95 ° C.
(A-8): Evonik Degussa acrylic resin film, Plexiglas 99524 (trade name), thickness 175 μm, glass transition point 104 ° C.
(A-9): Evonik Degussa acrylic resin film, Plexiglas 99524 (trade name), thickness 250 μm, glass transition point 104 ° C.
(A-10): Teijin Chemicals Ltd. polycarbonate film, Panlite PC-2151 (trade name), thickness 125 μm, glass transition point 148 ° C.
(A-11): Flame retardant polycarbonate film of International Chemical Co., Ltd., SDB-3 (trade name), thickness 250 μm, glass transition point 155 ° C.
(A-12): Riken Technos Co., Ltd. polyvinyl chloride resin film, S4660 FC25382 (trade name), thickness 200 μm, glass transition point 82 ° C.
(A-13): Riken Technos ABS resin film, SST467 FZ13664 (trade name), thickness 150 μm, glass transition point 107 ° C.
(A-14): Kaneka Corporation's acrylic resin film, Sanduren SD009NCT (trade name), thickness 100 μm, glass transition point 115 ° C.

Thermoplastic resin film (b)
(I-1): Unita Co., Ltd. biaxially stretched polyethylene terephthalate film, Emblet S75 (trade name), thickness 75 μm, yield point strength 33.4 N / 10 mm
(Ii-2): Biaxially stretched polyethylene terephthalate film manufactured by Toray Industries, Inc., Lumirror T60 (trade name), thickness 50 μm, yield point strength 28.1 N / 10 mm
(I-3): Biaxially stretched polyethylene terephthalate film manufactured by Toray Industries, Inc., Lumirror T60 (trade name), thickness 38 μm, yield point strength 18.1 N / 10 mm
(I-4): Biaxially stretched polyethylene terephthalate film manufactured by Toyobo Co., Ltd., E5101 (trade name), thickness 250 μm, yield point strength 228 N / 10 mm
(A-5) (For comparison): Toyobo Co., Ltd. void-containing polyethylene terephthalate film, G1211 (trade name), thickness 38 μm, yield point strength 13.9 N / 10 mm
(A-6) (For comparison): Teijin DuPont Films Co., Ltd. phthalic acid isomer copolymerized polyethylene terephthalate film, Teflex FT3 (trade name), thickness 50 μm, yield point strength 8.4 N / 10 mm, softening point 75 ° C.
(I-7) (For comparison): Cyclohexanedimethanol copolymerized polyethylene terephthalate film (PETG resin film), SET329 FZ26401 (trade name), Riken Technos Co., Ltd., thickness 100 μm, yield strength 1.3 N / 10 mm, softening point 80 ℃

Thermoplastic resin film (C)
(C-1): Riken Technos Co., Ltd. polyvinyl chloride resin film, S4970 FC25382 (trade name), coconut, thickness 100 μm, peel strength 1 N / 25 mm
(U-2): Okamoto Co., Ltd. polyvinyl chloride resin film, SPVC-150 (trade name), thickness 150 μm, peel strength 2 N / 25 mm
(U-3): Kaneka Corporation acrylic film, Sanduren SD014NRT (trade name), thickness 50 μm, peel strength 8 N / 25 mm
(U-4): Riken Technos Co., Ltd. PET-G resin film, TPT027 FX025 F200 (trade name), thickness 150 μm, peel strength 18 N / 25 mm

Examples 1-21 and Comparative Examples 1-4
The thermoplastic resin film (U) and the thermoplastic resin film (A) shown in Table 1 were passed through an embossing machine and sandwiched between a preheating roll set at a temperature of 120 ° C. and a pressing roll, and then temporarily bonded. The heat-temporarily pasted film is passed through the embossing machine, and the thermoplastic resin film (a) is further passed to the side in contact with the film (a). Between the preheating roll and the pressing roll set at a temperature of 120 ° C. To obtain a laminated film. Further, the embossed laminated film is continuously embossed by sandwiching the film (A) on the embossing roll side continuously between an embossing roll set at a temperature of 150 ° C. and a smooth roll having a rubber surface. Obtained. Subsequently, the film (a) was peeled from the embossed laminated film to obtain an embossed film having an embossed pattern on the surface. As an embossing machine, a steam heating preheating roll and a wood embossing roll / brass plating metal embossing roll BR-16 were used, and the line speed was 3 m / min.

In the methods of Examples 1 to 21 according to the present invention, embossing could be performed satisfactorily without causing back embossing or pattern elongation. Moreover, the heat resistance of the obtained embossed pattern was also favorable.

On the other hand, in the methods of Comparative Examples 1 to 3 using the film (A) having a yield point strength of less than 15 N / 10 mm and Comparative Example 4 using only the film (A), back embossing and pattern elongation occurred. Moreover, it was inferior to the heat resistance of the obtained embossed pattern.

1, 2 Unwinding roll 3 Thermoplastic resin film (A)
4 Thermoplastic resin film (I)
5 Pressing roll 6 Preheating roll 7 Pressing roll 8 Embossing roll 9 Smoothing roll 10 Pinch roll 11 Pinch roll 12 Embossing film 13 Winding roll 14 Thermoplastic resin film (I)
15 Winding roll

Claims (7)

By inserting the thermoplastic resin film (a) between an embossing roll with a predetermined concavo-convex pattern on the surface and a smooth roll having a rubber surface, the concavo-convex pattern is transferred to one surface of the film (a). In the method of manufacturing an embossed film,
(A) The step of bonding the film (a) and the thermoplastic resin film (a) so as to be peelable from each other after the transfer to obtain a bonded film, wherein the thermoplastic resin film (a) is thermoplastic Having a thermoplastic resin film (c) on the opposite side of the surface to be bonded to the resin film (a),
(B) The laminated film is inserted between an embossing roll and a smooth roll so that the film (a) is on the embossing roll side, and a concavo-convex pattern is transferred to the surface of the film (a) to form a laminated embossing film. And (c) peeling the film (a) from the laminated embossed film to obtain an embossed film, and the thermoplastic resin film (a) has a yield point strength of 15 N / 10 mm or more in a 100 ° C. atmosphere. Said method comprising: The method according to claim 1, wherein the ten-point average roughness (Rz) of the surface opposite to the surface to which the concavo-convex pattern of the embossed film is transferred is 10.0 μm or less. The method according to claim 1 or 2, wherein the thermoplastic resin film (a) is a biaxially stretched polyethylene terephthalate film. The thermoplastic resin film (c) is selected from the group consisting of a polyvinyl chloride resin film, an amorphous or low crystalline polyester resin film, a polypropylene film, and an acrylonitrile-butadiene-styrene copolymer resin (ABS resin) film. The method according to any one of claims 1 to 3 . The method according to any one of claims 1 to 4 , wherein the thermoplastic resin film (a) is an acrylic resin film. The method according to claim 5 , wherein the thermoplastic resin film (a) is an acrylic resin film having a glass transition point of 80 to 130 ° C. The embossed film obtained by the method of any one of Claims 1-6 .

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