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JP5577086B2 - Substrate foreign matter removing apparatus and substrate foreign matter removing method - Google Patents
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JP5577086B2 - Substrate foreign matter removing apparatus and substrate foreign matter removing method - Google Patents

Substrate foreign matter removing apparatus and substrate foreign matter removing method Download PDF

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JP5577086B2
JP5577086B2 JP2009279998A JP2009279998A JP5577086B2 JP 5577086 B2 JP5577086 B2 JP 5577086B2 JP 2009279998 A JP2009279998 A JP 2009279998A JP 2009279998 A JP2009279998 A JP 2009279998A JP 5577086 B2 JP5577086 B2 JP 5577086B2
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substrate
foreign matter
tape
photocatalyst
photocatalytic
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JP2011120993A (en
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貴文 平野
修二 工藤
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V Technology Co Ltd
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Description

本発明は、基板上の異物、特に有機物の異物(有機異物)を除去するのに好適な基板用異物除去装置及び基板用異物除去方法に関する。   The present invention relates to a substrate foreign matter removing apparatus and a substrate foreign matter removing method suitable for removing foreign matter on a substrate, particularly organic foreign matter (organic foreign matter).

例えばカラーフィルタ基板においては、表面に異物がなく平滑であることが要求されるが、製造工程において、基板表面にごみや油などが付着したり、異常突起が生じたりすることがあり、係る異物を除去する装置として、研磨テープを用いて異物を研磨除去する装置や異物にレーザ光を照射して除去する装置などが実用化されている(例えば、特許文献1,2参照)。   For example, color filter substrates are required to be smooth with no foreign matter on the surface, but in the manufacturing process, dust or oil may adhere to the substrate surface or abnormal protrusions may occur. As a device for removing the dust, a device for polishing and removing foreign matter using a polishing tape, a device for removing the foreign matter by irradiating laser light, and the like have been put into practical use (for example, see Patent Documents 1 and 2).

特開平8−229797号公報JP-A-8-229797 特開2004−325837号公報JP 2004-325837 A

しかし、研磨テープやレーザ光を用いる異物除去装置では、研磨屑・レーザ加工屑が基板表面に残存することがあり、また、異物を良好に除去しようとすると、過剰研磨・レーザ過照射となって、基板表面を損傷させてしまう可能性があった。   However, in a foreign matter removing apparatus using a polishing tape or laser light, polishing scraps and laser processing scraps may remain on the substrate surface, and if the foreign matter is to be removed satisfactorily, excessive polishing and laser over-irradiation will occur. The substrate surface could be damaged.

そこで、本発明は、このような問題点に対処し、特に有機物の異物(有機異物)の除去に有効な除去装置・除去方法であって、有機物の異物(有機異物)を、屑を残存させることなく、かつ、基板表面を損傷させることなく良好に除去できる基板用異物除去装置及び方法を提供することを目的とする。   Accordingly, the present invention addresses such problems and is a removal device / removal method that is particularly effective for removing organic foreign matter (organic foreign matter), in which organic foreign matter (organic foreign matter) is left as debris. It is an object of the present invention to provide a substrate foreign matter removing apparatus and method which can be satisfactorily removed without damaging the substrate surface.

上記目的を達成するために、本発明に係る基板用異物除去装置は、基板上の異物を除去する装置であって、基材に光触媒をコーティングした光触媒テープと、一対の回転軸の間に前記基板の表面と略平行に張り渡された前記光触媒テープを前記基板に対して離接する方向に移動させ、前記光触媒テープの光触媒層を前記基板上の異物に対して接触させる移動手段と、前記異物に接触した前記光触媒層に対して光を照射する光照射手段と、を備え、前記一対の回転軸の離間距離を前記基板の幅よりも長く設定し、前記移動手段は、前記一対の回転軸と前記光照射手段とを一体として前記基板に対して離接する方向に移動させる。
このような構成では、光触媒層と異物とが接触している状態で光を照射すると、光触媒層による光酸化反応で有機異物が選択的に分解・除去される。
In order to achieve the above object, a substrate foreign matter removing apparatus according to the present invention is a device that removes foreign matter on a substrate, the photocatalyst tape having a base material coated with a photocatalyst, and a pair of rotating shafts. Moving means for moving the photocatalyst tape stretched substantially parallel to the surface of the substrate in a direction to be in contact with and away from the substrate, and bringing the photocatalyst layer of the photocatalyst tape into contact with the foreign matter on the substrate; and the foreign matter Light irradiation means for irradiating light to the photocatalyst layer in contact with the pair, the separation distance of the pair of rotation shafts is set longer than the width of the substrate, and the movement means is the pair of rotation shafts And the light irradiating means are moved together in a direction to be separated from and in contact with the substrate.
In such a configuration, when light is irradiated while the photocatalyst layer is in contact with the foreign matter, the organic foreign matter is selectively decomposed and removed by a photooxidation reaction by the photocatalyst layer.

ここで、前記一対の回転軸及び前記光照射手段を前記基板に対して離接する方向に移動可能に支持するベースプレートに、前記基板を撮影する撮影手段を備え、前記ベースプレートは、前記基板の表面と平行な平面上を移動可能に支持される構成とすることができる。 Here, a base plate that supports the pair of rotating shafts and the light irradiation unit so as to be movable in a direction to be separated from and in contact with the substrate is provided with a photographing unit that photographs the substrate, and the base plate includes a surface of the substrate. It can be set as the structure supported so that a movement on a parallel plane is possible.

また、本発明に係る基板用異物除去方法は、基板上の異物を除去する方法であって、前記基板の幅よりも長い離間距離で配置した一対の回転軸の間に、基材に光触媒をコーティングした光触媒テープを前記基板の表面と略平行に張り渡し、前記一対の回転軸と光照射手段とを一体として前記基板に対して離接する方向に移動させて、前記光触媒テープの光触媒層を前記基板上の異物に対して接触させ、異物に接触した前記光触媒テープの光触媒層に前記光照射手段により光を照射するようにした。
このような構成では、光触媒層と異物とが接触している状態で光を照射すると、光触媒層による光酸化反応で有機異物が選択的に分解・除去される。
The substrate foreign matter removing method according to the present invention is a method for removing foreign matter on a substrate, wherein a photocatalyst is applied to a base material between a pair of rotating shafts arranged at a separation distance longer than the width of the substrate. The coated photocatalyst tape is stretched substantially parallel to the surface of the substrate, and the pair of rotating shafts and the light irradiation means are integrally moved in a direction to be separated from and contacted with the substrate, so that the photocatalyst layer of the photocatalyst tape is It was made to contact with the foreign material on a board | substrate, and light was irradiated by the said light irradiation means to the photocatalyst layer of the said photocatalyst tape which contacted the foreign material.
In such a configuration, when light is irradiated while the photocatalyst layer is in contact with the foreign matter, the organic foreign matter is selectively decomposed and removed by a photooxidation reaction by the photocatalyst layer.

本発明に係る基板用異物除去装置及び方法によれば、光触媒による光酸化反応で有機異物を水や二酸化炭素にまで酸化させて分解するので、除去後に有機異物の屑が基板表面に残存することを抑止でき、また、触媒反応で有機異物を分解するので、異物除去に伴って基板を損傷させてしまうことがない。   According to the substrate foreign matter removing apparatus and method according to the present invention, the organic foreign matter is oxidized to water or carbon dioxide by the photooxidation reaction by the photocatalyst and decomposed, so that organic foreign waste remains on the substrate surface after removal. In addition, since the organic foreign matter is decomposed by the catalytic reaction, the substrate is not damaged by removing the foreign matter.

本発明の実施形態における基板用異物除去装置を示す正面図である。It is a front view which shows the foreign material removal apparatus for substrates in embodiment of this invention. 本発明の実施形態における基板用異物除去装置を示す側面図である。It is a side view which shows the foreign material removal apparatus for substrates in embodiment of this invention. 本発明の実施形態における基板用異物除去装置で用いる光触媒テープの積層構造を示す斜視図である。It is a perspective view which shows the laminated structure of the photocatalyst tape used with the foreign material removal apparatus for substrates in embodiment of this invention. 本発明の実施形態の基板用異物除去装置における異物除去の作業手順を示す工程図である。It is process drawing which shows the operation | movement procedure of the foreign material removal in the board | substrate foreign material removal apparatus of embodiment of this invention.

以下、本発明の実施形態を添付図面に基づいて詳細に説明する。
図1は、本発明に係る基板用異物除去装置100の正面図、図2は側面図である。
図1,2に示す基板用異物除去装置100は、テーブル200上に載置した平板状の基板BS(例えばカラーフィルタ基板)の表面に付着した有機異物αを、光触媒テープPHTを用いて除去する装置である。
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a front view of a substrate foreign matter removing apparatus 100 according to the present invention, and FIG. 2 is a side view thereof.
The substrate foreign matter removing apparatus 100 shown in FIGS. 1 and 2 removes the organic foreign matter α adhering to the surface of a flat substrate BS (for example, a color filter substrate) placed on a table 200 using a photocatalytic tape PHT. Device.

前記基板用異物除去装置100は、基板BSに対して離接する方向(Z軸方向)に光触媒テープPHTを移動させる移動手段300と、前記光触媒テープPHTに向けて光(光触媒の感光波長光、例えば紫外線)を照射するランプや半導体レーザなどの光照射手段(光源)400と、光触媒テープPHTを、前記移動手段300を経由して移送させる移送手段500と、を備える。   The substrate foreign matter removing apparatus 100 includes a moving unit 300 that moves the photocatalytic tape PHT in a direction in which the substrate BS is separated from and contacting the substrate BS (Z-axis direction), and light (photocatalytic wavelength light of the photocatalyst, for example, A light irradiating means (light source) 400 such as a lamp or a semiconductor laser, and a transfer means 500 for transferring the photocatalytic tape PHT via the moving means 300.

上記各手段を備える基板用異物除去装置100は、X軸スライダ(ベースプレート)600に搭載され、前記X軸スライダ600は、図外のX軸フレームに対して図1の左右方向(X軸方向)に移動可能に取り付けられ、前記X軸フレームは前記テーブル200に対してY軸方向に移動可能に取り付けられ、前記X軸フレームの前記テーブル200に対するY軸方向への移動及び前記X軸スライダ600の前記X軸フレームに対するX軸方向への移動は、例えば駆動モータの回転で作動する送りねじ機構によって行われる。
即ち、前記基板用異物除去装置100は、前記テーブル200と平行な平面(XY平面)上を移動可能に構成され、テーブル200に載置した基板BSの異物αの真上に移動することができるようになっている。
The substrate foreign matter removing apparatus 100 having the above means is mounted on an X-axis slider (base plate) 600, and the X-axis slider 600 is in the left-right direction (X-axis direction) in FIG. The X-axis frame is attached to the table 200 so as to be movable in the Y-axis direction, the X-axis frame is moved in the Y-axis direction with respect to the table 200, and the X-axis slider 600 is moved. The movement in the X-axis direction with respect to the X-axis frame is performed by, for example, a feed screw mechanism that is operated by rotation of a drive motor.
That is, the substrate foreign matter removing apparatus 100 is configured to be movable on a plane (XY plane) parallel to the table 200 and can be moved directly above the foreign matter α of the substrate BS placed on the table 200. It is like that.

前記移動手段300は、前記X軸スライダ600に対してZ軸(垂直方向)に沿って設けた一対の案内レール301,301と、該案内レール301,301に係合支持されてZ軸方向に移動可能な押圧用スライダ302と、X軸スライダ600に対しZ軸(垂直方向)に沿って支持され、前記押圧用スライダ302の後面(背面)に固定したボールナット(図示省略)に螺合するボールネジ303と、前記ボールネジ303を軸回りに回転させる駆動モータ304と、前記駆動モータ304の回転を検出するエンコーダ305と、前記押圧用スライダ302に対してY軸方向を軸として回転可能に支持され、Z軸方向に同じ高さでかつX軸方向に所定距離Wxだけ離間させて配置した一対の回転軸306,306と、を備える。   The moving means 300 is a pair of guide rails 301 and 301 provided along the Z-axis (vertical direction) with respect to the X-axis slider 600, and is engaged and supported by the guide rails 301 and 301 in the Z-axis direction. A movable pressing slider 302 and an X-axis slider 600 are supported along the Z-axis (vertical direction) and screwed to a ball nut (not shown) fixed to the rear surface (rear surface) of the pressing slider 302. A ball screw 303, a drive motor 304 that rotates the ball screw 303 about its axis, an encoder 305 that detects the rotation of the drive motor 304, and the pressing slider 302 are supported so as to be rotatable about the Y-axis direction. And a pair of rotating shafts 306 and 306 disposed at the same height in the Z-axis direction and spaced apart by a predetermined distance Wx in the X-axis direction.

そして、上記移動手段300によると、駆動モータ304によってボールネジ303を回転させると、前記押圧用スライダ302がZ軸方向に沿って平行移動し、係る前記押圧用スライダ302の移動に伴って、前記一対の回転軸306,306が相対位置を保ったままZ軸方向、換言すれば、基板BSに離接する方向に平行移動する。
また、光照射手段(光源)400は、光軸をZ軸方向として下向きに光を照射し、かつ、Y軸方向(換言すれば、光触媒テープPHTの幅方向)において、光触媒テープPHTの幅の略中央が光軸となるように、前記押圧用スライダ302に取り付けられ、光照射手段(光源)400は、押圧用スライダ302のZ軸方向への移動に伴って上下動する。
According to the moving means 300, when the ball screw 303 is rotated by the drive motor 304, the pressing slider 302 moves in parallel along the Z-axis direction. As the pressing slider 302 moves, the pair of pairs The rotary shafts 306 and 306 move in parallel with each other in the Z-axis direction, in other words, in the direction of separating from and contacting the substrate BS.
The light irradiation means (light source) 400 emits light downward with the optical axis as the Z-axis direction, and the width of the photocatalytic tape PHT in the Y-axis direction (in other words, the width direction of the photocatalytic tape PHT). The light irradiating means (light source) 400 moves up and down as the pressing slider 302 moves in the Z-axis direction so that the optical center is the optical axis.

前記移送手段500は、X軸スライダ600にY軸方向に沿って取り付けた回転軸501,502と、光触媒テープPHT巻き取り用の巻取モータ503と、この巻取モータ503の回転軸503aに嵌合させたタイミングプーリ504と、回転軸502に嵌合させたタイミングプーリ505と、前記タイミングプーリ504とタイミングプーリ505との間に掛け渡したタイミングベルト506と、前記回転軸501に嵌合され異物除去に用いる光触媒テープPHTを予め巻き付けたテープリールR1と、前記回転軸502に嵌合され前記テープリールR1から引き出された光触媒テープPHTを巻き取るためのテープリールR2と、を備える。   The transfer means 500 is fitted to rotary shafts 501 and 502 attached to the X-axis slider 600 along the Y-axis direction, a winding motor 503 for winding the photocatalyst tape PHT, and a rotary shaft 503a of the winding motor 503. A combined timing pulley 504, a timing pulley 505 fitted to the rotary shaft 502, a timing belt 506 stretched between the timing pulley 504 and the timing pulley 505, and a foreign matter fitted to the rotary shaft 501 A tape reel R1 around which a photocatalytic tape PHT used for removal is wound in advance, and a tape reel R2 that is fitted onto the rotary shaft 502 and winds up the photocatalytic tape PHT drawn out from the tape reel R1.

ここで、X軸方向においてテープリールR1,R2で挟まれる領域よりも、前記一対の回転軸306,306が上下動する領域がZ軸方向の下側に設定されており、テープリールR1から引き出した光触媒テープPHTを前記一対の回転軸306,306の下側に掛けてテープリールR2に巻き取るようにすることで、テープリールR1からテープリールR2に向けての光触媒テープPHTの移送経路は、途中で基板BS側に張り出し、かつ、一対の回転軸306,306の間において、光触媒テープPHTは、基板BS表面と略平行に張り渡される。   Here, the region in which the pair of rotary shafts 306 and 306 move up and down is set to the lower side in the Z-axis direction than the region sandwiched between the tape reels R1 and R2 in the X-axis direction, and is pulled out from the tape reel R1. The photocatalyst tape PHT is hung on the lower side of the pair of rotating shafts 306 and 306 and wound around the tape reel R2, so that the transfer path of the photocatalyst tape PHT from the tape reel R1 to the tape reel R2 is: The photocatalyst tape PHT extends to the substrate BS side in the middle, and is stretched approximately parallel to the surface of the substrate BS between the pair of rotating shafts 306 and 306.

図3は、前記光触媒テープPHTの詳細な構造を示す。
前記光触媒テープPHTは、有機材料(例えばポリエチレンテレフタレートPETやポリイミドなど)によって形成したテープ状の基材BLと、該基材BLの片面に積層される無機材料で形成した保護層PLと、該保護層PL上に積層した酸化チタンTiO2などからなる光触媒層(光分解性触媒層)PHLとの3層構造を有し、基材BL及び保護層PLは、前記光照射手段(光源)400が照射する光(例えば紫外線)を透過する材質で形成される。そして、前記光触媒層PHL側の面が、基板BSに対向するように、前記移送手段500に装着される。
FIG. 3 shows a detailed structure of the photocatalytic tape PHT.
The photocatalytic tape PHT includes a tape-like base material BL formed of an organic material (for example, polyethylene terephthalate PET or polyimide), a protective layer PL formed of an inorganic material laminated on one surface of the base material BL, and the protection It has a three-layer structure with a photocatalyst layer (photodegradable catalyst layer) PHL made of titanium oxide TiO 2 or the like laminated on the layer PL, and the light irradiation means (light source) 400 includes the base BL and the protective layer PL. It is formed of a material that transmits the light to be irradiated (for example, ultraviolet rays). Then, the transfer means 500 is mounted so that the surface on the photocatalyst layer PHL side faces the substrate BS.

本実施形態のように、テープ状基材BLに有機材料を用いる場合には、テープ状基材BLに直接光触媒層PHLが接触すると、有機異物の除去のために前記光照射手段(光源)400から光を照射したときに、テープ状基材BLが光酸化によって分解されてしまうので、無機材料からなる保護層PLを、テープ状基材BLと光触媒層PHLとの間に挟んで、光触媒層PHLとテープ状基材BLとが直接に接しないようにしている。
従って、テープ状基材BLが無機材料で形成される場合には、保護層PLを設けずに、光触媒テープPHTを、テープ状基材BLと光触媒層PHLとの2層構造とすることができる。
When an organic material is used for the tape-shaped substrate BL as in this embodiment, when the photocatalyst layer PHL is in direct contact with the tape-shaped substrate BL, the light irradiation means (light source) 400 is used to remove organic foreign matters. Since the tape-like base material BL is decomposed by photo-oxidation when irradiated with light, a protective layer PL made of an inorganic material is sandwiched between the tape-like base material BL and the photocatalyst layer PHL, and the photocatalyst layer The PHL and the tape-like base material BL are not in direct contact with each other.
Therefore, when the tape-like base material BL is formed of an inorganic material, the photocatalytic tape PHT can have a two-layer structure of the tape-like base material BL and the photocatalytic layer PHL without providing the protective layer PL. .

前記光触媒層PHLは、蒸着、スパッタリングなどによって保護層PL(又はテープ状基材BL)上にコーティングさせることができる他、光触媒材料を含む塗料などを塗布コーティングしても良い。
また、光触媒層PHLの材料として酸化チタンを用いた場合には、波長が380nm以下の紫外領域で吸収光がピークを示すため、光照射手段(光源)400が照射する光を紫外線とすることが好ましいが、可視光域で作用する光触媒を用いてもよく、光照射手段(光源)400が照射する光の波長は、使用する光触媒の感光波長域とすればよい。
尚、基材BL及び保護層PLが、前記光照射手段(光源)400の照射光を透過する透過率は、少なくとも30%以上、好ましくは70%以上とするとよい。
The photocatalyst layer PHL can be coated on the protective layer PL (or tape-like substrate BL) by vapor deposition, sputtering, or the like, or a coating containing a photocatalyst material may be applied and coated.
In addition, when titanium oxide is used as the material of the photocatalyst layer PHL, the absorption light shows a peak in the ultraviolet region having a wavelength of 380 nm or less, so that the light irradiated by the light irradiation means (light source) 400 may be ultraviolet light. Although it is preferable, a photocatalyst that operates in the visible light region may be used, and the wavelength of the light irradiated by the light irradiation means (light source) 400 may be in the photosensitive wavelength region of the photocatalyst to be used.
In addition, the base material BL and the protective layer PL may transmit at least 30% or more, preferably 70% or more, through which the light irradiated from the light irradiation unit (light source) 400 is transmitted.

上記構成の基板用異物除去装置100を用いて、基板BS上の有機異物α(ごみや油など)を除去する作業手順を、図4を参照しつつ以下に説明する。
まず、予め光触媒テープPHTが巻き付けられたテープリールR1及び空のテープリールR2をそれぞれ回転軸501,502に嵌合させ、次いで、テープリールR1から光触媒テープPHTの端部を引き出し、引き出した光触媒テープPHTを一対の回転軸306,306の基板BS側に掛けて、テープリールR2のボス部分に係止する。
係る状態で、巻取モータ503を駆動させることで光触媒テープPHTに張力を加え、一対の回転軸306,306の間に光触媒テープPHTを張り渡す。
An operation procedure for removing organic foreign matters α (such as dust and oil) on the substrate BS using the substrate foreign matter removing apparatus 100 having the above configuration will be described below with reference to FIG.
First, the tape reel R1 and the empty tape reel R2 around which the photocatalytic tape PHT is wound are fitted to the rotary shafts 501 and 502, respectively, and then the end of the photocatalytic tape PHT is pulled out from the tape reel R1, and the photocatalytic tape pulled out is pulled out. The PHT is hung on the substrate BS side of the pair of rotating shafts 306 and 306 and locked to the boss portion of the tape reel R2.
In this state, the winding motor 503 is driven to apply tension to the photocatalytic tape PHT, and the photocatalytic tape PHT is stretched between the pair of rotating shafts 306 and 306.

上記のようにして、基板用異物除去装置100を準備すると、次いで、例えば前記X軸スライダ(ベースプレート)600に対して固定した撮影手段によって基板BSの表面を撮影し、撮影手段からの電気画像信号に基づいて基板BS表面の画像を、例えば除去装置100の操作卓に設けた表示装置に表示させる。
作業者は、前記表示装置に表示される基板BS表面の画像(拡大画像)を観察することで、基板BS上における有機異物αを特定し、当該有機異物αの中心に、撮像手段の光軸を一致させるように、撮影手段及び基板用異物除去装置100を一体的に、XY平面上で動かす(図4(a)参照)。
When the substrate foreign matter removing apparatus 100 is prepared as described above, then, for example, the surface of the substrate BS is photographed by the photographing means fixed to the X-axis slider (base plate) 600, and an electric image signal from the photographing means is obtained. For example, the image of the surface of the substrate BS is displayed on a display device provided on the console of the removal device 100, for example.
The operator identifies an organic foreign substance α on the substrate BS by observing an image (enlarged image) of the surface of the substrate BS displayed on the display device, and the optical axis of the imaging means is centered on the organic foreign substance α. Are moved together on the XY plane so as to coincide with each other (see FIG. 4A).

ここで、X軸スライダ(ベースプレート)600に撮影手段を固定した場合、撮影手段の光軸及び基板用異物除去装置100が有機異物の除去を行う領域の中心位置とのずれは既知であるから、撮像手段の光軸が有機異物αの中心に一致する状態から、基板用異物除去装置100が有機異物の除去を行う領域の中心位置を、前記有機異物αの中心に一致させるためのX軸スライダ(ベースプレート)600の移動量は既知である。
そこで、撮像手段の光軸が有機異物αの中心に一致する状態から、前記既知の移動量だけX軸スライダ600(撮影手段及び基板用異物除去装置100)を移動させることで、基板用異物除去装置100が有機異物の除去を行う領域の中心位置を、有機異物αの中心に一致させる。
Here, when the imaging unit is fixed to the X-axis slider (base plate) 600, the deviation between the optical axis of the imaging unit and the center position of the region where the substrate foreign matter removing apparatus 100 removes the organic foreign matter is known. From the state where the optical axis of the imaging means coincides with the center of the organic foreign matter α, the X-axis slider for making the center position of the region where the substrate foreign matter removing device 100 removes the organic foreign matter coincide with the center of the organic foreign matter α. The amount of movement of the (base plate) 600 is known.
Therefore, the substrate foreign matter removal is performed by moving the X-axis slider 600 (the photographing means and the substrate foreign matter removing apparatus 100) by the known movement amount from a state in which the optical axis of the imaging means coincides with the center of the organic foreign matter α. The center position of the region where the apparatus 100 removes the organic foreign matter is matched with the center of the organic foreign matter α.

基板用異物除去装置100が有機異物の除去を行う領域の中心位置とは、Y軸方向において光触媒テープPHTの幅方向の略中央で、かつ、X軸方向において前記一対の回転軸306の略中間である。
基板BS上の有機異物αの真上に、基板用異物除去装置100が有機異物の除去を行う領域の中心位置が移動すると、Z軸方向上側の初期位置に退避させておいた前記押圧用スライダ302を、駆動モータ304を回転駆動することで基板BSに近づくように降下させ、一対の回転軸306,306の間に張り渡されている光触媒テープPHTの光触媒層PHLを有機異物αに圧着させるようにする(図4(b)参照)。
The center position of the region where the substrate foreign matter removing apparatus 100 removes the organic foreign matter is substantially the center in the width direction of the photocatalytic tape PHT in the Y-axis direction, and substantially in the middle of the pair of rotating shafts 306 in the X-axis direction. It is.
When the center position of the area where the substrate foreign matter removing apparatus 100 removes the organic foreign matter moves directly above the organic foreign matter α on the substrate BS, the pressing slider that has been retracted to the initial position on the upper side in the Z-axis direction. 302 is lowered so as to approach the substrate BS by rotating the drive motor 304, and the photocatalyst layer PHL of the photocatalyst tape PHT stretched between the pair of rotary shafts 306 and 306 is pressed against the organic foreign matter α. (See FIG. 4B).

ここで、前記押圧用スライダ302の初期位置から基板BS表面までの距離は既知であり、エンコーダ305によって押圧用スライダ302の降下量(移動量)を検出できるので、光触媒テープPHTの光触媒層PHLを有機異物αに精度良く圧着させることができる。
尚、前記押圧用スライダ302(一対の回転軸306,306)を降下させるときに、光触媒テープPHTに加わる張力が増大することで、テープリールR1側からの光触媒テープPHTが新たに引き出され、光触媒テープPHTに加わる張力が過大にならないようにしてある。
Here, the distance from the initial position of the pressing slider 302 to the surface of the substrate BS is known, and the amount of movement (movement amount) of the pressing slider 302 can be detected by the encoder 305. Therefore, the photocatalytic layer PHL of the photocatalytic tape PHT is It is possible to accurately press the organic foreign matter α.
Note that when the pressing slider 302 (the pair of rotating shafts 306 and 306) is lowered, the tension applied to the photocatalyst tape PHT increases, so that the photocatalyst tape PHT from the tape reel R1 side is newly drawn out, and the photocatalyst. The tension applied to the tape PHT is prevented from becoming excessive.

光触媒テープPHTの光触媒層PHLを有機異物αに圧着させると、次いで、光照射手段400(光源)を動作させて、光触媒テープPHTの有機異物αに圧着されている部分の反対面側(テープ状の基材BL側)に、予め設定された強度の光を所定時間だけ照射させる(図4(c)参照)。
前記光の強度及び/又は照射時間は、有機異物αの大きさ、例えば、有機異物αの高さや有機異物αのXY平面上における面積や有機異物αの容積(高さ及び面積)などに応じて変更することができる。
When the photocatalyst layer PHL of the photocatalyst tape PHT is pressure-bonded to the organic foreign matter α, the light irradiation means 400 (light source) is then operated to oppose the portion of the photocatalyst tape PHT that is pressure-bonded to the organic foreign matter α (tape shape). Is irradiated with light having a preset intensity for a predetermined time (see FIG. 4C).
The intensity of the light and / or the irradiation time depends on the size of the organic foreign matter α, for example, the height of the organic foreign matter α, the area of the organic foreign matter α on the XY plane, the volume (height and area) of the organic foreign matter α, and the like. Can be changed.

光触媒テープPHTの基材BL側に照射された光は、基材BL及び保護層PLを透過して光触媒層PHLに到達し、光触媒層PHLが光を吸収することで、励起電子と正孔ができるが、励起電子は空気中の酸素に移動することで、残った正孔による酸化反応が進み、有機異物αを酸化する。
光触媒層PHLによる酸化によって、有機異物αは水や二酸化炭素などにガス化され、これらの酸化分解による生成物が周囲に放散することで、有機異物αの除去が完了する(図4(d)。
The light irradiated to the substrate BL side of the photocatalytic tape PHT passes through the substrate BL and the protective layer PL and reaches the photocatalyst layer PHL, and the photocatalyst layer PHL absorbs light, so that excited electrons and holes are absorbed. However, the excited electrons move to oxygen in the air, so that the oxidation reaction by the remaining holes proceeds to oxidize the organic foreign matter α.
Oxidation by the photocatalyst layer PHL gasifies the organic foreign matter α into water, carbon dioxide, and the like, and the products resulting from these oxidative decompositions diffuse to the surroundings, thereby completing the removal of the organic foreign matter α (FIG. 4D). .

有機異物αの除去が完了すると、前記巻取モータ503を駆動させてテープリールR2側に光触媒テープPHTを巻き取らせながら、押圧用スライダ302を上昇させることで、押圧用スライダ302の上昇に伴って光触媒テープPHTが弛むことを抑止しつつ、光触媒テープPHTのうち、有機異物αの除去に用いた部分をテープリールR2側に巻き取らせ、代わりに、テープリールR1側から新たに未使用の部分を送り出すようにする。   When the removal of the organic foreign matter α is completed, the winding slider 503 is lifted while driving the winding motor 503 to wind the photocatalytic tape PHT on the tape reel R2 side. The portion of the photocatalyst tape PHT used to remove the organic foreign matter α is wound around the tape reel R2 side while the photocatalyst tape PHT is prevented from loosening. Instead, the unused portion is newly used from the tape reel R1 side. Try to send out the part.

これにより、今回有機異物αの除去に用いた光触媒テープPHTの領域(光の照射領域)が、次回の除去に再度用いられることが回避し、テープリールR1側から新たに送り出された未使用の部分を、次回の除去に用いるようにする。
尚、有機異物αの除去に用いる部分の入れ替えのために、押圧用スライダ302が上側の初期位置まで上昇した後も、前記巻取モータ503の駆動を継続させて、テープリールR2に対する光触媒テープPHTの巻き取りを継続させ、同時に、テープリールR1側から未使用の光触媒テープPHTを送り出すようにできる。
Thereby, it is avoided that the region (light irradiation region) of the photocatalyst tape PHT used for the removal of the organic foreign matter α this time is used again for the next removal, and the unused unused newly fed out from the tape reel R1 side. The part is used for the next removal.
In order to replace the portion used for removing the organic foreign matter α, the drive of the winding motor 503 is continued even after the pressing slider 302 is raised to the upper initial position, and the photocatalytic tape PHT with respect to the tape reel R2 is continued. Can be continued, and at the same time, the unused photocatalytic tape PHT can be sent out from the tape reel R1 side.

上記の基板用異物除去装置100によると、光触媒の酸化作用によって有機異物αを酸化分解して除去するので、仮に異物の分解除去が完了した後も光を照射し続けたとしても、この光の照射によって基板BSが損傷することがなく、有機異物αの除去を良好に行わせつつ基板BSの損傷を未然に防止できる。
また、光触媒による有機物の酸化分解では、有機物が水や二酸化炭素に酸化分解されるため、除去作業後に基板BSの表面に異物の屑が残ってしまうことがなく、有機異物αが付着していた部分の周辺を屑で汚してしまうことがない。
According to the substrate foreign matter removing apparatus 100 described above, the organic foreign matter α is oxidatively decomposed and removed by the oxidizing action of the photocatalyst. Even if the light is continuously irradiated after the foreign matter is completely decomposed and removed, Irradiation does not damage the substrate BS, and the substrate BS can be prevented from being damaged while the organic foreign matter α is removed well.
Further, in the oxidative decomposition of the organic substance by the photocatalyst, the organic substance is oxidatively decomposed into water and carbon dioxide, so that the foreign substance waste does not remain on the surface of the substrate BS after the removal operation, and the organic foreign substance α is adhered. The periphery of the part is not soiled with rubbish.

また、光触媒テープPHTの基材BLを、有機材料で形成しても、無機の保護層PLを挟んで光触媒層PHLを積層することで、基材BLが光酸化によって分解されてしまうことを回避でき、有機材料の基材BLを用いる光触媒テープPHTであっても、安定して有機異物αの除去に用いることができる。
更に、上記の移送手段500によって、光触媒テープPHTのうち有機異物αの除去に用いる部分を、除去動作毎に使用済みの部分から未使用の部分に入れ替え、有機異物αの除去を毎回光触媒テープPHTの未使用部分を用いて行うので、有機異物αの除去性能を安定して維持できる。
Moreover, even if the base material BL of the photocatalytic tape PHT is formed of an organic material, the base material BL is prevented from being decomposed by photooxidation by laminating the photocatalytic layer PHL with the inorganic protective layer PL interposed therebetween. Even the photocatalytic tape PHT using the organic material base BL can be stably used for removing the organic foreign matter α.
Further, the transfer means 500 replaces the portion of the photocatalyst tape PHT used for removing the organic foreign matter α from the used portion for each removal operation to the unused portion, and removes the organic foreign matter α every time the photocatalytic tape PHT is removed. Thus, the removal performance of the organic foreign matter α can be stably maintained.

本実施形態では、移動手段300を構成する回転軸306をZ軸方向に平行移動させたが、移動方向をZ軸方向に限定するものではなく、例えば、回転軸306が円弧状に平行移動して光触媒テープPHTを有機異物αに接触させることができる。
また、一対の回転軸306,306を同時に一定の相対位置を保ちながら動かす必要はなく、一方を固定した状態で他方のみを動かしたりすることができる。
In this embodiment, the rotating shaft 306 constituting the moving unit 300 is translated in the Z-axis direction, but the moving direction is not limited to the Z-axis direction. For example, the rotating shaft 306 is translated in an arc shape. Thus, the photocatalytic tape PHT can be brought into contact with the organic foreign matter α.
In addition, it is not necessary to move the pair of rotating shafts 306 and 306 at the same time while maintaining a certain relative position, and it is possible to move only the other while the one is fixed.

また、光触媒体を光触媒テープPHTに限定するものではなく、例えば、シート状基材に光触媒をコーティングしたシート状の光触媒体を枠部材に張り付け、前記枠部材を把持して基板に押し当てるようにすることができる。
また、弾性を有するシート状の光触媒体を、基板の上方に枠部材に張り付けた状態で固定しておき、有機異物αの周囲を囲む開口形状の筒状押し付け部材を、筒状内に有機異物が位置するように、XY軸方向に位置決めした上で、シート状の光触媒体の反基板BS側から押し付けることで、シート状の光触媒体の前記筒状押し付け部材内に相当する部分を下方に向けて突出させ、この突出部分を基板BS上の有機異物αに接触させるようにすることができる。ここで、前記筒状押し付け部材の内部空間に光照射手段(光源)400を設置させることができる。
Further, the photocatalyst is not limited to the photocatalyst tape PHT. For example, a sheet-like photocatalyst coated with a photocatalyst on a sheet-like base material is attached to the frame member, and the frame member is held and pressed against the substrate. can do.
In addition, an elastic sheet-like photocatalyst body is fixed in a state of being attached to the frame member above the substrate, and an opening-shaped cylindrical pressing member surrounding the periphery of the organic foreign matter α is placed inside the cylindrical shape. The sheet-like photocatalyst body is pressed from the side opposite to the substrate BS after being positioned in the XY-axis direction so that the portion corresponding to the cylindrical pressing member of the sheet-like photocatalyst body faces downward. The protruding portion can be brought into contact with the organic foreign matter α on the substrate BS. Here, the light irradiation means (light source) 400 can be installed in the internal space of the cylindrical pressing member.

また、上記実施形態では、移動手段300が光触媒テープPHT(光触媒体)を基板BSに向けて移動させた構成としたが、基板BSを光触媒テープPHT(光触媒体)に向けて移動させることができる。
例えば、図1,2に示した回転軸306,306のZ軸方向の位置を固定する一方、基板BSを光触媒テープPHTに向けてリフトさせるリフト機構(移動手段)を設け、基板BSを上方に向けて平行移動させることで、基板BS上の有機異物αを、光触媒テープPHT(光触媒体)に接触させることができる。
In the above embodiment, the moving means 300 is configured to move the photocatalyst tape PHT (photocatalyst body) toward the substrate BS. However, the substrate BS can be moved toward the photocatalyst tape PHT (photocatalyst body). .
For example, while the positions of the rotating shafts 306 and 306 shown in FIGS. 1 and 2 are fixed in the Z-axis direction, a lift mechanism (moving means) that lifts the substrate BS toward the photocatalytic tape PHT is provided, and the substrate BS is moved upward. The organic foreign matter α on the substrate BS can be brought into contact with the photocatalyst tape PHT (photocatalyst body) by being moved in parallel.

更に、光触媒テープPHT(光触媒体)を基板BSに近づけると共に、基板BSを光触媒テープPHT(光触媒体)に近づけて、光触媒テープPHT(光触媒体)と基板BS上の有機異物αとを接触させることができる。
また、光触媒テープPHT(光触媒体)を基板BS上の有機異物αに圧着させるときの圧着力を、バネやゴムなどの弾性部材の弾性復帰力を用いて得ることができ、例えば、弾性を有する材料で形成した押圧部材で前記光触媒テープPHTの基材BL側を基板BSに向けて押し付けたり、弾性部材を介して支持した押圧部材で前記光触媒テープPHTの基材BL側を基板BSに向けて押し付けたりすることで、光触媒テープPHTの光触媒層PHLを、基板BS上の有機異物αに圧着させる構成とすることができる。
また、光照射手段400が、ミラーやレンズや光ファイバーなどの光学部品を介して光触媒に光を照射する構成とすることができる。
Further, the photocatalyst tape PHT (photocatalyst) is brought close to the substrate BS, and the substrate BS is brought close to the photocatalyst tape PHT (photocatalyst) to bring the photocatalyst tape PHT (photocatalyst) into contact with the organic foreign matter α on the substrate BS. Can do.
Moreover, the pressure-bonding force when the photocatalyst tape PHT (photocatalyst body) is pressure-bonded to the organic foreign matter α on the substrate BS can be obtained by using the elastic restoring force of an elastic member such as a spring or rubber, and has elasticity, for example. The base member BL side of the photocatalytic tape PHT is pressed toward the substrate BS with a pressing member formed of a material, or the base member BL side of the photocatalytic tape PHT is directed toward the substrate BS with a pressing member supported via an elastic member. By pressing, the photocatalytic layer PHL of the photocatalytic tape PHT can be pressed against the organic foreign substance α on the substrate BS.
Further, the light irradiation means 400 may be configured to irradiate the photocatalyst with light via an optical component such as a mirror, a lens, or an optical fiber.

100…基板用異物除去装置
200…テーブル
300…移動手段
302…押圧用スライダ
306…回転軸
400…光照射手段
500…移送手段
600…X軸スライダ
α…有機異物
BS…基板
PHT…光触媒テープ
BL…基材
PL…保護層
PHL…光触媒層
DESCRIPTION OF SYMBOLS 100 ... Substrate foreign material removal apparatus 200 ... Table 300 ... Moving means 302 ... Pressing slider 306 ... Rotating shaft 400 ... Light irradiation means 500 ... Transfer means 600 ... X-axis slider α ... Organic foreign matter BS ... Substrate PHT ... Photocatalytic tape BL ... Base material PL ... Protective layer PHL ... Photocatalyst layer

Claims (3)

基板上の異物を除去する基板用異物除去装置であって、
基材に光触媒をコーティングした光触媒テープと、
一対の回転軸の間に前記基板の表面と略平行に張り渡された前記光触媒テープを前記基板に対して離接する方向に移動させ、前記光触媒テープの光触媒層を前記基板上の異物に対して接触させる移動手段と、
前記異物に接触した前記光触媒層に対して光を照射する光照射手段と、
を備え、
前記一対の回転軸の離間距離を前記基板の幅よりも長く設定し、前記移動手段は、前記一対の回転軸と前記光照射手段とを一体として前記基板に対して離接する方向に移動させる、基板用異物除去装置。
A foreign matter removing device for a substrate that removes foreign matter on a substrate,
A photocatalytic tape having a substrate coated with a photocatalyst;
Moving the surface and the photocatalyst tape substantially been stretched parallel of the substrate in a direction in contact away to the substrate between the pair of rotating shafts, the photocatalytic layer of the photocatalyst tape against foreign matter on the substrate Moving means to contact;
A light irradiation means for irradiating light to the photocatalyst layer in contact with the foreign matter;
With
The separation distance between the pair of rotating shafts is set longer than the width of the substrate, and the moving means moves the pair of rotating shafts and the light irradiating means together in a direction in contact with and away from the substrate. Foreign material removal device for substrates.
前記一対の回転軸及び前記光照射手段を前記基板に対して離接する方向に移動可能に支持するベースプレートに、前記基板を撮影する撮影手段を備え、前記ベースプレートは、前記基板の表面と平行な平面上を移動可能に支持される、請求項1記載の基板用異物除去装置。 An imaging means for imaging the substrate is provided on a base plate that supports the pair of rotating shafts and the light irradiating means so as to be movable away from and in contact with the substrate, and the base plate is a plane parallel to the surface of the substrate. The foreign matter removing apparatus for a substrate according to claim 1 , which is movably supported on the top . 基板上の異物を除去する方法であって、A method for removing foreign matter on a substrate,
前記基板の幅よりも長い離間距離で配置した一対の回転軸の間に、基材に光触媒をコーティングした光触媒テープを前記基板の表面と略平行に張り渡し、Between a pair of rotating shafts arranged at a separation distance longer than the width of the substrate, a photocatalytic tape having a base material coated with a photocatalyst is stretched substantially parallel to the surface of the substrate,
前記一対の回転軸と光照射手段とを一体として前記基板に対して離接する方向に移動させて、前記光触媒テープの光触媒層を前記基板上の異物に対して接触させ、The pair of rotating shafts and the light irradiation means are integrally moved in a direction to be separated from and contacted with the substrate, and the photocatalytic layer of the photocatalytic tape is brought into contact with the foreign matter on the substrate,
異物に接触した前記光触媒テープの光触媒層に前記光照射手段により光を照射する、基板用異物除去方法。A substrate foreign matter removing method of irradiating light on the photocatalyst layer of the photocatalyst tape in contact with foreign matter by the light irradiating means.
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