JP5591382B2 - Soldering device - Google Patents

Description

  The present invention relates to a soldering apparatus, and more particularly to a jet-type soldering apparatus that solders components to be mounted on a circuit board from the back side of the circuit board by a jet of solder.

  2. Description of the Related Art Conventionally, methods for performing post soldering on electronic components or the like attached to a through hole of a circuit board include a dip method, a flow method, a nozzle method, and the like as methods for performing soldering collectively. Further, as a method of partially dividing the circuit board and partially soldering the components, there are a trowel type (manual and automatic by a robot), a laser type and a multi-nozzle type. The former method can perform soldering in a short time because the components are soldered together, but requires a large solder bath, which consumes a large amount of energy and requires a large installation space. In the latter method, the apparatus is small and the energy consumption is small. However, since the soldering is partial, it takes time and the productivity is poor.

  As a countermeasure against global warming in recent years, there is a pot type soldering method as a soldering apparatus that can save energy and ensure productivity, and can reduce the size of the apparatus. It is disclosed.

  The soldering device disclosed in Patent Document 1 includes a pressure chamber in which an overflow nozzle projects toward the opening side of the plating solution tank at the center of the plating solution tank surrounded by the heating sleeve, and is compressed into the pressure chamber. Soldering is performed with solder that overflows from the overflow nozzle by returning air and returns to the plating bath. When the solder in the pressure chamber runs out, when the supply of compressed air is stopped, the check valve provided at the bottom of the pressure chamber opens, and the solder that has returned to the plating bath returns to the pressure chamber through the check valve. It is like that.

  In the soldering device disclosed in Patent Document 2, a solder storage tank having a heater at the bottom and a solder recovery tank in which a feed pipe having a discharge port is connected to the bottom of the storage tank are installed in parallel. When pressurized air is sent from above the storage tank, the solder in the storage tank is sent to the solder collection tank side through the feed pipe, and soldering is performed with the solder overflowing from the discharge port. After the soldering is completed, when the pressurized air is shut off, the solder in the solder recovery tank returns to the storage tank through the return pipe due to the difference in the solder liquid level.

JP 59-147772 (FIG. 1)

JP 2006-116601 A (FIGS. 1 to 4)

  However, in the soldering apparatuses disclosed in Patent Documents 1 and 2, since there is no means for detecting even if the amount of solder is reduced by soldering, it is necessary to constantly monitor the amount of solder visually. there were.

  The present invention provides a soldering apparatus capable of solving the problems of the conventional soldering apparatus, collecting the solder that has been soldered, and detecting and notifying a decrease in the amount of the collected solder. For the purpose.

The soldering device of the present invention that achieves the above object includes a solder storage part having a sealed space in a state where the solder is stored, a nozzle for solder ejection whose upper end passes through the ceiling wall of the solder storage part, and a gas in the sealed space. Solder recovery that has a gas injection port for injecting, a communication port that communicates with the solder reservoir, and a check valve that opens and closes the communication port, and that collects solder ejected from the nozzle by opening the communication port in the solder reservoir The amount of solder, including the solder in the solder recovery part and the solder in the solder storage part , is detected by detecting the solder liquid level in the solder recovery part with the check valve open to the communication port. A soldering apparatus comprising: a solder storage amount shortage detecting means for detecting.

  According to the present invention, the solder after soldering is collected in the solder storage part, and the lack of solder storage amount is detected by detecting the liquid level of the solder collected in the solder storage part, and the solder liquid in the solder storage part is detected. Since the solder storage amount shortage can be notified when the position becomes less than the specified value, it is possible to prevent the soldering failure due to the shortage of the solder amount and to perform the soldering operation smoothly.

It is a perspective view which shows the structure of the soldering apparatus which concerns on one Example of this invention. It is a disassembled perspective view of the soldering apparatus shown in FIG. 1A is a cross-sectional view of the soldering apparatus shown in FIG. 1 in the short-side direction, and FIG. 1B is a configuration of an example of a heater arrangement and a check valve driving apparatus built in the soldering apparatus shown in FIG. It is explanatory drawing which shows the connection with these control apparatuses. (A) to (d) is a diagram showing the operation of the soldering apparatus shown in FIG. (A) is a figure which shows the soldering method by the conventional soldering apparatus, (b) is a figure which shows the soldering method by the soldering apparatus shown in FIG. (A) is a block diagram which shows the structure of the detection apparatus of the residual amount of solder in a soldering apparatus with the electrode provided in the valve shaft of the non-return valve of the soldering apparatus shown in FIG. 1, (b) is (a). It is a block diagram explaining the state which issues a warning when the remaining amount detection device of the solder is low in solder. (A) is a fragmentary perspective view which shows the structure of the modification Example of the soldering apparatus shown in FIG. 1, (b) is a fragmentary perspective view which shows the structure of the other Example of the soldering apparatus based on this invention. It is a block diagram which shows the structure of the 1st form of the automatic soldering apparatus which mounts the soldering apparatus shown in FIG. It is a block diagram which shows the structure of the 2nd form of the automatic soldering apparatus which combined and mounted the soldering apparatus shown in FIG.1 and FIG.7 (b).

  Hereinafter, embodiments of the present invention will be described in detail based on specific examples with reference to the accompanying drawings.

  FIG. 1 shows an overall configuration of a soldering apparatus 100 according to an embodiment of the present invention, and FIG. 2 is an exploded view in order to make the configuration of the soldering apparatus 100 of FIG. 1 easier to understand. It is shown. The soldering device 100 of this embodiment is roughly divided into a soldering device main body 1 having an upper surface opened to store solder for soldering, and a solder reservoir 2 provided inside the soldering device main body 1. And a solder collecting unit 3 for collecting the solder.

  As shown in FIG. 2, the soldering apparatus main body 1 has a rectangular parallelepiped shape with an open top surface, and includes a bottom surface 16, a lateral side wall 11, and a longitudinal side wall 12. The side walls 11 and 12 and the bottom surface 16 have built-in heaters for solder heating. The configuration of the heater will be described later. A gas inlet 6 for introducing a compressed gas into the soldering apparatus main body 1 is provided at a high position on one side wall 11 in the short direction. The position of the gas inlet 6 is set at a position higher than the maximum solder liquid level in the solder reservoir 2. On the inner peripheral surfaces of the side walls 11 and 12, there are mounting surfaces 13, 14, and 15 for mounting a ceiling wall of the solder reservoir 2 described later at a position higher than the gas inlet 6 described above. Here, the mounting surface on the gas inlet 6 side of the side wall 11 in the short direction is the first ceiling wall mounting surface 13, the mounting surface on the opposite side wall 11 is the second ceiling wall mounting surface 14, and the longitudinal direction. A mounting surface provided to face the side wall 12 of the first ceiling wall is a third ceiling wall mounting surface 15.

  In this embodiment, in order to incline the ceiling wall 20 of the solder reservoir 2, the second ceiling wall mounting surface 14 is larger than the depth of the first ceiling wall mounting surface 13 from the opening of the soldering apparatus body 1. The depth from the opening of the soldering device main body 1 is made deeper. Accordingly, the third ceiling wall mounting surface 15 is inclined from the first ceiling wall mounting surface 13 toward the second ceiling wall mounting surface 14.

  The ceiling wall 20 of the solder reservoir 2 is attached to the first ceiling wall attachment surface 13, the second ceiling wall attachment surface 14, and the third ceiling wall attachment surface 15 so that the inside is airtight, In this embodiment, the portion between 20 and the inner peripheral surface of the soldering apparatus main body 1 becomes the solder storage portion 2. That is, in this embodiment, the bottom surface 16 and the side walls 11 and 12 of the solder reservoir 2 are common to the bottom surface 16 and the side walls 11 and 12 of the soldering apparatus body 1. The ceiling wall 20 attached to the attachment surfaces 13, 14, 15 so as to be airtight inside is inclined from the first ceiling wall attachment surface 13 toward the second ceiling wall attachment surface 14.

  On the other hand, in the portion of the ceiling wall 20 on the gas inlet 6 side, the upper end side penetrates the ceiling wall 20 and protrudes to the opening side of the soldering apparatus body 1, and the lower end side is extended to a position away from the bottom surface 16 by a predetermined distance. There is a nozzle 4. The nozzle 4 of this embodiment is a rectangular cylinder that is elongated in the longitudinal direction of the ceiling wall 20, is attached to the ceiling wall 20 in a direction perpendicular to the bottom surface 16, and the top surface of the nozzle 4 is solder sprayed. Exit 40. The width of the nozzle 4 in the short direction is shorter than the width of the ceiling wall 20 in the short direction. Further, the solder ejection port 40 is provided so as to protrude to a position higher than the opening of the soldering apparatus main body 1.

  Further, the ceiling wall 20 on the second ceiling wall mounting surface 14 side has a solder recovery portion 3 formed by recessing the ceiling wall 20. In this embodiment, the solder recovery part 3 has a rectangular parallelepiped shape, and its bottom part 30 is located higher than the bottom face 16 of the soldering apparatus main body 1. A communication port 31 to the solder storage unit 2 is provided at the bottom 30 of the solder recovery unit 3, and the communication hole 31 can be opened and closed by a check valve 5. The communication hole 31 is in the shape of a truncated cone whose diameter on the solder reservoir 2 side is smaller than the diameter on the solder recovery unit 3 side, and this communication hole 31 includes a checkered valve body 52 of the same shape. 5 is liquid-tightly sealed. The valve shaft 51 connected to the valve body 52 can be driven by a driving device provided outside the soldering device main body 1. The drive device will be described later. The solder flowing out from the nozzle 4 and reaching the ceiling wall 20 flows on the ceiling wall 20 inclined toward the solder collecting unit 3 and flows into the solder collecting unit 3, so that a solder return pipe is unnecessary.

  3A shows a cross section in the short direction of the soldering apparatus 100 shown in FIG. 1, and FIG. 3B shows the heater 7 incorporated in the soldering apparatus 100 shown in FIG. The arrangement and the configuration of an example of the driving device 50 of the check valve 5 and the connection with these control devices 10 are shown. First, the configuration of the heater 7 that melts the solder in the soldering apparatus 100 will be described, and then the configuration of the driving device 50 of the check valve 5 will be described.

  A plurality of heaters 7 are wound in the horizontal direction on the side walls 11 and 12 of the soldering apparatus main body 1 with different vertical heights. A heater 7 is also built in the bottom surface 16 of the soldering apparatus main body 1. Further, a temperature sensor 8 for detecting the solder temperature is built in the side wall 11 of the soldering apparatus body 1, and the temperature of the solder detected by the temperature sensor 8 is input to the control device 10.

  The electrodes of each heater 7 are connected to a power source 70 through a switch circuit 71 so that energization of each heater 7 can be performed independently. The switch circuit 71 includes a switch that can turn on and off each heater 7 independently. The switch is turned on and off by the control device 10 that can detect the temperature of the solder. If the heater 7 can be controlled to be energized independently, the energization timing of each heater 7 is changed when energizing the cold soldering apparatus, so that the solder on the upper side of the soldering apparatus main body 1 is moved forward. The solder on the bottom side of the soldering apparatus main body 1 can be sequentially melted. As a result, it is possible to prevent solder explosion that occurs when the solder on the bottom side of the soldering apparatus main body 1 is first melted and boiled, and the solder that is not yet melted on the upper side is pushed up.

  Next, the configuration of the drive device 50 for the check valve 5 will be described with reference to FIG. In this embodiment, a plunger 53 is attached to the end of the valve shaft 51 of the check valve 5. A frame 56 is attached to the side wall 11 of the soldering apparatus main body 1, and a spring 55 that presses the plunger 53 and a solenoid 54 that sucks the plunger 53 are built in the frame 56. Energization of the solenoid 54 is performed by the control device 10. When the solenoid 54 is not energized, the valve shaft 51 is biased by the spring 55, so that the check valve 5 is closed. On the other hand, when the solenoid 54 is energized, the plunger 53 is attracted by the solenoid 54, and the plunger 53 pushes and contracts the spring 55 and moves toward the solenoid 54. Therefore, the valve shaft 51 moves upward, and the check valve 5 opens.

  As a drive device for the check valve 5, a lever type manual opening / closing of the check valve 5 is also possible. Thus, since the check valve 5 of the soldering apparatus 100 of the present invention is opened and closed by a mechanical configuration, the operation is reliable.

  Here, a soldering operation using the soldering apparatus 100 of the present invention configured as described above will be described with reference to schematic configuration diagrams shown in FIGS. FIG. 4A shows the soldering apparatus 100 before performing soldering. In addition, illustration of the heater and the drive device of the check valve 5 is omitted. In this example, an air pump 60 is connected to the gas inlet 6 as a gas supply source. In this embodiment, the gas supply source is an air pump, but high-pressure nitrogen gas can also be supplied from a nitrogen cylinder. When nitrogen gas is used, oxygen in the solder reservoir 2 disappears, and solder oxidation can be prevented.

  In the state of FIG. 4A, a heater (not shown) is energized to melt the solder 9. In this state, the check valve 5 is open, and the solder storage part 2 and the solder recovery part 3 communicate with each other through the communication hole 31. When soldering is performed after the solder 9 is melted, the check valve 5 is closed and the solder reservoir 2 is sealed. Next, the air pump 60 is driven to send compressed air from the gas inlet 6 into the solder reservoir 2. When the pressure (gas pressure) of the gas inside the solder reservoir 2 increases, the solder 9 in the solder reservoir 2 is pushed by this gas pressure, the solder 9 rises in the nozzle 4 and the solder jet port of the nozzle 4 40 erupts. This state is the state shown in FIG. The solder 9 ejected from the solder ejection port 40 of the nozzle 4 flows into the solder recovery unit 3 along the inclined ceiling wall 20. If it will be in this state, the circuit board 80 with which the electronic component 81 provided with the leg part 82 which wants to perform soldering was mounted will be brought close to the solder outlet 40, and soldering can be performed.

  In FIG. 4C, the circuit board 80 on which the electronic component 81 having the leg portion 82 to be soldered is mounted is brought into contact with the solder 9 ejected from the solder ejection port 40, and the leg portion 82 is soldered. It shows the state of being. The solder 9 ejected from the solder ejection port 40 of the nozzle 4 and soldered to the leg portion 82 of the circuit board 80 flows along the inclined ceiling wall 20 into the solder collecting portion 3 and is collected. When the soldering of the leg portion 82 of the circuit board 80 is finished, the operation of the air pump 60 is stopped and the check valve 5 is opened. Then, the solder 9 stored in the solder recovery part 3 returns to the solder storage part 2 through the communication hole 31, and the state shown in FIG. This state is the same as the state shown in FIG. 4A, and when soldering is performed again, the operations shown in FIGS. 4A to 4C are repeated.

  FIG. 5A is a diagram illustrating a soldering method using a conventional soldering apparatus. Many of the nozzles 4 of the conventional soldering apparatus have a cylindrical shape or a rectangular tube shape, and the amount of solder 9 ejected from the nozzle 4 is small. For this reason, in order to solder the leg portions 82 of the electronic component 81 having a large number of leg portions 82 mounted on the circuit board 80, the circuit board 80 is moved over the nozzle 4 along the direction in which the leg portions 82 are arranged. It was difficult to move the circuit board 80 so as not to be detached from the nozzle 4.

  On the other hand, in the soldering apparatus 100 of the present invention described above, the nozzle 4 has a predetermined width and a certain length. Therefore, as shown in FIG. The amount of solder 9 ejected from the outlet 40 is large, and the shape of the ejected solder is horizontally long and has a predetermined area. For this reason, when soldering the leg portions of the electronic component 81 having a large number of leg portions 82 mounted on the circuit board 80, the portion where the leg portions 82 of the circuit board 80 are arranged is soldered from above the nozzle 4. Since it is only necessary to touch the spout 40, the soldering operation can be performed easily and the soldering time can be shortened. Moreover, if the area of the solder jet port 40 of the nozzle 4 is large, the range of products to be soldered is widened.

  Next, the configuration and operation of an example of the solder storage shortage detection device 77 provided in the soldering apparatus 100 of the present invention will be described with reference to FIGS. 6 (a) and 6 (b). The solder storage shortage detection device 77 detects when the solder 9 in the soldering device 100 runs short. The solder reservoir shortage detection device 77 is a liquid level detection electrode 73 attached to a predetermined portion of the valve shaft 51 of the check valve 5 via an insulator 72, and a lead wire 78 for taking out the detection output of the liquid level detection electrode 73 to the outside. The alarm device 74 is connected to the lead wire 78, the lamp 75 is turned on when the liquid level is normal, and the battery 76. One electrode of the battery 76 is connected to the outer wall surface of the soldering apparatus main body 1. The position at which the liquid level detection electrode 73 is attached to the valve shaft 51 is a position that is exposed when the amount of solder 9 in the soldering apparatus 100 is insufficient.

  When the amount of solder 9 in the soldering apparatus 100 is sufficient, the liquid level detection electrode 73 is positioned in the solder 9 with the check valve 5 opened as shown in FIG. In this state, the liquid level detection electrode 73 is connected to one electrode of the battery 76 through the solder 9 and the outer wall surface of the soldering apparatus main body 1. For this reason, the alarm 74 and the lamp 75 are energized by the battery 76 and the alarm 74 is silent, but the lamp 75 is lit to indicate that the residual liquid level of the solder is in a normal state.

  On the other hand, when the amount of the solder 9 in the soldering apparatus 100 is insufficient, the liquid level detection electrode 73 is lower than the liquid level of the solder 9 with the check valve 5 opened as shown in FIG. On top and exposed in the air. In this state, the liquid level detection electrode 73 is not connected to one electrode of the battery 76 through the solder 9. Therefore, the continuity between the alarm 74 and the lamp 75 and the battery 76 is lost, the lamp 75 is turned off to indicate that the residual liquid level of the solder is not in a normal state, and an alarm is issued from the alarm 74. The soldering operator can know the shortage of the amount of solder 9 in the soldering apparatus 100 by this warning and the lamp 75 being extinguished. Therefore, by replenishing the solder 9, the soldering operation can be performed smoothly thereafter. it can.

  FIG. 7A shows a configuration of a soldering apparatus 101 according to a modified example of the soldering apparatus 100 according to the embodiment shown in FIG. The configuration of the soldering device main body 1 of the soldering device 101 of the modified embodiment may be the same as the configuration of the soldering device main body 1 of the embodiment shown in FIG. Further, in the configuration of the ceiling wall 20 of the solder reservoir 2 of the soldering apparatus 101 of the modified embodiment, the same components as those of the embodiment shown in FIG. Only the part is explained.

  The portion of the ceiling wall 20 of the solder reservoir 2 of the soldering apparatus 101 of the modified embodiment that is different from the ceiling wall 20 of the solder reservoir 2 of the embodiment shown in FIG. 2 is the shape of the nozzle 4A. The nozzle 4 of the soldering apparatus 100 according to an embodiment is a rectangular cylinder that is elongated in the longitudinal direction of the ceiling wall 20, and has a single solder ejection port 40 on the top surface of the nozzle 4. On the other hand, the nozzle 4A of the soldering apparatus 101 according to the modified embodiment has two solder ejection ports 41 and 42 on the top surface of the nozzle 4A. The two solder spouts 41 and 42 are separated by a gap 44. The width in the short direction, the length in the longitudinal direction, and the length in the vertical direction of the nozzle 4 </ b> A may be the same as those of the nozzle 4. Further, the position of the gap portion 44 is not particularly defined, and the nozzle 4A having a different position of the gap portion 44 can be made according to the product to be soldered. In the soldering apparatus 101 of the modified embodiment, two types of electronic components having different mounting positions on the board can be soldered simultaneously.

  FIG. 7B shows a configuration of a soldering apparatus 102 of another embodiment of the soldering apparatus 100 of the embodiment shown in FIG. The configuration of the soldering device main body 1 of the soldering device 102 according to another embodiment may be the same as the configuration of the soldering device main body 1 according to the embodiment shown in FIG. Moreover, in the structure of the ceiling wall 20 of the solder storage part 2 of the soldering apparatus 102 of another Example, the same code | symbol is attached | subjected to the same component as one Example shown in FIG. 2, and the description is abbreviate | omitted. Only the differences will be described.

  The configuration of the ceiling wall 20 of the solder reservoir 2 of the soldering apparatus 102 of another embodiment differs from the configuration of the ceiling wall 20 of the solder reservoir 2 of the embodiment shown in FIG. 2 in the shape of the nozzle 4B. It is. The nozzle 4 of the soldering apparatus 100 according to one embodiment is a rectangular cylinder that is elongated in the longitudinal direction of the ceiling wall 20, and a single solder ejection port 40 is provided on the top surface of the nozzle 4. On the other hand, the nozzle 4B of the soldering apparatus 102 of another embodiment is cylindrical, and a circular solder outlet 43 is provided on the top surface of the nozzle 4B. The length of the nozzle 4B in the vertical direction may be the same as that of the nozzle 4. Further, in the soldering apparatus 102 according to another embodiment, it is possible to perform soldering of an electronic component having a small number of leg portions to a circuit board. The cross-sectional shape of the nozzle 4B may be elliptical, and the nozzle 4C may be added as indicated by a two-dot chain line adjacent to the nozzle 4B. The diameters of the nozzles 4B and 4C may be determined according to the size of the leg portion of the circuit board to be soldered.

  FIG. 8 shows a configuration of an embodiment of the automatic soldering apparatus 200 of the first form using the soldering apparatus 100 shown in FIG. The automatic soldering apparatus 200 of this embodiment is for efficiently soldering the same type of circuit boards. The automatic soldering apparatus 200 includes an X-direction moving apparatus 90X that moves in the X direction, a Y-direction moving apparatus 90Y that moves in the Y direction, and a Z-direction moving apparatus that moves the soldering apparatus 100 in the left and right directions and the up and down direction There is a Z-direction moving device 90Z to be moved. The X-direction moving device 90 </ b> X includes two moving bodies that move along two parallel X-direction guide rails 91 that are separated from each other by a predetermined distance, and both are connected by two Y-direction guide rails 92. The Y-direction moving device 90Y moves along the Y-direction guide rail 92. A Z-direction moving device 90Z is attached on the Y-direction moving device 90Y, and one soldering device 100 is attached on the Z-direction moving device 90Z.

  With these three X-direction moving devices 90X, Y-direction moving devices 90Y and Z-direction moving devices 90Z, the soldering device 100 can freely move in the automatic soldering device 200. A circuit board transfer device 85 is provided on the soldering apparatus 100 that can move freely, and transfers the circuit board 80 to be soldered. Since the circuit board transfer device 85 is known, a description thereof is omitted here. Further, three X-direction moving devices 90X, Y-direction moving devices 90Y and Z-direction moving devices 90Z, a circuit board transfer device 85, the aforementioned gas supply source (not shown), a check valve driving device (not shown), and The solder storage amount shortage detection device 77 is driven and controlled by the control device 10.

  Here, an example of the operation of the control device 10 will be described. First, the control device 10 drives the circuit board transfer device 85 to transfer the circuit board 80 to be soldered to the soldering position and stop it. The soldering device 100 is positioned in advance by the X-direction moving device 90X and the Y-direction moving device 90Y according to the soldering position, and when the circuit board 80 is transported to the soldering position by the circuit board transporting device 85, Z The soldering apparatus 100 is raised to the soldering position by the direction moving device 90Z. Next, when the Z-direction moving device 90Z raises the soldering device 100, the control device 10 drives the check valve driving device 50 to close the check valve 5, and drives the gas supply source 60 to perform soldering. Compressed air is sent into the reservoir 2 and the solder 9 in the solder reservoir 2 is ejected from the nozzle 4. The timing of raising the soldering apparatus 100 may be slightly before the circuit board 80 is transported to the soldering position and stopped.

  When the soldering apparatus 100 is raised and soldering is performed on the circuit board 80 and the soldering is completed, the control apparatus 100 stops driving the gas supply source 60, and then the Z-direction moving apparatus 90Z performs the soldering apparatus 100. Is lowered from the soldering position. When the soldering position of the circuit board 80 does not change, the X-direction moving device 90X and the Y-direction moving device 90Y do not need to be driven. Then, in the middle of lowering the soldering device 100 from the soldering position, the control device 10 drives the check valve driving device 50 to open the check valve 5, and the solder reservoir 2 and the solder 9 of the solder recovery unit 3 are connected. Prepare the next soldering by matching the liquid level. Thereafter, the control device 10 drives the circuit board transfer device 85 to transfer the next circuit board 80 to the soldering position and repeats the above operation, so that the circuit board 80 can be soldered automatically.

  The control device 10 controls the liquid level so that the solder liquid level does not spill due to acceleration / deceleration due to the lowering when the soldering device 100 is lowered from the soldering position. When the circuit board transport device 85 transports different types of circuit boards 80 and performs soldering, the control device 10 lowers the soldering device 100 from the soldering position and then moves the X direction moving device 90X and the Y direction. The moving device 90Y may be driven to move the soldering device 100 to the next soldering position. The above driving method of the soldering apparatus 100 of the control apparatus 10 is merely an example, and the control procedure of the control apparatus 10 is not limited to this embodiment.

  FIG. 9 shows a configuration of an embodiment of an automatic soldering apparatus 200A according to the second aspect of the present invention. The automatic soldering apparatus 200 of the first embodiment shown in FIG. 8 is for efficiently soldering the same type of circuit boards, but the automatic soldering apparatus 200A of the second embodiment shown in FIG. Is for efficiently soldering a plurality of types of circuit boards having different soldering positions with a single device. For this reason, the first, second, and third three soldering devices 100A, 100B, and 100C operate independently of each other on the Y-direction moving device 90Y of the automatic soldering device 200A shown in FIG. The first, second and third Z-direction moving devices 90ZA, 90ZB and 90ZC are mounted and provided.

  In this embodiment, the first soldering apparatus 100A is the same as the soldering apparatus 100 shown in FIG. The second soldering apparatus 100B includes a nozzle 4D in which the overall length of the rectangular nozzle 4 of the soldering apparatus 100 shown in FIG. 1 is about half. Further, the third soldering apparatus 100C includes a cylindrical nozzle 4B similar to the soldering apparatus 102 shown in FIG. These nozzles 4, 4B and 4D can be independently raised and lowered to the soldering position by the first, second and third Z-direction moving devices 90ZA, 90ZB and 90ZC. Note that the configurations of the X-direction moving device 90X and the Y-direction moving device 90Y are the same as those shown in FIG. 8, and thus description thereof is omitted here.

  The same is true in that a circuit board transfer device 85 is provided on the first, second, and third soldering devices 100A, 100B, and 100C that can move freely. Also, the X-direction moving device 90X, the Y-direction moving device 90Y, the first, second, and third Z-direction moving devices 90ZA, 90ZB, and 90ZC, the circuit board transfer device 85, the gas supply source (not shown), The same is true in that the check valve driving device (not shown) and the solder storage amount shortage detecting device 77 are driven and controlled by the control device 10.

  Here, an example of the operation of the control device 10 in the automatic soldering apparatus 200A will be described. In the automatic soldering apparatus 200 shown in FIG. 8, the same type of circuit board 80 is transferred by the circuit board transfer device 85. On the other hand, in the automatic soldering apparatus 200 </ b> A shown in FIG. 9, various types of circuit boards 80 are transferred by the circuit board transfer apparatus 85. Here, in order to simplify the description, it is assumed that the first circuit board 80A, the second circuit board 80B, and the third circuit board 80C are transferred by the circuit board transfer device 85.

  As the components that need to be soldered by the automatic soldering apparatus 200A, the first circuit board 80A includes an electronic component 81 in which a large number of leg portions 82 are arranged, and the second circuit board 80B has the number of leg portions 82 as an electronic component. There is an electronic component 81C that is about half of the component 81, and the third circuit board 80C has an electronic component 81C that has a different mounting position from the second circuit board 80B, and a pin that requires soldering in the board transport direction (see FIG. There is an electronic component 81D in which a large number of such components are arranged. For example, such a situation exists when the first and second circuit boards 80A and 80B are mass-produced workpieces (large products), and the third circuit board 80C is a small-volume production workpiece (small products). .

  The first soldering apparatus 100A includes a nozzle 4 suitable for soldering the electronic component 81 on the first circuit board 80A, and the second soldering apparatus 100B includes the second circuit board 80B. And a nozzle 4D suitable for soldering the electronic component 81C on the third circuit board 80C, and the third soldering apparatus 100C solders the electronic component 81D on the third circuit board 80C. It is assumed that a nozzle 4B suitable for the above is provided. The nozzle 4B is a cylindrical general-purpose nozzle that is used for soldering called so-called drag soldering, in which the circuit board is moved in a direction perpendicular to the conveyance direction or in a direction perpendicular to the conveyance direction. is there. The soldering of the electronic component 4D by the nozzle 4B will be described in detail later.

  In this case, the first, second and third soldering devices 100A, 100B and 100C are mounted on the first, second and third Z-direction moving devices 90ZA, 90ZB and 90ZC, respectively. Which of the first, second, and third soldering devices 100A, 100B, and 100C is mounted on which of the first, second, and third Z-direction moving devices 90ZA, 90ZB, and 90ZC may be arbitrary. . Further, on the upstream side of the circuit board transfer device 85, there is a sensor (not shown) for determining the type of the circuit board flowing on the circuit board transfer device 85. The type of the circuit board detected by the sensor is determined by the circuit board being soldered. It is assumed that it has been input to the control device 10 before reaching the attachment position.

  The control device 10 first checks the type of circuit board to be soldered next. Here, the case where the circuit board to be soldered next is the second circuit board 80B will be described. Next, the control device 10 drives the circuit board conveyance device 85 to convey the second circuit board 80B to be soldered to the soldering position and stop it. The second soldering device 100B corresponding to the second circuit board 80B is previously positioned by the X direction moving device 90X and the Y direction moving device 90Y according to the soldering position. When the second circuit board 80B is transferred to the soldering position by the circuit board transfer device 85, the second soldering device 100B is raised to the soldering position by the second Z-direction moving device 90ZB. The control device 10 drives the check valve driving device 50 to close the check valve 5 while driving the second soldering device 100B, and drives the gas supply source 60 to supply compressed air into the solder reservoir 2. The solder 9 in the solder reservoir 2 is ejected from the nozzle 4D.

  When soldering is performed on the second circuit board 80B due to the rise of the second soldering device 100B, the control device 10 stops driving the gas supply source 60, and then the second Z-direction moving device 90ZB 2 soldering apparatus 100B is lowered from the soldering position. In the middle of lowering the second soldering device 100B from the soldering position, the control device 10 drives the check valve driving device 50 to open the check valve 5, and the solder reservoir 2 and the solder recovery unit 3 The liquid level of the solder 9 is adjusted to prepare for the next soldering.

  Next, when the circuit board to be soldered is the second circuit board 80B, the X-direction moving device 90X and the Y-direction moving device 90Y do not need to be driven. On the other hand, as in the embodiment shown in FIG. 9, when the circuit board to be soldered next is the third circuit board 80C, the control device 10 drives the X-direction moving device 90X and the Y-direction moving device 90Y. Then, the position of the second soldering apparatus 100B is matched with the soldering position of the electronic component 81C on the third circuit board 80C. Then, the control device 10 drives the circuit board transfer device 85 to transfer the third circuit board 80C to be soldered to the soldering position and keep it stationary, and to the second soldering apparatus 100B by the same operation as described above. Let them be attached.

  Since there is another electronic component 81D for soldering on the third circuit board 80C, the control circuit 10 lowers the second soldering device 100B from the soldering position and then moves the X-direction moving devices 90X and Y The direction moving device 90Y is driven to align the position of the third soldering device 100C with the soldering position of the electronic component 81D on the third circuit board 80C. Then, the control device 10 drives the circuit board conveying device 85 to convey the third circuit board 80C to the soldering position and stop it, and raises the third soldering device 100C to raise the tip of the electronic component 81D ( Soldering is performed on the downstream end of the transfer device 85. Next, the control device 10 drives only the X-direction moving device 90X to move the nozzle 4B to the rear end portion (the end portion on the downstream side of the transport device 85) of the electronic component 81D, so that all the electronic components 81D are moved. Solder the pins. When soldering the pins of the electronic component 81D, the third circuit board 80C may be moved by driving the circuit board transfer device 85 instead of driving the X-direction moving device 90X.

  Thereafter, the control device 10 drives the circuit board transport device 85 to transport the circuit board to be soldered next to the soldering position, and determines the type of the circuit board to be soldered next and responds accordingly. Since the operation of moving the soldering device to the soldering position is repeated, the soldering can be automatically performed on a variety of circuit boards. The soldering device mounted on the first, second, and third Z-direction moving devices 90ZA, 90ZB, and 90ZC is the type of the circuit board that is transported to the circuit board transport device 85, that is, the solder of the electronic component that performs soldering. A soldering device having a nozzle shape suitable for the soldering area may be selected according to the soldering area.

The automatic soldering apparatus 200 of the first embodiment shown in FIG. 8 includes a dedicated rectangular nozzle and is used for soldering one type of circuit board, and can improve the soldering speed. On the other hand, the automatic soldering apparatus 200A of the second embodiment shown in FIG. 9 includes both a dedicated rectangular nozzle and a general-purpose cylindrical nozzle, and can be used by switching between various types of circuit board solders. Can be used for attaching. For example, conventionally, it was necessary to prepare 10 types of dedicated nozzles for 10 types of circuit boards, but the automatic soldering apparatus 200A of the second embodiment includes both rectangular nozzles and cylindrical nozzles. Therefore, depending on the combination of the two, it is possible to deal with mass production by soldering with a dedicated rectangular nozzle, and for small production with soldering by scanning a general-purpose cylindrical nozzle.
And the soldering apparatus of this invention is the structure which ejects solder with gas, and since a motor is not required, it can reduce in size. For this reason, the structure which attaches a several soldering apparatus on a Z direction moving apparatus like the automatic soldering apparatus 200A of the 2nd form shown in FIG. 9 is attained.

DESCRIPTION OF SYMBOLS 1 Soldering device main body 2 Solder storage part 3 Solder collection | recovery part 4, 4B, 4C, 4D Nozzle 5 Check valve 6 Gas inlet 7 Heater 8 Temperature sensor 9 Solder 10 Control apparatus 11, 12 Side wall 13, 14, 15 Ceiling wall Mounting surface 16 Bottom surface 20 Ceiling wall 30 Bottom portion 31 Communication hole 40 to 43 Solder outlet 50 Check valve driving device 60 Air pump 73 Liquid level sensor 75 Alarm lamp 80, 80A to 80C Circuit board 81, 81C, 81D Electronic component 82 Leg portion 85 Circuit board transfer device 90X, 90Y, 90Z, 90ZA to 90ZC Moving device 100, 100A to 100C Soldering device 200, 200A Automatic soldering device

Claims (2)

A solder reservoir having a sealed space in a state where the solder is stored;
A nozzle for ejecting solder, the upper end of which penetrates the ceiling wall of the solder reservoir,
A gas inlet for injecting gas into the sealed space;
A solder collection unit that has a communication port communicating with the solder storage unit and a check valve that opens and closes the communication port, and collects the solder ejected from the nozzle by opening the communication port in the solder storage unit;
With the check valve opening the communication port, the level of solder in the solder collection unit is detected to detect the amount of solder including the solder in the solder collection unit and the solder in the solder storage unit . Solder storage shortage detection means for detecting the total amount,
A soldering apparatus comprising:   The insufficient solder storage amount detecting means detects electrical continuity between the electrode exposed when the solder liquid level in the solder recovery portion becomes less than a specified value and the solder in the solder recovery portion, and the electrode and the solder 2. The soldering apparatus according to claim 1, wherein a lack of solder storage amount of the soldering apparatus is notified when continuity with the soldering apparatus is lost.

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