JP5652226B2 - Three-dimensional structure coating apparatus and coating method - Google Patents

Description

  The present invention relates to a coating apparatus and a coating method for forming a fluid coating agent film on a three-dimensional structure.

  2. Description of the Related Art Conventionally, a coating apparatus that forms a coating film on a target object by storing the target object in a storage tank and immersing the target object in a coating agent is known. For example, in the coating apparatus described in Patent Document 1, an object is immersed in a coating agent, and the coating agent is attached to the inside of the three-dimensional structure. And this coating apparatus drains a coating agent by gravity and the blowing of air. As a result, a coating film of the coating agent is formed on the object.

  However, in the coating apparatus described in Patent Document 1, the coating agent accumulates on the lower end side of the object due to gravity. For this reason, the film of a coating agent differs in the film thickness by the upper end side and lower end side of a target object. Further, in this coating apparatus, the film thickness of the part to which air is directly sprayed is thinner than the film thickness of the part to which air is not directly sprayed. In other words, it is difficult for such a coating apparatus to form a uniform coating film on the object.

JP 2005-91082 A

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a three-dimensional structure coating apparatus and a coating method for forming a uniform coating agent film on a three-dimensional structure.

  In the invention of claim 1, the object (40) is immersed in the coating agent supplied to the storage chamber (21, 102). At this time, the coating agent is applied to the inside of the three-dimensional structure of the object (40) having the three-dimensional structure. Subsequently, after the excessive coating agent is recovered from the storage chambers (21, 102), the rotation drive unit (38) removes the object (40) to which the coating agent has been applied for each film thickness of the desired coating agent. It is rotationally driven at a preset rotational speed. At this time, the surplus of the coating agent applied to the object (40) is removed from the object by the centrifugal force that acts during rotation driving. Moreover, the coating agent applied to the object (40) is diffused by the centrifugal force and the film thickness becomes uniform. Therefore, a uniform film of the coating agent can be formed on the three-dimensional structure which is the object (40) having a three-dimensional structure.

  In the invention of claim 2, the storage chamber (21, 102) is formed by the first mold member (15, 103) and the second mold member (16, 104). The rotation drive unit (38) rotates and drives the storage tank (11, 101) in a state where the first mold member (15, 103) and the second mold member (16, 104) are combined. To do. That is, the rotation drive unit (38) rotates the storage tank (11, 101) while the object (40) coated with the coating agent is stored in the storage chamber (21, 102). In this case, the coating agent applied to the object (40) does not scatter outside the storage chamber (21, 102). Accordingly, the scattered coating agent does not contaminate the installation location of the storage tank (11, 101) and the surrounding environment. Further, surplus coating agent scattered from the object (40) remains in the storage chambers (21, 102). Therefore, the coating agent can be reused at the next application.

  In the invention of claim 3, the coating agent supply section (39) collects the excess coating agent in a state where at least a part of the coating agent remains in the storage chamber (21, 102) or the piping member (13). To do. In this case, the remaining coating agent is supplied again to the storage chamber (21, 102) at the next application. Therefore, the coating agent can be reused. Further, since the coating agent remains in the storage chamber (21, 102) or the piping member (13), the air in the storage chamber (21, 102) does not flow into the storage tank (14). . Thereby, it is suppressed that the coating agent in a storage tank (14) contacts excess air. Therefore, deterioration of the coating agent and change in characteristics can be suppressed.

  In invention of Claim 4, the sealing member (53,531,532) which suppresses that a target object (40) is exposed to a coating agent is provided. For this reason, the site | part in which the sealing member (53,531,532) is provided among the target objects (40) does not contact a coating agent. Therefore, the application of the coating agent to a portion of the object (40) where the application of the coating agent is unnecessary or prohibited can be selectively suppressed.

  In the invention of claim 5, the storage tank (11, 101) has a plurality of storage chambers (21, 102). Thereby, application | coating of the coating agent to a several target object (40) and adjustment of a film thickness are performed at once. Therefore, the working efficiency during the coating process can be improved.

  According to the sixth aspect of the present invention, the decompression section (105) for decompressing the inside of the accommodation chamber (21, 102) is provided. When the coating agent comes into contact with air, the properties may change or the performance may deteriorate. And when a coating agent is collect | recovered, the membrane | film | coat formed in the target object (40) will contact air. Therefore, degassing the inside of the storage chambers (21, 102) to reduce the pressure prevents the coating film from contacting the air. Thereby, the change of the characteristic of a coating agent and deterioration of a performance can be suppressed.

  In the invention of claim 7, after the object (40) is accommodated in the accommodating chamber (21, 102) of the accommodating tank (11, 101) in the accommodating process, the coating agent is supplied to the accommodating chamber in the application process and the object is obtained. A coating agent is applied to (40). Subsequently, after collecting the surplus of the coating agent in the film thickness adjusting step, the storage tank (11, 101) storing the object (40) is driven to rotate. At this time, the film thickness of the coating agent is adjusted by the centrifugal force generated during the rotation driving. Accordingly, a coating film of the coating agent can be formed on the object (40) with a uniform thickness.

The figure which shows schematically the structure of the coating apparatus by 1st Embodiment. The perspective view which shows the semiconductor device of 1st Embodiment roughly The figure which shows the procedure of the coating method by 1st Embodiment. The figure which shows typically the application | coating prohibition area | region of the semiconductor device of 1st Embodiment. The top view which shows roughly the coating apparatus by 1st Embodiment The figure which shows the relationship between the rotation speed of 1st Embodiment, and the film thickness of a coating agent. The figure which shows the relationship between the film thickness of the coating agent of 1st Embodiment, and adhesive strength. The figure which shows schematically the structure of the coating apparatus by 2nd Embodiment.

  Hereinafter, embodiments of a three-dimensional structure coating apparatus will be described with reference to the drawings. In a plurality of embodiments described below, substantially the same components are denoted by the same reference numerals, and detailed description thereof is omitted.

(First embodiment)
A three-dimensional structure coating apparatus and coating method according to the first embodiment will be described with reference to FIGS. Hereinafter, the three-dimensional structure coating apparatus is simply referred to as a coating apparatus.

  As shown in FIG. 1, the coating apparatus 10 includes a storage tank 11, a rotary shaft member 12, a piping member 13, and a storage tank 14. Hereinafter, as shown in FIG. The storage tank 11 is made of a metal material or the like. Examples of the metal material include stainless steel and aluminum. The storage tank 11 may be formed of other materials such as a resin material. The storage tank 11 is divided near the central portion in the vertical direction. The storage tank 11 has an upper first mold member 15 and a lower second mold member 16 when divided. The first mold member 15 has, on the lower surface thereof, a first recess 17 that is recessed upward from the inside, that is, the lower surface of the first mold member 15. The first mold member 15 has an air hole 18 and a confirmation hole 19 formed on the upper surface thereof. The air hole 18 and the confirmation hole 19 connect the outer wall and the inner wall of the first mold member 15, respectively. On the other hand, the second mold member 16 has, on its upper surface, a second recess 20 that is recessed downward from the inside of the second mold member, that is, from the upper surface. The first mold member 15 and the second mold member 16 are combined with each other to form a storage chamber 21 in the storage tank 11. In this case, the first concave portion 17 of the first mold member 15 forms a lid portion 22 and an upper end side wall portion 23 of the storage chamber 21. The second recess 20 of the second mold member 16 forms a bottom 24 and a lower end side wall 25 of the storage chamber 21.

  The air hole 18 and the confirmation hole 19 of the first mold member 15 connect the storage chamber 21 and the outside of the storage tank 11 on the upper side of the storage tank 11. The air hole 18 discharges the air in the storage chamber 21 when the coating agent is supplied to the storage chamber 21 from the storage tank 14. A supply amount detection unit 26 is provided above the confirmation hole 19. The supply amount detection unit 26 detects the supply amount of the coating agent supplied into the storage chamber 21 through the confirmation hole 19. The supply amount detection unit 26 detects the supply amount of the coating liquid by an arbitrary method such as an optical displacement meter or a known water level meter. The supply amount detection unit 26 outputs an electrical signal corresponding to the detected supply amount.

  Moreover, the 1st type | mold member 15 has the 1st projection part 27 extended upwards from the center part of radial direction on the upper surface. The first protrusion 27 is connected to the fixed shaft member 29 via the sliding member 28. The sliding member 28 uses a bearing in this embodiment. The sliding member 28 allows relative rotation between the fixed shaft member 29 and the storage tank 11. The fixed shaft member 29 is fixed to a structure (not shown) where the coating apparatus 10 is installed.

  The second mold member 16 has a lower opening 30 formed at the center in the radial direction on the lower surface side. In the second mold member 16, a plurality of upper openings 31 are formed in the second recess 20 corresponding to the bottom 24 of the storage chamber 21. In FIG. 1, two upper openings 31 are shown for simplification. The lower opening 30 and the upper opening 31 are connected by an internal pipe 32 provided inside the second mold member 16. That is, the internal pipe 32 connects the storage chamber 21 and the outside of the storage tank 11. The internal pipe 32 is formed so that the pipe length from the lower opening 30 to each upper opening 31 is the same.

  The rotary shaft member 12 is provided on the lower surface of the second mold member 16, that is, the lower surface of the storage tank 11. The rotary shaft member 12 is fixed to the second mold member 16 by a mounting jig such as a screw (not shown). The rotary shaft member 12 is provided so as to cover the lower opening 30 of the second mold member 16. The rotating shaft member 12 rotates by a driving force supplied from driving means such as a motor (not shown). The rotary shaft member 12 is provided coaxially with the lower opening 30 and coaxially with the fixed shaft member 29. Therefore, the rotating shaft member 12 rotates in a state where its own rotating shaft and the central axes of the fixed shaft member 29 and the lower opening 30 coincide.

  Further, the rotary shaft member 12 has a rotary shaft pipe 33 at a position corresponding to the lower opening 30. The rotary shaft pipe 33 connects the upper surface and the lower surface of the rotary shaft member 12 at a position corresponding to the lower opening 30. The rotary shaft pipe 33 is connected to the pipe member 13 with the first packing 34 and the second packing 35 interposed therebetween. The first packing 34 is fixed to the rotary shaft member 12. On the other hand, the second packing 35 is fixed to the piping member 13. The first packing 34 and the second packing 35 are provided in a liquid-tight and slidable manner. For this reason, the storage tank 11 rotates relative to the piping member 13. The rotary shaft pipe 33 and the pipe member 13 are provided coaxially with each other. That is, the piping member 13 extends in the vertical direction, that is, the vertical direction.

  Thus, the storage tank 11 is pressed by the fixed shaft member 29 from above and is rotated relative to the fixed shaft member 29 and the piping member 13 while being supported by the piping member 13 from below. In this case, the storage tank 11 rotates coaxially with the rotary shaft member 12, the rotary shaft pipe 33, and the pipe member 13 and horizontally with respect to the ground. Here, the term “horizontal” is sufficient if it is substantially horizontal with respect to the ground, and includes a slightly inclined state.

  The pipe member 13 is connected to the storage tank 14 at the end opposite to the rotary shaft member 12. The storage tank 14 stores a coating agent to be applied to an object. In the case of this embodiment, the coating agent uses a liquid polyamide resin system having a relatively low viscosity and high fluidity. Further, the piping member 13 has a pump 36 between the rotary shaft member 12 and the storage tank 14. The pump 36 supplies the coating agent stored in the storage tank 14 to the storage chamber 21 of the storage tank 11. When the coating agent is supplied, the air in the storage chamber 21 is discharged from the air hole 18 to the outside of the storage chamber 21 as the coating agent is supplied. Further, the pump 36 collects the coating agent supplied to the storage chamber 21 in the storage tank 14.

  The rotary shaft member 12, the supply amount detection unit 26, and the pump 36 are connected to the control unit 37. The control unit 37 is configured by a microcomputer having a CPU, a ROM, a RAM, and the like (not shown). The control unit 37 controls the operation of the rotary shaft member 12 and the pump 36 in accordance with a computer program stored in a ROM or the like. Specifically, the control unit 37 rotationally drives the rotary shaft member 12 by outputting a drive signal to a motor (not shown) of the rotary shaft member 12. That is, the control part 37 comprises the rotation drive part 38 described in the claim with the rotating shaft member 12. The control unit 37 controls the supply and recovery of the coating agent by outputting a drive signal to the pump 36. That is, the control part 37 comprises the coating agent supply part 39 described in the claims together with the pump 36. When supplying the coating agent, the control unit 37 controls the driving of the pump 36 based on the supply amount of the coating agent detected by the supply amount detection unit 26.

  An object to which the coating agent is applied is accommodated in the accommodation chamber 21. In this embodiment, the object is assumed to be a semiconductor device 40 as an example. As shown in FIG. 2, the semiconductor device 40 as an object has a configuration in which a semiconductor chip 41 is sandwiched between two heat sinks 42 and a heat sink 43. The semiconductor chip 41 is soldered to one heat sink 42. In addition, the semiconductor chip 41 is finally soldered to the heat sink 43. The heat sink 42 has an island 44 formed in a rectangular shape, a lead frame 45 extending outward from the island 44, and a terminal 46 extending from the opposite side of the island 44 from the lead frame 45. The lead frame 45 has a plurality of leads 47. Each lead 47 is connected to the lead frame 45 by a tie bar 48. The semiconductor chip 41 and each lead 47 are connected by a bonding wire 49. On the other hand, the heat sink 43 has an island 50 formed in a rectangular shape and a terminal 51 extending from the island 50 in the same direction as the terminal 46.

  The lead frame 45 and the terminal 46 of the heat sink 42 have a bent portion 52 near the end portion on the island 44 side. The terminal 51 of the heat sink 43 also has a bent portion 52 in the vicinity of the end portion on the island 50 side. For this reason, in a state where the semiconductor chip 41 and the heat sinks 42 and 43 are soldered, the semiconductor chip 41, the lead frame 45, the terminals 46, the leads 47, and the terminals 51 are substantially located on the same plane. That is, the semiconductor device 40 is a three-dimensional structure having a three-dimensional structure, and the semiconductor chip 41 is provided inside the three-dimensional structure. In other words, the semiconductor device 40 is formed in a flat plate shape having a gap between the heat sink 42 and the heat sink 43. Such a semiconductor device 40 is resin-sealed after the coating agent is applied. In the case of the present embodiment, the semiconductor device 40 is assumed to have a relatively large self-heating used for a power supply circuit or the like.

Next, details of the above-described coating apparatus 10 will be described in detail, and a coating method using the coating apparatus 10 will be described. Specifically, it will be described together with a flow of a coating process for applying a coating agent to the semiconductor device 40.
As shown in FIG. 4, in the coating process, an accommodating process is first performed as step S1. The housing process is a process of housing the semiconductor device 40 as an object in the housing tank 11. In this housing step, the semiconductor device 40 is placed on the second mold member 16 of the housing tank 11 separated vertically, and then sandwiched by the first mold member 15 from above.

  Incidentally, as shown in FIGS. 3A to 3C, the semiconductor device 40 is provided with an application-necessary area where the coating agent needs to be applied and an application-prohibited area where the coating agent is not applied. 3A to 3C schematically show the application prohibited area by hatching. Here, the upper surface shown in FIG. 3A is the surface of the island 44 opposite to the semiconductor chip 41 in the semiconductor device 40. Also, the lower surface shown in FIG. 3C is a surface of the island 50 opposite to the semiconductor chip 41 in the semiconductor device 40. In the semiconductor device 40, virtual lines L <b> 1 and virtual lines L <b> 2, which are virtual lines positioned slightly outside the bent portion 52, are set as application-prohibited regions. Further, in the semiconductor device 40, the surface of the island 44 and the island 50 opposite to the semiconductor chip 41 is a coating prohibited area. On the other hand, in the semiconductor device 40, the area inside the virtual lines L1 and L2 and the surface on the side where the semiconductor chip 41 of each island is soldered are the application required areas.

  Therefore, in the housing process, as shown in FIG. 1, a sealing member 53 as a sealing member is provided. The seal member 53 is provided at a position corresponding to the imaginary line L1 at the left outermost edge of the storage chamber 21 and at a position corresponding to the virtual line L2 at the right outermost edge side of the storage chamber 21 in the drawing. The sealing member 53, the lead frame 45 of the semiconductor device 40, and the terminals 46 and 51 are sealed from above and below. Specifically, the seal member 53 includes a lower seal member 531 on the lower surface side and an upper seal member 532 on the upper surface side. The lead frame 45 and the terminals 46 and 51 are each sealed on the lower surface side by the lower seal member 531 and on the upper surface side by the upper seal member 532. Thereby, even if it is a case where a coating agent is supplied to the storage chamber 21, an application prohibition area | region does not contact a coating agent.

  If the position where the semiconductor device 40 is installed is shifted in this housing step, the position of the application prohibited area sealed by the seal member 53 may be shifted. Therefore, the coating apparatus 10 is provided with a positioning projection 54 on the second mold member 16. The convex portion 54 protrudes upward from the upper surface of the second mold member 16. As shown in FIG. 5, the position of the semiconductor device 40 in the left-right direction in the drawing is determined by the tie bar 48 of the lead frame 45 coming into contact with the convex portion 54. The semiconductor device 40 is also positioned in the vertical direction in the figure by a movement restriction unit (not shown) provided in the second mold member 16. The positioning convex portion 54 and the movement restricting portion may be provided on the first mold member 15. A plurality of convex portions 54 may be provided.

  Subsequently, the first mold member 15 is attached to the second mold member 16 in which the semiconductor device 40 is installed from above. At this time, the first mold member 15 is fixed to the second mold member 16 by a mounting jig such as a screw (not shown). As a result, the semiconductor device 40 is accommodated in the accommodation chamber 21. Thereafter, the fixed shaft member 29 is connected to the first projecting portion 27 of the storage tank 11 from above via the sliding member 28. The semiconductor device 40 is accommodated in the accommodation chamber 21. At this time, the upper surface of the semiconductor device 40 is in close contact with the first recess 17 of the first mold member 15. Here, the upper surface is the surface of the island 44 opposite to the semiconductor chip 41. Further, the bottom surface of the semiconductor device 40 is supported by a support portion 55 formed so as to surround the outer periphery of the island 50. Here, the lower surface is a surface of the island 50 opposite to the semiconductor chip 41. Thereby, contact with the coating agent is suppressed on the upper surface and the bottom surface of the semiconductor device 40. That is, the upper surface of the semiconductor device 40 is sealed by the first concave portion 17, and the bottom surface is sealed by the support portion 55. In this case, a seal member may be provided at a position corresponding to the upper surface of the semiconductor device 40 in the lid portion 22 of the storage chamber 11, and the contact between the upper surface of the semiconductor device 40 and the lid portion 22 may be made dense. In addition, a seal member that closes contact with the lower surface side of the semiconductor device 40 may be provided in the support portion 55.

  As described above, the semiconductor device 40 is accommodated in the accommodation chamber 21 in a state in which the top and bottom surfaces and the rotation axis of the rotation shaft member 12 are perpendicular to each other. At this time, the semiconductor device 40 is supported from below by the second mold member 16. In the semiconductor device 40, the lead frame 45 and the terminal 46 are sandwiched between the first mold member 15 and the second mold member 16 through the seal member 53. That is, the semiconductor device 40 is supported by the first mold member 15 and the second mold member 16 at portions other than the application required region where the coating agent is applied. In other words, the entire application required area is exposed in the storage chamber 21. At this time, the rotation axis of the storage tank 11 is located approximately in the center of the islands 44 and 50 of the semiconductor device 40. The storage chamber 21 is connected to the piping member 13 and thus to the storage tank 14 via the internal piping 32 and the rotary shaft piping 33.

  Subsequently, the coating process in step S2 shown in FIG. 3 is performed. In this application step, the control unit 37 drives the pump 36 to supply the coating agent stored in the storage tank 14 to the storage chamber 21. In this case, the coating agent flows through the supply path formed by the piping member 13, the rotary shaft piping 33, the lower opening 30 of the second mold member 16, and the internal piping 32, and as shown in FIG. It is supplied to the storage chamber 21 from each upper opening 31 on the side. As described above, the internal piping 32 in the second mold member 16 has the same piping length from the lower opening 30 to the upper opening 31. Therefore, the coating agent is supplied from the upper openings 31 to the storage chamber 21 at an equal flow rate and the same timing.

  Then, when the amount of the coating agent in the storage chamber 21 detected by the supply amount detector 26 reaches a preset amount, the controller 37 stops driving the pump 36. In this case, the control unit 37 stops driving the pump 36 when a sufficient amount of coating liquid for immersing the semiconductor device 40 is supplied into the storage chamber 21. Thereby, the semiconductor device 40 is immersed in the coating agent. At this time, in the semiconductor device 40, a part other than the application prohibited area sealed by the seal member 53 or the like comes into contact with the coating agent. Further, as described above, the coating agent also flows inside the semiconductor device 40. For this reason, in the semiconductor device 40, the surface side where the heat sink 42 and the heat sink 42 face each other, that is, the surface on which the semiconductor chip 41 is provided also contacts the coating agent.

  Subsequently, the control unit 37 immerses the semiconductor device 40 until a predetermined immersion time is reached. Thereafter, the control unit 37 drives the pump 36 to collect the coating agent in the storage chamber 21. In this case, the control unit 37 drives the pump 36 so that the coating agent flows in the direction opposite to that during supply. Thereby, the surplus coating agent is recovered from the storage chamber 21 to the storage tank 14 as indicated by an arrow Y in FIG. At this time, the control unit 37 collects part of the coating agent in a state in which it remains in at least one of the storage chamber 21 and the piping member 13. Specifically, the control unit 37 stops the driving of the pump 36 in a state where the coating agent remains in the storage chamber 21, the internal pipe 32 of the second mold member 16, the rotary shaft pipe 33, or the pipe member 13. Here, when the coating agent remains in the storage chamber 21, the coating agent remains in an amount that does not contact the semiconductor device 40. In this case, the drive of the pump 36 for collecting the coating agent is controlled based on the remaining amount of the coating agent detected by the supply amount detection unit 26.

  When the coating agent is collected, the semiconductor device 40 is in a state where the coating agent is applied to the application required region. In this way, the coating apparatus 10 forms a coating film on the semiconductor device 40 by supplying the coating agent to the accommodation chamber 21 and immersing the semiconductor device 40 and then collecting the excess coating agent.

  Subsequently, the film thickness adjusting step of step S3 shown in FIG. 3 is performed. This film thickness adjusting step is a step of adjusting the film thickness of the coating film of the coating agent by rotationally driving the storage tank 11. In this case, the control unit 37 rotationally drives the storage tank 11 at a rotation speed set in advance for each film thickness of the coating film formed on the semiconductor device 40. Here, the relationship between the film thickness of the coating film of the coating agent and the rotational speed will be described. As shown in FIG. 6, the film thickness of the coating of the coating agent becomes thinner as the rotational speed increases. In other words, the film thickness of the coating of the coating agent can be adjusted by controlling the number of rotations.

  By the way, the coating agent has an adhesion function between the semiconductor device 40 and the resin sealing. In that case, the semiconductor device 40 and the resin sealing are required to have a predetermined adhesion strength. The adhesion strength has a correlation with the film thickness of the coating agent. As shown in FIG. 7, the film thickness of the coating agent rapidly decreases as the film thickness decreases, and gradually decreases when the film thickness increases. In other words, the film thickness of the coating agent has an optimum range suitable for the required adhesion strength. In the case of the semiconductor device 40 of the present embodiment, the adhesion strength becomes maximum when the film thickness of the coating agent is approximately 5 μm, and decreases as the film thickness moves away from 5 μm. For this reason, the control part 37 rotationally drives the storage tank 11 at about 1000 rpm so that contact | adhesion intensity | strength may become an optimal range. The optimum range and the corresponding rotation speed are preset for each semiconductor device 40 and stored in a ROM or the like. The required adhesion strength varies depending on the type and shape of the object. Therefore, the optimal range and the corresponding rotation speed may be set as appropriate according to the object. For example, the film thickness range that exceeds the required adhesion strength may be set as the optimum range, or the film thickness range corresponding to the lower limit value that is several percent lower than the maximum adhesion strength value is set as the optimum range. May be.

  The control part 37 outputs a drive signal so that it may become the rotation speed corresponding to the set optimal range. In the case of the present embodiment, the control unit 37 selects a rotation speed of about 1000 rpm in order to form a film thickness of 5 μm that maximizes the adhesion strength. And the control part 37 outputs the drive signal corresponding to 1000 rpm to the rotating shaft member 12. FIG. Thereby, the semiconductor device 40 is rotationally driven together with the storage tank 11. At this time, a surplus of the coating agent applied to the semiconductor device 40 is scattered by centrifugal force. Further, the coating agent applied to the semiconductor device 40 is diffused in the horizontal direction by centrifugal force. As a result, in the semiconductor device 40, a coating film of a coating agent having a predetermined and uniform film thickness is formed. In this case, the time for rotating the rotary shaft member 12 is set in advance.

  When the coating process is thus completed, the semiconductor device 40 is sent to a resin sealing process (not shown). In the resin sealing step, the semiconductor device 40 is resin-sealed in a state where the outer surfaces of the islands 44 and 50, that is, the surface opposite to the semiconductor chip 41 is exposed. Thereafter, the lead frame 45 and excessive portions of the lead frame 45 are cut to complete a resin-encapsulated semiconductor device in which the leads 47, the terminals 46, and the terminals 46 are exposed from the resin encapsulation.

According to the coating apparatus 10 of this embodiment described above, the following effects can be obtained.
The coating apparatus 10 immerses the object in the coating agent by supplying the coating agent to the storage chamber 21 in which the object is accommodated. At this time, since the coating agent having relatively high fluidity is used, even when the object has a three-dimensional structure, the coating agent is applied to the inside of the three-dimensional structure. After collecting the surplus coating agent from the storage chamber 21, the rotation driving unit 38 rotates the object to which the coating agent has been applied at a rotation speed set in advance for each film thickness of the desired coating agent. The surplus of the coating agent applied to the object is removed from the object by the centrifugal force that acts during rotational driving. In other words, the coating apparatus 10 performs liquid removal of excess coating agent by rotationally driving the storage tank 11 together with the object. Further, the coating agent applied to the object diffuses in the horizontal direction due to the centrifugal force at the time of rotational driving. Thereby, the coating agent forms a film having a uniform film thickness on the surface of the semiconductor device 40. Therefore, a uniform film of the coating agent can be formed on a three-dimensional structure that is an object having a three-dimensional structure.

The coating apparatus 10 includes a first mold member 15 and a second mold member 16 that form a storage chamber 21. And when accommodating the semiconductor device 40 which is a target object in the storage chamber 21, the semiconductor device 40 is accommodated in the state which the 1st type | mold member 15 and the 2nd type | mold member 16 isolate | separated. Therefore, the semiconductor device 40 can be easily accommodated.
The coating apparatus 10 seals the application prohibited area of the semiconductor device 40 with the seal member 53. Thereby, the site | part in which the sealing member 53 of the semiconductor device 40 is provided does not contact a coating agent. Therefore, it is possible to selectively suppress application of the coating agent to a portion of the semiconductor device 40 where application of the coating agent is unnecessary or prohibited.

The coating apparatus 10 collects excess coating agent in the storage tank 14. The collected coating agent is supplied to the storage chamber 21 again at the next application. Therefore, the coating agent can be reused.
When recovering the coating agent, the coating apparatus 10 recovers at least a part of the coating agent in a state of remaining in the storage chamber 21 or the piping member 13. In this case, the coating agent remains on the storage chamber 21 or the piping member 13 side, that is, on the side closer to the storage chamber 21 than the application tank. For this reason, the supply time of the coating agent in the next coating process is shortened compared with the case where the coating agent is supplied from the storage tank 14. Therefore, working efficiency can be improved.

  Further, since the coating agent remains in the storage chamber 21 or the piping member 13, the air in the storage chamber 21 does not flow into the storage tank 14. For this reason, the coating agent in the storage tank 14 does not come into contact with excess air. Therefore, it is possible to suppress the deterioration of the coating agent and the change in characteristics that may occur when it comes into contact with air.

  When the storage tank 11 is rotationally driven, the coating apparatus 10 is rotationally driven in a state where the first mold member 15 and the second mold member 16 are combined. That is, the rotation drive unit 38 drives the storage tank 11 to rotate while the object to which the coating agent is applied is stored in the storage chamber 21. In this case, the coating agent applied to the object stays in the storage chamber 21 and does not scatter outside the storage chamber 21. Therefore, the installation place of the coating apparatus 10 is not contaminated with the scattered coating agent. At this time, the excess coating agent scattered from the object remains in the storage chamber 21 and can be reused during the next coating process.

  By applying the coating agent by the coating process including the above-described accommodation step, application step, and film thickness adjustment step, a coating film of the coating agent can be formed on the object with a uniform thickness.

(Second Embodiment)
Hereinafter, the coating apparatus according to the second embodiment will be described with reference to FIG. The coating method in the second embodiment is the same as that in the first embodiment, and will be described with reference to FIG. Also in the second embodiment, a semiconductor device is assumed as an object.
As shown in FIG. 8, the coating apparatus 100 of the second embodiment has a plurality of storage chambers 102 in a storage tank 101. These storage chambers 102 are formed by a plurality of first recesses 17 provided in the first mold member 103 and a plurality of second recesses 20 provided in the second mold member 104. Further, the internal piping 32 of the second mold member 104 is connected to the respective storage chambers 102. In this case, the pipe lengths of the lower opening 30 of the second mold member 104 and the upper openings 31 of the storage chambers 21 are formed to be the same.

  The coating apparatus 100 performs the coating process shown in FIG. 4 as in the first embodiment. Specifically, the coating apparatus 100 performs positioning of the semiconductor device 40 and sealing with the seal member 53 in the housing process. Further, in the coating process, the coating apparatus 100 applies the coating agent to the semiconductor device 40 by immersing the semiconductor device 40 in the supplied coating agent and collecting excess coating liquid. Subsequently, the coating apparatus 100 forms a film with a uniform film thickness of the coating liquid on the semiconductor device 40 by rotating the semiconductor device 40 coated with the coating agent together with the storage tank 101 in the film thickness adjusting step. Thus, the coating apparatus 10 by 2nd Embodiment can form the uniform membrane | film | coat of a coating agent on the three-dimensional structure which is a target object which has a three-dimensional structure similarly to 1st Embodiment. In particular, the coating apparatus 100 of the second embodiment can coat a plurality of semiconductor devices 40 at a time, and can improve work efficiency. In this case, FIG. 8 illustrates the coating apparatus 10 provided with two storage chambers 102, but it is needless to say that three or more storage chambers 102 may be provided.

  In addition, the coating apparatus 100 includes a decompression unit 105 that deaerates and decompresses the inside of the storage chamber 102. In the present embodiment, the decompression unit 105 is connected to the storage chamber 102 via an exhaust pipe (not shown) formed inside the fixed shaft 29 and the first projection 27. When the decompression unit 105 is driven, the air hole 18 and the confirmation hole 19 are closed by a plug member (not shown). When the coating agent comes into contact with air, the properties may change or the performance may deteriorate. And in the state after collect | recovering coating agents in the above-mentioned application | coating process, there exists a possibility that the film | membrane of the coating agent formed in the semiconductor device 40 may contact air. Therefore, in this embodiment, the film of the coating agent formed on the semiconductor device 40 comes into contact with the air by performing a deaeration process in which the inside of the storage chamber 102 is deaerated by the decompression unit 105 before the film thickness adjustment residence. That is restrained. Thereby, the change of the characteristic of a coating agent and deterioration of a performance can be suppressed. When the deaeration process is performed, it is desirable to provide a valve member or the like so that the coating agent remaining in the piping member 13 or the like does not flow back into the storage chamber 102.

(Other embodiments)
The present invention is not limited to the above-described embodiments, and can be modified or expanded as follows.

The object is not limited to the semiconductor device 40, and may be another three-dimensional structure.
The shape and configuration of the semiconductor device 40 is an example, and may be a semiconductor device provided with a plurality of semiconductor chips and peripheral components.
A coating agent other than a polyamide resin may be used. In this case, since the storage tank 11 is rotationally driven, even a coating agent having a somewhat high viscosity can be applied to an object by centrifugal force.

The positions of the air holes 18 and the confirmation holes 19 or the number of the upper openings 31 are examples, and are not limited to those shown in each embodiment.
The decompression unit 105 may be applied to the coating apparatus 100 of the first embodiment. Further, the position where the decompression unit 105 is connected is not limited to the position shown in FIG.

  In the drawings, 10 and 100 are coating apparatuses, 11 and 101 are storage tanks, 12 is a rotary shaft member, 13 is a piping member, 14 is a storage tank, 15 and 103 are first mold members, and 16 and 104 are second mold members. , 17 is a first recess, 20 is a second recess, 21 and 102 are storage chambers, 22 is a lid, 23 is an upper side wall (wall), 24 is a bottom, 25 is a lower side wall (wall), 36 Is a pump (coating liquid supply unit), 38 is a rotation drive unit, 39 is a coating agent supply unit, 40 is a semiconductor device (object), 53 is a seal member (sealing member), 105 is a decompression unit, and 531 is a lower seal. A member (sealing member) 532 indicates an upper seal member (sealing member).

Claims (7)

A storage tank (11, 101) having a storage chamber (21, 102) for storing the object (40) in which the application prohibited region is set ;
It is provided in the storage chamber (21, 102), protrudes from the installation surface of the target object (40), contacts the target object (40), and the target object (40 in the storage chamber (21, 102)). ) For positioning the installation position of
A storage tank (14) for storing a fluid coating agent applied to the object (40) stored in the storage chamber (21, 102);
A piping member (13) extending in a vertical direction connecting the storage chamber (21, 102) of the storage tank (14) and the storage tank (11, 101);
Connected to said piping member (13), said holding tank (11 and 101) of the rotary shaft and the rotary shaft are provided coaxially pipe (33) the storage chamber the coating agent through a to (21,102) A coating agent supply unit (39) for supplying and applying to the object (40), and collecting the excess coating agent in the storage tank (14) through the rotary shaft pipe (33) ;
The film thickness of the coating of the coating agent formed on the object (40) having the rotating shaft member (12) provided coaxially with the piping member (13) and connected to the storage tank (11, 101) A rotational drive unit (38) for rotationally driving the object (40) to which the coating agent has been applied at a rotational speed set in advance for each;
A three-dimensional structure coating apparatus characterized by comprising: A storage tank (11, 101) having a storage chamber (21, 102) for storing the object (40);
A storage tank (14) for storing a fluid coating agent applied to the object (40) stored in the storage chamber (21, 102);
A piping member (13) extending in a vertical direction connecting the storage chamber (21, 102) of the storage tank (14) and the storage tank (11, 101);
The coating agent is supplied from the storage tank (14) to the storage chamber (21, 102) through the piping member (13) and applied to the object (40), and excess coating agent is applied to the storage tank ( 14) the coating agent supply unit (39) to be recovered;
The film thickness of the coating of the coating agent formed on the object (40) having the rotating shaft member (12) provided coaxially with the piping member (13) and connected to the storage tank (11, 101) A rotational drive unit (38) for rotationally driving the object (40) to which the coating agent has been applied at a rotational speed set in advance for each;
With
The storage tank (11, 101) has a plurality of storage chambers (21, 102) driven by the rotation drive unit (38), and the three-dimensional structure coating apparatus. The storage tank (11, 101) includes a first mold member (15, 15) having a first recess (17) that forms a wall (23, 25) and a lid (22) of the storage chamber (21, 102). 103) and a second recess (20) which is combined with the first mold member (15, 103) to form the wall (23, 25) and bottom (24) of the storage chamber (21, 102). A second mold member (16, 104),
The rotational drive unit (38) rotationally drives the storage tank (11, 101) in a state where the first mold member (15, 103) and the second mold member (16, 104) are combined. The three-dimensional structure coating apparatus according to claim 1, wherein The piping member (13) is connected to the storage chamber (21, 102) from below in the vertical direction,
The said coating agent supply part (39) remains at least one part in the said storage chamber (21,102) or the said piping member (13) among the excess said coating agents from Claim 1 characterized by the above-mentioned. The coating apparatus for a three-dimensional structure according to any one of claims 3 to 4. The sealing member according to any one of claims 1 to 4, further comprising a sealing member (53, 531, 532) that seals at least a part of the object (40) and suppresses exposure to a coating agent. 3. The three-dimensional structure coating apparatus according to the item.   The three-dimensional structure coating apparatus according to any one of claims 1 to 5, further comprising a decompression unit (105) for decompressing the interior of the storage chamber (21, 102). An accommodation step of accommodating the object (40) in which the application prohibited area is set in a state of being positioned in the accommodation chamber (21, 102) of the accommodation tank (11, 101);
The object (40) accommodated in the accommodating chamber (21, 102) in the accommodating step is supplied through a rotating shaft pipe (33) provided coaxially with the rotating shaft of the accommodating tank (11, 101). An application step of immersing in a fluid coating agent and applying the coating agent to the object (40) ;
After the surplus of the coating agent applied in the application step is collected through the rotary shaft pipe (33) , the storage tank (11, 101) that stores the object (40) is rotated to drive the coating. A film thickness adjusting step for adjusting the film thickness of the agent;
A method for coating a three-dimensional structure characterized in that

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