JP5756345B2 - Electronic component mounting method and mounting device - Google Patents

Description

  The present invention includes two transport devices that each transport a substrate in parallel, and two component supply devices that are provided on the front side and the back side of the device body and supply a plurality of types of electronic components to be mounted on the substrate. And a pair of opposed beams that can be moved in one direction by a one-way drive source, and a mounting head that can be moved in another direction orthogonal to the one direction by an other-direction drive source, respectively, and either one of the beams It is related with the mounting method and mounting apparatus of the electronic component which mounts the electronic component picked out from any one of the component supply apparatuses with said mounting head on the board | substrate conveyed with any one said conveying apparatus.

  An electronic component mounting device that takes out an electronic component from a component supply device by a suction nozzle attached to a mounting head and mounts the electronic component on a substrate is disclosed in Patent Document 1 and the like. In recent years, multi-variety variable-volume production forms have become widespread, and there is a need for efforts to reduce “non-operating time” other than the time that production equipment is implemented, such as time for switchover and time for changeover of production equipment. Yes. In order to meet this requirement, the configuration is equipped with two mounting heads with two opposing beams, and is equipped with two rows of transfer devices (dual lanes) arranged side by side. Proposals have been made for operation modes that can be produced independently by each device. In the basic operation, two mounting heads facing each other are taken out from the component supply device on the side close to each mounting head, and are dedicated to mounting the electronic component on the board in the transport device on the side close to the component supply device. Is.

JP 2010-87305 A

  However, the electronic component mounting apparatus becomes a bottleneck in the balance of the production efficiency of each electronic component mounting apparatus in the electronic component mounting line due to a significant deviation in the mounting processing time of the electronic components of the mounting heads provided in the two beams. There is a need for a solution to correct this.

  Therefore, in view of these problems, the present invention has the production efficiency of each electronic component mounting apparatus in the electronic component mounting line even if the mounting processing time of the electronic components of the mounting heads provided in the two beams is significantly biased. An object of the present invention is to prevent the occurrence of an electronic component mounting device that becomes a bottleneck in the balance of the above.

Method of mounting an electronic component according to a first aspect of the invention, a conveying device conveying the substrate row Nau two in the other direction in which each is orthogonal to the one direction aligned in one direction, before the one-way device body husband and a plurality of types of the two component supply apparatus for supplying electronic components, in the other direction to the pair of beams which faces movable by one-way drive source in one direction to be attached to the side and the rear side is disposed on board s and a mounting head which is movable by the other direction drive source, one of the bi chromatography beam one transportable either the electronic component taken out from either of the component supplying device in a provided instrumentation worn head feeder in in mounting method of the electronic component to be mounted onto the transported Ru board, if any of the mounting head of the beam not in the idle state, the front side of the beam of the mounting head, from the front side of the component feeding device Take out the electronic components Mounted on the substrate in the transport device on the front side, the back side of the beam of the mounting head from the back side of the component feeding device takes out the electronic component, while mounted on the substrate in the transport device on the back side, whereas either If the instrumentation wearing head bicycloalkyl over beam is in the idle state, to grasp the installation status of the electronic components to the substrate of the other conveyance apparatus that faces, the result of grasping the mounting condition of the electronic component based on, with the electronic component that is not installed to the substrate of the other conveyance apparatus instrumentation wearing head unutilized state, in the other mounting head simultaneously served may status of the beam, near the stomach to the other conveyance apparatus removed from the article supply apparatus, on the mounting head idle state of the other beam fly so as not to collide with the mounting head adjustment, characterized in that mounted on the substrate in the other conveyance apparatus

Method of mounting an electronic component according to a second aspect of the invention, a conveying device conveying the substrate row Nau two in the other direction in which each is orthogonal to the one direction aligned in one direction, before the one-way device body husband and a plurality of types of the two component supply apparatus for supplying electronic components, in the other direction to the pair of beams which faces movable by one-way drive source in one direction to be attached to the side and the rear side is disposed on board s and a mounting head which is movable by the other direction drive source, one of the bi chromatography beam one transportable either the electronic component taken out from either of the component supplying device in a provided instrumentation worn head feeder in in mounting method of the electronic component to be mounted onto the transported Ru board, also the mounting head of one of the beams, when not in a standby state without mounting the electronic component is completed, mounting of the front side of the beam The front side of the head The electronic component is taken out from the supply device, mounted on the substrate in the transport device on the near side, the electronic component is taken out from the component supply device on the back side by the mounting head of the back beam, and the substrate in the transport device on the back side while mounting onto, by mounting the electronic component is completed, if any instrumentation wearing head of one of the bi chromatography beam is in the standby state, the electronic components to the substrate of the other conveyance device facing of grasping the mounting status, based on the result of grasping the mounting condition of the electronic component, with the electronic component that is not installed to the substrate of the other conveyance apparatus instrumentation wearing head wait state, the other beam in situations where simultaneous fly a mounting head, taken out from the proximal stomach article feeder to the other conveyance device, served adjusted so mounting head in a standby state does not collide with the mounting head of the other beam On, characterized in that mounted on the substrate in the other conveyance device.

Method of mounting an electronic component according to a third aspect of the invention, a conveying device conveying the substrate row Nau two in the other direction in which each is orthogonal to the one direction aligned in one direction, before the one-way device body husband and a plurality of types of the two component supply apparatus for supplying electronic components, in the other direction to the pair of beams which faces movable by one-way drive source in one direction to be attached to the side and the rear side is disposed on board s and a mounting head which is movable by the other direction drive source, one of the bi chromatography beam one transportable either the electronic component taken out from either of the component supplying device in a provided instrumentation worn head feeder in in mounting method of the electronic component to be mounted onto the transported Ru board, also the mounting head of one of the beams, when not in a standby state without mounting the electronic component is completed, mounting of the front side of the beam The front side of the head The electronic component is taken out from the supply device, mounted on the substrate in the transport device on the near side, the electronic component is taken out from the component supply device on the back side by the mounting head of the back beam, and the substrate in the transport device on the back side while mounting onto, by mounting the electronic component is completed, if any instrumentation wearing head of one of the bi chromatography beam is in the standby state, the electronic components to the substrate of the other conveyance device facing of grasping the mounting status, based on the result of grasping the mounting status of the electronic components, other conveyance device in the mounting process in the mounting data corresponding to the board that put is in a standby state the mounting step of the unprocessed bi and 1 reciprocation extraction chromatography arm,-out based on the mounting step of the extracted 1 round trip unprocessed in situations where simultaneous fly and the mounting head of the mounting head and the other beam in the standby state, the other transportable Sending Taking out an electronic component which is not mounted from the near stomach article feeder to the substrate in the other conveying device location based on the extracted 1 round trip unprocessed mounting step, the mounting head in a standby state of the other beam on the fly adjustment so as not to collide with the mounting head, characterized in that mounted on the substrate in the other conveyance device.

Mounting apparatus for electronic components according to the fourth aspect of the present invention comprises a conveying device conveying the substrate row Nau two other directions respectively arranged in one direction perpendicular to the one direction, before the one-way device body husband and a plurality of types of the two component supply apparatus for supplying electronic components, in the other direction to the pair of beams which faces movable by one-way drive source in one direction to be attached to the side and the rear side is disposed on board s and a mounting head which is movable by the other direction drive source, one of the bi chromatography beam one transportable either the electronic component taken out from either of the component supplying device in a provided instrumentation worn head feeder in the mounting apparatus for electronic components to be mounted on a transported Ru board, if any of the mounting head of the beam not in the idle state, the front side of the beam of the mounting head, from the front side of the component feeding device Take out the electronic components Control means for mounting on the substrate in the transport device on the near side, taking out the electronic component from the component supply device on the back side by the mounting head of the back beam, and controlling the mounting on the substrate in the transport device on the back side; , if any instrumentation wearing head of one of the bi chromatography beam is in the idle state, and a monitor which monitors the installation status of the electronic components to the substrate of the other conveyance apparatus of the counterpart, the control means , if any mounting head of one beam is in the idle state, based on a result of grasping means has grasped the mounting status of electronic components, not mounted to the substrate at the other conveyance device electronic component for, in a situation where instrumentation wearing head can be mounted head simultaneously served the other beam of idle, removed from the proximal stomach article feeder to the other conveyance device, the idle state mounting head Square of the beam on the fly adjustment so as not to collide with the mounting head, and wherein the benzalkonium controls to mount on a substrate in the other conveyance device.

Mounting apparatus for electronic components according to the fifth aspect of the present invention comprises a conveying device conveying the substrate row Nau two other directions respectively arranged in one direction perpendicular to the one direction, before the one-way device body husband and a plurality of types of the two component supply apparatus for supplying electronic components, in the other direction to the pair of beams which faces movable by one-way drive source in one direction to be attached to the side and the rear side is disposed on board s and a mounting head which is movable by the other direction drive source, one of the bi chromatography beam one transportable either the electronic component taken out from either of the component supplying device in a provided instrumentation worn head feeder in in mounting apparatus for electronic components to be mounted on a transported Ru board, also the mounting head of one of the beams, when not in a standby state without mounting the electronic component is completed, mounting of the front side of the beam The front side of the head The electronic component is taken out from the supply device, mounted on the substrate in the transport device on the front side, and the electronic component is taken out from the component supply device on the back side by the mounting head of the back beam, and is transferred to the substrate in the transport device on the back side. and control means for mounting, and mounting of electronic components is completed, if any instrumentation wearing head of one of the bi chromatography beam is in the standby state, to the substrate of the other conveyance device facing A grasping means for grasping the mounting status of the electronic component, and when the mounting head of any one of the beams is in a standby state , the control means is a result of the grasping means grasping the mounting status of the electronic component. based on, for electronic components that are not attached to the substrate at the other conveyance device, in situations where instrumentation wearing head can be mounted head simultaneously served the other beam in the standby state, feeding the other transportable Removed from the proximal stomach article supplying apparatus location, the mounting head standby state on the fly adjustment so as not to collide with the mounting head of the other beam, that controls to mount on a substrate in the other conveyance apparatus and wherein a call.

Mounting apparatus of the electronic component according to a sixth aspect of the present invention comprises a conveying device conveying the substrate row Nau two other directions respectively arranged in one direction perpendicular to the one direction, before the one-way device body husband and a plurality of types of the two component supply apparatus for supplying electronic components, in the other direction to the pair of beams which faces movable by one-way drive source in one direction to be attached to the side and the rear side is disposed on board s and a mounting head which is movable by the other direction drive source, one of the bi chromatography beam one transportable either the electronic component taken out from either of the component supplying device in a provided instrumentation worn head feeder in in mounting apparatus for electronic components to be mounted on a transported Ru board, also the mounting head of one of the beams, when not in a standby state without mounting the electronic component is completed, mounting of the front side of the beam The front side of the head The electronic component is taken out from the supply device, mounted on the substrate in the transport device on the front side, and the electronic component is taken out from the component supply device on the back side by the mounting head of the back beam, and is transferred to the substrate in the transport device on the back side. and control means for mounting, and mounting of electronic components is completed, if any instrumentation wearing head of one of the bi chromatography beam is in the standby state, to the substrate of the other conveyance device facing a monitor which monitors the installation status of the electronic component, on the basis of the result of the grasping unit finds out the installation status of the electronic components, it is not mounted processed in the corresponding mounting data based board that put the other conveyance apparatus the mounting steps of the processing and extraction means for 1 round trip extracted bicycloalkyl over beam in the standby state, the control means, if any mounting head of one beam is in the standby state, extracted by the extraction means -Out 1 based on the round trip of the unprocessed attachment step which is, in the mounting head to the situation can be simultaneously served mounting heads other beam in the standby state, instrumentation wearing head standby state not close to another conveyance device to eject the electronic parts that are not attached to the substrate from parts products feeder in the other conveying device, based on the extracted 1 round trip unprocessed mounting step, the mounting head of the mounting head and the other beam in the standby state and on the fly adjustment so as not to collide, and wherein the benzalkonium controls to mount on a substrate in the other conveyance device.

  According to the present invention, when the mounting operation of the electronic component to the substrate in one transport apparatus by one beam mounting head is in an idle state, the one beam mounting head corresponds to the other transport apparatus. By taking out the electronic component from the component supply device and mounting it on the substrate in the other transport device, it is possible to assist the mounting operation on the substrate in the other transport device. Therefore, even if there is a significant deviation in the mounting processing time of the electronic components of the mounting heads provided in the two beams, this can be eliminated, and the production efficiency of each electronic component mounting apparatus in the electronic component mounting line can be reduced. It is possible to prevent the occurrence of an electronic component mounting apparatus that becomes a bottleneck in balance.

It is a top view of an electronic component mounting apparatus. It is a control block diagram of an electronic component mounting apparatus. It is a figure which shows the mounting data of the printed circuit board conveyed with 2 A of conveying apparatuses. It is a figure which shows the mounting data of the printed circuit board conveyed with the conveying apparatus 2B. It is a figure which shows the components arrangement | positioning data which concern on the components supply unit on 7 A of cart bases. It is a figure which shows the components arrangement | positioning data which concern on the components supply unit on 7 A of cart bases. It is a flowchart figure which shows attachment operation | movement. It is an operation | movement flowchart figure of assist mode. It is a top view of the electronic component mounting apparatus which shows the state in which both mounting heads are carrying in simultaneously.

  An embodiment of the present invention will be described below with reference to FIG. 1 for an electronic component mounting apparatus 1 that mounts electronic components on a substrate. In this electronic component mounting apparatus 1, two printed circuit boards P, which are boards, are transported in parallel and are arranged in parallel so as to position each printed circuit board P (in the case of omitting as “lanes”). 2A, 2B, component supply devices 3A, 3B that are arranged on the front and back sides of the main body of the apparatus and supply electronic components, and can be moved in one direction by a drive source (can be reciprocated in the Y direction) There are provided a pair of beams 4A and 4B, and mounting heads 6A and 6B each provided with a suction nozzle 5 and movable in the direction along the beams 4A and 4B by each drive source.

  The conveying devices 2A and 2B are disposed in the front and rear intermediate portions of the back side and the near side of the electronic component mounting device 1, and each include a supply conveyor, a positioning portion for positioning and fixing the printed circuit board P, and a discharge conveyor. Yes. And each said supply conveyor conveys each printed circuit board P received from upstream to each said positioning part, and after each electronic component is mounted | worn on each board | substrate P positioned by the positioning device in this each positioning part, each discharge It is conveyed to the conveyor and then conveyed to the downstream device.

  The component supply devices 3A and 3B are disposed at the back and front positions of the transfer devices 2A and 2B, and a large number of component supply units 8 are arranged in parallel on the feeder bases of the cart tables 7A and 7B as mounting bases. Is. Each cart base 7A, 7B is detachably disposed on the apparatus main body via a connector so that the tip on the component supply side of the component supply unit 8 faces the conveyance path of the printed circuit board P, and each cart base 7A, When 7B is properly attached to the apparatus main body, power is supplied to the component supply unit 8 mounted on the cart bases 7A and 7B, and when the handle is released and the handle is pulled, it can be moved by a caster provided on the lower surface. It is a configuration.

  The pair of front and rear beams 4A and 4B which are long in the X direction are individually moved by sliding a slider fixed to each beam along a pair of left and right front and rear guides driven by each Y direction linear motor 9. Move in the Y direction. The Y-direction linear motor 9 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. 9A.

  The beams 4A and 4B are respectively provided with mounting heads 6A and 6B which move along the guides in the longitudinal direction (X direction) by the X direction linear motor 10, respectively. Is composed of a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided between the stators and provided on the mounting heads 6A and 6B.

  Accordingly, the mounting heads 6A and 6B are provided inside the beams 4A and 4B so as to face each other, and in the normal mode (other than the assist mode), the corresponding printed circuit board P on the transfer devices 2A and 2B and the corresponding component supply are provided. The device 3A, 3B is moved above the part extraction position.

  That is, the mounting heads 6A and 6B provided in the beams 4A and 4B take out electronic components from the component supply units 8 of the corresponding component supply devices 3A and 3B, and in principle (normal mode), are provided in the beam 4A. The mounted head 6A takes out the electronic components from the back-side component supply device 3A and mounts them only on the printed circuit board P on the back-side transport device 2A. The mounting head 6B provided on the beam 4B supplies the front-side components. The electronic parts are taken out from the apparatus 3B and are shared so as to be mounted only on the printed circuit board P on the transport apparatus 2B on the near side.

  However, in the assist mode to be described later, the mounting head 6A provided on the beam 4A takes out an electronic component from the component supply device 3B on the near side and mounts it on the printed board P on the transport device 2B on the near side, or attaches to the beam 4B. The provided mounting head 6B is controlled to take out an electronic component from the back side component supply device 3A and mount it on the printed circuit board P on the back side transport device 2A.

  Each of the mounting heads 6A and 6B is provided with four suction nozzles 5 biased downward by respective springs at predetermined intervals on the circumference. 12, and by rotating the mounting heads 6 </ b> A and 6 </ b> B around the vertical axis by the θ-axis motor 13, as a result, the suction nozzles 5 of the mounting heads 6 </ b> A and 6 </ b> B can move in the X direction and the Y direction. It can rotate around a vertical line and can move up and down.

  Each component recognition camera 14 collectively images the electronic components sucked and held by the suction nozzles 5 provided in the mounting heads 6A and 6B.

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 15, and stores a ROM (Read Only Memory) 16 for storing a program related to this control and various data. A RAM (Random Access Memory) 17 is connected via a bus line 18. Further, a monitor 19 for displaying an operation screen and the like, and a touch panel switch 20 as input means formed on the display screen of the monitor 19 are connected to the CPU 15 via an interface 21. The Y-direction linear motor 9 and the like are connected to the CPU 15 via a drive circuit 22 and an interface 21. The CPU 15 functions as control means, grasping means, confirmation means, determination means, extraction means, and the like.

  The RAM 13 stores mounting data for each type of printed circuit board P related to component mounting for each of the transport devices 2A and 2B. 3 and 4 show mounting data for one type of printed circuit board P corresponding to each of the transfer devices 2A and 2B. That is, for each mounting order (step number P), position information in the X direction (mounting coordinates X), position information in the Y direction (mounting coordinates Y), and mounting angle of each electronic component in the printed circuit board P. Information (mounting angle Z), nozzle number information of the suction nozzle 5 (nozzle number N, indicated by “1” to “4”), arrangement number information of each component supply unit 8 (feeder number FDR), mounting heads 6A, 6B Number information (head number HD, mounting head 6A provided on back beam 4A is "1", mounting head 6B provided on front beam 4B is indicated by "2"), two rows of conveying devices The transport device 2A on the back side of 2A and 2B displays “B”, and the transport device 2B on the front side stores transport lane information (DUAL lane A / B) and control commands for displaying “A”. .

  Further, for each mounting order (step number P) of the mounting data, assist data A including status information and head number information (head number), nozzle number information of the suction nozzle 5 to be used when assisting, supply of each component Stored is assist data B including arrangement number information of the unit 8 and number information of the mounting heads 6A and 6B.

  The status information of the assist data A is information indicating the processing execution state for managing the assist operation, “0” indicates that the electronic component mounting process is not processed, and “1” indicates that the mounting step number has been extracted ( With the determination of the mounting step number to be processed in one reciprocation between the component supply device 3A or 3B and the printed circuit board P, a maximum of four chain suctions can be performed (including during the suction operation and during the processing). )), “2” means the end of the mounting process. The head number information of the assist data A is information for adding mounting head number data for performing the extracted mounting process when the mounting step is extracted. “0” is an unassigned state, and “1” is a mounting head. The number “1” (meaning the mounting head 6A) performs the mounting process, and “2” means the mounting head number “2” (meaning the mounting head 6B) performs the mounting process.

  The nozzle number information of the suction nozzle 5, the arrangement number information of each component supply unit 8, and the number information of the mounting heads 6A and 6B in the assist data B are “-”, and there is no target transport apparatus that can assist. It shows that. The mounting data of the printed circuit board P produced by the transport device 2A is shown in FIG. 3, and the mounting data of the printed circuit board P produced by the transport device 2B is shown in FIG.

  Further, in the RAM 13, as shown in FIG. 5, each electronic component type (FDR number) corresponding to the component supply unit arrangement number (FDR number) of each component supply unit 8 disposed on one cart base 7A (see FIG. 5). (Part ID) information (part arrangement data) is stored, and as shown in FIG. 6, the part supply unit arrangement number (FDR number) of each of the part supply units 8 arranged on the other cart base 7B. ) Information (component arrangement data) of the type (component ID) of each electronic component corresponding to () is stored.

  Then, as shown in FIGS. 5 and 6, the component supply unit 8 having FDR numbers “101” to “126” related to the cart base 7A corresponding to the transport apparatus 2A and the cart base 7B corresponding to the transport apparatus 2B. The electronic parts of different types (part IDs are different) are supplied from the parts supply unit 8 having the FDR numbers “201” to “226”.

  Furthermore, component library data for each electronic component including shape data, recognition data, control data, and component supply data representing the characteristics of the electronic component is stored.

  A recognition processing device 23 is connected to the CPU 15 via the interface 21. The recognition processing device 23 recognizes an image captured by the component recognition camera 14, and the processing result is sent to the CPU 15. Is sent out. That is, the CPU 15 outputs an instruction to the recognition processing device 23 so as to perform recognition processing (calculation of misalignment amount) on the image captured by the component recognition camera 14 and receives the recognition processing result from the recognition processing device 23. is there.

  With the above configuration, the mounting operation will be described with reference to FIG. When the component mounting on one printed circuit board P is completed, first, the CPU 15 confirms whether or not there is a substrate in which the electronic component has been mounted in the electronic component mounting apparatus 1 (step S01), and the component mounting is completed. Next, since there is the substrate P, it is confirmed whether there is a substrate request from the post-process device (step S02). If there is a request, the printed circuit board P is discharged to the post-process device (step S03), and the discharge is completed. Then, a substrate request is made to the previous process apparatus (S04), and immediately after that, it is confirmed whether the substrate P is carried in from the previous process apparatus (S05).

  At the time of determination in step S05 immediately after issuing the substrate request, since the substrate P has not been carried in, the CPU 15 controls to start assist mode processing described later.

  That is, after the component mounting is completed, the substrate request to the previous process apparatus is output without the substrate P, waiting for the substrate P to be carried in, and the mounting head 6A or 6B cannot perform the mounting operation. It is determined that the state is in effect, and assist mode processing is performed.

  After the assist mode process is executed, the process returns to step S01. However, since the mounted substrate P has not been discharged, it is determined whether the substrate P has been carried in from the previous process (S05).

  If the substrate P is not loaded from the previous process apparatus, the assist mode process is executed again using the standby state of the mounting head 6A or 6B (S05, S06). If it has been carried in from the previous process device, the substrate request to the previous process device is turned off (step S07), and then the printed board P is taken in and positioned in the positioning unit (step S08).

  Next, the CPU 15 extracts a process mounting step based on the mounting data, cuts out, and writes assist data A (step S09). That is, in the mounting data shown in FIG. 3 or FIG. 4, the mounting process of the electronic component is in an unprocessed state in order for the mounting head 6A or 6B to pick up and take out the electronic component from the respective component supply device 3A or 3B. Is extracted from the extracted mounting step, and the head information (head number) is written together with the status information written as “1” (step S09). . In this case, if extraction of the mounting step is mounting data of the printed circuit board P of the transport apparatus 2A, “1” is set as the head number of the mounting head 6A, and if mounting data of the printed circuit board P of the transport apparatus 2B is extracted. Write “2” as the head number.

  For example, if the extraction of the mounting step is “0004” from the mounting step number “0001” of the mounting data of the printed circuit board P of the transport apparatus 2A, the mounting head 6A first has the FDR number “101” at the mounting step number “0001”. The electronic parts are picked up and taken out from the parts supply unit 8 on the cart base 7A (step S10), and there are other electronic parts that are picked up by the mounting head 6A, so that "102", "103", "104" The electronic parts are picked up and taken out from the parts supply unit 8 on the cart base 7A (step S11).

  Then, the CPU 15 controls the arbitration process of the entry in the mounting portion of the printed circuit board P on the transport device 2A, that is, performs the escape control so that the mounting heads 6A and 6B do not collide (step S12). It is determined whether or not it is possible to enter the mounting area of the printed circuit board P (step S13), that is, whether or not it is possible to enter the mounting area by checking the mounting state in the assist operation of the opposing beam 4A or 4B. Judgment and repeat control of entry arbitration processing until entry is possible.

  If it is determined that entry is possible, the component recognition camera 14 collectively images the electronic components sucked and held by the four suction nozzles 5 of the mounting head 6A, and the recognition processing device 23 performs recognition processing (step S14). ).

  That is, the mounting head 6A is passed over the component recognition camera 14, and a plurality of electronic components sucked and held by the suction nozzles 5 of the both mounting heads 6A during the movement are collectively imaged. The recognition processing device 23 recognizes and grasps the positional deviation with respect to the suction nozzle 5.

  After that, each component recognition processing result is added to the mounting coordinates of the mounting data, and it is moved onto the printed circuit board P positioned on the transport device 2A, and the vertical axis motor 12 and the θ-axis motor 13 are also corrected and controlled. Meanwhile, the suction nozzle 5 is sequentially lowered to mount the electronic component (step S15).

  In this case, “2” is written as status information of the assist data A of the mounting step number for each mounting operation of the electronic component (rewriting from “1” to “2” (step S16)). Check whether there are other electronic components to be mounted on the mounting head 6A, and repeat until the mounting of all the electronic components on the mounting head 6A is completed, and determine that the mounting of all the electronic components on the mounting head 6A is completed. Then (step S17), it is next determined whether or not all the electronic components specified by the mounting data have been mounted (step S18).

  If it is determined that all the electronic components specified by the mounting data have not been mounted, the process returns to step S09, and the next cutting and mounting are repeated until the control command in the mounting data becomes “E”.

  The above-described extraction of the electronic component and mounting on the printed circuit board A are performed on the printed circuit board P of the transport apparatus 2A and the printed circuit board P of the transport apparatus 2B. Then, it is determined whether or not all of the electronic components designated by the mounting data have been mounted (step S18). If it is determined that the mounting has ended, it is determined whether or not there is an instruction to stop the mounting operation. If there is a stop instruction, it is controlled to stop and the mounting operation is terminated. If there is no stop instruction, the process returns to step S01. The instruction to stop the mounting operation is, for example, when the stop button is pressed by the operator, the stop switch is operated, so that the CPU 15 can confirm the presence or absence of the instruction.

  Returning to Step S01, since there is the mounting completion substrate P, it is confirmed whether there is a substrate request from the post-process apparatus (Step S02). If there is no substrate request, the assist mode processing is executed (Step S06).

  After the assist mode process is executed, the process returns to step S01. However, if there is no substrate request from the subsequent process (step S02), the assist mode process is executed again (step S06).

  In this way, when a substrate request from the post-process apparatus is generated (step S02), the substrate discharge operation is executed in the same manner as described above (step S03), and the substrate request to the pre-process apparatus is made (step S04). ).

  Here, as described above, there is a printed circuit board P that has been mounted in the electronic component mounting apparatus 1 (step S01), and it is confirmed whether there is a board request from the post-process apparatus (step S02). If there is not, or after turning on the substrate request to the previous process device (step S04), it is confirmed whether the printed circuit board P is loaded from the previous process device (step S05). Although control is performed so as to perform mode processing (step S06), the assist mode processing operation will be described with reference to FIG.

  That is, in any of the above cases, when the mounting operation of the electronic component on the substrate in the one transport device 2A or 2B by the mounting head 6A or 6B of the one beam 4A or 4B is in a standby state, for example, the electronic component If the mounting head 6A of the beam 4A or the mounting head 6B of the beam 4B is in a standby state regardless of the presence or absence of the printed circuit board P, the printed circuit board in the other transport device 2B or 2A An assist mode processing operation for assisting work related to mounting of an electronic component on P will be described. Note that, by this assist mode processing operation, one of the transport apparatuses 2A or 2B configured to deliver the substrate P during the mounting processing time of the electronic components of the mounting heads 6A and 6B provided in the two beams 4A and 4B. Regarding the lane, even if there is a significant deviation among the plurality of electronic component mounting devices constituting the mounting line, the electronic component mounting device becomes a bottleneck in the balance of production efficiency of each electronic component mounting device 1 in the electronic component mounting line. 1 can be prevented as much as possible.

  Even if the standby state is not as described above, an abnormality occurs in one lane regardless of the presence or absence of the substrate P, the setup of the component supply unit 8 of the cart base 7 in one lane, the removal of the component supply unit 8, etc. Even when the mounting head 6A or 6B is in an idle state (standby state is also included in the idle state) in which components cannot be mounted on the board P to be originally mounted on the one lane side (own side), the CPU 15 is in the idle state. It is possible to control to perform the assist mode processing by determining the above.

  In FIG. 8, first, it is determined whether or not the opposing transport device 2A or 2B (“opposite lane” and the assisted lane) has the printed circuit board P (step S21). 2A or 2B is also waiting, and the assist operation is postponed, and the assist mode processing operation ends.

However, as described above, since the number of attachment points “308” of the printed circuit board P in the transport device 2B is larger than the number of attachment points “88” of the printed circuit board P in the transport device 2A, the mounting of the printed circuit board P in the transport device 2A is completed. Therefore, if there is the printed circuit board P in the opposing transport device 2B (assisted transport device), the CPU 15 grasps the mounting status of the electronic components on the printed circuit board P in the facing lane (step S22). Specifically, the mounting state is grasped by referring to mounting data (see FIG. 4) of the printed circuit board P in the opposite lane.

  Then, the unprocessed process (assisted with the status information of assist data A being “0”) that is processed in one reciprocation between the component supply device 3B on the side close to the opposing transport device 2B and the printed circuit board P. A maximum of four mounting step numbers are extracted from the top, that is, from the smallest mounting step number (step S23).

  Next, “1” is written in the status information of the assist data A in the extracted mounting step number, and the number of the mounting head 6A or 6B that performs the assist operation is written for one round trip (step S24).

  Then, the CPU 15 controls the mediation processing of the entry in the suction portion of the component supply device 3B to be assisted, that is, performs the escape control so that the mounting heads 6A and 6B do not collide (step S25), and then It is determined whether or not the mounting heads 6A and 6B to the suction portion of the component supply device 3B can be simultaneously loaded (see FIG. 9) (step S26), and control of the arbitration process for loading is performed until simultaneous loading is possible. Repeat (step S26).

  If it is determined that the simultaneous placement is possible by the placement arbitration process, the electronic head is picked up and taken out from the component supply unit 8 on the cart base 7B by using the mounting head 6A having the written number ( Step S27). Next, it is confirmed whether or not there are other electronic components to be picked up by the mounting head 6A (step S28), and the process is repeated until all the electronic components to be picked up are picked up and picked up.

  In this case, if it is the printed circuit board P of the transport apparatus 2B that is assisted and the unprocessed mounting step number to be assisted is “0301” to “0304”, as shown in FIG. According to the assist data B, using the numbers “1” to “4” of the suction nozzle 5 of the mounting head 6A whose mounting head number is “1”, the feeder numbers “219” to “222” on the cart base 7B are used. The electronic components are taken out from the respective component supply units 8.

  Then, when all of the electronic components are taken out by the mounting head 6A, the CPU 15 controls the mediation processing of the loading in the mounting portion of the printed circuit board P on the transport device 2B to be assisted, that is, the mounting head 6A Control is performed so as not to collide with 6B (step S29), whether or not the printed board P can be entered into the mounting area is determined (step S30), and arbitration is performed until entry is possible. When it is determined that the approach is possible by repeating the control of the processing, the component recognition camera 14 collectively captures the electronic components sucked and held by the four suction nozzles 5 of the mounting head 6A, and the recognition processing device 23 recognizes them. Process (step S31).

  That is, the mounting head 6A is passed over the component recognition camera 14, and during this movement, a plurality of electronic components sucked and held by the suction nozzles 5 of the mounting head 6A are collectively picked up, and the picked-up images are displayed. The recognition processing device 23 performs recognition processing to grasp the positional deviation with respect to the suction nozzle 5.

  After that, each component recognition processing result is added to the mounting coordinates of the mounting data, and it is moved onto the printed circuit board P positioned on the transport device 2B, and the vertical axis motor 12 and the θ axis motor 13 are also corrected and controlled. Meanwhile, the suction nozzle 5 is sequentially lowered to mount the electronic component (step S32).

  In this case, for each electronic component mounting operation, “2” is written as the status information of the assist data of the mounting step number for which the mounting operation has been completed (from “1” to “2” (step S33)). Then, it is determined whether there are other electronic components to be mounted on the mounting head 6A (step S34), and if there are, the mounting operation and the writing operation are repeated.

  If it is determined that the mounting of all the electronic components on the mounting head 6A or 6B is completed (step S34), the process returns to step S01 shown in FIG. 7 and the operation as described above is performed.

  When all the electronic components are mounted on the printed circuit board P on the transport device 2B in this way, the printed circuit board P is removed from the substrate positioning unit via the discharge conveyor based on the substrate request from the post-process device. Delivered to the post-process equipment.

  Although the post-process apparatus is the next apparatus, it constitutes the transfer apparatuses 2A and 2B, and is a discharge conveyor that delivers the component-mounted board from the positioning position of the board P and discharges it to the post-process apparatus. If the printed circuit board P can be stopped, this discharge conveyor may be considered as a post-process device. In addition, the pre-process device is the previous device, but constitutes the transport devices 2A and 2B, and the printed circuit board P stops at the supply conveyor that feeds and transports the printed circuit board P to the positioning position for mounting the components. If possible, this supply conveyor may be considered a pre-process device.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2A, 2B Conveyor apparatus 3A, 3B Component supply apparatus 8 Component supply unit 6A, 6B Mounting head 7A, 7B Cart base 15 CPU
17 RAM
P Printed circuit board

Claims (6)

And line Nau two conveying devices conveying the substrate in the other direction is respectively orthogonal to the one direction aligned in one direction, is disposed on the front side and the rear side in the direction of the apparatus body is attached to said substrate two component supplying device for supplying a plurality of types of electronic components, a mounting head which is movable by respective other direction driving source before Symbol other direction to a pair of beams facing movable by one-way drive source to said one direction And mounting the electronic component taken out from any one of the component supply devices by the mounting head provided on any one of the beams onto the substrate that is transported by any one of the transporting devices. In the mounting method of
If the mounting head of any of the beams is not in an idle state, the mounting head of the beam on the near side takes out the electronic component from the component supply device on the near side, and Mounting on the substrate in the transfer device, the mounting head of the beam on the back side takes out the electronic component from the component supply device on the back side and mounts it on the substrate in the transfer device on the back side. on the other hand,
Any when the mounting head of one of said beams is in the idle state, to grasp the installation status of the electronic components to the substrate in the other of said conveying device facing,
Based on the result of grasping the mounting state of the electronic component, the mounting head in the idle state can simultaneously enter the mounting head of the other beam with respect to the electronic component that is not mounted on the board in the other transfer device. In the situation, take out from the component supply device close to the other transport device, adjust the entry so that the mounting head in the idle state does not collide with the mounting head of the other beam, in the other transport device An electronic component mounting method comprising mounting on a substrate. And line Nau two conveying devices conveying the substrate in the other direction is respectively orthogonal to the one direction aligned in one direction, is disposed on the front side and the rear side in the direction of the apparatus body is attached to said substrate two component supplying device for supplying a plurality of types of electronic components, a mounting head which is movable by respective other direction driving source before Symbol other direction to a pair of beams facing movable by one-way drive source to said one direction And mounting the electronic component taken out from any one of the component supply devices by the mounting head provided on any one of the beams onto the substrate that is transported by any one of the transporting devices. In the mounting method of
When the mounting head of any of the beams is not in a standby state without completing the mounting of the electronic component, the mounting head of the beam on the near side causes the component supply device on the near side to The electronic component is taken out and mounted on the substrate in the transport device on the near side, and the electronic component is taken out from the component supply device on the back side by the mounting head of the beam on the back side, and the back side While being mounted on a substrate in the transfer device,
By mounting the completed electronic part, if any the mounting head of one of said beams is in the standby state, to grasp the installation status of the electronic components to the substrate in the other of said conveying device facing,
Based on the result of grasping the mounting state of the electronic component, the mounting head in the standby state can simultaneously enter the mounting head of the other beam with respect to the electronic component that is not mounted on the substrate in the other transfer device. In the situation, take out from the component supply device close to the other transport device, adjust the entry so that the mounting head in the standby state does not collide with the mounting head of the other beam, in the other transport device An electronic component mounting method comprising mounting on a substrate. And line Nau two conveying devices conveying the substrate in the other direction is respectively orthogonal to the one direction aligned in one direction, is disposed on the front side and the rear side in the direction of the apparatus body is attached to said substrate two component supplying device for supplying a plurality of types of electronic components, a mounting head which is movable by respective other direction driving source before Symbol other direction to a pair of beams facing movable by one-way drive source to said one direction And mounting the electronic component taken out from any one of the component supply devices by the mounting head provided on any one of the beams onto the substrate that is transported by any one of the transporting devices. In the mounting method of
When the mounting head of any of the beams is not in a standby state without completing the mounting of the electronic component, the mounting head of the beam on the near side causes the component supply device on the near side to The electronic component is taken out and mounted on the substrate in the transport device on the near side, and the electronic component is taken out from the component supply device on the back side by the mounting head of the beam on the back side, and the back side While being mounted on a substrate in the transfer device,
By mounting the completed electronic part, if any the mounting head of one of said beams is in the standby state, to grasp the installation status of the electronic components to the substrate in the other of said conveying device facing,
Based on the result of grasping the mounting state of the electronic component, the mounting process in the mounting data corresponding to the substrate in the other transfer device is extracted for one reciprocation of the beam in the standby state for the mounting step that is not processed,
Based-out in the mounting step of the extracted 1 round trip unprocessed, in the mounting head simultaneously served may status of the beam the mounting head and the other of the standby state, the part closer to the other of said conveying device An electronic component that is not mounted on the substrate in the other transport device is taken out from the supply device, and the mounting head in the standby state of the other beam is moved based on the extracted unprocessed mounting step for one reciprocation. A mounting method for an electronic component, wherein the mounting adjustment is performed so that the mounting head does not collide with the mounting head, and the mounting is performed on the substrate in the other transfer device. And line Nau two conveying devices conveying the substrate in the other direction is respectively orthogonal to the one direction aligned in one direction, is disposed on the front side and the rear side in the direction of the apparatus body is attached to said substrate two component supplying device for supplying a plurality of types of electronic components, a mounting head which is movable by respective other direction driving source before Symbol other direction to a pair of beams facing movable by one-way drive source to said one direction And mounting the electronic component taken out from any one of the component supply devices by the mounting head provided on any one of the beams onto the substrate that is transported by any one of the transporting devices. In the mounting device of
If the mounting head of any of the beams is not in an idle state, the mounting head of the beam on the near side takes out the electronic component from the component supply device on the near side, and The electronic device is mounted on the substrate in the transfer device, and the electronic component is taken out from the component supply device on the deep side by the mounting head of the beam on the deep side, and mounted on the substrate in the transfer device on the deep side. Control means for controlling;
If any the mounting head of one of said beams is in the idle state, and a monitor which monitors the installation status of the electronic components to the substrate in the other of said conveying device facing,
When the mounting head of any one of the beams is in an idle state, the control unit determines whether the grasping unit grasps the mounting state of the electronic component, and the substrate in the other transporting device. For the electronic component that is not mounted on, in the situation where the mounting head in the idle state can be simultaneously loaded with the mounting head of the other beam , the electronic component is taken out from the component supply device close to the other transport device, and the idle state the mounting head on the fly adjustment so as not to collide with the mounting head of the other of said beams, mounting apparatus of electronic components, wherein the benzalkonium controls to mount on a substrate in the other of said conveying device . And line Nau two conveying devices conveying the substrate in the other direction is respectively orthogonal to the one direction aligned in one direction, is disposed on the front side and the rear side in the direction of the apparatus body is attached to said substrate two component supplying device for supplying a plurality of types of electronic components, a mounting head which is movable by respective other direction driving source before Symbol other direction to a pair of beams facing movable by one-way drive source to said one direction And mounting the electronic component taken out from any one of the component supply devices by the mounting head provided on any one of the beams onto the substrate that is transported by any one of the transporting devices. In the mounting device of
When the mounting head of any of the beams is not in a standby state without completing the mounting of the electronic component, the mounting head of the beam on the near side causes the component supply device on the near side to The electronic component is taken out and mounted on the substrate in the transport device on the near side, the electronic component is taken out from the component supply device on the back side by the mounting head of the beam on the back side, and the back side Control means for controlling to be mounted on a substrate in the transfer device;
Grasping means for grasping the mounting state of the electronic component on the substrate in the other transporting device when mounting of the electronic component is completed and the mounting head of one of the beams is in a standby state It equipped with a door,
When the mounting head of any one of the beams is in a standby state, the control unit determines whether the grasping unit grasps the mounting state of the electronic component, and the substrate in the other transporting device. In the situation where the mounting head in the standby state can be loaded simultaneously with the mounting head of the other beam , the electronic component not mounted on the electronic component is taken out from the component supply device close to the other transport device, and the standby state the mounting head on the fly adjustment so as not to collide with the mounting head of the other of said beams, mounting apparatus of electronic components, wherein the benzalkonium controls to mount on a substrate in the other of said conveying device . And line Nau two conveying devices conveying the substrate in the other direction is respectively orthogonal to the one direction aligned in one direction, is disposed on the front side and the rear side in the direction of the apparatus body is attached to said substrate two component supplying device for supplying a plurality of types of electronic components, a mounting head which is movable by respective other direction driving source before Symbol other direction to a pair of beams facing movable by one-way drive source to said one direction And mounting the electronic component taken out from any one of the component supply devices by the mounting head provided on any one of the beams onto the substrate that is transported by any one of the transporting devices. In the mounting device of
When the mounting head of any of the beams is not in a standby state without completing the mounting of the electronic component, the mounting head of the beam on the near side causes the component supply device on the near side to The electronic component is taken out and mounted on the substrate in the transport device on the near side, the electronic component is taken out from the component supply device on the back side by the mounting head of the beam on the back side, and the back side Control means for controlling to be mounted on a substrate in the transfer device;
Grasping means for grasping the mounting state of the electronic component on the substrate in the other transporting device when mounting of the electronic component is completed and the mounting head of one of the beams is in a standby state When,
Based on the result of the grasping means grasping the mounting state of the electronic component, one reciprocal extraction of the beam in the waiting state is performed for the mounting step in which the mounting process in the mounting data corresponding to the substrate in the other transfer device is not processed. Extracting means for
Wherein, when any one the mounting head of one of said beams is in the standby state,-out based on the mounting step of the untreated 1 reciprocation extracted by the extraction means, the standby state In a situation where the mounting head of the other beam can enter the mounting head of the other beam at the same time, the mounting head in the standby state is mounted from the component supply device close to the other transport device to the substrate in the other transport device. to eject the electronic parts that are not based on the unprocessed attachment steps 1 reciprocation of the extracted, of the mounting head and the other of said beam the fly so as not to collide with the mounting head adjustment of the standby state Moreover, mounting apparatus for electronic components, wherein the benzalkonium controls to mount on a substrate in the other of said conveying device.

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