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JP5774441B2 - Injection molding machine and mold thickness adjusting method for injection molding machine - Google Patents
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JP5774441B2 - Injection molding machine and mold thickness adjusting method for injection molding machine - Google Patents

Injection molding machine and mold thickness adjusting method for injection molding machine Download PDF

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JP5774441B2
JP5774441B2 JP2011232292A JP2011232292A JP5774441B2 JP 5774441 B2 JP5774441 B2 JP 5774441B2 JP 2011232292 A JP2011232292 A JP 2011232292A JP 2011232292 A JP2011232292 A JP 2011232292A JP 5774441 B2 JP5774441 B2 JP 5774441B2
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mold
movable
fixed
movable member
contact
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JP2013086488A (en
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達也 柴田
達也 柴田
惇朗 田村
惇朗 田村
知寛 森谷
知寛 森谷
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Priority to TW101124784A priority patent/TWI492832B/en
Priority to CN201210260147.5A priority patent/CN103057063B/en
Priority to KR1020120116556A priority patent/KR101330041B1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/64Mould opening, closing or clamping devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1761Means for guiding movable mould supports or injection units on the machine base or frame; Machine bases or frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/80Measuring, controlling or regulating of relative position of mould parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/64Mould opening, closing or clamping devices
    • B29C2045/645Mould opening, closing or clamping devices using magnetic means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/76083Position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/76167Presence, absence of objects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76568Position
    • B29C2945/76581Position distance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76585Dimensions, e.g. thickness

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

本発明は、射出成形機、及び射出成形機の型厚調整方法に関する。   The present invention relates to an injection molding machine and a mold thickness adjusting method for an injection molding machine.

射出成形機は、溶融樹脂を射出装置から射出して金型装置のキャビティに充填し、固化させることによって成形品を成形する。金型装置は固定金型及び可動金型で構成される。金型装置の型閉じ、型締め、及び型開きは型締装置によって行われる。   The injection molding machine molds a molded product by injecting molten resin from an injection apparatus, filling the cavity of a mold apparatus, and solidifying. The mold apparatus includes a fixed mold and a movable mold. Mold closing, mold clamping, and mold opening of the mold apparatus are performed by a mold clamping apparatus.

型締装置として、モータなどの駆動源とトグル機構とを用いる方式のものが広く用いられているが、トグル機構の特性上、型締力を変更することが困難であり、応答性や安定性が悪い。また、トグル機構の動作時に曲げモーメントが発生し、金型装置を取り付ける取り付け面などが歪むことがある。   As a mold clamping device, a system using a drive source such as a motor and a toggle mechanism is widely used. However, due to the characteristics of the toggle mechanism, it is difficult to change the mold clamping force, and responsiveness and stability. Is bad. In addition, a bending moment may be generated during the operation of the toggle mechanism, and the mounting surface to which the mold apparatus is attached may be distorted.

そこで、型開閉動作にはリニアモータを用い、型締め動作に電磁石の吸着力を利用した型締装置が提案されている。この型締装置は、固定金型が取り付けられる固定プラテンと、可動金型が取り付けられる可動プラテンと、可動プラテンと共に移動する吸着板と、可動プラテンと吸着板との間に配設されるリヤプラテンと、リヤプラテンを貫通して可動プラテンと吸着板とを連結するロッドとを備える。リヤプラテンと吸着板との間に電磁石による吸着力が生じると、吸着力がロッドを介して可動プラテンに伝達し、可動プラテンと固定プラテンとの間に型締力が生じる。   Therefore, a mold clamping device has been proposed that uses a linear motor for the mold opening and closing operation and uses the attractive force of an electromagnet for the mold clamping operation. The mold clamping device includes a fixed platen to which a fixed mold is attached, a movable platen to which a movable mold is attached, a suction plate that moves together with the movable platen, and a rear platen that is disposed between the movable platen and the suction plate. And a rod that penetrates the rear platen and connects the movable platen and the suction plate. When an attracting force by an electromagnet is generated between the rear platen and the attracting plate, the attracting force is transmitted to the movable platen via the rod, and a mold clamping force is generated between the movable platen and the fixed platen.

ところで、金型装置を交換すると、金型装置の厚さが変わり、型閉じ終了時にリヤプラテンと吸着板との間に形成されるギャップが変わることがある。ギャップが変わると、吸着力が変わり、型締力が変わる。   By the way, when the mold apparatus is replaced, the thickness of the mold apparatus changes, and the gap formed between the rear platen and the suction plate at the end of mold closing may change. When the gap changes, the suction force changes and the clamping force changes.

これに対し、従来から、金型装置の厚さに応じて可動プラテンと吸着板との間隔を調整する型厚調整部が提案されている(例えば特許文献1参照)。型厚調整部は、固定金型に可動金型を当接させた状態で、可動プラテンと吸着板との間隔を調整し、ギャップを設定値に調整する。   On the other hand, conventionally, a mold thickness adjusting unit that adjusts the distance between the movable platen and the suction plate in accordance with the thickness of the mold apparatus has been proposed (for example, see Patent Document 1). The mold thickness adjusting unit adjusts the gap to a set value by adjusting the interval between the movable platen and the suction plate while the movable mold is in contact with the fixed mold.

国際公開第05/090052号パンフレットWO05 / 090052 pamphlet

特許文献1では、金型装置の厚さに応じて可動プラテンと吸着板との間隔を調整する型厚調整部が提案されているが、具体的な調整方法の詳細について言及がない。   Patent Document 1 proposes a mold thickness adjustment unit that adjusts the distance between the movable platen and the suction plate in accordance with the thickness of the mold apparatus, but does not mention details of a specific adjustment method.

本発明は、上記課題に鑑みてなされたものであって、金型装置の交換に適した射出成形機、及び射出成形機の型厚調整方法の提供を目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide an injection molding machine suitable for replacement of a mold apparatus and a mold thickness adjusting method for the injection molding machine.

上記目的を解決するため、本発明の態様(1)による射出成形機は、
固定金型が取り付けられる第1の固定部材と、
可動金型が取り付けられる第1の可動部材と、
該第1の可動部材と共に移動する第2の可動部材と、
前記第1の可動部材と前記第2の可動部材との間に配設される第2の固定部材と、
前記第2の可動部材及び前記第2の固定部材の一方に形成され、他方を吸着して型締力を発生させる電磁石と、
前記第1の可動部材と前記第2の可動部材との間隔を調整する型厚調整部と、
該型厚調整部を制御する型厚調整処理部と、
前記第2の可動部材と前記第2の固定部材との間に所定のギャップを形成した状態で、前記第2の可動部材の型開き方向への移動を制限する移動制限部とを備え、
該移動制限部によって前記移動を制限した状態で、前記型厚調整処理部が前記型厚調整部を駆動して、前記第1の可動部材を型閉じ方向に移動させ、前記可動金型及び前記固定金型を介して前記第1の固定部材に接触させることを特徴とする。
In order to solve the above object, an injection molding machine according to the aspect (1) of the present invention provides:
A first fixing member to which a fixed mold is attached;
A first movable member to which a movable mold is attached;
A second movable member that moves with the first movable member;
A second fixed member disposed between the first movable member and the second movable member;
An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
A mold thickness adjusting unit for adjusting an interval between the first movable member and the second movable member;
A mold thickness adjustment processing unit for controlling the mold thickness adjustment unit;
A movement restricting portion for restricting movement of the second movable member in the mold opening direction in a state where a predetermined gap is formed between the second movable member and the second fixed member;
In a state where the movement is restricted by the movement restriction unit, the mold thickness adjustment processing unit drives the mold thickness adjustment unit to move the first movable member in the mold closing direction, and the movable mold and the It is made to contact the said 1st fixing member through a fixed metal mold | die.

また、本発明の態様(2)による射出成形機の型厚調整方法は、
固定金型が取り付けられる第1の固定部材と、
可動金型が取り付けられる第1の可動部材と、
該第1の可動部材と共に移動する第2の可動部材と、
前記第1の可動部材と前記第2の可動部材との間に配設される第2の固定部材と、
前記第2の可動部材及び前記第2の固定部材の一方に形成され、他方を吸着して型締力を発生させる電磁石と、
前記第1の可動部材と前記第2の可動部材との間隔を調整する型厚調整部とを備える射出成形機の型厚調整方法において、
前記第2の可動部材と前記第2の固定部材との間に所定のギャップを形成し、且つ、前記第2の可動部材の型開き方向への移動を制限した状態で、前記型厚調整部を駆動して、前記第1の可動部材を型閉じ方向に移動させ、前記可動金型及び前記固定金型を介して前記第1の固定部材に接触させることを特徴とする。
Moreover, the mold thickness adjusting method of the injection molding machine according to the aspect (2) of the present invention is:
A first fixing member to which a fixed mold is attached;
A first movable member to which a movable mold is attached;
A second movable member that moves with the first movable member;
A second fixed member disposed between the first movable member and the second movable member;
An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
In a mold thickness adjusting method for an injection molding machine comprising a mold thickness adjusting unit that adjusts an interval between the first movable member and the second movable member.
In a state where a predetermined gap is formed between the second movable member and the second fixed member and movement of the second movable member in the mold opening direction is restricted, the mold thickness adjusting unit Is driven to move the first movable member in the mold closing direction and to contact the first fixed member via the movable mold and the fixed mold.

本発明によれば、金型装置の交換に適した射出成形機、及び射出成形機の型厚調整方法が提供される。   ADVANTAGE OF THE INVENTION According to this invention, the mold thickness adjustment method of the injection molding machine suitable for replacement | exchange of a die apparatus and an injection molding machine is provided.

本発明の一実施形態による射出成形機の型閉じ時の状態を示す図The figure which shows the state at the time of mold closing of the injection molding machine by one Embodiment of this invention 本発明の一実施形態による射出成形機の型開き時の状態を示す図The figure which shows the state at the time of the mold opening of the injection molding machine by one Embodiment of this invention 本発明の一実施形態による射出成形機の型厚調整の説明図Explanatory drawing of mold thickness adjustment of the injection molding machine by one Embodiment of this invention

以下、本発明を実施するための形態について図面を参照して説明するが、各図面において、同一の又は対応する構成については同一の又は対応する符号を付して説明を省略する。また、型閉じを行う際の可動プラテンの移動方向を前方とし、型開きを行う際の可動プラテンの移動方向を後方として説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each of the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof will be omitted. Further, a description will be given assuming that the moving direction of the movable platen when performing mold closing is the front and the moving direction of the movable platen when performing mold opening is the rear.

図1は、本発明の一実施形態による射出成形機の型閉じ時の状態を示す図である。図2は、本発明の一実施形態による射出成形機の型開き時の状態を示す図である。   FIG. 1 is a view showing a state when a mold is closed in an injection molding machine according to an embodiment of the present invention. FIG. 2 is a view showing a state when the mold of the injection molding machine according to the embodiment of the present invention is opened.

図において、10は型締装置、Frは射出成形機のフレーム、Gdは該フレームFr上に敷設される2本のレールよりなるガイド、11は固定プラテン(第1の固定部材)である。固定プラテン11は、型開閉方向(図において左右方向)に延びるガイドGdに沿って移動可能な位置調整ベースBa上に設けられてよい。尚、固定プラテン11はフレームFr上に載置されてもよい。   In the figure, 10 is a mold clamping device, Fr is a frame of an injection molding machine, Gd is a guide composed of two rails laid on the frame Fr, and 11 is a fixed platen (first fixing member). The fixed platen 11 may be provided on a position adjustment base Ba that is movable along a guide Gd that extends in the mold opening / closing direction (left-right direction in the drawing). The fixed platen 11 may be placed on the frame Fr.

固定プラテン11と対向して可動プラテン(第1の可動部材)12が配設される。可動プラテン12は可動ベースBb上に固定され、可動ベースBbはガイドGd上を走行可能である。これにより、可動プラテン12は、固定プラテン11に対して型開閉方向に移動可能である。   A movable platen (first movable member) 12 is disposed facing the fixed platen 11. The movable platen 12 is fixed on the movable base Bb, and the movable base Bb can run on the guide Gd. Thereby, the movable platen 12 is movable in the mold opening / closing direction with respect to the fixed platen 11.

固定プラテン11と所定の間隔を置いて、かつ、固定プラテン11と平行にリヤプラテン(第2の固定部材)13が配設される。リヤプラテン13は、脚部13aを介してフレームFrに固定される。   A rear platen (second fixing member) 13 is disposed at a predetermined distance from the fixed platen 11 and parallel to the fixed platen 11. The rear platen 13 is fixed to the frame Fr via the leg portion 13a.

固定プラテン11とリヤプラテン13との間に4本の連結部材としてのタイバー14(図においては、4本のタイバー14のうちの2本だけを示す。)が架設される。タイバー14を介して固定プラテン11がリヤプラテン13に固定される。タイバー14に沿って可動プラテン12が進退自在に配設される。可動プラテン12におけるタイバー14と対応する箇所にタイバー14を貫通させるための図示されないガイド穴が形成される。尚、ガイド穴の代わりに、切欠部を形成するようにしてもよい。   Between the fixed platen 11 and the rear platen 13, four tie bars 14 (only two of the four tie bars 14 are shown in the figure) are installed as connecting members. The fixed platen 11 is fixed to the rear platen 13 via the tie bar 14. A movable platen 12 is disposed along the tie bar 14 so as to freely advance and retract. A guide hole (not shown) for penetrating the tie bar 14 is formed at a position corresponding to the tie bar 14 in the movable platen 12. In addition, you may make it form a notch part instead of a guide hole.

タイバー14の前端部(図において右端部)には図示されないネジ部が形成され、該ネジ部にナットn1を螺合して締め付けることによって、タイバー14の前端部が固定プラテン11に固定される。タイバー14の後端部はリヤプラテン13に固定される。   A screw portion (not shown) is formed at the front end portion (right end portion in the drawing) of the tie bar 14, and the front end portion of the tie bar 14 is fixed to the fixed platen 11 by screwing and tightening a nut n1 to the screw portion. The rear end of the tie bar 14 is fixed to the rear platen 13.

固定プラテン11には固定金型15が、可動プラテン12には可動金型16がそれぞれ取り付けられ、可動プラテン12の進退に伴って固定金型15と可動金型16とが接離させられ、型閉じ、型締め及び型開きが行われる。尚、型締めが行われるのに伴って、固定金型15と可動金型16との間に図示されないキャビティ空間が形成され、射出装置17の射出ノズル18から射出された図示されない溶融樹脂がキャビティ空間に充填される。固定金型15及び可動金型16によって金型装置19が構成される。   A fixed mold 15 is attached to the fixed platen 11, and a movable mold 16 is attached to the movable platen 12. The fixed mold 15 and the movable mold 16 are brought into contact with and separated from each other as the movable platen 12 advances and retreats. Closing, mold clamping and mold opening are performed. As the mold clamping is performed, a cavity space (not shown) is formed between the fixed mold 15 and the movable mold 16, and a molten resin (not shown) injected from the injection nozzle 18 of the injection device 17 is formed in the cavity. The space is filled. A mold apparatus 19 is configured by the fixed mold 15 and the movable mold 16.

吸着板22(第2の可動部材)は、可動プラテン12と平行に配設される。吸着板22は取付板27を介してスライドベースSbに固定され、スライドベースSbはガイドGd上を走行可能である。これにより、吸着板22は、リヤプラテン13よりも後方において進退自在となる。吸着板22は、磁性材料で形成されてよい。尚、取付板27はなくてもよく、この場合、吸着板22はスライドベースSbに直に固定される。   The suction plate 22 (second movable member) is disposed in parallel with the movable platen 12. The suction plate 22 is fixed to the slide base Sb via the mounting plate 27, and the slide base Sb can travel on the guide Gd. As a result, the suction plate 22 can move back and forth behind the rear platen 13. The suction plate 22 may be formed of a magnetic material. The attachment plate 27 may not be provided, and in this case, the suction plate 22 is directly fixed to the slide base Sb.

ロッド39は、後端部において吸着板22と連結させて、前端部において可動プラテン12と連結させて配設される。したがって、ロッド39は、型閉じ時に吸着板22が前進するのに伴って前進させられて可動プラテン12を前進させ、型開き時に吸着板22が後退するのに伴って後退させられて可動プラテン12を後退させる。そのために、リヤプラテン13の中央部分にロッド39を貫通させるためのロッド孔41が形成される。   The rod 39 is connected to the suction plate 22 at the rear end portion and is connected to the movable platen 12 at the front end portion. Therefore, the rod 39 is moved forward as the suction plate 22 moves forward when the mold is closed to move the movable platen 12 forward, and is retracted and moved backward as the suction plate 22 moves back when the mold is opened. Retreat. For this purpose, a rod hole 41 for penetrating the rod 39 is formed in the central portion of the rear platen 13.

リニアモータ28は、可動プラテン12を進退させるための型開閉駆動部であって、例えば可動プラテン12に連結された吸着板22とフレームFrとの間に配設される。尚、リニアモータ28は可動プラテン12とフレームFrとの間に配設されてもよい。   The linear motor 28 is a mold opening / closing drive unit for moving the movable platen 12 forward and backward, and is disposed, for example, between the suction plate 22 connected to the movable platen 12 and the frame Fr. The linear motor 28 may be disposed between the movable platen 12 and the frame Fr.

リニアモータ28は、固定子29、及び可動子31を備える。固定子29は、フレームFr上において、ガイドGdと平行に、かつ、スライドベースSbの移動範囲に対応させて形成される。可動子31は、スライドベースSbの下端において、固定子29と対向させて、かつ、所定の範囲にわたって形成される。   The linear motor 28 includes a stator 29 and a mover 31. The stator 29 is formed on the frame Fr in parallel with the guide Gd and corresponding to the movement range of the slide base Sb. The mover 31 is formed at a lower end of the slide base Sb so as to face the stator 29 and over a predetermined range.

可動子31は、コア34及びコイル35を備える。そして、コア34は、固定子29に向けて突出させて、所定のピッチで形成された複数の磁極歯33を備え、コイル35は、各磁極歯33に巻装される。尚、磁極歯33は可動プラテン12の移動方向に対して直角の方向に、互いに平行に形成される。また、固定子29は、図示されないコア、及び該コア上に延在させて形成された図示されない永久磁石を備える。該永久磁石は、N極及びS極の各磁極を交互に着磁させることによって形成される。可動子31の位置を検出する位置センサ53が配置される。また、コイル35に供給される電流の電流値を検出する電流センサ54がコイル35と電源との間に設けられる。   The mover 31 includes a core 34 and a coil 35. The core 34 includes a plurality of magnetic pole teeth 33 that are protruded toward the stator 29 and formed at a predetermined pitch, and the coil 35 is wound around each magnetic pole tooth 33. The magnetic pole teeth 33 are formed in parallel to each other in a direction perpendicular to the moving direction of the movable platen 12. The stator 29 includes a core (not shown) and a permanent magnet (not shown) formed to extend on the core. The permanent magnet is formed by alternately magnetizing the N and S poles. A position sensor 53 that detects the position of the mover 31 is disposed. Further, a current sensor 54 that detects a current value of a current supplied to the coil 35 is provided between the coil 35 and the power source.

コイル35に所定の電流を供給することによってリニアモータ28を駆動すると、可動子31が進退させられる。それに伴って、吸着板22及び可動プラテン12が進退させられ、型閉じ及び型開きを行うことができる。リニアモータ28は、可動子31の位置が設定値になるように、位置センサ53の検出結果に基づいてフィードバック制御される。   When the linear motor 28 is driven by supplying a predetermined current to the coil 35, the mover 31 is moved back and forth. Along with this, the suction plate 22 and the movable platen 12 are advanced and retracted, and the mold can be closed and opened. The linear motor 28 is feedback-controlled based on the detection result of the position sensor 53 so that the position of the mover 31 becomes a set value.

尚、本実施の形態においては、固定子29に永久磁石を、可動子31にコイル35を配設するようになっているが、固定子にコイルを、可動子に永久磁石を配設することもできる。その場合、リニアモータ28が駆動されるのに伴って、コイルが移動しないので、コイルに電力を供給するための配線を容易に行うことができる。   In the present embodiment, the permanent magnet is disposed on the stator 29 and the coil 35 is disposed on the mover 31, but the coil is disposed on the stator and the permanent magnet is disposed on the mover. You can also. In this case, since the coil does not move as the linear motor 28 is driven, wiring for supplying power to the coil can be easily performed.

尚、型開閉駆動部として、リニアモータ28の代わりに、回転モータ及び回転モータの回転運動を直線運動に変換するボールネジ機構、又は油圧シリンダ若しくは空気圧シリンダなどの流体圧シリンダなどが用いられてもよい。   As the mold opening / closing drive unit, instead of the linear motor 28, a rotary motor, a ball screw mechanism that converts the rotary motion of the rotary motor into a linear motion, or a fluid pressure cylinder such as a hydraulic cylinder or a pneumatic cylinder may be used. .

電磁石ユニット37は、リヤプラテン13と吸着板22との間に吸着力を生じさせる。この吸着力は、ロッド39を介して可動プラテン12に伝達し、可動プラテン12と固定プラテン11との間に型締力が生じる。   The electromagnet unit 37 generates an attracting force between the rear platen 13 and the attracting plate 22. This suction force is transmitted to the movable platen 12 via the rod 39, and a mold clamping force is generated between the movable platen 12 and the fixed platen 11.

尚、固定プラテン11、可動プラテン12、リヤプラテン13、吸着板22、リニアモータ28、電磁石ユニット37、ロッド39などによって型締装置10が構成される。   The mold clamping device 10 is constituted by the fixed platen 11, the movable platen 12, the rear platen 13, the suction plate 22, the linear motor 28, the electromagnet unit 37, the rod 39, and the like.

電磁石ユニット37は、リヤプラテン13側に形成された電磁石49、及び吸着板22側に形成された吸着部51からなる。吸着部51は、吸着板22の吸着面(前端面)の所定の部分、例えば、吸着板22においてロッド39を包囲し、かつ、電磁石49と対向する部分に形成される。また、リヤプラテン13の吸着面(後端面)の所定の部分、例えば、ロッド39のまわりには、電磁石49のコイル48を収容する溝45が形成される。溝45より内側にコア46が形成される。コア46の周りにコイル48が巻装される。リヤプラテン13のコア46以外の部分にヨーク47が形成される。   The electromagnet unit 37 includes an electromagnet 49 formed on the rear platen 13 side and a suction portion 51 formed on the suction plate 22 side. The suction portion 51 is formed in a predetermined portion of the suction surface (front end surface) of the suction plate 22, for example, a portion surrounding the rod 39 in the suction plate 22 and facing the electromagnet 49. A groove 45 for accommodating the coil 48 of the electromagnet 49 is formed around a predetermined portion of the attracting surface (rear end surface) of the rear platen 13, for example, around the rod 39. A core 46 is formed inside the groove 45. A coil 48 is wound around the core 46. A yoke 47 is formed at a portion other than the core 46 of the rear platen 13.

尚、本実施形態においては、リヤプラテン13とは別に電磁石49が、吸着板22とは別に吸着部51が形成されるが、リヤプラテン13の一部として電磁石を、吸着板22の一部として吸着部を形成してもよい。また、電磁石と吸着部の配置は逆であってもよい。例えば、吸着板22側に電磁石49を設け、リヤプラテン13側に吸着部51を設けてもよい。また、電磁石49のコイル48の数は、複数であってもよい。   In the present embodiment, the electromagnet 49 is formed separately from the rear platen 13 and the attracting part 51 is formed separately from the attracting plate 22, but the electromagnet is part of the rear platen 13 and the attracting part is part of the attracting plate 22. May be formed. Moreover, the arrangement of the electromagnet and the attracting part may be reversed. For example, the electromagnet 49 may be provided on the suction plate 22 side, and the suction portion 51 may be provided on the rear platen 13 side. Moreover, the number of the coils 48 of the electromagnet 49 may be plural.

電磁石ユニット37において、コイル48に電流を供給すると、電磁石49が駆動され、吸着部51を吸着し、型締力を発生させることができる。   When an electric current is supplied to the coil 48 in the electromagnet unit 37, the electromagnet 49 is driven to attract the attracting part 51 and generate a mold clamping force.

型締装置10のリニアモータ28及び電磁石49の駆動は、制御装置60によって制御される。制御装置60は、CPU及びメモリなどを備え、CPUによって演算された結果に応じて、リニアモータ28のコイル35や電磁石49のコイル48に電流を供給する。制御装置60には、型締力センサ55が接続される。型締力センサ55は、型締装置10において、少なくとも1本のタイバー14の所定の位置(固定プラテン11とリヤプラテン13との間における所定の位置)に設置され、当該タイバー14にかかる荷重を検出する。型締力センサ55は、例えばタイバー14の伸び量を検出する歪みゲージなどで構成される。型締力センサ55によって検出された荷重は、制御装置60に送られる。   Driving of the linear motor 28 and the electromagnet 49 of the mold clamping device 10 is controlled by the control device 60. The control device 60 includes a CPU, a memory, and the like, and supplies current to the coil 35 of the linear motor 28 and the coil 48 of the electromagnet 49 according to the result calculated by the CPU. A mold clamping force sensor 55 is connected to the control device 60. The mold clamping force sensor 55 is installed at a predetermined position (a predetermined position between the fixed platen 11 and the rear platen 13) of at least one tie bar 14 in the mold clamping device 10 and detects a load applied to the tie bar 14. To do. The mold clamping force sensor 55 is composed of, for example, a strain gauge that detects the extension amount of the tie bar 14. The load detected by the mold clamping force sensor 55 is sent to the control device 60.

次に、型締装置10の動作について説明する。   Next, the operation of the mold clamping device 10 will be described.

制御装置60の型開閉処理部61によって型閉じ工程が制御される。図2の状態(型開きの状態)において、型開閉処理部61は、コイル35に電流を供給して、リニアモータ28を駆動する。可動プラテン12が前進して、図1に示すように、可動金型16が固定金型15に当接させられる。このとき、リヤプラテン13と吸着板22との間、即ち電磁石49と吸着部51との間には、ギャップδが形成される。尚、型閉じに必要とされる力は、型締力と比較されて十分に小さくされる。   The mold closing process is controlled by the mold opening / closing processor 61 of the control device 60. In the state of FIG. 2 (the state of mold opening), the mold opening / closing processor 61 supplies current to the coil 35 to drive the linear motor 28. The movable platen 12 moves forward, and the movable mold 16 is brought into contact with the fixed mold 15 as shown in FIG. At this time, a gap δ is formed between the rear platen 13 and the suction plate 22, that is, between the electromagnet 49 and the suction portion 51. Note that the force required for mold closing is sufficiently reduced compared to the mold clamping force.

続いて、制御装置60の型締め処理部62は、型締め工程を制御する。型締め処理部62は、電磁石49のコイル48に電流を供給し、電磁石49に吸着部51を吸着する。この吸着力は、ロッド39を介して可動プラテン12に伝達し、可動プラテン12と固定プラテン11との間に型締力が生じる。   Subsequently, the mold clamping processing unit 62 of the control device 60 controls the mold clamping process. The mold clamping processing unit 62 supplies current to the coil 48 of the electromagnet 49 and attracts the attracting unit 51 to the electromagnet 49. This suction force is transmitted to the movable platen 12 via the rod 39, and a mold clamping force is generated between the movable platen 12 and the fixed platen 11.

型締力は型締力センサ55によって検出される。検出された型締力は制御装置60に送られ、型締力が設定値になるように型締め処理部62がコイル48に供給される電流を調整し、フィードバック制御する。この間、射出装置17において溶融させられた溶融樹脂が射出ノズル18から射出され、金型装置19のキャビティ空間に充填される。   The mold clamping force is detected by a mold clamping force sensor 55. The detected mold clamping force is sent to the control device 60, and the mold clamping processing unit 62 adjusts the current supplied to the coil 48 so that the mold clamping force becomes a set value, and performs feedback control. During this time, the molten resin melted in the injection device 17 is injected from the injection nozzle 18 and filled into the cavity space of the mold device 19.

キャビティ空間内の樹脂が冷却固化すると、型開閉処理部61は、型開き工程を制御する。型締め処理部62は、図1の状態において、電磁石49のコイル48への電流供給を停止する。それに伴って、リニアモータ28が駆動され、可動プラテン12が後退し、図2に示すように、可動金型16が後退して型開きが行われる。   When the resin in the cavity space is cooled and solidified, the mold opening / closing processor 61 controls the mold opening process. The mold clamping processing unit 62 stops supplying current to the coil 48 of the electromagnet 49 in the state of FIG. Accordingly, the linear motor 28 is driven, the movable platen 12 is moved backward, and the movable mold 16 is moved backward as shown in FIG. 2 to open the mold.

ところで、金型装置19を交換すると、金型装置19の厚さが変わり、型閉じ終了時にリヤプラテン13と吸着板22との間に形成されるギャップδが変わる。ギャップδが変わると、吸着力が変わり、型締力が変わる。   By the way, when the mold apparatus 19 is replaced, the thickness of the mold apparatus 19 changes, and the gap δ formed between the rear platen 13 and the suction plate 22 at the end of mold closing changes. When the gap δ changes, the suction force changes and the mold clamping force changes.

そこで、射出成形機は、金型装置19の厚さに応じて可動プラテン12と吸着板22との間隔を調整する型厚調整部70を備える。型厚調整部70は、型厚調整用モータ71、ギヤ72、ナット73、ロッド39などによって構成される。ロッド39は吸着板22の中央部分を貫通し、ロッド39の後端部にねじ43が形成される。ねじ43と、吸着板22に対して回転自在に支持されたナット73とが螺合させられる。ナット73の外周面に図示されないギヤが形成され、このギヤと、型厚調整用モータ71の出力軸71aに取り付けられたギヤ72が噛合させられる。ナット73及びねじ43によって運動方向変換部が構成され、該運動方向変換部において、ナット73の回転運動がロッド39の直進運動に変換される。また、型厚調整用モータ71の駆動用コイルに供給される電流の電流値を検出する電流センサ56が型厚調整用モータ71と電源との間に設けられる。   Therefore, the injection molding machine includes a mold thickness adjusting unit 70 that adjusts the distance between the movable platen 12 and the suction plate 22 in accordance with the thickness of the mold apparatus 19. The mold thickness adjusting unit 70 includes a mold thickness adjusting motor 71, a gear 72, a nut 73, a rod 39, and the like. The rod 39 passes through the central portion of the suction plate 22, and a screw 43 is formed at the rear end portion of the rod 39. The screw 43 and a nut 73 that is rotatably supported by the suction plate 22 are screwed together. A gear (not shown) is formed on the outer peripheral surface of the nut 73, and this gear is engaged with a gear 72 attached to the output shaft 71 a of the mold thickness adjusting motor 71. The nut 73 and the screw 43 constitute a movement direction conversion unit, and the rotation direction of the nut 73 is converted into a straight movement of the rod 39 in the movement direction conversion unit. Further, a current sensor 56 for detecting a current value of a current supplied to the driving coil of the mold thickness adjusting motor 71 is provided between the mold thickness adjusting motor 71 and the power source.

所定の電流を供給して型厚調整用モータ71を駆動すると、ナット73がねじ43に対して所定量回転し、吸着板22に対するロッド39の位置が調整される。よって、可動プラテン12と吸着板22との間隔が調整されて、型閉じ終了時におけるギャップδを最適な値にすることができる。   When a predetermined current is supplied to drive the mold thickness adjusting motor 71, the nut 73 rotates a predetermined amount with respect to the screw 43, and the position of the rod 39 with respect to the suction plate 22 is adjusted. Therefore, the gap between the movable platen 12 and the suction plate 22 is adjusted, and the gap δ at the end of mold closing can be set to an optimum value.

型厚調整用モータ71は、サーボモータであってよく、型厚調整用モータ71の出力軸71aの回転量などを検出するエンコーダ部71bを含んでよい。型厚調整用モータ71に供給される電流は、可動プラテン12と吸着板22との間隔が目標値になるように、エンコーダ部71bの検出結果に基づいてフィードバック制御される。   The mold thickness adjusting motor 71 may be a servo motor, and may include an encoder unit 71 b that detects the amount of rotation of the output shaft 71 a of the mold thickness adjusting motor 71. The current supplied to the mold thickness adjusting motor 71 is feedback-controlled based on the detection result of the encoder unit 71b so that the distance between the movable platen 12 and the suction plate 22 becomes a target value.

次に、図3に基づいて、型厚調整部70の動作について説明する。型厚調整部70の動作は、制御装置60の型厚調整処理部63によって制御される。   Next, the operation of the mold thickness adjusting unit 70 will be described with reference to FIG. The operation of the mold thickness adjustment unit 70 is controlled by the mold thickness adjustment processing unit 63 of the control device 60.

金型装置19の交換に伴い、新しい可動金型16が可動プラテン12に取り付けられ、新しい固定金型15が固定プラテン11に取り付けられると、制御装置60は、リニアモータ28を駆動して、ギャップδが所定値(>0)になるまで吸着板22を前進させる。このとき、制御装置60のギャップ監視部64は、例えば位置センサ53からの情報に基づいてギャップδを監視する。位置センサ53が検出するリニアモータ28の可動子31の位置で、吸着板22の位置が決まり、ギャップδが決まる。ギャップδが所定値になるとき、吸着板22及び可動プラテン12と共に前進する可動金型16は、固定金型15に接触していない。可動金型16と固定金型15との接触を「型タッチ」と呼ぶ。   When the new movable mold 16 is attached to the movable platen 12 and the new fixed mold 15 is attached to the fixed platen 11 in accordance with the replacement of the mold apparatus 19, the control apparatus 60 drives the linear motor 28 and the gap The suction plate 22 is moved forward until δ reaches a predetermined value (> 0). At this time, the gap monitoring unit 64 of the control device 60 monitors the gap δ based on information from the position sensor 53, for example. The position of the suction plate 22 is determined by the position of the mover 31 of the linear motor 28 detected by the position sensor 53, and the gap δ is determined. When the gap δ reaches a predetermined value, the movable mold 16 that moves forward together with the suction plate 22 and the movable platen 12 is not in contact with the fixed mold 15. Contact between the movable mold 16 and the fixed mold 15 is referred to as “mold touch”.

尚、ギャップδが所定値になる前に型タッチが生じないように、リニアモータ28の駆動前に、型厚調整処理部63は、型厚調整部70を駆動して、吸着板22と可動プラテン12との間隔を十分に狭めておいてもよい。また、リニアモータ28の駆動開始からの経過時間が所定時間に達したときにギャップδが所定値に達しない場合、型タッチが生じているので、型厚調整処理部63は、型厚調整部70を駆動して、吸着板22と可動プラテン12との間隔を狭めてもよい。   Before the linear motor 28 is driven, the mold thickness adjustment processing unit 63 drives the mold thickness adjustment unit 70 to move the suction plate 22 so that the mold touch does not occur before the gap δ reaches a predetermined value. The distance from the platen 12 may be sufficiently narrowed. In addition, when the elapsed time from the start of driving the linear motor 28 reaches a predetermined time, if the gap δ does not reach a predetermined value, a mold touch has occurred. 70 may be driven to narrow the distance between the suction plate 22 and the movable platen 12.

次いで、制御装置60の移動制限部65が吸着板22の後退を制限した状態で、型厚調整処理部63が型厚調整部70を駆動して可動プラテン12を前進させ(図3参照)、可動金型16を固定金型15に接触させる(図1参照)。   Next, in a state where the movement restriction unit 65 of the control device 60 restricts the backward movement of the suction plate 22, the mold thickness adjustment processing unit 63 drives the mold thickness adjustment unit 70 to advance the movable platen 12 (see FIG. 3). The movable mold 16 is brought into contact with the fixed mold 15 (see FIG. 1).

移動制限部65は、型厚調整処理部63が型厚調整部70を駆動して吸着板22と可動プラテン12との間隔を広げる間、例えばリニアモータ28を駆動して、吸着板22の後退を制限する。よって、可動プラテン12が前進して、型タッチが行われる。型タッチ時に型厚調整が終わる。型タッチ後における型厚調整部70の過剰な駆動を抑制するため、型タッチを検出する接触検出部66が制御装置60に備えられてもよい。   The movement restricting unit 65 drives the linear motor 28 while the mold thickness adjustment processing unit 63 drives the mold thickness adjusting unit 70 to widen the distance between the suction plate 22 and the movable platen 12, for example. Limit. Therefore, the movable platen 12 moves forward and a mold touch is performed. Mold thickness adjustment ends when the mold is touched. In order to suppress excessive driving of the mold thickness adjusting unit 70 after the mold touch, the control device 60 may include a contact detection unit 66 that detects the mold touch.

接触検出部66は、型タッチによって生じる反力の有無、又は型タッチによって生じる型締力の有無を検出することにより、型タッチの有無を検出する。   The contact detection unit 66 detects the presence or absence of a mold touch by detecting the presence or absence of a reaction force caused by a mold touch or the presence or absence of a mold clamping force caused by a mold touch.

(1)型タッチによって反力が生じると、吸着板22の後退を制限するためのリニアモータ28の駆動力が上がる。(2)リニアモータ28の駆動力が上限値に達し、型厚調整部70の駆動力に負けると、吸着板22が後退する。上記(1)〜(2)は、型厚調整部70の駆動力がリニアモータ28の駆動力よりも高い場合に起きる。   (1) When a reaction force is generated by the mold touch, the driving force of the linear motor 28 for limiting the backward movement of the suction plate 22 increases. (2) When the driving force of the linear motor 28 reaches the upper limit value and loses the driving force of the mold thickness adjusting unit 70, the suction plate 22 moves backward. The above (1) and (2) occur when the driving force of the mold thickness adjusting unit 70 is higher than the driving force of the linear motor 28.

上記(1)〜(2)の場合、接触検出部66は、リニアモータ28の駆動力が所定値以上か否かに基づいて、型タッチによって生じる反力の有無を検出してよい。リニアモータ28の駆動力は、例えばリニアモータ28のコイル35に供給される電流の電流値に比例するので、電流センサ54によって検出可能である。   In the case of (1) to (2) above, the contact detection unit 66 may detect the presence or absence of a reaction force generated by the mold touch based on whether or not the driving force of the linear motor 28 is equal to or greater than a predetermined value. The driving force of the linear motor 28 is proportional to the current value of the current supplied to the coil 35 of the linear motor 28, for example, and can be detected by the current sensor 54.

また、上記(2)の場合、接触検出部66は、吸着板22の位置が停止位置から所定量以上後退したか否かに基づいて、型タッチによって生じる反力の有無を判定してもよい。吸着板22の位置は、リニアモータ28の可動子31の位置で決まるので、位置センサ53によって検出可能である。   In the case of (2), the contact detection unit 66 may determine the presence or absence of a reaction force caused by the mold touch based on whether or not the position of the suction plate 22 has been retracted by a predetermined amount or more from the stop position. . Since the position of the suction plate 22 is determined by the position of the mover 31 of the linear motor 28, it can be detected by the position sensor 53.

(3)型タッチによって反力が生じると、可動プラテン12を前進させるべく、型厚調整部70の駆動力が上がる。上記(3)は、型厚調整部70の駆動力が、リニアモータ28の駆動力よりも低い場合に生じる。   (3) When a reaction force is generated by the mold touch, the driving force of the mold thickness adjusting unit 70 is increased to advance the movable platen 12. The above (3) occurs when the driving force of the mold thickness adjusting unit 70 is lower than the driving force of the linear motor 28.

上記(3)の場合、接触検出部66は、型厚調整部70の駆動力が所定値以上か否かに基づいて、型タッチによって生じる反力の有無を検出してよい。型厚調整部70の駆動力は、例えば型厚調整用モータ71の駆動用コイルに供給される電流の電流値に比例するので、電流センサ56によって検出可能である。   In the case of (3) above, the contact detection unit 66 may detect the presence or absence of a reaction force generated by the mold touch based on whether or not the driving force of the mold thickness adjusting unit 70 is equal to or greater than a predetermined value. The driving force of the mold thickness adjusting unit 70 is proportional to the current value of the current supplied to the driving coil of the mold thickness adjusting motor 71 and can be detected by the current sensor 56.

(4)型タッチによって型締力が生じる。そこで、接触検出部66は、型締力が所定値以上か否かに基づいて、型タッチの有無を判定してもよい。型締力は、型締力センサ55によって検出可能である。   (4) A mold clamping force is generated by the mold touch. Therefore, the contact detection unit 66 may determine the presence or absence of the mold touch based on whether or not the mold clamping force is equal to or greater than a predetermined value. The mold clamping force can be detected by a mold clamping force sensor 55.

このように、接触検出部66は、位置センサ53、電流センサ54、電流センサ56、又は型締力センサ55からの情報に基づいて、型タッチの有無を検出するので、型タッチの有無を検出する専用のセンサが不要になる。   As described above, the contact detection unit 66 detects the presence / absence of the mold touch based on the information from the position sensor 53, the current sensor 54, the current sensor 56, or the mold clamping force sensor 55. This eliminates the need for a dedicated sensor.

接触検出部66によって型タッチを検出するまで、移動制限部65によってギャップδを所定値に維持するように吸着板22の後退を制限した状態で、型厚調整処理部63が型厚調整部70を駆動する。接触検出部66によって型タッチを検出すると、型厚調整部70の駆動が解除される。   The mold thickness adjustment processing unit 63 performs the mold thickness adjustment unit 70 in a state where the backward movement of the suction plate 22 is limited so that the gap δ is maintained at a predetermined value by the movement limitation unit 65 until the mold touch is detected by the contact detection unit 66. Drive. When the mold touch is detected by the contact detection unit 66, the driving of the mold thickness adjusting unit 70 is released.

以上、本発明の実施形態について説明したが、本発明は、上記の実施形態に制限されることはなく、本発明の範囲を逸脱することなく、上記の実施形態に種々の変形や置換を加えることができる。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions are made to the above-described embodiments without departing from the scope of the present invention. be able to.

例えば、上記実施形態の移動制限部65は、ギャップδを所定値に維持するため、リニアモータ28を駆動して吸着板22の後退を制限するとしたが、ブレーキ装置の制動力によって吸着板22の後退を制限してもよい。ブレーキ装置は、特に限定されないが、例えばスライドベースSbをガイドGdに対して制動する装置であってよい。このように、ブレーキ装置の制動力によって吸着板22の後退を制限する場合、接触の有無の検出は、電流センサ56又は型締力センサ55からの情報に基づいて行われてよい。   For example, the movement restriction unit 65 of the above embodiment drives the linear motor 28 to restrict the backward movement of the suction plate 22 in order to maintain the gap δ at a predetermined value, but the movement of the suction plate 22 is controlled by the braking force of the brake device. You may limit retreat. The brake device is not particularly limited, and may be a device that brakes the slide base Sb against the guide Gd, for example. As described above, when the backward movement of the suction plate 22 is limited by the braking force of the brake device, the presence / absence of contact may be detected based on information from the current sensor 56 or the mold clamping force sensor 55.

また、上記実施形態の制御装置60は、新しい金型装置19が取り付けられると、リニアモータ28を駆動して吸着板22を所定位置まで前進させる制御を行うとしたが、この制御は、新しい金型装置19を仮止めした状態で行われてもよい。例えば、この制御は、クレーンなどで可動金型16及び固定金型15をまとめて吊持した状態で金型装置19を固定プラテン11に仮止めした状態で行われてもよい。その後、可動プラテン12が前進して金型装置19に接触し、続いて、金型装置19が型締めされる。型締め状態で、固定金型15が固定プラテン11に、可動金型16が可動プラテン12にそれぞれボルトなどで本止めされる。尚、金型装置19は、固定プラテン11の代わりに、可動プラテン12に仮止めされてもよい。   In addition, the control device 60 according to the above embodiment controls the linear motor 28 to advance the suction plate 22 to a predetermined position when the new mold device 19 is attached. It may be performed in a state where the mold device 19 is temporarily fixed. For example, this control may be performed in a state where the mold apparatus 19 is temporarily fixed to the fixed platen 11 in a state where the movable mold 16 and the fixed mold 15 are suspended together by a crane or the like. Thereafter, the movable platen 12 moves forward and contacts the mold device 19, and then the mold device 19 is clamped. In the clamped state, the fixed mold 15 is fixed to the fixed platen 11 and the movable mold 16 is fixed to the movable platen 12 with bolts or the like. The mold device 19 may be temporarily fixed to the movable platen 12 instead of the fixed platen 11.

また、上記実施形態の接触検出部66は、可動金型16と固定金型15との接触を検出するが、可動金型16及び固定金型15を介した可動プラテン12と固定プラテン11との接触を検出すればよい。例えば、金型装置19を固定プラテン11に仮止めする場合、接触検出部66は可動プラテン12と可動金型16との接触を検出してよい。また、金型装置19を可動プラテン12に仮止めする場合、接触検出部66は固定金型15と固定プラテン11との接触を検出してよい。いずれの場合にも、接触によって反力又は型締力が生じるので、接触検出部66は、位置センサ53等からの情報に基づいて、接触の有無を検出できる。   The contact detection unit 66 of the above embodiment detects the contact between the movable mold 16 and the fixed mold 15, but the movable platen 12 and the fixed platen 11 via the movable mold 16 and the fixed mold 15 are detected. What is necessary is just to detect a contact. For example, when the mold apparatus 19 is temporarily fixed to the fixed platen 11, the contact detection unit 66 may detect contact between the movable platen 12 and the movable mold 16. When the mold apparatus 19 is temporarily fixed to the movable platen 12, the contact detection unit 66 may detect contact between the fixed mold 15 and the fixed platen 11. In any case, since a reaction force or a mold clamping force is generated by the contact, the contact detection unit 66 can detect the presence or absence of contact based on information from the position sensor 53 or the like.

また、上記実施形態の型厚調整は、制御装置60によって自動で行われるが、手動で行われてもよい。   Moreover, although the mold thickness adjustment of the said embodiment is performed automatically by the control apparatus 60, you may perform it manually.

また、上記実施形態では、リヤプラテン13と吸着板22との間に所定のギャップδを形成し、吸着板22の後退を制限した状態で、型厚調整部70を駆動して可動プラテン12を前進させ、金型装置19を介して固定プラテン11に接触させることによって型厚調整を行うとしたが、別の方法で型厚調整を行ってもよい。例えば、リニアモータ28を駆動して、可動プラテン12を前進させ、金型装置19を介して固定プラテン11に接触させたときのギャップを検出し、検出値と目標値との差に応じて型厚調整部70を駆動することによって型厚調整を行ってもよい。検出値が目標値よりも小さい場合、ギャップを広げるため、型厚調整部70を駆動して可動プラテン12と吸着板22との間隔を広げる。間隔を広げる量は、検出値と目標値との差の絶対値と略同じであってよい。また、検出値が目標値よりも大きい場合、ギャップを狭めるため、型厚調整部70を駆動して可動プラテン12と吸着板22との間隔を狭める。間隔を狭める量は、検出値と目標値との差の絶対値と略同じであってよい。接触の検出やギャップの検出等は上記実施形態と同様の構成で行われる。例えば、接触の検出は接触検出部66で行われ、ギャップの検出はギャップ監視部64で行われ、型厚調整部70の制御は型厚調整処理部63で行われる。目標値は、試験等により予め決定され、メモリなどの記録媒体に記録されたものを用いる。   Further, in the above-described embodiment, a predetermined gap δ is formed between the rear platen 13 and the suction plate 22, and the movable platen 12 is advanced by driving the mold thickness adjusting unit 70 in a state where the backward movement of the suction plate 22 is restricted. Although the mold thickness adjustment is performed by bringing the mold plate 19 into contact with the fixed platen 11 via the mold device 19, the mold thickness adjustment may be performed by another method. For example, the gap when the linear motor 28 is driven to move the movable platen 12 forward and come into contact with the fixed platen 11 via the mold device 19 is detected, and the mold is determined according to the difference between the detected value and the target value. The mold thickness may be adjusted by driving the thickness adjusting unit 70. When the detected value is smaller than the target value, the mold thickness adjusting unit 70 is driven to widen the gap between the movable platen 12 and the suction plate 22 in order to widen the gap. The amount by which the interval is widened may be substantially the same as the absolute value of the difference between the detected value and the target value. When the detected value is larger than the target value, the mold thickness adjusting unit 70 is driven to narrow the gap between the movable platen 12 and the suction plate 22 in order to narrow the gap. The amount by which the interval is narrowed may be substantially the same as the absolute value of the difference between the detected value and the target value. Contact detection, gap detection, and the like are performed in the same configuration as in the above embodiment. For example, contact detection is performed by the contact detection unit 66, gap detection is performed by the gap monitoring unit 64, and control of the mold thickness adjustment unit 70 is performed by the mold thickness adjustment processing unit 63. The target value is determined in advance by a test or the like and recorded on a recording medium such as a memory.

10 型締装置
11 固定プラテン(第1の固定部材)
12 可動プラテン(第1の可動部材)
13 リヤプラテン(第2の固定部材)
15 固定金型
16 可動金型
22 吸着板(第2の可動部材)
39 ロッド
48 コイル
49 電磁石
53 位置センサ
54 電磁石用の電流センサ
55 型締力センサ
56 型厚調整部用の電流センサ
60 制御装置
61 型開閉処理部
62 型締め処理部
63 型厚調整処理部
64 ギャップ監視部
65 移動制限部
66 接触検出部
70 型厚調整部
10 mold clamping device 11 fixed platen (first fixing member)
12 Movable platen (first movable member)
13 Rear platen (second fixing member)
15 Fixed mold 16 Movable mold 22 Suction plate (second movable member)
39 Rod 48 Coil 49 Electromagnet 53 Position sensor 54 Current sensor for electromagnet 55 Mold clamping force sensor 56 Current sensor for mold thickness adjusting unit 60 Control device 61 Mold opening / closing processing unit 62 Mold clamping processing unit 63 Mold thickness adjusting processing unit 64 Gap Monitoring unit 65 Movement restriction unit 66 Contact detection unit 70 Mold thickness adjustment unit

Claims (8)

固定金型が取り付けられる第1の固定部材と、
可動金型が取り付けられる第1の可動部材と、
該第1の可動部材と共に移動する第2の可動部材と、
前記第1の可動部材と前記第2の可動部材との間に配設される第2の固定部材と、
前記第2の可動部材及び前記第2の固定部材の一方に形成され、他方を吸着して型締力を発生させる電磁石と、
前記第1の可動部材と前記第2の可動部材との間隔を調整する型厚調整部と、
該型厚調整部を制御する型厚調整処理部と、
前記第2の可動部材と前記第2の固定部材との間に所定のギャップを形成した状態で、前記第2の可動部材の型開き方向への移動を制限する移動制限部とを備え、
該移動制限部によって前記移動を制限した状態で、前記型厚調整処理部が前記型厚調整部を駆動して、前記第1の可動部材を型閉じ方向に移動させ、前記可動金型及び前記固定金型を介して前記第1の固定部材に接触させることを特徴とする射出成形機。
A first fixing member to which a fixed mold is attached;
A first movable member to which a movable mold is attached;
A second movable member that moves with the first movable member;
A second fixed member disposed between the first movable member and the second movable member;
An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
A mold thickness adjusting unit for adjusting an interval between the first movable member and the second movable member;
A mold thickness adjustment processing unit for controlling the mold thickness adjustment unit;
A movement restricting portion for restricting movement of the second movable member in the mold opening direction in a state where a predetermined gap is formed between the second movable member and the second fixed member;
In a state where the movement is restricted by the movement restriction unit, the mold thickness adjustment processing unit drives the mold thickness adjustment unit to move the first movable member in the mold closing direction, and the movable mold and the An injection molding machine, wherein the first fixing member is brought into contact via a fixed mold.
前記可動金型及び前記固定金型を介した前記第1の可動部材と前記第1の固定部材との接触の有無を検出する接触検出部をさらに備え、
前記型厚調整処理部は、前記接触検出部によって前記接触を検出するまで、前記型厚調整部を駆動して前記第1の可動部材を型閉じ方向に移動させる請求項1に記載の射出成形機。
A contact detection unit for detecting presence or absence of contact between the first movable member and the first fixed member via the movable mold and the fixed mold;
2. The injection molding according to claim 1, wherein the mold thickness adjustment processing unit drives the mold thickness adjustment unit to move the first movable member in a mold closing direction until the contact is detected by the contact detection unit. Machine.
前記接触検出部は、前記接触によって生じる反力の有無を検出することにより、前記接触の有無を検出する請求項2に記載の射出成形機。   The injection molding machine according to claim 2, wherein the contact detection unit detects the presence or absence of the contact by detecting the presence or absence of a reaction force generated by the contact. 前記接触検出部は、前記接触によって生じる型締力の有無を検出することにより、前記接触の有無を検出する請求項2に記載の射出成形機。   The injection molding machine according to claim 2, wherein the contact detection unit detects the presence or absence of the contact by detecting the presence or absence of a clamping force generated by the contact. 前記可動金型及び前記固定金型を介した前記第1の可動部材と前記第1の固定部材との接触は、前記可動金型と前記固定金型との接触である請求項1〜4のいずれか一項に記載の射出成形機。   The contact between the first movable member and the first fixed member via the movable mold and the fixed mold is a contact between the movable mold and the fixed mold. The injection molding machine as described in any one of Claims. 型厚調整時に、前記可動金型が、前記固定金型とまとめて、前記第1の固定部材に取付けられており、
前記可動金型及び前記固定金型を介した前記第1の可動部材と前記第1の固定部材との接触は、前記第1の可動部材と前記可動金型との接触ある請求項1〜4のいずれか一項に記載の射出成形機。
At the time of mold thickness adjustment, the movable mold is attached to the first fixed member together with the fixed mold,
The contact of the movable mold and said first movable member through said fixed mold and said first securing member according to claim 1 and wherein the first movable member and the a contact between the movable mold The injection molding machine according to any one of 4.
型厚調整時に、前記固定金型が、前記可動金型とまとめて、前記第1の可動部材に取付けられており、At the time of mold thickness adjustment, the fixed mold is attached to the first movable member together with the movable mold,
前記可動金型及び前記固定金型を介した前記第1の可動部材と前記第1の固定部材との接触は、前記第1の固定部材と前記固定金型との接触である請求項1〜4のいずれか一項に記載の射出成形機。The contact between the first movable member and the first fixed member via the movable mold and the fixed mold is a contact between the first fixed member and the fixed mold. The injection molding machine according to any one of 4.
固定金型が取り付けられる第1の固定部材と、
可動金型が取り付けられる第1の可動部材と、
該第1の可動部材と共に移動する第2の可動部材と、
前記第1の可動部材と前記第2の可動部材との間に配設される第2の固定部材と、
前記第2の可動部材及び前記第2の固定部材の一方に形成され、他方を吸着して型締力を発生させる電磁石と、
前記第1の可動部材と前記第2の可動部材との間隔を調整する型厚調整部とを備える射出成形機の型厚調整方法において、
前記第2の可動部材と前記第2の固定部材との間に所定のギャップを形成し、且つ、前記第2の可動部材の型開き方向への移動を制限した状態で、前記型厚調整部を駆動して、前記第1の可動部材を型閉じ方向に移動させ、前記可動金型及び前記固定金型を介して前記第1の固定部材に接触させることを特徴とする射出成形機の型厚調整方法。
A first fixing member to which a fixed mold is attached;
A first movable member to which a movable mold is attached;
A second movable member that moves with the first movable member;
A second fixed member disposed between the first movable member and the second movable member;
An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
In a mold thickness adjusting method for an injection molding machine comprising a mold thickness adjusting unit that adjusts an interval between the first movable member and the second movable member.
In a state where a predetermined gap is formed between the second movable member and the second fixed member and movement of the second movable member in the mold opening direction is restricted, the mold thickness adjusting unit To move the first movable member in the mold closing direction to contact the first fixed member via the movable mold and the fixed mold. Thickness adjustment method.
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CN201210260147.5A CN103057063B (en) 2011-10-21 2012-07-25 Injection moulding machine and method for adjusting mould thickness of injection moulding machine
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