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JP5781982B2 - In-vehicle circuit board housing case and in-vehicle electronic control device - Google Patents
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JP5781982B2 - In-vehicle circuit board housing case and in-vehicle electronic control device - Google Patents

In-vehicle circuit board housing case and in-vehicle electronic control device Download PDF

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JP5781982B2
JP5781982B2 JP2012140392A JP2012140392A JP5781982B2 JP 5781982 B2 JP5781982 B2 JP 5781982B2 JP 2012140392 A JP2012140392 A JP 2012140392A JP 2012140392 A JP2012140392 A JP 2012140392A JP 5781982 B2 JP5781982 B2 JP 5781982B2
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vehicle circuit
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cavity
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文典 奈良
文典 奈良
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Autoliv Development AB
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Description

本発明は、特定周波数で動作する電子部品が実装された車載回路基板を収容する車載回路基板収容筐体および車載回路基板収容筐体を備えた車載用電子制御装置に関するものである。   The present invention relates to a vehicle-mounted circuit board housing case that houses a vehicle-mounted circuit board on which electronic components that operate at a specific frequency are mounted, and a vehicle-mounted electronic control device that includes the vehicle-mounted circuit board housing case.

自動車などの車両には、例えばエアバックなどの各種車載用機器を制御する電子制御ユニット(ECU: Electronic Control Unit)が多数配置されている。電子制御ユニットは、車載用電子機器である制御基板(車載回路基板)を含み、例えば1.6GHz程度の周波数で動作する電子部品が多数実装されている。   In vehicles such as automobiles, a large number of electronic control units (ECUs) that control various in-vehicle devices such as airbags are arranged. The electronic control unit includes a control board (on-vehicle circuit board) that is an on-vehicle electronic device, and is mounted with a large number of electronic components that operate at a frequency of about 1.6 GHz, for example.

車載回路基板は、例えばアルミダイキャストの箱型の筐体に収容される。金属製の筐体に車載回路基板を収容することで、剛性などが向上し、車両衝突時に車載回路基板上の電子部品を保護できる。   The in-vehicle circuit board is accommodated in, for example, an aluminum die-cast box-shaped housing. By housing the in-vehicle circuit board in the metal casing, the rigidity and the like are improved, and the electronic components on the in-vehicle circuit board can be protected in the event of a vehicle collision.

しかし、金属製の筐体を用いると、重量や製造コストが高くなるという問題があった。これに対して、特許文献1には、軽量化や低コスト化を図るために、下方が開口された箱型の樹脂製のケースを採用した筐体が記載されている。   However, when a metal casing is used, there is a problem that the weight and manufacturing cost increase. On the other hand, Patent Document 1 describes a housing that employs a box-shaped resin case with an opening at the bottom in order to reduce weight and cost.

この筐体は、上記樹脂製のケース(本願でのカバー部材)と、このケースの開口に蓋をする金属製のカバー(本願での土台部材)とを備えている。電子部品が実装された基板(本願での車載回路基板)は、ケースの開口からケース内に収容されて固定される。   The housing includes the resin case (cover member in the present application) and a metal cover (base member in the present application) that covers the opening of the case. A board on which electronic components are mounted (an in-vehicle circuit board in the present application) is housed and fixed in the case from the opening of the case.

特開2012−28661号公報JP 2012-28661 A

ところで、車載回路基板を収容した筐体には、周辺の環境に起因して、外部から放射ノイズ(電磁波)が照射される場合がある。この場合、金属製の筐体は、静電遮蔽体として機能する。このため、車載回路基板に実装された電子部品は、放射ノイズの影響を受けず、誤動作が生じ難い。   By the way, radiation noise (electromagnetic wave) may be radiated from the outside to the casing that houses the on-vehicle circuit board due to the surrounding environment. In this case, the metal housing functions as an electrostatic shield. For this reason, the electronic component mounted on the in-vehicle circuit board is not affected by the radiation noise and is unlikely to malfunction.

特許文献1では、筐体の一部として樹脂製のケースを採用しているので、筐体は静電遮蔽体として機能せず、放射ノイズがケースを通過する。ここで、車載回路基板は、電子部品が実装された例えば多層基板であるから、全体として見れば1枚の金属板(導電壁)と見なせるが、実際には電子部品間に隙間が存在する。また、電子部品を搭載する基板には配線のためのパターンによる隙間や、金属製カバーと実装基板との間などにも隙間が存在する。そのため、ケースを通過した放射ノイズは、これらの隙間を部分的に通過して、金属製のカバーにより反射され、再び車載回路基板で部分的に反射される。   In patent document 1, since the resin-made case is employ | adopted as a part of housing | casing, a housing | casing does not function as an electrostatic shielding body but a radiation noise passes a case. Here, since the in-vehicle circuit board is, for example, a multilayer board on which electronic components are mounted, it can be regarded as a single metal plate (conductive wall) as a whole, but there is actually a gap between the electronic parts. In addition, there is a gap due to a pattern for wiring on the board on which the electronic component is mounted, and a gap between the metal cover and the mounting board. Therefore, the radiated noise that has passed through the case partially passes through these gaps, is reflected by the metal cover, and is partially reflected again by the in-vehicle circuit board.

その結果、上記筐体では、車載回路基板と金属製のカバーとの間の空間で共振現象が生じる。特に、共振周波数が電子部品の誤動作する周波数に一致してしまうと、エアバッグ展開が正常に行われないなどの問題が生じる可能性がある。   As a result, in the casing, a resonance phenomenon occurs in the space between the on-board circuit board and the metal cover. In particular, if the resonance frequency coincides with the frequency at which the electronic component malfunctions, there is a possibility that problems such as the airbag not being deployed normally occur.

つまり、筐体の軽量化や低コスト化を図るために、筐体の一部に樹脂製の部材を採用すると、放射ノイズの影響を低減することが困難になるという問題があった。   That is, when a resin member is used as a part of the housing in order to reduce the weight and cost of the housing, there is a problem that it becomes difficult to reduce the influence of radiation noise.

なお、特許文献1に示す筐体の金属製のカバーに代表されるように、筐体の軽量化や省スペース化の観点から、金属製のカバーは、厚み方向の寸法が小さくなる傾向にあると予想される。そのため、車載回路基板と金属製のカバーとの間で共振現象が生じる上記空間の寸法は、小さくなる傾向にあると考えられる。   In addition, as represented by the metal cover of the casing shown in Patent Document 1, the metal cover tends to have a smaller dimension in the thickness direction from the viewpoint of weight reduction and space saving of the casing. It is expected to be. Therefore, it is considered that the dimension of the space where the resonance phenomenon occurs between the on-vehicle circuit board and the metal cover tends to be small.

本発明は、このような課題に鑑み、樹脂製の部材を採用しながら、放射ノイズの影響を低減できる車載回路基板収容筐体および車載用電子制御装置を提供することを目的としている。   In view of such a problem, an object of the present invention is to provide an in-vehicle circuit board housing case and an in-vehicle electronic control device that can reduce the influence of radiation noise while adopting a resin member.

上記課題を解決するために、本発明にかかる車載回路基板収容筐体の代表的な構成は、電子部品が実装された車載回路基板を備え、車載回路基板を収容する車載回路基板収容筐体であって、車載回路基板が載置される金属製の土台部材と、車載回路基板を覆って土台部材に組み付けられる樹脂製のカバー部材とを備え、土台部材は、矩形の底面部と、底面部の周囲に立設され底面部とともに空洞を形成する枠体とを有し、土台部材の底面部と車載回路基板との距離が約5.5mmまたは5.5mm以上であることを特徴とする。   In order to solve the above problems, a typical configuration of an in-vehicle circuit board housing case according to the present invention is an in-vehicle circuit board housing case that includes an in-vehicle circuit board on which electronic components are mounted and houses the in-vehicle circuit board. The base member includes a metal base member on which the in-vehicle circuit board is placed, and a resin cover member that covers the in-vehicle circuit board and is assembled to the base member. The base member has a rectangular bottom surface portion and a bottom surface portion. And a frame that forms a cavity together with the bottom surface portion, and the distance between the bottom surface portion of the base member and the in-vehicle circuit board is about 5.5 mm or 5.5 mm or more.

上記の構成において、土台部材の底面部と車載回路基板との間で空洞が形成されていて、外部からカバー部材に向けて放射ノイズ(電磁波)が照射された場合を想定する。電磁波は、外部から樹脂製のカバー部材を通って、さらに車載回路基板に至る。車載回路基板に至る電磁波は、車載回路基板を部分的に通過して上記空洞に至り、金属製の土台部材で反射される。土台部材で反射された電磁波は、車載回路基板で部分的に反射され、その後再度、土台部材で反射される。   In the above configuration, a case is assumed where a cavity is formed between the bottom surface portion of the base member and the in-vehicle circuit board, and radiation noise (electromagnetic wave) is irradiated from the outside toward the cover member. The electromagnetic wave passes from the outside through the resin cover member and further reaches the in-vehicle circuit board. The electromagnetic wave reaching the in-vehicle circuit board partially passes through the in-vehicle circuit board, reaches the cavity, and is reflected by the metal base member. The electromagnetic wave reflected by the base member is partially reflected by the in-vehicle circuit board and then again reflected by the base member.

上記空洞は、金属製の土台部材と、部分的には導電壁と見なせる車載回路基板とで囲まれた空間であるから、いわゆる空洞共振器として機能する。一般に、空洞共振器は、導電壁で囲まれた空間内に、空間の寸法および形状で定まる、ある特定の波長の電磁界のみが成長する共振現象を生じさせる。なお、共振現象に伴い空間内に生じる電磁界の様子を示す共振モードは、空間内の電磁波の共振周波数に応じて多数存在する。   The cavity functions as a so-called cavity resonator because it is a space surrounded by a metal base member and an in-vehicle circuit board that can be regarded as a conductive wall. In general, a cavity resonator generates a resonance phenomenon in which only an electromagnetic field having a specific wavelength, which is determined by the size and shape of a space, is grown in a space surrounded by conductive walls. Note that there are a large number of resonance modes indicating the state of the electromagnetic field generated in the space due to the resonance phenomenon according to the resonance frequency of the electromagnetic wave in the space.

上記空洞内では、土台部材と車載回路基板との間で電磁波が反射を繰り返すので、共振現象が生じる。共振現象により、車載回路基板に実装された電子部品が誤動作する共振周波数(例えば、1.64GHz程度)を有する、電磁波(例えば、マイクロ波)が空洞内に発生する可能性がある。つまり、上記空洞を有する筐体では、共振現象により生じた電磁波によって、電子部品の動作が不安定となり、誤動作を生じることがあり得る。一例として、矩形の底面部の長辺、短辺などの長さが、電子部品が誤動作する周波数を有する電磁波の1/2波長(一般的には1/n波長、nは2以上の整数)に一致してしまうと、誤動作が生じ易い。また、共振現象は、空洞の寸法および形状で定まることから、矩形の底面部の長辺、短辺の長さに限らず、底面部と車載回路基板との距離にも依存すると考えられる。   In the cavity, the electromagnetic wave is repeatedly reflected between the base member and the on-vehicle circuit board, so that a resonance phenomenon occurs. Due to the resonance phenomenon, electromagnetic waves (for example, microwaves) having a resonance frequency (for example, about 1.64 GHz) at which an electronic component mounted on the on-vehicle circuit board malfunctions may be generated in the cavity. That is, in the casing having the above-described cavity, the operation of the electronic component may become unstable and malfunction may occur due to electromagnetic waves generated by the resonance phenomenon. As an example, the long side, the short side, etc. of the bottom surface of the rectangle has a half wavelength of an electromagnetic wave having a frequency at which the electronic component malfunctions (generally 1 / n wavelength, n is an integer of 2 or more). If they match, malfunction is likely to occur. Further, since the resonance phenomenon is determined by the size and shape of the cavity, it is considered that the resonance phenomenon depends not only on the long side and the short side length of the rectangular bottom surface portion but also on the distance between the bottom surface portion and the in-vehicle circuit board.

そこで本発明では、上記の空洞を小さくするという技術的な傾向に反して、土台部材の底面部と車載回路基板との間の距離を約5.5mmまたは5.5mm以上とし、空洞を広げた。その結果、上記の距離が5.5mm未満であるときに空洞内で生じると予想される、共振モードの電界および磁界の形成が妨げられると考えられる。言い換えると、空洞共振器として機能する空洞の寸法のうち上記の距離を5.5m以上とすることで、空洞の寸法および形状で定まる共振現象に伴う共振モードも変化し、その結果、上記空洞内の電磁波の共振周波数をずらすことが可能となる。したがって、上記車載回路基板収容筐体によれば、樹脂製のカバー部材を採用しながらも、電子部品の誤動作周波数と一致する共振周波数を有する電磁波が、空洞内に形成されることを防ぐことができ、電子部品の誤動作を防止し、外部からの放射ノイズの影響を低減できる。   Therefore, in the present invention, contrary to the technical tendency of reducing the above-described cavity, the distance between the bottom surface portion of the base member and the in-vehicle circuit board is set to about 5.5 mm or 5.5 mm or more to widen the cavity. . As a result, it is believed that the formation of resonant mode electric and magnetic fields, which are expected to occur in the cavity when the distance is less than 5.5 mm, is prevented. In other words, by setting the above distance to 5.5 m or more among the dimensions of the cavity functioning as the cavity resonator, the resonance mode associated with the resonance phenomenon determined by the dimension and shape of the cavity is also changed. The resonance frequency of the electromagnetic wave can be shifted. Therefore, according to the on-vehicle circuit board housing case, it is possible to prevent an electromagnetic wave having a resonance frequency that matches the malfunction frequency of the electronic component from being formed in the cavity while adopting a resin cover member. It is possible to prevent malfunction of electronic components and reduce the influence of radiation noise from the outside.

上記の土台部材は、車載回路基板に接し、底面部と車載回路基板との距離を変更可能にする介在部材を含むとよい。一例として、厚み0.5mm以上の介在部材を用意し、さらに底面部の長辺の寸法を105mm、短辺の寸法を85mm、底面部から枠体の上端までの寸法を5mmとした土台部材を用意した。このため、上記の距離は、介在部材の厚みの分だけ大きくなり、5mmから5.5mm以上に変更される(言い換えると、上記の空洞の深さの寸法が10%以上大きくなっている)。   Said base member is good to contain the interposition member which contact | connects a vehicle-mounted circuit board and can change the distance of a bottom face part and a vehicle-mounted circuit board. As an example, a base member in which an interposition member having a thickness of 0.5 mm or more is prepared, the long side dimension of the bottom surface part is 105 mm, the short side dimension is 85 mm, and the dimension from the bottom surface part to the upper end of the frame body is 5 mm. Prepared. Therefore, the distance is increased by the thickness of the interposition member and is changed from 5 mm to 5.5 mm or more (in other words, the cavity depth is increased by 10% or more).

そして、1.5GHz付近の周波数を有する電界強度200V/mの放射ノイズを、介在部材を配置せず上記の土台部材を用いた車載回路収容筐体に照射したところ、誤動作を確認した。これに対して、銅箔テープを重ねた厚み0.5mmの介在部材を上記の土台部材と車載回路基板との間に介在させ、その状態で、上記と同様に1.5GHz付近の周波数を有する電界強度200V/mの放射ノイズを照射したところ、誤動作は発生しなかった。なお、介在部材としては厚みが0.5mm以上であれば、1mm程度の厚みのワッシャや、3mm程度の厚みのナットなどを用いても良い。これらの介在部材を配置した筐体に、1.5GHz付近の周波数を有する電界強度200V/mの放射ノイズを照射した場合であっても、誤動作は発生しなかった。このように、土台部材と車載回路基板との間に介在部材を介在させ、上記の距離を変更することで、電磁波の影響すなわち誤動作の有無が変動することが明らかとなった。つまり、介在部材によって上記の距離を変更すれば、結果的に、電磁波の周波数を電子部品の誤動作周波数と一致させないようにでき、電子部品の誤動作を防止できると考えられる。   And when the in-vehicle circuit housing | casing housing | casing using said base member was irradiated without the interposed member arrange | positioning the radiation noise of electric field strength 200V / m which has a frequency of 1.5 GHz vicinity, malfunction was confirmed. On the other hand, an interposition member having a thickness of 0.5 mm obtained by stacking copper foil tapes is interposed between the base member and the in-vehicle circuit board, and in that state, has a frequency in the vicinity of 1.5 GHz similarly to the above. When radiated noise with an electric field strength of 200 V / m was irradiated, no malfunction occurred. As the interposition member, if the thickness is 0.5 mm or more, a washer having a thickness of about 1 mm or a nut having a thickness of about 3 mm may be used. No malfunction occurred even when the housing in which these interposition members were arranged was irradiated with radiation noise having an electric field strength of 200 V / m having a frequency near 1.5 GHz. As described above, it has been clarified that the influence of electromagnetic waves, that is, the presence or absence of malfunctioning fluctuates by interposing the interposition member between the base member and the in-vehicle circuit board and changing the distance. In other words, if the above-mentioned distance is changed by the interposition member, as a result, the frequency of the electromagnetic wave can be prevented from matching the malfunction frequency of the electronic component, and malfunction of the electronic component can be prevented.

当該車載回路基板収容筐体は、空洞に配置された発泡スチロールをさらに備えてよい。発泡スチロールは、比誘電率が2〜2.5の誘電体であり、電磁波の周波数帯によっては電波透過性が良く、上記の共振モードが変化し、電子部品が誤作動を起こす問題となる共振周波数をずらす場合があると考えられる。よって、外部からの放射ノイズの影響をより効果的に低減できる。   The on-vehicle circuit board housing case may further include a polystyrene foam disposed in the cavity. Styrofoam is a dielectric material with a relative dielectric constant of 2 to 2.5, good radio wave transmission depending on the frequency band of electromagnetic waves, the resonance mode changes, and the resonance frequency that causes malfunction of electronic components It is thought that there is a case to shift. Therefore, the influence of the radiation noise from the outside can be reduced more effectively.

本発明にかかる車載回路基板収容筐体の他の代表的な構成は、電子部品が実装された車載回路基板を備え、車載回路基板を収容する車載回路基板収容筐体であって、車載回路基板が載置される金属製の土台部材と、車載回路基板を覆って土台部材に組み付けられる樹脂製のカバー部材とを備え、土台部材は、矩形の底面部と、底面部の周囲に立設され底面部とともに空洞を形成する枠体とを有し、空洞内に配置された発泡スチロールを備えることを特徴とする。   Another representative configuration of the in-vehicle circuit board housing case according to the present invention is an in-vehicle circuit board housing case that includes an in-vehicle circuit board on which electronic components are mounted and that houses the in-vehicle circuit board. And a resin cover member that covers the in-vehicle circuit board and is assembled to the base member. The base member is erected around the rectangular bottom surface portion and the bottom surface portion. It has the frame which forms a cavity with a bottom face part, and is provided with the expanded polystyrene arranged in the cavity.

上記構成によれば、発泡スチロールのような誘電体を空洞内に配置することで、実質的に電波の通る経路を長くすることと等価な状況を作り得ると考えられる。これにより、一例として、土台部材の底面部と車載回路基板との間の距離を5mmとした場合であっても、見かけの共振周波数をずらすことが可能となり、電子部品の誤動作を防止し、外部からの放射ノイズの影響を低減できると考えられる。   According to the said structure, it is thought that the situation equivalent to lengthening the path | route through which an electromagnetic wave passes substantially can be created by arrange | positioning dielectrics like a polystyrene foam in a cavity. Thereby, as an example, even when the distance between the bottom surface portion of the base member and the on-vehicle circuit board is 5 mm, the apparent resonance frequency can be shifted, and malfunction of electronic components can be prevented. It is thought that the influence of radiation noise from can be reduced.

上記課題を解決するために、本発明にかかる車載用電子制御装置の代表的な構成は、上述の車載回路基板収容筐体を備えることを特徴とする。このようにすれば、放射ノイズの影響を低減した信頼性の高い車載用電子制御装置を得ることが可能となる。   In order to solve the above-described problems, a typical configuration of an on-vehicle electronic control device according to the present invention includes the above-described on-vehicle circuit board housing case. In this way, it is possible to obtain a highly reliable on-vehicle electronic control device that reduces the influence of radiation noise.

本発明によれば、樹脂製の部材を採用しながら、放射ノイズの影響を低減できる車載回路基板収容筐体および車載用電子制御装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the vehicle-mounted circuit board housing | casing housing | casing which can reduce the influence of radiation noise, and the vehicle-mounted electronic control apparatus can be provided, employ | adopting resin members.

本発明の実施形態における車載回路基板収容筐体を示す図である。It is a figure which shows the vehicle-mounted circuit board accommodation housing | casing in embodiment of this invention. 図1の車載回路基板収容筐体の分解斜視図である。It is a disassembled perspective view of the vehicle-mounted circuit board accommodation housing | casing of FIG. 図2の車載回路基板収容筐体の土台部材および介在部材を示す図である。It is a figure which shows the base member and interposition member of the vehicle-mounted circuit board accommodation housing | casing of FIG. 図2の車載回路基板収容筐体の車載回路基板の裏面を示す図である。It is a figure which shows the back surface of the vehicle-mounted circuit board of the vehicle-mounted circuit board accommodation housing | casing of FIG. 図3の土台部材に車載回路基板を載置した状態を示す図である。It is a figure which shows the state which mounted the vehicle-mounted circuit board on the base member of FIG. 図3の土台部材に介在部材を配置していない状態を示す上面図である。It is a top view which shows the state which has not arrange | positioned the interposition member in the base member of FIG. 図6の土台部材で形成される空洞内に生じる共振現象を説明する模式図である。It is a schematic diagram explaining the resonance phenomenon which arises in the cavity formed with the base member of FIG. 図7の空洞内に生じると予想される共振モードを例示する図である。FIG. 8 is a diagram illustrating resonance modes expected to occur in the cavity of FIG. 7. 図7の土台部材から車載回路基板までの距離と誤動作の有無との関係を例示する図である。It is a figure which illustrates the relationship between the distance from the base member of FIG. 7, and a vehicle-mounted circuit board, and the presence or absence of malfunction. 本発明の他の実施形態である、車載回路基板収容筐体の一部を例示する断面図である。It is sectional drawing which illustrates a part of vehicle-mounted circuit board housing | casing housing | casing which is other embodiment of this invention.

以下に添付図面を参照しながら、本発明の好適な実施形態について詳細に説明する。かかる実施形態に示す寸法、材料、その他具体的な数値などは、発明の理解を容易とするための例示に過ぎず、特に断る場合を除き、本発明を限定するものではない。なお、本明細書及び図面において、実質的に同一の機能、構成を有する要素については、同一の符号を付することにより重複説明を省略し、また本発明に直接関係のない要素は図示を省略する。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The dimensions, materials, and other specific numerical values shown in the embodiments are merely examples for facilitating understanding of the invention, and do not limit the present invention unless otherwise specified. In the present specification and drawings, elements having substantially the same function and configuration are denoted by the same reference numerals, and redundant description is omitted, and elements not directly related to the present invention are not illustrated. To do.

図1は、本発明の実施形態における車載回路基板収容筐体を示す図である。図2は、図1の車載回路基板収容筐体の分解斜視図である。車載回路基板収容筐体(以下、筐体100)は、図示のように、金属製の土台部材102と、樹脂製のカバー部材104とを備え、内部には車載回路基板106が収容されている。   FIG. 1 is a diagram showing an in-vehicle circuit board housing case according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the on-board circuit board housing case of FIG. As shown in the figure, the in-vehicle circuit board housing case (hereinafter referred to as the housing 100) includes a metal base member 102 and a resin cover member 104, in which the in-vehicle circuit board 106 is housed. .

また、筐体100は、図2に示すように、土台部材102と車載回路基板106との間に介在する介在部材107a、107b、107c、107dを備える。介在部材107a、107b、107c、107dは、いずれも形状が同じであり、銅箔テープを重ねて厚さ0.5mm程度としたもの、厚さ1mm程度のワッシャ、または厚さ3.5mm程度のナットであってよい。ここでは、介在部材107a、107b、107c、107dは、ワッシャとして例示している。   Moreover, the housing | casing 100 is provided with the interposed members 107a, 107b, 107c, and 107d interposed between the base member 102 and the vehicle-mounted circuit board 106, as shown in FIG. The interposition members 107a, 107b, 107c, and 107d all have the same shape, and a copper foil tape is stacked to a thickness of about 0.5 mm, a washer having a thickness of about 1 mm, or a thickness of about 3.5 mm. It can be a nut. Here, the interposed members 107a, 107b, 107c, and 107d are illustrated as washers.

土台部材102は、車載回路基板106を載置する土台となる部材であり、例えばアルミダイキャストで成形されている。土台部材102は、図2に例示するように、矩形の底面部108と、底面部108の周囲に立設された枠体110とを備える。また、土台部材102は、底面部108と枠体110とを用いて形成されたグランド端子114a、114b、114c、114dと、筐体100を車両に固定するために外側に張り出したフランジ116a、116b、116cとを有している。   The base member 102 is a member that serves as a base on which the in-vehicle circuit board 106 is placed, and is formed by, for example, aluminum die casting. As illustrated in FIG. 2, the base member 102 includes a rectangular bottom surface portion 108 and a frame body 110 erected around the bottom surface portion 108. The base member 102 includes ground terminals 114a, 114b, 114c, and 114d formed by using the bottom surface portion 108 and the frame body 110, and flanges 116a and 116b that project outward to fix the housing 100 to the vehicle. 116c.

カバー部材104は、図2に例示するように、下方が開放された箱型を成す部材であり、その内部に車載回路基板106を収容する。そして、カバー部材104が車載回路基板106を覆って、土台部材102に組み付けられることで、図1に例示する筐体100が組立てられる。   As illustrated in FIG. 2, the cover member 104 is a member having a box shape with an open bottom, and houses the in-vehicle circuit board 106 therein. Then, the cover member 104 covers the in-vehicle circuit board 106 and is assembled to the base member 102, whereby the housing 100 illustrated in FIG. 1 is assembled.

車載回路基板106には、所定の周波数で動作する電子部品が多数実装されている。ただし、図2では、車載回路基板106に設置された外部コネクタ117のみを示している。   A large number of electronic components that operate at a predetermined frequency are mounted on the in-vehicle circuit board 106. However, FIG. 2 shows only the external connector 117 installed on the in-vehicle circuit board 106.

つぎに、図3〜図5を参照して、筐体100の各部材について説明する。図3は、図2の筐体100の土台部材102および介在部材107a〜107dを示す図である。図3(a)は土台部材102および介在部材107a〜107dの上面図である。図3(b)は、図3(a)のA−A断面図である。   Next, each member of the housing 100 will be described with reference to FIGS. FIG. 3 is a diagram illustrating the base member 102 and the interposition members 107a to 107d of the housing 100 of FIG. FIG. 3A is a top view of the base member 102 and the interposed members 107a to 107d. FIG.3 (b) is AA sectional drawing of Fig.3 (a).

土台部材102のグランド端子114a〜114dの上には、図3(a)に例示するように、介在部材107a〜107dがそれぞれ配置されている。これらのグランド端子114a〜114dおよび介在部材107a〜107dには、図示のように孔が開けられている。グランド端子114a〜114dは、介在部材107a〜107dを介して車載回路基板106およびカバー部材104を組付ける際の締結部としても用いられる。   As illustrated in FIG. 3A, interposition members 107 a to 107 d are respectively disposed on the ground terminals 114 a to 114 d of the base member 102. These ground terminals 114a to 114d and interposition members 107a to 107d are perforated as shown. The ground terminals 114a to 114d are also used as fastening portions when assembling the in-vehicle circuit board 106 and the cover member 104 via the interposition members 107a to 107d.

ここで、図3(b)に例示する土台部材102の枠体110の高さ、すなわち底面部108から枠体110の上端110aまでの寸法Laを5mmとした。また、図3(b)に例示するように、グランド端子114d上に配置され代表的に示される介在部材107dの厚み方向の寸法Lbを0.5mmとした。   Here, the height of the frame 110 of the base member 102 illustrated in FIG. 3B, that is, the dimension La from the bottom surface portion 108 to the upper end 110 a of the frame 110 was set to 5 mm. Further, as illustrated in FIG. 3B, the dimension Lb in the thickness direction of the interposed member 107d that is arranged on the ground terminal 114d and is typically shown is 0.5 mm.

土台部材102の底面部108は、図3(a)に例示するように、長辺118a、118bおよび短辺120a、120bとで規定された矩形である。ここでは一例として、長辺118a、118bの図3(b)に例示する寸法Lcを105mm程度、図3(a)に例示する短辺120a、120bの寸法Ldを85mm程度とした。   As illustrated in FIG. 3A, the bottom surface portion 108 of the base member 102 has a rectangular shape defined by long sides 118 a and 118 b and short sides 120 a and 120 b. Here, as an example, the dimension Lc illustrated in FIG. 3B of the long sides 118a and 118b is about 105 mm, and the dimension Ld of the short sides 120a and 120b illustrated in FIG.

図4は、図2の筐体100の車載回路基板106の裏面を示す図である。車載回路基板106の裏面には、図4に例示するように、例えば電源用IC130と、電源用IC130に接続された電源ライン132とが実装されている。電源ライン132は、車載回路基板106の表面に実装された図中点線で示す外部コネクタ117の一部と重なる位置に存在している。   FIG. 4 is a view showing the back surface of the in-vehicle circuit board 106 of the housing 100 of FIG. As illustrated in FIG. 4, for example, a power supply IC 130 and a power supply line 132 connected to the power supply IC 130 are mounted on the back surface of the in-vehicle circuit board 106. The power supply line 132 exists at a position overlapping with a part of the external connector 117 indicated by a dotted line in the figure mounted on the surface of the in-vehicle circuit board 106.

図5は、図3の土台部材102に車載回路基板106を載置した状態を示す図である。図5(a)は、土台部材102とともに車載回路基板106の表面を示す上面図である。図5(b)は、図5(a)のB−B断面図である。   FIG. 5 is a diagram illustrating a state in which the in-vehicle circuit board 106 is placed on the base member 102 in FIG. 3. FIG. 5A is a top view showing the surface of the in-vehicle circuit board 106 together with the base member 102. FIG.5 (b) is BB sectional drawing of Fig.5 (a).

図5(a)に点線で例示する介在部材107a〜107dは、下面ではグランド端子114a〜114dに接し(図3(a)参照)、上面では車載回路基板106に接している。このため、図5(b)に例示するように、枠体110の上端110aと車載回路基板106との間は、介在部材107a〜107dの厚み方向の寸法Lbとした0.5mmだけ離れることになる。   The interposition members 107a to 107d illustrated by dotted lines in FIG. 5A are in contact with the ground terminals 114a to 114d on the lower surface (see FIG. 3A), and are in contact with the in-vehicle circuit board 106 on the upper surface. For this reason, as illustrated in FIG. 5B, the upper end 110a of the frame 110 and the in-vehicle circuit board 106 are separated by 0.5 mm as a dimension Lb in the thickness direction of the interposed members 107a to 107d. Become.

上記したように枠体110の高さは、底面部108から枠体110の上端110aまでの寸法Laとした5mmである。したがって、底面部108から車載回路基板106までの距離は、寸法Laに寸法Lbを加えた距離、すなわち5.5mmとなる。言い換えると、介在部材107a〜107dが存在することで、底面部108から車載回路基板106までの距離は、底面部108から枠体110の上端110aまでの寸法Laよりも10%大きくなっている。つまり、介在部材107a〜107dは、車載回路基板106に接し、底面部108と車載回路基板106との距離を変更可能とする部材である。なお、寸法Laは、上記の電源用IC130などを車載回路基板106の裏面に実装できるように設定されている。   As described above, the height of the frame 110 is 5 mm, which is the dimension La from the bottom surface portion 108 to the upper end 110a of the frame 110. Therefore, the distance from the bottom surface portion 108 to the in-vehicle circuit board 106 is a distance obtained by adding the dimension Lb to the dimension La, that is, 5.5 mm. In other words, the presence of the interposition members 107 a to 107 d causes the distance from the bottom surface portion 108 to the in-vehicle circuit board 106 to be 10% larger than the dimension La from the bottom surface portion 108 to the upper end 110 a of the frame 110. That is, the interposition members 107a to 107d are members that come into contact with the in-vehicle circuit board 106 and allow the distance between the bottom surface portion 108 and the in-vehicle circuit board 106 to be changed. The dimension La is set so that the power supply IC 130 and the like can be mounted on the back surface of the in-vehicle circuit board 106.

枠体110は、その上端110aが介在部材107a〜107dを介して車載回路基板106に接していて、図5(b)に例示するように、底面部108と車載回路基板106との間に空洞140を形成している。つまり、空洞140の寸法は、長辺が105mm、短辺が85mm、高さ(厚み)が5.5mmとなっていて、高さは介在部材107a〜107dによって、枠体110の高さよりも0.5mm高くなっている。   The upper end 110a of the frame 110 is in contact with the in-vehicle circuit board 106 via the interposition members 107a to 107d, and as illustrated in FIG. 5B, there is a cavity between the bottom surface portion 108 and the in-vehicle circuit board 106. 140 is formed. That is, the dimension of the cavity 140 is such that the long side is 105 mm, the short side is 85 mm, and the height (thickness) is 5.5 mm, and the height is 0 than the height of the frame 110 by the interposition members 107a to 107d. .5mm higher.

以下、図6〜図9を参照して、筐体100に外部から放射ノイズ(電磁波)が照射される状況下で、空洞内に共振現象が生じる場合について説明する。なお、放射ノイズが照射される状況としては、例えば車室内に置かれる無線機や、沿道に設置された各種機器から放射ノイズが発生し、この放射ノイズが走行中の車両に照射される場合などが考えられる。   Hereinafter, with reference to FIGS. 6 to 9, a description will be given of a case where a resonance phenomenon occurs in the cavity under a situation where radiation noise (electromagnetic wave) is irradiated to the casing 100 from the outside. In addition, as a situation where radiation noise is irradiated, for example, when radiation noise is generated from a wireless device placed in the passenger compartment or various devices installed along the road, this radiation noise is irradiated to a traveling vehicle, etc. Can be considered.

図6は、図3の土台部材102に介在部材107a〜107dを配置していない状態を示す上面図である。ここで、グランド端子114c、114d間の寸法Leは、約90mmとした。なお、グランド端子114cは、図示のように、長辺118aと短辺120aとが交差する箇所から離間していて、短辺120aの中央から上記交差する箇所に多少近付いた位置にある。グランド端子114dは、図示のように、長辺118aと短辺120bとが交差する箇所の近傍に位置している。   FIG. 6 is a top view showing a state where the interposition members 107a to 107d are not arranged on the base member 102 of FIG. Here, the dimension Le between the ground terminals 114c and 114d was about 90 mm. As shown in the figure, the ground terminal 114c is separated from the location where the long side 118a and the short side 120a intersect, and is located slightly closer to the intersecting location from the center of the short side 120a. As shown in the figure, the ground terminal 114d is located in the vicinity of a location where the long side 118a and the short side 120b intersect.

図7は、図6の土台部材102で形成される空洞内に生じる共振現象の原理を説明する模式図である。図7(a)は、介在部材107a〜107dを配置しない状態で土台部材102を用いた場合に空洞内に共振現象が生じる様子を示している。図7(b)は、図7(a)から土台部材102を省略した構成での放射ノイズの様子を示している。図7(c)は、図7(a)に電磁波吸収シートを追加した構成での放射ノイズの様子を示している。   FIG. 7 is a schematic diagram for explaining the principle of the resonance phenomenon that occurs in the cavity formed by the base member 102 of FIG. FIG. 7A shows a state in which a resonance phenomenon occurs in the cavity when the base member 102 is used without the interposed members 107a to 107d being arranged. FIG.7 (b) has shown the mode of the radiation noise in the structure which abbreviate | omitted the base member 102 from Fig.7 (a). FIG.7 (c) has shown the mode of the radiation noise in the structure which added the electromagnetic wave absorption sheet | seat to Fig.7 (a).

土台部材102は、グランド端子114a〜114dの上に上記介在部材107a〜107dが配置されていない状態で、図7(a)に例示するように、車載回路基板106との間で空洞140Aを形成している。   As illustrated in FIG. 7A, the base member 102 forms a cavity 140A with the in-vehicle circuit board 106 in a state where the interposition members 107a to 107d are not disposed on the ground terminals 114a to 114d. doing.

まず、外部から放射ノイズが照射される状況を想定し、ECUの起動前に、筐体100に向けて放射ノイズを照射した。なお、ECUは、筐体100に収容された車載回路基板106を含んでいて、車載用回路基板106と土台部材102との間には介在部材107a〜107dが配置されていないものとする。そして、放射ノイズ照射中にECUを起動させたところ、ECUが起動しないという誤動作を確認した。また、動作中のECUノイズを照射したところ、ECUの動作が停止するという誤動作も確認した。この誤動作は、共振現象に伴って空洞140A内に発生した放射ノイズの共振周波数が、車載回路基板106に実装された電子部品が誤動作する周波数に一致したためと考えられる。   First, assuming a situation where radiation noise is irradiated from the outside, radiation noise was irradiated toward the housing 100 before the ECU was started. It is assumed that the ECU includes an in-vehicle circuit board 106 accommodated in the casing 100, and no interposition members 107a to 107d are disposed between the in-vehicle circuit board 106 and the base member 102. And when ECU was started during radiation noise irradiation, the malfunction that ECU did not start was confirmed. Moreover, when the ECU noise during operation was irradiated, a malfunction that the operation of the ECU stopped was also confirmed. This malfunction is considered to be because the resonance frequency of the radiated noise generated in the cavity 140A due to the resonance phenomenon coincides with the frequency at which the electronic component mounted on the in-vehicle circuit board 106 malfunctions.

具体的には、外部から筐体100に照射された放射ノイズ142は、図示を省略する上記樹脂製のカバー部材104を通って、図7(a)に例示するように車載回路基板106に至る。車載回路基板106は、電子部品が実装された例えば多層基板であり、全体として見れば1枚の金属板(導電壁)と見なせるものの、実際には電子部品間等多くの隙間が存在する。   Specifically, the radiation noise 142 applied to the housing 100 from the outside passes through the resin cover member 104 (not shown) and reaches the in-vehicle circuit board 106 as illustrated in FIG. 7A. . The on-board circuit board 106 is, for example, a multilayer board on which electronic components are mounted, and can be regarded as a single metal plate (conductive wall) as a whole, but actually there are many gaps between the electronic parts.

そのため、車載回路基板106に至る放射ノイズ142は、車載回路基板106を部分的に通過して空洞140Aに至り、金属製の土台部材102で反射される。土台部材102で反射された放射ノイズ144は、図7(a)に例示するように、車載回路基板106で部分的に反射され、その後再度、土台部材102で反射される。   Therefore, the radiation noise 142 reaching the in-vehicle circuit board 106 partially passes through the in-vehicle circuit board 106 and reaches the cavity 140A, and is reflected by the metal base member 102. As illustrated in FIG. 7A, the radiation noise 144 reflected by the base member 102 is partially reflected by the in-vehicle circuit board 106 and then reflected again by the base member 102.

つまり、上記空洞140Aは、金属製の土台部材102と、部分的には導電壁と見なせる車載回路基板106とで囲まれた空間であるから、いわゆる空洞共振器として機能していると考えられる。一般に、空洞共振器は、導電壁で囲まれた空間内に、空間の寸法および形状で定まる、ある特定の波長の電磁界のみが成長する共振現象を生じさせる。   That is, since the cavity 140A is a space surrounded by the metal base member 102 and the in-vehicle circuit board 106 that can be considered as a conductive wall, it is considered to function as a so-called cavity resonator. In general, a cavity resonator generates a resonance phenomenon in which only an electromagnetic field having a specific wavelength, which is determined by the size and shape of a space, is grown in a space surrounded by conductive walls.

一方、図7(b)に例示するように、土台部材102を除いた構成では、放射ノイズ142は車載回路基板106を部分的に通過するのみであり、電子部品の誤動作は確認されなかった。よって、車載回路基板106の上面から照射された放射ノイズ142が、車載回路基板106の電子部品に直接影響を与えてはいないことが確認された。   On the other hand, as illustrated in FIG. 7B, in the configuration excluding the base member 102, the radiated noise 142 only partially passes through the in-vehicle circuit board 106, and no malfunction of the electronic component was confirmed. Therefore, it was confirmed that the radiation noise 142 irradiated from the upper surface of the in-vehicle circuit board 106 does not directly affect the electronic components of the in-vehicle circuit board 106.

また、図7(c)に例示するように、車載回路基板106と土台部材102との間の空洞内に電磁波吸収シート146を配置した構成でも、電子部品の誤動作は確認されなかった。   Further, as illustrated in FIG. 7C, the malfunction of the electronic component was not confirmed even in the configuration in which the electromagnetic wave absorbing sheet 146 was disposed in the cavity between the in-vehicle circuit board 106 and the base member 102.

この構成では、車載回路基板106を部分的に通過した放射ノイズ142は、電磁波吸収シート146で吸収されつつ、放射ノイズ148aとして土台部材102に至り、土台部材102で反射され、放射ノイズ148bとなる。放射ノイズ148bは、電磁波吸収シート146で吸収され、放射ノイズ148cとして車載回路基板106に至り、車載回路基板106で部分的に反射され、放射ノイズ148dとなる。放射ノイズ148dは、電磁波吸収シート146で吸収されつつ、放射ノイズ148eとして空洞140Aに至る。つまり、電磁波吸収シート146により電磁波が吸収されることで、問題となる周波数で共振現象が生じなかったと考えられる。   In this configuration, the radiated noise 142 partially passing through the in-vehicle circuit board 106 is absorbed by the electromagnetic wave absorbing sheet 146, reaches the base member 102 as the radiated noise 148a, is reflected by the base member 102, and becomes the radiated noise 148b. . The radiation noise 148b is absorbed by the electromagnetic wave absorbing sheet 146, reaches the in-vehicle circuit board 106 as the radiation noise 148c, is partially reflected by the in-vehicle circuit board 106, and becomes the radiation noise 148d. The radiation noise 148d reaches the cavity 140A as the radiation noise 148e while being absorbed by the electromagnetic wave absorbing sheet 146. That is, it is considered that the resonance phenomenon did not occur at the problematic frequency because the electromagnetic wave was absorbed by the electromagnetic wave absorbing sheet 146.

したがって、図7(a)に模式的に示す介在部材107a〜107dを配置しない状態で、土台部材102を用いた筐体100では、車載回路基板106と土台部材102とが空洞140Aを介して平行平板を形成し、いわゆる平行平板共振を起こすような共振現象が生じていると想定される。   Accordingly, in the casing 100 using the base member 102 without the interposed members 107a to 107d schematically shown in FIG. 7A, the in-vehicle circuit board 106 and the base member 102 are parallel through the cavity 140A. It is assumed that a resonance phenomenon that forms a flat plate and causes so-called parallel plate resonance occurs.

図8は、空洞内に生じると予想される共振モードを例示する図である。共振モードとは、共振現象に伴って空間内に生じる電磁界の様子を示すものであり、空間内の電磁波の共振周波数に応じて多数存在する。図8(a)および図8(b)では、ある瞬間での電界を実線で示し、磁界を点線で示している。   FIG. 8 is a diagram illustrating a resonance mode expected to occur in the cavity. The resonance mode indicates a state of an electromagnetic field generated in the space due to the resonance phenomenon, and there are a large number according to the resonance frequency of the electromagnetic wave in the space. 8A and 8B, the electric field at a certain moment is indicated by a solid line, and the magnetic field is indicated by a dotted line.

図8(a)は、図7に例示した空洞140Aに生じる共振モード150、152、154を模式的に示している。なお、図8(a)で各共振モードとして上側に例示する図は、空洞140Aを上方から見た状態を示している。また、各共振モードとして下側に例示する図は、空洞140Aを側方から見た状態を示していて、さらに高さ方向に拡大して示している。   FIG. 8A schematically shows resonance modes 150, 152, and 154 generated in the cavity 140A illustrated in FIG. In addition, the figure illustrated to the upper side as each resonance mode in Fig.8 (a) has shown the state which looked at the cavity 140A from upper direction. In addition, the diagrams illustrated below as the resonance modes show the state where the cavity 140A is viewed from the side, and is further enlarged in the height direction.

一方、図8(b)は、土台部材102と車載回路基板106との間に介在部材107a〜107dを配置し、介在部材107a〜107dの厚み寸法Lbだけ空洞140Aよりも高さの高い、図5(b)に例示する空洞140が形成されている状態を想定している。つまり、図8(b)の下側に例示するように、空洞140では、上記の底面部108から車載回路基板106までの距離が、上記の寸法Laに寸法Lbを加えた距離となっている。   On the other hand, FIG. 8B shows that the interposed members 107a to 107d are arranged between the base member 102 and the in-vehicle circuit board 106, and the height is higher than the cavity 140A by the thickness dimension Lb of the interposed members 107a to 107d. It is assumed that the cavity 140 illustrated in 5 (b) is formed. That is, as illustrated in the lower side of FIG. 8B, in the cavity 140, the distance from the bottom surface 108 to the in-vehicle circuit board 106 is a distance obtained by adding the dimension Lb to the dimension La. .

図8(a)および図8(b)に例示する共振モード150、152、154は、いずれも代表的なモードであり、電子部品の誤動作周波数である1.6GHz程度を共振周波数として仮定している。なお、周波数1.64GHzの電磁波の波長は、式(1)から算出される。   The resonance modes 150, 152, and 154 illustrated in FIG. 8A and FIG. 8B are all representative modes, assuming that the resonance frequency is about 1.6 GHz, which is a malfunction frequency of the electronic component. Yes. The wavelength of the electromagnetic wave having a frequency of 1.64 GHz is calculated from the equation (1).

波長=電磁波の速度/周波数≒3×1011/1.64×10=182.8mm (1)
上記の式(1)で算出される周波数1.64GHzの電磁波の1/2波長、すなわち91.4mmの整数倍の高調波が空洞140A内で定在波として存在し共振することで、共振モード150、152、154に示す電磁界がそれぞれ形成される。なお、空洞140A内に生じる電磁界の様子が共振モード150、152、154のうちいずれのモードに分類されるかは、空洞140Aの寸法および形状に依存する。
Wavelength = velocity of electromagnetic wave / frequency≈3 × 10 11 /1.64×10 9 = 182.8 mm (1)
Resonance mode is achieved when a half wave of an electromagnetic wave having a frequency of 1.64 GHz calculated by the above formula (1), that is, a harmonic of an integral multiple of 91.4 mm, exists as a standing wave in the cavity 140A and resonates. Electromagnetic fields indicated by 150, 152, and 154 are formed, respectively. Note that whether the state of the electromagnetic field generated in the cavity 140A is classified into any of the resonance modes 150, 152, and 154 depends on the size and shape of the cavity 140A.

ここで、土台部材102の底面部108の長辺118a、118b、短辺120a、120bあるいはグランド端子114c、114d間の長さが、上記の電磁波の1/2波長にほぼ一致してしまうと、電子部品の誤動作が生じ易い。上記したように、図6に例示するグランド端子114c、114d間の寸法Lfは、約90mmであり、車載回路基板106に実装されている多数の電子部品が誤動作する周波数1.64GHzの1/2波長である91.4mmに近い寸法であった。   Here, when the length between the long sides 118a and 118b, the short sides 120a and 120b or the ground terminals 114c and 114d of the bottom surface portion 108 of the base member 102 substantially matches the half wavelength of the electromagnetic wave, Electronic components are likely to malfunction. As described above, the dimension Lf between the ground terminals 114c and 114d illustrated in FIG. 6 is about 90 mm, and is ½ of the frequency of 1.64 GHz at which many electronic components mounted on the in-vehicle circuit board 106 malfunction. The size was close to the wavelength of 91.4 mm.

一方、共振現象は、空間の寸法および形状で定まることから、矩形の底面部108の長辺118a、118b、短辺120a、120bあるいはグランド端子114c、114d間の長さに限らず、底面部108と車載回路基板106との距離にも依存すると考えられる。   On the other hand, since the resonance phenomenon is determined by the size and shape of the space, the bottom surface portion 108 is not limited to the length between the long sides 118a and 118b, the short sides 120a and 120b or the ground terminals 114c and 114d of the rectangular bottom surface portion 108. It is considered that this also depends on the distance between the circuit board 106 and the in-vehicle circuit board 106.

そこで本実施形態では、筐体100の軽量化や省スペース化の観点から空洞140Aを小さくするという技術的な傾向に反して、土台部材102と車載回路基板106との間に介在部材107a〜107dを配置し、底面部108と車載回路基板106との距離を大きくした空洞140を形成した。その結果、本実施形態では、放射ノイズの共振周波数をずらし、電子部品の誤動作する周波数と異なるようにして、電子部品の誤動作を防止している。以下、具体的に説明する。   Therefore, in the present embodiment, against the technical trend of reducing the cavity 140A from the viewpoint of weight reduction and space saving of the housing 100, the interposed members 107a to 107d are provided between the base member 102 and the in-vehicle circuit board 106. And a cavity 140 was formed in which the distance between the bottom surface portion 108 and the in-vehicle circuit board 106 was increased. As a result, in the present embodiment, the malfunction frequency of the electronic component is prevented by shifting the resonance frequency of the radiation noise to be different from the frequency at which the electronic component malfunctions. This will be specifically described below.

図8(b)に例示するように、底面部108と車載回路基板106との距離は、寸法Laに介在部材107a〜107dの厚み方向の寸法Lbを加えた距離となっている。このため、介在部材107a〜107dが存在しないときに形成される空洞140Aの寸法および形状とは異なる、上記の空洞140が形成されることになる。なお、底面部108と車載回路基板106との距離は、上記したように5.5mmであり、寸法Laは5mmであるから、寸法Laよりも10%大きくなっている。   As illustrated in FIG. 8B, the distance between the bottom surface portion 108 and the in-vehicle circuit board 106 is a distance obtained by adding the dimension Lb in the thickness direction of the interposition members 107a to 107d to the dimension La. For this reason, the above-mentioned cavity 140 is formed, which is different from the size and shape of the cavity 140A formed when the interposed members 107a to 107d are not present. Note that the distance between the bottom surface portion 108 and the in-vehicle circuit board 106 is 5.5 mm as described above, and the dimension La is 5 mm, which is 10% larger than the dimension La.

つまり、空洞共振器として機能する空間の寸法が、介在部材107a〜107dの存在によって変化するので、空間の寸法および形状で定まる共振現象に伴う共振モードも変化すると考えられる。このため、図8(b)に模式的に示す空洞140には、図示は省略するが、空洞140Aに形成される図中の共振モード150、152、154とは異なる共振モードが形成されると予想される。よって、空洞140では、共振モード150、152、154に示される電界および磁界の形成が妨げられ、共振モード150、152、154に示される電磁界とは異なる電磁界が形成される。その結果、空洞140内の電磁波の共振周波数をずらすことが可能となる。   That is, since the dimension of the space functioning as the cavity resonator changes depending on the presence of the interposed members 107a to 107d, it is considered that the resonance mode accompanying the resonance phenomenon determined by the size and shape of the space also changes. For this reason, in the cavity 140 schematically shown in FIG. 8B, a resonance mode different from the resonance modes 150, 152, and 154 in the figure formed in the cavity 140A is formed although illustration is omitted. is expected. Therefore, in the cavity 140, the formation of the electric field and magnetic field shown in the resonance modes 150, 152, and 154 is prevented, and an electromagnetic field different from the electromagnetic field shown in the resonance modes 150, 152, and 154 is formed. As a result, the resonance frequency of the electromagnetic wave in the cavity 140 can be shifted.

図9は、土台部材102から車載回路基板106までの距離と誤動作の有無との関係を例示する図である。ここでは一例として、土台部材102の底面部108から車載回路基板106までの距離を変えた筐体100に対して、1〜2GHzの周波数を有する放射ノイズを照射し、誤動作の有無を確認した結果を示している。上記の距離は、介在部材107a〜107dを配置しない場合が5mmである。また、介在部材107a〜107dとして厚み3.5mmのナット、または厚み1mmのワッシャをそれぞれ配置した場合、上記の距離は、5mmに3.5mmまたは1mmが追加され、8.5mmまたは6mmとなる。さらに、銅箔テープを重ねることで形成された厚み0.5mmの介在部材107a〜107dを配置した場合、上記の距離は、5mmに0.5mmが追加され、5.5mmとなる。   FIG. 9 is a diagram illustrating the relationship between the distance from the base member 102 to the in-vehicle circuit board 106 and the presence or absence of malfunction. Here, as an example, as a result of radiating noise having a frequency of 1 to 2 GHz to the casing 100 in which the distance from the bottom surface portion 108 of the base member 102 to the in-vehicle circuit board 106 is changed, the presence or absence of malfunction is confirmed. Is shown. The distance is 5 mm when the interposed members 107a to 107d are not arranged. Further, when a 3.5 mm thick nut or a 1 mm thick washer is respectively disposed as the interposition members 107a to 107d, the above distance becomes 8.5 mm or 6 mm by adding 3.5 mm or 1 mm to 5 mm. Furthermore, when the interposed members 107a to 107d having a thickness of 0.5 mm formed by stacking the copper foil tapes are arranged, the above distance becomes 5.5 mm by adding 0.5 mm to 5 mm.

図中では、1.5GHz付近の周波数を有する電界強度200V/mの放射ノイズを、介在部材107a〜107dを配置せず、車載回路収容筐体100に照射したところ、上記の距離が5mmである場合には誤動作を確認し「NG」となった。しかし介在部材107a〜107dを配置して距離を5.5mm、6mm、8.5mmと大きくしたところ、誤動作は発生せず「OK」となった。なお、上記の距離は、介在部材107a〜107dを配置しない場合に比べて10%以上大きくなっている。このように介在部材107a〜107dによって、電磁波の影響が変動することが明らかとなり、結果的に電磁波の周波数も変化すると考えられる。   In the figure, when the in-vehicle circuit housing case 100 is irradiated with radiation noise having an electric field strength of 200 V / m having a frequency of about 1.5 GHz without placing the interposition members 107a to 107d, the above distance is 5 mm. In this case, the malfunction was confirmed and the result was “NG”. However, when the interposition members 107a to 107d were arranged and the distances were increased to 5.5 mm, 6 mm, and 8.5 mm, no malfunction occurred and the result was “OK”. In addition, said distance is 10% or more larger compared with the case where interposition member 107a-107d is not arrange | positioned. Thus, it becomes clear that the influence of electromagnetic waves fluctuates by the interposed members 107a to 107d, and as a result, the frequency of the electromagnetic waves is also considered to change.

本実施形態によれば、上記の寸法を有する土台部材102と車載回路基板106との間に、上記の厚みを有する介在部材107a〜107dを介在させることで、空洞共振器として機能する空間の寸法および形状を変化させる。その結果、介在部材107a〜107dが存在しない空洞140A内で生じると予想される、共振モード150、152、154の電界および磁界の形成を妨げ、放射ノイズの共振周波数をずらすことができる。したがって、筐体100では、樹脂製のカバー部材104を採用しながらも、電子部品の誤動作する周波数と一致する放射ノイズが空洞内に形成されることがない。その結果、電子部品の誤動作を防止でき、外部からの放射ノイズの影響を低減できる。なお、上記実施形態では、介在部材107a〜107dを介して土台部材102の底面部108と車載回路基板106との間の上記距離を変更したが、これに限られない。一例として、介在部材107a〜107dを用いず、上記の距離が約5.5mmまたは5.5mm以上となるように、土台部材102の底面部108から枠体110の上端110aまでの距離を予め設定してもよい。要するに、車載回路基板収容筐体では、電子部品の誤動作する周波数と一致する放射ノイズが空洞内に形成されないように、上記の距離を設定すればよい。   According to the present embodiment, the interposition members 107a to 107d having the above thickness are interposed between the base member 102 having the above dimensions and the in-vehicle circuit board 106, so that the dimensions of the space functioning as a cavity resonator are obtained. And change shape. As a result, it is possible to prevent the formation of electric and magnetic fields in the resonance modes 150, 152, and 154, which are expected to occur in the cavity 140A in which the interposition members 107a to 107d do not exist, and to shift the resonance frequency of the radiation noise. Therefore, in the case 100, the radiated noise that matches the frequency at which the electronic component malfunctions is not formed in the cavity while the resin cover member 104 is employed. As a result, malfunction of the electronic component can be prevented, and the influence of external radiation noise can be reduced. In the above embodiment, the distance between the bottom surface portion 108 of the base member 102 and the in-vehicle circuit board 106 is changed via the interposition members 107a to 107d. However, the present invention is not limited to this. As an example, the distance from the bottom surface portion 108 of the base member 102 to the upper end 110a of the frame 110 is set in advance so that the above-mentioned distance is about 5.5 mm or 5.5 mm or more without using the interposition members 107a to 107d. May be. In short, in the in-vehicle circuit board housing case, the above-described distance may be set so that radiated noise matching the frequency at which the electronic component malfunctions is not formed in the cavity.

図10は、本発明の他の実施形態である、車載回路基板収容筐体の一部を例示する断面図である。なお、図10(a)の断面図は、図5(b)に対応させて示している。上記実施形態では、介在部材107a〜107dを配置することで、放射ノイズの共振周波数をずらしていたが、これに限られない。すなわち、図10に例示するように、介在部材107a〜107dを配置した上で、空洞140内に平板状の発泡スチロール160を配置してもよい。   FIG. 10 is a cross-sectional view illustrating a part of an in-vehicle circuit board housing as another embodiment of the present invention. Note that the cross-sectional view of FIG. 10A corresponds to FIG. 5B. In the above embodiment, the resonance frequency of the radiation noise is shifted by arranging the interposed members 107a to 107d. However, the present invention is not limited to this. That is, as illustrated in FIG. 10, the flat foam polystyrene 160 may be disposed in the cavity 140 after the interposition members 107 a to 107 d are disposed.

発泡スチロール160は、比誘電率が2〜2.5の誘電体である。このため、発泡スチロール160を空洞140内に配置することで、放射ノイズの周波数帯によっては電波透過性が良くなり、上記の共振モードが変化し、結果的に、電子部品が誤作動を起こす問題となる共振周波数をずらす場合があると考えられる。よって、このような筐体であっても、外部からの放射ノイズの影響をより効果的に低減できる。このことから、発泡スチロールのような誘電体を配置することで、実質的に電波の通る経路を長くすることと等価な状況を作り得る。これにより、図10(b)の断面図に例示した筐体のように、図5(b)や図10(a)に例示した厚み方向の寸法Lbの長さを有さず、土台部材102の底面部108から車載回路基板106までの距離を例えば5mmとしても、空洞140内に発泡スチロール160を配置することで、見かけの共振周波数をずらすことが可能となり、放射ノイズの影響を低減できる。なお、発泡スチロール160は平板状としたが、適宜の形状を有してよい。また、上述した各実施形態にかかる車載回路基板収容筐体を用いることで、放射ノイズの影響を低減した信頼性の高い車載用電子制御装置を得ることが可能となる。   The expanded polystyrene 160 is a dielectric having a relative dielectric constant of 2 to 2.5. For this reason, by disposing the polystyrene foam 160 in the cavity 140, radio wave transmission is improved depending on the frequency band of radiation noise, the above-described resonance mode is changed, and as a result, the electronic component malfunctions. It is considered that the resonance frequency may be shifted. Therefore, even if it is such a housing | casing, the influence of the radiation noise from the outside can be reduced more effectively. From this fact, by disposing a dielectric material such as polystyrene foam, it is possible to create a situation equivalent to substantially extending the path through which the radio wave passes. Thus, unlike the case illustrated in the cross-sectional view of FIG. 10B, the base member 102 does not have the length of the dimension Lb in the thickness direction illustrated in FIG. 5B or FIG. Even if the distance from the bottom surface portion 108 to the in-vehicle circuit board 106 is set to 5 mm, for example, by disposing the foamed polystyrene 160 in the cavity 140, the apparent resonance frequency can be shifted, and the influence of radiation noise can be reduced. Although the foamed polystyrene 160 has a flat plate shape, it may have an appropriate shape. In addition, by using the on-vehicle circuit board housing case according to each of the above-described embodiments, it is possible to obtain a highly reliable on-vehicle electronic control device in which the influence of radiation noise is reduced.

以上、添付図面を参照しながら本発明の好適な実施形態について説明したが、本発明は係る例に限定されないことは言うまでもない。当業者であれば、特許請求の範囲に記載された範疇内において、各種の変更例または修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。   As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

本発明は、特定周波数で動作する電子部品が実装された車載回路基板を収容する車載回路基板収容筐体および車載用電子制御装置に利用することができる。   INDUSTRIAL APPLICABILITY The present invention can be used for an in-vehicle circuit board housing case for housing an in-vehicle circuit board on which an electronic component that operates at a specific frequency is mounted, and an in-vehicle electronic control device.

100…筐体、102…土台部材、104…カバー部材、106…車載回路基板、107a〜107d…介在部材、108…底面部、110…枠体、114a〜114b…グランド端子、116a〜116d…フランジ、117…外部コネクタ、118a、118b…長辺、120a、120b…短辺、130…電源IC、132…電源ライン、140…空洞、142、144、148a〜148e…放射ノイズ(電磁波)、146…電磁波吸収シート、150、152、154…共振モード、160…発泡スチロール DESCRIPTION OF SYMBOLS 100 ... Housing | casing 102 ... Base member, 104 ... Cover member, 106 ... In-vehicle circuit board, 107a-107d ... Interposition member, 108 ... Bottom part, 110 ... Frame, 114a-114b ... Ground terminal, 116a-116d ... Flange DESCRIPTION OF SYMBOLS 117 ... External connector, 118a, 118b ... Long side, 120a, 120b ... Short side, 130 ... Power supply IC, 132 ... Power supply line, 140 ... Cavity, 142, 144, 148a-148e ... Radiated noise (electromagnetic wave), 146 ... Electromagnetic wave absorbing sheet, 150, 152, 154 ... resonance mode, 160 ... styrene foam

Claims (4)

電子部品が実装された車載回路基板を備え、該車載回路基板を収容する車載回路基板収容筐体であって、
前記車載回路基板が載置される金属製の土台部材と、
前記車載回路基板を覆って前記土台部材に組み付けられる樹脂製のカバー部材とを備え、
前記土台部材は、矩形の底面部と、該底面部の周囲に立設され該底面部とともに空洞を形成する枠体と、該底面部と該枠体とを用いて形成された複数のグランド端子とを有し、
前記底面部の長辺の長さ、短辺の長さ、あるいは該長辺と該短辺とが交差する箇所の近傍に位置するグランド端子と該交差する箇所から離間した位置にある他のグランド端子との間の長さが、前記電子部品の誤作動周波数の電磁波の1/2波長にほぼ一致、前記土台部材の前記底面部と前記車載回路基板との距離が5.5mm以上であることを特徴とする車載回路基板収容筐体。
An in-vehicle circuit board housing case that includes an in-vehicle circuit board on which electronic components are mounted and that houses the in-vehicle circuit board,
A metal base member on which the in-vehicle circuit board is placed;
A resin cover member that covers the in-vehicle circuit board and is assembled to the base member;
The base member has a rectangular bottom surface, a frame standing around the bottom surface and forming a cavity together with the bottom surface, and a plurality of ground terminals formed using the bottom surface and the frame And
The length of the long side of the bottom portion, the length of the short side, or a ground terminal located in the vicinity of a location where the long side and the short side intersect with another ground located at a position away from the intersecting location The length between the terminals is substantially equal to a half wavelength of the electromagnetic wave of the malfunction frequency of the electronic component, and the distance between the bottom surface portion of the base member and the in-vehicle circuit board is 5.5 mm or more. An on-vehicle circuit board housing case characterized by the above.
前記土台部材は、前記車載回路基板に接し、前記底面部と該車載回路基板との距離を変更可能にする介在部材を含むことを特徴とする請求項1に記載の車載回路基板収容筐体。   2. The on-board circuit board housing case according to claim 1, wherein the base member includes an interposition member that comes into contact with the on-board circuit board and allows a distance between the bottom surface portion and the on-board circuit board to be changed. 前記空洞内に配置された発泡スチロールをさらに備えることを特徴とする請求項1または2に記載の車載回路基板収容筐体。   The on-vehicle circuit board housing case according to claim 1, further comprising a polystyrene foam disposed in the cavity. 請求項1から3のいずれか1項に記載の車載回路基板収容筐体を備えることを特徴とする車載用電子制御装置。   An in-vehicle electronic control device comprising the in-vehicle circuit board housing case according to any one of claims 1 to 3.
JP2012140392A 2012-06-22 2012-06-22 In-vehicle circuit board housing case and in-vehicle electronic control device Active JP5781982B2 (en)

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