JP5832650B2 - Vapor deposition equipment - Google Patents

Description

The present invention provides a plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess whose upper surface is opened, on a rotatable rotating support body in the circumferential direction, and a specific vapor deposition material is accommodated by the rotary support body. The present invention relates to a vapor deposition apparatus that guides the body to a heating position, heats the vapor deposition material accommodated in the recess of the vapor deposition material container, evaporates the vapor deposition material through the opening, and deposits the vapor deposition material on the surface of the material to be processed. is there. In particular, when a vapor deposition material accommodated in a recess of a specific vapor deposition material container is irradiated with a beam and heated, and this vapor deposition material is evaporated, the evaporated vapor deposition material is transferred to another vapor deposition material container. It is characterized in that it is prevented from being mixed into the deposited vapor deposition material.

  2. Description of the Related Art Conventionally, a vacuum deposition apparatus has been used to deposit various materials on the surface of various materials to be processed such as glass substrates.

  In such a vapor deposition apparatus, various vapor deposition materials are accommodated in a concave portion of a vapor deposition material container such as a crucible, and a beam such as a plasma beam is emitted from a beam emission device such as a plasma gun. The vapor deposition material accommodated in the recess is irradiated from the opened upper surface of the vapor deposition material container to evaporate the vapor deposition material, and the vapor deposition material is vapor deposited on the surface of the material to be processed to form a film.

  In such a vapor deposition apparatus, when different vapor deposition materials are sequentially deposited on the surface of the material to be treated, or when different vapor deposition materials are vapor deposited on the surface of the different material to be treated, In order to efficiently deposit various vapor deposition materials on the surface one after another, for example, as shown in Patent Documents 1 and 2, a plurality of vapor deposition material accommodating portions for accommodating the vapor deposition materials are provided on the upper surface of the rotatable rotating body. Concave in the circumferential direction with a required interval, guide the specific vapor deposition material container provided in this rotating body to the beam irradiation position, and irradiate the vapor deposition material accommodated in this vapor deposition material container with the beam In this case, an evaporation material is evaporated.

  However, when the vapor deposition material accommodated in the vapor deposition material container guided to the beam irradiation position is irradiated with the beam to evaporate the vapor deposition material, the vapor deposition material evaporated from the vapor deposition material container However, not only the surface of the material to be treated but also other vapor deposition material container provided in the rotating body, the vaporized vapor deposition material is mixed into the vapor deposition material accommodated in the other vapor deposition material container. There was a problem.

  For this reason, in Patent Document 2, a protective cover provided with an opening in a portion facing the vapor deposition material container guided to the beam irradiation position is provided above the rotating body so as to cover the other vapor deposition material container. The vapor deposition material evaporated from the vapor deposition material container guided to the beam irradiation position is mixed into the vapor deposition material accommodated in another vapor deposition material container not guided to the beam irradiation position. It is shown to prevent this.

  However, even when the protective cover is provided above the rotator with a required interval, the vapor deposition material evaporated from the vapor deposition material container guided to the beam irradiation position is not removed between the protective cover and the rotator. The vapor deposition material is guided to the other vapor deposition material container through the gap, and the vaporized vapor deposition material cannot be sufficiently prevented from being mixed into the vapor deposition material accommodated in the other vapor deposition material container, and is evaporated. When the evaporated material adheres to the lower surface of the protective cover and the rotating body is rotated to guide the other evaporated material container to the beam irradiation position, the evaporated material attached to the lower surface of the protective cover enters the other evaporated material container. There was a problem of falling and mixing in the deposited vapor deposition material.

  In addition, the gap between the protective cover and the rotating body is narrowed to prevent the evaporated vapor deposition material from being guided to another vapor deposition material container through the space between the protective cover and the rotating body. Although it is conceivable, there is a limit to narrowing the gap between the protective cover and the rotating body because the rotating body is rotated and the deposition material container is sequentially guided to the beam irradiation position. Appropriately prevent vapor deposition material evaporated from the material container from adhering to the lower surface of the protective cover or mixing into the vapor deposition material accommodated in another vapor deposition material container through the protective cover and the rotating body. It was difficult to prevent.

  In particular, in the case where a vapor deposition material container in which a vapor deposition material is accommodated is provided on the upper surface of the rotary support, and this vapor deposition material container protrudes upward from the rotary support, even if a protective cover as described above is provided, The gap between the rotating support and the protective cover is increased, and the vapor deposition material evaporated from a specific vapor deposition material container is sufficiently prevented from entering the vapor deposition material accommodated in another vapor deposition material container. It was difficult.

Japanese Utility Model Publication No. 62-110263 JP 2004-256843 A

  As described above, the present invention provides a plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess whose upper surface is opened on a rotatable rotation support body in the circumferential direction. A specific vapor deposition material container is guided to a heating position such as a beam irradiation position, and the vapor deposition material is heated by irradiating the vapor deposition material accommodated in the recess through the opening of the vapor deposition material container to evaporate the vapor deposition material. Thus, an object of the present invention is to solve the above-described problems in a vapor deposition apparatus for vapor deposition on the surface of a material to be treated.

  That is, in the present invention, in the vapor deposition apparatus as described above, the vapor deposition material accommodated in the concave portion of the vapor deposition material container guided to the heating position such as the beam irradiation position is irradiated with a beam to heat the vapor deposition material. In the case where the vapor deposition material is evaporated and vapor deposited on the surface of the material to be treated, it is possible to appropriately prevent the evaporated vapor deposition material from being mixed into the vapor deposition material accommodated in another vapor deposition material container. It is to be an issue.

In the first vapor deposition apparatus according to the present invention , in order to solve the above-described problems, the vapor deposition material container in which the vapor deposition material is accommodated in the recess having the upper surface opened is provided on the rotatable support body. A plurality of circumferentially disposed, and a specific vapor deposition material container is guided to a heating position by the rotating support, the vapor deposition material accommodated in the recess of the vapor deposition material container is heated, and the vapor deposition material is In a vapor deposition apparatus that evaporates through the opening and deposits on the surface of the material to be treated, the deposition member provided with the opening that exposes the vapor deposition material container guided to the heating position is used as the other deposition material container. The upper surface of the deposition material container, which is disposed on the rotating support so as to cover the upper surface and led to the heating position, is positioned above the lower surface of the deposition preventing member at the lip of the opening. to make it, the lower the adhesion-preventing member And formed in a stepped shape having a top portion, an opening for exposing the deposition material container guided to the heating position was provided in the lower portion of the deposition-inhibitory member.

  In this way, when the upper surface of the vapor deposition material container guided to the heating position is positioned above the lower surface of the deposition preventing member at the lip of the opening that exposes the vapor deposition material container, the beam is irradiated. The vapor deposition material evaporated from the opened upper surface of the vapor deposition material container is suppressed from being led to the lower surface side of the deposition member through the gap between the vapor deposition material container and the opening. It is prevented from being led to another vapor deposition material container through between the lower surface of the substrate and the rotary support. In particular, when the upper surface of the vapor deposition material container guided to the heating position is positioned above the upper surface of the deposition preventing member at the lip of the opening, the evaporated vapor deposition material is separated from the vapor deposition material container and the It is further suppressed from being led to the lower surface side of the adhesion preventing member through the opening of the adhesion preventing member from being led to another vapor deposition material container through between the lower surface of the adhesion preventing member and the rotary support. Become so.

Further, in the second vapor deposition apparatus according to the present invention, a plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess having an upper surface opened are provided in a circumferential direction on a rotatable rotary support, A specific vapor deposition material container is guided to a heating position by the rotary support of the vapor deposition material, the vapor deposition material accommodated in the recess of the vapor deposition material container is heated, and the vapor deposition material is evaporated through the opening to be processed. In the vapor deposition apparatus for vapor deposition on the surface of the substrate, the adhesion preventing member provided with the opening for exposing the vapor deposition material container guided to the heating position is rotated and supported so as to cover the upper surface of the other vapor deposition material container. The upper surface of the deposition material container that is disposed on the body and led to the heating position is positioned above the lower surface of the deposition preventing member at the lip of the opening, and the heating position Adjacent to the deposition material container led to The separation protrusion for separating the other of the vapor deposition material container, is provided between the rotary support and the adhesion-preventing member.

And like the 2nd vapor deposition apparatus, the separation convex part which isolate | separates the vapor deposition material container guide | induced to the said heating position and the other vapor deposition material container adjacent to the said adhesion member and rotation support body The gap between the lower surface of the deposition-preventing member provided with the separation projection and the rotating support is further narrowed, and the vapor deposition material evaporated from the upper surface of the vapor deposition material container is Even if it is led to the lower surface side of the deposition preventing member through the vapor deposition material container and the opening, it is restrained between the lower surface of the deposition preventing member provided with the separation convex portion and the rotating support, and is evaporated. It is further prevented that the deposited vapor deposition material is guided to another vapor deposition material container.

Further, in the third vapor deposition apparatus according to the present invention, a plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess having an upper surface opened are provided on a rotatable rotating support body in the circumferential direction, A specific vapor deposition material container is guided to a heating position by the rotary support of the vapor deposition material, the vapor deposition material accommodated in the recess of the vapor deposition material container is heated, and the vapor deposition material is evaporated through the opening to be processed. In the vapor deposition apparatus for vapor deposition on the surface of the substrate, the adhesion preventing member provided with the opening for exposing the vapor deposition material container guided to the heating position is rotated and supported so as to cover the upper surface of the other vapor deposition material container. The deposition upper surface of the vapor deposition material container that is placed on the body and led to the heating position is positioned above the lower surface of the deposition preventing member at the lip of the opening, Heat-resistant ring at the opening edge of the member It is mounted, and so tilted downward toward the outer peripheral side upper surface of the heat ring from the inner peripheral side.

And like a 3rd vapor deposition apparatus, when a heat-resistant ring is attached to the lip of the opening of the above-mentioned deposition preventing member, and the upper surface portion of this heat-resistant ring is inclined downward from the inner peripheral side toward the outer peripheral side, The heat-resistant ring prevents the edge of the opening of the deposition preventing member from being deformed by heat, and the lump of vapor deposition material adhering to the edge of the opening faces toward the outer peripheral side of the upper surface of the heat-resistant ring. When the deposition member is guided along the downwardly inclined surface and is lifted or lowered, the vapor deposition material lump attached to the lip of the opening portion may form on the rotating support or other It is prevented from falling into the vapor deposition material container.

Further, in each of the vapor deposition apparatuses, the vapor deposition material is evaporated from the specific vapor deposition material container guided to the heating position, and the vapor deposition material is vapor-deposited on the surface of the material to be treated. In order to guide the other vapor deposition material container to the heating position, an elevating device for elevating and lowering at least one of the adhesion preventing member and the rotation support body can be provided.

And when raising / lowering an adhesion prevention member by the said raising / lowering apparatus, the lower surface in the opening edge of the said opening part does not collide with the upper surface of the said vapor deposition material container by this raising / lowering apparatus. In the state raised to the position, the rotary support is rotated so that the next vapor deposition material container is guided to the heating position. And after guiding the next vapor deposition material container to the heating position in this way, the deposition member is lowered by the lifting device, and the upper surface of the next vapor deposition material container is opened to the lip of the opening. It is made to position above the lower surface of the adhesion-preventing member.

  In the vapor deposition apparatus of the present invention, the adhesion preventing member provided with the opening for exposing the vapor deposition material container guided to the heating position is placed on the rotating support so as to cover the upper surface of the other vapor deposition material container. Since the upper surface of the vapor deposition material container guided to the heating position is positioned above the lower surface of the deposition preventing member at the lip of the opening, the beam is irradiated. The vapor deposition material evaporated from the upper surface of the vapor deposition material container that is opened is suppressed from being led to the lower surface side of the deposition preventing member through the space between the vapor deposition material container and the opening. It is prevented from adhering or being led to another vapor deposition material container through the lower surface of the adhesion-preventing member and the rotary support.

  As a result, in the vapor deposition apparatus of the present invention, the vapor deposition material accommodated in the concave portion of the vapor deposition material container is irradiated with a beam through the opening of the vapor deposition material container guided to the heating position by the rotating support, thereby vapor deposition material. When the vapor deposition material is vapor-deposited on the surface of the material to be treated, the vapor deposition material evaporated from the vapor deposition material container is guided to the other vapor deposition material container and enters the other vapor deposition material container. Mixing into the stored vapor deposition material is appropriately prevented.

In a vapor deposition apparatus according to an embodiment of the present invention, a vapor is emitted from a beam emitting device toward a vapor deposition material container guided to a beam irradiation position by a rotating support, and the vapor deposition material accommodated in the vapor deposition material container It is the schematic explanatory drawing which showed the state which irradiates a beam to evaporate vapor deposition material and vapor-deposits this vapor deposition material on the surface of a to-be-processed material. It is the disassembled perspective view which showed the adhesion preventing member, the vapor deposition material container, and the rotation support body in the vapor deposition apparatus in the said embodiment. In the vapor deposition apparatus according to the above-described embodiment, each holding member provided with a plurality of vapor deposition material containers in which a vapor deposition material is contained in a recess having an upper surface opened, is provided on the upper surface of the rotating support body in a circumferential direction with a required interval. It is the schematic perspective view which showed the state hold | maintained in the recessed part. In the vapor deposition apparatus according to the above-described embodiment, the vapor deposition material introduced into the beam irradiation position in a state where the vapor deposition material containing body containing the vapor deposition material is held in each holding recess provided in the circumferential direction of the rotating support. It is the schematic plan view which showed the state which has arrange | positioned the adhesion prevention member on the rotation support body so that the upper surface by which the container was opened was exposed through an opening part. In the vapor deposition apparatus according to the above-described embodiment, the deposition member is placed on the rotating support so that the upper surface of the deposition material container guided to the beam irradiation position is located above the upper surface of the opening of the deposition member. 2A shows a state in which the vapor deposition material accommodated in the recess of the vapor deposition material container is irradiated with a beam, (A) is a partial cross-sectional explanatory view in the radial direction, and (B) is a partial cross section in the circumferential direction. It is explanatory drawing. In the vapor deposition apparatus according to the above-described embodiment, another vapor deposition material is accommodated by rotating the rotation support holding the vapor deposition material container in a state where the adhesion preventing member disposed on the rotation support is lifted upward. It is the schematic perspective view which showed the state which guides a body to a beam irradiation position. In the vapor deposition apparatus in the embodiment, it is an exploded perspective view showing a state in which a separating convex portion and an annular convex portion are provided on a disk member that is detachably mounted on the rotating support. In the vapor deposition apparatus according to the above embodiment, a heat-resistant ring is attached to the lip of the opening of the adhesion-preventing member, and the upper surface of the heat-resistant ring is inclined downward from the inner peripheral side toward the outer peripheral side. It is partial sectional explanatory drawing shown.

  Hereinafter, a vapor deposition apparatus according to an embodiment of the present invention will be specifically described with reference to the accompanying drawings. In addition, the vapor deposition apparatus which concerns on this invention is not limited to what was shown to the following embodiment, In the range which does not change the summary of invention, it can change suitably and can implement.

  In the vapor deposition apparatus of this embodiment, as shown in FIG. 1, the rotating shaft 2 a of the rotating device 2 is introduced into the vacuum chamber 1 from the bottom of the vacuum chamber 1, and the center of the disk-shaped rotating support 10 is formed. The rotating support 10 is rotated around the rotating shaft 2a by holding the portion on the rotating shaft 2a. A sealing member 2 b is provided so that outside air does not enter the vacuum chamber 1 from a portion where the rotating shaft 2 a of the rotating device 2 is introduced into the vacuum chamber 1.

  Further, as shown in FIGS. 2 and 3, a plurality of (four in the example shown in the figure) holding recesses 11 are provided on the upper surface of the rotary support 10 with a required interval in the circumferential direction. In order to separate the holding recesses 11 and divide the upper surface of the rotary support 10 into four equal parts, the separation protrusions 12 having triangular protrusions are provided radially from the center, and on the outer periphery of the upper surface of the rotary support 10. An annular convex portion 13 protruding upward is provided.

  Then, as shown in FIG. 3, the respective vapor deposition material containers 3 in which the vapor deposition material T is accommodated in the concave portions whose upper surfaces are opened are held in the respective holding concave portions 11 provided on the upper surface of the rotary support 10. The upper surface of each vapor deposition material container 3 is positioned above the separating projection 12.

  Further, the planar circular deposition preventing member 20 provided with the opening 21 for exposing the vapor deposition material container 3 guided to the beam irradiation position is covered with the above-described upper surface of the other vapor deposition material container 3. It is arranged on the rotating support 10.

  In addition, the outer diameter of the anti-adhesion member 20 is slightly larger than that of the rotary support 10, and the side wall 20c extending downward along the outer periphery of the anti-adhesion member 20 The outer peripheral side of the rotary support 10 is covered.

  Further, projecting pieces 22 projecting in opposite directions from the outer periphery of the deposition preventing member 20 are provided at positions on both sides in the diameter direction of the deposition preventing member 20, and the projecting pieces 22 on both sides are vacuumed from the bottom of the vacuum chamber 1, respectively. The lifting / lowering rod 4a of the lifting / lowering device 4 introduced into the chamber 1 is held by the lifting / lowering rod 4a. A sealing member 4 b is provided so that outside air does not enter the vacuum chamber 1 from a portion where the lifting rod 4 a in the lifting device 4 is introduced into the vacuum chamber 1.

  Here, the said adhesion prevention member 20 is formed in the level | step difference shape which has the fan-shaped lower step part 20a provided with the said opening part 21, and the other upper step part 20b higher than this lower step part 20a. ing.

  In the vapor deposition apparatus of this embodiment, as shown in FIG. 1, a beam B such as a plasma beam is emitted from a beam emitting apparatus 5 such as a plasma gun provided on the side of the vacuum chamber 1, and the beam The vapor deposition material T accommodated in the recess of the vapor deposition material container 3 guided to the irradiation position is irradiated with the beam B to evaporate the vapor deposition material T, and the evaporated vapor deposition material T is disposed in the upper part of the vacuum chamber 1. Vapor deposition is performed on the surface of the processed material W.

  Here, in this embodiment, as shown in FIG. 6, after the elevating rod 4a provided in the elevating device 4 raises the adhesion-preventing member 20, the rotating device 2 rotates the rotating shaft. The rotating support body 10 holding the vapor deposition material container 3 around the center 2a is rotated, and the vapor deposition material container 3 containing the vapor deposition material T to be vapor-deposited on the workpiece W is guided to the beam irradiation position. The deposition preventing member 20 is lowered by the lifting rod 4 a provided in the lifting device 4.

  Then, the adhesion preventing member 20 is lowered in this way, and the opening 21 provided in the lower step portion 20a of the adhesion preventing member 20 as shown in FIGS. 1, 4 and 5A, 5B. The vapor deposition material container 3 guided to the beam irradiation position is introduced into the inside, and the upper surface of the vapor deposition material container 3 guided to the beam irradiation position is placed on the edge of the opening 21 provided in the adhesion preventing member 20. Projecting above the upper surface of the adhesion-preventing member 20, and two portions provided radially on the upper surface of the rotary support 10 so as to define a portion for holding the vapor deposition material container 3 guided to the beam irradiation position. The separation convex portion 12 is positioned below the lower surface of the fan-shaped lower step portion 20 a provided with the opening 21, and the gap between the lower surface of the lower step portion 20 a of the deposition preventing member 20 and the upper surface of the rotation support 10 is very narrow. It is trying to become.

  And in the state which made the upper surface of the vapor deposition material container 3 thus guided to the beam irradiation position protrude from the upper surface of the deposition preventing member 20 at the lip of the opening 21 provided in the deposition preventing member 20, As described above, the beam B is irradiated to the vapor deposition material T accommodated in the vapor deposition material container 3 to evaporate the vapor deposition material T accommodated in the vapor deposition material container 3.

  If it does in this way, the vapor deposition material T which evaporated from the upper surface opened of the vapor deposition material container 3 will flow into the lower surface side of the deposition preventing member 20 through between the vapor deposition material container 3 and the opening part 21 of the deposition preventing member 20. In addition, even if the evaporated vapor deposition material T flows into the lower surface side of the deposition preventing member 20, the rotation support is performed so as to partition the portion that holds the vapor deposition material container 3 guided to the beam irradiation position. The gap between the lower surface of the lower step portion 20a of the anti-adhesion member 20 and the upper surface of the rotary support 10 is very narrow due to the two separating projections 12 provided on the upper surface of the body 10. The vapor deposition material T flowing into the lower surface side of the member 20 is prevented from being guided to another vapor deposition material container 3 through the gap between the lower surface of the lower step portion 20a of the deposition preventing member 20 and the upper surface of the rotary support 10.

  As a result, in the vapor deposition apparatus of this embodiment, when the vapor deposition material T accommodated in the vapor deposition material container 3 guided to the beam irradiation position is evaporated and vapor deposited on the surface of the material W to be processed, The vapor deposition material T evaporated from the vapor deposition material container 3 is appropriately prevented from being introduced into the other vapor deposition material container 3 and mixed into the vapor deposition material T accommodated in the other vapor deposition material container 3. It becomes like this.

  Moreover, in the vapor deposition apparatus of this embodiment, since the said separation convex part 12 is a triangular protrusion, when raising and lowering the adhesion prevention member 20 as mentioned above, on this separation convex part 12 Even if the lump of the vapor deposition material T falls, the lump of the vapor deposition material T falls down on the rotary support 10 from the separation convex portion 12, and the lump of the vapor deposition material T falls on the separation convex portion 12 and the lower surface of the adhesion preventing member 20. It will not be caught between.

  In this embodiment, the separation convex portion 12 and the annular convex portion 13 are provided on the upper surface of the rotary support 10 itself. However, as shown in FIG. A disk member 30 to be mounted is used, and a mounting hole 31 to be mounted on the rotary support 10 is provided at the center of the disk member 30 and a through hole corresponding to the holding recess 11 in the rotary support 10 is provided. 32, and a separation convex portion 33 having a triangular projection radially from the central mounting hole 31 is provided on the upper surface of the disk member 30 and protrudes upward along the outer periphery of the upper surface of the disk member 30. An annular convex portion 34 may be provided. As described above, when the disk member 30 is detachably mounted on the upper surface of the rotary support 10, the vapor deposition material T flows into the lower surface side of the deposition preventing member 20, and the vapor deposition material T adheres to the disk member 30. However, the disk member 30 can be easily replaced by being detached from the upper surface of the rotary support 10.

  Further, in this embodiment, the upper surface of the vapor deposition material container 3 guided to the beam irradiation position as described above is arranged from the upper surface of the deposition preventing member 20 at the rim of the opening 21 provided in the deposition preventing member 20. The upper surface of the vapor deposition material container 3 guided to the beam irradiation position is positioned above the lower surface of the deposition preventing member 20 at the lip of the opening 21 provided in the deposition preventing member 20. Even in the case where the vapor deposition material T is evaporated, the vapor deposition material T evaporated from the opened upper surface of the vapor deposition material container 3 passes between the vapor deposition material container 3 and the opening 21 of the adhesion preventing member 20 and the lower surface of the adhesion preventing member 20. Inflow to the side is suppressed.

  Further, in the vapor deposition apparatus of the above embodiment, as shown in FIG. 8, a heat-resistant ring 23 is attached to the rim of the opening 21 of the deposition preventing member 20, and the upper surface of the heat-resistant ring 23 is set on the inner peripheral side. When it is made to incline downward toward the outer peripheral side, the edge of the opening 21 of the deposition preventing member 20 is prevented from being deformed by heat by the heat-resistant ring 23 and attached to the edge of the opening 21. Even if the vapor deposition material T is peeled off when the adhesion preventing member 20 is moved up and down, the vapor deposition material T is formed on the adhesion preventing member 20 along the surface inclined downward toward the outer peripheral side of the upper surface portion of the heat-resistant ring 23. As a result, it is prevented from falling on the rotary support 10 or in the other vapor deposition material container 3.

  Furthermore, in the vapor deposition apparatus of the above-described embodiment, the vapor deposition material T is irradiated with the beam B from the beam emitting device 5 to heat the vapor deposition material T. However, heating means such as an electric heater (not shown) It is also possible to heat the vapor deposition material T by providing.

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Rotating device, 2a Rotating shaft, 2b Sealing member 3 Vapor deposition material container 4 Lifting device, 4a Lifting rod, 4b Sealing member 5 Beam emitting device 10 Rotating support 11 Holding recessed part 12 Separation convex part 13 Annular convex part 20 Deposition member, 20a Lower step portion, 20b Upper step portion, 20c Side wall portion 21 Opening portion 22 Projection piece 23 Heat-resistant ring 30 Disc member 31 Mounting hole portion 32 Through hole 33 Separation convex portion 34 Annular convex portion B Beam T Deposition material W Covered Treatment material

Claims (6)

A plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess whose upper surface is opened are provided in a circumferential direction on a rotatable rotary support, and the specific vapor deposition material container is heated by the rotary support. In the vapor deposition apparatus for heating the vapor deposition material accommodated in the recess of the vapor deposition material container and evaporating the vapor deposition material through the opening to deposit on the surface of the material to be treated, the heating position is set at the heating position. A deposition member provided with an opening for exposing the led deposition material container is placed on the rotating support so as to cover the upper surface of the other deposition material container, and the deposition led to the heating position The upper surface where the material container is opened is positioned above the lower surface of the adhesion preventing member at the lip of the opening , and the adhesion preventing member is formed in a step shape having a lower step portion and an upper step portion. The vapor deposition material container guided to the heating position. The opening that issued evaporation apparatus is characterized by providing in the lower portion of the deposition-inhibitory member. A plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess whose upper surface is opened are provided in a circumferential direction on a rotatable rotary support, and the specific vapor deposition material container is heated by the rotary support. In the vapor deposition apparatus for heating the vapor deposition material accommodated in the recess of the vapor deposition material container and evaporating the vapor deposition material through the opening to deposit on the surface of the material to be treated, the heating position is set at the heating position. A deposition member provided with an opening for exposing the led deposition material container is placed on the rotating support so as to cover the upper surface of the other deposition material container, and the deposition led to the heating position Other vapor deposition adjacent to the vapor deposition material container guided to the heating position such that the opened upper surface of the material container is positioned above the lower surface of the deposition preventing member at the lip of the opening. Separation projections that separate the material container Vapor deposition apparatus characterized in that provided between the rotary support and the adhesion-preventing member. A plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess whose upper surface is opened are provided in a circumferential direction on a rotatable rotary support, and the specific vapor deposition material container is heated by the rotary support. In the vapor deposition apparatus for heating the vapor deposition material accommodated in the recess of the vapor deposition material container and evaporating the vapor deposition material through the opening to deposit on the surface of the material to be treated, the heating position is set at the heating position. A deposition member provided with an opening for exposing the led deposition material container is placed on the rotating support so as to cover the upper surface of the other deposition material container, and the deposition led to the heating position The upper surface where the material container is opened is positioned above the lower surface of the adhesion preventing member at the opening edge of the opening, and a heat resistant ring is attached to the opening edge of the adhesion preventing member, The top surface of this heat-resistant ring Deposition apparatus characterized by tilted downward toward the outer peripheral side.   The vapor deposition apparatus according to any one of claims 1 to 3, further comprising an elevating device that moves up and down at least one of the adhesion-preventing member and the rotating support.   5. The vapor deposition apparatus according to claim 4, wherein the deposition member is moved up and down by the lifting device, and the bottom surface of the opening edge of the deposition member is made up of the deposition material by the lifting device. The vapor deposition apparatus, wherein the rotary support is rotated in a state where it is raised to a position where it does not collide with the upper surface of the container. 6. The vapor deposition apparatus according to claim 1 , wherein the vapor deposition material is irradiated with a beam when heating the vapor deposition material accommodated in the vapor deposition material container. .

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