JP5852244B2 - Substrate pasting apparatus and substrate pasting method - Google Patents

Description

  The present invention relates to a substrate bonding apparatus for bonding a pair of substrates.

  2. Description of the Related Art Electronic devices such as smartphones and PDAs (personal digital assistants) are often provided with a touch panel that enables a user to perform a gesture operation by touching a display with a finger or a pen.

  Such an electronic device is configured by covering a display disposed on a housing surface with a laminated substrate body in which a touch panel sheet and a cover panel are laminated.

  As an example, the method of manufacturing the laminated substrate body applies an adhesive to the surface of the touch panel sheet placed on the placement surface of the substrate bonding apparatus, and presses and bonds the adhesive to the cover panel held upward.

JP 2011-150331 A

  In many cases, physical buttons for device operation have been provided on the side of the casing of electronic devices, but in recent years, a highly flexible organic EL display has been used not only on the surface of the casing but also on the side of the casing. In addition, it has been proposed that a display is extended to enable gesture operation using a touch panel even on a side surface portion.

  Therefore, the laminated substrate body also needs to be configured to be bent and bent at both ends to form a concave shape so as to cover the display from the surface to the side surface.

  In order to manufacture a concave laminated substrate body, first, both ends of a glass or resin substrate serving as a cover panel are bent or bent to form a concave shape. Next, it is necessary to perform a lamination process so that the flexible touch panel sheet adheres along the concave surface of the cover panel.

  As a method for the lamination process, for example, the mounting surface of the substrate bonding apparatus is a convex surface that fits into the concave surface of the cover panel, and the touch panel sheet coated with the adhesive is bent and held along the convex surface. And it pushes into the concave surface of a cover panel, and joins both.

  However, in the case of such a manufacturing method, when the touch panel sheet is pushed into the concave surface of the cover panel, the touch panel sheet coated with an adhesive is pushed into the curved or bent rising portions at both ends of the cover panel while being rubbed in surface contact. Will be.

  Due to this surface contact, the adhesive may be scraped off, and the cover panel and the touch panel sheet may not be appropriately joined, or a part of the adhesive may protrude to the outside and cause a product defect.

  In addition, there may be a manufacturing error in the degree of bending or the degree of bending of the bent or bent rising portion at both ends of the cover panel. In this case, the shape of the convex surface which fits the mounting surface of the board | substrate bonding apparatus to the concave surface of a cover panel may not correspond, and it may be difficult to stick both.

  The present invention has been proposed to solve the above-described problems. That is, an object of this invention is to provide the board | substrate bonding apparatus which can bond the concave board | substrate which has a concave surface, and the thin board | substrate which has flexibility with an adhesive agent accurately.

  The present invention is a substrate bonding apparatus for bonding a concave substrate having a concave surface and a flexible thin substrate via an adhesive, and the thin substrate is attached to the concave surface of the concave substrate. A pressing unit that presses the pressing unit, the pressing unit pressing the thin substrate against the concave surface of the concave substrate; and the thin substrate that is positioned on the side of the pressing unit with respect to the concave substrate by the pressing unit. And a displacement portion that fits within the concave surface of the concave substrate and displaces the thin substrate so as to follow the concave surface.

The pressing portion is a center block, the displacement portion is a separation block that can approach and separate from the center block, and the pressing means until the center block and the separation block contract smaller than the concave surface, The separation block is brought close to the central block, enters the concave surface together with the thin substrate, and the separation block is moved in the concave surface toward the side portion of the concave substrate, thereby reducing the thin substrate. You may make it expand according to the said concave surface.

The separation block may have a pressing curved surface substantially in the same shape as the concave portion of the side portion of the concave substrate on the side portion side.

    At least a part of the displacement part may be constituted by an elastic member.

  The pressing means further includes guide means for pre-bending the thin substrate following the overall shape when the separation block is moved to the central block, and the separation block is formed into the concave substrate after the bending. You may make it move to the said side part direction.

  The guide means may include a claw portion that preliminarily bends the thin substrate by applying an external force by being hooked on the side edge surface of the thin substrate.

The separation block is located at a position closer to the central block from a position outside the position where the side of the concave substrate abuts on the side of the thin substrate during the bending by the claw portion. You may make it move.

  The claw portion may move along the outer shape of the separation block through the side edge surface of the thin substrate not receiving external force.

  The claw portion includes a side edge of the thin substrate that is not subjected to an external force, and a side edge of the thin substrate after being bent along the outer shape of the separation block close to the center block. You may make it move on the straight line which passes.

  You may make it further provide the attraction | suction means which makes the said separation block adsorb | suck the said thin substrate bent according to the whole shape of the said center block and the said separation block.

  A curing unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate before and after the thin substrate is bonded to the concave substrate; You may make it prepare.

Curing in which the adhesive applied to at least one of the concave substrate and the thin substrate is temporarily cured at least before bonding of the side portions of the concave substrate and after bonding of the side portions. A processing unit may be provided.

  The pressing means includes a support portion that supports the displacement portion, and the displacement portion is displaced toward the side portion of the concave substrate while bringing the other end into contact with the thin substrate, The thin substrate may be pressure-bonded following the concave surface, and the support portion may support the other end of the displacement portion as a displacement fulcrum.

  One end of the displacement portion may be provided with a variable distance from the fulcrum so as to maintain the pressure bonding of the thin substrate to the concave substrate.

  In addition, what caught the above aspects as a method is also 1 aspect of this invention.

  According to the present invention, when the thin substrate is pushed into the concave space of the concave substrate, the thin substrate and the side portion of the concave substrate are not brought into surface contact and rubbed. Therefore, erroneous locations are bonded to each other, and generation of wrinkles of the thin substrate and generation of non-contacted portions between the thin substrate and the concave substrate can be suppressed. In addition, since the thin substrate is not pushed in while grinding the side part of the concave substrate with the surface, the outflow of the adhesive is prevented, the adhesive force is decreased, the design property is decreased, and the adhesive is interposed. A short circuit or the like can be prevented.

It is a schematic diagram which shows the various board | substrates after bonding. It is a block diagram of the board | substrate bonding apparatus which concerns on 1st Embodiment. It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 1st Embodiment is provided. It is an enlarged view which shows the side part of a concave board | substrate concerning 2nd Embodiment. It is a figure which shows the press aspect of the separation block of the board | substrate bonding apparatus which concerns on 2nd Embodiment. It is a perspective view of the press mechanism which concerns on 3rd Embodiment. It is a state transition diagram which shows the motion of the press curved surface vicinity which concerns on 3rd Embodiment. It is a state transition diagram showing operation of a claw part concerning a 4th embodiment. It is an enlarged view of the isolation | separation block of the board | substrate bonding apparatus which concerns on 5th Embodiment. It is an enlarged view of the isolation | separation block of the board | substrate bonding apparatus which concerns on 6th Embodiment. It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 7th Embodiment is provided. It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 7th Embodiment. It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 8th Embodiment is provided. It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 8th Embodiment. It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 9th Embodiment is provided. It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 9th Embodiment. It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 10th Embodiment. It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 11th Embodiment. It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 12th Embodiment is provided. It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 12th Embodiment is provided. It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on other embodiment.

  Hereinafter, an embodiment of a substrate bonding apparatus according to the present invention will be described in detail with reference to the drawings.

(substrate)
The board | substrate bonded together by the board | substrate bonding apparatus of this invention is demonstrated previously. FIG. 1 is a schematic view showing cross sections of various substrates after bonding. The board | substrate bonding apparatus 1 of this invention bonds the thin board | substrate 21 along the concave surface 20a of the concave board | substrate 20 using the adhesive agent R. FIG.

  The thin substrate 21 is a touch panel, a decorative film, or various films such as an organic EL display and a liquid crystal display. On the other hand, the concave substrate 20 is a protective panel made of glass or acrylic for protecting the thin substrate 21. For example, for the purpose of protecting the thin substrate 21, the entire surface of the thin substrate 21 is adhered to the concave substrate 20 with the adhesive R so that the entire surface of the thin substrate 21 is covered with the concave substrate 20.

  The thin substrate 21 is a flexible thin substrate. In order for the thin substrate 21 to be affixed to the concave surface 20a of the concave substrate 20, it is sufficient if the thin substrate 21 is flexible enough to bend and deform along the concave surface 20a.

  The concave substrate 20 is a substrate having a concave surface 20a. The concave surface 20a is formed such that at least the side portion 20b of the concave substrate 20 rises from the curved portion or the bent portion. That is, the concave substrate 20 has a concave surface 20a formed on the substrate surface by bending or bending.

  The central region other than the side part 20b of the concave substrate 20 may be flat or may be continuously curved with the side part 20b. The concave substrate 20 may be warped as a whole, or the back surface opposite to the concave surface 20a may have a shape unrelated to the concave surface 20a, for example, a flat surface. In addition, a pair of opposing side portions 20b may rise, any one of the side portions 20b may rise, or three side portions 20b may rise. Two sets of side portions 20b facing each other so as to surround the center from four sides may rise.

  Specifically, as shown in FIG. 1A, the concave substrate 20 has a substantially tile shape or a substantially arc-shaped cross section, and as shown in FIG. 1B, the side portion 20b is bent at a right angle. In addition, as shown in (c), the side portion 20b includes a substantially U shape in which the side portion 20b rises from the curved portion.

  Hereinafter, when it is simply referred to as the side portion 20b, it refers to the side portion 20b that rises to form the concave surface 20a. A space surrounded by the flat surface including both ends of the side portion 20b and the concave surface 20a is referred to as a concave space 20c defined by the concave surface 20a.

  The adhesive R is not particularly limited as long as it accepts and cures external energy. For example, a thermosetting resin, a photocurable resin, a radiation curable resin, and other various resins that are cured by receiving electromagnetic waves. Or a resin that hardens upon drying.

(First embodiment)
The board | substrate bonding apparatus 1 which concerns on 1st Embodiment is demonstrated with reference to drawings. FIG. 2 is a configuration diagram of the substrate bonding apparatus 1 according to the first embodiment. Drawing 3 is a lineblock diagram of press mechanism 4 (pressing means) with which substrate pasting device 1 concerning a 1st embodiment is provided.

(Constitution)
As shown in FIG. 2, this board | substrate bonding apparatus 1 makes the holding | maintenance part 3 and the press mechanism 4 (pressing means) oppose in the vacuum chamber 9 connected to the vacuum source which is not shown in figure. The holding part 3 and the pressing mechanism 4 can be relatively approached. For example, both or one of the holding unit 3 and the pressing mechanism 4 has an actuator that moves so as to approach or separate from the other party.

  The holding unit 3 holds the concave substrate 20 by an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesive chuck, or other various chuck mechanisms. The pressing mechanism 4 pushes the thin substrate 21 into the concave space 20c while holding the thin substrate 21 by any of the same various chuck mechanisms, and the thin substrate 21 follows the concave surface 20a of the concave substrate 20. It is expanded to the concave surface 20a while being bent and deformed.

  As shown in FIG. 3, the pressing mechanism 4 can be continuously deformed into two types. As shown in FIG. 3A, the first form of the pressing mechanism 4 is a reduced body that is shrunk smaller than the concave space 20c defined by the concave surface 20a. The 2nd form of the press mechanism 4 is the expansion body expanded according to the concave surface 20a, as shown to (c) of FIG.

  Since the pressing mechanism 4 takes the form of a contracting body, the pressing mechanism 4 does not come into contact with the concave surface 20a, so that the thin substrate 21 is rolled into the concave surface space 20c, and in the process of shifting to the expanding body, The substrate 21 is expanded while being bent and deformed so as to follow the concave surface 20a from the center of the substrate, and the entire surface of the thin substrate 21 is brought into close contact with the concave substrate 20 via the adhesive R.

  The pressing mechanism 4 includes a center block 41 and a separation block 42. The separation block 42 is arranged beside the central block 41 so as to face the side portion 20b of the concave substrate 20. In the case where only one side of the four sides of the concave substrate 20 is the rising side part 20b, a single separation block 42 is disposed so as to face the side part 20b, and two opposing sides of the four sides are arranged. In the case of the side part 20b where the side has risen, the separation blocks 42 are arranged on both sides of the central block 41 so as to face the side part 20b, and the side part 20b where all four sides have risen. In some cases, a total of four separation blocks 42 are arranged on four sides of the central block 41.

  The central block 41 presses the central region of the thin substrate 21 against the central region of the concave substrate 20. That is, the central block 41 is a substantially rectangular parallelepiped having an upper surface that follows the surface shape of the central region of the concave surface 20a. If the center area | region of the concave surface 20a is curving, a substantially rectangular parallelepiped has the upper surface raised according to it, and if the center area | region of the concave surface 20a is flat, the upper surface will be flat according to it.

  The separation block 42 pushes and expands the thin substrate 21 following the concave surface 20a of the concave substrate 20. Further, the separation block 42 extends to the side portion 20b of the concave substrate 20 and closely contacts the thin substrate 21 without a gap. Therefore, the separation block 42 is generally a rectangular parallelepiped as a whole, but the pressing curved surface 42a facing the side portion 20b of the concave substrate 20 is substantially the same corresponding to the curved or bent surface shape of the side portion 20b. It has become. For example, when the side portion 20b is raised by the curved portion, the pressing curved surface 42a has a rounded curvature considering the curvature of the curved portion, the thickness of the thin substrate 21, and the thickness of the applied adhesive R. .

  Furthermore, the central block 41 is immovable with respect to the side portion 20b direction of the concave substrate 20, and can move only in the direction toward the concave substrate 20. On the other hand, the separation block 42 is movable not only in the direction toward the concave substrate 20 but also away from the central block 41. Specifically, as shown in FIGS. 3A and 3B, the first position A approaching the central block 41 and the side of the concave substrate 20 as shown in FIG. It moves horizontally between the second position B that abuts the part 20b via the thin substrate 21.

  When the separation block 42 is present at the first position A, the entire opposing region of the center block 41 and the separation block 42 is contracted smaller than the concave space 20c of the concave substrate 20 to form a reduced body. The overall facing region is a region where the region facing the concave surface 20a of the central block 41 and the region facing the concave surface 20a of the separation block 42 are inscribed. That is, the sum of the widths of the separation blocks 42 on both sides and the width of the center block 41 is smaller than the concave surface width of the concave substrate 20.

  Further, when the separation block 42 is present at the second position B, the entire opposing region formed by the center block 41 and the separation block 42 is expanded along the concave surface 20a of the concave substrate 20, Become. That is, the separation block 42 moves from the first position A to the second position B by the amount obtained by subtracting the sum of the width of the separation block 42 on both sides and the width of the center block 41 from the concave surface width of the concave substrate 20. To do.

(Function)
As shown in FIG. 3A, the substrate bonding apparatus 1 first moves the separation block 42 to the central block 41 by moving it to the first position A as shown in FIG. That is, in the first step, the separation block 42 and the central block 41 are deformed into a reduced body shape.

  Then, the concave substrate 20 is installed in the holding unit 3, and the thin substrate 21 is placed on the upper surfaces of the center block 41 and the separation blocks 42 on both sides. At this time, the concave substrate 20 and the thin substrate 21 face each other in the vacuum chamber 9. The concave substrate 20 is installed so that the concave surface 20 a faces the thin substrate 21. The adhesive R is applied to the opposing surfaces of the concave substrate 20, the thin substrate 21, or both.

  Next, as a second step, as shown in FIG. 3B, the holding unit 3 and the contracted body are relatively moved closer to each other. When the reduced body enters the concave space 20c, the thin substrate 21 is also pushed into the concave space 20c. At this time, the reduced body is smaller than the concave space 20c. Accordingly, the thin substrate 21 and the side portion 20b of the concave substrate 20 do not make surface contact, although the possibility of point contact remains. Since there is no surface contact, the thin substrate 21 is not pushed in while rubbing the side portion 20b of the concave substrate 20 with the surface.

  The relative approach of the holding unit 3 and the contraction body is continued until the central region of the thin substrate 21 is pressed against the central region of the concave substrate 20. For example, the pressing can be detected by installing a torque sensor or the like on the actuator.

  As a third step, the separation block 42 is moved to the second position B so as to be separated from the center block 41 as shown in FIG. If it does so, the whole opposing area | region which the center block 41 and the isolation | separation block 42 form will expand until it follows the concave surface 20a of the concave substrate 20, and will correspond to the concave surface shape and magnitude | size of the concave substrate 20. FIG. Actually, the size is slightly smaller because the thin substrate 21 and the adhesive R are interposed.

  At this time, the thin substrate 21 is expanded along the concave surface 20a of the concave substrate 20 from the central region toward the end as the separation block 42 moves horizontally. The separation block 42 has an outer shape in which the pressing curved surface 42a matches the surface shape of the side portion 20b. Therefore, the thin substrate 21 and the concave substrate 20 are in close contact with each other. In addition, since the contact is made in order from the center toward the end, no space is generated between the concave substrate 20 and the thin substrate 21.

(effect)
As described above, the pressing mechanism 4 included in the substrate bonding apparatus 1 according to the present embodiment includes the center block 41 and the separation block 42. The separation block 42 is located beside the central block 41 and can approach and separate from the central block 41. Then, until the shape of the central block 41 and the separation block 42 is smaller than the concave space 20 c of the concave substrate 20, the separation block 42 is brought close to the central block 41 and enters the concave space 20 c together with the thin substrate 21. Next, the separation block 42 is moved in the concave space 20c in the direction of the side portion 20b where the concave substrate 20 rises, so that the thin substrate 21 is expanded following the concave surface 20a.

  According to the pressing mechanism 4, when the thin substrate 21 is pushed into the concave space 20 c of the concave substrate 20, the thin substrate 21 and the side portion 20 b of the concave substrate 20 are not in surface contact and rubbed. For this reason, erroneous portions are bonded to each other, and generation of wrinkles of the thin substrate 21 and generation of a non-contact portion between the thin substrate 21 and the concave substrate 20 can be suppressed. In addition, since the thin substrate 21 is not pushed in while rubbing the side 20b of the concave substrate 20 with the surface, the outflow of the adhesive R is prevented, the adhesive strength is decreased, the design property is decreased, and the adhesive is bonded. A short circuit or the like via the agent R can be prevented.

  The thin substrate 21 is pressed against the concave surface 20a of the concave substrate 20 from the central region toward the end as the separation block 42 moves horizontally. Therefore, it is possible to further suppress the occurrence of wrinkles on the thin substrate 21 and the occurrence of a non-contact portion between the thin substrate 21 and the concave substrate 20.

  Further, the separation block 42 has a pressing curved surface 42a having substantially the same shape as that of the concave surface 20a of the side portion 20b on which the concave substrate 20 rises, on the side portion 20b side. Therefore, the thin substrate 21 can be adhered to the concave substrate 20 in the entire region. Therefore, even when the thin substrate 21 is bonded to the concave substrate 20, a high-quality bonded product can be manufactured.

(Second Embodiment)
(Constitution)
FIG. 4 is an enlarged view showing the side part 20 b of the concave substrate 20. As shown in FIG. 4, manufacturing errors may occur in the side portion 20b of the concave substrate 20 in the degree of bending or the degree of bending. In this case, the shape of the pressing curved surface 42 a of the separation block 42 and the side part 20 b of the concave substrate 20 may not match, and the thin substrate 21 may be difficult to adhere to the concave surface 20 a of the concave substrate 20.

  Then, the board | substrate bonding apparatus 1 which concerns on 2nd Embodiment is provided with the isolation | separation block 42 which consists of an elastic member, as shown in FIG. The portion made of the elastic member may be only the pressing curved surface 42a that is in close contact with the side portion 20b of the concave substrate 20, or all may be an elastic member for easy manufacture of the separation block 42.

  The elastic member is a member that is elastically deformed when pressed and has substantially the same shape as the side portion 20b, and returns to its original shape when the pressure is released, and is a natural rubber sheet or block having elasticity, polybutadiene, nitrile And a synthetic rubber sheet or block such as chloroprene, a sheet or block made of fiber such as polyurethane, and a brush bundled with fibers. The same applies to the elastic member described later.

(Function and effect)
FIG. 5 is a diagram illustrating a pressing mode of the separation block 42 when at least the pressing curved surface 42a is formed of an elastic member. As shown in FIGS. 5A and 5B, even if an error occurs in the shape of the side portion 20b of the concave substrate 20, the pressing curved surface 42a of the side portion 20b absorbs the error. Deforms following the shape. Therefore, the entire area of the thin substrate 21 can be pressed against the concave substrate 20, and the thin substrate 21 is bent and deformed following the concave surface 20 a with high accuracy, so that the thin substrate 21 and the concave substrate 20 are closely attached.

  Therefore, even if a manufacturing error exists in the concave substrate 20, a high-quality bonded product can be manufactured.

(Third embodiment)
FIG. 6 is a perspective view of the pressing mechanism 4 in the substrate bonding apparatus 1 according to the third embodiment. In addition, the same code | symbol is attached | subjected about the same structure and 1st Embodiment as 1st Embodiment, and detailed description is abbreviate | omitted.

(Constitution)
The board | substrate bonding apparatus 1 which concerns on 3rd Embodiment is bending the thin board | substrate 21 before pushing the thin board | substrate 21 into the concave surface space 20c of the concave board | substrate 20, and makes the isolation | separation block 42 into the center block 41. Wrap it around the contracted body. In this board | substrate bonding apparatus 1, the center block 41 and the isolation | separation block 42 are extended and extended in the same direction on the same stage 44, as shown in FIG. The center block 41 is fixed to the stage 44.

  A rail 45 is laid on the stage 44. The separation block 42 is fixed to a slide base 46 that slides on the rail 45. The rail 45 extends in a direction crossing the long side of the separation block 42. That is, by sliding on the rail 45, the center block 41 is brought into contact with and separated from the center block 41, and the center block 41 and the separation block 42 are in the form of a contraction body and an expansion body.

  The driving means for moving the separation block 42 is a rotating machine 47a such as a servo motor or a stepping motor, and a ball screw 47b connected to the rotating machine 47a. The ball screw 47b extends in parallel with the rail 45, and each slide base 46 on which each separation block 42 is mounted is fitted to the ball screw 47b. Screw grooves corresponding to the slide bases 46 are formed in opposite directions.

  According to this ball screw 47b, when the screw shaft is rotated in one direction, the slide bases 46 move in opposite directions. That is, the separation blocks 42 on both sides move in a direction approaching or separating from the center block 41, respectively.

  The detailed configuration of the pressing mechanism 4 so far is the same as that of the substrate bonding apparatus 1 according to the first embodiment. In the third embodiment, a claw portion 5 is further provided outside each separation block 42. The tab 5 is guide means for bending the thin substrate 21 in advance in accordance with the shapes of the central block 41 and the separation block 42 when the separation block 42 is at the first position A.

  The claw portion 5 has a plate shape having substantially the same length as the separation block 42 and is attached along the separation block 42. The claw portion 5 has flanges 5 a bent toward the center of both ends of the separation block 42 at both ends, and is pivotally supported by the flange 5 a on a rotation shaft 48 penetrating the shaft of the separation block 42. The rotating shaft 48 is connected to a rotating machine 49 such as a servo motor or a stepping motor. Each rotating shaft 48 and each rotating machine 49 are fixed to each slide base 46, and this claw portion 5 is movable along the pressing curved surface 42 a of the separation block 42.

(Function)
The operation of the substrate bonding apparatus 1 will be described with reference to FIG. FIG. 7 is a state transition diagram illustrating the movement in the vicinity of the pressing curved surface 42a in the substrate bonding apparatus 1 according to the third embodiment.

  First, the separation block 42 is moved to the third position C as shown in FIG. The third position C is further outward than the second position B, and when the flat thin substrate 21 not receiving external force is placed on the upper surface of the pressing mechanism 4, The position is such that it is slightly applied to the pressing curved surface 42a.

  Then, with the separation block 42 moved to the third position C, the thin substrate 21 that has not been subjected to external force is placed on the upper surface of the pressing mechanism 4, and as shown in FIG. The part 5 is moved above the separation block 42 and hooked on the side end face of the thin substrate 21. That is, the extent that the end of the thin substrate 21 protrudes slightly to the pressing curved surface 42a is such that the claw portion 5 can be caught by the side end surface of the thin substrate 21 and exert an external force. At this time, it is preferable that the adhesive R is applied to the inside slightly from the outer edge of the thin substrate 21 and the claw portion 5 is not in contact.

  When the claw portion 5 is hooked, the claw portion 5 is rotated downward along the pressing curved surface 42a while pulling back (retracting) the separation block 42 to the first position A as shown in FIG. 7C. I will let you. Since the nail | claw part 5 and the isolation | separation block 42 have the fixed relationship with the same slide stand 46, the distance of the nail | claw part 5 and the press curved surface 42a does not change. At this time, each time the separation block 42 is retracted, the thin substrate 21 is loosely bent. And the thin board | substrate 21 is wound around the press curved surface 42a of the separation block 42 so that the looseness may be corrected whenever the nail | claw part 5 rotates.

  When the separation block 42 continues to move backward and the claw 5 rotates, and the separation block 42 reaches the first position A, the thin substrate 21 follows the upper surface of the reduction body as shown in FIG. It is wrapped around. In a state where the thin substrate 21 is wound around the upper surface of the reduced body, the shape and size of the thin substrate 21 are smaller than the concave surface 20a of the concave substrate 20.

  Therefore, as shown in FIG. 7E, even if the thin substrate 21 is pushed into the concave space 20c, the side portion 20b of the concave substrate 20 and the thin substrate 21 do not come into contact with each other. The pushing of the thin substrate 21 into the concave space 20 c is continued until the central region of the thin substrate 21 is pressed against the central region of the concave substrate 20.

  When the pushing of the thin substrate 21 into the concave space 20c is completed, the separation block 42 is moved to the second position B while the claw portion 5 is maintained at the rotation end position, as shown in FIG. Then, as shown in FIG. 7G, the entire thin substrate 21 is brought into close contact with the concave substrate 20. Thus, the thin substrate 21 and the side portion 20b of the concave substrate 20 come into contact for the first time when the separation block 42 moves to the second position B.

  The claw portion 5 is engaged with the thin substrate 21 until the thin substrate 21 and the side portion 20b of the concave substrate 20 are in close contact with each other, or as shown in FIG. It is desirable to continue.

(effect)
As described above, the pressing mechanism 4 further includes guide means for bending the thin substrate 21 in advance according to the shape of the center block 41 and the separation block 42 when the separation block 42 is at the first position A. Then, the driving means moves the separation block 42 to the second position B after the bending.

  Accordingly, since the thin substrate 21 is smaller than the concave space 20c of the concave substrate 20, when the thin substrate 21 is pushed into the concave space 20c of the concave substrate 20, the thin substrate 21 and the concave substrate 20 side The side part 20b does not come into contact. Therefore, even if compared with the first embodiment, wrinkle generation of the thin substrate 21 due to sticking of the wrong place with the adhesive R, non-adherence between the thin substrate 21 and the concave substrate 20 The occurrence of the location can be further suppressed.

  Further, since the thin substrate 21 is not pushed in while rubbing the side 20b of the concave substrate 20 with the surface, it further prevents the adhesive R from flowing out to the outside, lowering the adhesive force, lowering the design, A short circuit or the like via the adhesive R can be further prevented.

  In addition, the guide means is a claw portion 5 that bends and shapes the thin substrate 21 in advance by being hooked on the side edge of the thin substrate 21 and applying an external force. Therefore, even when the adhesive R is applied to the thin substrate 21, contact with the application surface of the adhesive R for bending can be minimized, and the adhesive force before bonding And the occurrence of unevenness of the adhesive R can be suppressed.

  Further, the driving means moves the separation block 42 from the third position C outside the second position B to the first position A through the second position B during the bending by the claw portion 5. I moved it. As a result, the thin substrate 21 is wound around the pressing curved surface 42a of the separation block 42 so as to correct the bending by the claw portion 5 each time it is gently bent.

  Therefore, even when only the side edge surface of the thin substrate 21 is gripped by the tab 5, the thin substrate 21 is greatly bent in the wrong direction during bending or loosely wound around the separation block 42. Can be easily bent and formed. Therefore, the thin substrate 21 can be accurately made smaller than the concave space 20c, and the thin substrate 21 can be brought into close contact with the concave surface 20a of the concave substrate 20 at the time of expansion by the separation block 42, Product quality is improved.

(Fourth embodiment)
FIG. 8 is a state transition diagram illustrating the operation of the claw portion 5 in the substrate bonding apparatus 1 according to the fourth embodiment. As shown in FIG. 8, the claw portion 5 may be moved along the outer shape of the separation block 42, or may be moved linearly while hooking the side edge surface of the thin substrate 21.

  That is, as shown in FIGS. 8A and 8B, the claw portion 5 according to the fourth embodiment is separated from the side edge of the thin substrate 21 that is not subjected to external force and at the first position A. It moves on a straight line passing through the side edge of the thin substrate 21 after being bent along the outer shape of the block 42.

  Even in the case where the adhesive R is applied to the thin substrate 21 in order to grasp only the side end surface of the thin substrate 21 by such a movement mode of the claw portion 5, Contact with the adhesive application surface can be minimized, and a decrease in adhesive strength before bonding and occurrence of unevenness in the adhesive R can be suppressed.

(Fifth embodiment)
(Constitution)
FIG. 9 is an enlarged view of the separation block 42 of the substrate bonding apparatus 1 according to the fifth embodiment. The separation block 42 includes a curing processing unit 42b that radiates energy for curing the adhesive R.

  The curing processing unit 42b prevents dripping of the adhesive R, prevents unevenness of the adhesive R caused by contact between the thin substrate 21 and the concave substrate 20, or maintains the shape of the thin substrate 21 bonded in a bent shape. The adhesive R applied to the thin substrate 21 is temporarily cured. Temporary curing is a state in which a completely cured state is not reached.

  In order to maintain the shape of the bent thin substrate 21, the curing processing unit 42b is accommodated in the separation block 42 and radiates energy toward the pressing curved surface 42a. The curing processing unit 42b is an infrared lamp if the adhesive R is a thermosetting resin, and a UV lamp if the adhesive R is an ultraviolet curable resin.

  In order to bring the adhesive R into a temporarily cured state, it is only necessary to emit an amount of energy that does not reach the adhesive R completely. Moreover, if it is an ultraviolet curable resin, it can be made into a temporary hardening state by the oxygen inhibitory effect | action of hardening, even if it does not carry out strict radiation energy management in oxygen-containing atmospheres, such as air | atmosphere. In this case, only the inside of the adhesive R is cured, and the viscosity of the surface is maintained, so that it is possible to ensure adhesiveness while suppressing unwanted flow of the adhesive R.

(Function)
As shown in FIG. 9, the adhesive R is applied to the thin substrate 21 in advance, and the thin substrate 21 is bent so as to be wound around the center block 41 and the separation block 42. Thereafter, before the thin substrate 21 is pressed against the concave substrate 20, the adhesive R is temporarily cured by the curing processing unit 42b. In particular, the adhesive R applied to the area facing the pressing curved surface 42a, that is, the adhesive having a large curved surface, where the applied adhesive R tends to flow and collect on the edge of the thin substrate 21. R is temporarily cured.

  The thin substrate 21 is pushed into the concave space 20c of the concave substrate 20 while maintaining the state of being bent and shaped following the shapes of the center block 41 and the separation block 42 by temporary curing, and the separation block 42 is moved to the second block. By moving to the position B, the thin substrate 21 is gradually stretched along the concave surface 20a.

(effect)
As described above, in the substrate bonding apparatus 1 according to the fifth embodiment, the center block 41 is further provided with the curing processing unit 42 b that temporarily cures the adhesive R applied to the side portion of the thin substrate 21. In addition, the thin substrate 21 formed by bending following the shape of the separation block 42 is temporarily cured.

  Thus, the flow of the adhesive R can be suppressed before the entire area of the thin substrate 21 is brought into close contact with the concave substrate 20 using the separation block 42. For this reason, erroneous portions are bonded to each other, and generation of wrinkles of the thin substrate 21 and generation of a non-contact portion between the thin substrate 21 and the concave substrate 20 can be suppressed.

  In addition, since the adhesive R does not move to the edge of the thin substrate 21 before being adhered, the protrusion after adhesion, unevenness of the adhesion thickness, lowering of the adhesive force, lowering of the design, It is possible to prevent a short circuit or the like. Furthermore, after laminating with the substrate laminating apparatus 1, the thin substrate bonded in a bent shape until the next process of curing the final adhesive R is carried out from the substrate laminating apparatus 1 The shape of 21 can be maintained so that it does not peel off.

(Sixth embodiment)
FIG. 10 is an enlarged view of the separation block 42 of the substrate bonding apparatus 1 according to the sixth embodiment. In the sixth embodiment, the suction portion 42c is provided to maintain the shape until the bent thin substrate 21 is bonded. The suction part 42 c is a suction pipe connected to the negative pressure generator, and opens to the pressing curved surface 42 a of the separation block 42. In the sixth embodiment, a curing processing unit 50 is provided. The curing processing unit 50 radiates energy for curing the adhesive R, and is basically the same as the curing processing unit 42b. However, the curing processing unit 50 is disposed on the side (outside) of the concave substrate 20 that is extended by the bending of the side part 20b.

  The suction part 42c sucks the thin substrate 21 wound around the separation block 42 and keeps the thin substrate 21 in close contact with the separation block 42. Suction may be performed so that the entire area of the thin substrate 21 is in close contact with the separation block 42 and the center block 41, but at least a region facing the pressing curved surface 42a, that is, a large curved surface, is likely to generate a reaction force against bending stress. It is effective to suck the points. Then, by moving the separation block 42 to the second position B while maintaining the suction by the suction part 42c, the thin substrate 21 is gradually stretched along the concave surface 20a from the bent state. To go. The curing processing unit 50 applies the adhesive R before or after bending (before bonding to the side part 20b) and after bending (after bonding to the side part 20b). Radiates energy for pre-curing.

  Thus, in the board | substrate bonding apparatus 1 which concerns on 6th Embodiment, the suction part 42c which makes the separation block 42 adsorb | suck the thin board | substrate 21 bent according to the shape of the center block 41 and the separation block 42 further. I prepared. Moreover, when the adhesive agent R is temporarily hardened by the hardening process part 50 before bending shaping | molding, it can suppress that the adhesive agent R flows. Furthermore, when the adhesive R is temporarily cured by the curing processing unit 50 after bending, the shape of the bonded thin substrate 21 can be maintained and prevented from peeling off. Therefore, the same effect as that of the fifth embodiment can be obtained by this configuration.

(Seventh embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.11 and FIG.12. 11 and 12 are diagrams showing the configuration and operation of the pressing mechanism of the present embodiment.

(Constitution)
As shown in FIG. 11, the pressing mechanism 4 of this embodiment includes a pressing portion 141, a displacement portion 142, and a support portion 143. Moreover, this embodiment has the hardening process part 50 similarly to FIG. The pressing portion 141 is a member that moves the thin substrate 21 in a direction in which the thin substrate 21 is in contact with or separated from the concave substrate 20. The pressing portion 141 approaches the concave substrate 20 and presses the thin substrate 21 against the central region of the concave substrate 20.

  The pressing portion 141 is a substantially rectangular parallelepiped block, and the upper surface thereof has a shape that follows the surface shape of the central region of the concave surface 20a. That is, when the central region of the concave surface 20a is a curved surface, the upper surface of the pressing portion 141 has a shape that follows the curved surface. When the central region of the concave surface 20a is flat, the upper surface of the pressing portion 141 is flat. The upper surface is provided with the above-described chuck mechanism so that the thin substrate 21 can be held.

  The displacement portion 142 is a pair of members provided on both sides of the pressing portion 141 corresponding to the both side portions 20 b of the concave substrate 20. The displacement portion 142 is provided at a position that fits together with the pressing portion 141 in the space inside the side portion 20 b of the concave substrate 20 when the pressing portion 141 presses the thin substrate 21.

  The displacement part 142 approaches the concave substrate 20 together with the pressing part 141, and is displaced toward the outer edge of the thin substrate 21 while one end is in contact with the thin substrate 21. Due to this displacement, the displacement part 142 presses the thin substrate 21 along the concave surface 20 a of the concave substrate 20.

  When the concave substrate 20 has a curved portion on one, three or four sides of the side portion 20b, the displacement portion 142 may be provided on one, three or four sides of the pressing portion 141 correspondingly. .

  The displacement portion 142 of the present embodiment has a plate shape that is parallel to the both side portions 20b of the concave substrate 20 and has at least the entire length of the side portions 20b. One end of the displacement portion 142 that contacts and separates from the thin substrate 21 is a plate-shaped edge portion 142x. The displacement part 142 is configured by an elastic member that is bent when the edge part 142x comes into contact with the thin substrate 21 and is pressed against the concave substrate 20. As described above, various materials can be applied as the material of the elastic member. For example, the displacement part 142 can be made of rubber or other resin. Moreover, even if it says plate shape, the whole does not necessarily need to be a flat surface and may have a fixed angle and curvature.

  It is desirable that the displacement portion 142 does not damage the concave substrate 20 and the thin substrate 21. For example, it may be made of rubber or other resin or coated with resin. Further, by making the edge 142x have a round shape, damage can be prevented.

  The support portion 143 is a member that supports the other end that is a part of the displacement portion 142. The support portion 143 has a shaft portion 143 a that serves as a fulcrum of displacement of the displacement portion 142. The shaft portion 143a is provided in parallel to the side portion 20b of the concave substrate 20, and is rotated by a driving source (not shown). Thereby, the support part 143 rotates centering | focusing on the axial part 143a.

  The radius of rotation from the center of rotation of the shaft portion 143a of the support portion 143 to one end of the displacement portion 142 is such that one end of the displacement portion 142 does not leave the thin substrate 21 during the rotation and is moved to the concave substrate 20. The length is set to maintain the crimping.

  For example, when the side portion 20b is raised by the curved portion, the distance from the rotation center of the shaft portion 143a to the inner surface of the curved portion may not be constant depending on the position and shape of the inner surface. In this case, the difference between the position where the distance is the longest and the position where the distance is the shortest is absorbed by the elastic deformation of the displacement portion 142, and the pressure bonding of the thin substrate 21 to the concave substrate 20 by one end of the displacement portion 142 is maintained. , Turning radius is set.

  The pressing portion 141 is set so as to press the thin substrate 21 against the concave substrate 20 simultaneously with the displacement portion 142 or before the displacement portion 142. In the case of simultaneously pressing, the pressing surface of the pressing portion 141 and the height of one end of the displacement portion 142 are made equal.

  In order to press the pressing portion 141 first, an elastic member that urges the pressing portion 141 in a direction in which the thin substrate 21 is pressed against the concave substrate 20 is provided. In this case, when the pressing portion 141 presses the thin substrate 21 to the concave substrate 20, the pressing portion 141 moves backward relative to the displacement portion 142 against the urging force of the elastic member, and then the displacement One end of the portion 142 presses the thin substrate 21 to the concave substrate 20.

  Further, in order to press the pressing portion 141 first, the pressing portion 141 itself or the pressing surface thereof can be an elastic body. In this case, when the pressing portion 141 press-bonds the thin substrate 21 to the concave substrate 20, the pressing surface of the pressing portion 141 is elastically deformed and retreats relative to one end of the displacement portion 142, and then is displaced. One end of the portion 142 presses the thin substrate 21 to the concave substrate 20.

(Function)
The substrate bonding process according to the present embodiment as described above will be described. First, in the initial state, as shown in FIG. 11, one end of the displacement portion 142 is brought close to the pressing portion 141 side. Then, the concave substrate 20 is installed on the holding unit 3, and the other surface of the thin substrate 21 with the adhesive R attached to one surface is placed on the pressing unit 141 and the displacement unit 142. Thereby, the concave substrate 20 and the thin substrate 21 face each other in the chamber 9.

  In this state, the inside of the vacuum chamber 9 is evacuated by a vacuum source. Then, before the thin substrate 21 is attached close to the concave substrate 20, energy for temporarily curing the adhesive R is emitted from the curing processing unit 50. Thereby, when the pressing part 141 and the displacement part 142 enter the space between the side parts 20b which the concave substrate 20 opposes, it can suppress that the adhesive agent R apply | coated to the thin board | substrate 21 flows.

  When the pressing mechanism 4 approaches the holding unit 3, the pressing unit 141 and the displacement unit 142 enter the space between the opposing side portions 20 b of the concave substrate 20, so that the thin substrate 21 is also in this space. Get inside. At this time, as shown in FIG. 12A, the displacement portion 142 is in a space inside the side portion 20 b of the concave substrate 20.

  The approach between the holding unit 3 and the pressing mechanism 4 continues until the pressing unit 141 presses the central region of the thin substrate 21 against the central region of the concave substrate 20 as shown in FIGS. . For example, the pressing can be detected by connecting a torque sensor or the like to the drive source of the drive mechanism.

  As described above, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, one end of the displacement portion 142 also presses the thin substrate 21 against the concave substrate 20. The pressing timing of the pressing portion 141 and the pressing timing of the displacement portion 142 are as described above. By this pressing, the displacement portion 142 is elastically deformed, and one end of the displacement portion 142 is inserted at a position continuous with the pressing end of the pressing portion 141.

  In this state, as shown in FIGS. 12C and 12D, the drive source is activated and the support portion 143 is rotated. Then, one end of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. Due to the elastic deformation of the displacement portion 142, one end thereof maintains contact with the concave substrate 20 via the thin substrate 21. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20. In addition, you may radiate | emit the energy for carrying out the temporary hardening of the adhesive agent R by the hardening process part 50 after bonding.

(effect)
According to the present embodiment as described above, even if the shape of the curved portion of the side portion 20b varies, the thin substrate 21 can be appropriately crimped without causing a gap or a wrinkle.

  Further, even if the shape of the curved portion of the side portion 20b differs depending on the product, it is not necessary to prepare a convex-shaped member having a fitting surface adapted to each shape. For this reason, the labor of member preparation and replacement work can be saved, and the productivity is improved.

  Further, after the pressing portion 141 presses the thin substrate 21 against the central region of the concave substrate 20, the thin substrate 21 follows the rotation of the displacement portion 142 toward the side portion 20 b of the concave substrate 20. 21 is pressed against the concave substrate 20. For this reason, the thin substrate 21 can be uniformly adhered over the entire surface of the concave substrate 20 without the occurrence of biting of vacuum bubbles or the like. Therefore, the quality of the product after bonding is improved. Moreover, since the adhesive agent R is temporarily hardened by the hardening process part 50 before bonding, the flow of the adhesive agent R is suppressed. Furthermore, when the adhesive R is temporarily cured by the curing processing unit 50 after bonding, the shape of the bonded thin substrate 21 can be maintained and can be prevented from peeling off. Therefore, the same effects as those of the fifth and sixth embodiments can be obtained by this configuration. In addition, you may perform any one or both of temporary hardening before bonding and temporary hardening after bonding.

(Eighth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.13 and FIG.14. 13 and 14 are diagrams showing the configuration and operation of the pressing mechanism 4 in the present embodiment.

(Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, as shown in FIG. 13, the displacement part 142 of this embodiment has the roller 142a and the axial support part 142b. The roller 142a is a rotating member having at least the entire length of the side portion 20b in parallel with the side portion 20b of the concave substrate 20. The outer peripheral surface of the roller 142 a becomes one end of a displacement portion 142 that contacts and separates from the thin substrate 21.

  The shaft support 142b is a member that rotatably supports the roller 142a at one end thereof. The shaft support 142b has a length at least equal to the entire length of the roller 142a. The shaft support 142b supports both ends of the shaft of the roller 142a by arm portions at both ends. The arm portion is provided so as to be displaceable (extendable / contractible) by, for example, an elastic body, an air cylinder, an electromagnet floating device, and the like, and is configured to maintain the pressure bonding by the roller 142a according to the shape of the bending portion. As the elastic body, it is possible to use rubber or other resin, a spring, or a material in which the support is elastically supported by these. When an electromagnet is used, it becomes easy to adjust the crimping force, the amount of expansion and contraction, etc., by controlling the energization by the control device.

  The support part 143 is a member that supports the other end of the shaft support part 142b. The support portion 143 has a displacement fulcrum of the displacement portion 142, that is, a shaft portion 143a serving as a rotation axis of the shaft support portion 142b. The configuration of the shaft portion 143a is the same as that in the first embodiment.

  The pressing portion 141 is set to press the thin substrate 21 to the concave substrate 20 simultaneously with the roller 142a of the displacement portion 142 or before the roller 142a, as in the first embodiment. Yes.

(Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, in the initial state, the roller 142a is brought close to the pressing portion 141 side. Then, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20.

  At this time, as shown in FIG. 14A, the outer peripheral surface of the roller 142 a that is one end of the displacement portion 142 is in the space inside the side portion 20 b of the concave substrate 20.

  14B, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the outer peripheral surface of the roller 142a, which is one end of the displacement portion 142, also moves against the concave substrate 20. Then, the thin substrate 21 is pressed.

  In this state, the drive source is activated to rotate the shaft portion 143a. Then, as shown in FIGS. 14C and 14D, the roller 142a of the displacement portion 142 rotates along the curved portion of the side portion 20b of the concave substrate 20 toward the outer edge of the thin substrate 21. Moving. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20. At this time, the arm portion expands and contracts according to the shape of the curved portion, so that the pressure bonding of the thin substrate 21 to the concave substrate 20 by the roller 142a is maintained.

(effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, the member that is in direct contact with the thin substrate 21 is the rotating roller 142a. For this reason, scratches and the like due to rubbing the surface of the thin substrate 21 are less likely to occur. Further, since the thin substrate 21 is not easily damaged even if it is moved at a high speed, the bonding process can be speeded up. Furthermore, even when the shape of the curved portion of the concave substrate 20 and the flexibility of the thin substrate 21 vary due to the expansion and contraction of the arm portion, it is possible to maintain the pressure bonding following the curved surface.

(Ninth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.15 and FIG.16. FIG.15 and FIG.16 is a figure which shows the structure and operation | movement of the press mechanism 4 in this embodiment.

(Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, the displacement part 142 of this embodiment has the brush 142c, as shown in FIG. Moreover, the support part 143 has the base | substrate part 143b which fixes the brush 142c.

  The brush 142c is, for example, an assembly of a plurality of resins, natural or synthetic fibers, or hairs, and one end of the brush 142c faces the curved portion of the side portion 20b of the concave substrate 20. The other end, which is a part of the brush 142c, is implanted in the base portion 143b.

  The base portion 143b is a member having at least the entire length of the side portion 20b in parallel with the side portion 20b of the concave substrate 20, and has a curved surface toward the curved portion of the side portion 20b. The brush 142c is planted over the entire surface of the curved surface.

  The tip of the brush 142 c is one end that contacts the thin substrate 21 and presses against the concave substrate 20. The portion of the brush 142c that is implanted into the base portion 143b is one of the fulcrums for displacement of the brush 142c. Further, since the brush 142c has flexibility, it is bent when the thin substrate 21 is pressed against the concave substrate 20.

  Although not shown, after the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the base portion 143 b of the displacement portion 142 is further recessed, and the tip of the brush 142 c is concave to the thin substrate 21. It has a drive mechanism that moves in the direction of pressing against the substrate 20.

  As in the first embodiment, the pressing portion 141 is set to press the thin substrate 21 against the concave substrate 20 simultaneously with the brush 142c of the displacement portion 142 or before the brush 142c. Yes. In addition, the tip of the brush 142c, which is one end of the displacement portion 142, fits in a space inside the side portion 20b of the concave substrate 20, and the thin substrate 21 is sequentially pressed against the concave substrate 20 from the inside to the outside. Is set.

(Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20.

  At this time, as shown in FIG. 16A, the tip of the brush 142c, which is one end of the displacement portion 142, is in the space inside the side portion 20b of the concave substrate 20.

  16B, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the tip of the brush 142c, which is one end of the displacement portion 142, also moves against the concave substrate 20. Then, the thin substrate 21 is pressed.

  In this state, the drive mechanism operates to move the base portion 143b toward the concave substrate 20. Then, as shown in FIGS. 16C and 16D, the brush 142c is bent while pressing the thin substrate 21 against the concave substrate 20 sequentially from the inner brush 142c to the outer brush 142c. Thereby, the brush 142c press-bonds the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.

(effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, the member that is in direct contact with the thin substrate 21 is a flexible brush 142c. For this reason, even if there is a greater difference or variation in the curved shape, it is possible to absorb this and perform bonding with high accuracy. Further, scratches caused by rubbing the surface of the thin substrate 21 are less likely to occur.

  Further, since the thin substrate 21 is not easily damaged even if it is moved at a high speed, the bonding process can be speeded up. Furthermore, since the structure of the displacement part 142 is the brush 142c planted in the base | substrate part 143b, an apparatus structure is simplified and it can manufacture at low cost.

(Tenth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG. FIG. 17 is a diagram illustrating the configuration and operation of the pressing mechanism 4 in the present embodiment.
(Constitution)
This embodiment is basically the same configuration as the ninth embodiment. However, in the present embodiment, as shown in FIG. 17A, the pressing portion 141 and the base portion 143b (support portion 143) are integrally formed, and not only the base portion 143b but also the upper surface of the pressing portion 141. Moreover, the brush 142c (displacement part 142) is planted. The tip of the brush 142c is centered so that the thin substrate 21 is crimped first from the central portion of the concave substrate 20, and the other brushes 142c are also sequentially crimped toward the side portion 20b of the concave substrate 20. The department is set high.

(Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20.

  At this time, as shown in FIG. 17B, the tip of the brush 142c, which is one end of the displacement portion 142, is inside the side portion 20b of the concave substrate 20.

  Then, as illustrated in FIG. 17C, the brush 142 c of the pressing unit 141 presses the thin substrate 21 against the concave substrate 20. At this time, the tip of the brush 142c sequentially press-bonds the thin substrate 21 from the central portion of the concave substrate 20 toward the side portion 20b.

  Further, as shown in FIGS. 17D, 17E, and 17F, the thin substrate 21 is sequentially moved from the inner brush 142c to the outer brush 142c also in the curved portion of the side portion 20b of the concave substrate 20. The brush 142c is bent while being pressed against the concave substrate 20. Thereby, the brush 142c press-bonds the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.

(effect)
According to the present embodiment as described above, the same effects as in the fourth embodiment can be obtained, and the following effects can be obtained. That is, since the whole member that presses the thin substrate 21 against the concave substrate 20 is the brush 142c, it can be sequentially pressed from the center of the concave substrate 20 to the outside. For this reason, biting of vacuum bubbles or the like can be further prevented, and the thin substrate 21 can be uniformly adhered over the entire surface of the concave substrate 20. Therefore, the quality of the product after bonding is further improved. In addition, a driving mechanism that drives only the base portion 143b of the displacement portion 142 becomes unnecessary.

(Eleventh embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG. FIG. 18 is a diagram illustrating the configuration and operation of the pressing mechanism 4 in the present embodiment.
(Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, this embodiment has a guide mechanism 15 as shown in FIG.

  The guide mechanism 15 is a mechanism that guides the surface in the vicinity of the side portion 21 b of the thin substrate 21 pressed by the pressing mechanism 4 so as to be inside the side portions 20 b of the concave substrate 20. The guide mechanism 15 has a pair of guide members 15 a that come in contact with and separate from both side portions 21 b of the thin substrate 21 placed on the pressing mechanism 4. The guide member 15a has a plate shape having a length equivalent to at least the entire length of the side portion 21b of the thin substrate 21.

  The pair of guide members 15a is moved between a guide position in contact with the side portion 21b of the thin substrate 21 and a retraction position that is retracted away from the side portion 21b of the thin substrate 21 by a moving mechanism (not shown). It is provided to be movable. In addition, this moving mechanism is provided with a pair of frames each having a guide member 15a so as to be rotatable around an axis connected to a drive source, and by rotating in opposite directions to each other, It is good also as a structure which the guide member 15a moves to the direction which mutually contacts. In addition, the pair of guide members 15 a are provided so as to be lifted and lowered together with the pressing mechanism 4 by a lifting mechanism (not shown) while being in contact with the side portion 21 b of the thin substrate 21. Note that this lifting mechanism may also be used as the driving mechanism of the pressing mechanism 4. Further, the up-and-down movement of the guide member 15 a may be relative to the concave substrate 20 held by the holding unit 3.

  The pair of guide members 15 a are configured so that the thin substrate 21 is held at a position separated from the concave substrate 20 except for a portion pressed by the pressing portion 141 and pressed by the displacement portion 142. An interval and a follow-up distance to the pressing mechanism 4 are set.

(Function)
The bonding process of this embodiment as described above will be described. The basic bonding process is the same as that in the first embodiment. However, in the present embodiment, as shown in FIG. 18B, the guide members 15a moved to the guide position are in contact with both side portions 21b of the thin substrate 21 placed on the pressing mechanism 4, Causes deflection.

  Due to this bending, the both side portions 21 b of the thin substrate 21 come to a position that enters the space inside the both side portions 20 b of the concave substrate 20. In this way, the pressing mechanism 4 approaches the concave substrate 20 in a state where the positions of the both side portions 21b of the thin substrate 21 are regulated, and the guide member 15a also approaches the concave substrate 20 following this. .

  And since the pressing part 141 and the displacement part 142 enter into the space between the side parts 20b which the concave substrate 20 opposes, the thin board | substrate 21 also enters in this space. At this time, both side portions 21b of the thin substrate 21 are located inside the side portions 20b of the concave substrate 20 by the guide member 15a.

  Further, as shown in FIGS. 18C and 18D, the pressing unit 141 presses the thin substrate 21 against the concave substrate 20, and the displacement unit 142 follows the curved portion of the side portion 20 b of the concave substrate 20. The thin substrate 21 is crimped. The details are the same as in the first embodiment.

  In the present embodiment, as shown in FIG. 18D, the thin substrate 21 is held in contact with the guide member 15a until the entire surface of the thin substrate 21 is bonded to the concave substrate 20, and thereafter, FIG. E), the guide member 15a is separated from the thin substrate 21. For this reason, shaking of the plate surface of the thin substrate 21 being bonded is prevented.

(effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the thin substrate 21 can be shaken before the entire surface of the thin substrate 21 is finally bonded to the concave substrate 20. Does not occur. For this reason, it is possible to realize a more uniform and accurate bonding, and the quality of the bonded substrate is improved.

(Twelfth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.19 and FIG.20. 19 and 20 are diagrams showing the configuration and operation of the pressing mechanism 4 in the present embodiment.

(Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, as shown in FIG. 19, the displacement portion 142 of the present embodiment has, for example, a plurality of one ends that are substantially elliptical in cross section and are in contact with and away from the thin substrate 21. And the displacement part 142 is a rotation member which has the length of the full length of the side part 20b at least parallel to the side part 20b of the concave board | substrate 20. As shown in FIG. As the displacement portion 142, a relatively hard member or an elastic member may be used.

  The support portion 143 is a shaft that supports a part of the displacement portion 142 and serves as a pivot for the rotation of the displacement portion 142. The configuration of this shaft is the same as that of the shaft portion 143a of the first embodiment. The support portion 143 is provided at an eccentric position of the displacement portion 142, and the edge portion 142y that is one outer peripheral surface of the displacement portion 142 and the edge portion 142z that is the other outer peripheral surface that opposes the support portion 143, that is, The distance from the rotation center of the shaft is different. For example, the edge 142y has a longer distance from the center of rotation than the edge 142z. The edge portions 142y and 142z serve as one end of the displacement portion 142 that contacts and separates from the thin substrate 21. Note that three or more ends having different rotation radii can be provided so as to be able to handle more curved surfaces.

  In the vicinity of the displacement portion 142 in the pressing portion 141, a hole, a recess, or a cavity that allows the displacement portion 142 to rotate is provided. Further, the pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with the displacement portion 142 or before the displacement portion 142 as in the first embodiment. The support portion 143 may be provided so as to be displaceable by an elastic member, and the pressure bonding by the displacement portion 142 may be maintained according to the shape of the bending portion.

(Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, in an initial state, either one of the edge portions 142 y and 142 z is set in a direction in contact with the thin substrate 21 in accordance with the curved shape of the side portion 20 b in the concave substrate 20.

  FIG. 19A shows a curved shape with a large radius of curvature. In this case, the edge 142 y is directed toward the thin substrate 21. Then, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20. Then, as shown in FIG. 19A, the edge portion 142 y of the displacement portion 142, together with the pressing portion 141, presses the thin substrate 21 against the concave substrate 20.

  In this state, the drive source is activated and the support portion 143 rotates. Then, as shown in FIG. 19B, the edge 142 y of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20.

  On the other hand, in the case of a curved shape with a small radius of curvature, the edge 142z faces the thin substrate 21 as shown in FIG. And the support part 143 rotates in the state which the edge part 142z pressed the thin board | substrate 21 with respect to the concave board | substrate 20 with the pressing part 141 similarly to the above. Then, as shown in FIG. 20B, the edge 142 z of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20.

(effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, since the displacement portion 142 has the edge portions 142y and 142z having different rotation radii, uniform bonding can be realized corresponding to different curved shapes without preparing or replacing the members. . For this reason, productivity can be improved. Note that some variation in the shape of the curved portion is absorbed by the elastic deformation of the concave substrate 20, and the pressure bonding of the thin substrate 21 by the displacement portion 142 can be maintained. Further, by providing the support portion 143 so as to be displaceable by an elastic member, even if the shape of the curved portion of the concave substrate 20 and the flexibility of the thin substrate 21 vary, it is possible to maintain the pressure bonding following the curved surface. it can.

(Other embodiments)
The present invention is not limited to the embodiment as described above. For example, the following forms are also included in the present invention.

(1) The positional relationship between a pair of substrates to be bonded is not limited to that exemplified in the above embodiment. For example, as shown in FIG. 21A, it is possible to configure a mode in which the concave substrate 20 is supported downward and the thin substrate 21 is held upward by the pressing portion 141. In this case, as shown in FIGS. 21B to 21D, the pressing portion 141 and the displacement portion 142 holding the thin substrate 21 are lowered, and the pressing portion 141 moves the central region of the thin substrate 21 into the concave substrate. 20, the displacement portion 142 presses the thin substrate 21 against the side portion 20 b of the concave substrate 20. Bonding can also be performed by placing the thin substrate 21 above the concave substrate 20 and pressing it from above with the pressing portion 141 and the displacement portion 142.

(2) In any of the above-described embodiments, by pre-curing the adhesive before bonding and the adhesive after bonding by irradiation of energy by the curing processing unit, The flow may be suppressed. This temporary curing can be realized, for example, by weakening the energy applied to the adhesive. Moreover, it is realizable by irradiating in air | atmosphere. For example, when the adhesive is an ultraviolet curable resin, the adhesive can be temporarily cured by irradiating UV light in the atmosphere. In the case of irradiation in the atmosphere, curing is hindered by oxygen in the atmosphere, and it is easy to maintain a state in which the viscosity of the surface is maintained. Depending on the type of resin, it is conceivable to apply various methods such as irradiation of electromagnetic waves, temperature change (heating, cooling), air blowing, etc., as the method of the temporary curing treatment. Further, in the above-described embodiment, the curing processing units 42b and 50 are provided outside the holding unit 3. However, the curing processing units 42b and 50 are also provided inside the holding unit 3 to cure the entire adhesive R from the entire holding unit 3. May be radiated. And the following hardening processes are realizable by using these hardening process parts properly.
(a) The adhesive R applied to the concave substrate 20 or the thin substrate 21 is temporarily cured before bonding.
(b) Temporary curing is performed before or after the thin substrate 21 is bonded to the side portion 20b of the concave substrate 20.
(c) The entire adhesive R of the concave substrate 20 and the thin substrate 21 after bonding is temporarily cured or fully cured (curing to reach a completely cured state).

  Further, in the above-described embodiment, the adhesive is temporarily cured by radiating energy from the curing unit before and after the bonding. However, in the embodiment in which one end of the displacement portion presses the thin substrate against the concave substrate, the curing processing unit is directed toward the portion where the concave substrate and the thin substrate are pressure bonded in accordance with the movement of one end of the displacement portion. May emit energy. For example, the light of the UV lamp is guided by an optical fiber, and the end face of the optical fiber is arranged in a straight line or a dotted shape over the entire length of the concave substrate, and the concave substrate and the thin substrate are crimped in accordance with the movement of one end of the displacement portion. The UV is irradiated toward the target site. By doing so, since the concave substrate and the thin substrate are gradually preliminarily cured from the bonded and bonded portion, rather than radiating energy by the curing treatment part after bonding, the adhesive is temporarily cured. The time for temporary curing can be shortened, and the displacement of the thin substrate with respect to the concave substrate can also be suppressed.

(3) The substrates may be bonded in a vacuum or in the air. Even when the process is performed in the air, it is possible to prevent entrapment of bubbles and the like by pressing the thin substrate from the central region of the concave substrate toward the side portion. For example, when the brush as in the tenth embodiment is used, the flat surface is not crimped in a relatively wide range, but can be sequentially crimped from the center of the concave substrate toward the outside. , Effective in preventing air bubbles.

(4) The substrate to be bonded is typically a cover panel, a touch panel and a liquid crystal module, or a display panel and a backlight constituting the liquid crystal module. However, the size, shape, material, etc. are not limited as long as they can be a pair of objects to be attached. For example, the present invention can also be applied to various members constituting the display device. It is free to attach the adhesive to which substrate, and it is applicable not only when the adhesive is attached to one of the substrates but also when the adhesive is attached to both. The present invention is also applicable to the case where one substrate is pressure-bonded to the other substrate without using an adhesive.

(5) Any of the above embodiments may be combined. For example, the eleventh embodiment can be combined with all the above embodiments. In other words, the above embodiments are not intended to limit the scope of the invention. These embodiments can be variously omitted, replaced, changed, and combined within the scope of the gist of the invention, and are included in the invention described in the scope of claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate bonding apparatus 15 ... Guide mechanism 15a ... Guide member 20 ... Concave substrate 20a ... Concave surface 20b ... Side part 20c ... Concave surface 21 ... Thin board | substrate 21b ... Side part 3 ... Holding part 4 ... Pressing mechanism 41 ... Central block 42 ... separation block 42a ... pressing curved surface 42b, 50 ... curing processing part 42c ... suction part 44 ... stage 45 ... rail 46 ... slide table 47a ... rotating machine 47b ... ball screw 48 ... rotating shaft 49 ... rotating machine 5 ... claw part 5a ... Flange 9 ... Vacuum chamber 141 ... Pushing part 142 ... Displacement part 142a ... Roller 142b ... Shaft support part 142c ... Brush 142x, 142y, 142z ... Edge part 143 ... Supporting part 143a ... Shaft part 143b ... Base part R ... Adhesive A ... 1st position B ... 2nd position C ... 3rd position

Claims (15)

A substrate laminating apparatus for laminating a concave substrate having a concave surface and a flexible thin substrate via an adhesive,
A pressing means for pressing the thin substrate against the concave surface of the concave substrate;
The pressing means is
A pressing portion that presses the thin substrate against the concave surface of the concave substrate;
It is located beside the pressing portion, and the thin substrate is pressed against the concave substrate by the pressing portion, and is displaced so as to fit within the concave surface of the concave substrate and to press the thin substrate along the concave surface. A displacement part;
The board | substrate bonding apparatus characterized by having. The pressing portion is a center block,
The displacement part is a separation block that can approach and leave the center block,
The pressing means is
Until the central block and the separation block are contracted smaller than the concave surface, the separation block is brought close to the central block so as to enter the concave surface together with the thin substrate;
Moving the separation block in the concave surface toward the side of the concave substrate, thereby spreading the thin substrate along the concave surface;
The board | substrate bonding apparatus of Claim 1 characterized by these. The separation block is
A pressing curved surface having substantially the same shape as the concave surface portion of the side edge of the concave substrate on the side edge side;
The board | substrate bonding apparatus of Claim 2 characterized by these.   The board | substrate bonding apparatus of Claim 1 by which at least one part of the said displacement part is comprised by the elastic member. The pressing means is
Guide means for pre-bending the thin substrate following the overall shape when the separation block is brought close to the central block,
The separation block is
After the bending, moving toward the side of the concave substrate;
The board | substrate bonding apparatus of Claim 2 characterized by these. The guide means includes
Including a claw portion for bending the thin substrate in advance by hooking the side edge of the thin substrate and applying an external force;
The board | substrate bonding apparatus of Claim 5 characterized by these. The separation block is
During the bending by the claw portion, moving from a position outside the position where the side of the concave substrate comes into contact with the side portion via the thin substrate, to a position close to the central block,
The board | substrate bonding apparatus of Claim 6 characterized by these. The claw portion is
Moving along the outer edge of the separation block through the side edge surface of the thin substrate not receiving external force,
The board | substrate bonding apparatus of Claim 7 characterized by these. The claw portion is
Moves on a straight line passing through the side edge surface of the thin substrate that is not subjected to external force and the side edge surface of the thin substrate after being bent along the outer shape of the separation block near the center block. To do,
The board | substrate bonding apparatus of Claim 8 characterized by these. Further comprising suction means for adsorbing the thin substrate bent to follow the overall shape of the central block and the separation block to the separation block;
The board | substrate bonding apparatus of Claim 5 characterized by these. A curing unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate before and after the thin substrate is bonded to the concave substrate; Preparing,
The board | substrate bonding apparatus of Claim 1 characterized by these. Curing in which the adhesive applied to at least one of the concave substrate and the thin substrate is temporarily cured at least before bonding of the side portions of the concave substrate and after bonding of the side portions. The board | substrate bonding apparatus of Claim 1 provided with a process part. The pressing means has a support part that supports the displacement part,
The displacement part is displaced toward the side part of the concave substrate while bringing one end into contact with the thin substrate, thereby causing the thin substrate to be pressure-bonded following the concave surface,
The board | substrate bonding apparatus of Claim 1 with which the said support part supports the other end of the said displacement part as a fulcrum of a displacement.   The substrate sticking according to claim 13, wherein one end of the displacement portion is provided with a variable distance from the fulcrum so as to maintain pressure bonding of the thin substrate to the concave substrate. Combined device. A substrate laminating method for laminating a concave substrate having a concave surface and a flexible thin substrate via an adhesive,
The pressing part presses the thin substrate against the concave surface of the concave substrate,
A displacement portion located beside the pressing portion is placed in the concave surface of the concave substrate together with the pressing of the thin substrate against the concave substrate by the pressing portion, so that the thin substrate is pressure-bonded following the concave surface. The board | substrate bonding method characterized by displacing.

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