JP5884973B2 - Soldering device - Google Patents

Description

  The present invention relates to a soldering apparatus for soldering electronic components.

  Conventionally, “flow soldering method” and “reflow soldering method” have been performed as methods for mechanically soldering electronic components to a printed circuit board.

  The “flow soldering method” is a method of filling a solder bath with solder that has been heated and melted, moving a printed circuit board with electronic component terminal conductors inserted into the through holes on the solder bath, and bringing the solder liquid surface into contact with the substrate surface. This is a method of soldering. In this method, the printed circuit board is brought into contact with the liquid surface of the solder that has been melted by heating, so that the solder becomes hard due to contact with the printed circuit board. In order to avoid this, it is necessary to sufficiently heat the solder in the solder bath. However, a solder having a high melting point, such as lead-free solder, which has been recently diversified, has a problem that it is easy to apply a thermal stress to an electronic component because the heating temperature must be increased accordingly.

  "Reflow soldering method" is a method in which components are mounted on a printed circuit board that is pre-printed with cream solder according to the pattern, and solder is applied by directly applying heat to the printed circuit board to melt the cream solder. . This method requires screen printing or the like to print cream solder, and is suitable for mass-produced products. However, application to small lot products is extremely disadvantageous in terms of cost.

  In view of this, an apparatus disclosed in Patent Document 1 below has been proposed as a soldering apparatus that performs a necessary and sufficient heat treatment on each soldering location by using a cylindrical soldering iron.

JP 2009-200196 A

  The soldering apparatus of the above-mentioned patent document 1 has a fixing jig for fixing a terminal lead inserted into a through hole of a wiring board to a jig in a form protruding to the solder iron side, and the jig can be moved back and forth and left and right. And a connecting plate having a cylindrical soldering iron and a solder supply device and a lifting drive mechanism, and a floating mechanism for pulling the connecting plate upward by a pulling force of a spring. It is a thing.

  In the apparatus disclosed in Patent Document 1, the floating mechanism pulls the connecting plate upward using the pulling force of the spring. When performing soldering, the connecting plate is transported in the above-described floating state. For soldering, it is necessary to first transport the connecting plate at the origin position to the vicinity of the solder position at a high speed, and then lower the connecting plate at a low speed until the soldering iron is brought into contact with the substrate. However, as described above, if the connecting plate is transported in a floating state, it is extremely unstable during high-speed transport. Repeated transportation in an unstable state tends to cause wear and damage of parts, accelerates the deterioration of accuracy, and causes problems in terms of stability and reliability. Also, if the traction force of the spring is used for the floating mechanism, the pressing force of the soldering iron against the board fluctuates when the height position of the board fluctuates, and the pressing force is insufficient, resulting in poor soldering. On the other hand, there is a problem that the pressing force is too strong and the substrate is excessively stressed, causing damage.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a soldering apparatus with improved stability when a soldering iron is conveyed.

In order to achieve the above object, a soldering apparatus according to the present invention includes a head unit on which a cylindrical soldering iron is mounted, and a floating state that applies a force against its own weight to the head unit. comprising a unit and a conveying unit that conveys at least the vertical direction the floating unit, the floating unit, an air cylinder for the head unit in a floating state by the air pressure, the upper and lower the head unit within a predetermined height range is configured to include a guide mechanism for guiding the movement, the head unit has been locked by the floating unit is conveyed to the vicinity of the soldering position by the transfer unit, the Heddoyuni' was floated by the floating unit The gist that further comprising control means for controlling the air cylinder to press against the periphery of the through hole in the substrate and soldering iron tips of is lowered from the soldering position near to the soldering position cylindrical shape by the transfer unit And

According to the present invention, when the floating unit is transported to the vicinity of the soldering position, the head unit is locked to prevent damage, and when the head unit is lowered, the head unit is floated to the soldering position. The tip of the cylindrical soldering iron can be lowered from the vicinity to the soldering position to press the periphery of the through hole on the substrate, and the pressing force of the soldering iron against the substrate can be made constant .

It is a figure which shows the soldering apparatus of one Embodiment of this invention. It is a figure explaining the state which solders. It is a figure explaining a cutting mechanism. It is a figure explaining a floating unit. It is a figure for demonstrating control of a floating unit and a conveyance unit.

  Next, the best mode for carrying out the present invention will be described.

  FIG. 1 is a diagram showing a soldering apparatus according to an embodiment of the present invention.

  The soldering apparatus 1 of the present embodiment includes a head unit 2 on which a soldering iron 20 is mounted, a floating unit 3 that is brought into a floating state by applying a force against its own weight to the head unit 2, and the above A transport unit 4 for transporting the floating unit 3 at least in the vertical direction is provided.

  The soldering iron 20 mounted on the head unit 2 has a cylindrical shape, and the thread solder 21 pulled out from the reel 22 is cut into a predetermined dimension by the cutting mechanism 10 and supplied into the hollow path. The head unit 2 includes a cutting mechanism 10 that cuts the thread solder 21 and a heating mechanism (not shown) that heats the cylindrical soldering iron 20.

  The floating unit 3 includes an air cylinder 30 that brings the head unit 2 into a floating state by air pressure, and a guide mechanism 31 that guides the vertical movement of the head unit 2 within a predetermined height range. In this example, the air cylinder 30 applies a traction force against the head unit 2 against its own weight. For example, when the head unit 2 is pulled upward with a force of 90% of its own weight, the head unit 2 appears to have a load of 10% of its own weight. A state where the load is apparently smaller than its own weight is called a floating state.

  The transport unit 4 includes a Z-direction transport unit 41 for transporting the floating unit 3 in the up and down direction (hereinafter referred to as “Z direction”), and the left and right direction (hereinafter referred to as “X” when the head unit 2 is viewed from the front. An X-direction transport unit 42 for transporting the floating unit 3 in the front-rear direction (hereinafter referred to as “Y-direction”) when the head unit 2 is viewed from the front. It is prepared for.

  FIG. 2 is a diagram illustrating a state in which soldering is performed.

  This soldering apparatus 1 joins the through hole 8 and the conductor 6 with the thread solder piece 21a in a state where the conductor 6 of the electronic component 7 is inserted into the through hole 8 on the printed board 5. The tip of the cylindrical soldering iron 20 is pressed around the through-hole 8 in a state where the lead wire 6 having passed through the through-hole 8 enters the hollow path of the cylindrical soldering iron 20. In this state, the thread solder piece 21a is supplied to the hollow path of the cylindrical soldering iron 20, and is heated and melted at the tip portion for soldering. In the figure, reference numeral 9 denotes a guide tube 9 for guiding the thread solder piece 21 a obtained by cutting with the cutting mechanism 10 to the cylindrical soldering iron 20.

  FIG. 3 is a diagram illustrating the cutting mechanism 10 of the head unit 2.

  The cutting mechanism 10 includes a cutting plate 16 having a receiving blade 11, a cutting gear 15 having a plurality of cutting blades 12, and a motor 13 for driving the cutting gear 15 to rotate. The receiving blade 11 is positioned directly below the feed roller 14 and has a cylindrical shape having a supply hole 11 a for receiving the supply of the thread solder 21. The cutting blade 12 has a cylindrical shape having a holding hole 12 a for holding the thread solder 21. In this example, two cutting blades 12 are arranged on the cutting gear 15 at symmetrical positions about the rotation axis. A discharge hole 11c and a soldering iron 20 are arranged at a position coaxial with the other cutting blade 12 in a state where the cutting gear 15 is stopped at a position where one of the cutting blades 12 is coaxial with the receiving blade 11. .

  First, the tip of the thread solder 21 is supplied to the holding hole 12a of the cutting blade 12 with the cutting gear 15 stopped where one of the cutting blades 12 is coaxial with the receiving blade 11. When the cutting gear 15 is rotated from there, the tip of the thread solder 21 is cut to generate a thread solder piece (not shown). Next, when the cutting gear 15 is rotated halfway from the initial position, the positions of the holding hole 12a and the discharge hole 11c of the cutting blade 12 coincide with each other, and the thread solder piece is discharged from the discharge hole 11c to the cylindrical soldering iron 20. Supplied. When the thread solder piece is supplied to the cylindrical soldering iron 20, soldering is performed as described above.

  FIG. 4 is a diagram illustrating the floating unit 3.

  The floating unit 3 accommodates the lifting block 32 on which the head unit 2 is mounted, the two guide bars 33 for guiding the vertical movement of the lifting block 32, and the lifting block 32 and the guide bar 33. And a casing 34 to be formed.

  The casing 34 has a box shape with an open front, and a guide bar 33 is fixed across the upper wall and the lower wall. The elevating block 32 moves up and down in the internal space of the casing 34. The casing 34 is movable up and down between an upper end position corresponding to the upper wall of the elevating block 32 and a lower end position corresponding to the lower wall. Thus, the casing 34 also functions as a restricting member that restricts the range of vertical movement.

  The elevating block 32, the guide bar 33, the casing 34, and the like function as a guide mechanism 31 that guides the vertical movement of the head unit 2 within a predetermined height range.

  A sensor 35 for detecting the height position of the elevating block 32 is provided inside the casing 34. The sensor 35 detects whether the height position of the elevating block 32 is within or outside a predetermined appropriate range. Thereby, the sensor 35 detects the height position of the head unit 2 during operation of the apparatus. Specifically, the height position of the head unit 2 when performing soldering, the height position of the head unit 2 when in a floating state, which will be described later, and the height position of the head unit 2 when in a locked state, which will be described later, respectively. Detect.

  The floating unit 3 includes an air cylinder 30 that brings the head unit 2 into a floating state by air pressure. The air cylinder 30 is attached to the upper wall of the casing 34 by a support member 36.

  A through hole 37 is formed in the casing 34 near the center of the upper wall, and a cylinder rod 38 of the air cylinder 30 is inserted into the through hole 37. The tip of the cylinder rod 38 is fixed to the upper end surface of the lifting block 32.

  Connected to the air cylinder 30 are an upper valve 30a for controlling the air pressure on the upper side of the cylinder and a lower valve 30b for controlling the air pressure on the lower side of the cylinder.

  With this structure, in order to realize the floating state of the head unit 2, the air pressure of the air cylinder 30 is controlled so that the air pressure on the lower side of the cylinder is larger than that on the upper side of the cylinder. Specifically, it can be performed by always applying a constant air pressure to the lower side of the cylinder and turning off the air pressure on the upper side of the cylinder (lowering it to atmospheric pressure). By doing so, a force against the own weight of the head unit 2 (in this example, the combined weight of the head unit 2 and the lifting block 32) is applied to the head unit 2.

  On the other hand, the air pressure of the air cylinder 30 is controlled so that the air pressure on the cylinder upper side becomes larger than that on the cylinder lower side. Specifically, a constant air pressure is always applied to the lower side of the cylinder, and an air pressure exceeding that is applied to the upper side of the cylinder. As a result, a force exceeding the weight of the head unit 2 (in this example, the combined weight of the head unit 2 and the lifting block 32) is applied to the head unit 2. In this state, the elevating block 32 is fixed to the lower end position of the casing 34 and pressed from above, and a locked state described later can be realized.

  As described above, the transport unit 4 includes the Z-direction transport unit 41, the X-direction transport unit 42, and the Y-direction transport unit 43.

  The Z-direction transport unit 41 is configured by attaching a lifting unit 46 that moves up and down according to the rotation of the ball screw 44 to a ball screw 44 fixed to the support member 45 along the vertical direction. The above-described floating unit 3 is attached to the lifting unit 46. When the ball screw 44 is rotationally driven, the elevating unit 46 moves up and down, thereby conveying the floating unit 3 in the Z direction. When the floating unit 3 is conveyed in the Z direction, the head unit 2 attached thereto is also conveyed in the Z direction.

  The X-direction transport unit 42 includes a slide rail mechanism on which the support member 45 of the Z-direction transport unit 41 is placed and which allows the support member 45 to slide in the X direction. The sliding movement can be realized by a ball screw mechanism (not shown), for example. By driving the slide rail mechanism, the Z-direction transport unit 41 is transported in the X direction. When the Z-direction transport unit 41 is transported in the X direction, the floating unit 3 and the head unit 2 attached thereto are also transported in the X direction.

  The Y-direction transport unit 43 is provided with a slide rail mechanism on which the X-direction transport unit 42 is placed and which allows the X-direction transport unit 42 to slide in the Y direction. The sliding movement can be realized by a ball screw mechanism (not shown), for example. By driving the slide rail mechanism, the X-direction transport unit 42 is transported in the Y direction. When the X-direction transport unit 42 is transported in the Y direction, the Z-direction transport unit 41, the floating unit 3 and the head unit 2 attached thereto are also transported in the Y direction.

  FIG. 5 is a diagram for explaining control of the floating unit 3 and the transport unit 4.

  The soldering apparatus 1 controls the air cylinder 30 so that the head unit 2 is locked at the lower end position when the transport unit 4 transports the floating unit 3 from the initial position to the vicinity of the soldering position. Is further provided.

  The control means 50 will be described in detail.

  The control means 50 includes a Z-direction drive motor 41a for driving the Z-direction transport unit 41, an X-direction drive motor 42a for driving the X-direction transport unit 42, and a Y for driving the Y-direction transport unit 43. The direction drive motor 43a is driven and controlled to control the operation of transporting the head unit 2 in the Z direction, the X direction, and the Y direction.

  Thereby, the control means 50 conveys the floating unit 3 from the initial position to the vicinity of the soldering position at a relatively high first conveyance speed, and relatively slowly from the vicinity of the soldering position to the soldering position. The transport unit 4 is controlled to transport at the second transport speed.

  Here, the vicinity of the soldering position refers to a position where the tip of the soldering iron 20 of the head unit 2 faces directly above the target through hole 8 in the printed circuit board 5. Specifically, the tip of the soldering iron 20 is located at a position of several millimeters directly above the target through hole 8. The head unit 2 is transported at a high speed to the vicinity of the soldering position, is transported at a low speed from the vicinity of the soldering position to the soldering position, the soldering iron 20 is brought into contact with the printed circuit board 5, and the soldering is completed. The soldering iron 20 is separated from the printed board 5 by being conveyed at low speed to the vicinity of the soldering position.

  At this time, the control means 50 controls the upper valve 30a and the lower valve 30b so that the head unit 2 is in a floating state, and controls the air pressure on the cylinder upper side and the cylinder lower side of the air cylinder 30, respectively.

  That is, the air pressure on the lower side of the air cylinder 30 is controlled to be higher than the upper side of the cylinder, and a pulling force against the weight is applied to the lifting block 32 and the head unit 2. For example, by controlling the air pressure so that 90% of the weight of the head unit 2 and the lifting block 32 is applied, the head unit 2 and the lifting block 32 are pulled upward, and the head unit 2 and the lifting block 32 seem to have their own weight. The load is 10%.

  In this state, the floating unit 3 and the head unit 2 are lowered by low-speed conveyance from the vicinity of the soldering position to the soldering position, and soldering is performed by bringing the soldering iron 20 and the printed circuit board 5 into contact with each other. At this time, the floating unit 3 is lowered and the tip of the soldering iron 20 comes into contact with the surface of the printed circuit board 5. Further, when the floating unit 3 is slightly lowered, the height position of the head unit 2 does not change, and the elevating block 32 rises relative to the casing 34 along the guide bar. Then, only 10% of the weight of the head unit 2 and the lifting block 32 is applied to the printed circuit board 5. Thus, by not pressing the printed circuit board 5 with a force more than necessary, damage to the printed circuit board 5 and the soldering iron 20 can be prevented.

  By conveying the floating unit 3 and the head unit 2 at high speed from the initial position to the vicinity of the soldering position, the tact time can be shortened. In addition, by conveying at a low speed from the vicinity of the soldering position to the soldering position, for example, even if there is some variation in the position of the printed circuit board 5, it prevents sudden interference between the printed circuit board 5 and the tip of the soldering iron 20. This prevents the printed circuit board 5, the soldering iron 20, electronic parts from being damaged and other troubles.

  The initial position is a standby position of the head unit 2, for example. Alternatively, in the case of the second and subsequent soldering to the printed circuit board 5, the position where the previous soldering is completed may be positioned as the initial position and controlled.

  The control means 50 controls the upper valve 30a that controls the air pressure on the upper side of the air cylinder 30. Similarly, the lower valve 30b that controls the air pressure above the cylinder of the air cylinder 30 is controlled. Thus, the air pressure on the upper and lower cylinders of the air cylinder 30 is controlled by controlling the upper valve 30a and the lower valve 30b, and the direction and strength of the force applied to the lifting block 32 via the cylinder rod 38 are controlled. Control.

  Thereby, the control means 50 controls the air cylinder 30 so that the head unit 2 is locked at the lower end position when the floating unit 3 is conveyed from the initial position to the vicinity of the soldering position by the conveying unit 4.

  That is, when high-speed conveyance is performed at the first conveyance speed, the air pressure on the cylinder upper side of the air cylinder 30 is made higher than that in the floating state, or conversely, the air pressure on the cylinder lower side is made lower than in the floating state. Thereby, the force which pulls the head unit 2 and the raising / lowering block 32 upward becomes weak or disappears, and in some cases, a force to push down is applied. By doing so, the head unit 2 can be locked at the lower end position.

  As described above, when the head unit 2 is locked at the lower end position during high-speed conveyance at the first conveyance speed, rattling during high-speed conveyance is prevented, and wear and damage of components are prevented.

  Further, the control means 50 obtains information on the height position of the elevating block 32 detected by the sensor 35, and the height position of the head unit 2 detected by the sensor 35 is within a predetermined appropriate range. If it is out of the aptitude range, an abnormality is recognized. If an abnormality is recognized, an alarm is issued to notify the abnormality, and the transport unit 4 is controlled to return the head unit 2 to the standby position.

  Specifically, when the floating unit 3 is transported to the soldering position, it is determined whether the height position of the head unit 2 detected by the sensor 35 is within a predetermined appropriate range or out of the appropriate range. Thus, it is possible to detect an abnormality in the state of the soldering iron 20 and the height position of the printed circuit board 5 during soldering. Further, when the floating unit 3 is brought into the floating state, it is determined whether the height position of the head unit 2 detected by the sensor 35 is within a predetermined appropriate range or out of the appropriate range. An abnormality in the height position of the head unit 2 can be detected. Further, when the floating unit 3 is locked, it is determined whether the height position of the head unit 2 detected by the sensor 35 is within a predetermined appropriate range or out of the appropriate range. An abnormality in the height position of the head unit 2 can be detected.

  By doing so, at the time of soldering, for example, the printed circuit board 5 is not supplied, the printed circuit board 5 is not set at a normal position, the positions of the soldering iron 20 and the conductor 6 are shifted, Abnormalities such as damage on the soldering iron 20 side, the head unit 2 not being transported to a normal position, and the like are detected based on an abnormality in the height position of the head unit 2, and troubles occur beforehand. It comes to prevent.

  The soldering apparatus 1 according to the present embodiment can transport in a stable state since the head unit 2 is locked at the lower end position when the floating unit 3 on which the soldering iron 20 is mounted is transported. In particular, since the conveyance from the initial position to the vicinity of the soldering position is performed as fast as possible in order to shorten the tact time, it is extremely effective to stabilize the head unit 2 in the locked state. By doing so, it is possible to reduce wear of parts and prevent early damage, stabilize accuracy, and improve reliability. Further, since the air pressure is used to make the floating state, even if the height position of the printed circuit board 5 changes, the pressing force of the soldering iron 20 against the printed circuit board 5 during soldering becomes constant. Therefore, it is possible to prevent the conventional solder failure due to insufficient pressing force and damage due to excessive pressing force.

Further, the control means 50 transports the floating unit 3 from the initial position to the vicinity of the soldering position at a relatively high first transport speed, and relatively slowly from the vicinity of the soldering position to the soldering position. In order to control the transport unit 4 to transport at the second transport speed,
There was a problem in the state of the soldering iron 20 and the board position by reducing the tact time by moving the soldering position from the initial position to the vicinity of the soldering position and reducing the tact time. Sometimes troubles such as damage due to sudden interference between the soldering iron 20 and the printed circuit board 5 are prevented.

The floating unit 3 is provided with a sensor 35 for detecting the height position of the head unit 2, and the control means 50 is such that the height position of the head unit 2 detected by the sensor 35 is out of a predetermined appropriate range. Sometimes to recognize anomalies,
When there is a defect in the state of the soldering iron 20, the board position, the lock position, the floating height, etc., the height position of the head unit 2 is outside the predetermined appropriate range and is recognized as abnormal. Prevents troubles from occurring due to continuous operation.

1: Soldering device 2: Head unit 3: Floating unit 4: Transport unit 5: Printed circuit board 6: Conductor 7: Electronic component 8: Through hole 9: Guide tube 10: Cutting mechanism 11: Receiving blade 11a: Supply hole 11c: Discharge hole 12: Cutting blade 12a: Holding hole 13: Motor 14: Feed roller 15: Cutting gear 16: Cutting plate 20: Soldering iron 21: Yarn solder 22: Reel 30: Air cylinder 30a: Upper valve 30b: Lower valve 31: Guide mechanism 32: Elevating block 33: Guide bar 34: Casing 35: Sensor 36: Support member 37: Through hole 38: Cylinder rod 39: Pump 41: Z direction transport unit 41a: Z direction drive motor 42: X direction transport Part 42a: X-direction drive motor 43: Y-direction transport part 43a: Y-direction drive motor 44: Ball screw 45: Support Material 46: elevating unit 50: Control unit

Claims (3)

A head unit on which a cylindrical soldering iron is mounted, a floating unit that is brought into a floating state by applying a force against its own weight to the head unit, and a transport unit that transports the floating unit at least vertically And
The floating unit is configured to include an air cylinder to float the head unit pneumatically, a guide mechanism for guiding the vertical movement of the head unit within a predetermined height range,
The head unit locked by the floating unit is transported to the vicinity of the soldering position by the transport unit, and the head unit floated by the floating unit is lowered from the vicinity of the soldering position to the soldering position by the transport unit. A soldering apparatus, further comprising control means for controlling the air cylinder so as to press the tip of the cylindrical soldering iron around the through hole on the substrate . In the above soldering position,
2. The tip of the cylindrical soldering iron is pressed around the through-hole in a state where the conducting wire that has passed through the through-hole has entered the hollow path of the cylindrical soldering iron . Soldering device. The floating unit comprises a sensor for detecting the height position of the head unit,
It said control means, soldering apparatus recognizes claims 1 or 2 wherein the abnormality when the height position of the head unit in which the sensor detects is out of the predetermined proper range.

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