JP6124352B2 - Laser type soldering apparatus and soldering method - Google Patents

Description

  The present invention relates to a technique for soldering electronic components such as semiconductor chips using laser light and linear solder.

  A laser-type soldering apparatus that uses laser light and linear solder to solder an electronic component such as a semiconductor chip mounted on a printed circuit board is known as described in, for example, Patent Document 1.

  This soldering apparatus projects laser light from a laser head attached to an arm of an automatic soldering robot toward a portion (soldering point) to be soldered between a printed circuit board and an electronic component, and to the laser head. A linear solder is supplied from an attached solder nozzle, and the linear solder is melted and soldered by the laser beam. When the soldering apparatus is used to solder a plurality of soldering points, the laser head is used. Is moved to the first soldering point, laser light is projected from the laser head onto the soldering point to preheat the soldering point, and then the linear solder from the solder nozzle to the soldering point is performed. To melt the solder with the laser beam. The first soldering point is soldered by post-heating and trimming, then the laser head is moved to the second soldering point, and the above-described steps are performed. The same process is repeated for the second and subsequent soldering points.

  As described above, the conventional laser soldering apparatus moves the laser head to the positions of a plurality of soldering points in order to perform soldering. Therefore, in order to increase the soldering speed, It is essential to shorten the moving time of the laser head.

  However, since the movement of the laser head is performed by an actuator such as an electric motor, a certain response time is required, and since there is a limit to shortening the response time, the movement time of the laser head is shortened. However, there was a limit naturally. In addition, the laser head is heavy, and the weight is further increased by integrally attaching the solder nozzle, and this is also an obstacle to shortening the moving time of the laser head.

Japanese Patent Laid-Open No. 2002-1521

  An object of the present invention is to increase the speed of soldering by enabling a plurality of soldering points to be soldered in order without moving the laser head.

In order to solve the above-mentioned problems, a laser soldering apparatus according to the present invention supplies a laser projection apparatus for sequentially projecting laser beams to a plurality of soldering points, and linear solder is sequentially supplied to the plurality of soldering points. A solder supply device, and the laser projection device adjusts the angle of the deflection mirror capable of adjusting the angle for deflecting the laser light from the laser oscillator in accordance with the positions of the plurality of soldering points, and the angle of the deflection mirror. A servo motor; and a condensing lens that projects the laser light deflected by the deflecting mirror onto the soldering point, and sequentially directs the laser light to the plurality of soldering points while remaining stationary at a fixed position. configured to project the said solder supply apparatus, a solder nozzle for supplying a linear solder to the soldering point A nozzle support mechanism for movably supporting the solder nozzle relative to the laser projection device, and a nozzle drive mechanism for driving the nozzle support mechanism to sequentially move the solder nozzles to the positions of the plurality of soldering points. possess the door, when projecting the laser light into a plurality of soldering points remain the laser projection device is stationary at a fixed position, by displacement relative to the laser projection device, the plurality of soldering points The linear solder is configured to be supplied in order .

In the present invention, it is desirable that the solder nozzle is movable in at least the X-axis direction or the Y-axis direction among the X-axis, Y-axis, and Z-axis directions with respect to the laser projection device.
More preferably, the solder nozzle is movable in both the X-axis direction and the Y-axis direction with respect to the laser projection device, and the nozzle support mechanism is attached to a base member fixed to the housing of the laser projection device. A first support member supported to be movable in the axial direction or the Y-axis direction, and a second support member supported to be movable in the Y-axis direction or the X-axis direction to the first support member. The solder nozzle is supported by a second support member via a third support member, and the nozzle drive mechanism includes a first drive mechanism for driving the first support member and a second drive for driving the second support member. And a drive mechanism.

  In this case, the first drive mechanism is meshed with the first screw shaft, the first screw shaft provided on the base member, the first electric motor that rotationally drives the first screw shaft, and the first support shaft. A first nut member coupled to the member, and the second drive mechanism includes a second screw shaft provided on the first support member and a second electric motor that rotationally drives the second screw shaft; And a second nut member engaged with the second screw shaft and connected to the second support member.

  In the present invention, the solder nozzle may be supported by the second support member via a third support member, and the third support member may be driven in the Z-axis direction by a third drive mechanism. . This third drive mechanism can be constituted by a fluid pressure cylinder.

The condensing lens used in the present invention is preferably an Fθ lens.
In the present invention, the laser projection device may include a CCD camera, and the CCD camera may be configured to capture an image of the soldering point through the deflection mirror and a condenser lens.

According to the present invention, as a first soldering method for soldering a plurality of soldering points of an electronic component mounted on a printed circuit board, the laser projection device projects laser light onto the plurality of soldering points. A nozzle moving step of moving the solder nozzle to a first soldering point while still standing at a position for the laser; projecting laser light from the laser projection device to the first soldering point; A preheating step of preheating the attachment point; supplying a certain amount of linear solder from the solder nozzle to the first soldering point, and projecting laser light from the laser projection device; A solder melting step for melting linear solder; continuing from the laser projection device to the first soldering point; A post-heating step in which the molten solder is post-heated and arranged by projecting a laser beam; a nozzle moving step in which the solder nozzle is moved to a second soldering point during the post-heating step; After finishing, the laser beam is deflected by adjusting the angle of the deflecting mirror in the laser projection device, and the laser beam is projected onto the second soldering point to set the second soldering point. A preheating step for preheating; performing the solder melting step and the post-heating step for the second soldering point; hereinafter, each step for the soldering points after the third soldering point By repeating the above, the plurality of soldering points are soldered in order. The law is provided.

  Further, as a second soldering method for soldering a plurality of soldering points of a plurality of electronic components mounted on a printed circuit board, the plurality of electronic components solder the soldering points using linear solder. When the first electronic component includes a second electronic component supplied in advance with a solder body made of cream solder or ball solder at the soldering point, for the first electronic component, Soldering is performed by the method according to claim 9, and the laser beam is applied from the laser projection device to the soldering point to which the solder body is supplied to the second electronic component. The laser type solder is characterized in that the solder body is melted with the laser beam by performing deflection and projecting with a reflow soldering With a method is provided.

  According to the present invention, the laser beam is deflected in accordance with the position of the plurality of soldering points by the angle-adjustable deflection mirror, and is projected onto the plurality of soldering points in order, and only the solder nozzles are provided to the plurality of the soldering points. Therefore, it is possible to increase the soldering speed as compared with the conventional apparatus that performs soldering while moving the entire laser head provided with the solder nozzle.

It is a partial fracture side view showing roughly one embodiment of the soldering device concerning the present invention. FIG. 2 is a partially broken plan view of FIG. 1. It is a side view similar to FIG. 1 of the state which moved the solder nozzle. FIG. 4 is a plan view of FIG. 3. It is principal part sectional drawing of FIG. It is an optical path figure of the said soldering apparatus. It is a schematic diagram of the principal part which shows the method of soldering with the said soldering apparatus. It is a side view which shows the example of the soldering object which can be soldered with the said soldering apparatus. It is a top view of FIG.

  1 to 4 show an embodiment of a laser soldering apparatus according to the present invention. This soldering apparatus includes a laser projection apparatus 1 that sequentially projects laser light 3 onto a plurality of soldering points P (see FIGS. 6 and 7), and linear solder 4 that is disposed on the plurality of soldering points P in order. And a solder supply device 2 for supplying.

  As can be seen from FIG. 6, the laser projection apparatus 1 deflects the laser light 3 incident from the laser oscillator by deflection mirrors (galvanomirrors) 5, 6, and passes through the condenser lens 7 to a plurality of soldering points P. It projects in turn and is configured as follows.

  That is, the laser projection apparatus 1 has a housing 10 having a square box shape, and a galvano scanner mechanism 11 is built in the housing 10 and faces the soldering point P of the housing 10. The condensing lens 7 is disposed on the opposing surface (lower surface).

  The galvano scanner mechanism 11 includes a first deflecting mirror 5 that is arranged to be rotatable about a first axis L1, and a second axis L2 that is arranged to be rotatable about a second axis L2 orthogonal to the first axis L1. Two deflection mirrors 6, a first servo motor 12 connected to the rotation shaft 5 a of the first deflection mirror 5 to adjust the direction, that is, the deflection angle of the first deflection mirror 5, and the second deflection. And a second servo motor 13 which is connected to the rotation shaft 6a of the mirror 6 and adjusts the direction of the second deflection mirror 6, that is, the deflection angle. Connected to the control device. The control device automatically controls the entire soldering device including the solder supply device 2 described later in accordance with a set program.

A collimating optical unit is attached to one side surface of the housing 10. The collimating optical unit is an optical system for converting a laser beam 3 that is spread from a laser oscillator through an optical fiber 15 into parallel light, and is a unit case connected to the side surface of the housing 10. 16, a connector 17 for connecting the optical fiber 15 is provided on one side surface of the unit case 16, and the laser light 3 incident from the optical fiber 15 is different by 90 degrees inside the unit case 16. A semi-transparent mirror 18 that reflects in the direction and a conversion lens 19 that converts the laser light 3 reflected by the semi-transparent mirror 18 into parallel light are provided. The conversion lens 19 converts the laser light 3 into parallel light, The light is projected toward the first deflection mirror 5.
The semi-transparent mirror 18 has a property of totally reflecting the laser beam 3 but transmitting other light, that is, visible light.

  As shown in FIG. 6, the laser light 3 projected from the conversion lens 19 toward the first deflection mirror 5 is reflected sideways by the first deflection mirror 5 to be reflected by the second deflection mirror 6. Then, the light is reflected downward by the second deflecting mirror 6, enters the condenser lens 7, and is projected to the soldering point P through the condenser lens 7 in a condensed state. At this time, the two deflecting mirrors 5 and 6 are rotated by the servo motors 12 and 13, respectively, to change the direction (deflection angle) of each of the changing mirrors 5 and 6, and the laser beam 3 is applied to a plurality of soldering points P. By scanning along, it is possible to perform soldering by projecting the laser beam 3 to each soldering point P in order.

  As the condenser lens 7, an Fθ lens is preferably used. This Fθ lens is a lens designed so that the scanning speed is constant between the lens periphery and the center by changing the curvature of the two lens surfaces. The Fθ lens includes a telecentric Fθ lens that forms an image at a point parallel to the optical axis and a normal Fθ lens that forms an image at a position corresponding to an incident angle. In the illustrated example, the telecentric Fθ lens is used. Has been.

  As described above, when the laser beam 3 is scanned along a plurality of soldering points P, the laser beam is directed toward the next soldering point P after the soldering of one soldering point P is completed. When moving 3, it may be necessary to prevent the laser beam 3 from being projected to a place other than the soldering point P. In such a case, the projection of the laser beam 3 is interrupted, or a shutter that opens and closes the optical path is provided at an appropriate position in the optical path, for example, the collimating optical unit, and the optical path is closed by the shutter. Thus, the laser beam can be blocked. However, if the problem of burning does not occur even when the laser beam 3 is projected onto a substrate or an electronic component, it is not always necessary to interrupt the projection of the laser beam 3 or to block the optical path with a shutter.

  Further, while the plurality of soldering points P are being soldered one after another, the housing 10 is moved to one of the plurality of soldering points P one after another while remaining stationary at a certain position. There is no.

  A CCD camera 20 is attached to the side surface of the unit case 16, and the CCD camera 20 transfers the image of the soldering point P to the condenser lens 7, the two deflecting mirrors 5 and 6, the conversion lens 19, and the like. An image can be taken through the semi-transparent mirror 18. For this reason, the CCD camera 20 is arranged in a state in which the optical axis for imaging coincides with the optical axis L0 of the laser light 3 from the semi-transparent mirror 18 through the conversion lens 19 to the first deflecting mirror 5. It is installed.

  The image of the soldering point P imaged by the CCD camera 20 is displayed on a monitor (not shown). For example, in the teaching stage before soldering, the laser beam 3 with respect to the soldering point P is observed while viewing this image. It is used for positioning the projection position, or used for monitoring the state of the soldering point P during soldering.

  The solder supply device 2 includes a solder nozzle 23 for supplying the linear solder 4 to the soldering point P, a solder supply source 24 for supplying the linear solder 4 to the solder nozzle 23, and the solder nozzle 23 with the X axis. , Y-axis, Z-axis movably supported nozzle support mechanism 25, and nozzle drive mechanism for driving the nozzle support mechanism 25 to move the solder nozzles 23 to the plurality of soldering points P in order. Mechanism.

  A flexible solder feed tube 28 made of a synthetic resin extending from the solder supply source 24 is connected to the solder nozzle 23, and the linear solder 4 fed into the solder nozzle 23 through the solder feed tube 28 is The solder nozzle 23 is supplied toward the soldering point P from a small-diameter nozzle port 23a at the tip.

  The solder supply source 24 is attached to an appropriate position of the housing 10 and includes a reel on which the linear solder 4 is wound, and a feed roller that intermittently feeds the linear solder 4 from the reel by a predetermined amount. The linear solder 4 fed by the feed roller is supplied to the solder nozzle 23 by a necessary amount through a solder feed tube 28 connected to the solder nozzle 23. Since the configuration of the supply source 24 is known, the illustration thereof is omitted.

  The nozzle support mechanism 25 includes a base member 31 that is horizontally fixed to the housing 10 of the laser projection apparatus 1 via a support plate 30, and an X-axis direction (housing for the base member 31 via a first drive mechanism 36. A first support member 32 supported so as to be able to reciprocate in a direction in which the first support member 32 moves toward and away from the first support member 32, and a Y-axis direction (a direction parallel to the side surface of the housing) via the second drive mechanism 37. A second support member 33 supported so as to be reciprocally movable, and a third support member 34 supported by the second support member 33 so as to be capable of reciprocating in the Z-axis direction (vertical direction) via a third drive mechanism 38; The solder nozzle 23 is supported by the third support member 34 via a support arm 35.

  The base member 31 is elongated in the X-axis direction, and a first screw shaft 36a extending in the X-axis direction is rotatably supported by bearing portions 31a and 31b formed in the base member 31. A first electric motor 36b that rotates the first screw shaft 36a in the forward and reverse directions is provided at the tip of the base member 31, and a first nut member 36c meshes with the first screw shaft 36a. A 1 nut member 36 c is connected to the first support member 32. Then, by rotating the first screw shaft 36a forward and backward by the first electric motor 36b, the first nut member 36c reciprocates along the first screw shaft 36a, thereby the first support. The member 32 is driven to reciprocate in the X axis direction. Accordingly, the first screw shaft 36a, the first electric motor 36b, and the first nut member 36c constitute the first drive mechanism 36.

  The first support member 32 has a first portion 32a elongated in the X-axis direction along the base member 31, and a second portion 32b elongated in the Y-axis direction. The second portion A second screw shaft 37a extending in the Y-axis direction is rotatably supported by bearing portions 32c and 32d formed in 32b, and the second screw shaft 37a is forward and reverse at one end of the second portion 32b. A second electric motor 37b that rotates in a direction is provided. A second nut member 37c is engaged with the second screw shaft 37a, and the second nut member 37c is connected to the second support member 33. Then, by rotating the second screw shaft 37a forward and backward by the second electric motor 37b, the second nut member 37c reciprocates along the second screw shaft 37a, thereby the second support. The member 33 is driven to reciprocate in the Y axis direction. Accordingly, the second screw shaft 37a, the second electric motor 37b, and the second nut member 37c constitute the second drive mechanism 37.

The screw shafts 36a and 37a and the nut members 36c and 37c are preferably of a ball screw type in which a ball is rotatably interposed between the screw shaft and the nut member.
Stepping motors can be suitably used as the first and second electric motors 36b and 37b.

  A support frame 40 is fixed to the lower surface of the second support member 33, a fluid pressure cylinder 41 is attached to one end of the support frame 40, and a lower end of a rod 41 a protruding downward from the fluid pressure cylinder 41 is A vertical flange portion 34a of the third support member 34 having a letter shape is connected via a connection fitting 42, and the third support member 34 is driven to reciprocate in the Z-axis direction (vertical direction) by expansion and contraction of the rod 41a. It has become. Therefore, the fluid pressure cylinder 41 constitutes the third drive mechanism 38.

  The third drive mechanism 38 moves the solder nozzle 23 to another soldering area when soldering is not performed, when soldering is completed, or after soldering of one soldering area is completed. When the solder nozzle 23 is moved to the standby position by raising the third support member 34 to perform soldering at the soldering point, as shown in FIG. As shown in FIG. 3, the third support member 34 is lowered and moved to the soldering position.

  However, the third driving mechanism 38 can also adjust the height of the solder nozzle 23 in accordance with the height of the soldering point when soldering the plurality of soldering points P sequentially. It can also be used to move the nozzle 23 up and down.

  The rod 41a and the coupling fitting 42 are coupled so as to be relatively displaceable in the axial direction of the rod 41a. That is, as shown in FIG. 5, the end of the rod 41a is inserted into the connection hole 42a of the connection fitting 42 in a loosely inserted state, and is locked to the lower surface of the connection fitting 42 at the tip of the rod 41a. A locking member 43 is attached, and a coil spring 45 is interposed in a compressed state between the upper surface of the connection fitting 42 and a spring receiver 44 attached to the rod 41a. 42 is elastically pressed against the locking member 43, so that the rod 41a and the coupling fitting 42 are connected so as to be relatively displaceable. Thereby, the third support member 34 can be displaced upward with respect to the rod 41a when an acting force by a nozzle height adjusting mechanism 46, which will be described later, acts upward on the third support member 34.

  Two guide shafts 47 are fixed vertically and parallel to the support frame 40, and a slider 48 is slidably fitted to the guide shaft 47, and the slider 48 is connected to the third support member 49 by a connecting member 49. By being connected to 34, the vertical movement of the third support member 34 is guided by the guide shaft 47.

  The support frame 40 is provided with the nozzle height adjusting mechanism 46 for moving the solder nozzle 23 up and down in the Z-axis direction with a small stroke. The nozzle height adjusting mechanism 46 adjusts the height of the solder nozzle 23 in accordance with the height of the soldering points when soldering a plurality of soldering points P sequentially. The cam 50 is attached to a rotating shaft of a cam drive motor 52 fixed to the support frame 40, and the cam receiver 51 is attached to the connecting member 49. Then, when the cam 50 is rotated by a necessary angle by the cam drive motor 52, the cam receiver 51 moves up and down by contact with the cam 50, and accordingly, the third support member 34 moves up and down. The solder nozzle 23 is configured to move up and down.

  When the third support member 34 is raised and the solder nozzle 23 is in the standby position, the cam receiver 51 is also lifted away from the cam 50, so that even if the cam 50 is rotated by the cam drive motor 52, the solder is not soldered. The nozzle 23 does not move up and down.

  The support arm 35 is attached to the tip of the horizontal flange 34b of the third support member 34 so that the inclination angle can be adjusted around the attachment shaft 35a, and the solder nozzle 23 is attached to the tip of the support arm 35. The inclination angle can be adjusted around the attachment shaft 35b.

  The operation of moving the solder nozzle 23 by the nozzle support mechanism 25 is performed by controlling the first, second, and third drive mechanisms 36, 37, and 38 and the nozzle height adjusting mechanism 46 by the controller. The second and third support members 32, 33, and 34 are moved in the X, Y, and Z-axis directions so as to be performed in conjunction with the projection of the laser beam 3 by the laser projection device 1. .

  For example, when the solder nozzle 23 is not soldered, the rod 41a of the fluid pressure cylinder 41 constituting the third drive mechanism 38 is shortened as shown in FIG. Rises to occupy the standby position, and during soldering, the rod 41a of the fluid pressure cylinder 41 is lowered to the soldering position as shown in FIG. Then, by moving in the X-axis direction and the Y-axis direction by the first drive mechanism 36 and the second drive mechanism 37, it is sequentially sent to the positions of a plurality of soldering points P, and to each soldering point P, The linear solder 4 is supplied in conjunction with the projection of the laser beam 3 by the laser projection device 1, and soldering is performed. Further, when the solder nozzle 23 is moved, the height of the solder nozzle 23 is adjusted by the nozzle height adjusting mechanism 46 according to the height of the soldering point P or the like.

Instead of using the screw shafts 36a and 37a and the nut members 36c and 37c as a device for movably supporting the first and second support members 32 and 33, a linear unit composed of a rail and a slider is used. A slide device may be used. In this case, air cylinders are used as the first and second drive mechanisms 36 and 37 in place of the electric motors 36b and 37b.
Further, the first and second support members 32 and 33 do not necessarily need to be supported up and down in the order described above, and the order may be changed. In that case, the solder nozzle 23 is supported by the lower support member via the third support member 34.

  An example of a method for soldering a plurality of soldering points P of an electronic component mounted on a printed board using the soldering apparatus having the above-described configuration will be described. The method described below is automatically performed according to a program previously input to the control device.

  As shown in FIG. 7, first, the solder nozzle 23 is moved to the position of the point P1 (first soldering point) to be soldered first among the plurality of soldering points P1 to Pn by the nozzle driving mechanism. Then, a nozzle moving step waiting at that position is performed.

  Next, in the laser projection apparatus 1, the first and second servo motors 12 and 13 adjust the deflection angle of one or both of the first and second deflection mirrors 5 and 6, thereby The laser beam 3 is projected toward one soldering point P1, and a preheating process for preheating the first soldering point P1 for a predetermined time is performed. The time required for this preheating process varies depending on the amount of heat of the laser beam 3 and the type of soldering point P, but is usually a very short time such as a fraction of a second or a few tens of seconds. It is.

  After the preheating step is finished, a certain amount of linear solder 4 necessary for soldering the soldering point P1 is supplied from the solder nozzle 23 to the first soldering point P1, By continuously projecting the laser beam 3 from the laser projection device 1, a solder melting process for melting the linear solder 4 with the laser beam 3 is performed.

  After the linear solder 4 is melted, a laser beam 3 is continuously projected from the laser projection device 1 to the first soldering point P1, and a post-heating process is performed in which the melted solder is post-heated and arranged. Is called. The time required for the post-heating step is usually a very short time of about a fraction of a second or about several tens of seconds as in the case of the preheating step.

  Then, during the post-heating step, the solder nozzle 23 moves to the next soldering point P2 (second soldering point), and a nozzle moving step for waiting there is performed.

  On the other hand, in the laser projection apparatus 1, when the post-heating of the first soldering point P1 is finished and the soldering of the first soldering point P1 is finished, the first and second servo motors 12 are used. , 13 adjusts the deflection angle of one or both of the first and second deflecting mirrors 5, 6 and projects the laser beam 3 toward the second soldering point P2, whereby the second The preheating process for the soldering point P2 is performed.

  Then, the solder melting step and the post-heating step are sequentially performed on the second soldering point P2, whereby the second soldering point P2 is soldered. Hereinafter, the third soldering is performed. By repeating the steps described above for the soldering points after the point P3, the plurality of soldering points P1-Pn are soldered in order.

  When the number of the soldering points is large, the soldering points are divided into a plurality of regions, and soldering is performed on the soldering points in one region by the method described above, and then the laser projection device 1 and the solder supply Move the apparatus 2 to the next area, or move the soldering target (substrate, etc.) and solder the soldering points in the new area repeatedly for all areas. You can do it.

  In the case where a plurality of electronic components are mounted on the printed circuit board, the electronic components may be soldered one by one by the above method. For example, for the plurality of electronic components arranged in a row, The soldering points of a plurality of electronic components can be soldered together, such as soldering one terminal row by the above method and then soldering the other terminal row.

  8 and 9, as a plurality of electronic components mounted on a printed circuit board 55, an electronic component 56 that is soldered using linear solder 4 and an electronic component that is reflow-type soldered When 57 is mixed, these electronic components 56 and 57 can be soldered as follows.

  That is, for the electronic component (first electronic component) 56 to be soldered using the linear solder 4, the solder supply is sequentially performed with respect to each soldering point (terminal) P as described above. The linear solder 4 is supplied from the apparatus 2, and the laser light 3 is deflected by the changing mirror and projected from the laser projection apparatus 1, thereby melting the linear solder 4 with the laser light 3 and soldering. To do.

  On the other hand, the electronic component (second electronic component) 57 that performs reflow soldering is an electronic component in which a solder body 58 made of cream solder or ball solder is applied or adhered to each soldering point P in advance. For this second electronic component 57, the laser projection device 1 changes the direction of the deflecting mirrors 5 and 6 to operate the solder light supply device 2 without operating the solder supply device 2. By scanning along the soldering points P, the laser light 3 is projected onto each soldering point P in order, and the linear solder 4 is melted to perform reflow soldering.

  In this case, the first electronic component 56 and the second electronic component 57 may be soldered one by one, but one or more soldering points P of the first electronic component 56 are soldered. And soldering the first electronic component 5 and the second electronic component 57 together, such as by soldering one or more soldering points P of the second electronic component 57. You can also.

In the illustrated embodiment, the two deflection mirrors 5 and 6 are used. However, the number of the deflection mirrors 5 and 6 may be one, or may be three or more.
Further, the solder nozzle 23 can be configured to be displaceable also in the rotation direction around the Z axis, that is, in the θ direction.

  Furthermore, in the embodiment, the first support member 32 of the nozzle support mechanism 25 is supported by the base member 31 so as to be movable in the X-axis direction, and the second support member 33 is supported by the first support member 32 in the Y-axis direction. The first support member 32 is supported by the base member 31 so as to be movable in the Y-axis direction, and the second support member 33 is moved by the first support member 32 in the X-axis direction. It may be supported as possible.

Further, the solder nozzle 23 can be moved in the three directions of the X axis, the Y axis, and the Z axis. However, when it is not necessary to raise the solder nozzle 23 to the standby position, the solder nozzle 23 is moved to the Z direction. The third drive mechanism 38 that drives in the axial direction can be omitted. In this case, the second support member 33 and the third support member 34 connect the rod 41a of the air cylinder 41 and the connection fitting 42 so that the nozzle height adjusting mechanism 46 can function. It is connected so as to be relatively displaceable by a connecting mechanism similar to the connecting mechanism.
However, even if the height of the solder nozzle 23 is not adjusted, it can be dealt with by adjusting the protruding amount of the linear solder 4, or the soldering target (substrate) side can be displaced in the Z-axis direction. In this case, the nozzle height adjusting mechanism 46 can be omitted.
Furthermore, in an apparatus for soldering a plurality of soldering points arranged in only the X-axis direction or only in the Y-axis direction, the solder nozzle 23 is configured to be movable only in the X-axis direction or only in the Y-axis direction. You can also.

DESCRIPTION OF SYMBOLS 1 Laser projection apparatus 2 Solder supply apparatus 3 Laser beam 4 Linear solder 5,6 Deflection mirror 7 Condensing lens 10 Housing 12, 13 Servo motor 20 CCD camera 23 Solder nozzle 25 Nozzle support mechanism 31 Base member 32 First support member 33 The second support member 34 The third support member 36 The first drive mechanism 36a The first screw shaft 36b The first electric motor 36c The first nut member 37 The second drive mechanism 37a The second screw shaft 37b The second electric motor 37c The second nut member 38 Third drive mechanism 41 Fluid pressure cylinder 55 Printed circuit board 56, 57 Electronic component 58 Solder body P, P1, P2, P3, Pn Soldering point

Claims (10)

A laser projection device that sequentially projects laser light to a plurality of soldering points; and a solder supply device that sequentially supplies linear solder to the plurality of soldering points,
The laser projection device includes a deflection mirror capable of adjusting an angle for deflecting laser light from a laser oscillator in accordance with positions of the plurality of soldering points, a servo motor for adjusting the angle of the deflection mirror, and the deflection mirror. A condensing lens that projects the deflected laser light onto the soldering point, and is configured to sequentially project the laser light onto the plurality of soldering points while remaining stationary at a certain position.
The solder supply device includes a solder nozzle that supplies linear solder to the soldering point, a nozzle support mechanism that supports the solder nozzle so as to be movable with respect to the laser projection device, and drives the nozzle support mechanism. when the have a nozzle driving mechanism for moving sequentially solder nozzle positions of the plurality of soldering points, for projecting laser light into a plurality of soldering points remain the laser projection device is stationary at a fixed position The linear solder is sequentially supplied to the plurality of soldering points by being displaced with respect to the laser projection device.
Laser soldering device characterized by that.   2. The soldering apparatus according to claim 1, wherein the solder nozzle is movable in at least the X-axis direction or the Y-axis direction among the X-axis, Y-axis, and Z-axis directions with respect to the laser projection apparatus. . The solder nozzle is movable in both the X-axis direction and the Y-axis direction with respect to the laser projection device,
The nozzle support mechanism includes a first support member supported by a base member fixed to the housing of the laser projection device so as to be movable in the X-axis direction or the Y-axis direction, and the first support member in the Y-axis direction or X-axis. A second support member supported so as to be movable in the axial direction, and the solder nozzle is supported by the second support member,
The nozzle drive mechanism includes a first drive mechanism that drives the first support member, and a second drive mechanism that drives the second support member.
The soldering apparatus according to claim 2.   The first drive mechanism is coupled to the first support member by meshing with the first screw shaft, a first electric motor that rotates the first screw shaft provided on the base member, and the first screw shaft. The second drive mechanism includes a second screw shaft provided on the first support member, a second electric motor that rotationally drives the second screw shaft, and the second The soldering apparatus according to claim 3, comprising a second nut member meshed with a screw shaft and connected to the second support member.   The solder nozzle is supported by the second support member via a third support member, and the third support member is driven in the Z-axis direction by a third drive mechanism. Or the soldering apparatus of 4.   The soldering apparatus according to claim 5, wherein the third driving mechanism includes a fluid pressure cylinder.   The soldering apparatus according to claim 1, wherein the condenser lens is an Fθ lens.   The laser projection apparatus includes a CCD camera, and the CCD camera is configured to take an image of the soldering point through the deflection mirror and a condenser lens. The soldering apparatus of a crab. A method of soldering a plurality of soldering points of an electronic component mounted on a printed circuit board using the soldering apparatus according to claim 1,
A nozzle moving step of moving the solder nozzle to the first soldering point while keeping the laser projection device stationary at positions for projecting laser light onto a plurality of soldering points ;
A preheating step of projecting laser light from the laser projection device onto the first soldering point to preheat the first soldering point;
Solder melting for supplying a certain amount of linear solder from the solder nozzle to the first soldering point and projecting the laser light from the laser projection device to melt the linear solder with the laser light Process;
A post-heating step of post-heating and adjusting the molten solder by projecting laser light from the laser projection device to the first soldering point;
A nozzle moving step of moving the solder nozzle to a second soldering point during the post-heating step;
After the post-heating is finished, the laser beam is deflected by adjusting an angle of the deflection mirror in the laser projection device, and the laser beam is projected onto the second soldering point, and the second laser beam is projected. Preheating process to preheat soldering points;
And performing the solder melting step and the post-heating step on the second soldering point, and then repeating the above steps on the soldering point after the third soldering point, A laser soldering method, wherein the plurality of soldering points are soldered in order. A method for soldering a plurality of soldering points of a plurality of electronic components mounted on a printed circuit board using the soldering apparatus according to claim 1,
The plurality of electronic components include a first electronic component that solders the soldering point using linear solder, and a second solder body that is preliminarily supplied with cream solder or ball solder. Including electronic components,
The first electronic component is soldered by the method according to claim 9, and the second electronic component is soldered at the soldering point to which the solder body is supplied. From a laser projection device, by deflecting and projecting laser light with the deflection mirror, the solder body is melted with the laser light to perform reflow soldering.
A laser soldering method characterized by the above.

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