JP5916557B2 - Manufacturing method of ceramic substrate - Google Patents

Description

  The present invention relates to a technique for manufacturing a ceramic substrate.

  Conventionally, a method has been proposed in which a green sheet having a conductive pattern printed on one surface of the green sheet is pressed to form a cavity on the surface of the green sheet and then fired (see Patent Document 1).

JP 9-45965 A

  However, in Patent Document 1, since a green sheet having a conductive pattern printed on one surface of the green sheet is pressed, a conductive pattern such as a boundary portion between the side surface of the cavity formed by the pressing and the surface of the green sheet is used. There is a problem that is easily cut.

  Therefore, an object of the present invention is to provide a method for manufacturing a ceramic substrate that can form a conductive pattern with high accuracy.

  In order to solve this problem, a method of manufacturing a ceramic substrate according to the present invention includes a sheet arranging step of arranging the green sheet having a conductive pattern formed on one surface of a green sheet between press surfaces of a pair of molds, A pressing step of pressing a mold to form a recess on one surface of the green sheet and forming a groove on the side surface of the recess from the bottom surface of the recess and one surface of the green sheet other than the recess. And a paste filling step of filling the groove with a conductive paste, and a firing step of firing the green sheet filled with the conductive paste.

In such a manufacturing method, the conductive paste filling the groove formed on the side surface of the recess is connected to the conductive pattern formed on the bottom surface of the recess and the conductive pattern formed outside the recess. It can function as a pattern.
Therefore, even if the conductive pattern is cut by the press on the side surface of the depression formed by pressing the green sheet, it is possible to ensure electrical connection of the conductive pattern on the bottom surface side and the opening surface side of the depression. it can. Thus, a method of manufacturing a ceramic substrate that can form a conductive pattern with high accuracy is provided.

  Moreover, pattern formation which forms the said conductive pattern in the 1st area | region which should be formed as a bottom face of the said hollow part among the one surface of the said green sheet, and the 2nd area | region where the said hollow part should not be formed It is more preferable that the method further includes a step, and in the pressing step, the groove portion connected to the conductive pattern formed in the first region and the conductive pattern formed in the second region is formed.

In this case, the conductive pattern on the bottom surface side and the opening surface side of the recess portion is not disposed on the side surface of the recess portion, but via the conductive paste filled in the groove portion formed on the side surface. Is ensured.
Therefore, a useless conductive pattern can be omitted as compared with a case where a groove is formed in a portion where the conductive pattern is arranged on the side surface of the recess and the conductive paste is filled.
By the way, when a groove is formed in a portion where the conductive pattern is arranged on the side surface of the recess and the conductive paste is filled, the conductive pattern is interposed via the conductive paste regardless of whether the conductive pattern is cut or not. Can be ensured.
However, there is a possibility that a difference occurs in the electrical characteristics of the conductive pattern electrically connected via the conductive paste between the case where the conductive pattern is cut and the case where the conductive pattern is not cut. is there.
In this regard, if the conductive pattern is not disposed on the side surface of the recess, and the electrical connection of the conductive pattern is ensured through the conductive paste filled in the groove formed on the side surface, the above-described possibility can be obtained. Variations in electrical characteristics can be reduced without causing them. Therefore, the conductive pattern can be formed with higher accuracy.

  In the paste filling step, it is more preferable that the green sheet is vibrated at least at one time in a period from the filling start time of the conductive paste to the groove portion to the filling end time.

  In this case, the conductive paste can be filled without including bubbles or the like in the groove. Therefore, compared to the case where the green sheet is not vibrated during the above period, variation or fluctuation in the electrical characteristics of the conductive paste can occur, and noise in the conductive paste can be suppressed. As a result, the accuracy can be further improved. A conductive pattern can be formed.

  As described above, according to the present invention, a method for manufacturing a ceramic substrate capable of forming a conductive pattern with high accuracy is provided.

It is sectional drawing which shows roughly the press apparatus used for the manufacturing method of the ceramic substrate which concerns on embodiment of this invention. It is a figure which shows the mode of a 1st metal mold | die. It is a flowchart which shows the manufacturing method of the ceramic substrate which concerns on embodiment of this invention. It is a figure which shows the mode of a pattern formation process. It is a figure which shows the mode of a sheet | seat arrangement | positioning process. It is a figure which shows the mode of a press process. It is a figure which shows the mode of the green sheet after a press process. It is a figure which shows the mode of a paste filling process.

  Hereinafter, the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional view schematically showing a press apparatus used in a method for manufacturing a ceramic substrate according to an embodiment of the present invention. As shown in FIG. 1, the press apparatus 1 which concerns on this embodiment is provided with the conveyance part 10 and the press part 20 as main components.

  The transport unit 10 is a unit that transports the green sheet in a predetermined amount unit in the feed direction SD. The green sheet is a sheet containing ceramic powder as a raw material and a binder for the ceramic powder.

  The transport unit 10 in the present embodiment is, for example, a rail-type conveyor that transports a green sheet in a predetermined amount unit in the feed direction SD with both ends sandwiched in the longitudinal direction of the green sheet. Further, the conveyance unit 10 in the present embodiment is provided with a vibration mechanism that vibrates the green sheet, and is provided with a positioning mechanism or the like for positioning the green sheet at a predetermined position as necessary.

  The press unit 20 includes an elevator 21 and a first mold 22 and a second mold 23 that are a pair of molds.

  The elevator 21 is disposed on one side with the conveyance path in the conveyance unit 10 as a boundary, and is a device that can move in both directions D1 and D2 away from the conveyance path.

  The first mold 22 is attached to the elevator 21. The first mold 22 has a surface PS1 to be pressed on the green sheet (hereinafter referred to as a press surface) PS1, and the press surface PS1 is directly opposed to the transport path in the transport unit 10.

  FIG. 2 is a view showing a state of the first mold 22. As shown in FIG. 2, the press surface PS1 of the first mold 22 has a convex portion (hereinafter referred to as a cavity forming convex portion) for forming a recess (hereinafter referred to as a cavity) on one surface of the green sheet. ) 22X is provided.

  The cavity forming convex portion 22X is a part of the press surface PS1 protruding from the press surface PS1, and the tip of the cavity forming convex portion 22X is a flat surface. The shape of the cavity forming convex portion 22X in the present embodiment is a frustum shape.

  Further, on the side surface of the cavity forming convex portion 22X, a protruding portion (hereinafter referred to as a groove forming protruding portion) 22Y for forming a groove portion is provided on the side of the cavity.

  The groove forming protrusion 22Y has a part of one side surface of the cavity forming convex portion 22X between the tip surface of the cavity forming convex portion 22X and the press surface PS1 from the side surface of the cavity forming convex portion 22X. It protrudes over. The shape of the groove forming protrusion 22Y in the present embodiment is a semi-cylindrical shape obtained by cutting the cylinder along a plane passing through the diameters of both end faces of the cylinder.

  As shown in FIG. 1, the second mold 23 is arranged on the opposite side to the side on which the first mold 22 is arranged with the conveyance path in the conveyance unit 10 as a boundary. Further, the second mold 23 has a flat press surface PS 2, and the press surface PS 2 faces the press surface PS 1 of the first mold 22.

  The green sheet is pressed using such a press device 1.

  FIG. 3 is a flowchart showing a method for manufacturing a ceramic substrate according to an embodiment of the present invention. As shown in FIG. 3, the method for manufacturing a ceramic substrate according to the present embodiment includes a pattern forming process P1, a sheet arranging process P2, a pressing process P3, a paste filling process P4, and a firing process P5 as main processes.

<Pattern formation process>
This pattern formation step P1 includes a first region to be formed as the bottom surface of the cavity (hereinafter referred to as a cavity bottom region) and a second region in which the cavity is not formed, on one surface of the green sheet. (Hereinafter, referred to as a non-cavity region).

  In the present embodiment, as shown in FIG. 4, conductive patterns EP having a predetermined shape are formed at predetermined positions of the cavity bottom surface area AR1 and the non-cavity area AR2 on one surface of the green sheet GT. As a method for forming such a conductive pattern EP, for example, a screen printing method or the like is used. Of the one surface of the green sheet GT, a region (hereinafter referred to as a cavity side region) AR3 to be formed as a side surface of the cavity is a region where the conductive pattern EP is not formed.

<Sheet arrangement process>
This sheet arrangement process P2 is a process of arranging the green sheet GT between the press surfaces PS1 and PS2 of the pair of molds.

  Specifically, as shown in FIG. 5, green is provided between the press surface PS1 of the first mold 22 and the press surface PS2 of the second mold 23 with the press surface PS2 of the second mold 23 as a mounting table. A sheet GT is disposed. At this time, the side surface of the cavity forming convex portion 22X in the first mold 22 is opposed to the cavity side surface region AR3 in the green sheet GT.

<Pressing process>
In this pressing step P3, the pair of first mold 22 and second mold 23 are pressed to form a cavity on one surface of the green sheet, and a groove extending between the bottom surface of the cavity and one surface of the green sheet other than the cavity. Is formed on the side surface of the cavity.

  Specifically, as shown in FIG. 6, the elevator 21 is moved from the pre-press position to the press position, and the first mold 22 and the second mold 23 are pressed at a predetermined pressing amount with respect to the green sheet part GTP. Pressed. Thereby, the cavity forming convex portion 22X and the groove forming protrusion 22Y are pressed against one surface of the green sheet portion GTP.

  As shown in FIG. 5, the pre-press position is a position where the cavity forming convex portion 22X and one surface of the green sheet portion facing the cavity forming convex portion 22X are not in contact with each other.

  Next, when a predetermined period has elapsed since the elevator 21 moved to the press position, the elevator 21 is returned from the press position to the pre-press position.

  Thus, as shown in FIG. 7, the cavity CV corresponding to the cavity forming convex portion 22X is formed on one surface of the green sheet portion GTP, and the side surface of the cavity CV corresponds to the groove forming protrusion 22Y. A groove portion VP is formed.

  The groove VP extends over the bottom surface of the cavity CV and one surface of the green sheet GT other than the cavity CV. The groove VP is connected to the conductive pattern EP formed on the bottom surface of the cavity CV and the conductive pattern EP formed on one surface of the green sheet GT other than the cavity CV not formed. .

<Paste filling process>
This paste filling step P4 is a step of filling the groove VP with a conductive paste.

  Specifically, after the vibration of the green sheet GT is started by the vibration mechanism, as shown in FIG. 8, the conductive paste CP is poured into the groove VP from, for example, a dipping machine through a nozzle. Then, when the conductive paste CP is filled in the groove VP, the pouring of the conductive paste CP is stopped and the vibration of the green sheet GT is stopped.

<Baking process>
This firing step P5 is a step of firing the green sheet GT that has undergone the paste filling step P4.

  Specifically, for example, the green sheet portion GTP is cut from the green sheet GT, and then transferred to a firing furnace, and heated in the firing furnace at a predetermined temperature for a predetermined period. As a result, the green sheet part GTP is obtained as a ceramic substrate.

  As described above, in the manufacturing method according to this embodiment, the cavity CV is formed on one surface of the green sheet GT as shown in FIG. 7 by pressing the pair of molds 22 and 23. Further, a groove portion VP extending from the bottom surface of the cavity CV to one surface of the green sheet GT other than the cavity CV is formed on the side surface of the cavity CV. Then, as shown in FIG. 8, the groove VP is filled with the conductive paste CP, and then the green sheet GT is fired.

  In this case, the conductive paste CP filling the groove VP formed on the side surface of the cavity CV is converted into the conductive pattern EP formed on the bottom surface of the cavity CV, and the conductive pattern EP formed outside the cavity CV. Can be made to function as a pattern that connects the two.

  Therefore, even if the conductive pattern existing on the side surface of the cavity CV formed by pressing the green sheet GT is cut by the press, the electrical connection of the conductive pattern EP on the bottom surface side and the opening surface side of the cavity CV is ensured. can do. Thus, a method of manufacturing a ceramic substrate that can form a conductive pattern with high accuracy is provided.

  In the case of the manufacturing method of the present embodiment, as shown in FIG. 4, the pattern forming process P1 for forming the conductive pattern EP in the cavity bottom surface area AR1 and the non-cavity area AR2 on one surface of the green sheet GT is performed by the pressing process P3. Prepared before.

  Then, in the pressing step P3, as shown in FIG. 7, a groove portion VP that is connected to the conductive pattern EP formed in the cavity bottom surface area AR1 and the conductive pattern EP formed in the non-cavity area AR2 is formed.

  For this reason, the conductive pattern EP is not disposed on the side surface of the cavity CV, and the conductive property CP on the bottom surface side and the opening surface side of the cavity CV is filled via the conductive paste CP filled in the groove VP formed on the side surface. The electrical connection of the pattern EP is ensured.

  Therefore, useless conductive pattern EP can be omitted as compared with the case where the groove portion VP is formed in the conductive pattern portion arranged on the side surface of the cavity CV and the conductive paste CP is filled.

  By the way, when the groove VP is formed in the conductive pattern portion arranged on the side surface of the cavity CV and filled with the conductive paste CP, the conductive pattern CP is interposed regardless of whether the conductive pattern portion is cut or not. Thus, electrical connection of the conductive pattern EP can be ensured. However, there is a difference in the electrical characteristics of the conductive pattern EP electrically connected via the conductive paste CP between the case where the conductive pattern EP is cut and the case where the conductive pattern EP is not cut. Is more likely to occur.

  In this regard, as described above, the conductive pattern EP is not disposed on the side surface of the cavity CV, and the electrical connection of the conductive pattern EP is ensured through the conductive paste CP filled in the groove portion VP formed on the side surface. In the case of this embodiment, variation in electrical characteristics can be reduced without causing the above possibility. Therefore, the conductive pattern can be formed with higher accuracy.

  Furthermore, in the paste filling step P4 in the present embodiment, the green sheet GT is vibrated during a period from the start of filling of the conductive paste CP into the groove VP to the end of filling.

  For this reason, it is possible to fill the conductive paste CP without including bubbles or the like in the groove portion VP. Therefore, compared with the case where the green sheet GT is not vibrated during the above period, variation or fluctuation in the electrical characteristics of the conductive paste CP can occur, and noise in the conductive paste CP can be suppressed. The conductive pattern can be formed with higher accuracy.

  As mentioned above, although the said embodiment was demonstrated as an example, this invention is not limited to the said embodiment.

  For example, in the above embodiment, the green sheet GT is vibrated during the period from the start of filling of the conductive paste CP to the groove VP until the end of filling, but a part of the period may be set as the vibration period. In short, it is sufficient that the green sheet GT is vibrated at least at one time in the period from the start of filling of the conductive paste CP to the groove VP until the end of filling.

  Further, in the above-described embodiment, the frustum-shaped cavity forming convex portion 22 </ b> X is formed on the press surface PS <b> 1 of the first mold 22. However, as the shape of the cavity forming convex portion 22X, various shapes can be adopted as long as it is a convex portion for forming a hollow portion as a component storage part (cavity).

  In the embodiment, one cavity forming convex portion 22 </ b> X is formed on the press surface PS <b> 1 of the first mold 22. However, the number of the cavity forming convex portions 22X may be two or more.

  In the above embodiment, the semi-cylindrical groove forming projection 22Y is formed on the side surface of the cavity forming convex portion 22X. However, as the shape of the groove forming protrusion 22Y, various shapes can be adopted as long as it is a protrusion for forming a groove into which the conductive paste CP is to be inserted.

  In the above embodiment, one groove forming protrusion 22Y is formed on the side surface of the cavity forming protrusion 22X. However, the number of groove forming protrusions 22Y may be two or more. When two or more groove forming protrusions 22Y are formed on the side surface of the cavity forming protrusion 22X, each groove forming protrusion 22Y is formed on one side surface of the cavity forming protrusion 22X. Alternatively, it may be divided into two or more side surfaces.

  Moreover, in the said embodiment, in order to arrange | position the green sheet site | part GTP between the 1st metal mold | die 22 and the 2nd metal mold | die 23, the green sheet GT was made into the movement object. However, the first mold 22 or the second mold 23 may be the movement target, and the first mold 22 or the second mold 23 and the green sheet GT may be the movement target. In short, the green sheet portion GTP may be disposed between the first mold 22 and the second mold 23.

  Moreover, in the said embodiment, only the 1st metal mold | die 22 was moved and the press surface PS1 of the said 1st metal mold | die 22 and the press surface PS2 of the 2nd metal mold | die 23 were pressed by the green sheet site | part GTP. However, both the first mold 22 and the second mold 23 are moved, and the press surface PS1 of the first mold 22 and the press surface PS2 of the second mold 23 are pressed on the green sheet portion GTP. Also good.

  Moreover, in the said embodiment, the 1st metal mold | die 22 which has the press surface PS1 for forming the cavity CV in a green sheet surface, and the 2nd metal mold | die 23 which has the flat press surface PS2 are one side of the conveyance part 10. Provided on the other side. However, for example, a pair of molds having a press surface for obtaining through holes and through-grooves for cutting out the outer frame on the green sheet is provided behind the first mold 22 and the second mold 23 (feeding of the green sheet). It may be provided on one side and the other side of the transport unit 10 in the rear of the direction SD). In addition, such a metal mold | die may be integrally connected with the 1st metal mold | die 22 or the 2nd metal mold | die 23, and a different body may be sufficient as it.

  In the above embodiment, a plurality of green sheet portions GTP are cut from one green sheet GT. However, one green sheet GT may be divided and one green sheet portion GTP may be cut from each of the divided green sheets.

  The method for manufacturing a ceramic substrate according to the present invention has applicability in various industries that handle ceramic substrates.

DESCRIPTION OF SYMBOLS 1 ... Press apparatus 10 ... Conveyance part 20 ... Press part 21 ... Elevator 22 ... 1st metal mold | die 22X ... Convex part for cavity formation 22Y ... Projection part 23 for groove formation ... 2nd mold PS1, PS2 ... Press surface CV ... Cavity VP ... Groove CP ... Conductive paste GT ... Green sheet GTP ... Green sheet part P1 ... Pattern Forming process P2 ... Sheet arrangement process P3 ... Pressing process P4 ... Paste filling process P5 ... Firing process

Claims (3)

A sheet disposing step of disposing the green sheet having a conductive pattern formed on one surface of the green sheet between the press surfaces of a pair of molds;
The pair of molds is pressed to form a recess on one surface of the green sheet, and a groove that extends between the bottom surface of the recess and one surface of the green sheet other than the recess is formed on the side surface of the recess. Pressing process to
A paste filling step of filling the groove with a conductive paste;
And a firing step of firing the green sheet filled with the conductive paste. A pattern forming step of forming the conductive pattern in a first region that is to be formed as a bottom surface of the recess portion and a second region in which the recess portion is not to be formed in one surface of the green sheet. In addition,
The said press process WHEREIN: The said groove part connected with the said conductive pattern formed in the said 1st area | region and the said conductive pattern formed in the said 2nd area | region is formed. A method for manufacturing a ceramic substrate. In the paste filling step,
3. The method for manufacturing a ceramic substrate according to claim 1, wherein the green sheet is vibrated at least at one time in a period from a filling start time of the conductive paste to the groove portion to a filling end time. 4. .

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