JP5988239B2 - 蛍光測定用基板 - Google Patents
蛍光測定用基板 Download PDFInfo
- Publication number
- JP5988239B2 JP5988239B2 JP2012102994A JP2012102994A JP5988239B2 JP 5988239 B2 JP5988239 B2 JP 5988239B2 JP 2012102994 A JP2012102994 A JP 2012102994A JP 2012102994 A JP2012102994 A JP 2012102994A JP 5988239 B2 JP5988239 B2 JP 5988239B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal layer
- fine particles
- fluorescence
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 title claims description 73
- 238000005259 measurement Methods 0.000 title claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 70
- 239000002184 metal Substances 0.000 claims description 70
- 239000010419 fine particle Substances 0.000 claims description 56
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000002245 particle Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 20
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- 239000004793 Polystyrene Substances 0.000 claims description 6
- 229920002223 polystyrene Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000009751 slip forming Methods 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 description 51
- 238000000034 method Methods 0.000 description 21
- 230000005284 excitation Effects 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 16
- 239000010408 film Substances 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 16
- 239000004332 silver Substances 0.000 description 16
- 238000002198 surface plasmon resonance spectroscopy Methods 0.000 description 16
- 238000000151 deposition Methods 0.000 description 14
- 239000002105 nanoparticle Substances 0.000 description 13
- 239000010409 thin film Substances 0.000 description 12
- 230000008021 deposition Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 229910000510 noble metal Inorganic materials 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000007850 fluorescent dye Substances 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- VYXSBFYARXAAKO-WTKGSRSZSA-N chembl402140 Chemical compound Cl.C1=2C=C(C)C(NCC)=CC=2OC2=C\C(=N/CC)C(C)=CC2=C1C1=CC=CC=C1C(=O)OCC VYXSBFYARXAAKO-WTKGSRSZSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000002795 fluorescence method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000975 dye Substances 0.000 description 3
- 239000002082 metal nanoparticle Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012921 fluorescence analysis Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000003100 immobilizing effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Description
2 微粒子
3 金属層
3A 金属
3B 金属
Claims (3)
- 基板上に吸着された誘電体からなる複数の微粒子と、前記複数の微粒子を埋包するように前記基板の表面から前記微粒子表面にかけて連続的に前記基板上に形成された金属層とを備え、前記金属層の一部は複数の突起部を有するとともに、前記複数の微粒子は粒径30nm〜1000nmであり、前記基板表面から前記金属層の平坦部までの前記金属層の膜厚は、前記粒径の100%以上で1000%までの厚さであることを特徴とする蛍光測定用基板。
- 前記複数の微粒子は、ポリスチレンを含むポリマー、シリカ、酸化チタンのいずれかから構成されていることを特徴とする請求項1に記載の蛍光測定用基板。
- 前記基板は、ガラス、シリコン、ポリスチレン、ポリカーボネート、ポリメタクリル酸メチル樹脂のいずれかの材料で構成していることを特徴とする請求項1又は請求項2に記載の蛍光測定用基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012102994A JP5988239B2 (ja) | 2012-04-27 | 2012-04-27 | 蛍光測定用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012102994A JP5988239B2 (ja) | 2012-04-27 | 2012-04-27 | 蛍光測定用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013231639A JP2013231639A (ja) | 2013-11-14 |
| JP5988239B2 true JP5988239B2 (ja) | 2016-09-07 |
Family
ID=49678207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012102994A Expired - Fee Related JP5988239B2 (ja) | 2012-04-27 | 2012-04-27 | 蛍光測定用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5988239B2 (ja) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4548416B2 (ja) * | 2004-03-31 | 2010-09-22 | オムロン株式会社 | 局在プラズモン共鳴センサ及び検査装置 |
| JP2006349463A (ja) * | 2005-06-15 | 2006-12-28 | Canon Inc | 表面増強ラマン分光分析用治具及びその製造方法 |
| JP5110254B2 (ja) * | 2006-10-10 | 2012-12-26 | 富士レビオ株式会社 | 蛍光測定法と、蛍光測定のための測定用チップ及びその製造方法 |
| JP5552007B2 (ja) * | 2010-09-17 | 2014-07-16 | 富士フイルム株式会社 | 光電場増強デバイス |
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2012
- 2012-04-27 JP JP2012102994A patent/JP5988239B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013231639A (ja) | 2013-11-14 |
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