JP6136451B2 - Cutting method and cutting apparatus - Google Patents

Description

  The present invention relates to a cutting method and a cutting apparatus for cutting a long film member.

  There is a thin product such as a foil in which a material corresponding to a specific purpose is applied to the surface of a long thin film material. Patent Document 1 shows an apparatus for cutting out a material having a necessary length from such a long thin film material as a product. Patent Document 1 describes that the accuracy and speed of cutting the film material is improved by detecting the position of the material placed at the cutting location and finely adjusting the position of the cutting blade.

  Patent Document 2 discloses a cutting device and a cutting method for cutting a ceramic laminated block. The cutting apparatus includes a table on which a block to be cut is placed, a cutting unit disposed above the table, a cut driving unit that drives the cutting unit up and down, and a parallel drive that relatively moves the table and the cutting unit. And a section.

  This cutting apparatus includes a CCD camera that obtains a captured image including the first cut trace and the next cut planned position by the cutting means in the same field of view. Based on the captured image obtained by the CCD camera, the calculation unit calculates the distance from the first cut trace to the next scheduled cut position. Based on this distance, the parallel drive unit relatively moves the table and the cutting means. Thereby, it is supposed that a block can be accurately cut at a planned cutting position.

  Further, Patent Document 2 describes that when the rising cutting blade reaches the position where it comes out of the block, the detection operation of the scheduled cutting position by the CCD camera and the calculation unit is started.

JP 2007-242507 A Japanese Patent Laid-Open No. 2005-88161

  Patent Document 1 does not describe a specific method for detecting the position of a material placed at a cutting place. Further, the cutting machine is generally large in size, and it often takes time to finely adjust the position of the cutting blade relative to the film material.

  In the cutting method described in Patent Document 2, since it is necessary to obtain a captured image including the first cut trace and the next cut planned position in the same field of view, until the cutting edge of the rising cutting means reaches the position where it comes out of the block In addition, it is not possible to start the operation of detecting the planned cutting position by the CCD camera and the calculation unit. Therefore, in some cases, the conveyance distance corresponding to the next scheduled cutting position may not be specified until the operation of the cutting means is completed. Therefore, there is a limit to further shortening the time of this cutting method.

  In addition, since the timing at which the blade edge comes out of the block changes depending on the thickness of the block to be cut, it is difficult to take the timing for starting the detection operation by the CCD camera.

  Therefore, in order to solve any of the above-described problems, another cutting method and a cutting apparatus capable of shortening the cutting time while maintaining the accuracy of the cutting position of the film material are desired.

The cutting method of the present invention relates to a method of pulling out a long film material in which a plurality of processing portions are intermittently formed at substantially the same position on both surfaces and cutting the film material at a predetermined position. The cutting method includes a step of cutting the film material at the first cutting position by the cutting means, and after the operation of the cutting means at the first cutting position starts, before the cutting means cuts the film material, the film material is drawn out. Starting detection of the boundary position of the processing unit upstream of the cutting means in the direction, and calculating a second cutting position to be cut after the first cutting position based on the boundary position; ,including. In one aspect, the detection of the position of the processing unit is performed by both the first boundary position of the processing unit formed on the surface of the film material and the second boundary position of the processing unit formed on the back surface of the film material. In the case where the difference between the first boundary position and the second boundary position exceeds a predetermined size, the film material portion having the processing portion is determined as a defective product. The position of the part is detected by a first boundary position on the downstream side in the drawing direction of the processing part formed on the surface of the film material and a second downstream side in the drawing direction of the processing part formed on the back surface of the film material. The calculation of the second cutting position is performed based on the average position of the first boundary position and the second boundary position, or the first boundary position and the second boundary position are calculated. Of the two boundary positions, the determination is based on the one located upstream in the pulling direction.

The cutting apparatus of the present invention relates to an apparatus for pulling out a long film material in which a plurality of processing units are intermittently formed at substantially the same position on both surfaces and cutting the film material at a predetermined position. The cutting apparatus includes a drawing unit that pulls out the film material, a cutting unit that cuts the film material, a sensor that detects the position of the processing unit, a control unit that controls the sensor, and a calculation unit. At least two sensors are arranged opposite to both surfaces of the drawn film material on the upstream side of the cutting means in the drawing direction of the film material . The control unit controls the sensor so that the detection of the position of the processing unit is started after the cutting unit starts operating at the first cutting position and before the cutting unit cuts the film material. The calculation unit calculates a second cutting position to be cut after the first cutting position based on the detected position of the processing unit. In one aspect, the sensor detects and controls both the first boundary position of the processing unit formed on the surface of the film material and the second boundary position of the processing unit formed on the back surface of the film material. When the difference between the first boundary position and the second boundary position exceeds a predetermined size, the part determines that the part of the film material having the processing part is defective, and in another aspect, the sensor A first boundary position on the downstream side in the pulling direction of the processing unit formed on the surface of the film material, and a second boundary position on the downstream side in the pulling direction of the processing unit formed on the back surface of the film material, Both are detected, and the calculation unit is positioned based on the average position of the first boundary position and the second boundary position, or upstream of the first boundary position and the second boundary position in the drawing direction. The second cutting position is calculated on the basis of the direction to be performed.

  According to the present invention, it is possible to shorten the cutting time while maintaining the accuracy of the cutting position of the film material.

It is a schematic plan view of the cutting device which cut | disconnects the film material in 1st Embodiment. It is a schematic side view of the cutting device which cut | disconnects the film material in 1st Embodiment. It is the schematic side view which expanded a part of film material in which the processing part was formed in one side. It is a flowchart which shows the cutting method which cut | disconnects a film material. It is a schematic plan view of the cutting device which cut | disconnects the film material in 2nd Embodiment. It is a schematic side view of the cutting device which cut | disconnects the film material in 2nd Embodiment. It is the schematic side view which expanded a part of film material in which the processing part was formed in both surfaces.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic plan view of a cutting device that draws out a thin long film material and cuts the film material. FIG. 2 is a schematic side view of the cutting apparatus. The thin long film material 10 is drawn out from a roll portion 12 formed by winding the film material in a roll shape. In addition, the positions P1, P2, and P3 shown in FIG.

  FIG. 3 is an enlarged schematic side view of a part of the film material 10. On one surface of the film material 10, a plurality of processing units 10a and a portion 10b other than the processing unit 10a are formed. The plurality of processing units 10a are formed intermittently. The processing unit may be an application unit coated with an arbitrary material, a marking, or the like. Thus, depending on the product to be manufactured, there is one in which the processing part 10a is intermittently formed on the film material 10.

  In FIG. 3, the thickness of the film material 10 is exaggerated, but the thickness of the film material 10 may be 0.1 mm or less. Moreover, the thickness of the process part 10a may be 0.1 mm or less.

  The cutting device includes a sensor 20, a cutting unit 30, a pulling unit 40, and a discharge unit 50. The cutting means 30 may have any configuration as long as it has a function of cutting the film material 10. In the present embodiment, a cutting die is used as the cutting means 30. Furthermore, the cutting device includes a mold driving mechanism that drives the cutting mold. The cutting die 30 is disposed above the film material 10 and is configured to be movable downward and upward. When the cutting die 30 is lowered and the cutting die 30 is pressed against the film material 10, the film material 10 is cut. When the cutting mold 30 is raised, the cutting mold 30 is retracted from the film material 10.

  The drawing means 40 may have any configuration as long as it has a function of drawing the film material 10. The drawing means 40 is disposed downstream of the cutting mold 30 in the drawing direction T of the film material 10. The drawing means 40 pulls out the film material 10 from the roll portion 12 while holding the vicinity of the tip portion of the film material 10 by vacuum suction.

  The pulling means 40 can enter the gap between the cutting die 30 and the film material 10 when the cutting die 30 is raised. Thereby, the drawer | drawing-out means 40 can hold | maintain the front-end | tip part of the film material 10 connected to the roll part 12 after the film material 10 is cut | disconnected.

  It is preferable that the height position of the film material 10 is different between when the film material 10 is pulled out and when the film material 10 is cut. More specifically, the height position of the film material 10 when the film material 10 is pulled out is preferably higher than the height position of the film material 10 when the film material 10 is cut. Therefore, it is preferable that the drawing means 40 is movable not only in the drawing direction T of the film material 10 but also in the vertical direction.

  The discharge unit 50 includes a suction stage that sucks and holds the film material 10 separated from the roll unit 12, and a transport stage that transports the film material 10 to a processing unit that performs the next processing on the suction stage. good. Not only this but the discharge part 50 may have what kind of structure.

  The sensor 20 is disposed upstream of the cutting means 30 in the drawing direction T of the film material 10. The sensor 20 may be any sensor that can detect the position of the processing unit 10a of the film material 10, more specifically the boundary position of the processing unit 10a. For example, when there is a step between the processing unit 10a and the unprocessed unit 10b formed on the surface of the film material 10, the sensor 20 may detect the step. If there is a color difference between the processing unit 10a and the unprocessed unit 10b, the boundary position of the processing unit 10a can be detected based on the color difference.

  The sensor 20 may be an imaging unit such as a CCD camera, for example. The CCD camera faces one surface of the film material 10, that is, one surface on which the processing unit 10a is formed, and can image the one surface of the film material 10. The CCD camera can acquire an image of the surface of the film material 10 and detect the position of the boundary between the processing unit 10a and the unprocessed unit 10b from the acquired image. The CCD camera can detect the boundary position of the processing unit 10a by imaging the processing unit 10a and the unprocessed unit 10b adjacent to the processing unit 10a with the same visual field.

  The sensor 20 may be, for example, a fiber sensor, a two-dimensional camera, a laser displacement meter, or the like instead of the CCD camera. For example, the position of the processing unit 10a may be scanned by driving the fiber sensor in the direction of the film material 10 using a uniaxial stage or the like. The sensor 20 is preferably a non-contact sensor that has a very low possibility of damage to the film material 10, such as a laser displacement meter, a proximity sensor, a metal detection sensor, or the like.

  Further, the cutting device may include a control unit that controls the sensor 20, the cutting unit 30, the pulling unit 40, and the like. In particular, the control unit controls the operation timing of the sensor 20 and the cutting means 30.

  Next, with reference to the flowchart shown in FIG. 4, the cutting method using said cutting device is demonstrated. After the film material 10 is cut at a predetermined position, the cutting mold 30 is raised to a predetermined retracted position (step S1). The separated film material 10 is moved from the discharge unit 50 to another place. The leading end of the film material 10 connected to the roll unit 12 is drawn to the delivery stage 60 near the cutting die 30. The delivery stage 60 can hold the film material 10 by vacuum suction.

  The pulling means 40 rises to a predetermined height, enters the gap between the cutting die 30 and the film material 10, and moves above the delivery stage 60 (steps S2 to S3). The pulling means 40 descends to the delivery stage 60 and sucks and holds the leading end portion of the film material 10 (step S4).

  Next, the pulling means 40 is raised to a predetermined height, and the leading end of the film material 10 is lifted (step S5). The pulling means 40 pulls out the film material 10 from the roll part 12 by a predetermined length (step S6). Then, the pulling means 40 is lowered to a predetermined height, and the film material is placed on the stage 70 facing the cutting mold 30. At this time, the film material 10 is sucked and held by the suction stage of the discharge unit 50, the stage 70 facing the cutting mold 30, and the delivery stage 60. The amount (length) by which the drawing means 40 pulls out the film material 10 will be described later.

  Next, the cutting die is lowered, and the film material 10 is cut at the first cutting position P1 (steps S8 to S9). After the film material 10 is cut, the cutting die 30 is raised (step S10). After the cutting mold 30 is opened to a predetermined height position, the pulling means is raised (step S11). The separated film material 10 is vacuum-sucked by the discharge unit 50 and conveyed to a processing unit that performs the next processing.

  The sensor 20 starts detecting the position of the processing unit 10a upstream of the cutting means 30 in the drawing direction T of the film material before the cutting means 30 cuts the film material 10 after the start of the operation of the cutting means 30. (Step S12). That is, the CCD camera 20 acquires an image near the boundary of the film material processing unit 10a before the film material 10 is cut after the cutting mold 30 starts to descend. The time required for the CCD camera 20 to acquire an image can be shorter than the time required for the cutting mold 30 to reach the cutting position.

  The position of the processing unit 10a can be calculated from the image acquired by the CCD camera 20 (step S13). Here, the boundary position 80a on the downstream side of the drawing direction T of the film material 10 is detected. Based on the boundary position 80a, a second cutting position P2 to be cut after the first cutting position P1 is calculated (step S14). Since the distance between the CCD camera 20 and the cutting die 30 is known, if the second cutting position P2 is determined, the length (drawing amount) with which the drawing means 40 should pull out the film material 10 can be determined. Thus, the pulling means 40 can accurately place the second cutting position P2 at the cutting position by the cutting mold 30.

  Calculation of the second cutting position P2 and the drawing amount of the film material 10 is performed by a calculation unit provided in the cutting device. The calculation unit includes, for example, a CPU and a memory.

  By detecting the boundary position of the processing unit 10a upstream of the first cutting position P1, the second cutting position P2 to be cut later can be calculated during the operation of the cutting means 30. Thereby, since cutting | disconnection operation | movement and calculation of a cutting | disconnection position can be performed in parallel, the time for cut | disconnecting the film material 10 repeatedly can be reduced. From the viewpoint of time reduction, the calculation of the second cutting position P2 and the drawing amount of the film material 10 by the arithmetic unit is preferably finished before the operation of the cutting means 30 is completed, here, before the raising of the drawing means 40 is finished.

  Next, the pulling means 40 enters the gap between the cutting die 30 and the film material 10 and moves above the delivery stage 60 (step S3). The pulling means 40 descends to the delivery stage 60 and sucks and holds the leading end portion of the film material 10 (step S4).

  Next, the pulling means 40 is raised to a predetermined height, and the leading end of the film material 10 is lifted (step S5). The pulling means 40 pulls out the film material 10 from the roll part 12 by a predetermined length (step S6). Then, the pulling means 40 is lowered to a predetermined height, and the leading end portion of the film material 10 is set on the stage 70 facing the cutting die 30 (step S7). Here, the amount (length) by which the drawing means 40 pulls out the film material 10 corresponds to the drawing amount calculated in step S14. Thereby, the film material 10 can be accurately pulled out so that the second cutting position P <b> 2 matches the cutting position by the cutting mold 30. Thereafter, similarly to the method described above, the film member 10 is cut at the second cutting position P2 by the cutting means 30.

  As described above, the steps S3 to S14 are repeated, and the film material 10 having a predetermined length is separated from the roll portion 12 while the film material 10 is pulled out.

  During the conveyance of a thin film material such as a foil, the film material itself often vibrates. Therefore, if it is attempted to detect the film material 10 by the sensor 20 during the conveyance of the film material, the detection accuracy of the scheduled cutting position may be significantly reduced. In the present invention, the sensor 20 images the film material 10 while the cutting means 30 is operating, that is, while the film material 10 is not being conveyed. As a result, it is possible to suppress a decrease in detection accuracy of the scheduled cutting position (cutting position).

  Since it is difficult to form the length of the processing unit 10a with high accuracy, the processing unit 10a may be formed longer than the target length of the processing unit 10a. In this case, the processing unit 10a having a predetermined length can be formed by cutting the processing unit 10a with a predetermined length from the distal end portion 80a of the processing unit 10a.

  FIG. 5 is a schematic plan view of a cutting device for cutting a film material in the second embodiment. FIG. 6 is a schematic side view of the cutting device according to the second embodiment. FIG. 7 is an enlarged schematic side view of a part of the film material handled by the cutting apparatus.

  The mechanical configuration of the cutting device in the second embodiment is substantially the same as the mechanical configuration of the first cutting device. In FIG.5 and FIG.6, the same code | symbol is attached | subjected to the same structure as the structure of a 1st cutting device.

  In the cutting device of the second embodiment, the sensors 20a and 20b are arranged on both sides with the drawn film material 10 in between. A plurality of processing units 10 a and 10 c are intermittently formed on both surfaces of the film material 10. The first sensor 20 a detects a boundary position 80 a of the processing unit 10 a on the surface of the film material 10. The second sensor 20 b detects the boundary position 80 c of the processing unit 10 c on the back surface of the film material 10. As described above, at least two sensors 20a and 20b may be arranged to face both surfaces of the drawn film material.

  The cutting device in 2nd Embodiment can respond | correspond to the film material 10 by which the process parts 10a and 10c were formed in both surfaces. If any one of the sensors 20a and 20b is selectively operated, the film material having the processing unit 10a formed on one side can be processed in the same manner as the cutting device of the first embodiment. Moreover, even if it is a film material with which processing part 20a, 20b was formed in both surfaces, based on the position of the processing part formed in one surface selectively using one sensor 20a, 20b, film material 10 The cutting position may be calculated.

  Further, in the cutting apparatus or the cutting method of the present embodiment, the positions of the processing portions 10a and 10c on the front surface and the back surface of the film material 10 may be slightly shifted (see FIG. 7). In this case, the cutting position of the film material 10 may be calculated based on the positions of the processing units 10a and 10c on both sides. For example, in steps S <b> 12 to S <b> 13 shown in FIG. 4, the first boundary position 80 a on the downstream side in the pulling direction T of the processing unit 10 a formed on the surface of the film material 10 and the processing formed on the back surface of the film material 10. The second boundary position 80c on the downstream side in the drawing direction T of the part 10c is detected. Then, in step S14, the second cutting position P2 may be calculated based on the average position 82 of the first boundary position 80a and the second boundary position 80c. Instead of this, the second cutting position P2 may be calculated based on one of the first boundary position 80a and the second boundary position 80c that is located upstream in the pulling direction T.

  Depending on the product, it is preferable that the processing units 10a and 10c are formed at the same location on both sides. For example, if the processing units 10 a and 10 c are formed on both surfaces of the film material 10 simultaneously while the film material 10 is being pulled out, the processing units 10 a and 10 c are formed at substantially the same location on both surfaces of the film material 10. However, for the convenience of the processing method, the positions of the processing units 10a and 10c may be different as shown in FIG. If the cutting device shown in FIGS. 5 and 6 is used, it is possible to distinguish defective products whose positions of the processing units 10a and 10c are greatly different.

  Specifically, the first sensor 20 a detects the first boundary position 80 a on the downstream side in the pulling direction T of the processing unit 10 a formed on the surface of the film material 10. Further, the second sensor 20 b detects a second boundary position 80 c on the downstream side in the pulling direction T of the processing unit 10 c formed on the back surface of the film material 10. When the difference between the first boundary position 80a and the second boundary position 80c exceeds a predetermined size set in advance, the control unit determines that the portion having the processing unit is defective. This has the advantage that defective products can be automatically identified.

  The portion of the film material 10 determined to be defective is separated by the cutting means 30 and then discarded to the disposal unit. For this reason, it is preferable that the cutting device has a discarding part on the rear side of the cutting means 30. In this case, when the discharge unit 50 holds a portion of the film material 10 that is determined to be defective, the discharge unit 50 conveys the defective product to the disposal unit.

  In this way, it is not necessary to provide a step of inspecting the product separately in the subsequent steps by finding a defective product during the process of cutting the film material 10 and discarding the defective product. Can be shortened. In this case, even if a separate inspection is performed after cutting, the time for the cutting process may be somewhat longer, but the time for the entire process may be shortened.

  Although the preferred embodiments of the present invention have been presented and described in detail above, the present invention is not limited to the above-described embodiments, and it is understood that various changes and modifications can be made without departing from the gist. I want to be.

DESCRIPTION OF SYMBOLS 10 Film material 10a Processing part 20 Sensor 20a Sensor 20b Sensor 30 Cutting means 40 Pull-out means

Claims (10)

A cutting method of pulling out a long film material in which a plurality of processing sections are intermittently formed at substantially the same position on both sides, and cutting the film material at a predetermined position,
Cutting the film material at a first cutting position by a cutting means;
After the start of the operation of the cutting means at the first cutting position, before the cutting means cuts the film material, the position of the processing unit is upstream of the cutting means in the drawing direction of the film material. Starting the detection;
Based on the detected position of the said processing unit, viewed including the steps, a to the calculation of the second cutting position to be cut later than the first cutting position,
The detection of the position of the processing unit includes: a first boundary position of the processing unit formed on the surface of the film material; and a second boundary position of the processing unit formed on the back surface of the film material. Done in both
A cutting method in which, when a difference between the first boundary position and the second boundary position exceeds a predetermined size, the part of the film material having the processing unit is determined as a defective product . The cutting method according to claim 1, wherein in the detection of the position of the processing unit, a boundary position on the downstream side of the processing unit in the drawing direction is detected. A cutting method of pulling out a long film material in which a plurality of processing sections are intermittently formed at substantially the same position on both sides, and cutting the film material at a predetermined position,
Cutting the film material at a first cutting position by a cutting means;
After the start of the operation of the cutting means at the first cutting position, before the cutting means cuts the film material, the position of the processing unit is upstream of the cutting means in the drawing direction of the film material. Starting the detection;
Calculating a second cutting position to be cut after the first cutting position based on the detected position of the processing unit, and
The detection of the position of the processing unit includes the first boundary position on the downstream side in the drawing direction of the processing unit formed on the surface of the film material, and the processing unit formed on the back surface of the film material. Performed at both the second boundary position downstream in the pull-out direction,
The calculation of the second cutting position is carried out based on the average position of the second boundary position between the first boundary position, disconnect method. A cutting method of pulling out a long film material in which a plurality of processing sections are intermittently formed at substantially the same position on both sides, and cutting the film material at a predetermined position,
Cutting the film material at a first cutting position by a cutting means;
After the start of the operation of the cutting means at the first cutting position, before the cutting means cuts the film material, the position of the processing unit is upstream of the cutting means in the drawing direction of the film material. Starting the detection;
Calculating a second cutting position to be cut after the first cutting position based on the detected position of the processing unit, and
The detection of the position of the processing unit includes the first boundary position on the downstream side in the drawing direction of the processing unit formed on the surface of the film material, and the processing unit formed on the back surface of the film material. Performed at both the second boundary position downstream in the pull-out direction,
The calculation of the second cutting position is performed based on the person located on the upstream side of the pull-out direction of the second boundary position between the first boundary position, disconnect method. The cutting method according to any one of claims 1 to 4 , wherein the calculation of the second cutting position is completed before the operation of the cutting means is ended. The drawer the film material so that the second cutting position matches the position of the cutting means, further comprising cutting the film material in the second cutting position by the cutting means, of claims 1 to 5 The cutting method according to any one of the above. A cutting device that pulls out a long film material in which a plurality of processing units are intermittently formed at substantially the same position on both sides, and cuts the film material at a predetermined position,
Drawer means for pulling out the film material;
Cutting means for cutting the film material;
A sensor for detecting the position of the processing unit, at least two disposed opposite to both surfaces of the drawn film material on the upstream side of the cutting means in the drawing direction of the film material ;
A controller that controls the sensor to start detecting the position of the processing unit before the cutting unit cuts the film material after the start of the operation of the cutting unit at the first cutting position;
Based on the detected position of the said processing unit, viewed it contains a calculation unit, a for the calculation of the second cutting position to be cut later than the first cutting position,
The sensor detects both the first boundary position of the processing unit formed on the surface of the film material and the second boundary position of the processing unit formed on the back surface of the film material,
When the difference between the first boundary position and the second boundary position exceeds a predetermined size, the control unit determines that the part of the film material having the processing unit is a defective product. .
A cutting device that pulls out a long film material in which a plurality of processing units are intermittently formed at substantially the same position on both sides, and cuts the film material at a predetermined position,
Drawer means for pulling out the film material;
Cutting means for cutting the film material;
A sensor for detecting the position of the processing unit, at least two disposed opposite to both surfaces of the drawn film material on the upstream side of the cutting means in the drawing direction of the film material;
A controller that controls the sensor to start detecting the position of the processing unit before the cutting unit cuts the film material after the start of the operation of the cutting unit at the first cutting position;
A calculation unit that calculates a second cutting position to be cut after the first cutting position based on the detected position of the processing unit;
The sensor includes a first boundary position on the downstream side in the pulling direction of the processing unit formed on the surface of the film material, and a downstream side in the pulling direction of the processing unit formed on the back surface of the film material. Both of the second boundary position of
The said calculating part is a cutting device which calculates a said 2nd cutting position based on the average position of a said 1st boundary position and a said 2nd boundary position. A cutting device that pulls out a long film material in which a plurality of processing units are intermittently formed at substantially the same position on both sides, and cuts the film material at a predetermined position,
Drawer means for pulling out the film material;
Cutting means for cutting the film material;
A sensor for detecting the position of the processing unit, at least two disposed opposite to both surfaces of the drawn film material on the upstream side of the cutting means in the drawing direction of the film material;
A controller that controls the sensor to start detecting the position of the processing unit before the cutting unit cuts the film material after the start of the operation of the cutting unit at the first cutting position;
A calculation unit that calculates a second cutting position to be cut after the first cutting position based on the detected position of the processing unit;
The sensor includes a first boundary position on the downstream side in the pulling direction of the processing unit formed on the surface of the film material, and a downstream side in the pulling direction of the processing unit formed on the back surface of the film material. Both of the second boundary position of
The said calculating part is a cutting device which calculates a said 2nd cutting position based on the one located in the upstream of the said drawing direction among the said 1st boundary position and the said 2nd boundary position. The cutting apparatus according to any one of claims 7 to 9 , wherein the calculation of the second cutting position by the arithmetic unit is completed before the cutting operation of the cutting means at the first cutting position is completed.