JP6138660B2 - Substrate inspection apparatus and substrate inspection method - Google Patents

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for electrically inspecting a substrate to be inspected.

  As this type of board inspection apparatus and board inspection method, the applicant has disclosed an in-circuit tester and a soldering failure detection method (board inspection method) in Japanese Patent Application Laid-Open No. 7-104026. This in-circuit tester has poor soldering (connection) between the lead of a flat package IC or the like (hereinafter also referred to as “electronic component”) surface-mounted on the substrate to be inspected and the pattern to which the lead should be connected. A substrate inspection apparatus configured to be able to inspect whether or not a defect has occurred, and includes a measurement table on which a substrate to be inspected can be placed, four measurement probes, and each measurement probe independently and arbitrarily. The XY unit is moved in the X-Y direction, and a resistance measurement circuit to which each measurement probe is connected.

  When inspecting a substrate to be inspected by this in-circuit tester, first, two measuring probes connected to the + source terminal of the resistance measuring circuit and a measuring probe connected to the + sense terminal of the resistance measuring circuit, Probing is performed on the shoulder and tip of the lead of the electronic component mounted on the board to be inspected. In addition, two probes, the measurement probe connected to the -sense terminal of the resistance measurement circuit and the measurement probe connected to the -source terminal of the resistance measurement circuit, are connected to a lead obtained by probing the above two measurement probes. Probing each pattern to be done. Next, a constant current is supplied between the two source terminals, and the voltage value of the voltage generated between the two sense terminals in that state is measured, and based on the supplied constant current value and the measured voltage value, The resistance value between the lead of the component and the pattern is calculated (resistance value measurement processing by a four-terminal method).

  At this time, if the lead is normally soldered to the pattern, a resistance value not more than a predetermined threshold value is calculated. Therefore, when a resistance value equal to or lower than the threshold value is calculated, it is determined that the lead having the other two measurement probes probed is properly soldered to the pattern in which the two measurement probes are probed. To do. On the other hand, when the lead is incompletely soldered to the pattern, a large resistance value exceeding the threshold value is calculated. In addition, when the lead is completely separated from the pattern (when not connected), the calculated resistance value is infinite. Therefore, when a large resistance value (including infinity) exceeding the threshold is calculated, it is determined that the lead is not normally soldered to the pattern. After this, between the other leads and the pattern, the resistance value is measured in the same procedure as the above-described series of processing and compared with the threshold value. Inspect whether or not.

JP-A-7-104026 (page 3-5, FIG. 1-10)

  However, the in-circuit tester and the substrate inspection method disclosed by the applicant have the following problems to be improved. That is, the in-circuit tester (board inspection method) disclosed by the applicant inspects whether or not a soldering defect has occurred by sequentially measuring the resistance value between the lead of the electronic component and the pattern. A configuration (method) is adopted. In this case, the inspection target substrate which is the target of this type of substrate inspection apparatus and substrate inspection method has not only surface-mounted electronic components but also electronic components mounted (incorporated) on the inner layer of the multilayer substrate. Things exist. In particular, multilayer capacitors that are easy to downsize and thin due to their simple internal structure are often built into the board to secure mounting space for other electronic components on the board surface. It has become.

  In this case, in the in-circuit tester (substrate inspection method) disclosed by the applicant, in order to inspect for the presence of defective soldering, the external electrode in the capacitor to be inspected and the connection to which the external electrode should be connected It is necessary to bring a pair of measurement probes into contact with each of the patterns for use. However, in the in-circuit tester (substrate inspection method) disclosed by the applicant, the measurement probe cannot be brought into contact with the external electrode of the capacitor built in the substrate. It is difficult to inspect whether or not there is a connection failure. For this reason, it is preferable to improve this point.

  The present invention has been made in view of such a problem to be improved, and provides a substrate inspection apparatus and a substrate inspection method capable of reliably inspecting whether or not a connection failure or the like has occurred in a capacitor built in the substrate. The main purpose is to do.

  In order to achieve the above object, the substrate inspection apparatus according to claim 1 includes a built-in multilayer capacitor in which a plurality of internal electrodes are connected to a pair of external electrodes, and one of the external electrodes is a first connection pattern. Connection failure of the one external electrode with respect to the first connection pattern, for the second connection, with respect to the substrate to be inspected that is connected to the other and the other of the external electrodes is connected to the second connection pattern It is electrically determined whether any one of the defective connection of the other external electrode to the pattern, the disconnection of the first connection pattern, the disconnection of the second connection pattern, and the damage of the multilayer capacitor has occurred. A board inspection apparatus configured to be inspectable, wherein a conductor disposed opposite to an electrode surface of each internal electrode, the first connection pattern, and the second connection pattern A measurement process A for measuring an electrical parameter in a state where an AC signal is applied to one of the two not connected to the reference potential and an AC signal applied to one not connected to the reference potential, and connected to the reference potential in the measurement process A A measurement process B for separating the one of the two from the reference potential and measuring the electrical parameter in a state where the AC signal is applied to one not connected to the reference potential in the measurement process A. A measurement unit that switches between an object to be connected to the reference potential and an object to which the AC signal is applied, and controls the measurement unit to execute each measurement process and the measurement result and inspection of each measurement process A processing unit is provided for determining whether or not the defect has occurred based on the reference data.

  Further, in the substrate inspection apparatus according to claim 2, in the substrate inspection apparatus according to claim 1, the measurement unit connects one of the conductor and the first connection pattern to the reference potential, and The second connection pattern is connected to the reference potential, and changes according to the current flowing from the other to the other in the state where the AC signal is applied to the other of the conductor and the first connection pattern. A first measurement process for measuring the electrical parameter, connecting one of the conductor and the first connection pattern to the reference potential, and disconnecting the second connection pattern from the reference potential The electric power that changes according to the current flowing from the other to the other in the state where the AC signal is applied to the other of the conductor and the first connection pattern A second measurement process for measuring a parameter; connecting one of the conductor and the second connection pattern to the reference potential; and connecting the first connection pattern to the reference potential; A third measurement process for measuring the electrical parameter that changes in accordance with the current flowing from the other to the other in a state where the AC signal is applied to the other of the second connection pattern and the second connection pattern; Any one of the second connection patterns is connected to the reference potential, the first connection pattern is disconnected from the reference potential, and the AC signal is applied to the other of the conductor and the second connection pattern. Measurement with the fourth measurement process for measuring the electrical parameter that changes according to the current flowing from the other to the one in the state of applying The first measurement process and the third measurement process are executed as the measurement process A according to the control of the processing unit, and the second measurement process and the fourth measurement process are performed. The measurement process B is executed.

  Furthermore, the substrate inspection apparatus according to claim 3 is the substrate inspection apparatus according to claim 2, wherein the processing unit preliminarily defines only one measurement result of the first measurement process and the third measurement process. It is determined that the defect does not occur when the measurement results of the other three measurement processes are within the reference range, and the measurement of two of the measurement processes is performed. When the result is out of the reference range, and the measurement results of the other two measurement processes are within the reference range, and when all the measurement results of the respective measurement processes are out of the reference range, the defect is Determine that it has occurred.

  According to a fourth aspect of the present invention, there is provided the substrate inspection apparatus according to any one of the first to third aspects, wherein the first probe connected to the first connection pattern and the second connection pattern are used. A second switch to be connected; a first switch for connecting and disconnecting the first probe and the reference potential according to control of the processing unit; and a second switch for connecting and disconnecting the second probe and reference potential according to control of the processing unit. 2 switches.

  Furthermore, the substrate inspection apparatus according to claim 5 is the substrate inspection apparatus according to any one of claims 1 to 4, wherein the electrode as the conductor and the electrode surface of each internal electrode according to the control of the processing unit. And a moving mechanism for moving the electrode to an opposing position.

  The substrate inspection method according to claim 6 includes a multilayer capacitor in which a plurality of internal electrodes are connected to a pair of external electrodes, respectively, and one of the external electrodes is connected to the first connection pattern. In addition, with respect to the inspection target substrate in which the other of the external electrodes is connected to the second connection pattern, the connection failure of the one external electrode with respect to the first connection pattern, the other with respect to the second connection pattern Board inspection for electrically inspecting whether any one of defective connection of external electrodes, disconnection of the first connection pattern, disconnection of the second connection pattern, and damage to the multilayer capacitor has occurred. In the method, any two of the conductor, the first connection pattern, and the second connection pattern arranged opposite to the electrode surface of each internal electrode are connected to a reference potential. And measuring process A for measuring an electrical parameter in a state where an AC signal is applied to one not connected to the reference potential, and one of the two connected to the reference potential in the measuring process A A measurement process B for measuring the electrical parameter in a state in which the AC signal is applied to one that is disconnected from the reference potential and is not connected to the reference potential in the measurement process A; The target to which the AC signal is applied is switched and executed, and it is determined whether or not the defect has occurred based on the measurement result of each measurement process and the reference data for inspection.

  The substrate inspection method according to claim 7 is the substrate inspection method according to claim 6, wherein either one of the conductor and the first connection pattern is connected to the reference potential, and the second connection is used. The electrical parameter that changes according to the current flowing from the other to the one of the conductor and the first connection pattern in a state where the pattern is connected to the reference potential and the AC signal is applied to the other of the conductor and the first connection pattern One of the conductor and the first connection pattern is connected to the reference potential, and the second connection pattern is disconnected from the reference potential, and the conductor and the first connection In the state where the AC signal is applied to the other of the first connection pattern, the electrical parameter that changes according to the current flowing from the other to the one of the other A second measurement process to be determined, one of the conductor and the second connection pattern is connected to the reference potential, and the first connection pattern is connected to the reference potential, and the conductor and the second A third measurement process for measuring the electrical parameter that changes in accordance with a current flowing from the other to the other in a state in which the AC signal is applied to the other of the second connection pattern, the conductor, and the second One of the two connection patterns is connected to the reference potential, the first connection pattern is disconnected from the reference potential, and the AC signal is applied to the other of the conductor and the second connection pattern. Before the four measurement processes including the fourth measurement process for measuring the electrical parameter that changes in accordance with the current flowing from the other to the one in the state that has been performed. A first measurement process and the third measurement process executed as the measurement process A, and executes the second measurement process, and the fourth measurement process as the measurement process B.

  In the substrate inspection apparatus according to claim 1, and the substrate inspection method according to claim 6, the measurement processes A and B are executed by switching the object to be connected to the reference potential and the object to which the AC signal is applied, and the measurement of each measurement process is performed. It is determined whether a defect has occurred based on the result and the reference data for inspection. In this case, in the substrate inspection apparatus according to claim 2 and the substrate inspection method according to claim 7, the first measurement process and the third measurement process are executed as the measurement process A, and the second measurement process and the fourth measurement process are performed. Is executed as measurement process B. Therefore, when a defect or the like between one external electrode and the first connection pattern exists, the first measurement is performed regardless of whether or not a defect or the like exists between the other external electrode and the second connection pattern. When the electrical parameter measured in both the process and the second measurement process is out of the reference range and there is a defect between the other external electrode and the second connection pattern, the one external electrode and the first connection Regardless of whether there is a defect or the like between the patterns, the electrical parameter measured in both the third measurement process and the fourth measurement process is out of the reference range, and one of the external electrodes and the first connection One of the first measurement process and the third measurement process when there is no defect between the patterns for use and no defect between the other external electrode and the second connection pattern. Because the electrical parameters measured in step 1 are out of the reference range, the test target board having a built-in multilayer capacitor that cannot be directly connected to probes on both external electrodes has a defect based on the measurement results for each measurement process. It can be reliably checked whether or not it exists.

  According to the substrate inspection apparatus of claim 3, it is determined that there is no defect when only one measurement result of the first measurement process and the third measurement process is out of the reference range, By determining that a defect has occurred when the measurement results of two of the measurement processes are out of the reference range, and when all the measurement results of each measurement process are out of the reference range By defining the reference range according to the capacity of the multilayer capacitor mounted on the board to be inspected and its mounting state, it is possible to quickly determine whether there is a defect based on the inspection result of each measurement process. Can be easily distinguished.

  According to the substrate inspection apparatus of the fourth aspect, since the first probe, the second probe, the first switch, and the second switch are provided, for example, the first probe and the second probe are connected to the first connection pattern. Unlike the configuration in which the probe is connected to the reference potential by probing to the second connection pattern or separated from the first connection pattern or the second connection pattern, the first probe and the second probe are Since the first probe and the second probe can be disconnected from the reference potential by the first switch and the second switch while being connected to the first connection pattern and the second connection pattern, the inspection target The time required for the substrate inspection can be sufficiently shortened.

  Furthermore, according to the substrate inspection apparatus according to claim 5, by providing an electrode as a conductor and a moving mechanism for moving the electrode, for a substrate to be inspected that does not have a conductor pattern or the like that can be used as a conductor, The electrode can be used as a conductor for reliable inspection.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. It is explanatory drawing for demonstrating the connection aspect of the capacitor | condenser 21 and connection pattern 22a, 22b, 23 in the test object board | substrate 20, and the probes 4a-4c. It is explanatory drawing for demonstrating the relationship between the measurement result of each measurement process made into the test object board | substrate 20 of the state shown in FIG. 2, and the presence or absence of connection failure Xa, Xb. It is explanatory drawing for demonstrating the connection aspect of the other capacitor | condenser 21 and connection pattern 22a, 22b, 23 in the test object board | substrate 20, and the probes 4a-4c. FIG. 5 is an explanatory diagram for explaining the relationship between the measurement results of each measurement process for the inspection target substrate 20 in the state shown in FIG. 4 and the presence or absence of connection failures Xa and Xb. FIG. 5 is an explanatory diagram for explaining a disconnection Xc generated in connection patterns 22a, 22b, and 23 on a test target substrate 20 and a crack Xd generated in a capacitor 21; It is explanatory drawing for demonstrating the connection aspect of the further capacitor | condenser 21, the connection patterns 22a, 22b, and 23 and the conductor pattern 24 in the test object board | substrate 20, and the probes 4a, 4b, and 4d.

  Embodiments of a substrate inspection apparatus and a substrate inspection method according to the present invention will be described below with reference to the accompanying drawings.

  A substrate inspection apparatus 1 shown in FIG. 1 is an example of a “substrate inspection apparatus”, and includes a substrate holding unit 2, moving mechanisms 3 a to 3 c, probes 4 a to 4 c, switches 5 a and 5 b, a measurement unit 6, an operation unit 7, The display unit 8, the control unit 9, and the storage unit 10 are provided, and the inspection target substrate 20 can be electrically inspected according to a “substrate inspection method” described later.

  In this case, the inspection target substrate 20 is a multilayer substrate which is an example of the “inspection target substrate”, and includes, as an example, three capacitors 21a to 21c (hereinafter also referred to as “capacitor 21” when not distinguished). ing. In FIG. 1 and FIGS. 2, 4, 6, and 7 to be referred to later, illustration of electronic components (mounting components) other than the capacitor 21 is omitted. The capacitor 21 is an example of a “multilayer capacitor” and, as shown in FIGS. 2 and 4, a pair of external electrodes 31a and 31b (an example of “one external electrode” and “the other external electrode”) and A plurality of internal electrodes 32a connected to the external electrode 31a and a plurality of internal electrodes 32b connected to the external electrode 31b are provided.

  Further, in the inspection target substrate 20 of this example, as shown in FIG. 1, as an example, the external electrode 31a of the capacitor 21a is connected to the connection pattern 22a alone, and the external electrodes 31a of the capacitors 21b and 21c are connected. And the external electrodes 31b of the capacitors 21a to 21c are commonly connected to the connection pattern 23 (the external electrodes 31a of the capacitors 21b and 21c are connected to the connection pattern 22b). And the external electrodes 31b of the capacitors 21a to 21c are connected to each other via the connection pattern 23).

  In this case, in this example, the connection patterns 22a and 22b (hereinafter also referred to as “connection pattern 22” when not distinguished) correspond to the “first connection pattern”, and the connection pattern 23 is “second connection”. Corresponds to “use pattern”. 2, 4, 6, and 7, in order to facilitate understanding of the configuration of the “inspection target substrate”, the connection pattern 22 is directed from the lower ends of the external electrodes 31 a and 31 b toward the lower surface of the inspection target substrate 20. , 23 are drawn out at the shortest distance (example drawn out directly below the “capacitor”), but the shape of the “connection pattern” is not limited to this, In some cases, the wiring pattern is formed on the inner layer or the outer layer of the “substrate” and is drawn away from the “external electrode of the capacitor” (not shown).

  On the other hand, the substrate holding unit 2 is configured to hold the inspection target substrate 20. The moving mechanisms 3a and 3b move the probes 4a and 4b toward the inspection target substrate 20 held by the substrate holding unit 2 in accordance with the control signals S1a and S1b from the control unit 9, thereby moving the probes 4a and 4b. Each of the connection patterns 22 and 23 is probed. The moving mechanism 3c is an example of a “moving mechanism”, and moves the probe 4c toward the inspection target substrate 20 held by the substrate holding unit 2 in accordance with the control signal S1c from the control unit 9 to inspect the inspection target substrate. By bringing the probe 4 c into contact with the surface of the probe 20, the probe 4 c is disposed opposite to the internal electrodes 32 a and 32 b of the capacitor 21 built in the inspection target substrate 20.

  The probe 4a corresponds to a “first probe”, and is attached to the moving mechanism 3a in the substrate inspection apparatus 1 of this example. The probe 4b corresponds to a “second probe”, and is attached to the moving mechanism 3b in the substrate inspection apparatus 1 of this example. Furthermore, the probe 4c is an example of an “electrode” as a “conductor”, and in the board inspection apparatus 1 of this example, the electrode surface (bottom surface) has a columnar shape (as an example, the same as one capacitor 21). The probe 4c is made of a (columnar) metal. As described above, the probe 4c is attached to the moving mechanism 3c, which is an example of the “moving mechanism”. The probe 4 c is connected to the current measurement port 6 b of the measurement unit 6 and connected to the ground potential (G potential: an example of “reference potential”) via the current measurement circuit of the measurement unit 6. Therefore, in this board | substrate inspection apparatus 1, the structure by which the probe 4c connected to the electric current measurement port 6b of the measurement part 6 becomes the L electric potential same as G electric potential (reference electric potential) is employ | adopted.

  In accordance with the control signal S2a from the control unit 9, the switch 5a switches the contact a connected to the probe 4a to the contact b connected to the ground potential (G potential) and the measurement signal output port 6a of the measurement unit 6. By connecting to one of the contacts c connected to (H potential), the connection pattern 22 to which the probe 4a is connected is connected to either the G potential or the measurement signal output port 6a (“AC” An example of a configuration in which “the other of the conductor and the first connection pattern” to which the “signal” is applied is the “first connection pattern”). The switch 5a is an example of a “first switch”, and the probe 4a is switched to the OPEN state in which the contact a is not connected to either the contact b or the contact c in accordance with the control signal S2a from the control unit 9. Is disconnected from the G potential.

  In accordance with the control signal S2b from the control unit 9, the switch 5b switches the contact a connected to the probe 4b to the contact b connected to the ground potential (G potential) and the measurement signal output port 6a of the measurement unit 6. By connecting to one of the contacts c connected to (H potential), the connection pattern 23 to which the probe 4b is connected is connected to either the G potential or the measurement signal output port 6a ("AC" An example of a configuration in which “the other of the conductor and the second connection pattern” to which the “signal” is applied is the “second connection pattern”). The switch 5b is an example of a “second switch”, and the probe 4b is switched to the OPEN state in which the contact a is not connected to either the contact b or the contact c in accordance with the control signal S2b from the control unit 9. Is disconnected from the G potential.

  The measurement unit 6 is an example of a “measurement unit”, and executes “measurement process A” and “measurement process B” in accordance with a control signal S3 from the control unit 9, and controls the measurement result as measurement result data D1. To the unit 9. In this case, as will be described later, for example, the measurement unit 6 includes, as an example, “first measurement process” as “measurement process A”, “second measurement process” as “measurement process B”, and “measurement process A”. “Third measurement process” and “fourth measurement process” as “measurement process B” are executed in this order. In addition, the execution order of each measurement process is not limited to said order, The structure and method performed in arbitrary orders can be employ | adopted. The measurement unit 6 includes a measurement signal output port 6a to which one of the probes 4a and 4b is connected by the switches 5a and 5b, and a current measurement port 6b to which the probe 4c is connected, and a measurement signal output port. A measurement signal output unit (not shown) connected to 6a and a current measurement circuit (not shown) connected to the current measurement port 6b are configured.

  Further, as will be described later, the measurement unit 6 outputs a measurement signal (an example of “AC signal”) from the measurement signal output port 6a according to the control of the control unit 9, and the current flowing into the current measurement port 6b. The value is measured by the current measurement circuit, and based on the voltage value of the measurement signal output from the measurement signal output port 6a, the current value measured by the current measurement circuit, and the phase difference between the measured current and the measurement signal, Capacitance of one capacitance component formed between the internal electrode 32a (or internal electrode 32b) of the capacitor 21 with which the probe 4c is opposed and the probe 4c (“according to the current flowing from the other to one of them) The measurement result data D1 is output. Each of the above “measurement processes” will be described in detail later.

  The operation unit 7 includes various operation switches for setting operation conditions (inspection conditions) of the substrate inspection apparatus 1, and outputs an operation signal corresponding to the switch operation to the control unit 9. The display unit 8 is an operation condition setting screen for setting an operation condition (inspection condition) of the substrate inspection apparatus 1 according to the control of the control unit 9, an inspection result notification screen for notifying an inspection result of the inspection target substrate 20, and the like. Various display screens (none of which are shown).

  The controller 9 controls the board inspection apparatus 1 as a whole. Specifically, the control unit 9 corresponds to a “processing unit” and outputs control signals S1a and S1b to the moving mechanisms 3a and 3b to connect the probes 4a and 4b to the connection patterns 22 and 23 (probing them). ). Further, the control unit 9 outputs a control signal S1c to the moving mechanism 3c so that the probe 4c is opposed to the internal electrodes 32a and 32b in the capacitor 21 to be inspected. Further, the control unit 9 outputs control signals S2a and S2b to the switches 5a and 5b to connect the probes 4a and 4b to either the G potential or the H potential (measurement signal output port 6a of the measurement unit 6). Or switch to the OPEN state.

  In addition, the control unit 9 outputs the control signal S3 to the measurement unit 6 to execute each of the above “measurement processes”. In this case, in the substrate inspection apparatus 1 of the present example, as described above, a predetermined order (specifically, as an example, “first measurement process”, “second measurement process”, “third measurement process”). ”And“ fourth measurement process ”), each“ measurement process ”is executed. Further, the control unit 9 stores the measurement result data D1 output from the measurement unit 6 in the storage unit 10, and based on the measurement result data D1 and the inspection data D0 stored in the storage unit 10, Connection failure Xa of the external electrode 31a to the connection pattern 22 (see FIGS. 2 and 4), connection failure Xb of the external electrode 31b to the connection pattern 23 (see FIGS. 2 and 4), and connection It is determined whether or not any of the disconnection Xc (see FIG. 6) of the patterns 22 and 23 and the breakage of the capacitor 21 (crack Xd: see FIG. 6) has occurred, and the determination result is used as inspection result data D2. Store in the storage unit 10. A specific method for determining whether or not a defect has occurred will be described later in detail.

  The storage unit 10 stores the inspection data D0, the measurement result data D1, the inspection result data D2, and the like. In this case, the inspection data D0 includes “inspection procedure data” that can specify the inspection procedure for the inspection target substrate 20 and “inspection reference data for determining whether or not the inspection target substrate 20 is defective. "Is recorded and configured. Specifically, in the inspection data D0, the control unit 9 controls the moving mechanisms 3a and 3b to position the probes 4a and 4b to be probed, the moving timing thereof, and the control unit 9 controls the moving mechanism 3c. Then, the position where the probe 4c should be probed and its movement timing, the potential at which the control unit 9 controls the switches 5a and 5b to connect and disconnect the probes 4a and 4b, and the switching timing thereof, and the control unit 9 measure The order in which each “measurement process” should be executed by controlling the unit 6 and the timing thereof are recorded as “inspection procedure data”. Further, in the inspection data D0, it is possible to specify the relationship between the magnitude relationship between the results of each “measurement process” (the value of the measurement result data D1) executed by the measurement unit 6 and the failure occurring in the capacitor 21. Information is recorded as “inspection reference data”.

  When the inspection target substrate 20 is inspected by the substrate inspection apparatus 1, first, the inspection target substrate 20 is held by the substrate holding unit 2. Next, when a start switch (not shown) of the operation unit 7 is operated, the control unit 9 starts an inspection process for the inspection target substrate 20. In the actual inspection of the inspection target substrate 20, various electronic components other than the capacitors 21 and the presence / absence of defects related to the connection pattern are also inspected. However, the “substrate inspection apparatus” and the “substrate inspection method” are understood. In order to facilitate the inspection, description of inspection items other than the inspection items related to the capacitor 21 is omitted. At this time, as an example, the control unit 9 outputs the control signals S1a and S1b to the moving mechanisms 3a and 3b in accordance with the inspection data D0, so that the control unit 9 is held by the substrate holding unit 2 as shown in FIG. The probe 4a is probed to the connection pattern 22a of the inspection target substrate 20, and the probe 4b is probed to the connection pattern 23.

  Next, the control unit 9 outputs the control signal S1c to the moving mechanism 3c according to the inspection data D0, thereby probing the probe 4c on the surface of the mounting portion of the capacitor 21a on the inspection target board 20. At this time, as shown in the figure, the probe 4c is brought into contact with the surface of the inspection target substrate 20 and is probed so that the capacitor 21a built in the inspection target substrate 20 and the inspection target substrate 20 are connected. A state in which a gap made of a non-conductive material is generated between the internal electrodes 32a and 32b of the capacitor 21a and the electrode surface (bottom surface) of the probe 4c due to the base material existing between the surfaces (the internal electrodes 32a and 32b). To the probe 4c without contacting with each other, and a capacitive component is formed).

  Subsequently, the control unit 9 outputs the control signal S2a to the switch 5a, thereby connecting the contact a connected to the probe 4a to the contact c connected to the measurement signal output port 6a of the measurement unit 6. As a result, the probe 4a is connected to the measurement signal output port 6a (the port that becomes the H potential when the measurement signal is output) ("the other of the conductor and the first connection pattern" is the "first connection pattern"). Example of connection pattern 22a (connection pattern in which probe 4a is probed)). Further, the control unit 9 outputs the control signal S2b to the switch 5b, thereby connecting the contact a connected to the probe 4b to the contact b connected to the G potential, thereby connecting the probe 4b to the G potential. (Example of processing for connecting the connection pattern 23 as the “second connection pattern” in which the probe 4b is probed to the G potential as the “reference potential”).

  In the substrate inspection apparatus 1 of this example, the probe 4c is always connected to the current measurement port 6b of the measurement unit 6 (L potential port controlled to be the same potential as the G potential when the measurement signal is output). ("One of the conductor and the first connection pattern" is the probe 4c as the "conductor", and this probe 4c is the L potential having the same potential as the G potential as the "reference potential". Example of configuration connected to

  Next, the control unit 9 outputs the control signal S3 to the measurement unit 6 to start the “first measurement process” as the “measurement process A”. At this time, the measurement unit 6 outputs an AC signal as a measurement signal from the measurement signal output port 6a and measures the current value of the current flowing from the current measurement port 6b. Further, the measurement unit 6 is configured so that the probe 4c is opposed based on the measured current value, the voltage value of the measurement signal output from the measurement signal output port 6a, and the phase difference between the measured current and the measurement signal. The capacitance of the capacitance component formed between the internal electrode 32a of the capacitor 21a and the probe 4c is measured and output to the control unit 9 as measurement result data D1 ("first connection pattern" In the state where the measurement signal (AC signal) is applied to the connection pattern 22a as described above, the connection pattern 22a, the external electrode 31a, the internal electrode 32a, and the capacitance component between the internal electrode 32a and the probe 4c An example of a process for measuring an electrical parameter (capacitance) that changes in accordance with a current flowing through the probe 4 c as a “conductor”. In response to this, the control unit 9 stores the measurement result data D1 output from the measurement unit 6 in the storage unit 10 as the measurement result of the “first measurement process”.

  At this time, when there is no connection failure Xb between the external electrode 31b of the capacitor 21a and the connection pattern 23 (when the external electrode 31b is normally connected to the connection pattern 23), the probe 4b, each internal electrode 32b becomes G potential (that is, the same potential as the current measurement port 6b as L potential to which the probe 4c is connected) via the connection pattern 23 and the external electrode 31b. Therefore, when there is no connection failure Xa between the external electrode 31a of the capacitor 21a and the connection pattern 22a (when the capacitor 21a is normally connected to the connection pattern 22a), the measurement unit 6 When a measurement signal is output from the measurement signal output port 6a, measurement is performed via the capacitance component between the probe 4a, the connection pattern 22a, the external electrode 31a, each internal electrode 32a, and the internal electrodes 32a and 32b. A current flows from the portion 6 to each internal electrode 32b, and this current flows to the G potential via the external electrode 31b, the connection pattern 23, and the probe 4b.

  Therefore, when both of the connection failures Xa and Xb are not present, almost no current flows from the internal electrode 32a to the probe 4c via the capacitance component between the internal electrode 32a and the probe 4c. A current value of “0 mA” will be measured. As a result, when there is no connection failure Xa, Xb, as shown in FIG. 3, the measurement unit 6 measures a capacitance value of “0 pF” and outputs it as measurement result data D1. Depending on the size of the capacitor 21a (area of the internal electrodes 32a and 32b) and the separation distance between the capacitor 21a and the probe 4c (that is, the size of the capacitance component formed between the capacitor 21a and the probe 4c). In this case, a very small current flows from each internal electrode 32a to the probe 4c, and thus a very small capacitance may be measured. Hereinafter, this very small capacitance (substantially “ (Capacitance of 0 pF) will be described as “0 pF”.

  On the other hand, when a connection failure Xa exists between the external electrode 31a of the capacitor 21a and the connection pattern 22a, the connection failure Xb exists when the measurement signal is output from the measurement signal output port 6a as described above. Regardless of whether or not there is current, current does not flow from the internal electrode 32a to the probe 4c via the capacitive component between the internal electrode 32a and the probe 4c, so that the current value of “0 mA” is measured by the measurement unit 6. . As a result, when there is a connection failure Xa, as shown in FIG. 3, the measurement unit 6 measures the capacitance value of “0 pF” and outputs it as measurement result data D1.

  Further, when there is a connection failure Xb, each internal electrode 32b does not have a G potential. Therefore, when there is no connection failure Xa, a measurement signal is output from the measurement signal output port 6a of the measurement unit 6. A current flows from each internal electrode 32a to the probe 4c via the capacitance component between the internal electrode 32a and the probe 4c via the probe 4a, the connection pattern 22a, and the external electrode 31a. It will flow into the measurement port 6b. Therefore, as a result of measuring a certain large current value by the measuring unit 6, as shown in FIG. 3, a capacitance value of about “several pF” is measured by the measuring unit 6 and output as measurement result data D1. . As described above, in the “first measurement process”, the capacitance of “0 pF” or “several pF” is measured depending on the presence or absence of connection failure Xa, Xb between the capacitor 21a and the connection patterns 22a, 23. The Thus, the “first measurement process” is completed.

  Next, the control unit 9 outputs the control signal S2a to the switch 5a, thereby maintaining the state where the contact point a is connected to the contact point c, and outputting the control signal S2b to the switch 5b, thereby switching to the OPEN state. The probe 4b is separated from the G potential by separating the contact point a from the G potential (the connection pattern 23 as the “second connection pattern” on which the probe 4b is probed is the G potential as the “reference potential”). An example of a process of disconnecting from a. Next, the control unit 9 outputs the control signal S3 to the measurement unit 6 to execute the “second measurement process” as the “measurement process B”. The capacitance measurement procedure is the same as the “first measurement process” described above, and thus the description thereof is omitted. In addition, the control unit 9 stores the measurement result data D1 output from the measurement unit 6 in the storage unit 10 as the measurement result of the “second measurement process”.

  At this time, in this state in which the switch 5a is switched to the OPEN state (that is, the state in which each internal electrode 32b is disconnected from the G potential), when the measurement signal is output, the connection between the internal electrode 32a and the probe 4c is performed. There is no element that obstructs the flow of current from the internal electrode 32a to the probe 4c via the capacitive component. Therefore, when there is no connection failure Xa, when the measurement signal is output from the measurement signal output port 6a of the measurement unit 6, the probe 4a, the connection pattern 22a and the connection pattern 22a A current flows from each internal electrode 32a through the external electrode 31a to the probe 4c via a capacitive component between the internal electrode 32a and the probe 4c, and this current flows into the current measurement port 6b of the measurement unit 6. Therefore, as a result of measuring a certain large current value by the measuring unit 6, as shown in FIG. 3, a capacitance value of about “several pF” is measured by the measuring unit 6 and output as measurement result data D1. .

  On the other hand, when a connection failure Xa exists between the external electrode 31a of the capacitor 21a and the connection pattern 22a, the connection failure Xb exists when the measurement signal is output from the measurement signal output port 6a as described above. Regardless of the presence or absence of the current, no current flows from the internal electrode 32a to the probe 4c via the capacitive component between the internal electrode 32a and the probe 4c, so that the current value of “0 mA” is measured by the measurement unit 6. Become. As a result, as shown in FIG. 3, when the connection failure Xa exists, the capacitance value of “0 pF” is measured by the measurement unit 6 regardless of the presence or absence of the connection failure Xb and is output as the measurement result data D1. Is done. Thus, also in this “second measurement process”, the capacitance of “0 pF” or “several pF” is measured depending on the presence or absence of connection failure Xa, Xb between the capacitor 21a and the connection patterns 22a, 23. Is done. Thus, the “second measurement process” is completed.

  Subsequently, the control unit 9 outputs the control signal S2a to the switch 5a, thereby connecting the contact a connected to the probe 4a to the contact b connected to the G potential, thereby bringing the probe 4a to the G potential. Connection (an example of processing for connecting the connection pattern 22a as the “first connection pattern” in which the probe 4a is probed to the G potential as the “reference potential”). Further, the control unit 9 outputs the control signal S2b to the switch 5b, thereby connecting the contact a connected to the probe 4b to the contact c connected to the measurement signal output port 6a of the measurement unit 6. Then, the probe 4a is connected to the measurement signal output port 6a (the port having the H potential) (the other of the conductor and the second connection pattern) is the connection pattern 23 (probe 4b). Is a connection pattern that is probing)).

  Next, the control unit 9 starts the “third measurement process” as the “measurement process A” by outputting the control signal S <b> 3 to the measurement unit 6. At this time, the measurement unit 6 outputs an AC signal as a measurement signal from the measurement signal output port 6a and measures the current value of the current flowing from the current measurement port 6b. Further, the measurement unit 6 is configured so that the probe 4c is opposed based on the measured current value, the voltage value of the measurement signal output from the measurement signal output port 6a, and the phase difference between the measured current and the measurement signal. The capacitance of the capacitance component formed between the internal electrode 32a of the capacitor 21a and the probe 4c is measured and output to the control unit 9 as measurement result data D1 ("second connection pattern") In the state in which the measurement signal (AC signal) is applied to the connection pattern 23, the connection pattern 23 is connected to the external electrode 31b, the internal electrode 32b, and the capacitance component between the internal electrode 32b and the probe 4c. An example of a process for measuring an electrical parameter (capacitance) that changes in accordance with a current flowing through the probe 4c as a “conductor”. In response to this, the control unit 9 stores the measurement result data D1 output from the measurement unit 6 in the storage unit 10 as the measurement result of the “third measurement process”.

  In this case, in the example shown in FIG. 2, the element (electrode) that inhibits the current from flowing from the internal electrode 32b to the probe 4c via the capacitive component between the internal electrode 32b and the probe 4c is the internal electrode 32b and the probe. 4c does not exist. Therefore, in the state where the connection failure Xb does not exist, when the measurement signal is output from the measurement signal output port 6a of the measurement unit 6, the probe 4b, the connection pattern, regardless of the presence or absence of the connection failure Xa. Current flows from each internal electrode 32b to the probe 4c via the capacitance component between the internal electrode 32b and the probe 4c, and this current flows into the current measurement port 6b of the measurement unit 6 via the external electrode 31b and the external electrode 31b. Become. Therefore, as a result of measuring a certain large current value by the measuring unit 6, as shown in FIG. 3, a capacitance value of about “several pF” is measured by the measuring unit 6 and output as measurement result data D1. .

  Further, when the connection failure Xb exists, when the measurement signal is output from the measurement signal output port 6a as described above, the capacitance between the internal electrode 32b and the probe 4c regardless of the presence or absence of the connection failure Xa. Since no current flows from the internal electrode 32 b to the probe 4 c via the component, the current value of “0 mA” is measured by the measurement unit 6. As a result, as shown in FIG. 3, when the connection failure Xb exists, the capacitance value of “0 pF” is measured by the measurement unit 6 regardless of the presence or absence of the connection failure Xa and is output as the measurement result data D1. Is done. Thus, also in this “third measurement process”, the capacitance of “0 pF” or “several pF” is measured depending on the presence or absence of connection failure Xa, Xb between the capacitor 21a and the connection patterns 22a, 23. Is done. Thus, the “third measurement process” is completed.

  Next, the control unit 9 outputs the control signal S2b to the switch 5b, thereby maintaining the state where the contact point a is connected to the contact point c, and outputting the control signal S2a to the switch 5a, thereby switching to the OPEN state. The probe 4a is separated from the G potential by separating the contact point a from the G potential (the connection pattern 22a as the “first connection pattern” on which the probe 4a is probed is used as the “G potential” as the “reference potential”. An example of a process of disconnecting from a. Next, the control unit 9 outputs the control signal S3 to the measurement unit 6 to execute the “fourth measurement process” as the “measurement process B”. The capacitance measurement procedure is the same as the “third measurement process” described above, and thus the description thereof is omitted. In addition, the control unit 9 stores the measurement result data D1 output from the measurement unit 6 in the storage unit 10 as the measurement result of the “fourth measurement process”.

  At this time, in the example shown in FIG. 2, as described above, the element (electrode) that inhibits the flow of current from the internal electrode 32b to the probe 4c via the capacitive component between the internal electrode 32 and the probe 4c is provided inside. There is no state between the electrode 32b and the probe 4c. Therefore, in the “fourth measurement process”, as shown in FIG. 3, in the same manner as the “third measurement process” described above, in the state where the connection failure Xb does not exist, the presence or absence of the connection failure Xa is determined. Regardless, the capacitance of “several pF” is measured and output as measurement result data D1, and in the state where the connection failure Xb exists, “0 pF” is set regardless of the presence or absence of the connection failure Xa. The capacitance is measured and output as measurement result data D1. Thus, also in this “fourth measurement process”, the capacitance of “0 pF” or “several pF” is measured depending on the presence or absence of connection failure Xa, Xb between the capacitor 21a and the connection patterns 22a, 23. Is done. Thus, the “fourth measurement process” is completed.

  Next, the control unit 9 determines the capacitor 21a and the connection pattern 22a based on the measurement result data D1 for each “measurement process” stored in the storage unit 10 and the inspection data D0 stored in the storage unit 10. , 23, whether or not there is a connection failure Xa, Xb is determined, and the determination result is stored in the storage unit 10 as inspection result data D2.

  Specifically, as shown in FIG. 3, when both of the connection failures Xa and Xb do not exist (when no “failure” occurs), the electrostatic potential of “0 pF” in the “first measurement process”. The capacitance is measured, the capacitance of “several pF” is measured in the “second measurement process”, the capacitance of “several pF” is measured in the “third measurement process”, and the “fourth measurement” is performed. In the “Process”, the capacitance of “several pF” is measured (only the measurement result of “the first measurement process” which is “one of the first measurement process and the third measurement process” is “predefined. An example in which the reference capacity range is not within the reference capacity range and the measurement results of the other three “measurement processes” are within the reference capacity range). Accordingly, the control unit 9 determines that “0 pF”, “several pF”, “several pF”, and “several pF” in the four “measuring processes” from the “first measuring process” to the “fourth measuring process”. When the measurement result of the pattern Pa is obtained, there is no connection failure Xa, Xb between the capacitor 21a and the connection patterns 22a, 23, and the capacitor 21a is normally connected to the connection patterns 22a, 23. The determination result is stored in the storage unit 10 as inspection result data D2.

  In this case, as an example, when the capacitor 21a is a multilayer capacitor having a capacitance of 2 μf, a capacitance of about “10 pF” is measured as the “several pF”, and the above “0 pF” is measured. A capacitance of about “0.1 pF” is measured. Therefore, when inspecting such a capacitor 21a, for example, ± 50% (that is, 5 pF to 15 pF) may be defined as the “reference capacitance range” based on the above “10 pF”.

  Further, when the connection failure Xa exists and the connection failure Xb does not exist, the capacitance of “0 pF” is measured in the “first measurement process” and the capacitance of “0 pF” in the “second measurement process”. The capacitance is measured, the capacitance of “several pF” is measured in “third measurement process”, and the capacitance of “several pF” is measured in “fourth measurement process” (four “ The measurement results of the two “measurement processes” of the “measurement process” are out of the reference capacity range as the “reference range”, and the measurement results of the other two “measurement processes” are the reference capacity range as the “reference range”. An example of the inside). Accordingly, the control unit 9 determines the pattern of “0 pF”, “0 pF”, “number pF”, and “number pF” in the four “measurement processes” from the “first measurement process” to the “fourth measurement process”. When the measurement result of Pb is obtained, it is determined that there is a connection failure Xa between the capacitor 21a (external electrode 31a) and the connection pattern 22a, and the determination result is stored in the storage unit 10 as inspection result data D2. Let

  Furthermore, when the connection failure Xa does not exist and the connection failure Xb exists, the capacitance of “several pF” is measured in the “first measurement process”, and “several pF” in the “second measurement process”. , The capacitance of “0 pF” is measured in the “third measurement process”, and the capacitance of “0 pF” is measured in the “fourth measurement process”. The measurement results of two “measurement processes” of the “measurement processes” are out of the reference capacity range as the “reference range”, and the measurement results of the other two “measurement processes” are the reference capacity as the “reference range”. Another example when in range). Therefore, the control unit 9 uses the patterns “number pF”, “number pF”, “0 pF”, and “0 pF” in the four “measurement processes” from the “first measurement process” to the “fourth measurement process”. When the measurement result of Pc is obtained, it is determined that there is a connection failure Xb between the capacitor 21a (external electrode 31b) and the connection pattern 23, and the determination result is stored in the storage unit 10 as inspection result data D2. Let

  Further, when both of the connection failures Xa and Xb exist, the capacitance of “0 pF” is measured in all of the “first measurement process” to the “fourth measurement process” (for each “measurement process”). An example when all measurement results are outside the “reference capacity range” as the “reference range”). Accordingly, the control unit 9 uses the patterns “0 pF”, “0 pF”, “0 pF”, and “0 pF” in all four “measurement processes” from the “first measurement process” to the “fourth measurement process”. When the measurement result of Pd is obtained, there is a connection failure Xa between the capacitor 21a (external electrode 31a) and the connection pattern 22a, and between the capacitor 21a (external electrode 31b) and the connection pattern 23. The connection failure Xb is determined to exist, and the determination result is stored in the storage unit 10 as the inspection result data D2.

  Thereafter, the control unit 9 causes the display unit 8 to display the inspection result based on the inspection result data D2 stored in the storage unit 10, and the connection failure between the capacitor 21a and the connection pattern 22a and the connection pattern 23. The inspection of whether Xa and Xb exist is finished. Subsequently, the control unit 9 starts checking whether or not there is a connection failure Xa, Xb between the capacitor 21b and the connection patterns 22b, 23. Specifically, the control unit 9 outputs the control signals S1a and S1b to the moving mechanisms 3a and 3b according to the inspection data D0, thereby maintaining the state in which the probe 4b is probed in the connection pattern 23, while FIG. As indicated by a broken line in FIG. 1, the probe 4 a is probed to the connection pattern 22 b of the inspection target substrate 20.

  Next, the control unit 9 outputs the control signal S1c to the moving mechanism 3c in accordance with the inspection data D0, whereby the probe 4c is placed on the surface of the mounting portion of the capacitor 21b on the inspection target board 20 as shown by the broken line in FIG. Probing. At this time, by probing the probe 4c so as to contact the surface of the inspection target substrate 20, each internal portion of the capacitor 21b is caused by a base material existing between the capacitor 21b and the surface of the inspection target substrate 20. A state in which a gap made of a non-conductive material is generated between the electrodes 32a, 32b and the electrode surface (bottom surface) of the probe 4c (the probe 4c is opposed to each internal electrode 32a, 32b without being in contact with the capacitance component). Formed state).

  In this case, as described above, in the substrate inspection apparatus 1 of this example, the probe 4c is configured such that the electrode surface (bottom surface) has a columnar shape comparable to that of one capacitor 21. Accordingly, by probing the probe 4c on the surface of the mounting portion of the capacitor 21b as described above, the probe 4c is opposed to only the capacitor 21b (the internal electrodes 32a and 32b of the capacitor 21b), and the connection pattern 22b is interposed. Thus, the internal electrode 32a of the capacitor 21c connected to the internal electrode 32a of the capacitor 21b does not face the probe 4c. Thereby, in the board inspection apparatus 1 of this example, each “measurement” at the time of inspection of the capacitor 21b is different from the configuration / method in which a large electrode or the like facing both the capacitors 21b and 21c is used as the “conductor”. In the “processing”, a situation in which a current flows from the internal electrode 32a of the capacitor 21c to the probe 4c and affects the inspection result of the capacitor 21b is avoided.

  Next, the control unit 9 performs switching from the “first measurement process” in the same procedure as the four “measurement processes” for the capacitor 21a, while switching the connection of the probes 4a and 4b by the switches 5a and 5b. Each “measurement process” of the “fourth measurement process” is executed. Further, the control unit 9 connects between the capacitor 21b and the connection patterns 22b and 23 based on the measurement result data D1 for each “measurement process” and the test data D0 stored in the storage unit 10. It is determined whether or not the defects Xa and Xb exist, and the determination result is stored in the storage unit 10 as the inspection result data D2, and the determination result is displayed on the display unit 8. Thereby, the inspection of whether or not there is a connection failure Xa, Xb between the capacitor 21b and the connection pattern 22b and the connection pattern 23 is completed. Thereafter, the control unit 9 performs an inspection as to whether or not there is a connection failure Xa, Xb between the capacitor 21c and the connection patterns 22b, 23, and causes the display unit 8 to display the inspection result. Thus, a series of inspections for the inspection target substrate 20 is completed.

  In this case, it is difficult for the capacitor 21 to be inspected to distinguish the external electrodes 31a and 31b from the appearance. Therefore, in the above example, as shown in FIG. 2, one of the internal electrodes 32b is mounted so as to be closer to the probe 4c than the internal electrode 32a (internal electrode 32b rather than internal electrode 32a). Probing so that the probe 4c is located near the probe 4c), as shown in FIG. 4, one of the internal electrodes 32a is mounted so as to be located closer to the probe 4c than the internal electrode 32b. (Probing so that the probe 4c is positioned closer to the internal electrode 32a than to the internal electrode 32b). In FIG. 6 and FIGS. 6 and 7 to be referred to later, elements having the same functions as those described with reference to FIG.

  When inspecting whether or not connection failures Xa and Xb exist between the mounted capacitor 21 and the connection patterns 22 and 23 shown in FIG. 4, a procedure similar to the procedure described with reference to FIG. By executing four “measurement processes” from “first measurement process” to “fourth measurement process”, any one of the four patterns PA, Pb to Pd shown in FIG. Capacitance is measured. Although detailed description is omitted, in the example shown in FIG. 4, unlike the example shown in FIG. 2, the measurement of the “third measurement process” is performed when both the connection failures Xa and Xb do not exist. Only the result is a pattern PA different from the measurement results of the other three “measurement processes”. Therefore, the control unit 9 is based on the measurement result data D1 of each “measurement process” stored in the storage unit 10 and the inspection data D0 stored in the storage unit 10 (measurement results are patterns PA, Pb˜ Whether or not there is a connection failure Xa, Xb is determined, and the inspection result is displayed on the display unit 8.

  In order to facilitate understanding of the configuration of the “substrate inspection apparatus” and the specific procedure of the “substrate inspection method”, based on the measurement results of “first measurement process” to “fourth measurement process”. Although the example of inspecting whether or not the connection failures Xa and Xb exist has been described, instead of the connection failure Xa (or in addition to the connection failure Xa), as shown in FIG. When the disconnection Xc exists, instead of the connection failure Xb (or in addition to the connection failure Xb), when the disconnection Xc exists in the connection pattern 23, it replaces the connection failure Xa or the disconnection Xc (or connection failure Xa When the internal electrode 32a is broken due to the crack Xd occurring in the capacitor 21 (in addition to the disconnection Xc or the disconnection Xc), and instead of the connection failure Xb or the disconnection Xc (or in addition to the connection failure Xb or the disconnection Xc) Even when the crack Xd is generated in the denser 21 and the internal electrode 32b is broken, any of the above-described patterns Pa to Pd (or patterns PA, Pb to Pd) is obtained as a measurement result of each “measurement process”. Measurement results can be obtained with patterns.

  As for the “measurement process” in the case where the disconnection Xc and the crack Xd are generated, the same phenomenon as the “measurement process” in the case where the connection failures Xa and Xb are generated occurs and the same measurement result is obtained. . Therefore, when inspecting the inspection target substrate 20 by the substrate inspection apparatus 1, actually, when the measurement result of each “measurement process” is the pattern Pa (or pattern PA), the connection failure Xa, Xb, disconnection Xc and When it is determined that the crack Xd does not exist and the measurement result of each “measurement process” is any of the patterns Pb to Pd, any of the connection defects Xa, Xb, the disconnection Xc, and the crack Xd is generated. Will be determined.

  Thus, according to the substrate inspection apparatus 1 and the substrate inspection method by the substrate inspection apparatus 1, “measurement process A (“ first measurement process ”and“ third measurement process ””) ”and“ measurement process B ( Each “measurement process” of “second measurement process” and “fourth measurement process”) is executed, and the measurement result (value of measurement result data D1) of each “measurement process” and reference data for inspection (for inspection) By determining whether or not a defect has occurred based on the data D0), when there is a connection failure Xa or the like between the external electrode 31a and the connection pattern 22, there is a gap between the external electrode 31b and the connection pattern 23. Regardless of whether or not there is a connection failure Xb or the like, the capacitance measured in both the “first measurement process” and the “second measurement process” is out of the reference capacity range defined in advance. Defect Xb etc. exist In this case, the capacitance measured in both the “third measurement process” and the “fourth measurement process” is out of the predetermined reference capacity range regardless of whether or not the connection failure Xa exists. When both of the connection failures Xa and Xb do not exist, the capacitance measured in only one of the “first measurement process” and the “third measurement process” is out of the predetermined reference capacity range. Whether or not there is a connection failure Xa, Xb based on the measurement result for each “measurement process” for the inspection target substrate 20 having the built-in capacitor 21 in which a probe or the like cannot be directly connected to the external electrodes 31a, 31b. Can be reliably inspected.

  Further, according to the substrate inspection apparatus 1 and the substrate inspection method by the substrate inspection apparatus 1, only one measurement result of “first measurement process” and “third measurement process” is defined in advance as a reference capacity range. When it is determined that there is no connection failure Xa, Xb when the measurement results are out of the range, and the measurement results of the two “measurement processes” out of each “measurement process” are out of the predefined reference capacity range , And when all the measurement results of each “measurement process” are out of the reference capacity range defined in advance, it is determined that the connection failure Xa, Xb has occurred, and is mounted on the inspection target board 20. By determining the reference capacity range (reference range) according to the capacity of the capacitor 21 and its mounting state, whether or not there is a connection failure Xa, Xb based on the inspection result of each “measurement process”. It can be easily determined in a short time.

  Further, according to the substrate inspection apparatus 1, the probe 4a as the “first probe”, the probe 4b as the “second probe”, the switch 5a as the “first switch”, and the switch as the “second switch” Unlike the configuration in which the probe 4a, 4b is connected to the G potential by probing the connection pattern 22, 23 or separating the probe 4a, 4b from the connection pattern 22, 23, for example, Since the probes 4a and 4b can be disconnected and connected to the G potential by the switches 5a and 5b in a state where the probes 4a and 4b are connected to the connection patterns 22 and 23, it is necessary to inspect the inspection target substrate 20. Time can be shortened sufficiently.

  Furthermore, according to the board inspection apparatus 1, the probe 4c which is an example of the “electrode” as the “conductor” and the moving mechanism 3c for moving the probe 4c are provided, so that the conductor usable as the “conductor” is provided. The inspection target substrate 20 having no pattern or the like can be reliably inspected by using the probe 4c as a “conductor”.

  The configuration of the “substrate inspection apparatus” and the specific procedure of the “substrate inspection method” are not limited to the configuration of the substrate inspection apparatus 1 and the example of the procedure of the substrate inspection method performed by the substrate inspection apparatus 1. For example, the “electrical parameter” is not limited to “capacitance”, and the current value of the current flowing from the internal electrode 32a (or the internal electrode 32b) to the probe 4c itself is measured as the “electrical parameter”. It is also possible to adopt a configuration / method for inspecting the presence or absence of connection failures Xa and Xb.

  In addition, the configuration / method of executing each “measurement process” using the probe 4c which is an example of the “electrode” as the “conductor” has been described as an example, but the “electrode” has a columnar shape (probe shape). However, the present invention is not limited thereto, and “electrodes” (not shown) having various shapes such as a plate shape and a spherical shape can be used. In this case, the “electrode” is formed in the same size as one “capacitor” in the same manner as the probe 4c described above, so that the external electrodes 31a and 31b are mutually connected like the capacitors 21b and 21c in the above example. Even when adjacent to each other in the state of being connected to each other, it is possible to individually inspect those connection failures and the like.

  Further, as in the inspection target substrate 20 shown in FIG. 7, the signal transmission pattern, the ground pattern, the power supply pattern, etc. that cover the electrode surfaces of the internal electrodes 32a and 32b of the capacitor 21 and are opposed to the electrode surfaces. When the conductor pattern 24 exists, it is possible to adopt a configuration / method in which each “measurement process” is performed using the conductor pattern 24 as a “conductor”. Specifically, when the conductor pattern 24 is used as a “conductor”, the probe 4d probed by the connection pattern 24a connected to the conductor pattern 24 is measured as an example instead of the probe 4c described above. Connected to the current measurement port 6 b of the unit 6. As a result, the conductor pattern 24 connected to the probe 4d via the connection pattern 24a functions in the same manner as the probe 4c described above. As a result, the same measurement result as in the above example using the probe 4c can be obtained. . In this case, the “conductor pattern” used as the “conductor” is not limited to the “inner layer conductor pattern” such as the conductor pattern 24 shown in the figure, but the “conductor pattern” formed on the surface of the inspection target substrate. It can also be used.

  Further, the connection pattern 23 probing the probe 4b is disconnected from the G potential by switching the switch 5b to the OPEN state, and the connection pattern 22 probing the probe 4a is switched to G by switching the switch 5a to the OPEN state. Although the configuration / method of separating from the potential has been described as an example, instead of such a configuration / method, the probe 4b connected to the G potential is separated from the connection pattern 23 to make the connection pattern 23 G It is also possible to adopt a configuration / method in which the connection pattern 22 is separated from the G potential by separating from the potential or by separating the probe 4 a connected to the G potential from the connection pattern 22. Even when such a configuration / method is adopted, the same effects as the substrate inspection apparatus 1 and the substrate inspection method by the substrate inspection apparatus 1 can be obtained.

  Further, a configuration / method for connecting the connection patterns 22 and 23 to the H potential (measurement signal output port 6a) or the G potential by probing the probes 4a and 4b to the connection patterns 22 and 23 will be described as an example. However, for example, when there is a connection connector (not shown) for connecting the connection patterns 22 and 23 to the external device, a signal cable (not shown) is connected to the connection connector for connection. A configuration / method for connecting the patterns 22 and 23 to the H potential (measurement signal output port 6a) or the G potential can be employed (an example of a configuration / method that does not use the “first probe” or the “second probe”). ). Even when such a configuration / method is adopted, the same effects as the substrate inspection apparatus 1 and the substrate inspection method by the substrate inspection apparatus 1 can be obtained.

  In addition, although the probe 4a, 4b is arbitrarily moved by the moving mechanism 3a, 3b and described in the state in which each “measurement process” is performed in the state in which the probe is connected to the connection patterns 22, 23, the example is described. Moving at least one of a probe unit (inspection jig: not shown) in which a plurality of probes are implanted in accordance with the positions of the connection patterns 22a, 22b, 23, and the like and the inspection target substrate 20 toward the other. Thus, it is also possible to adopt a configuration / method in which each “measurement process” is performed in a state in which the probes are respectively probed in the connection patterns 22a, 22b, 23 and the like. When such a configuration / method is adopted, a scanner (not shown) for arbitrarily connecting / disconnecting any of the probes to the G potential or H potential (measurement signal output port 6a). ) May be connected to the probe unit. Even when such a configuration / method is adopted, the same effects as the substrate inspection apparatus 1 and the substrate inspection method by the substrate inspection apparatus 1 can be obtained.

  Furthermore, the configuration and method of executing each “measurement process” in a state where the probe 4c is fixedly connected to the current measurement port 6b (L potential) of the measurement unit 6 has been described as an example. 6 is connected to the measurement signal output port 6a (H potential), and one of the probes 4a and 4b is connected to the current measurement port 6b (L potential) of the measuring unit 6, and the other of the probes 4a and 4b is connected to the other. By connecting to the G potential, it is possible to adopt a configuration / method for executing the four “measurement processes” similar to the above “measurement processes”.

  In the “first measurement process”, the probes 4a, 4b, and 4c are connected to the H potential, the G potential, and the L potential, respectively. In the “second measurement process”, the probes 4a, 4c are connected to the L potential and the H potential, respectively. In the “first measurement process”, the probes 4a, 4b, and 4c are connected to the L potential, the G potential, and the H potential, respectively, and in the “second measurement process”, the probes 4a, 4c are set to the H potential and the L potential, respectively. In the “third measurement process”, the probes 4a, 4b, 4c are connected to the G potential, the L potential, and the H potential, respectively, and in the “fourth measurement process”, the probes 4b, 4c are set to the H potential and the L potential. And connecting the probes 4a, 4b, and 4c to the G potential, the H potential, and the L potential in the “third measurement process”, respectively. It is possible to use a construction, method or connected probes 4b, and 4c to L potential and H potential in the fourth measurement process ".

  Furthermore, the execution order of the “first measurement process”, “second measurement process”, “third measurement process”, and “fourth measurement process” (“predefined order”) is not limited to the above example. It is possible to employ a configuration / method for executing the four measurement processes from the “first measurement process” to the “fourth measurement process” in an arbitrary order. In this case, after executing one of the “first measurement process” and the “second measurement process”, the “first measurement process” and the “fourth measurement process” are performed without executing the “third measurement process” and the “fourth measurement process”. The other of the “second measurement process” is executed, and the “first measurement process” and the “second measurement process” are executed after one of the “third measurement process” and the “fourth measurement process” is executed. Without executing the other of the “third measurement process” and the “fourth measurement process”, the number of times of switching the connection to the “first connection pattern” or the “second connection pattern” (in the above example, the probe 4a , 4b probing number) can be set to a small number of times.

  Further, the example in which the presence or absence of connection failures Xa and Xb is inspected for all of the capacitors 21a to 21c when inspecting the inspection target substrate 20 has been described. , Xb, when it is determined that either or both of the connection failures Xa, Xb are present in any of the capacitors 21, the inspection target substrate 20 on which the capacitor 21 is mounted is regarded as a defective product. A configuration / method for completing a series of inspections can also be adopted.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 3a-3c Movement mechanism 4a-4d Probe 5a, 5b Switch 6 Measurement part 6a Measurement signal output port 6b Current measurement port 9 Control part 20 Test object board 21a-21c Capacitor 22a, 22b, 23, 24a For connection Pattern 24 Conductor pattern 31a, 31b External electrode 32a, 32b Internal electrode D0 Inspection data D1 Measurement result data D2 Inspection result data S1a-S1c, S2a, S2b, S3 Control signal Xa, Xb Connection failure Xc Disconnection Xd Crack

Claims (7)

A multilayer capacitor in which a plurality of internal electrodes are connected to a pair of external electrodes is built in, one of the external electrodes is connected to the first connection pattern, and the other of the external electrodes is a second connection. For the substrate to be inspected connected to the pattern, the connection failure of the one external electrode to the first connection pattern, the connection failure of the other external electrode to the second connection pattern, the first connection A board inspection apparatus configured to be capable of electrically inspecting whether any one of pattern disconnection, disconnection of the second connection pattern, and damage to the multilayer capacitor has occurred,
Any one of the conductor, the first connection pattern, and the second connection pattern arranged opposite to the electrode surface of each internal electrode is connected to a reference potential and not connected to the reference potential 1 One of the two connected to the reference potential in the measurement process A and the measurement process A in which the AC signal is applied, and the measurement process A The measurement process B for measuring the electrical parameter in a state where the AC signal is applied to one that is not connected to a reference potential is executed by switching between a target connected to the reference potential and a target to which the AC signal is applied. And a measurement unit that controls the measurement unit to execute each measurement process, and a measurement result of each measurement process and reference data for inspection And it has a substrate inspection device includes a processing unit for determining whether the bad has occurred based.   The measurement unit connects either the conductor or the first connection pattern to the reference potential, and connects the second connection pattern to the reference potential, and the conductor and the first connection. A first measurement process for measuring the electrical parameter that changes according to a current flowing from the other to the other in a state in which the AC signal is applied to the other of the pattern and the pattern, and the conductor and the first connection Either one of the patterns is connected to the reference potential, the second connection pattern is disconnected from the reference potential, and the AC signal is applied to the other of the conductor and the first connection pattern. A second measurement process for measuring the electrical parameter that changes in accordance with a current flowing from the other side to the one side, the conductor, and the second connection pattern; Either one is connected to the reference potential, the first connection pattern is connected to the reference potential, and the other signal is applied to the other of the conductor and the second connection pattern. A third measurement process for measuring the electrical parameter that changes in accordance with a current flowing from the first to the second, a conductor and the second connection pattern connected to the reference potential, and The first connection pattern is separated from the reference potential, and changes according to a current flowing from the other to the other in the state where the AC signal is applied to the other of the conductor and the second connection pattern. Four measurement processes including a fourth measurement process for measuring an electrical parameter are configured to be executable, and the first measurement process is performed under the control of the processing unit. And the third measurement process is executed as the measurement process A, and the second measurement process, and the fourth measurement process the measurement processing board inspection apparatus according to claim 1, wherein the run as B.   The processing unit is configured such that only one measurement result of the first measurement process and the third measurement process deviates from a predetermined reference range, and the measurement results of the other three measurement processes are within the reference range. It is determined that the defect does not occur at the time, the measurement results of the two measurement processes out of the measurement processes are out of the reference range, and the measurement results of the other two measurement processes are the reference 3. The substrate inspection apparatus according to claim 2, wherein it is determined that the defect has occurred when it is within the range and when all measurement results of the measurement processes are out of the reference range.   A first probe connected to the first connection pattern; a second probe connected to the second connection pattern; and a first that connects and disconnects the first probe and the reference potential according to control of the processing unit. The substrate inspection apparatus according to claim 1, further comprising: a switch; and a second switch that connects and disconnects the second probe and the reference potential according to control of the processing unit.   5. The substrate according to claim 1, further comprising: an electrode as the conductor; and a moving mechanism that moves the electrode to a position facing the electrode surface of each internal electrode in accordance with control of the processing unit. Inspection device. A multilayer capacitor in which a plurality of internal electrodes are connected to a pair of external electrodes is built in, one of the external electrodes is connected to the first connection pattern, and the other of the external electrodes is a second connection. For the substrate to be inspected connected to the pattern, the connection failure of the one external electrode to the first connection pattern, the connection failure of the other external electrode to the second connection pattern, the first connection A board inspection method for electrically inspecting whether any one of the disconnection of the pattern, the disconnection of the second connection pattern, and the damage of the multilayer capacitor has occurred,
Any one of the conductor, the first connection pattern, and the second connection pattern arranged opposite to the electrode surface of each internal electrode is connected to a reference potential and not connected to the reference potential 1 One of the two connected to the reference potential in the measurement process A and the measurement process A in which the AC signal is applied, and the measurement process A The measurement process B for measuring the electrical parameter in a state where the AC signal is applied to one that is not connected to a reference potential is executed by switching between a target connected to the reference potential and a target to which the AC signal is applied. And a substrate inspection method for determining whether or not the defect has occurred based on the measurement result of each measurement process and the reference data for inspection.   One of the conductor and the first connection pattern is connected to the reference potential, and the second connection pattern is connected to the reference potential, and the other of the conductor and the first connection pattern. One of the first measurement process for measuring the electrical parameter that changes according to the current flowing from the other to the one in a state where the AC signal is applied to the conductor, and the conductor and the first connection pattern One is connected to the reference potential, the second connection pattern is disconnected from the reference potential, and the AC signal is applied to the other of the conductor and the first connection pattern. One of the second measurement process for measuring the electrical parameter that changes according to the current flowing through the conductor, and the conductor and the second connection pattern The first connection pattern is connected to the reference potential and the AC signal is applied to the other of the conductor and the second connection pattern. A third measurement process for measuring the electrical parameter that changes in accordance with a current flowing in one side, a connection between the conductor and the second connection pattern to the reference potential, and the first connection The electrical parameter that changes according to the current flowing from the other to the other in the state where the pattern is separated from the reference potential and the AC signal is applied to the other of the conductor and the second connection pattern. The first measurement process and the third measurement process in the four measurement processes including the fourth measurement process to be measured are executed as the measurement process A, and Substrate inspection method according to claim 6, wherein performing a second measurement process, and the fourth measurement process as the measurement process B.

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