JP6163535B2 - Viscous fluid supply device and viscous fluid supply device - Google Patents

Description

  The present invention relates to a viscous fluid supply device, a viscous fluid supply device, and an opening / closing member.

  Conventionally, as a viscous fluid replenishment device, for example, a cutting line that cuts cream-like solder extending from the discharge nozzle, and the cutting line is traversed at a position close to the tip surface of the discharge nozzle and rotated around the central axis of the discharge nozzle A device having a cutting line holding device that holds the same is proposed (for example, see Patent Document 1). In this apparatus, after the cream-like solder is discharged, the refilled solder can be easily cut by rotating the cutting line in the vicinity of the discharge nozzle.

JP 2002-137360 A

  However, in this apparatus, in addition to the cutting line, it is necessary to include a gear, a motor, and the like that rotationally drive the cutting line, and the configuration is complicated. Therefore, it has been required to further simplify the configuration of the solder supply device.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a viscous fluid replenisher, a viscous fluid replenishment device, and an opening / closing member that can further simplify the configuration.

  The present invention adopts the following means in order to achieve the main object described above.

The viscous fluid replenisher of the present invention is
An opening / closing member is provided that is disposed in a discharge port formed in a storage portion that stores the viscous fluid, and is deformed by a change in pressure applied to the viscous fluid.

  In this viscous fluid replenisher, the open / close member is deformed by a change in pressure applied to the viscous fluid, thereby discharging and cutting the viscous fluid. Thus, since the viscous fluid is discharged and cut by the opening / closing member, the configuration can be further simplified. Here, examples of the “viscous fluid” include solder and conductive paste.

  In the viscous fluid supply device of the present invention, when the viscous fluid is pressurized, the opening / closing member opens the discharge port to discharge the viscous fluid, and when the pressurization is stopped, the discharge member closes and discharges the discharge port. It may be an elastic member that cuts the viscous fluid. If it carries out like this, discharge and cutting | disconnection of a viscous fluid can be performed using the elastic force of an elastic member, and a structure can be simplified more.

  In the viscous fluid replenisher according to the present invention, the opening / closing member may be a plate-like body in which cut portions having a plurality of cuts are formed. By doing so, the configuration can be further simplified by a simple structure in which a cut is formed in the plate-like body. At this time, the opening / closing member may be formed with the cut portion having a shape in which a plurality of straight cuts intersect. In this way, the configuration can be further simplified by a simple structure of a straight cut. Moreover, it is easy to form a notch part. At this time, the opening / closing member may be formed with the cut portion having a shape in which three or four straight cuts intersect at one point of the central portion of the cut. In this cut | notch part, the responsiveness with respect to the pressure change added to a viscous fluid is good, and is more preferable as a structure of an opening-and-closing member. Or the said opening-and-closing member is good also as what the said notch part of the shape where two or more S-shaped incisions cross is formed. Even in this case, the structure can be further simplified by the structure of the S-shaped notch. Note that the S-shape refers to a wave shape, and includes, for example, a shape in which the S-shape is reversed or a shape in which a plurality of S-shapes are connected.

  In the viscous fluid supply device of the present invention, the opening / closing member may be made of any material of low density polyethylene resin, silicone resin, and urethane resin. These resins are more preferable because the opening / closing response of the opening / closing member is good.

  The viscous fluid replenishing device of the present invention includes any one of the above-described viscous fluid replenishers and a pressurizer that pressurizes the viscous fluid accommodated in the accommodating portion. In this apparatus, since the opening / closing member is deformed by a change in pressure applied to the viscous fluid, the viscous fluid is discharged and cut, so that the configuration can be further simplified. In addition, if this viscous fluid replenishment apparatus employ | adopts any structure mentioned above, the effect corresponding to the employ | adopted structure will be acquired.

  The opening / closing member of the present invention is an opening / closing member disposed in a discharge port formed in a housing portion that contains a viscous fluid, and is deformed by a change in pressure applied to the viscous fluid. Since the opening / closing member is deformed by a change in pressure applied to the viscous fluid, the viscous fluid is discharged and cut, so that the configuration can be further simplified. In this opening / closing member, any of the above-described viscous fluid replenishers may be employed.

FIG. 2 is a configuration diagram showing an example of a schematic configuration of a mounting processing system 20. The block diagram which shows an example of the outline of a structure of the viscous fluid replenishment apparatus. The block diagram which shows an example of the outline of a structure of the viscous fluid replenisher 50. FIG. The block diagram which shows an example of the outline of a structure of the opening-and-closing member 52. FIG. The flowchart which shows an example of a solder replenishment process routine. Explanatory drawing of the opening-and-closing member 52 at the time of viscous fluid replenishment. Explanatory drawing of another opening / closing member.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing an example of a schematic configuration of a mounting processing system 20 according to an embodiment of the present invention. FIG. 2 is a configuration diagram illustrating an example of a schematic configuration of the viscous fluid supply device 40. FIG. 3 is a configuration diagram illustrating an example of a schematic configuration of the viscous fluid supply device 50. FIG. 4 is a configuration diagram illustrating an example of a schematic configuration of the opening / closing member 52. Here, the viscous fluid replenisher 50 and the viscous fluid replenishing device 40 that contain solder as a viscous fluid will be described. The mounting processing system 20 includes one or more printing devices 21 that execute a printing process for printing solder on a substrate, and a plurality of mounting devices 28 that mount components (such as electronic components) on the substrate on which the solder is printed. ing. The mounting processing system 20 is connected to a LAN (not shown) as a network, and communicates with a mounting management server (not shown) that manages a plurality of mounting processing systems via the network. The mounting processing system 20 is connected to a plurality of mounting devices 28 mounted with reels or the like containing various components, and is configured as a mounting line for transporting the substrate and mounting the components. “Mounting” includes placing, mounting, inserting, joining, adhering components, etc. on a substrate.

  The printing apparatus 21 includes a printing machine controller 22 that controls the entire apparatus, an operation panel 23 on which a display screen is displayed and various input operations can be performed by an operator, and a communication unit (not shown) that communicates with devices connected to the LAN. And. In addition, the printing device 21 is a unit that executes a printing process, a conveyance positioning device 30 that conveys and fixes a substrate, a squeegee device 34 that prints solder on the substrate, and a viscous fluid replenishment that replenishes solder onto the substrate. Device 40.

  The printing press controller 22 is configured as a microprocessor centered on a CPU (not shown), and has a large capacity such as a flash memory that stores various processing programs, a RAM that temporarily stores data, and an HDD. And a storage unit (not shown) that stores the data in a rewritable manner. The printing press controller 22 is electrically connected to the operation panel 23, the conveyance positioning device 30, the squeegee device 34, the viscous fluid replenishing device 40, and the like through a bus 29. The printing machine controller 22 outputs a signal for controlling the conveyance positioning device 30, the squeegee device 34, and the viscous fluid replenishing device 40, outputs display data to the operation panel 23, and a mounting management server via a communication unit. Send information to external devices. Further, the printing press controller 22 inputs data and the like input to the operation panel 23, and receives information from an external device such as a mounting management server via the communication unit. The storage unit stores information on a substrate to be printed, a print processing program for performing print processing on the substrate, a control program for the viscous fluid supply device 40, and the like.

  The operation panel 23 includes a display unit 24 that displays a screen and an operation unit 25 that receives an input operation from an operator. The display unit 24 is configured as a liquid crystal display and displays the operating state and setting state of the printing apparatus 21 on the screen. The operation unit 25 includes a cursor key for moving the cursor up and down, left and right, a cancel key for canceling input, a determination key for determining selection contents, and the like, and is configured to allow an operator's instruction to be key-inputted.

  The conveyance positioning device 30 is a device that carries in a substrate, positions and supports the loaded substrate, and contacts and separates the screen 33 (screen mask) on which a predetermined wiring pattern is formed. The conveyance positioning device 30 is disposed on a fixed substrate, a substrate conveyance unit 31 that conveys the substrate to a predetermined printing position for printing solder, a substrate holding unit 32 that fixes the conveyed substrate at the printing position. And a screen 33 on which a predetermined pattern is formed. The substrate transport unit 31 is configured as a device that transports a substrate by a belt conveyor, for example, and includes a guide member provided in each of the pair of side frames and a conveyor belt provided in each of the pair of side frames. And a belt rotating device that drives the conveyor belt to rotate. The board | substrate holding | maintenance part 32 is arrange | positioned in the printing position, for example, is provided with the support apparatus which supports a board | substrate from the downward direction, and the clamp apparatus which clamps the edge part of a board | substrate. The screen 33 is, for example, a thin metal plate on which a desired wiring pattern is formed, and is fixed to a frame (not shown) with a predetermined tension. The transport positioning device 30 includes an imaging unit (not shown) and a lifting unit, detects a positional deviation of the substrate based on image data captured by the imaging unit, and corrects the positional deviation by the lifting unit. The substrate holding unit 32 is moved up and down to position the screen 33 on the substrate.

  The squeegee device 34 includes a print head 35, a head moving unit 36 that can move the print head 35 in the Y direction, and a plurality of squeegees 37 that are disposed on the print head 35 so as to be movable up and down. The Y direction refers to the longitudinal direction of the apparatus among the two axes orthogonal to each other in the horizontal plane, and the Z axis refers to the vertical axis (see FIG. 1). The head moving unit 36 is provided with a viscous fluid supply device 40, and the viscous fluid supply device 40 supplies solder onto the screen 33. The print head 35 includes a cylinder device (not shown), and moves a squeegee 37 fixed to the cylinder device in the Z-axis direction (vertical direction). The head moving unit 36 moves the print head 35 in the Y direction by a Y direction slider (not shown). The head moving unit 36 includes a moving motor (not shown) as a drive source, and a slider is guided by a guide rail (not shown) that is a guide member, and the print head 35 is moved in the Y direction by driving the moving motor. . The squeegee 37 is a plate-like member that is long in a predetermined direction (for example, the X direction in FIG. 1), and is formed to have a longer length than the substrate. Here, it is assumed that the squeegee 37 is scanned in the Y direction perpendicular to the X direction with the X direction in FIG. 1 as the longitudinal direction. One of the squeegees 37 is selectively used in contact with the screen 33 according to the reciprocation of the print head 35 in the Y direction.

  As shown in FIG. 2, the viscous fluid replenishing device 40 is accommodated in a viscous fluid replenisher 50 that contains solder, a replenisher holder 43 that fixes the viscous fluid replenisher 50, and a housing 51 of the viscous fluid replenisher 50. A pressurizer 44 for pressurizing the solder, a decompressor 45 for decompressing the solder accommodated in the accommodating portion 51, and an electromagnetic valve 46 for switching between pressurization and decompression of the viscous fluid replenisher 50. FIG. 2 also shows an enlarged cross-sectional view of the tip portion of the viscous fluid supply device 50. The replenisher holder 43 is configured to be capable of fixing and releasing the viscous fluid replenisher 50, and is disposed at the upper part of the main body of the viscous fluid replenishing device 40. The pressurizer 44 is, for example, a pressurization pump, and supplies positive pressure to the rear end of the viscous fluid supply device 50 when the solder is discharged from the viscous fluid supply device 50. The pressurizing force of the pressurizer 44 is appropriately set according to the viscosity of the solder, and can be, for example, in the range of 0.1 MPa to 0.5 MPa. The decompressor 45 is, for example, a decompression pump, and supplies negative pressure to the rear end of the viscous fluid replenisher 50 after discharging the solder. Thereby, discharge of excess solder is suppressed. The decompression force of the decompressor 45 is appropriately set according to the viscosity of the solder, and can be set in a range of −40 kPa to −10 kPa, for example. In this viscous fluid replenishing device 40, a replenisher holder 43 is disposed at a rotating portion (not shown), and the viscous fluid replenisher 50 is held in a horizontal direction during standby when solder is not discharged (see the dotted line in FIG. 2). When supplying the solder, the viscous fluid supply device 50 is rotated to hold the viscous fluid supply device 50 in the vertical direction.

  As shown in FIGS. 2 and 3, the viscous fluid replenisher 50 includes an accommodating portion 51 that is a container portion that accommodates the solder 60, an opening / closing member 52 disposed at the discharge port 53, and an opening / closing member 52. And a pressing plate 58 that moves inside the accommodating portion 51 along the inner wall 57. The accommodating portion 51 is a cylindrical member having a discharge port 53 formed at the tip, and accommodates solder therein. A pressing plate 58 is inserted into the rear end of the accommodating portion 51. When the pressing plate 58 is pressed and moves along the inner wall 57 toward the discharge port 53, the solder pressed by the pressing plate 58 is opened and closed. From the discharge port 53. The solder accommodated in the accommodating portion 51 may be, for example, a cream-like solder having a suitable viscosity by adding a flux to the solder powder. The fixing member 56 is a screw cap having an opening at the center, and fixes the opening / closing member 52 to the opening edge of the discharge port 53 by sandwiching the opening / closing member 52. The fixing member 56 has a fixing strength that prevents the opening / closing member 52 from being removed even when the solder accommodated in the accommodating portion 51 is pressurized. The fixing member 56 has a member strength that does not break even when the solder accommodated in the accommodating portion 51 is pressurized. The fixing member 56 has been described as being configured as a screw cap. However, the fixing member 56 is not particularly limited as long as the opening / closing member 52 is fixed to the discharge port 53. For example, the fixing member may be a disk having an opening at the center, and may be fixed to the discharge port 53 with a screw in a state where the opening / closing member 52 is sandwiched. When the viscous fluid replenisher 50 is attached to the viscous fluid replenisher 40, a pressurizer 44 and a decompressor 45 are connected to the rear end of the accommodating portion 51, and the pressurizer 44 or the decompressor 45 Positive or negative pressure is supplied.

  The opening / closing member 52 is a member that is disposed in the discharge port 53 formed in the accommodating portion 51 that accommodates solder, and is deformed by a change in pressure applied to the solder. The opening / closing member 52 is an elastic member that opens the discharge port 53 and discharges the solder when the solder is pressurized, and closes the discharge port 53 and cuts the discharged solder when the pressurization is stopped. As shown in FIG. 4, the opening / closing member 52 is a plate-like body in which cut portions 54 having a plurality of cuts are formed. Further, the opening / closing member 52 is formed with a cut portion 54 having a shape in which a plurality of straight cuts intersect. Specifically, the cut portion 54 is formed in a shape in which three straight cuts intersect at one point in the center of the cut. A plurality (six in this case) of lid portions 55 that are deformed when pressed are formed in the central portion of the opening / closing member 52 by the cut portions 54. Here, it is assumed that the ends of the lid portion 55 are formed at the same angle. The opening / closing member 52 is disposed in the discharge port 53 in a state of being fitted inside the fixing member 56.

  The opening / closing member 52 may be formed of any material among low density polyethylene resin, silicone resin, and urethane resin. With these resins, the opening / closing response of the opening / closing member 52 is good. The opening / closing member 52 is preferably made of a material having a Young's modulus in the range of 0.1 GPa to 0.5 GPa, and more preferably in the range of 0.2 GPa to 0.4 GPa. Although the size of the opening / closing member 52 depends on the size of the viscous fluid replenisher 50, for example, the diameter may be 0.3 cm to 1.5 cm, or the thickness may be 0.5 mm to 6 mm. Further, the size of the cut portion 54 (the size of the lid portion 55) may be set as appropriate according to the amount of solder discharged at one time. For example, the length of the cut may be 1 mm to 5 mm. The opening / closing member 52 thus formed can discharge and cut the solder.

  Next, the operation of the mounting processing system 20 of the present embodiment configured as described above, particularly the processing in which the viscous fluid supply device 40 supplies solder to the screen 33 will be described. FIG. 5 is a flowchart illustrating an example of a viscous fluid supply processing routine. This routine is stored in the storage unit of the printing press controller 22, and is executed after the operator inputs that the printing process is to be executed. When this routine is started, the printing press controller 22 first determines whether or not it is a solder replenishment timing (step S100), and waits as it is when it is not the replenishment timing. The replenishment timing is obtained empirically based on, for example, the time after the replenishment of solder and the number of processed substrates subjected to printing, and is stored in the printing press controller 22. On the other hand, when it is the replenishment timing in step S100, the viscous fluid replenisher 50 is rotated to move the viscous fluid replenisher 50 from the standby position to the replenishment position (step S110). Next, a pressurizing process is performed on the viscous fluid replenisher 50 by the pressurizer 44 (step S120), and it is determined based on, for example, a pressurization time or the like (step S130). When the replenishment is not completed, the process after step S120, that is, the pressurizing process is continued, and when the replenishment is completed, the pressure reducing process is executed (step S140). In the decompression process, for example, a negative pressure may be supplied to the viscous fluid replenisher 50 for a predetermined time. By this decompression process, the residual pressure of the viscous fluid replenisher 50 can be released, and excess solder leakage can be prevented.

  Here, the operation of the opening / closing member 52 during the pressurizing process to the viscous fluid replenisher 50 will be described. 6A and 6B are explanatory diagrams of the opening / closing member 52 at the time of viscous fluid replenishment, in which FIG. 6A is a standby state, FIG. 6B is a pressurization state, and FIG. It is. As shown in FIG. 6A, the lid 55 is closed during standby. Next, when the viscous fluid replenisher 50 is pressurized by the pressurizer 44 during the replenishment of the solder, the pressing plate 58 is pressed toward the discharge port 53, and the solder accommodated in the accommodating portion 51 is moved by the pressing plate 58. Pressed (see FIG. 3). At this time, since the opening / closing member 52 is a member that is deformed by a change in pressure applied to the solder, as shown in FIG. 6B, the pressed lid portion 55 is expanded by the solder 60, and the discharge port 53 is opened. Open. Thus, the solder 60 is discharged to the outside from the opened lid portion 55. Subsequently, when the replenishment of the solder is completed, the pressurization by the pressurizer 44 is finished, and as shown in FIG. 6C, the lid portion 55 is closed by the elastic force of the lid portion 55, the discharge port 53 is closed, Accordingly, the solder 60 is cut. And if the inside of the viscous fluid replenisher 50 is pressure-reduced by the decompressor 45, it will return to the standby state which the discharge outlet 53 closed completely (FIG. 6 (a)).

  Subsequently, the printing press controller 22 rotates the viscous fluid replenisher 50 to the standby position (step S150), and whether or not the viscous fluid printing process has been completed, for example, the number of printed sheets has reached the scheduled printing number. It is determined based on whether or not (step S160). When the viscous fluid printing process is not finished, the above-described processing after step S100 is repeatedly executed. When the viscous fluid printing process is finished, this routine is finished as it is. Thus, the solder 60 is discharged and cut using the elastic force of the opening and closing member 52.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The accommodating part 51 of this embodiment corresponds to the accommodating part of the present invention, the opening / closing member 52 corresponds to the opening / closing member, the discharge port 53 corresponds to the discharge port, and the cut portion 54 corresponds to the cut portion.

  According to the viscous fluid replenisher 50 described above, the opening / closing member 52 is deformed by a change in the pressure applied to the solder, so that the solder is discharged and cut. For example, the gear that rotationally drives the cutting line in addition to the cutting line. The configuration of the viscous fluid replenishing device 40 and the like can be further simplified as compared with a device that uses a motor or the like to cut solder. The opening / closing member 52 is an elastic member that opens the discharge port 53 and discharges the solder when pressurizing the solder, and closes the discharge port and cuts the discharged solder when the pressurization is stopped. By using the elastic force, the solder can be discharged and cut, and the configuration can be further simplified. Furthermore, since the opening / closing member 52 is a plate-like body in which cut portions having a plurality of cuts are formed, the configuration can be further simplified by a simple structure in which cuts are formed in the plate-like body. Furthermore, since the opening / closing member 52 is formed with a cut portion 54 having a shape in which a plurality of straight cuts intersect, the configuration can be further simplified by a simple structure called a straight cut. Moreover, it is easy to form a notch part. Since the opening / closing member 52 is formed with a cut portion 54 having a shape in which three straight cuts intersect at one point in the central portion of the cut, the open / close member 52 has good responsiveness to pressure changes applied to the solder. It is more preferable as the configuration. In addition, since the opening / closing member 52 is formed of any one of low-density polyethylene resin, silicone resin, and urethane resin, these resins are more preferable because the opening / closing member is responsive to opening / closing. Furthermore, since the viscous fluid replenishing device 40 includes the viscous fluid replenisher 50, the configuration can be further simplified in the same manner as the viscous fluid replenisher 50.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, when the solder is pressurized, the discharge port 53 is opened to discharge the solder, and when the pressurization is stopped, the discharge port 53 is closed and the open / close member 52 is an elastic member that cuts the discharged solder. However, the opening / closing member is not particularly limited as long as it is deformable by a change in pressure applied to the solder. For example, the discharge port may be closed when the pressurization is stopped and the pressure is reduced. In the above-described embodiment, the opening / closing member 52 is a plate-like body formed with a plurality of cuts. However, if the opening / closing member is deformed by a change in the pressure applied to the solder, this is particularly preferable. It is not limited. For example, it is good also as what is not provided with the notch part by combining the member of the same shape into a plate-shaped member which closes the discharge outlet 53 like a puzzle. Furthermore, in the above-described embodiment, the opening / closing member 52 is formed with the cut portions 54 having a shape in which a plurality of straight cuts intersect. However, if the opening / closing member is deformed by a change in the pressure applied to the solder, this is particularly preferable. It is not limited. For example, the cut may be a curve.

  In the above-described embodiment, the opening / closing member 52 is formed with the cut portion 54 having a shape in which the cuts of the three straight lines intersect at one point of the central portion of the cut. However, as shown in FIG. It is not limited to. FIG. 7 is an explanatory diagram of other opening / closing members 52A to 52D. For example, as shown to Fig.7 (a), it is good also as the opening / closing member 52A in which the notch part 54A in which three notches cross in the center part of an opening / closing member was formed. Even in this case, the structure can be further simplified by the structure of three straight cuts. Moreover, as shown in FIG.7 (b), it is good also as the opening-and-closing member 52B in which the notch part 54B in which two notches cross in the center part of the notch was formed. Even in this case, the structure can be further simplified by the structure of two straight cuts. Moreover, as shown in FIG.7 (c), it is good also as the opening-and-closing member 52C in which the notch part 54C in which the notch of four straight lines cross | intersects in the center part of this notch is formed. Even in this case, the configuration can be further simplified by the structure of four straight cuts. In addition, when the opening / closing member was produced and the solder discharge and cutting experiment was performed, a cut portion having a shape in which three or four straight cuts intersect at one point of the central portion of the cut is formed. In the opening / closing member, the discharge and cutting properties of the solder were high, which was a preferable result. Alternatively, the notch 54 is not limited to a straight line, and may be an opening / closing member 52D having a notch 54D having a shape in which a plurality of S-shaped notches intersect as shown in FIG. 7D. Even in this case, the structure can be further simplified by the structure of the S-shaped notch. Here, the plurality of S-shaped cuts intersect at the center of the S-shaped cuts. In addition, S-shape shall mean a wave shape, for example, shall also include the shape which reversed S-shape. Further, although the cuts intersect at the center, there may be a cut that intersects with a deviation from the true center of the cut.

  In the above-described embodiment, it is assumed that the tips of the lid portions 55 are all formed at the same angle. However, the present invention is not particularly limited to this, and one or more of the tips of the lid portions are the same as the angles of the tips of the other lid portions. It may be different. Even in this case, the configuration can be further simplified.

  In the above-described embodiment, the opening / closing member 52 is made of any one of a low-density polyethylene resin, a silicone resin, and a urethane resin, but is not particularly limited thereto, and other resins may be used. A material other than resin may be used.

  In the above-described embodiment, the viscous fluid replenisher 50 has been described. However, the present invention is not particularly limited thereto. For example, the printing device 21 including the opening / closing member 52 may be used. It is good also as an opening-and-closing member which deform | transforms by the change of the pressure which is arrange | positioned at the formed discharge outlet and is applied to solder.

  In the above-described embodiment, the example in which the solder as the viscous fluid is replenished from the viscous fluid replenisher 50 has been described. However, the present invention is not particularly limited thereto. It may be replenished. That is, the viscous fluid supply device 50 can be applied to other viscous fluids. The viscous fluid may be, for example, a non-Newtonian fluid, and examples thereof include a paste in which fine particles are added to a solvent and kneaded.

  The present invention is applicable to substrate production technology.

20 mounting processing system, 21 printing device, 22 printing machine controller, 23 operation panel, 24 display unit, 25 operation unit, 28 mounting device, 30 transfer positioning device, 31 substrate transfer unit, 32 substrate holding unit, 33 screen, 34 squeegee Device, 35 Print head, 36 Head moving unit, 37 Squeegee, 40 Viscous fluid supply device, 43 Supply device holder, 44 Pressurizer, 45 Pressure reducer, 46 Solenoid valve, 50 Viscous fluid supply device, 51 Storage unit, 52, 52A ˜52D Opening / closing member, 53 discharge port, 54, 54A to 54D cut portion, 55 lid portion, 56 fixing member, 57 inner wall, 58 pressing plate, 60 solder.

Claims (9)

A viscous fluid replenisher used in the printing apparatus of a mounting processing system including a printing apparatus that prints a viscous fluid on a substrate and a mounting apparatus that mounts components on the substrate,
Viscous fluid replenishment comprising a single plate-like opening and closing member that is disposed by being sandwiched by a fixing member at a discharge port formed in a housing portion that contains a viscous fluid, and deforms due to a change in pressure applied to the viscous fluid. vessel.   The opening / closing member is an elastic member that opens the discharge port to discharge the viscous fluid when the viscous fluid is pressurized, and closes the discharge port to cut the discharged viscous fluid when the pressurization is stopped. The viscous fluid replenisher according to claim 1.   The viscous fluid replenisher according to claim 1 or 2, wherein the opening / closing member is a plate-like body in which cut portions having a plurality of cuts are formed.   The viscous fluid replenisher according to claim 3, wherein the opening / closing member is formed with the cut portion having a shape in which a plurality of straight cuts intersect.   The viscous fluid replenisher according to claim 4, wherein the opening / closing member is formed with the cut portion having a shape in which three or four straight cuts intersect at one point of the central portion of the cut.   The viscous fluid replenisher according to claim 3, wherein the opening / closing member is formed with the cut portion having a plurality of S-shaped cuts.   The viscous fluid replenisher according to any one of claims 1 to 6, wherein the opening / closing member is formed of any one of a low-density polyethylene resin, a silicone resin, and a urethane resin. A viscous fluid replenishing device used in the printing apparatus of a mounting processing system including a printing apparatus that prints a viscous fluid on a substrate and a mounting apparatus that mounts a component on the substrate,
A viscous fluid replenisher according to any one of claims 1 to 7,
A pressurizer for pressurizing the viscous fluid accommodated in the accommodating portion;
A viscous fluid replenishing device.   The viscous fluid supply device according to claim 8,
  A viscous fluid replenishing device comprising: a decompressor that supplies negative pressure to the viscous fluid accommodated in the accommodating portion when the viscous fluid replenishment is completed.

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