JP6892686B2 - Nozzle for solder coating equipment - Google Patents

Description

The present invention relates to a nozzle for a coating device, and more particularly to a nozzle provided in a solder coating device for applying a solder paste on the surface of a member to be coated.

Conventionally, in order to perform soldering using a reflow method, a coating device for applying a solder paste on the surface of a member to be coated has been used (see, for example, Patent Document 1). In these coating devices, a mechanism is adopted in which the solder paste is discharged from a metal nozzle provided at the tip of the syringe by applying pressure to the syringe filled with the solder paste with air.

JP-A-2017-6916

In the solder coating apparatus configured as described above, tens of thousands of shots of solder paste are discharged in one use of the solder paste container. During the repeated ejection of the solder paste in this way, the dry solder paste adheres to the vicinity of the tip of the nozzle, or the solder paste hardens, which makes it difficult to eject the solder paste. For this reason, the amount of solder paste applied by the coating apparatus is reduced, and it may not be possible to perform soldering quantitatively.

Further, when a solder paste in which solder particles having different particle diameters are mixed is used, the solder paste may stick inside the coating device and the nozzle may be clogged. In this case, since it is necessary to remove the nozzle for cleaning or replace the entire syringe, it is costly and time-consuming to perform these operations.

The present invention has been made in view of the above circumstances, and the problem to be solved by the present invention is that the discharge amount of the solder paste can be kept constant even if the discharge of the solder paste is repeated, and the solder is soldered. It is an object of the present invention to provide a nozzle for a solder coating device that can prevent clogging even when the paste is cured.

The present invention provides a nozzle for a solder coating apparatus having the following structure in order to solve the above problems.

The nozzle for a solder coating device according to the present invention is a nozzle provided in a solder coating device that applies solder to a member to be coated, and the solder coating device includes the nozzle and a container for supplying solder paste to the nozzle. A pressure applying portion for applying pressure to the nozzle is provided, and by applying pressure to the nozzle from the pressure applying portion, the solder paste filled in the nozzle is discharged, and the nozzle is a tubular member. The nozzle main body is provided with a discharge portion provided at the tip of the nozzle main body, and the discharge portion is formed by bulging an elastic soft material toward the tip of the nozzle and at the tip. A discharge port is formed by a notch, and the size of the discharge port is adjusted by changing the magnitude of the pressure applied from the pressure applying portion.

According to this configuration, even if the solder paste is repeatedly discharged, the amount of the solder paste discharged can be kept constant, and clogging can be prevented even when the solder paste is cured.

Further, it is preferable that a hole is formed at the tip of the discharge port in the discharge portion.

According to this configuration, the amount of solder paste discharged from the discharge port can be easily adjusted.

Further, it is preferable that the discharge portion is formed so that the thickness decreases toward the tip portion.

According to this configuration, it becomes easier to adjust the amount of solder paste discharged from the discharge port.

Further, it is preferable that the discharge portion is configured to be detachable from the nozzle main body portion.

According to this configuration, it is possible to easily replace the discharge portion.

According to the nozzle for a solder coating apparatus according to the present invention, the amount of solder paste discharged can be kept constant even if the solder paste is repeatedly discharged, and clogging can be prevented even when the solder paste is cured. It will be possible.

The schematic diagram which shows the whole structure of the solder coating apparatus which concerns on one Embodiment. Sectional drawing which shows the tip part of a nozzle. The perspective view which shows the discharge part. The figure which showed the relationship between the discharge pressure and the size of a discharge port. The figure which showed the shape of the discharge port member in another embodiment. The cross-sectional view which shows the shape of the discharge port member in another embodiment.

<Solder coating device 1>
First, the outline of the solder coating apparatus 1 according to the embodiment will be described with reference to FIGS. 1 to 4. FIG. 2 is an enlarged cross-sectional view of a region A (tip portion of a nozzle for a solder coating apparatus) in FIG. The solder coating device 1 is a device for coating the solder S on the surface of the substrate B which is a member to be coated.

As shown in FIG. 1, the solder coating device 1 includes a nozzle for the solder coating device (hereinafter, simply referred to as “nozzle”) 10, a controller 21, and a container 22 for storing the solder paste as main components. There is. When the solder paste is empty, the container 22 is removed from the solder coating device 1 and can be replaced with a new container 22 filled with the solder paste.

The controller 21 is a control device that controls the drive of the solder coating device 1 as a whole. The controller 21 is also a pressure applying unit according to the present invention, and can supply air to the nozzle 10 by a pump or a valve (not shown) to apply pressure. The controller 21 and the container 22 are connected via the first pipe 23. Further, the controller 21 and the nozzle 10 are connected to each other via the second pipe 24. Further, the container 22 and the nozzle 10 are connected via a solder supply pipe 25.

When the solder S is applied using the solder application device 1, a command signal is sent from the outside to the controller 21 with the solder paste contained in the container 22. By this command signal, air is supplied from the controller 21 to the container 22 via the first pipe 23, the supply of the solder paste from the container 22 to the nozzle 10 is started, and the nozzle 10 is filled with the solder paste.

Further, air is supplied from the controller 21 to the nozzle 10 via the second pipe 24, and the solder paste filled in the nozzle 10 is discharged by the pressure of the air. Then, by adjusting the pressure of the air supplied to the nozzle 10 by the controller 21, the amount of solder S discharged from the nozzle 10 is adjusted.

In the present embodiment, air is directly supplied from the controller 21 to the nozzle 10 to apply pressure, but other configurations are also possible. For example, the controller 21 supplies air to the container 22, and the pressure of the air indirectly applies pressure from the controller 21 to the nozzle 10 via the solder paste filled in the nozzle 10 from the container 22. Is also possible.

In the solder coating apparatus 1 according to the present embodiment, as shown in FIGS. 1 and 2, the nozzle 10 includes a nozzle main body 11 which is a metal cylindrical member and a discharge portion 14 provided at the tip of the nozzle main body 11. , Is equipped.

The nozzle body 11 is composed of a discharge container 12 filled with the solder paste supplied from the container 22 and a fixing ring 13 for fixing the discharge unit 14 to the discharge container 12. The discharge container 12 is formed so that the lower portion has a smaller diameter than the upper portion. As shown in FIG. 2, a male screw portion 12b is formed on the outer peripheral surface of the discharge container 12, and a female screw portion 13a is formed on the inner peripheral surface of the fixing ring 13. The fixing ring 13 is fixed to the discharge container 12 by screwing the male threaded portion 12b and the female threaded portion 13a.

In the present embodiment, the discharge portion 14 is made of silicon, and the bulging portion 14a is formed by bulging toward the tip end side (lower side in FIG. 1) of the nozzle 10. A flange portion 14b is formed at the upper base end portion of the discharge portion 14 so as to project outward in the radial direction around the bulging portion 14a. In other words, the discharge portion 14 is formed in a shape like a round cap with a brim.

Further, a discharge port 14s is formed at the tip of the discharge portion 14 due to a notch. In the present embodiment, as shown in FIG. 3, four notches having different phases at 90 degrees are formed at the tip of the discharge portion 14 from one central point. The material of the discharge portion 14 may be a soft material having elasticity, and a resin material other than silicon can be used. For example, NBR (nitrile butadiene rubber), EPDM (ethylene propylene diene rubber), NR (natural rubber), BR (butadiene rubber), urethane, fluororubber, IR (isoprene rubber) and the like. Further, the shape of the discharge portion is not limited to the above, and other configurations may be used as long as the notch is formed.

The discharge unit 14 is removable from the nozzle body 11. Specifically, as shown in FIG. 2, the tip portion 12a of the discharge container 12 is inserted into the discharge portion 14. At this time, the flange portion 14b of the discharge portion 14 is brought into contact with the contact portion 12c formed in the discharge container 12. In this state, the female threaded portion 13a of the fixing ring 13 and the male threaded portion 12b of the discharge container 12 are screwed together. As a result, the pressing portion 13b formed on the fixing ring 13 presses the flange portion 14b, and the discharging portion 14 is fixed to the nozzle body portion 11. Further, by removing the fixing ring 13 from the discharge container 12, the discharge portion 14 can be removed from the nozzle main body portion 11.

In the nozzle 10 configured as described above, when air is supplied from the controller 21 via the second pipe 24, the solder paste filled inside the discharge container 12 is discharged from the discharge port 14s. Specifically, as shown in FIGS. 4 (a1) and 4 (a2), when the pressure P1 by air is applied to the solder paste inside the discharge container 12, the discharge port 14s is opened by the internal pressure like the opening diameter R1. Solder paste is discharged.

In the solder coating apparatus 1 according to the present embodiment, the size of the discharge port 14s is adjusted by changing the magnitude of the pressure of the air applied from the controller 21. Specifically, as shown in FIGS. 4 (b1) and 4 (b2), when a pressure P2 larger than the pressure P1 is applied to the solder paste inside the discharge container 12, the size of the discharge port 14s becomes larger than the opening diameter R1. It is opened like a large opening diameter R2 and the solder paste is discharged. On the contrary, when the pressure of the air applied from the controller 21 is reduced, the discharge port 14s is opened small and the solder paste is discharged.

As described above, in the solder coating apparatus 1, the discharge portion 14 is formed of an elastic soft material, and the discharge port 14s is formed by a notch at the tip portion thereof. Therefore, it is possible to adjust the size of the discharge port 14s by changing the size of the pressure of the air applied from the controller 21. That is, by repeating the ejection of the solder paste, even if the dry solder paste adheres to the vicinity of the tip of the nozzle 10 or the solder paste hardens, the pressure of the air applied from the controller 21 gradually increases. By adjusting in this way, the amount of solder paste discharged can be kept constant. That is, in the solder coating apparatus 1 according to the present embodiment, by keeping the amount of the solder paste to be applied constant, it is possible to perform the soldering quantitatively.

Further, even when the solder paste is fixed in a lump inside the solder coating device 1, the size of the discharge port 14s can be increased by applying a large pressure of air to the controller 21, so that the solder paste is fixed in a lump from the discharge port 14s. The solder paste can be discharged. That is, even when the solder paste is cured, clogging of the nozzle 10 can be prevented. That is, in the solder coating apparatus 1 according to the present embodiment, it is not necessary to remove the nozzle 10 for cleaning or replacement, so that it is possible to eliminate the cost and labor for performing these operations. It becomes.

Further, in the solder coating device 1 according to the present embodiment, the fixing ring 13 is attached to and detached from the discharge container 12, so that the discharge portion 14 can be attached to and detached from the nozzle main body portion 11. As a result, even if the discharge unit 14 is deteriorated due to wear or the like, the discharge unit 14 can be easily replaced. Further, since the only component to be replaced is the discharge portion 14, it is possible to significantly reduce the cost of the component due to the replacement as compared with the case where the metal nozzle is replaced.

<Another Embodiment>
Next, the solder coating apparatus according to another embodiment will be described with reference to FIGS. 5 and 6. The solder coating apparatus described below is different only in the configuration of the discharge portion from the solder coating apparatus 1. Therefore, the description of the configuration other than the discharge unit will be omitted, and the configuration of the discharge unit in each embodiment will be mainly described.

5 (a) to 5 (d) show the discharge portions 15 to 18 provided in the nozzle main body portion 11 in the solder coating apparatus according to the second embodiment to the fifth embodiment, respectively. In each embodiment, the discharge units 15 to 18 are made of silicon like the discharge unit 14.

A discharge port 15s due to a notch is formed at the tip end portion of the discharge portion 15 according to the second embodiment, and a circular hole 15h is formed at the tip end portion of the discharge port 15s. Further, a discharge port 16s is formed at the tip of the discharge portion 16 according to the third embodiment, and a square hole 16h is formed at the tip of the discharge port 16s.

As described above, according to the discharge ports 15s and 16s according to the second embodiment and the third embodiment, since the holes 15h and 16h are formed in advance, the solder paste is discharged when the solder paste is discharged from the discharge ports 15s and 16s. The initial pressure applied to the container can be reduced. As a result, the pressure applied to the discharge container can be adjusted in a small range, so that the amount of solder paste discharged from the discharge ports 15s and 16s can be easily adjusted.

The shape of the discharge port in the discharge portion is not limited, and various other shapes can be used. For example, as in the discharge unit 17 according to the fourth embodiment shown in FIG. 5C, three notches having different phases at 120 degrees may be formed from one central point to form the discharge port 17s. Further, as in the discharge portion 18 according to the fifth embodiment shown in FIG. 5 (d), six curved notches having different phases at every 60 degrees may be formed from one central point to form the discharge port 18s. good.

FIG. 6 shows a discharge unit 19 provided in the nozzle main body (discharge container 12 and fixing ring 13) in the solder coating apparatus according to the sixth embodiment. A discharge port 19s is formed at the tip of the discharge portion 19, and the bulge portion 19a is formed so that the thickness decreases toward the tip.

With the above configuration, the discharge port 19s is easily elastically deformed, so that the pressure applied to the discharge container when the solder paste is discharged from the discharge port 19s can be reduced. As a result, the pressure applied to the discharge container can be adjusted in a small range, so that the amount of solder paste discharged from the discharge port 19s can be adjusted more easily.

1 Solder coating equipment
10 Nozzles (Nozzles for solder coating equipment)
11 Nozzle body 12 Discharge container
11 Nozzle body 12 Discharge container
12a Tip part 12b Male thread part
13 Fixing ring 13a Female thread
13b Pressing part 14 Discharging part
14a bulge 14b flange
14s discharge port 15 discharge part
15s discharge port 15h hole
16 Discharge section 16s Discharge port
16h hole 17 discharge part
17s discharge port 18 discharge part
18s discharge port 19 discharge part
19a bulge 19s discharge port
14c Discharge port 21 controller
22 Container 23 First piping
24 Second piping 25 Solder supply piping
Area A B board
P1 pressure P2 pressure
R1 Aperture diameter R2 Aperture diameter

Claims (5)

A nozzle provided in a solder coating device that applies solder to a member to be coated.
The solder coating device includes the nozzle, a container for supplying the solder paste to the nozzle, and a pressure applying portion for applying pressure to the nozzle.
By applying pressure to the nozzle from the pressure applying portion, the solder paste filled in the nozzle is discharged.
The nozzle includes a nozzle main body portion that is a tubular member and a discharge portion provided at the tip of the nozzle main body portion.
The discharge portion is formed by bulging an elastic soft material toward the tip end side of the nozzle, and a discharge port is formed at the tip portion by a notch to change the magnitude of the pressure applied from the pressure applying portion. A nozzle for a solder coating device, which adjusts the size of the discharge port. The nozzle for a solder coating apparatus according to claim 1, wherein a hole is formed at the tip of the discharge port in the discharge portion. The nozzle for a solder coating apparatus according to claim 1 or 2, wherein the discharge portion is formed so that the thickness decreases toward the tip portion. The nozzle for a solder coating apparatus according to any one of claims 1 to 3, wherein the discharge portion is configured to be detachable from the nozzle main body portion. A solder coating apparatus comprising the nozzle for the solder coating apparatus according to any one of claims 1 to 4.

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