JP6194529B2 - Honing reamer, processing device using the same, and manufacturing method of honing reamer - Google Patents

Description

The present invention relates to an invention in which abrasive grains such as diamond are disposed in a reamer portion of a honing reamer, and in particular, a honing reamer that uses an adhesive layer to fix the abrasive grains so as to improve productivity . The present invention relates to a processing apparatus using the same and a manufacturing method of a honing reamer.

A honing reamer with a machining center or the like that drills a pilot hole in a workpiece (such as a cylinder) and finishes the pilot hole with a required finishing dimensional accuracy of, for example, 3 μm (micrometers) or less. It is often used.
The diamond is temporarily fixed to the base material with nickel plating or an adhesive, and then fixed again by nickel plating (electrodeposition).
Patent Document 1 (Japanese Patent Laid-Open No. 2005-279842) is an example in which abrasive grains (diamonds) are temporarily fixed to a base material by nickel plating, and an example in which electrodeposition plating is performed after temporarily fixing abrasive grains with an adhesive is patented. There exists literature 2 (Unexamined-Japanese-Patent No. 2011-235429).

In Patent Document 1, diamond is sprinkled on a base material, dipped in a temporary fixing plating tank, and then plated in a fixed plating tank to fix the diamond to the base material.
In addition, in Patent Document 2, abrasive grains are regularly arranged on a conductive adhesive sheet, the adhesive sheet is affixed to a base material and temporarily fixed, and then an electrodeposited nickel plating is applied on the adhesive sheet. It was made from.
In Patent Document 2, a large load is applied to the abrasive grains and the adhesive layer near the expansion / contraction slit when the reamer is driven, and the adhesion and fixing strength of the abrasive grains and the adhesive layer to the reamer substrate is increased. Nothing was shown about the means of.

  JP 2005-279842 A   JP2011-235429A

As described above, the abrasive grain fixing structure disclosed in Patent Document 1 is performed by two plating steps of temporary fixing and permanent fixing.
Therefore, when the temporary fixing is fixed, the plating solution naturally enters between the base material and the abrasive grains. As a result, the abrasive grains move, and the movement at the temporary fixing and plating is added in addition to the variation of the abrasive grains themselves. Tended to be uneven. In Patent Document 1, a truing process is provided and corrected for the purpose of correcting this.
Therefore, this correction process increases the cost of the honing reamer, and, contrary to the rationalization of the production process, results in wasteful processing of the expensive diamond itself.

Further, the abrasive grain fixing structure disclosed in Patent Document 2 is a method in which abrasive grains are regularly arranged in a staggered pattern on a conductive adhesive sheet, the adhesive sheet is attached to a base material, and this is used as a temporary fixing means. It is the one that has been fixed by applying plating.
Since the abrasive grains do not float with the plating solution in this case, the cause of unevenness of the abrasive grain tip is reduced, but the cause of unevenness is not only the variation of the abrasive grains but also, for example, how to attach the adhesive sheet, etc. Of course, variations will occur.
Therefore, this also requires a correction process similar to that of Patent Document 1.
As a result, the cost shown in this document is naturally high, which hinders mechanization of the production process.

As described above, both Patent Documents 1 and 2 are arranged regularly to control the abrasive density, improve the discharge of chips, etc., and improve the grinding performance using a honing reamer. No consideration was given to subsequent management of the abrasive grain tip, and the tip of the abrasive grain was made uniform by providing a truing process.
For this reason, there has been a problem that the number of processes is increased, the cost of the honing reamer is increased, and the production process is rationalized, and expensive diamonds themselves are wasted.
The present invention has been made for the purpose of solving the above problems.

The present invention has been made for the purpose of solving the above problems.
That is, the adhesive is thickly applied to the reamer base material so as to form an adhesive layer, and by embedding abrasive grains in the adhesive layer, the adhesion and fixing strength of the abrasive grains is increased, and variations and abrasives at the time of abrasive grain planting are increased. Variations on the front end side of the abrasive grains coming from variations in the grains themselves are absorbed in the adhesive layer.
Further, the adhesion strength of the abrasive grains and the adhesive layer adjacent to the enlargement / reduction slit portion to the reamer base material is improved .

As this means, in the honing reamer in which the abrasive grains are temporarily fixed to the reamer base material with the adhesive layer, and the plating layer for fixing the abrasive grains to the reamer base material is applied.
Abrasive grains are temporarily fixed to the adhesive layer provided on the outer periphery of the reamer substrate except for the expansion / contraction slits, and the abrasive grains are fixed to the base material with the first plating layer, and the expansion / contraction slits described above. In addition to the first plating layer, the adhesive layer adjacent to the portion and the slit portion for expansion / contraction are a honing reamer covered with a second plating.
By doing so, the abrasive grains and adhesive layer adjacent to the slit portion are covered with the second plating in addition to the first plating layer, and the adhesion strength is improved, so even if the load during driving increases As in the prior art, the abrasive grains and the adhesive layer are not peeled off from the reamer substrate.

In addition to the first nickel plating layer, the second nickel plating was applied to the expansion / contraction slit portion and the adhesive layer adjacent to the slit portion, and the adhesive layer and the abrasive grains were fixed to the reamer substrate. Honing reamer.
As described above, since the same nickel plating as the first plating is used for the second plating, it is not necessary to prepare a special plating tank.

The expansion / contraction slit portion is a honing reamer that is provided in the reamer portion and discharges grinding scraps near the slit portion.
The honing reamer according to the present invention is provided with a slit for expansion / contraction, so that grinding waste can be discharged, grinding oil can be supplied, and the reamer outer diameter can be finely adjusted.

Moreover, it is a honing reamer which uses the adhesive agent which has vibration absorption for the adhesive bond layer which temporarily fixes an abrasive grain.
By doing so, the honing reamer of the present invention can absorb vibrations generated during use, and therefore noise and environmental measures can be taken.

In addition, the honing reamer is assembled to the main spindle of the machine tool so as to be movable up and down, and the machining device using the honing reamer for finishing the prepared hole of the workpiece with an ultra-precision finish is provided.
By doing so, it is possible to perform grinding finishing with low cost, high accuracy, and high reliability.

In addition, abrasive grains are temporarily fixed to the adhesive layer provided on the outer periphery of the reamer substrate except for the slit portion for expansion / contraction, and the abrasive grains are fixed to the substrate with the first plating layer, and The adhesive layer adjacent to the slit part and the slit part for expansion / contraction are the manufacturing method of the honing reamer covered with the second plating in addition to the first plating layer.
Thus, conventionally, the abrasive grains and the adhesive layer adjacent to the enlargement / reduction slit part and the enlargement / reduction slit part were easily damaged by the load during the reamer drive, but the abrasive grains adjacent to the slit part of the present invention and Since the adhesive layer is covered with the second plating in addition to the first plating layer and the adhesion strength is improved, even if the load during driving increases, the abrasive grains and the adhesive layer are removed from the reamer substrate. Saying that it will come off A method for making a honing reamer is available.

Moreover, it is a manufacturing method of the honing reamer whose film thickness of the adhesive bond layer apply | coated to a reamer base | substrate outer periphery was 30-60 micrometers.
By doing so, a manufacturing method of a honing reamer that can rationalize the manufacturing equipment and simplify the finishing process can be obtained.

Also, a pressing sheet of a pressing press having a pressing sheet having an arc capable of pressing a ¼ range of the outer diameter of the reamer and a sheet guide for reducing the outer diameter of the pressing sheet. Is a manufacturing method of a honing reamer in which the abrasive grains are pressed toward the center of the substrate and the abrasive grains are positioned in the adhesive layer.
As described above, the present invention increases the range in which the abrasive grains are pressed by the indentation press, so that the escape area of the extruded adhesive is widened, and a method for producing a honing reamer in which the adhesive does not protrude outside is obtained.

Since the abrasive grains and the adhesive layer adjacent to the slit portion of the present invention are covered with the second plating in addition to the first plating layer and the adhesion strength is improved, even if the load during driving increases, the conventional As described above, the abrasive grains and the adhesive layer are not peeled off from the reamer base material.

Furthermore, since the manufacturing equipment can be rationalized and the finishing process can be simplified, not only the honing reamer alone but also the processing apparatus and the manufacturing method can be made inexpensive.
In addition, the grinding operation by the processing apparatus equipped with the honing reamer and the discharge of chips and the like are good, and the grinding finish processing can be performed at a low cost and with high accuracy.

  It is principal part explanatory drawing of the honing reamer (diamond reamer) and processing apparatus provided with this invention.   It is a principal part expansion perspective view of the honing reamer shown in FIG.   It is a principal part expanded sectional view of FIG.   It is the P section enlarged view of FIG.   It is a figure which shows the manufacturing process of the reamer part of FIG.   FIG. 6 is a diagram schematically illustrating the manufacturing process of FIG. 5.   It is explanatory drawing of the indentation press used at the time of pressure molding shown in FIG.   FIG. 4 is an enlarged cross-sectional view of a diamond reamer different from FIG.

Next, details of the present invention will be described with reference to an embodiment shown in the drawings.
First, in FIGS. 1 to 4, FIG. 1 is an explanatory view of a main part of a honing reamer (diamond reamer) and a processing apparatus provided with the present invention. 2 is an enlarged perspective view of a main part of the honing reamer shown in FIG. 1, FIG. 3 is an enlarged sectional view of the main part of FIG. 2, and FIG. 4 is an enlarged view of a P part of FIG.
In FIG. 1, 1 is a floating holder body for mounting a honing reamer, which will be described later, and this holder body 1 is mounted on a spindle of a general-purpose machine tool such as a drilling machine or a machining center. In this embodiment, the holder body 1 is mounted on a honing machine. This will be explained with an example.

The holder body 1 has a collet 3 or the like for mounting a honing reamer 5 mounted on the main shaft of the honing machine. Reference numeral 4 denotes a spindle which moves the honing reamer 5 up and down with a known configuration. (Specific example is Patent No. 3208559 acquired by the same applicant.)
Reference numeral 6 denotes a nut which serves to tighten the honing reamer 5, here the collet 3 holding the diamond reamer. The nut 6 is located at the tip (bed side) of the honing holder main body 1 as shown in the figure.

Next, the honing reamer 5 (diamond reamer) as a processing tool will be described with reference to FIGS. 2 and 3 including FIG.
The honing reamer 5 mentioned here has a reamer portion 8 for ultra-precision finishing a shank 7 mounted on a machining center or the like and a prepared hole of the workpiece.
The reamer 8 has a cylindrical shape and has abrasive grains 9 such as diamond on the outer peripheral surface.
Diamond reamers are often used for ultra-precision finishing such as castings, aluminum, copper, plastic, and hardened steel.

Reference numeral 10 denotes slits provided in the reamer unit 8 in several strips. The slit 10 is for expanding and contracting the reamer portion 8.
Reference numeral 11 denotes an internal hollow hole provided inside the reamer part. The inner hollow hole 11 has a larger inner diameter on the end face side and a smaller inner diameter as it goes deeper.
Reference numerals 12 and 13 are incorporated in the hole 11 to expand and contract the reamer portion 8, 12 is a ball, and 13 is a tapered cone. Reference numeral 14 denotes a pushing screw for pushing the ball 12 or the tapered cone 13 into the hollow hole 11 inside. The ball 12 or the tapered cone 13 is inserted into the inner hollow hole 11 and moves on the inclined surface of the inner hollow hole 11 by the movement of the push screw 14.

That is, the screw portion 15a on the push screw 14 side is screwed into the screw groove 11a provided on the inner hollow hole 11 side, the push screw 14 is rotated, and the ball 12 or the taper cone 13 is inclined to the inclined surface by the taper cone set portion 15b. As the ball advances, the ball 12 pushes the slit 10 open. (The push-in screw 14 includes a screw portion 15a, a tapered cone set portion 15b, and the like.)
As a result, the outer diameter of the reamer 8 is increased. When the pushing screw 14 is turned to the opposite side and the tapered cone set portion 15b is moved backward along the inclined surface toward the end surface side, the ball 12 or the tapered cone 13 causes the outer diameter of the reamer portion 8 to be increased by the repulsive force of the slit 10. The diameter is reduced.

Next, the adhesion and fixing of diamond as the abrasive grains 9 attached to the reamer unit 8 will be described.
As described above, the reamer 8 has several slits 10 on the outer periphery of the cylinder because of the expansion / contraction mechanism (internal hollow hole 11, ball 12, push screw 14). The slits 10 are formed by grooves provided at the outer peripheral portion of the reamer base 8 a at equal parts and provided at the fixing portion of the abrasive grains 9.

Reference numeral 16 denotes a conductive adhesive layer. The adhesive layer 16 is obtained by applying an adhesive to the reamer substrate 8a with a film thickness of 30 to 60 μm, and the conductive adhesive layer 16 may use a conductive adhesive itself. In addition, conductivity may be formed on the surface.
In this case, for example, the surface of the epoxy resin adhesive layer (not conductive) applied to the surface of the reamer substrate 8a is primed with an etching material, tin is adsorbed on the surface, and sensitivity is imparted. Next, it is immersed in a panadium solution to form a metal layer on the surface, and a nickel plating layer is formed thereon.

  The temporarily fixed fixing portion 9c of the abrasive grain 9 is adhered and fixed (temporarily fixed) to the adhesive layer 16. Although the temporary fixing structure of the abrasive grains 9 will be described later, one surface of the abrasive grains 9 is not simply bonded to the adhesive layer 16 as in the prior art. The bottom part of the abrasive grains 9 is embedded in the adhesive layer 16 so that 9c (plural surfaces) are in close contact with the adhesive, and the fixing part 9c is temporarily fixed or fixed.

In addition, when the workpiece 2 that does not require so much adhesive fixing strength of the abrasive grains is ground and finished, the fixing of the abrasive grains of the adhesive layer 16 may be treated as the main fixing. The size of the abrasive grains 9 used at this time is, for example, an average abrasive grain diameter, and is generally 125 to 590 μm that is commercially available.
Further, an epoxy adhesive is used as an adhesive for forming the adhesive layer 16, and is uniformly applied to the outer periphery of the reamer substrate 8a by using a roller or the like to form an adhesive layer 16 having a thickness of 30 to 60 μm. Yes. This film thickness embeds approximately 10% to 20% of the abrasive grain size of 125 to 590 μm.
In addition, the nickel plating thickness at this time is managed by 20-30 micrometers. This is a relatively thick plating thickness.

A plurality of surfaces including the bottom surface of the previous abrasive grains 9 and 10% to 20% in height are embedded in the adhesive layer 16 having a film thickness of 30 to 60 μm.
Furthermore, in order to improve the biting of the adhesive layer 16 to the reamer base material 8a, the reamer base material 8a substrate is activated in steps such as electrolytic degreasing, water washing, rust removal, and water washing.

Reference numeral 17 denotes a first nickel plating. The first nickel plating 17 serves to fix (fix) the abrasive grains 9 temporarily fixed with the adhesive layer 16 to the reamer substrate 8a.
In addition, the magnitude | size of the abrasive grain demonstrated by a present Example is 125-590 micrometers by an abrasive grain diameter, and the film thickness of the adhesive bond layer 16 is 30-60 micrometers.

Further, the abrasive grains 9 are single with respect to the reamer substrate 8a, and the density is devised so as to be kept substantially uniform.
In other words, the abrasive grains 9 are aligned with the outer diameter line E (shown in FIG. 3) so as to be in contact with each other and are planted in the adhesive layer 16.

FIG. 4 is an enlarged view of a portion P in FIG.
In the case of FIG. 3, the bottom surface 9a of the abrasive grains 9 is that nearly half is not in contact with the reamer substrate 8a. However, the tip 9b of the abrasive grain 9 is in contact with the outer diameter line E.
That is, variations in the abrasive grain size and other planting errors are absorbed within the thickness of the adhesive layer 16.
In the case of FIG. 4, the bottom surface 9 a of most abrasive grains 9 is in contact with the reamer base material 8 a, and the tip 9 b of the abrasive grains 9 is in contact with the outer diameter line E.
This is when there is little variation in the abrasive grain size and other planting errors.

Next, the manufacturing process of the reamer unit 8 having the abrasive grains 9 will be described with reference to FIGS.
FIG. 5 is a diagram showing a manufacturing process of the reamer portion of FIG. 1, FIG. 6 is a schematic diagram illustrating the manufacturing process of FIG. 5, and FIG. 7 is used in the press molding (pressure molding) shown in FIG. It is explanatory drawing of the pressing press to do.
First, at Step-1, the reamer base 8a constituting the reamer body 8 and the adhesive constituting the adhesive layer 16 and the abrasive grains 9 are prepared as materials as shown in the figure. At this time, the surface of the reamer substrate 8a is roughened by shot blasting or the like. In addition, an epoxy adhesive having heat resistance and conductivity is prepared.

Furthermore, although the abrasive grain 9 prepared the diamond, it is not limited to this. Moreover, although the size of the abrasive grains 9 is prepared, for example, around 300 μm, this is not limited to this size. For example, 125 to 590 μm is applicable to the present invention.
However, at this time, it is naturally necessary to change the layer thickness (film thickness) of the adhesive layer 16 and the first nickel plating 17 described later.

The adhesive prepared in Step-1 is applied to the reamer base material 8a constituting the reamer body 8 in Step-2, and becomes an adhesive layer 16. At the time of applying the adhesive, the reamer substrate 8a rotates at a constant speed, and the viscosity-adjusted adhesive is applied to the outer periphery of the reamer substrate 8a using a roller or the like.
Next, the abrasive grains 9 are dropped on the reamer substrate 8a rotating at a constant speed in Step-3.
At this time, the rotation speed is set to a speed that matches the diameter of the abrasive grains 9 or the shape of the reamer base material (a speed set by preliminary examination).

Further, among the abrasive grains 9 that have fallen on the reamer substrate 8a, the abrasive grains 9 that have reached and adhered to the adhesive layer 16 remain on the reamer substrate 8a, but have not reached the adhesive layer 16 9 cannot stay on the reamer base material 8a, falls into a lower container (not shown), and returns to the diamond side where it falls again.
In other words, the fine vibration described below and the number of rotations of the reamer substrate 8a or the like are determined in advance so that the reamer substrate 8a is bonded to the reamer substrate 8a only at a certain density.
It is also possible to control so that the abrasive grains 9 do not fall where the abrasive grains are not required by changing the rotation speed of the reamer substrate 8a (for example, the previous slit 10).
In Step-4, the reamer substrate 8a is rotated, and the abrasive grains 9 attached to the reamer substrate 8a together with other means (for example, a brush) can be sieved and the density can be adjusted.
That is, excess abrasive grains 9 and the like that have entered between the abrasive grains 9 are screened off to obtain a substantially uniform density.

Thereafter, in Step-4, the press-molding (pressure molding) of the abrasive grains 9 attached to the reamer substrate 8a is performed.
That is, in Step-3, since the part of the abrasive grain 9 that has been lowered is only in contact with the adhesive layer 16, it may be peeled off if an impact is applied in the assembly process. There is also.
If it peels off, the density will change, as well as the product may be defective.
In the present invention, the abrasive grains 9 are prevented from being peeled off from the reamer base material 8a by this indentation molding.

For this reason, in the present invention, as in Step-4, the abrasive grains 9 are pressed and formed at an early stage after the descending process, and the abrasive grains 9 are embedded in the adhesive layer. is there.
The means for this purpose is an indentation press, in which the abrasive grains are pressed from the tangential direction toward the center of the reamer substrate, and a plurality of surfaces including the bottom surfaces of the abrasive grains are brought into close contact with the adhesive layer 16.
Alternatively, the abrasive grains 9 are passed through the adhesive layer 16 and brought into contact with the reamer substrate 8 a, and the abrasive grains 9 are adhered and fixed to the adhesive layer 16. Of course, even at this time, the bottom surface of the abrasive grains 9 is bonded to the reamer substrate 8a.

Further, when the above-described indentation (pressure forming) means (Step-4), the previous adhesive application means (Step-2), and the abrasive 9 landing means (Step-3) are combined organically, a conventional adhesive sheet The diamond reamer can be easily obtained by arranging the abrasive grains 9 regularly and planting them.
That is, the adhesive layer 16 is spirally formed on the reamer substrate 8a at Step-2, the abrasive grains 9 are dropped thereon, and the abrasive grains 9 are pressed by a press molding (pressure molding) means (Step-4). Is pressed, and a plurality of surfaces including the bottom surface of the abrasive grains 9 are brought into close contact with the adhesive layer 16, so that a diamond reamer having a spiral shape that has been difficult to manufacture in the past can be easily obtained.
Further, in the above combination, if the rotation speed of the reamer base 8a is varied, the density of the abrasive grains 9 falling on the reamer base can be easily changed, so that the diamond reamer can be supplied according to the purpose of use. It becomes possible.

Further, by adopting this seeding method, the function of the honing reamer (diamond reamer) can be changed only by changing the type of adhesive applied to the reamer substrate 8a.
That is, if a vibration-absorbing adhesive is used, vibrations generated during use can be absorbed, so that noise countermeasures can be taken and further environmental measures can be taken.

Next, Step-5 is entered, and the adhesive layer 16 in which the abrasive grains 9 are adhered and fixed to the reamer substrate 8a is dried in, for example, a drying furnace at 100 ° C. to 200 ° C., whereby the adhesive is thermally cured.
Next, in Step-6, the reamer part 8 is immersed in a plating tank, nickel plating is performed on the adhesive layer 16, and the abrasive grains 9 are firmly fixed (fixed) to the reamer substrate 8a.
Thereafter, after finishing adjustment and a completion inspection process, Step-n is reached and a honing reamer (diamond reamer) is completed.

The honing reamer is created according to the above flowchart (FIG. 5).
Hereinafter, the main part of FIG. 5 will be described in more detail with reference to FIG.
That is, shot blasting is applied to the surface of the reamer substrate 8a in the Step-1 to Step-2 step column to make it rough. This increases the adhesion area with the epoxy adhesive (conductivity) to be applied with an increased adhesion area, and prevents interfacial peeling and the like from occurring.
The film thickness of the adhesive is 30 to 60 μm. This is referred to as the adhesive layer 16 in the present invention.
Further, the reamer base material 8a on which the adhesive layer 16 is formed rotates with the variable rotation shaft 18 as a base point up to Step-5 in FIG.

Abrasive grains 9 prepared by a distributor 19 such as a shooter are dropped onto the rotating reamer substrate 8a (as shown in the Step-3 step column).
In addition, by giving a fine vibration to the distributor 19 such as the shooter, the density of the abrasive grains 9 on the distributor 19 such as the shooter can be made uniform and aligned.
The uniform and aligned abrasive grains 9 are allowed to fall on the reamer base material 8a. However, how to give fine vibration, strength, etc. are determined in advance by preliminary examination.

Next, the pressing press 20 constituting the pressing molding (pressure molding) means described in the Step-4 to Step-5 step column will be described.
The indentation press 20 is characterized in that when the indentation press 20 presses the abrasive grains 9 (a state) that have been in contact with the adhesive layer 16, the bottom 9a of the abrasive grains 9 passes over the adhesive layer 16 and the reamer substrate 8a. This is a point where pressure is applied until it comes into contact with (b state). The abrasive grains 9 in the (b state) state are not pressed until all of them are in contact with the reamer base material 8a, but a part thereof is located in the adhesive layer.
Thereby, the front-end | tip 9b of each abrasive grain 9 will become substantially aligned with the outer diameter line E (c state).
In other words, the outer diameter of the reamer 8 is substantially uniform although there are variations in abrasive grain size and material, and variations in implantation.
At the same time, a plurality of surfaces (including the bottom 9 a) of the abrasive grains 9 are in close contact with the adhesive layer 16. The adhesion fixing force is a fixing strength that enables the workpiece to be ground and ground with this adhesive fixing force when heated and dried.

Here, with reference to FIG. 7, the pressing press 20 will be described in more detail.
The indentation press 20 is composed of an indentation sheet guide 20a, an indentation sheet portion 20b, and the like, and presses the abrasive grains 9 simultaneously within a predetermined range from the tangential direction toward the center of the reamer substrate 8a. Is configured to be pressed until it passes through the adhesive layer 16 and abuts against the reamer substrate 8a.
Of course, the pressing size of the abrasive grains 9 by the indentation press 20 can be changed, and the bottom surface 9a of the abrasive grains 9 is stopped before it hits the reamer substrate 8a, and the bottom surface 9a of the abrasive grains 9 is positioned in the adhesive layer 16. You can also

Further, as shown in FIG. 7, the indentation press 20 has a structure in which the abrasive grains are simultaneously pressed within a predetermined range.
This is of course an improvement in workability, but when the pressing press 20 presses the abrasive grains 9, if this range is small, there is no escape space for the adhesive pushed out to the abrasive grains 9, and the pressing surface of the pressing press 20. Since it protrudes further, it is enlarged to some extent to secure a place for the extruded adhesive to escape.

Further, the pressing sheet portion 20b used in the pressing press 20 has a thickness of about 2 mm and is flexible, for example, a sheet made of Teflon.
Accordingly, the abrasive grains 9 pressed by the resin sheet are pressed toward the center of the reamer substrate 8a while being wrapped by the pressing sheet portion 20b.
For this reason, since the abrasive grains 9 do not fall from the reamer base material 8a in this pressurizing step, the uniform honing reamer 5 without unevenness in density is obtained.

Further, the uniforming of the abrasive grain density can also be obtained by the fact that the abrasive grains protrude when the pressing press 20 pushes the abrasive grains toward the reamer substrate 8a.
In other words, when the abrasive grains 9 do not protrude, there is a gap between the abrasive grains 9, and the abrasive grains 9 are implanted in the gap.

The pressing press 20 capable of pressing a range of, for example, 1/4 of the outer diameter of the reamer is composed of a pressing sheet guide 20a and a pressing sheet portion 20b. The pressing sheet portion 20b is made of Teflon or the like as described above. It is.
Thus, the pushing sheet portion 20b that presses a ¼ range of the reamer outer diameter has a slightly larger arc than the outer diameter of the reamer portion 8, and the abrasive grains 9 are pressed through the pushing sheet guide 20b. When this is done, the previous push-in sheet portion 20b is deformed in a smaller direction so as to match the outer diameter of the previous reamer portion 8.
By continuing the processing in this state, the tips 9b of the abrasive grains 9 are positioned in substantially the same arc shape.

  Next, returning to the Step-6 to Step-n process column of FIG. 6, the abrasive grains 9 closely fixed by the adhesive layer 16 are first nickel-plated (finally fixed) to become a reamer portion 8 and the honing reamer 5 is completed. To do. The film thickness of the first nickel plating 17 at this time is 20 to 30 μm, but this varies depending on the size of the abrasive grains 9.

8 is a second nickel plating for plating the expansion / contraction slit portion, and is provided so as to cover the adhesive layer adjacent to the expansion / contraction slit portion and the first nickel plating 17.
As described above, the expansion / contraction slit portion is provided with several strips for the purpose of finely adjusting the radial dimension, supplying grinding oil, discharging grinding scraps, and the like. The load applied to the abrasive grains near the slit 10 is not different from the other portions during normal rotation, but naturally becomes a large load during driving.
Therefore, it is necessary for the abrasive grains in this portion to improve the adhesion strength to the reamer substrate. As a means for this purpose, in this embodiment, masking or the like is performed using a tape or a jig so that the adhesive is not applied to the expansion / contraction slit 10 portion. In addition, the second nickel plating 21 is applied.

That is, in FIG. 8, the second nickel plating 21 is further applied on the nickel plating 17 layer in order to improve the strength of the slit 10 part.
By doing so, the strength of the slit 10 part is improved, and even if the driving load increases, it cannot be said that it will come off from here.

Since the present invention has the configuration as described above, the following operational effects can be obtained.
That is, a honing reamer and a processing apparatus using the same, in which the abrasive grains are temporarily fixed to the reamer base material with an adhesive, and then the first nickel plating is performed to fix the abrasive grains to the reamer base material. In this case, the adhesive forms an adhesive layer having a film thickness of 30 to 60 μm on the outer periphery of the reamer substrate, the temporary fixing portions of the abrasive grains are located in the adhesive layer, and a plurality of surfaces serve as the adhesive layer. A honing reamer that is closely fixed and a processing apparatus using the honing reamer are provided.

As described above, in the present invention, the adhesive is applied thickly so as to form an adhesive layer on the reamer base material, and the adhesive fixing strength of the abrasive grains is enhanced by embedding abrasive grains in the adhesive layer, and the abrasive grains are planted. Even if the finishing process is simplified, the distance from the surface of the reamer substrate to the tip of the abrasive grain can be increased by absorbing the dispersion on the abrasive grain tip side that comes from the dispersion of the time and the abrasive grain itself. It can be maintained within the set dimensional range, and after embedding abrasive grains in the adhesive layer, the abrasive grains are not peeled off during operation and the density is not changed.
In addition, the grinding operation by the processing apparatus equipped with the honing reamer and the discharge of chips and the like are good, and the grinding finish processing can be performed at a low cost and with high accuracy.

Further, a part of the abrasive grains in which a plurality of surfaces are closely fixed so as to be embedded in the adhesive layer are in contact with the reamer base material through the adhesive layer.
As a result, the dispersion of abrasive grains and the like can be easily absorbed, and the abrasive grains adhere firmly to the reamer substrate with an adhesive attached to the bottom surface when the adhesive layer passes through.
Moreover, since the abrasive grains located in the adhesive layer have a plurality of surfaces that are in close contact with the adhesive layer, the fixing force at this portion is also reliable.
On the other hand, since each abrasive grain is pressurized by the pressing surface of the pressing press 20, the tip of the abrasive grain is aligned with the pressing surface of the pressing press.

In other words, the reamer outer diameter is substantially uniform.
Thereby, the conventional process of adjusting the reamer outer diameter can be simplified, and mechanization of reamer production is promoted.
If the adhesive layer 16 functions as a cushioning material to absorb vibrations, the effect of using the adhesive layer for temporarily fixing the abrasive grains 9 is expanded.

Further, after the abrasive grains temporarily fixed to the adhesive layer having a film thickness of 30 to 60 μm are disposed on the reamer base material, the abrasive grains are simultaneously pushed in a predetermined range from the tangential direction toward the center of the reamer base material by a pressing press. Thus, a honing reamer in which a part of the abrasive grains passes through the adhesive layer and comes into contact with the reamer base material and a processing apparatus using the honing reamer are provided.
The pressing press 20 at this time is composed of a pressing sheet guide 20a and a pressing sheet portion 20b, and the pressing sheet portion 20b is made of Teflon or the like as described above.
Thus, the pushing sheet portion 20b that presses a ¼ range of the reamer outer diameter has a slightly larger arc than the outer diameter of the reamer portion 8, and the abrasive grains 9 are pressed through the pushing sheet guide 20b. When this is done, the center of the previous push-in sheet portion 20b is deformed to fit the outer diameter of the previous reamer portion 8.
By continuing the processing in this state, the tips 9b of the abrasive grains 9 are positioned in substantially the same arc shape.

Further, the honing reamer is configured to cover the adhesive layer adjacent to the expansion / contraction slit portion and the first nickel plating by the second nickel plating for plating the expansion / contraction slit portion.
As described above, the honing reamer has several slits for expansion / contraction for the purpose of finely adjusting the dimension in the radial direction, supplying grinding oil, discharging grinding waste, and the like. The load applied to the abrasive grains before and after the slit 10 is not different from the other parts during normal rotation, but naturally becomes a large load during driving.
Therefore, it is necessary to improve the adhesion strength between the abrasive grains in this portion and the reamer substrate. As a means for this purpose, in this embodiment, masking or the like is performed using a tape or a jig so that the adhesive is not applied to the expansion / contraction slit 10 portion. In addition, the second nickel plating 21 is applied.

Further, a honing reamer in which an adhesive layer is formed on a reamer substrate, abrasive grains are dropped on the adhesive layer, and the abrasive grains are positioned in the adhesive layer with a pressing press or the like, and a processing apparatus using the honing reamer It is what.
As a result, the density of the adhesive layer applied to the reamer substrate and the density of the abrasive grains to be dropped can be arbitrarily selected, so that it is easy to meet the purpose of use, as well as measures such as grinding waste discharge and grinding oil supply. It becomes easy to take.

In addition, a honing reamer in which abrasive grains are fixed to an adhesive layer by nickel plating is attached to a honing machine or the like to form a processing device using a honing reamer that processes a pilot hole or the like of a cylinder.
As a result, the grinding operation by the processing apparatus equipped with the honing reamer and the discharge of chips and the like are good, and the grinding finish processing is highly accurate.
Further, in the present invention, since the fine adjustment work process can be simplified, labor saving in the production process of the honing reamer can be achieved, and an inexpensive processing apparatus can be obtained.

  In addition, a honing reamer that has been temporarily fixed to the reamer substrate with an adhesive and then plated with nickel to fix the abrasive particles to the reamer substrate. An adhesive layer is formed on the adhesive layer, and abrasive grains are applied to the adhesive layer. After the excess abrasive grains are removed by rotation of the reamer base, the abrasive grains are reamered from the tangential direction simultaneously within a predetermined range with a pressing press. This is a manufacturing method of a honing reamer which is pressed toward the center of the base material so that abrasive grains are positioned in the adhesive layer and nickel plating or the like is applied to the surface of the adhesive layer or the like.

As a result, the adhesion and fixing strength of the abrasive grains can be increased, and the dispersion at the tip of the abrasive grains due to the dispersion at the time of grain implantation and the dispersion of the abrasive grains themselves can be absorbed in the adhesive layer, thus simplifying the finishing process. However, the distance from the surface of the reamer substrate to the tip of the abrasive grain can be maintained within the set size range, and after the abrasive grains are embedded in the adhesive layer, the abrasive grains are not peeled off during the operation and the density is not changed.
Further, in the manufacturing method of the processing apparatus equipped with the honing reamer, the grinding work and the discharge of chips and the like are good, and the grinding finishing process can be performed at a low cost and with high accuracy.

In addition, the adhesive is applied to the surface of the rotating reamer base material to form an adhesive layer, and the abrasive grains are aligned through a distributor such as a shooter to which fine vibration is applied, and the density is made uniform. A honing reamer in which the abrasive grains are dropped onto the adhesive layer, and after removing the excess abrasive grains, the abrasive grains are pressed by a pressing press so that a plurality of surfaces including the bottom surface of the abrasive grains are positioned in the adhesive layer. This is the production method.
Thereby, the conventional process of adjusting the reamer outer diameter can be simplified, and rationalization of reamer production can be promoted.
If the adhesive layer 16 functions as a cushioning material to absorb vibrations, the effect of using the adhesive layer for temporarily fixing the abrasive grains 9 is expanded.

DESCRIPTION OF SYMBOLS 1 Holder body 2 Work piece 3 Collet 4 Spindle 5 Honing reamer 6 Nut 7 Shank 8 Reamer part 8a Reamer base material 9 Abrasive grain 9a Abrasive grain bottom face 9b Abrasive grain tip 9c Temporary fixing part 10 Slit 11 Internal hollow hole 11a Thread groove 12 Ball 13 Taper cone 14 Push screw 15a Screw portion 15b on the push screw 14 side 15b Taper cone set portion 16 Adhesive layer 17 First nickel plating 18 Variable rotating shaft 19 Distributor 20 such as a shooter Push press 20a Push sheet Guide 20b Push sheet part 21 Second nickel plating

Claims (8)

In a honing reamer in which the abrasive grains are temporarily fixed to the reamer substrate with an adhesive layer, and the reamer substrate is provided with a plating layer for fixing the abrasive grains.
Abrasive grains are temporarily fixed on the adhesive layer provided on the outer periphery of the reamer substrate except for the slits for expansion and contraction. The abrasive grains are fixed to the substrate with the first plating layer, and the adhesive layer adjacent to the expansion / contraction slit portion and the expansion / contraction slit portion include the second plating layer in addition to the first plating layer. Honing reamer characterized by being covered with. In addition to the first nickel plating layer, a second nickel plating was applied to the expansion / contraction slit part and the adhesive layer adjacent to the slit part, and the adhesive layer and abrasive grains were fixed to the reamer substrate. The honing reamer according to claim 1. The honing reamer according to claim 1, wherein a plurality of slits for expansion / contraction are provided in the reamer part, and grinding scraps near the slit part are discharged. The honing reamer according to claim 1, wherein a vibration-absorbing adhesive is used for the adhesive layer for temporarily fixing the abrasive grains. A machining apparatus using a honing reamer that assembles the honing reamer according to any one of claims 1 to 4 to a spindle of a machine tool so as to be movable up and down and finishes a prepared hole in a workpiece. Abrasive grains are temporarily fixed to the adhesive layer provided on the outer periphery of the reamer substrate except for the expansion / contraction slits, and the abrasive grains are fixed to the base material with the first plating layer, and the expansion / contraction slits described above. The manufacturing method of the honing reamer characterized by the adhesive layer adjacent to a part and the slit part for expansion / contraction being covered with 2nd plating other than said 1st plating layer. The method of manufacturing a honing reamer according to claim 6, wherein the thickness of the adhesive layer applied to the outer periphery of the reamer substrate is 30 to 60 µm. An indentation sheet of an indentation press having an indentation sheet having an arc capable of pressing a quarter range of the reamer outer diameter and a sheet guide for reducing the outer diameter of the indentation sheet. The method for producing a honing reamer according to claim 6, wherein the abrasive grains are positioned on the adhesive layer by pressing toward the surface.

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