JP6231397B2 - Component recognition device, component transfer device, and component mounting device - Google Patents

Description

  The present invention relates to a technique applied to a component mounting apparatus and the like, and in particular, a component recognition device for detecting oblique suction of a component sucked by a component transfer head, and a component including the component recognition device The present invention relates to a transfer device and a component mounting device.

  2. Description of the Related Art Conventionally, there is known a component mounting apparatus that picks up a component from a component supply unit by a mounting head (a component transfer head), and transports the component onto a substrate for mounting. The component mounting apparatus is equipped with an imaging device, and the component sucked by the mounting head prior to mounting of the component on the board is imaged, and the suction state of the component is examined based on the image, When the parts are mounted, the mounting position is corrected.

  Note that Patent Document 1 includes a first imaging device that captures a component picked up by a mounting head from the side, and a second imaging device that captures the component from directly below. It is configured to detect whether or not a component is adsorbed to the mounting head based on the imaging result of, and to recognize the adsorption state of the component by the mounting head based on the imaging result of the second imaging device. A component mounting apparatus is disclosed.

JP 2010-199446 A

  As the component adsorption state by the mounting head, there is a case where so-called oblique adsorption occurs in which the component is adsorbed by the mounting head while being tilted in the vertical direction. This oblique suction occurs, for example, when a foreign substance such as solder adheres to the tip of the mounting head and the component is sucked to the tip of the mounting head while the foreign object is sandwiched.

  Depending on the degree of the diagonal suction of components, there is a possibility of causing a mounting failure. Therefore, it is necessary to detect and deal with this. In this regard, according to the component mounting apparatus of Patent Document 1, the component sucked by the mounting head can be picked up from the side by the first image pickup device, so that it is easy to detect oblique suction. However, in the configuration in which the imaging device (first imaging device) is disposed within the movable region of the mounting head, as in the component mounting device of Patent Document 1, the operation of the mounting head is limited to avoid interference. . In addition, depending on the orientation of the component relative to the first imaging device (direction around the vertical axis), it may be difficult to determine whether the suction is diagonal.

  The present invention has been made in view of such circumstances, and provides a technique capable of more reliably detecting oblique suction without hindering the degree of freedom of operation of the transfer head. With the goal.

In a component mounting apparatus or the like, when an image of a component correctly attracted to the transfer head is taken from directly below, only the component bottom surface is illuminated and appears bright. Further, when the part is imaged obliquely from below, only the part bottom face and a specific side face are illuminated and appear bright, and the other faces hardly appear in the part image. However, when the component is in the diagonally picked up state, the component side that is not reflected in the component image will be reflected in the component image by conversely tilting the component in the vertical direction. ) May not be reflected. The present invention has been made paying attention to this point. That is, the component recognition device according to one aspect of the present invention is based on the imaging device that images the component from below and the reflection state of the component side surface in the component image captured by the imaging device. A discriminating device that discriminates the presence or absence of an oblique suction state in which the component is tilted in the vertical direction, and the discriminating device specifies the component bottom surface based on the luminance value of each pixel of the component image. The component side surface is specified based on the luminance value of each pixel around the component bottom surface .

  According to this component recognition apparatus, since the component adsorbed on the transfer head is imaged only from below, the operation of the transfer head is hardly limited by the imaging device. In addition, since the presence or absence of the diagonally attracted state is determined based on the reflected state of the side surface of the component in the component image, it is relatively less affected by the orientation of the component (direction around the vertical axis). Therefore, it is possible to more reliably detect oblique suction without hindering the degree of freedom of operation of the transfer head.

In particular, when an image of a component that is correctly adsorbed to the transfer head is taken from below, the bottom surface of the component is usually bright and the surrounding area (background) is dark. Moreover, when the side surface of a component is reflected, the side surface is slightly darker than the bottom surface of the component. Therefore, according to the configuration in which the component side surface is specified based on the luminance value around the component bottom surface as described above, the component side surface can be appropriately specified from the component image.

What this case, the determination device, said Chi sales of each pixel of the surrounding components bottom, and measuring the area of a large pixel area luminance value than a predetermined threshold, identifying the component side based on the area of the pixel area It may be.

  According to this configuration, it is possible to specify the component side surface with higher accuracy.

  In the case where the imaging device captures an image of the component adsorbed by the transfer head from directly below, the determination device can detect the component when the component side surface is reflected in the component image. Is preferably determined to be in an oblique adsorption state. In the case where the imaging device captures an image of a component adsorbed by the transfer head from obliquely below, the determination device is configured to use a component side surface other than a specific side surface predetermined in the component image. It is preferable to determine that the component is in an obliquely picked-up state when the image is reflected or when the specific side surface is not reflected.

According to these configurations, it is possible to satisfactorily determine whether or not a component is in an obliquely sucked state only by imaging the component sucked by the transfer head only from below.
As another aspect of the present invention, a component recognition device is a component recognition device for recognizing a component sucked by the transfer head, and the component sucked by the transfer head is viewed obliquely from below. Based on the imaging device to be imaged and the reflected state of the component side surface in the component image captured by the imaging device, it is determined whether or not there is an oblique suction state in which the component is tilted vertically with respect to the transfer head. A discriminating device, wherein the discriminating device is configured such that when the part side other than the predetermined specific side is reflected in the part image, or when the specific side is not reflected, It may be determined that the state is an oblique adsorption state.

As described above , regarding the component recognition device that images components from obliquely below, when the imaging device is defined as a second imaging device, the component is separated from the second imaging device prior to the second imaging device. Prior to the imaging of the component by the second imaging device, the first imaging device that images from directly below and the second imaging device so that the component can be imaged in a predetermined orientation. It is preferable to further include an attitude correction device that rotates the component around a vertical axis based on a component image captured by the imaging device.

  According to this configuration, it is possible to always perform imaging of the component by the second imaging device in the correct orientation. Therefore, it becomes possible to specify the component side surface more accurately.

  On the other hand, a component transfer apparatus according to an aspect of the present invention is for recognizing a transfer head that sucks a component and transports it to a target position, and a suction state of the component sucked by the transfer head. A component transfer device including a component recognition device, wherein the component recognition device includes the component recognition device described above.

  A component mounting apparatus according to one aspect of the present invention is a component mounting apparatus having a component transfer apparatus that transports a component from a component supply unit onto a substrate and mounts the component at a predetermined position on the substrate, The component transfer device includes the component transfer device.

  According to these component transfer devices and component mounting devices, it is possible to more reliably detect oblique suction without hindering the degree of freedom of operation of the transfer head. For this reason, it is possible to prevent troubles in conveying parts due to oblique suction.

  As described above, according to the present invention, it is possible to more reliably detect oblique suction of components without hindering the degree of freedom of operation of the transfer head.

1 is a plan view schematically showing a component mounting apparatus according to a first embodiment of the present invention. It is a front view which shows a component mounting apparatus schematically. It is a block diagram which shows the main electrical structures of a component mounting apparatus. It is a flowchart which shows an example of control of component mounting operation | movement. 6 is a flowchart showing detailed control of component imaging / recognition processing (processing in step S7) in FIG. It is the model which shows the state in which components were correctly adsorbed by the mounting head, and the component image in that case. It is a schematic diagram which shows an example of the state by which the components were diagonally adsorbed by the mounting head, and the component image in that case. It is a schematic diagram which shows an example of a component image when components are diagonally adsorbed to the mounting head. It is a top view which shows roughly the component mounting apparatus concerning 2nd Embodiment of this invention. It is a block diagram which shows the main electrical structures of a component mounting apparatus. It is a flowchart which shows an example of control of component mounting operation | movement. It is a flowchart which shows an example of control of component mounting operation | movement. It is a schematic diagram which shows the structure of a 2nd imaging unit. It is a schematic diagram which shows the state by which components were diagonally adsorbed by the mounting head. It is a plane schematic diagram which shows the relationship between a 2nd imaging unit and components. It is a plane schematic diagram which shows the relationship between a 2nd imaging unit and components.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>
1 and 2 schematically show a component mounting apparatus according to a first embodiment of the present invention (a component mounting apparatus to which a component recognition apparatus (component transfer apparatus) according to the present invention is applied). 1 is a plan view, and FIG. 2 is a front view, each showing a component mounting apparatus. In the drawing, XYZ rectangular coordinate axes are shown in order to clarify the directional relationship.

  The component mounting apparatus includes a base 1, a substrate transport mechanism 2 that is disposed on the base 1 and transports a substrate 3 such as a printed wiring board (PWB) in the X direction, a component supply unit 4, 5, a component mounting head unit 6, a head unit driving mechanism for driving the head unit 6, an imaging unit 7 </ b> A for component recognition, and the like.

  The substrate transport mechanism 2 includes a pair of conveyors 2 a and 2 a that transport the substrate 3 on the base 1. These conveyors 2a and 2a receive the board 3 from the right side (-X side) in the figure and transport it to a predetermined mounting work position (position shown in the figure), and the board 3 is mounted by a fixing device (not shown). Position and fix in position. Then, after the mounting operation, the substrate 3 is unloaded to the left side (+ X side) in the figure.

  The component supply units 4 and 5 are disposed on both sides (both sides in the Y direction) of the substrate transport mechanism 2. A plurality of tape feeders 4 a arranged in the X direction along the substrate transport mechanism 2 are disposed in one of the component supply units 4 and 5. Each of these tape feeders 4a includes a reel on which a small piece of chip parts such as an IC, a transistor, and a capacitor are accommodated and wound with a tape, and the vicinity of the substrate transport mechanism 2 while intermittently feeding the tape from the reel. A part is supplied to a predetermined part supply position. On the other hand, trays 5a and 5b are set in the component supply unit 5 on the other side at a predetermined interval in the X direction. Package-type parts such as DIP (Dual Inline Package), QFP (Quad Flat Package), and BGA (Ball Grid Array) are arranged on each tray 5a, 5b so that it can be taken out by the head unit 6 described later. Is placed.

  The head unit 6 takes out components from the component supply units 4 and 5 and mounts them on the substrate 3, and is disposed above the substrate transport mechanism 2 and the component supply units 4 and 5.

  The head unit 6 can be moved in the X and Y directions within a certain area by a head unit driving mechanism. The head unit driving mechanism includes a pair of fixed rails 8 that are respectively fixed to a pair of elevated frames provided on the base 1 and extend parallel to each other in the Y direction, and units that are supported by the fixed rails 8 and extend in the X direction. A support member 11 and a ball screw shaft 9 screwed into the unit support member 11 and driven by a Y-axis servo motor 10 are included. Also, a fixed rail 13 fixed to the unit support member 11 and supporting the head unit 6 so as to be movable in the X direction, and a ball screw that is screwed into the head unit 6 and driven using the X-axis servo motor 15 as a drive source. Shaft 14. That is, the head unit driving mechanism moves the head unit 6 in the X direction via the ball screw shaft 14 by driving the X axis servo motor 15 and also moves the unit via the ball screw shaft 9 by driving the Y axis servo motor 10. The support member 11 is moved in the Y direction, and as a result, the head unit 6 is moved in the X direction and the Y direction.

  The head unit 6 includes a plurality of shaft-like mounting heads 16 (corresponding to the transfer heads of the present invention) each having a component suction nozzle 16 a at the tip, and these mounting heads 16 are connected to the head unit 6. And a head driving mechanism using an actuator such as a servo motor as a drive source that moves up and down (movement in the Z direction) and rotates around the central axis of the nozzle (rotation in the R direction in FIG. 2). The head unit 6 of this example includes a total of six mounting heads 16 (hereinafter abbreviated as heads 16) arranged in a line in the X direction.

  The nozzle 16a of each head 16 can communicate with any of a negative pressure generator, a positive pressure generator, and the atmosphere via an electric switching valve. That is, when a negative pressure is supplied to the nozzle 16a, the component is adsorbed and held by the nozzle 16a, and thereafter, when the positive pressure is supplied, the adsorbing and holding of the component by the head 16 is released.

  The imaging unit 7A corresponds to the imaging device of the present invention. In other words, the component 16 is imaged so as to recognize the suction state of the component taken out from the component supply units 4 and 5 by each head 16. The imaging unit 7A is disposed on the base 1 between the component supply unit 5 and the conveyor 2a and at a position between the trays 5a and 5b in the X direction.

  The imaging unit 7A includes a camera 20 that captures an image of a component adsorbed by each head 16 (nozzle 16a) and an illumination unit 21 that provides illumination for imaging by the camera 20 (see FIG. 3). The camera 20 is arranged in an upward posture so as to take an image of a part from directly below. The illumination unit 21 includes a plurality of LEDs, and is configured to irradiate the component with illumination light from around the component and obliquely below. Thereby, the camera 20 images mainly the bottom surface of the component adsorbed by the head 16. Although not shown, the head 16 is provided with a background plate (back plate) having a low reflection surface that suppresses light reflection, and the background plate makes the background of the component black (darken). ) The accuracy of parts recognition is improved by copying.

  The camera 20 is a so-called line sensor camera having a plurality of image sensors arranged in a row, and is fixed on the base 1 so that the image sensors are arranged in the Y direction. That is, the imaging unit 7A continuously captures the parts adsorbed by each head 16 while the head unit 6 moves non-stop in the X direction above the head unit 6.

  The component mounting apparatus further includes a control device 30 as shown in FIG. 3 for controlling the operation thereof. The control device 30 includes a CPU that executes logical operations, a ROM that stores various programs for controlling the CPU, a RAM that temporarily stores various data, an HDD, and the like. The control device 30 has, as its functional configuration, a main control unit 31 that comprehensively controls the overall operation of the component mounting apparatus, a storage unit 32 that stores various processing programs and various data, a substrate transport mechanism 2, and a head unit. 6, a drive control unit 33 that controls driving of each head 16, a camera control unit 34 and illumination control unit 35 that control the imaging unit 7 </ b> A (camera 20 and illumination unit 21), and an image signal output from the camera 20. And an image processing unit 36 for performing predetermined image processing, and these are connected so that signals can be exchanged with each other.

  The main control unit 31 controls the drive control unit 33, the camera control unit 34, the illumination control unit 35, and the like according to the mounting program stored in the storage unit 32, and also recognizes the image of the component adsorbed on the head 16 and performs the same. Various arithmetic processes are performed. In particular, at the time of component recognition, the head unit 6 and the imaging unit 7A are controlled so as to image the component adsorbed on each head 16, and an oblique adsorption state of a component to be described later is detected based on the acquired component image. By executing the component recognition processing including (determination), the component adsorption state by the head 16 is recognized. That is, in this example, the head unit 6, the head unit drive mechanism, the imaging unit 7A, and the control device 30 correspond to the component transfer device of the present invention, and the imaging unit 7A and the control device 30 correspond to the component recognition device of the present invention. The control device 30 corresponds to the discrimination device of the present invention.

  Next, a series of mounting operations of the component mounting apparatus based on the control of the control device 30 (main control unit 31) will be described.

  FIG. 4 is a flowchart illustrating an example of the control of the component mounting operation by the control device 30. First, the control device 30 controls the substrate transport mechanism 2 to carry the substrate 3 into the mounting work position and position and fix it (step S1). Then, the head unit 6 is moved onto the component supply units 4 and 5, and the components are sequentially attracted to the respective heads 16 (steps S 3 and S 5). Thereafter, prior to mounting the component on the substrate 3, Recognition processing is executed (step S7). This component imaging / recognition process will be described in detail later.

  When the component imaging / recognition process ends, the control device 30 determines whether there is a component failure or a suction failure (step S9), and if NO is determined, moves the head unit 6 onto the substrate 3. The components sucked by the heads 16 are sequentially mounted on the substrate 3 (step S11). On the other hand, if it is determined as YES in step S9, the control device 30 moves the head unit 6 above the component discarding unit (not shown) installed on the base 1 and the components adsorbed to each head 16 Among these, after discarding a component corresponding to a component failure or a suction failure to the component disposal unit (step S17), the process proceeds to step S11, and the remaining components are sequentially mounted.

  When the components attracted by each head 16 are mounted on the substrate 3, the control device 30 determines whether all the required components are mounted on the substrate 3 (step S13). The process proceeds to step S3, and the processes in steps S3 to S13 are repeated. If it is finally determined YES in step S13, the control device 30 releases the fixation of the substrate 3 and drives the substrate transport mechanism 2 to carry out the substrate 3 (step S15). Thereby, a series of component mounting operations on the board 3 is completed.

  FIG. 5 is a flowchart showing the control (subroutine) of component imaging / recognition processing in step S7.

  When the suction of the component by each head 16 is completed (YES in step S5 in FIG. 4), the control device 30 resets the head counter (step S21) and executes the component imaging process (step S23). Specifically, by controlling each head 16, the components are arranged at predetermined imaging height positions, and the head unit 6 is placed above the imaging unit 7A, for example, as indicated by a one-pointed arrow in FIG. It is moved at a constant speed in the X direction (from the + X side to the -X side in the example in the figure). Thereby, the parts adsorbed by each head 16 are continuously imaged.

  When the imaging of all the components is completed by passing the head unit 6 above the imaging unit 7A (YES in step S25), the control device 30 increments the value of the head counter (step S27), and then the counter A recognition process of a component (hereinafter referred to as an n-th component) attracted to the head 16 corresponding to the value is executed (step S29), and it is determined whether the component recognition is successful (step S31). For example, the control device 30 sets in advance among the pixels of the component image based on the image of the n-th component acquired in step S23, that is, an image in which the component and its background are reflected (hereinafter referred to as a component image). The process of recognizing the component is executed based on the brightness value higher (brighter) than the set threshold value T1. Specifically, the bottom surface of the component is specified, the suction state of the component is recognized based on the bottom image of the component, and it is determined whether or not the recognition process has been successful. For example, when the component is not picked up (when a picking error occurs), the area of the pixel region becomes zero. In such a case, the control device 30 causes the area of the pixel region to be small. In step S31, NO is determined as being outside the specified range, and the process proceeds to step S43. In this step S43, it is determined whether or not the component recognition and the success / failure determination of the recognition process have been completed for the suction components of all the heads 16. If not completed, the process proceeds to step S27. As a result, the next part is recognized. Each process of the component recognition (step S29) and the success / failure determination of the recognition process (step S31) is sequentially performed by incrementing the value of the head counter, so if the recognition process is not successful for the Nth component, The component recognition of other components and the success / failure determination of the recognition process have been completed, the process ends in step S43, and the process proceeds to step S9 in FIG.

  In the process of step S29, the positional deviation of the component in the horizontal direction with respect to the head 16 and the positional deviation of the component around the vertical axis (head 16) are mainly recognized.

  On the other hand, if YES is determined in step S31, the control device 30 determines whether or not the nth component is a leaded component such as DIP based on the component data of the component stored in the storage unit 32. Is determined (step S33), and a process of determining whether or not the n-th component is in an oblique suction state is executed based on the luminance value around the component bottom surface specified in step S29 in the component image of the n-th component.

  Specifically, when it is determined NO in step S33, the control device 30 obtains a luminance value over the entire circumference of the bottom surface of the component in the component image of the nth component. More specifically, as shown in FIG. 6, inspection areas A1 to A4 having a predetermined area along each side of the component are set around the bottom image Ia of the component, and the luminance of the pixels in each inspection area A1 to A4 is set. After averaging the values and calculating the average luminance value (step S35), whether the average luminance value of each of the inspection areas A1 to A4 is higher (brighter) than a preset threshold value T2 (threshold value T2 <threshold value T1). Is determined (step S39). The threshold value T2 is set to a value equivalent to the average luminance value of the background image formed by the background plate (back plate).

  And when it determines with NO here, ie, when an average luminance value is more than threshold value T2 in at least one inspection area among inspection areas A1-A4, control device 30 makes the nth part slant. It recognizes that it is in the suction state, stores the value of the head counter at that time (the head 16 to which the n-th component is sucked) (step S41), and shifts the processing to step S43.

  That is, as shown in FIG. 6, when the component is correctly sucked to the head 16 (nozzle 16 a) without being sucked diagonally (without tilting up and down), when the component is imaged from directly below, the bottom image of the component Only a background image appears around Ia. Therefore, the average luminance values of the inspection areas A1 to A4 are all equal to or lower than the threshold value T2. On the other hand, as shown in FIG. 7, when a component is adsorbed obliquely, for example, by foreign matter Fm such as solder being sandwiched between the component and the tip of the nozzle 16a, As shown in FIG. 8, since the side images Ib and Ic are reflected around the bottom image Ia, the average luminance values of the inspection areas A2 and A3 in which the side images Ib and Ic are reflected are high. Therefore, as described above, the average luminance value of each of the inspection areas A1 to A4 around the bottom image Ia is compared with the threshold value T2, that is, the reflection state of the side images Ib and Ic on the component image is examined. This makes it possible to determine whether or not there is an oblique suction state.

  If YES is determined in step S33, the control device 30 sets the inspection area only along the remaining sides of the part bottom image Ia except the sides where the leads are formed. After calculating the average luminance value for each inspection area (step S37), it is determined whether any of the average luminance values in the inspection area is higher (brighter) than the threshold value T2 (step S39). That is, the lead is easy to reflect light, and the brightness value of the image is increased similarly to the bottom image Ia. Therefore, when the nth component is a lead component, the lead image is prevented from being erroneously recognized as the side image Ib. Therefore, the inspection area is set only along the remaining sides excluding the sides where the leads are formed.

  In step S43, the control device 30 determines whether or not the value of the head counter is equal to the number of heads (N), that is, whether or not the determination process of whether or not the suction components of all the heads 16 are in the diagonal suction state has been performed. To do. Here, in the case of NO, the control device 30 shifts the processing to step S27, repeats the processing of steps S27 to S41, and finally ends the diagonal suction state determination processing for the suction components of all the heads 16. If it is determined, the flowchart is ended, and the process proceeds to step S9 in FIG.

  In addition, in the process of step S11 in FIG. 4, the control device 30 corrects the mounting position of the component (for each component mounting position based on the suction state (positional deviation) of the component recognized in the process of step S29. Correction of the X-direction position, Y-direction position, and R-direction position of each head 16 at the time of mounting) is performed. Further, for the head 16 stored in step S41 of FIG. 5, that is, the head 16 that has been determined that the component is in the diagonally sucked state, the control device 30 has caused a suction failure in the process of step S9 of FIG. Is determined. Therefore, the component attracted by the head 16 is discarded by the component disposal unit in the process of step S17 in FIG.

  As described above, according to this component mounting apparatus, the component adsorbed to each head 16 is imaged only from directly below by the imaging unit 7A installed on the base 1, and the component is diagonally adsorbed based on the image. Whether or not there is. Therefore, the operation of the head 16 may be limited by the imaging device as in the conventional device (component mounting device described in Patent Document 1) that determines the presence or absence of the diagonally sucked state by imaging the component from the side. No. In addition, since the presence or absence of the diagonally sucked state is determined based on the detection of the side images Ib and Ic of the component that appear in the component image when the component is imaged from directly below, the orientation of the component (the direction around the vertical axis) ) Not easily affected by. Therefore, according to this component mounting apparatus, it is possible to more reliably detect oblique suction of components without hindering the degree of freedom of operation of the head 16 (head unit 6).

  In this component mounting apparatus, when determining the oblique suction of the component (processing in step S39), the average luminance value of each of the inspection areas A1 to A4 set around the bottom surface image Ia of the component is compared with the threshold value T2. In this case, however, it is preferable to set the value of the threshold value T2 slightly higher than the average luminance value of the background image. That is, the slight slant suction with a relatively small inclination angle with respect to the horizontal plane often has no problem in mounting on the substrate 3. Therefore, if the value of the threshold value T2 is set high within a range in which slight oblique suction that does not hinder the mounting on the substrate 3 is allowed, the frequency of performing the processing of step S17 in FIG. It is possible to improve efficiency and reduce the number of discarded parts.

  Further, since there is a geometrically close relationship between the inclination direction and inclination angle (degree of inclination) in the oblique suction state of the component and the luminance values of the inspection areas A1 to A4, the inclination direction of the component and A correlation between the tilt angle and the luminance values of the inspection areas A1 to A4 is obtained on a trial basis and stored in the storage unit 32. For example, in the process of step S41 in FIG. Based on the brightness value of A4, a specific inclination direction and inclination angle of the component may be specified, and the member may be identified as being obliquely attracted based on the result. According to this configuration, the oblique adsorption can be more accurately identified.

<Second Embodiment>
FIG. 9 is a plan view showing the component mounting apparatus according to the second embodiment, and FIG. 10 is a block diagram showing the main electrical configuration of the component mounting apparatus. Note that the basic configuration of the component mounting apparatus according to the second embodiment is the same as the configuration of the component mounting apparatus of the first embodiment, and therefore the same reference numerals are given to the configurations common to the component mounting apparatus of the first embodiment. Description will be omitted, and differences from the component mounting apparatus of the first embodiment will be mainly described in detail below.

  In the component mounting apparatus according to the second embodiment, the imaging unit 7A (hereinafter referred to as the first imaging unit 7A) that captures an image of the component adsorbed by the head 16 (nozzle 16a) from directly below the first imaging apparatus of the present invention. In addition, a second image pickup unit 7B (corresponding to the second image pickup device of the present invention) for picking up images of components from obliquely below is provided.

  The second image pickup unit 7B picks up an image of the component in order to inspect the coplanarity (flatness) of each lead of the component with lead and determine the presence or absence of the oblique suction state.

  The second imaging unit 7B is disposed adjacent to the first imaging unit 7A (adjacent to the + Y side). Similarly to the imaging unit 7A, the second imaging unit 7B includes a line sensor camera (camera 22) in which a plurality of imaging elements are arranged in a line and an illumination unit 23 (see FIG. 10).

  As shown in FIG. 13, the camera 22 is disposed in a diagonally upward posture at a predetermined elevation angle θ so as to image a component from the diagonally lower side along the X direction. In this example, the camera 22 is arranged on the base 1 at an elevation angle θ = 40 ° from the carry-out side (+ X side) of the substrate 3 toward the carry-in side (−X side). Has been. As a result, the second imaging unit 7B continuously images the components adsorbed by the heads 16 from obliquely below while the head unit 6 moves non-stop in the X direction above the head unit 6.

  In addition to the camera control unit 34, the illumination control unit 35, and the image processing unit 36 corresponding to the first imaging unit 7A (the camera 20 and the illumination unit 21), the control device 30 includes, as shown in FIG. A camera control unit 37, an illumination control unit 38, and an image processing unit 39 corresponding to the imaging unit 7B (camera 22 and illumination unit 23) are provided, and these and the main control unit 31 can exchange signals with each other. It has the structure connected so. At the time of component recognition, the main control unit 31 controls each of the imaging units 7A and 7B so as to capture an image of the component attracted by each head 16, and based on the acquired component image, the component is diagonally attracted. By performing a component recognition process including state detection (discrimination), the component adsorption state by the head 16 is recognized. That is, in this example, the head unit 6, the head unit driving mechanism, the imaging units 7A and 7B, and the control device 30 correspond to the component transfer device of the present invention, and the imaging units 7A and 7B and the control device 30 are the components of the present invention. It corresponds to a recognition device. Further, the head unit driving mechanism and the control device 30 correspond to the posture correction device of the present invention.

  Control of a series of mounting operations by the control device 30 (main control unit 31) of the second embodiment is the same as the control shown in the flowchart except for the component imaging / recognition process in step S7 of the flowchart of FIG. Therefore, the part imaging / recognition process (the process of step S7) according to the second embodiment will be described in detail below.

  FIG. 11 and FIG. 12 are flowcharts showing control of component imaging / recognition processing according to the second embodiment. If the controller 30 determines that the component suction by all the heads 16 of the head unit 6 has been completed (YES in step S5 in FIG. 4), the head counter is reset (step S51), and imaging of the component by the first imaging unit 7A is performed. Processing is executed (steps S53 and S55). Further, after incrementing the value of the head counter (step S57), a recognition process of the component (n-th component) attracted to the head 16 corresponding to the counter value is executed (step S59), and the component recognition is successful. It is determined whether or not (step S61). The processes in steps S51 to S61 and S65 are the same as the processes in steps S21 to S31 and S43 in FIG.

  If YES in step S61, the control device 30 corrects the component suction angle (rotation angle in the R direction in FIG. 2) by 0 ° (posture correction) based on the bottom image of the component specified in step S59. Process) is executed (step S63). Specifically, as shown by the solid line in FIG. 15, when the head 16 is shifted in the rotational direction (R direction), specifically, when the normal of a specific side is shifted from the X direction in plan view The control device 30 rotates the head 16 so that the normal line is parallel to the X direction in plan view (so that it is in the state indicated by the two-dot difference line in FIG. 15).

  Next, it is determined whether or not the value of the head counter is equal to the number of heads (N), that is, whether or not the processing of component recognition and 0 ° correction of the suction angle has been executed for the suction components of all the heads 16 (step). S65). Here, in the case of NO, the control device 30 shifts the process to step S57 and repeats the processes of steps S57 to S65.

  If it is finally determined YES in step S65, the control device 30 resets the head counter (step S67), and then performs component imaging processing by the second imaging unit 7B (step S69). Specifically, as indicated by a one-dot chain arrow in FIG. 1, the head unit 6 that has passed above the first imaging unit 7A is shifted in the Y direction (+ Y side) and then directed to the second imaging unit 7B. By moving the head unit 6 in the reverse direction (from the −X side to the + X side) at a constant speed, the head unit 6 is passed over the second imaging unit 7B. Thereby, the parts adsorbed by each head 16 are continuously imaged.

  When the head unit 6 passes over the second imaging unit 7B and imaging of all components is completed (YES in step S71), the control device 30 increments the value of the head counter (step S73). A recognition process of the component (n-th component) adsorbed on the head 16 corresponding to the counter value is executed (step S75), and it is determined whether the component recognition is successful (step S77). Note that although the imaging data to be processed is based on different imaging units, the processes in steps S73 to S77 and S91 are basically the same as the processes in steps S57 to S61 and S65 (steps S27 to S31 and S43 in FIG. 5). This is the same, and is performed by specifying the bottom surface of the component. However, the threshold value (referred to as threshold value T3) to be compared with the average luminance value when specifying the bottom surface of the component is a state in which the component is correctly attracted to the head 16, as shown in FIG. Is set to a value that allows the bottom surface to be specified based on the average luminance value of the bottom image of the component imaged in a non-existing state.

  If YES is determined in step S77, the control device 30 causes the n-th component to face the camera 22 at the time of component imaging by the camera 22 based on the component data of the component stored in the storage unit 32. After determining whether or not it has a lead on the side surface (step S79), based on the luminance value around the bottom surface of the component identified in step S69 among the component images of the nth component, the nth A process for determining whether or not the component is in an oblique suction state is executed.

  Specifically, when it is determined NO in step S79, for example, as shown by a solid line in FIG. 16, when the n-th component is a component that does not have a lead on the side facing the camera 22, An inspection area (not shown) is set on the side facing the camera 22 in the periphery of the bottom image of the component, and the average luminance value of the pixels in the inspection area is calculated (step S81). It is determined whether or not the threshold value is higher (brighter) than a preset threshold value T4 (threshold value T4 <threshold value T3) (step S83). This threshold value T4 is set to a value slightly higher than the average luminance value of the background image.

  And when it determines with NO here, ie, when the average luminance value of a test | inspection area is below a threshold value, the control apparatus 30 recognizes that the said nth component is a diagonally-suction state, and the head at that time The counter value (the head 16 to which the nth component is sucked) is stored (step S85), and the process proceeds to step S91.

  That is, as shown in FIG. 13, when a component is adsorbed to the head 16 (nozzle 16a) without being adsorbed diagonally, when the component is imaged from obliquely below, the component image is added to the image of the component bottom surface Ca. Thus, the image of the side Cb on the side facing the camera 22 is reflected. Therefore, the average luminance value of the inspection area is higher than the threshold value T4. On the other hand, as shown by the solid line in FIG. 14, when the component is sucked diagonally, specifically, when the component is sucked diagonally so that the opposite camera side (−X side) is lowered, the component Since the amount of reflection on the side surface Cb decreases, the average luminance value in the inspection area is equal to or less than the threshold value T4. Therefore, as described above, the average luminance value of the inspection area set on the side facing the camera 22 in the periphery of the component bottom image is compared with the threshold value T4, that is, the component side surface Cb to the component image. It is possible to determine whether or not there is an oblique adsorption state by examining the reflected state. This is not limited to the case where the component is inclined in the vertical direction only with respect to the line segment parallel to the X direction, as shown by the solid line in FIG. 14, and further in the vertical direction with respect to the line segment parallel to the Y direction. The same applies when tilted.

  In addition, as a state of the diagonal suction of the component, as shown by a two-dot chain line in FIG. 14, the component may be inclined so that the camera side (+ X side) is lowered. As a result, the possibility that the component cannot be recognized in step S75 (NO in step S77) increases. Therefore, in this embodiment, such oblique adsorption is dealt with by the processing in steps S75 and 77.

  On the other hand, if YES is determined in step S79, for example, as shown by a two-dot chain line in FIG. 15, if the n-th component is a component having a lead on the side facing the camera 22, the bottom surface of the component In the periphery of the image Ia, inspection areas (not shown) are set on both outer sides in the Y direction, the average luminance value of the pixels in each inspection area is calculated (step S87), and the average luminance value is set in advance. It is determined whether it is higher (brighter) than the set threshold value T4 (step S89). This threshold value is the same value as the threshold value in step S83.

  If YES is determined in this step, the control device 30 shifts the processing to step S85 and stores the head 16 (the value of the head counter) on which the n-th component is sucked. That is, when the component is adsorbed to the head 16 (nozzle 16a) without being adsorbed diagonally (see FIG. 13), only the side surface Cb on the side facing the bottom surface Ca and the camera 22 is the component image. The other side, that is, the sides on both sides in the Y direction is not reflected. Therefore, as described above, the reflected state of the side surfaces on both sides in the Y direction of the part is detected, that is, as described above, the inspection area set on both outer sides in the Y direction around the bottom image Ia. By comparing the average luminance value and the threshold value, it is possible to determine whether or not there is an oblique suction state.

  Next, the control device 30 determines whether or not the value of the head counter is equal to the number of heads (N), that is, whether or not the determination process of whether or not the suction components of all the heads 16 are in the diagonal suction state has been executed. (Step S91). Here, in the case of NO, the control device 30 shifts the processing to step S73, repeats the processing of steps S73 to S89, and finally completes the diagonal suction state determination processing for all suction components. The flowchart is terminated, and the process proceeds to step S9 in FIG.

  Also in the component mounting apparatus according to the second embodiment as described above, the component picked up by each head 16 is imaged from below (obliquely below) by the second imaging unit 7B installed on the base 1, and the image is displayed on the image. Based on this, the presence / absence of an oblique suction state of the part is determined. Therefore, similarly to the component mounting apparatus of the first embodiment, it is possible to detect the oblique suction of the components without hindering the freedom of operation of the head 16 (head unit 6). In particular, in this component imaging apparatus, when the component is imaged from directly below by the first imaging unit 7A and the orientation of the component is deviated in the rotation direction (R direction) with respect to the head 16, the head 16 is rotated. Since the component is imaged by the second imaging unit 7B after correcting the shift, it is possible to avoid being affected by the orientation of the component. Therefore, as described above, it is possible to satisfactorily detect the diagonal suction of the component while imaging the component from diagonally below by the second imaging unit 7B.

  In the component mounting apparatus of the second embodiment, as described in the description of the first embodiment, when comparing the average luminance value of the inspection area with the threshold T3, the value of the threshold T3 is used as the background image. It is preferable to allow slightly oblique adsorption that does not hinder the mounting on the substrate 3 by setting it slightly higher than the average luminance value. According to this, it is possible to reduce the frequency of performing the process of step S17 of FIG. 4 to improve the efficiency of the mounting work, and to reduce the number of discarded parts.

  Also in the component mounting apparatus of the second embodiment, the correlation between the tilt direction and tilt angle of the component and the luminance value of the inspection area is obtained in advance on a trial basis and stored in the storage unit 32. A specific inclination direction and inclination angle of the component may be specified based on the obtained average luminance value of the inspection area, and the oblique suction may be certified based on the result.

  By the way, the component mounting apparatus of each embodiment mentioned above is illustration of preferable embodiment of the component mounting apparatus to which the component recognition apparatus (component transfer apparatus) which concerns on this invention was applied, Comprising: The specific structure is as follows. Modifications can be made as appropriate without departing from the scope of the present invention.

  For example, in the above-described component mounting apparatus, the average brightness value of the inspection area set around the bottom image of the component is compared with the threshold value, and when the average luminance value of the inspection area exceeds the threshold value, the component mounting apparatus is in an oblique suction state. For example, if the area of a pixel region formed by pixels that exceed a predetermined threshold among the pixels around the bottom image of the component is determined, and the area of the pixel region exceeds the predetermined threshold, the component May be determined to be in an oblique adsorption state. Even with such a configuration, it is possible to appropriately determine the presence or absence of oblique suction.

  Moreover, although the component mounting apparatus was demonstrated in the said embodiment, the component recognition apparatus (component transfer apparatus) which concerns on this invention adsorbs and takes out components from a component supply part with a transfer head, The adsorption state of the components It can also be applied to a so-called component test apparatus in which the image is picked up and recognized by the image pickup unit and then transported to the test unit and various tests such as an energization test are performed in the test unit. If the present invention is applied, also in such a component inspection apparatus, the component sucked by the transfer head is imaged only from below, and the presence or absence of the diagonally sucked state is determined based on the reflection state of the component side surface on the component image. Therefore, as in the case of the component mounting apparatus, it is possible to more accurately determine whether or not the component is in the diagonally sucked state without obstructing the freedom of operation of the transfer head.

6 Head unit 7A, 7B Imaging unit (1st imaging unit, 2nd imaging unit)
16 Mounting head 20, 22 Camera 21, 23 Illumination unit 30 Control device 31 Main control unit 32 Storage unit 33 Drive control unit 34, 37 Camera control unit 35, 38 Illumination control unit 36, 39 Image processing unit

Claims (8)

A component recognition device for recognizing a component adsorbed by a transfer head,
An imaging device for imaging the component from below;
A discriminating device for discriminating whether or not there is an oblique suction state in which the component is tilted in the vertical direction with respect to the transfer head, based on the reflected state of the component side surface in the component image captured by the imaging device. ,
The discriminating device specifies a component bottom surface based on a luminance value of each pixel of the component image, and then specifies the component side surface based on a luminance value of each pixel around the component bottom surface. Recognition device. The component recognition apparatus according to claim 1 ,
The determination device, wherein the Chi the sale of each pixel of the surrounding components bottom, and measuring the area of a large pixel area luminance value than a predetermined threshold, identifying the component side based on the area of the pixel region, it A component recognition device. The component recognition apparatus according to claim 1 or 2 ,
The imaging device captures an image of a component adsorbed by the transfer head from directly below,
The said discrimination | determination apparatus discriminate | determines that the said component is a diagonal adsorption | suction state, when the said component side surface is reflected in the said component image, The component recognition apparatus characterized by the above-mentioned. The component recognition apparatus according to claim 1 or 2 ,
The imaging device captures an image of a component adsorbed by the transfer head from obliquely below,
The discriminating device discriminates that the component is in an oblique suction state when a component side other than the predetermined specific side is reflected in the component image or when the specific side is not reflected. A component recognition apparatus characterized by the above. A component recognition device for recognizing a component adsorbed by a transfer head,
An imaging device for imaging the component adsorbed by the transfer head from obliquely below;
A discriminating device for discriminating whether or not there is an oblique suction state in which the component is tilted in the vertical direction with respect to the transfer head, based on the reflected state of the component side surface in the component image captured by the imaging device. ,
The discriminating device discriminates that the component is in an oblique suction state when a component side other than the predetermined specific side is reflected in the component image or when the specific side is not reflected. A component recognition apparatus characterized by the above. In the component recognition apparatus according to claim 4 or 5,
When the imaging device is defined as a second imaging device, separately from the second imaging device, a first imaging device that images the component from directly under the second imaging device;
Prior to imaging of the component by the second imaging device, based on the component image captured by the first imaging device, the imaging of the component by the second imaging device can be performed in a predetermined orientation. An apparatus for recognizing a part, further comprising: an attitude correction device that rotates the part around a vertical axis. A component transfer device comprising: a transfer head that picks up a component and conveys it to a target position; and a component recognition device for recognizing the suction state of the component sucked by the transfer head,
A component transfer device comprising the component recognition device according to claim 1 as the component recognition device. A component mounting device having a component transfer device that transports a component from a component supply unit onto a substrate and mounts the component at a predetermined position on the substrate,
A component mounting apparatus comprising the component transfer apparatus according to claim 7 as the component transfer apparatus.

Images