JP6233973B2 - Metal-ceramic circuit board manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a metal-ceramic circuit board in which a metal circuit board is bonded to one surface of a ceramic substrate, and in particular, to a part on a metal circuit board where soldering of chip parts or terminals is necessary. The present invention relates to a method for producing a metal-ceramic circuit board plated with a metal.

  Conventionally, a power module is used to control a large electric power of an electric vehicle, a train, a machine tool, and the like. As an insulating substrate for such a power module, a metal-ceramic in which a chip component on a metal circuit board bonded to one surface of a ceramic substrate or a portion where terminals need to be soldered is partially plated A circuit board is used.

  As a method of manufacturing such a metal-ceramic circuit board, a circuit pattern forming resist having a circuit pattern shape is printed on a metal plate bonded to the ceramic substrate, and unnecessary portions of the metal plate are removed by etching to form a circuit pattern. After removing the resist for forming the circuit pattern, printing the partial plating resist on a portion other than the predetermined portion such as the portion that needs to be soldered on the circuit pattern, and plating the predetermined portion, and then applying the partial plating resist. After peeling or removing the circuit pattern forming resist, plating is performed on the entire surface of the circuit pattern, and a partial plating resist is printed on a predetermined portion of the plating to remove unnecessary portions of the plating by etching. A method of peeling off the partial plating resist later is known (for example, see Patent Document 1).

  However, in the method of Patent Document 1, the resist for circuit pattern formation is peeled off, and after the resist for partial plating is printed, the resist for partial plating is peeled off. The manufacturing time of the metal-ceramic circuit board becomes longer and the manufacturing cost becomes higher.

  In order to eliminate such problems, the circuit forming metal plate bonded to the ceramic substrate is pressed against a masking member provided with a window portion at a predetermined portion, while the predetermined portion of the circuit forming metal plate is pressed through the window portion. There has been proposed a method in which a plating solution is sprayed onto a portion and plating is partially performed by a sparger method (high-pressure jet method) (see, for example, Patent Document 2).

JP 2003-31720 A (paragraph number 0013-0034) Japanese Patent Laying-Open No. 2004-6604 (paragraph numbers 0013-0038)

  In the method of Patent Document 2, since there is no step of printing and removing the resist for partial plating, the manufacturing time can be shortened. However, since it is necessary to produce a masking member having a predetermined shape, the manufacturing cost can be reduced. When manufacturing metal-ceramic circuit boards in which the size and shape of the portions that need to be plated are not sufficient, it is necessary to re-create the masking member. Also, when the surface of the circuit-forming metal plate bonded to the ceramic substrate is warped in a concave or convex shape, the masking member cannot be brought into close contact with the surface of the circuit-forming metal plate. The plating protrudes, the accuracy of the plating pattern is deteriorated, and pinholes are easily formed at the corners of the circuit forming metal plate.

  Therefore, in view of such a conventional problem, the present invention can accurately apply plating to a predetermined portion on a metal plate bonded to a ceramic substrate and reduce the manufacturing cost. It aims at providing the manufacturing method of a ceramic circuit board.

  As a result of diligent research to solve the above problems, the present inventors formed a first resist so as to cover substantially the entire surface of the metal plate bonded to the ceramic substrate, and formed a predetermined portion of the first resist. After removing and exposing a part of the metal plate, and forming a plating film on the exposed part of the metal plate, a second resist is formed so as to cover the plating film, and a predetermined portion of the first resist On the metal plate bonded to the ceramic substrate by removing the first and second resists after removing the exposed portion of the metal plate by etching treatment. The present invention has been found to provide a method for producing a metal-ceramic circuit board capable of accurately plating a predetermined portion of the metal and reducing the production cost. This has led to the.

  That is, according to the metal-ceramic circuit board manufacturing method of the present invention, the first resist is formed so as to cover substantially the entire surface of the metal plate bonded to the ceramic substrate, and a predetermined portion of the first resist is removed. After exposing a part of the metal plate and forming a plating film on the exposed part of the metal plate, a second resist is formed so as to cover the plating film, and a predetermined part of the first resist is removed. Then, a part of the metal plate is exposed, and the exposed part of the metal plate is removed by etching, and then the first and second resists are peeled off.

  In this metal-ceramic circuit board manufacturing method, the first and second resists are preferably electrodeposition resists, and the first resist is preferably removed by laser processing. The plating is preferably performed by dipping in a plating solution. The metal plate is preferably made of aluminum or an aluminum alloy.

  The metal plate and the ceramic substrate are preferably joined by forming a metal plate by bringing the molten metal into contact with one surface of the ceramic substrate and then cooling and solidifying it. In this case, when the molten metal is brought into contact with one surface of the ceramic substrate, the molten metal is brought into contact with the other surface of the ceramic substrate, and is cooled and solidified to form a metal member to form the other surface of the ceramic substrate. You may join to. Moreover, it is preferable that a metal member consists of the same aluminum or aluminum alloy as a metal plate. Further, plate-like or columnar fins may be formed on the surface of the metal member opposite to the ceramic substrate. Furthermore, the plating film is preferably formed by electroplating or electroless plating, and is preferably made of Ni, Ni alloy, Au or Ag.

  According to the present invention, it is possible to provide a method for manufacturing a metal-ceramic circuit board capable of accurately plating a predetermined portion on a metal plate bonded to a ceramic substrate and reducing the manufacturing cost. Can do.

In embodiment of the manufacturing method of the metal-ceramics circuit board by this invention, it is sectional drawing which shows the process of joining the metal plate for circuits to one surface of a ceramic substrate, and joining the metal plate for bases to the other surface. . It is sectional drawing explaining the process of forming a resist on the substantially whole surface of the metal plate for circuits and the metal plate for bases in embodiment of the manufacturing method of the metal-ceramics circuit board by this invention. It is sectional drawing explaining the process of removing the predetermined part of the resist on the metal plate for circuits in embodiment of the manufacturing method of the metal-ceramics circuit board by this invention. In embodiment of the manufacturing method of the metal-ceramics circuit board by this invention, it is sectional drawing explaining the process of forming a plating film in the part which removed the resist on the metal plate for circuits. It is sectional drawing explaining the process of forming a resist so that a plating film may be covered in the manufacturing method of the metal-ceramics circuit board by this invention. It is sectional drawing explaining the process of removing the predetermined part of the resist on the metal plate for circuits and the metal plate for bases in embodiment of the manufacturing method of the metal-ceramics circuit board by this invention. In the embodiment of the method for manufacturing a metal-ceramic circuit board according to the present invention, a step of forming a metal circuit board and a metal base board by removing unnecessary portions of the circuit metal board and the base metal board by etching treatment will be described. FIG. It is sectional drawing explaining the process of removing the resist on a metal circuit board and a metal base board in embodiment of the manufacturing method of the metal-ceramics circuit board by this invention. It is a figure which shows the back surface of the metal-ceramics circuit board manufactured by the modification of embodiment of the manufacturing method of the metal-ceramics circuit board by this invention. It is a figure which shows the back surface of the metal-ceramics circuit board manufactured by the other modification of embodiment of the manufacturing method of the metal-ceramics circuit board by this invention.

  Embodiments of a method for producing a metal-ceramic circuit board according to the present invention will be described below with reference to the accompanying drawings.

  First, as shown in FIG. 1A, a metal-ceramic bonding substrate in which a circuit metal plate 12 is bonded to one surface of a ceramic substrate 10 is manufactured. In this metal-ceramic bonding substrate, a metal plate for circuit 12 is formed by bringing a molten metal into contact with one surface of the ceramic substrate 10 in a mold and cooling to solidify (so-called molten metal bonding method), thereby forming the ceramic substrate 10. It can manufacture by joining to one side of. Further, a metal-ceramic bonding substrate in which the base metal plate 14 is bonded to the other surface of the ceramic substrate 10 may be manufactured. In this metal-ceramic bonding substrate, when the molten metal is brought into contact with one surface of the ceramic substrate 10, the molten metal is brought into contact with the other surface of the ceramic substrate 10, and is cooled and solidified. And can be manufactured by bonding to the other surface of the ceramic substrate 10. In these cases, the molten metal is preferably a molten aluminum or aluminum alloy. Alternatively, instead of the so-called molten metal joining method, the circuit metal plate 12 made of copper, copper alloy, aluminum or aluminum alloy may be joined directly or via a brazing material to one surface of the ceramic substrate 10. The base metal plate 14 made of copper, copper alloy, aluminum or aluminum alloy may be joined to the surface directly or via a brazing material.

  Next, as shown in FIG. 1B, a (first) resist 16 is formed so as to cover substantially the entire surfaces of the circuit metal plate 12 and the base metal plate 16 (surfaces opposite to the ceramic substrate 10 respectively). To do. The resist 16 is preferably an electrodeposition resist. The electrodeposition resist formed by electrodeposition can have a substantially uniform thickness even if the surfaces of the circuit metal plate 12 and the base metal plate 14 are uneven. The resist 16 can be formed by a spray method (spraying method), a dip method (immersion method), or the like. However, the spray method has a large loss of resist ink, and the back surface of the base metal plate 14 (the ceramic substrate 10). In the case where a large number of fins are formed at a narrow pitch on the opposite surface, the resist 16 having a substantially uniform thickness cannot be formed by the spray method or the dip method. In the dip method, since it takes time to discharge the resist ink, the pulling speed from the resist ink is slowed, and the productivity is deteriorated.

  Next, as shown in FIG. 1C, a predetermined portion (a portion to be plated) of the resist 16 formed on the surface of the circuit metal plate 12 is removed to form a partial plating resist. The removal of the resist 16 is preferably performed by laser processing for irradiating a predetermined portion of the resist 16 with laser.

  Next, as shown in FIG. 1D, a plating film 18 made of Ni, Ni alloy, Au, Ag, or the like is formed on the surface of the circuit metal plate 12 where the resist 16 has been removed. The plating film 18 is preferably formed by immersing the circuit metal plate 12 in a plating solution, and may be either electroplating or electroless plating. By forming the plating film 18 in this way, it is not necessary to produce a masking member every time the shape is different as in the case of performing partial plating by a sparger method (high pressure jet jet method), thereby reducing the manufacturing cost. be able to. Moreover, even if the surface of the circuit metal plate 12 bonded to the ceramic substrate 10 is warped in a concave or convex shape, the plating film 18 can be accurately formed by suppressing the plating from protruding from the portion that needs to be plated. Can do.

  Next, as shown in FIG. 1E, a (second) resist 16 is formed so as to cover the plating film 18. The resist 16 is preferably an electrodeposition resist. In the case of an electrodeposition resist, the thickness of the (second) resist 16 covering the plating film 18 is made the same as that of the (first) resist 16 in other portions, and the surface of the circuit metal plate 12 is plated. The portion where the film 18 is not formed and the portion where the film 18 is formed can be formed in a substantially uniform thickness, and it is easy to peel off the resist 16 later. By forming the (second) resist 16 in this way, substantially the entire surfaces of the circuit metal plate 12 and the plating film 18 are covered with the (first and second) resists 16.

  Next, as shown in FIG. 1F, a predetermined portion of the resist 16 formed on the surfaces of the circuit metal plate 12 and the base metal plate 14 (corresponding to an unnecessary portion of the circuit metal plate 12 and the base metal plate 14). A portion to be removed) to form a circuit pattern forming resist and a metal base plate forming resist. The removal of the resist 16 is preferably performed by laser processing.

  Next, as shown in FIG. 1G, an unnecessary portion of the circuit metal plate 12 is removed by etching with an etchant such as a ferric chloride solution to form a metal circuit plate 12 having a desired circuit pattern. At the same time, unnecessary portions of the base metal plate 14 are removed to form the metal base plate 14.

  Next, as shown in FIG. 1H, the metal circuit board 12 having a desired circuit pattern is bonded to one surface of the ceramic substrate 10 by peeling off the (first and second) resists 16 and the other. A metal-ceramic circuit board having the metal base plate 14 bonded to the surface is obtained. Since the resist 16 is peeled only once, the manufacturing time and cost of the metal-ceramic circuit board can be reduced, and the metal plate 12 can reduce the adhesion of the plating due to the resist 16 stripping solution. 14 and the ceramic substrate 10 can be prevented from being damaged.

  Further, as shown in FIG. 2, it protrudes in a substantially vertical direction from the back surface (surface opposite to the ceramic substrate 10) of the flat metal base plate 14, and is spaced apart from each other at a predetermined interval so as to extend substantially in parallel. A metal base plate with a plate fin in which a plurality of plate-like heat radiating fins 14a are formed integrally with the metal base plate 14 may be joined to the ceramic substrate 10 or from the back surface of the plate-like metal base plate 14 in a substantially vertical direction. A metal base plate with pin fins, in which a large number of columnar (pin-shaped) radiating fins 14b are integrally formed with the metal base plate 14 so as to be spaced apart from each other at a predetermined interval, is joined to the ceramic substrate 10. May be.

  Examples of the method for producing a metal-ceramic circuit board according to the present invention will be described in detail below.

[Example 1]
The ceramic substrate is placed in a mold in which a cavity for accommodating the ceramic substrate is formed and a cavity having a shape corresponding to the base metal plate and the circuit metal plate is formed on both sides of the cavity. After injecting molten aluminum, it is cooled and solidified to form a flat plate of 90 mm × 40 mm × 0.6 mm on one surface of a ceramic substrate made of aluminum nitride of 100 mm × 50 mm × 0.6 mm. An integrated metal / ceramic bonding substrate in which a flat circuit metal plate having a size of 90 mm × 40 mm × 0.8 mm was directly bonded to the other surface was prepared. In this metal-ceramic bonding substrate, the circuit metal plate side warped in a concave shape.

  The metal-ceramic bonding substrate is dipped in an electrodeposition photoresist solution in an electrodeposition bath, electrodes are attached to the circuit metal plate and the base metal plate, and a voltage of 120 V is applied, so that the circuit metal plate and the base are applied. An electrodeposition resist film is formed so as to cover substantially the entire surface of the metal plate (the surface opposite to the ceramic substrate), dried at 80 ° C. for 30 minutes, and then exposed to UV light and cured to obtain a thickness. A (first) electrodeposition resist having a thickness of 40 μm was formed.

  Next, after irradiating a laser to a substantially rectangular portion having a size of 15 mm × 15 mm of the resist formed on the surface of the circuit metal plate to remove the resist of the portion and exposing the circuit metal plate, A 6 μm thick Ni plating film was formed on the exposed portion of the circuit metal plate by electroplating by dipping in a Ni plating solution comprising a Watt bath.

  Next, a (second) electrodeposition resist having a thickness of 40 μm was formed so as to cover the plating film by the same method as the above (first) electrodeposition resist formation method.

  Next, the resist formed on the surface of the circuit metal plate has a substantially rectangular shape with a size of 85 mm × 35 mm surrounding the plating film, and the resist on the surface of the base metal plate has a substantially rectangular shape with a size of 85 mm × 35 mm. In this way, by irradiating the unnecessary portion of the resist with a laser, the unnecessary portion of the resist is removed to expose the circuit metal plate and the base metal plate, and then etching is performed with a ferric chloride solution. As a result, an unnecessary portion of the circuit metal plate is removed to form a metal circuit plate having a desired circuit pattern, and an unnecessary portion of the base metal plate is removed to form a metal base plate. The resist is stripped off using a resist stripping solution as a component, and a metal circuit board with a desired circuit pattern is directly bonded to one side of the ceramic substrate and flat on the other side. A metal-ceramic circuit board in which a plate-like metal base plate was directly bonded was produced.

  With respect to the metal-ceramic circuit board thus produced, the amount of protrusion of the plating film (the length of the portion protruding from the portion requiring plating) was measured with a factory microscope to evaluate the accuracy of the plating pattern, and the pin was visually checked. When the resistance of the resist was evaluated by observing the presence or absence of holes, the protruding amount of the plating film was as small as 0.01 to 0.03 mm, and the accuracy of the plating pattern was good. There was no pinhole, and the resistance of the resist was good.

[Example 2]
Example 1 using the same metal-ceramic bonding substrate as Example 1 except that the size of the circuit metal plate is 90 mm × 40 mm × 0.4 mm and the circuit metal plate side is warped convexly. Using the same method as above, a metal-ceramic circuit board was prepared, the amount of protrusion of the plating film was measured to evaluate the accuracy of the plating pattern, and the resistance of the resist was evaluated by the presence or absence of pinholes. The amount of protrusion was as small as 0.01 to 0.03 mm, the accuracy of the plating pattern was good, there were no pinholes in the metal circuit board and the metal base board, and the resist resistance was good.

[Example 3]
Instead of the flat metal base plate, it protrudes from the back surface (surface opposite to the ceramic substrate) of the flat metal base plate having a size of 150 mm × 60 mm × 4 mm in a substantially vertical direction and is spaced apart by 2 mm from each other. Then, a metal base plate with plate fins, in which six plate-like heat radiation fins of length 90 mm × width 5 mm × height 15 mm are formed integrally with the metal base plate so as to extend substantially in parallel to the ceramic substrate, A metal-ceramic circuit board similar to that of Example 1 was prepared except that the metal circuit board was bonded and warped in a convex shape, and the amount of protrusion of the plating film was measured by the same method as in Example 1. When the accuracy of the plating pattern was evaluated and the resistance of the resist was evaluated based on the presence or absence of pinholes, the protruding amount of the plating film was as small as 0.01 to 0.03 mm. Accuracy is good, no pinholes in the metal circuit plate and the metal base plate, resistance of the resist was good.

[Example 4]
Instead of the flat metal base plate, it protrudes from the back surface (surface opposite to the ceramic substrate) of the flat metal base plate having a size of 150 mm × 60 mm × 4 mm in a substantially vertical direction and is spaced apart by 2 mm from each other. A metal base plate with pin fins, in which 160 pin-shaped radiating fins each having a diameter of 2.5 mm and a height of 8 mm are formed integrally with the metal base plate so as to be disposed, is joined to the ceramic substrate. A metal-ceramic circuit board similar to that in Example 1 was prepared except that the plate was warped in a convex shape, and the amount of protrusion of the plating film was measured by the same method as in Example 1 to increase the accuracy of the plating pattern. When the resistance of the resist was evaluated by evaluating the presence or absence of pinholes, the protruding amount of the plating film was as small as 0.01 to 0.03 mm, and the accuracy of the plating pattern was A good, no pinholes in the metal circuit plate and the metal base plate, resistance of the resist was good.

[Example 5]
After forming the Ni plating film, it was immersed in the Au plating solution, and the same as in Example 1 except that the Au plating film was formed on the Ni plating film (so that the total thickness of the plating film was 6 μm). The metal-ceramic circuit board was prepared by the method, the amount of protrusion of the plating film was measured to evaluate the accuracy of the plating pattern, and the resistance of the resist was evaluated by the presence or absence of pinholes. The amount of protrusion of the plating film was The accuracy of the plating pattern was good, as small as 0.01 to 0.03 mm, the metal circuit board and the metal base board had no pinholes, and the resist had good resistance.

[Example 6]
After forming the Ni plating film, it was immersed in an Ag plating solution, and the same as in Example 1 except that the Ag plating film was formed on the Ni plating film (so that the total thickness of the plating film was 6 μm). The metal-ceramic circuit board was prepared by the method, the amount of protrusion of the plating film was measured to evaluate the accuracy of the plating pattern, and the resistance of the resist was evaluated by the presence or absence of pinholes. The amount of protrusion of the plating film was The accuracy of the plating pattern was good, as small as 0.01 to 0.03 mm, the metal circuit board and the metal base board had no pinholes, and the resist had good resistance.

[Example 7]
A metal-ceramic circuit board was produced in the same manner as in Example 1 except that the plating film was formed by electroless Ni-P plating instead of electroplating, and the plating pattern was measured by measuring the amount of protrusion of the plating film. The resistance of the resist was evaluated by the presence or absence of the occurrence of pinholes. The protruding amount of the plating film was as small as 0.01 to 0.03 mm, the accuracy of the plating pattern was good, and the metal circuit board There was no pinhole in the metal base plate, and the resistance of the resist was good.

[Comparative Example 1]
For a metal / ceramic bonding substrate manufactured by the same method as in Example 1 (the circuit metal plate side warped in a concave shape), the circuit metal plate was pressed against a masking member provided with an opening of 15 mm × 15 mm. However, a plating solution comprising a Watt bath was sprayed onto the circuit metal plate through the opening, and a Ni plating film having a thickness of 6 μm was formed on the circuit metal plate by a sparger method (high pressure jet jet method).

  Next, a resist was applied by spray coating so as to cover substantially the entire surfaces of the circuit metal plate and the base metal plate (surfaces opposite to the ceramic substrate, respectively).

  Next, the resist formed on the surface of the circuit metal plate has a substantially rectangular shape with a size of 85 mm × 35 mm, and the resist on the surface of the metal plate for base has a substantially rectangular shape with a size of 85 mm × 35 mm. By irradiating the unnecessary part of the resist with laser, the resist of the unnecessary part is removed to expose the circuit metal plate and the base metal plate, and then the etching process is performed with a ferric chloride solution. A metal circuit board having a desired circuit pattern is formed by removing an unnecessary portion of the metal plate for use, and a metal base plate is formed by removing an unnecessary portion of the metal plate for the base. It peeled.

  In this way, a metal-ceramic circuit board in which a metal circuit board having a desired circuit pattern is directly bonded to one surface of the ceramic substrate and a flat metal base plate is directly bonded to the other surface is produced. In the same manner as above, the amount of protrusion of the plating film was measured to evaluate the accuracy of the plating pattern, and the resistance of the resist was evaluated based on the presence or absence of pinholes. As a result, the masking member cannot be brought into close contact with the surface of the metal circuit board, the protruding amount of the plating film is as large as 0.2 mm, the accuracy of the plating pattern is poor, and pinholes are formed at the corners of the metal circuit board. The resistance of the resist was not good.

[Comparative Example 2]
A metal-ceramic circuit board was produced by the same method as in Comparative Example 1 using a metal-ceramic bonding board produced by the same method as in Example 2 (the metal plate side for the circuit was warped in a convex shape). By the same method as in Example 1, the amount of protrusion of the plating film was measured to evaluate the accuracy of the plating pattern, and the resistance of the resist was evaluated based on whether or not pinholes were generated. As a result, the protruding amount of the plating film was as large as 0.1 mm, the accuracy of the plating pattern was not good, pinholes were formed at the corners of the metal circuit board and the metal base board, and the resistance of the resist was not good.

[Comparative Example 3]
Instead of the flat metal base plate, it protrudes from the back surface (surface opposite to the ceramic substrate) of the flat metal base plate having a size of 150 mm × 60 mm × 4 mm in a substantially vertical direction and is spaced apart by 2 mm from each other. Then, a metal base plate with plate fins, in which six plate-like heat radiation fins of length 90 mm × width 5 mm × height 15 mm are formed integrally with the metal base plate so as to extend substantially in parallel to the ceramic substrate, A metal-ceramic circuit board similar to that of Comparative Example 1 was prepared except that the metal circuit board side was warped in a convex shape, and the amount of protrusion of the plating film was measured by the same method as in Example 1 to perform plating. The accuracy of the pattern was evaluated, and the resistance of the resist was evaluated based on the presence or absence of pinholes. As a result, the protruding amount of the plating film was as large as 0.1 mm, the accuracy of the plating pattern was not good, pinholes were formed in the corners of the metal circuit board and the side surfaces of the radiation fins, and the resist resistance was not good. .

[Comparative Example 4]
Instead of the flat metal base plate, it protrudes from the back surface (surface opposite to the ceramic substrate) of the flat metal base plate having a size of 150 mm × 60 mm × 4 mm in a substantially vertical direction and is spaced apart by 2 mm from each other. A metal base plate with pin fins, in which 160 pin-shaped radiating fins each having a diameter of 2.5 mm and a height of 8 mm are formed integrally with the metal base plate so as to be disposed, is joined to the ceramic substrate. A metal-ceramic circuit board similar to Comparative Example 1 was prepared except that the plate side was warped, and the amount of protrusion of the plating film was measured by the same method as in Example 1 to evaluate the accuracy of the plating pattern. The resistance of the resist was evaluated based on the presence or absence of pinholes. As a result, the protruding amount of the plating film was as large as 0.1 mm, the accuracy of the plating pattern was not good, pinholes were formed in the corners of the metal circuit board and the side surfaces of the radiation fins, and the resist resistance was not good. .

10 Ceramic substrate 12 Metal plate for circuit (metal circuit plate)
14 Metal plate for base (metal base plate)
14a Plate-shaped radiating fin 14b Columnar (pin-shaped) radiating fin 16 Resist 18 Plating

Claims (11)

A first resist is formed so as to cover substantially the entire surface of the metal plate bonded to the ceramic substrate, a predetermined portion of the first resist is removed to expose a part of the metal plate, and the metal plate is exposed. After forming a plating film on the part, a second resist is formed so as to cover the plating film, a predetermined part of the first resist is removed to expose a part of the metal plate, and the metal plate is exposed. A method for producing a metal-ceramic circuit board, wherein the first and second resists are removed after removing the portion by etching. The method for producing a metal-ceramic circuit board according to claim 1, wherein the first and second resists are electrodeposition resists. The method for producing a metal-ceramic circuit board according to claim 1 or 2, wherein the removal of the first resist is performed by laser processing. The method for producing a metal-ceramic circuit board according to any one of claims 1 to 3, wherein the plating is performed by dipping in a plating solution. The method for producing a metal-ceramic circuit board according to any one of claims 1 to 4, wherein the metal plate is made of aluminum or an aluminum alloy. The metal plate and the ceramic substrate are joined by forming a metal plate by bringing a molten metal into contact with one surface of the ceramic substrate and then cooling and solidifying the metal plate. A method for producing a metal-ceramic circuit board according to any one of 1 to 5. When the molten metal is brought into contact with one surface of the ceramic substrate, the molten metal is brought into contact with the other surface of the ceramic substrate, and is cooled and solidified to form a metal member to form the other surface of the ceramic substrate. The method for manufacturing a metal-ceramic circuit board according to claim 6, wherein the metal-ceramic circuit board is bonded to the surface. The method for manufacturing a metal-ceramic circuit board according to claim 7, wherein the metal member is made of the same aluminum or aluminum alloy as the metal plate. The method for producing a metal-ceramic circuit board according to claim 7 or 8, wherein a plate-like or columnar fin is formed on a surface of the metal member opposite to the ceramic substrate. The method for producing a metal-ceramic circuit board according to claim 1, wherein the plating film is formed by electroplating or electroless plating. 11. The method for producing a metal-ceramic circuit board according to claim 1, wherein the plating film is made of Ni, Ni alloy, Au, or Ag.

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