JP6368407B2 - Chip peeling apparatus and chip peeling method - Google Patents

Description

  The present invention relates to a chip peeling apparatus and a chip peeling method.

Patent Document 1 describes a chip peeling device. This chip peeling apparatus includes a sheet support attached to the periphery of a semiconductor chip and a side having the semiconductor chip with respect to the sheet as a front side, and a side without the semiconductor chip as a front side. When the back side is used, it has a suction collet arranged on the front side with respect to the semiconductor chip, a collet advance / retreat mechanism for moving the suction collet back and forth with respect to the semiconductor chip, and a needle arranged on the back side with respect to the semiconductor chip , A needle advancement / retraction mechanism for moving the needle forward / backward with respect to the semiconductor chip, and a holder for housing the needle, which is disposed on the back side of the semiconductor chip, and an opening through which the needle can pass is formed on the surface facing the semiconductor chip A holder advancing / retracting mechanism for moving the holder back and forth with respect to the semiconductor chip.
The collet advance / retreat mechanism, the needle advance / retreat mechanism, and the holder advance / retreat mechanism sandwich the semiconductor chip between the suction collet and the holder while the needle is housed in the holder, and then move the holder away from the semiconductor chip while maintaining the position of the needle.

Utility Model Registration No. 3187638

Here, in general, in the chip peeling apparatus, when the semiconductor chip is peeled from the sheet, the back surface of the semiconductor chip is pushed up or received by a thin needle at the tip, so that an impact force may be applied to the semiconductor chip and may be damaged. .
An object of the present invention is to provide a chip peeling apparatus and a chip peeling method capable of suppressing the impact force applied to a semiconductor chip and reducing the possibility of damage to the semiconductor chip.

A chip peeling apparatus according to the first invention that meets the above-mentioned object is an adsorption collet that adsorbs a semiconductor chip attached to a sheet;
An adsorption collet advance / retreat mechanism for advancing and retracting the adsorption collet;
A holder provided with a suction hole for sucking the sheet around the recess, in which a recess larger than the semiconductor chip as viewed from the tip surface side is formed on the tip surface that sucks the sheet ;
A holder advancing and retracting mechanism for advancing and retracting the holder;
A needle that is housed in the holder and pushes out the semiconductor chip attached to the sheet;
And a needle reciprocating mechanism for advancing and retracting the needle,
The needle reciprocating mechanism, the needle have a pusher member buffer portion suppresses a shock given to the semiconductor chip,
The holder advancing / retreating mechanism has a holder buffer portion for suppressing an impact of the holder on the semiconductor chip;
The suction collet advancing / retreating mechanism has a suction collet buffering part that suppresses an impact of the suction collet on the semiconductor chip .

In the chip peeling apparatus according to the first invention,
A control unit for controlling the suction collet advance / retreat mechanism, the holder advance / retreat mechanism, and the needle advance / retreat mechanism;
Retracting the control section, the suction collet into contact with the semiconductor chip, and the flexures no step said said sheet towards the inside of the recess above, a step of causing contact the needle to the seat deflected, the holder And extruding the semiconductor chip from the sheet with the needle .

A chip peeling method according to a second invention that meets the above object is a chip peeling method using the chip peeling apparatus according to the first invention,
I said I flexures the sheet towards the inside of the recess the by contacting the semiconductor chip to the suction collet is brought into contact with the needle to the seat deflected, extruding the semiconductor chip from the sheet with the needle, The semiconductor chip is peeled off.

A chip peeling method according to a third invention that meets the above-mentioned object is a chip peeling method using the chip peeling device according to the first invention,
The contact adsorption collet on the semiconductor chip, and the flexures no step the sheet toward the inside of the recess above,
And a step in which the needle is in contact with wrinkles do it the seat,
The holder which adsorbs the sheet in a state in which the needle is stationary is retracted, the needle extruding said semiconductor chip from the sheet, including the steps of the semiconductor chip is peeled.

A chip peeling apparatus according to a fourth invention that meets the above-mentioned object is an adsorption collet that adsorbs a semiconductor chip attached to a sheet;
An adsorption collet advance / retreat mechanism for advancing and retracting the adsorption collet;
A holder provided with a suction hole for sucking the sheet around the recess, in which a recess larger than the semiconductor chip as viewed from the tip surface side is formed on the tip surface that sucks the sheet ;
A holder advancing and retracting mechanism for advancing and retracting the holder;
A needle that is housed in the holder and pushes out the semiconductor chip attached to the sheet;
And a needle reciprocating mechanism for advancing and retracting the needle.

  ADVANTAGE OF THE INVENTION According to this invention, the chip | tip peeling apparatus and chip | tip peeling method which can suppress the impact force given to a semiconductor chip and can reduce the possibility that a semiconductor chip will be damaged can be provided.

It is explanatory drawing which showed typically the structure of the chip | tip peeling apparatus which concerns on the 1st Embodiment of this invention. It is a graph which shows the position command of a suction collet, a holder, and a needle which a control part with which the chip exfoliation device is provided. (A)-(E) is explanatory drawing which shows the operation | movement in which the chip | tip peeling apparatus peels a semiconductor chip. (A) and (B) are graphs showing a waveform of an impact force applied to a semiconductor chip when the chip peeling apparatus repeats the operation of peeling the semiconductor chip a plurality of times, each having a recess formed in the holder. It is a graph which shows the impact force in the case where it is not formed and the case where it is formed. (A)-(E) are explanatory drawings which show the operation | movement which the chip peeling apparatus which concerns on the 2nd Embodiment of this invention peels a semiconductor chip.

  Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention. It should be noted that in the drawing, illustration of parts not related to the description may be omitted.

[First Embodiment]
The chip peeling apparatus 10 (see FIG. 1) according to the first embodiment of the present invention can peel a predetermined semiconductor chip C from a sheet ST on which a plurality of diced semiconductor chips C are attached. The thickness of the sheet ST is, for example, 0.1 mm. The semiconductor chip C has a rectangular parallelepiped shape, and its length and width are, for example, 0.6 mm and 0.3 mm, respectively.
The chip peeling apparatus 10 includes a sheet support (not shown), a suction collet 20, a suction collet advance / retreat mechanism 22, a holder 30, a holder advance / retreat mechanism 32, a needle 40, a needle advance / retreat mechanism 42, and a control unit 50.

  The sheet support can move the supported sheet ST in the direction in which the plurality of semiconductor chips C attached to the sheet ST are arranged, and can position the semiconductor chip C to be peeled between the suction collet 20 and the holder 30. .

  The adsorption collet 20 can advance and retreat in one direction and the opposite direction, as indicated by an arrow A in FIG. An adsorption hole 202 for air adsorption is formed in the tip surface of the adsorption collet 20, and the semiconductor chip C attached to the sheet ST can be adsorbed by air.

The suction collet advance / retreat mechanism 22 has a servo motor SVM2 as a driving source for moving the suction collet buffer 222 and the suction collet 20 forward and backward, and advances and retracts the suction collet 20 with respect to the semiconductor chip C via the suction collet buffer 222. be able to.
The suction collet buffer 222 is, for example, a spring. The suction collet buffering part 222 may be a shock absorber or rubber (elastic body) using air pressure. In addition, the adsorption collet buffer part 222 should just have an elastic element at least, and may have a viscous element further.
Therefore, the suction collet buffer 222 can suppress the impact of the suction collet 20 on the semiconductor chip C.

The holder 30 advances and retreats in the direction in which the suction collet 20 advances and retreats, and the sheet ST can be sucked by the front end surface.
In the holder 30, a recess 302 is formed at the center of the tip surface.
The recess 302 has a shape similar to that of the semiconductor chip C when viewed from the front end surface side of the suction collet 20. The length and width of the recess 302 are set larger than the size of the semiconductor chip C, respectively. However, the shape of the recess 302 may not be a shape similar to the shape of the semiconductor chip C, and may be, for example, a circular shape or a diamond shape. The depth of the recess 302 is set based on the mechanical properties of the sheet such as the thickness and elasticity of the sheet ST to be used.
Around the recess 302, a plurality of suction holes 304 are provided for air suction of the sheet ST to which the semiconductor chip C is stuck .
The holder may have a divided structure having a base and a tip that can be attached to and detached from the base. By making the holder into a divided structure and preparing in advance a plurality of tip portions in which various recesses having different dimensions are formed, it becomes easy to cope with semiconductor chips having a plurality of dimensions.

The holder advancing / retracting mechanism 32 includes a holder buffer 322 and a servo motor SVM3 serving as a drive source for moving the holder 30 back and forth, and can move the holder 30 forward and backward via the holder buffer 322.
The holder buffer 322 is, for example, a spring. The holder buffer 322 may be a shock absorber or rubber (elastic body) using air pressure. In addition, the holder buffer part 322 should just have an elastic element at least, and may have a viscous element further.
Therefore, the holder buffer 322 can suppress the impact that the holder 30 gives to the semiconductor chip C.

  The needle (an example of an extrusion member) 40 is a round bar-shaped member having a thin tip. The needle 40 is accommodated in a hole 306 formed at the center of the bottom surface of the recess 302 provided in the holder 30. The needle 40 advances and retreats in the direction in which the holder 30 advances and retreats, and the tip portion thereof breaks through the sheet ST, so that the semiconductor chip C attached to the sheet ST can be pushed out from the sheet ST side.

The needle advance / retreat mechanism (an example of the push-out member advance / retreat mechanism) 42 includes a needle buffer portion 422 and a servo motor SVM4 serving as a drive source for moving the needle 40 forward and backward, and the needle buffer portion (an example of the push-out member buffer portion) 422. The needle 40 can be advanced and retracted.
The needle buffering part 422 is a spring, for example. The needle buffering part 422 may be a shock absorber or rubber (elastic body) using air pressure. In addition, the needle buffer part 422 should just have an elastic element at least, and may have a viscous element further.
Therefore, the needle buffering part 422 can suppress the impact of the needle 40 on the semiconductor chip C.

The control unit 50 includes a servo amplifier (not shown) that drives the servo motors SVM2, SVM3, and SVM4, and a controller (not shown) connected to the servo amplifier. The suction collet advance / retreat mechanism 22, the holder advance / retreat mechanism 32, and the needle The operation of the advance / retreat mechanism 42 can be controlled.
Further, the control unit 50 can control the air suction operation by the suction collet 20 and the holder 30.
Further, the control unit 50 is connected to an image processing unit (not shown) that processes a captured image of the semiconductor chip C attached to the sheet ST, and based on the position information of the semiconductor chip C obtained by the image processing unit. The operation of the sheet support (not shown) can be controlled.

Next, the operation (chip peeling method) of the chip peeling apparatus 10 will be described based on FIG. 2 and FIG. The semiconductor chip C attached to the sheet ST is peeled according to the following steps S1 to S9.
As described above, the control unit 50 controls the suction collet advance / retreat mechanism 22, the holder advance / retreat mechanism 32, the needle advance / retreat mechanism 42, and the like.

(Process S1)
A sheet support (not shown) that supports the sheet ST (see FIG. 1) positions the sheet ST so that the semiconductor chip C to be peeled is positioned between the suction collet 20 and the holder 30.
Next, the holder 30 and the needle 40 advance toward the positioned sheet ST. Specifically, as shown in FIG. 3A, the holder 30 and the needle 40 advance to a target position that is considered to contact the sheet ST.
Thereafter, in the period p0 (see FIG. 2) prior to time t1, the suction collet 20, the holder 30, and the needle remain stationary.

(Process S2)
At time t1, the holder 30 air-sucks the sheet ST. Further, the suction collet 20 starts to advance toward the facing semiconductor chip C, and decelerates at a predetermined time in the period p1.

  At time t <b> 2, the holder 30 and the needle 40 start to advance toward the collet 20.

(Process S3)
At time t3, the suction collet 20 stops advancing. On the other hand, also in the period p3 after the time t3 when the suction collet 20 stops the advancement, the holder 30 and the needle 40 further advance toward the suction collet 20. That is, the sheet ST with the semiconductor chip C attached is moved in the direction of the suction collet 20 by the holder 30.

(Process S4)
At time t4, the suction collet 20 contacts the semiconductor chip C (see FIG. 3B). When the suction collet 20 comes into contact with the semiconductor chip C, the sheet ST bends toward the inside of the recess 302 (in the thickness direction of the sheet ST). As a result, the sheet ST acts as a buffer material, and the impact force applied to the semiconductor chip C is suppressed. In addition, since the holder buffering part 322 and the suction collet impacting part 222 are provided, the impact force applied to the semiconductor chip C is further suppressed.
After the contact, the semiconductor chip C is air adsorbed by the adsorption collet 20.

Here, when the semiconductor chip C comes into contact with the suction collet 20, the impact force applied to the semiconductor chip C is as shown in FIG. 4A when the recess 302 is not formed at the tip of the holder 30 and is flat. The waveform is as shown. On the other hand, when the recess 302 is formed at the tip of the holder 30 as in the chip peeling apparatus 10 in the present embodiment, the impact force applied to the semiconductor chip C has a waveform as shown in FIG. It becomes. That is, the impact force is reduced by bending the sheet ST toward the inside of the recess 302.
In the graphs shown in FIGS. 4 (A) and 4 (B), the load collet 20 is provided with a load cell, and the measurement data obtained from the load cell when the semiconductor chip C is peeled is regarded as the impact force. Is.

  Note that while the suction collet 20 is in contact with the holder 30 or the needle 40 via the semiconductor chip C and the sheet ST, the static positions of the suction collet 20, the holder 30, and the needle 40 are respectively the suction collet buffer portion 222. , Determined by the spring constants of the holder buffer 322 and the needle buffer 422. Therefore, the actual positions of the suction collet 20, the holder 30, and the needle 40 deviate from the position commands generated by the controller (not shown) of the control unit 50 shown in FIG.

(Process S5)
In a period p4 from time t4 to time t5 when the semiconductor chip C contacts the suction collet 20, the holder 30 and the needle 40 further advance with respect to the suction collet 20 while the position of the suction collet 20 is maintained. That is, the sheet ST is further bent in the thickness direction of the sheet ST. The holder 30 and the needle 40 further advance in order to absorb the dimensional tolerance in consideration of the dimensional tolerance of the thickness of the semiconductor chip C.
As shown in FIG. 3C, the sheet ST is further bent toward the inside of the depression 302 (in the thickness direction of the sheet ST), and the needle 40 comes into contact with and pierces the bent sheet ST. However, the needle 40 stands by at a position where the tip does not contact the back surface Cb (see FIG. 1) of the semiconductor chip.

(Step S6)
In a period p5 from time t5 to time t6, the needle 40 is stationary with respect to the origin position of the needle 40, and the holder 30 adsorbing the sheet ST moves backward while the position of the needle 40 is maintained.
Immediately after the holder 30 is retracted, the suction collet 20 that sucks the surface Cf of the semiconductor chip C advances as the holder 30 moves. When the holder 30 moves backward, as shown in FIG. 3D, the needle 40 pierced into the sheet ST breaks through the sheet ST, and the semiconductor chip C is pushed out of the sheet ST in contact with the back surface Cb of the semiconductor chip C. And peel off.

In the process of shifting from the state shown in FIG. 3C to the state shown in FIG. 3D, conventionally, the needle 30 is caused by the difference between the speed at which the holder 30 retracts and the speed at which the suction collet 20 advances. Chattering that repeats contact and separation at a fast cycle occurred between the front end portion of the semiconductor chip 40 and the back surface Cb of the semiconductor chip C, giving an impact force to the back surface Cb of the semiconductor chip C.
In this respect, since the chip peeling apparatus 10 according to the present embodiment includes the suction collet buffer part 222, the holder buffer part 322, and the needle buffer part 422, the impact force applied to the semiconductor chip C is suppressed. It becomes.

  From the viewpoint of further suppressing chattering, it is preferable that the spring constant of the suction collet buffer portion 222 does not match the spring constant of the holder buffer portion 322 and the spring constant of the needle buffer portion 422. However, the spring constant of the suction collet buffer portion 222 here is an equivalent spring constant corresponding to the spring constant when the suction collet buffer portion 222 is not a spring. Similarly, the spring constant of the holder buffer 322 is an equivalent spring constant corresponding to the spring constant when the holder buffer 322 is not a spring, and the spring constant of the needle buffer 422 is the needle buffer 422. When is not a spring, it is an equivalent spring constant corresponding to the spring constant.

(Step S7)
In a period p6 from time t6 to time t7, the suction collet 20, the holder 30, and the needle 40 are stationary and their respective positions are held. By holding the positions of the suction collet 20, the holder 30, and the needle 40 in the period p6, the possibility that the semiconductor chip C is stably peeled from the sheet ST and the peeling fails is reduced.

(Process S8)
In a period p7 from time t7 to time t8, as shown in FIG. 3E, the needle 40 and the holder 30 are moved backward, and the suction collet 20 that has sucked the semiconductor chip C is moved backward.
In the period p7, first, the holder 30 and the needle 40 start moving backward, and then the suction collet 20 starts moving backward. However, the suction collet 20, the holder 30 and the needle 40 simultaneously move backward at time t7. May start. Alternatively, the suction collet 20 may first start to retract, and then the holder 30 and the needle 40 may retract.

(Process S9)
At time t8, the air adsorption of the sheet ST by the holder 30 is released.
In the subsequent period p8 until time t9, the peeled semiconductor chip C is transported to a predetermined position by the suction collet 20.
Thereafter, by repeating the above-described steps S1 to S9 for the semiconductor chip C to be peeled, all the semiconductor chips C attached to one sheet ST are peeled off.

[Second Embodiment]
Subsequently, a chip peeling apparatus 10 according to a second embodiment of the present invention will be described.
The chip peeling apparatus 10 according to the second embodiment is different from the chip peeling apparatus 10 according to the first embodiment only in its operation (chip peeling method).
Therefore, the operation of the chip peeling apparatus 10 according to the present embodiment will be described below.

First, as shown in FIG. 5A, the holder 30 advances to a target position that is considered to be in contact with the sheet ST, and the needle 40 advances to a target position that is considered to be in front of the contact with the sheet ST.
Next, as shown in FIG. 5B, the suction collet 20 contacts the semiconductor chip C.
Next, as shown in FIG. 5C, when the holder 30 and the needle 40 further advance, the sheet ST bends toward the inside of the recess 302 (in the thickness direction of the sheet ST) and the needle 40 is bent. Contact ST without breaking through.
Next, as shown in FIG. 5D, the needle 40 in contact with the sheet ST is stationary with respect to the origin position of the needle 40, and the sheet ST is adsorbed while the position of the needle 40 is maintained. The holder 30 moves backward. When the holder 30 moves backward, the sheet ST is stretched and the semiconductor chip C is pushed out.
Finally, as shown in FIG. 5E, the needle 40 and the holder 30 are retracted, and the suction collet 20 that has adsorbed the semiconductor chip C is retracted, and the semiconductor chip C is peeled off.

Thereafter, the operations shown in FIGS. 5A to 5E are repeated for the semiconductor chip C to be peeled, so that all the semiconductor chips C attached to one sheet ST are obtained. It is peeled off.
The operation timing of the holder 30, the needle 40, and the collet 20 in the present embodiment is substantially the same as the operation timing (see FIG. 2) in the first embodiment.
As described above, according to the operation of the chip peeling apparatus 10 according to the present embodiment, since the needle 40 does not directly contact the back surface of the semiconductor chip C, the sheet ST serves as a buffer material and the impact force applied to the semiconductor chip C is the first. This is more relaxed than the operation according to the first embodiment.

As described above, the chip peeling apparatus 10 includes the suction collet buffer 222, the holder buffer 322, and the needle buffer 422, so that the impact force applied to the semiconductor chip C is suppressed. Further, since the recess 302 formed in the holder 30 is formed, the sheet ST bends and acts as a cushioning material, and the impact force applied to the semiconductor chip C is further suppressed.
As a result, the possibility of damage to the semiconductor chip C is reduced, and the overall processing speed of the chip peeling apparatus 10 can be improved.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions and the like that do not depart from the gist are within the scope of the present invention.
In the above-described embodiment, the direction in which the suction collet 20, the holder 30, and the needle 40 advance and retract may be any direction. That is, the direction in which the suction collet 20, the holder 30, and the needle 40 advance or retreat may be the vertical direction or the horizontal direction.
The extruded member is not limited to a needle generally referred to by those skilled in the art. The extrusion member may be any member as long as it can extrude the semiconductor chip.

The chip peeling apparatus 10 does not include the suction collet buffering part 222, the holder buffering part 322, or the needle buffering part 422, and has the above-described effects even when the recess 302 is formed in the holder 30.
In addition, the chip peeling device 10 does not have the recess 302 formed in the holder 30, and may include at least one of the suction collet buffer 222, the holder buffer 322, and the needle buffer 422. The effect of.

DESCRIPTION OF SYMBOLS 10 Chip peeling apparatus 20 Adsorption collet 22 Adsorption collet advance / retreat mechanism 30 Holder 32 Holder advance / retreat mechanism 40 Needle 42 Needle advance / retreat mechanism 50 Control part 202 Adsorption hole 222 Adsorption collet buffer part 302 Depression 304 Adsorption hole 306 Hole 322 Holder buffer part 422 Needle buffer part C Semiconductor chip Cf Semiconductor chip front surface Cb Semiconductor chip back surface ST sheet

Claims (5)

An adsorption collet that adsorbs the semiconductor chip attached to the sheet;
An adsorption collet advance / retreat mechanism for advancing and retracting the adsorption collet;
A holder provided with a suction hole for sucking the sheet around the recess, in which a recess larger than the semiconductor chip as viewed from the tip surface side is formed on the tip surface that sucks the sheet ;
A holder advancing and retracting mechanism for advancing and retracting the holder;
A needle that is housed in the holder and pushes out the semiconductor chip attached to the sheet;
And a needle reciprocating mechanism for advancing and retracting the needle,
The needle reciprocating mechanism, the needle have a pusher member buffer portion suppresses a shock given to the semiconductor chip,
The holder advancing / retreating mechanism has a holder buffer portion for suppressing an impact of the holder on the semiconductor chip;
The chip peeling apparatus in which the suction collet advance / retreat mechanism has a suction collet buffer portion that suppresses an impact of the suction collet on the semiconductor chip . The chip peeling apparatus according to claim 1 ,
A control unit for controlling the suction collet advance / retreat mechanism, the holder advance / retreat mechanism, and the needle advance / retreat mechanism;
Retracting the control section, the suction collet into contact with the semiconductor chip, and the flexures no step said said sheet towards the inside of the recess above, a step of causing contact the needle to the seat deflected, the holder And a step of extruding the semiconductor chip from the sheet with the needle . A chip peeling method using the chip peeling apparatus according to claim 1 ,
I said I flexures the sheet towards the inside of the recess the by contacting the semiconductor chip to the suction collet is brought into contact with the needle to the seat deflected, extruding the semiconductor chip from the sheet with the needle, A chip peeling method for peeling the semiconductor chip. A chip peeling method using the chip peeling apparatus according to claim 1 ,
The contact adsorption collet on the semiconductor chip, and the flexures no step the sheet toward the inside of the recess above,
And a step in which the needle is in contact with wrinkles do it the seat,
The holder is retracted to the needle is adsorbing the sheet in a state where the stationary and the needle pushes the semiconductor chip from the sheet, the chip peeling method comprising the steps of the semiconductor chip is peeled. An adsorption collet that adsorbs the semiconductor chip attached to the sheet;
An adsorption collet advance / retreat mechanism for advancing and retracting the adsorption collet;
A holder provided with a suction hole for sucking the sheet around the recess, in which a recess larger than the semiconductor chip as viewed from the tip surface side is formed on the tip surface that sucks the sheet ;
A holder advancing and retracting mechanism for advancing and retracting the holder;
A needle that is housed in the holder and pushes out the semiconductor chip attached to the sheet;
Chip peeling apparatus and a needle reciprocating mechanism for advancing and retracting the needle.