JP6424709B2 - Thermocompression bonding device - Google Patents

Description

  The present invention relates to a thermocompression bonding apparatus.

The printed wiring board is manufactured, for example, as follows.
As necessary, a substrate on which a circuit including electrodes, wirings, various electronic components (for example, a chip resistor and a chip capacitor) and the like are formed is prepared in advance.
Next, a prepreg (resin-containing sheet, adhesive sheet) is placed on the substrate.
Next, the substrate and the prepreg are thermocompression bonded. By this thermocompression bonding, the prepreg is softened and then hardened to form an insulating layer. The thermocompression bonding temperature is, for example, about 160 to 170 ° C.

Conventionally, the above-mentioned thermocompression bonding
A heat-bonding thermocompression bonding stage having a flat mounting surface on which the thermocompression bonding object is mounted;
A thermocompression bonding apparatus is used which has a flat pressing surface disposed opposite to the thermocompression bonding stage and movable up and down and pressing a thermocompression bonding object, and including a heatable thermocompression bonding head. (See FIG. 7 of Patent Document 1).
In this thermocompression bonding apparatus, the thermocompression bonding target is held while being held between the flat mounting surface of the thermocompression bonding stage and the flat pressing surface of the thermocompression bonding head, thereby pressing and heating the thermocompression bonding target.

In the above-mentioned conventional thermocompression bonding apparatus, the thermocompression bonding target is sandwiched between a pair of flat surfaces (the flat mounting surface of the thermocompression bonding stage and the flat pressing surface of the thermocompression bonding head), so It is difficult to uniformly press the entire surface of the thermocompression bonding object.
Further, in the above-described conventional thermocompression bonding apparatus, since the thermocompression bonding head is in contact with the thermocompression bonding object, contamination of the thermocompression bonding head can not be avoided.

Patent Document 1 discloses
A thermocompression bonding apparatus that applies pressure and electrically bonds one electronic component and another electronic component set overlappingly on a flat surface while heating and
A fixed-side thermo-compression bonding stage provided with a work support on which the flat surface is electrically heated;
A thermocompression bonding head that ejects heated compressed air is supported, and can be reciprocated in a direction toward and away from the work support table, and the one between the thermocompression bonding head and the work support table at the time of approach A movable thermocompression bonding stage that forms a high pressure space where the other electronic components can be joined together by pressing the compressed air with each other;
A thermocompression bonding apparatus for an electronic component is proposed, which is characterized by comprising:

JP 10-214865 A

In the thermocompression bonding apparatus described in Patent Document 1, the entire surface to be thermocompression-bonded can be uniformly pressurized and thermocompression-bonded by the compressed air diffused in the high pressure space (claim 2, abstract, etc.).
In Patent Document 1, compressed air (26) is the hot air generated in the hot gas generator (24) (paragraph 0021).
In the thermocompression bonding apparatus described in Patent Document 1, the thermocompression bonding head is in non-contact with the thermocompression bonding target, and the contamination of the thermocompression bonding head is suppressed.

In the thermocompression-bonding apparatus of patent document 1, heating and pressurization are uniformly performed with respect to the whole surface of thermocompression-bonding object. Therefore, even if there is a heating prohibited area which is preferably not heated to the thermocompression bonding object, the area is inevitably heated.
For example, in the prepreg used for producing the printed wiring board, holes for interlayer connection and / or for incorporating components may be formed in advance, if necessary. If the entire surface of such a prepreg is uniformly heated and pressurized, the pores may be deformed by the softening and pressurization caused by the heating of the prepreg. Therefore, in the prepreg, it is preferable that the hole formation region is not heated.

  The present invention has been made in view of the above circumstances, and a thermocompression bonding can be performed on the thermocompression bonding target including the heating prohibition region without causing the heating prohibition region to be heated and the other regions can be thermocompression bonding satisfactorily. It aims at providing an apparatus.

The thermocompression bonding apparatus of the present invention is
A thermocompression bonding apparatus comprising a non-adhered laminate including a resin-containing sheet and thermocompression bonding a thermocompression bonding target including a heating area and a heating inhibition area,
A heat-bonding thermocompression-bonding stage having a mounting surface on which the thermo-compression bonding object is placed;
And a gas injection unit including a plurality of gas injection ports for injecting a gas to the thermocompression bonding target placed on the thermocompression bonding stage,
The plurality of gas injection ports are disposed to face the heating area, and at least one high temperature gas injection port that injects a high temperature gas having a relatively high temperature higher than the softening temperature of the resin-containing sheet; And at least one low temperature gas injection port disposed opposite to the area and injecting a low temperature gas having a relatively low temperature lower than the softening temperature of the resin-containing sheet,
The high temperature gas and the low temperature gas are simultaneously injected from the gas injection unit with respect to the thermocompression bonding object placed on the thermocompression bonding stage to pressurize the thermocompression bonding object.

  According to the present invention, it is possible to provide a thermocompression bonding apparatus capable of thermocompression bonding of other regions without heating the heating prohibition region with respect to the thermocompression bonding target including the heating prohibition region.

It is a schematic cross section of the thermocompression-bonding apparatus of one Embodiment which concerns on this invention. It is a schematic cross section of the thermocompression-bonding apparatus of one Embodiment which concerns on this invention.

"Thermocompression bonding device"
A thermocompression bonding apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1: is a schematic cross section which shows a mode that thermocompression bonding object is thermocompression-bonded.

As shown in Figure 1,
The thermocompression bonding apparatus 10 of the present embodiment is
A thermocompression bonding stage 11 having a flat mounting surface 11S on which the thermocompression bonding object 20 is placed;
And a gas injection unit 12 including a plurality of gas injection ports that are disposed to face the thermocompression bonding stage 11 and inject gas to the thermocompression bonding target 20 placed on the thermocompression bonding stage 11.

In the present embodiment, the thermocompression bonding target 20 is an unbonded laminate including a resin-containing sheet.
The thermocompression bonding target 20 includes a heating area 22H to be heated and a heating inhibition area 22C which is preferably not to be heated.
The thermocompression bonding apparatus 10 of the present embodiment is formed of an unbonded laminate including a resin-containing sheet, and can be applied to any thermocompression bonding object 20 formed of an unbonded laminate including a heating area and a heating prohibited area. It is preferably used for the production of a wiring board or the like.

In the present embodiment, the thermocompression bonding target 20 is a non-bonded laminate in the middle of the production of the printed wiring board, and includes the substrate 21 and the prepreg (resin-containing sheet, adhesive sheet) 22 mounted thereon.
The substrate 21 is not particularly limited, and a glass epoxy substrate or the like in which a glass fiber cloth is impregnated with an epoxy resin is preferable.
Circuits (not shown) including electrodes, wirings, various electronic components (for example, chip resistors, chip capacitors, etc.) and the like are formed in advance on the substrate 21 as necessary.

  In the present embodiment, the prepreg 22 is formed in advance with holes 22X for interlayer connection or for incorporating components. In the illustrated example, the holes 22X are through holes. The diameter, the planar shape, and the number of the holes 22X are appropriately designed.

When the formation region of the holes 22X of the prepreg 22 is heated, there is a possibility that the holes 22X may be deformed due to the softening and pressurization by the heating of the prepreg 22.
In the present embodiment, the formation area of the holes 22X is the heating inhibition area 22C, and the other area is the heating area 22H.

The thermocompression bonding stage 11 on which the thermocompression bonding target 20 is placed is heated by a heater (not shown).
The position of the thermocompression bonding stage 11 is fixed.

The gas injection unit 12 is movable in the height direction by a known technique, and the distance between the gas injection unit 12 and the thermocompression bonding stage 11 is adjustable.
The gas injection portion 12 is a plate-like member having a plurality of through holes 12X, and the gas is supplied to the upper end side of each through hole 12X and the gas is ejected from the lower end side according to a known technique. The lower end side opening part (opening part by the side of the thermocompression bonding stage 11) of each through-hole 12X becomes a gas injection port.
The type of gas is not particularly limited, and may be air or the like.

In the present embodiment, the plurality of gas injection ports are disposed to face the heating region 22H of the thermocompression bonding target 20, and at least one high temperature gas injection port 12A that injects a high temperature gas having a relatively high temperature; And at least one low temperature gas injection port 12B disposed opposite to the area 22C and injecting a low temperature gas having a relatively low temperature lower than the softening temperature of the prepreg 22 (resin-containing sheet).
In the illustrated example, a plurality of high temperature gas injection ports 12A and a plurality of low temperature gas injection ports 12B are provided so that the entire surface of the planar thermocompression bonding target 20 can be pressurized favorably.
The diameter, number, and pitch of the high temperature gas injection port 12A and the low temperature gas injection port 12B are appropriately designed.

  In the figure, reference numeral 12H denotes a high temperature gas injection unit provided with a high temperature gas injection port 12A in the gas injection unit 12, and reference numeral 12C denotes a low temperature gas provided with a low temperature gas injection opening 12B in the gas injection unit 12. The injection part is shown.

The temperature of the high temperature gas is equal to or higher than the softening temperature of the prepreg 22 (resin-containing sheet), and is, for example, about 160 to 170 ° C. A gas such as air can be heated to a temperature suitable for thermocompression bonding by a known technique, and can be supplied to the gas injection unit 12 as a high temperature gas.
The temperature of the low temperature gas is less than the softening temperature of the prepreg 22 (resin-containing sheet), and is, for example, 150 ° C. or less. A gas such as air can be supplied to the gas injection unit 12 as a low temperature gas at the environmental temperature without being particularly heated.

  The thermocompression bonding can be performed as follows using the thermocompression bonding apparatus 1.

The thermocompression bonding stage 11 and the gas injection unit 12 are sufficiently separated in advance. In this state, the thermocompression bonding target 20 formed of an unbonded laminate including the substrate 21 and the prepreg (resin-containing sheet) 22 mounted thereon is mounted on the mounting surface 11S of the thermocompression bonding stage 11 .
At this time, as illustrated, the substrate 21 is disposed on the thermocompression bonding stage 11 side, and the prepreg 22 is disposed on the gas injection unit 12 side.

  Next, if necessary, the gas injection unit 12 is lowered to bring the gas injection unit 12 closer to the thermocompression bonding target 20. The height position of the gas injection part 12 is set in the range which the gas injection part 12 does not contact the thermocompression-bonding object 20, and the whole surface of the thermocompression-bonding object 20 is favorably pressurized by gas injection pressure.

Next, gas is simultaneously injected from the high temperature gas injection port 12A of the gas injection unit 12 and the low temperature gas injection port 12B.
A high temperature gas having a relatively high temperature higher than the softening temperature of the prepreg 22 (resin-containing sheet) is injected from the high temperature gas injection port 12A.
The low temperature gas having a relatively low temperature lower than the softening temperature of the prepreg 22 (resin-containing sheet) is injected from the low temperature gas injection port 12B.

  In the thermocompression bonding apparatus 10 of the present embodiment, the high temperature gas and the low temperature gas are simultaneously injected from the gas injection unit 12 to the thermocompression bonding target 20 placed on the thermocompression bonding stage 11 to make the thermocompression bonding target 20 Pressurize. At this time, since the heating region 22H of the thermocompression bonding target 20 is heated by the high temperature gas, the prepreg 22 is softened and then hardened. On the other hand, the heating prohibited area 22C of the thermocompression bonding target 20 is maintained at a relatively low temperature lower than the softening temperature of the thermocompression bonding target 20 by the low temperature gas and is not exposed to high temperatures, so deformation of the holes 22X is suppressed. Therefore, in the present embodiment, the entire thermocompression bonding target 20 can be thermocompression bonded satisfactorily while protecting the heating prohibited area 22C from heat.

In the thermocompression-bonding apparatus 10 of this embodiment, the gas injection part 12 does not contact with the thermocompression-bonding object 20, and the thermocompression-bonding object 20 is pressurized using gas injection pressure.
Therefore, the contamination of the gas injection part 12 resulting from the contact with the thermocompression bonding object 20 is suppressed.
Further, unlike the thermocompression bonding apparatus described in FIG. 7 of Patent Document 1, the entire thermocompression bonding target 20 can be thermocompression bonded favorably regardless of the surface shape of the thermocompression bonding target 20.
For example, in the example shown in FIG. 2, a hole 22X for containing a component (a through hole in the illustrated example) is formed in advance in the prepreg 22, and the electronic component 30 is further embedded in the hole 22X. The electronic component 30 projects beyond the main surface of the prepreg 22. The electronic component 30 is, for example, a chip resistor and a chip capacitor.
As in the example shown in FIG. 2, even if there is a portion that partially protrudes on the surface of the thermocompression bonding object 20, the entire thermocompression bonding object 20 can be obtained without contacting the gas injection unit 12 with the thermocompression bonding object 20. It can be thermocompression-bonded well.
In the example shown in FIG. 2, the electronic component 30 is held at a relatively low temperature lower than the softening temperature of the thermocompression bonding target 20 by the low temperature gas, and the effect of being protected from heat is also obtained.

  As described above, according to the present embodiment, the thermocompression bonding target 20 including the heating prohibition region 22C can be thermocompression-bonded to other regions without heating the heating prohibition region 22C. A thermocompression bonding apparatus 10 can be provided.

  The present invention is not limited to the above embodiments, and design changes can be made as appropriate without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 10 thermocompression bonding apparatus 11 thermocompression bonding stage 11S mounting surface 12 gas injection part 12X through hole 12A high temperature gas injection port 12B low temperature gas injection port 12H high temperature gas injection part 12C low temperature gas injection part 20 thermocompression bonding object 21 substrate 22 prepreg (containing resin Sheet)
22C Heating prohibited area 22H Heating area 22X hole 30 electronic parts

Claims (1)

A thermocompression bonding apparatus comprising a non-adhered laminate including a resin-containing sheet and thermocompression bonding a thermocompression bonding target including a heating area and a heating inhibition area,
A heat-bonding thermocompression-bonding stage having a mounting surface on which the thermo-compression bonding object is placed;
And a gas injection unit including a plurality of gas injection ports for injecting a gas to the thermocompression bonding target placed on the thermocompression bonding stage,
The gas injection portion is formed of a plate-like member having a plurality of through holes to which the gas is supplied, and openings of the individual through holes on the thermocompression bonding stage side are the gas injection holes.
The plurality of gas injection ports are designed so as to face the heating area, and at least one high temperature gas injection port for injecting high temperature gas having a relatively high temperature higher than the softening temperature of the resin-containing sheet; The arrangement is designed to face the non-heatable area, and includes at least one low temperature gas injection port for injecting a low temperature gas having a relatively low temperature lower than the softening temperature of the resin-containing sheet,
The high temperature gas and the low temperature gas are simultaneously injected from the gas injection unit to the thermocompression bonding object placed on the thermocompression bonding stage, and the thermocompression bonding object is pressurized.
Thermocompression bonding device.

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