JP5608545B2 - Thermocompression bonding head, mounting apparatus and mounting method - Google Patents

Description

The present invention, thermocompression bonding head for bonding by heating bonding a mounting component via the thermosetting adhesive to the mounting portion of the substrate or panel, on implementing device and mounting how.

  2. Description of the Related Art Conventionally, liquid crystal display devices are often used as various display means such as a television, a PC monitor, a mobile phone, a tablet personal computer, a portable game machine, or an in-vehicle monitor. In recent years, in such liquid crystal display devices, so-called COG (chip on glass) in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel or a liquid crystal driving circuit from the viewpoints of fine pitch, light weight, and thinning. A so-called FOG (film on glass) that directly mounts the flexible substrate on which the substrate is formed on the substrate of the liquid crystal display panel is employed.

  For example, a liquid crystal display device 100 employing a COG mounting system has a liquid crystal display panel 104 that performs a main function for liquid crystal display, as shown in FIG. 9, and the liquid crystal display panel 104 is a glass substrate or the like. And two transparent substrates 102 and 103 facing each other. In the liquid crystal display panel 104, the transparent substrates 102 and 103 are bonded to each other by a frame-shaped seal 105, and the liquid crystal 106 is sealed in a space surrounded by the transparent substrates 102 and 103 and the seal 105. A panel display unit 107 is provided.

  The transparent substrates 102 and 103 have a pair of striped transparent electrodes 108 and 109 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent substrates 102 and 103 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 108 and 109.

  Of the two transparent substrates 102 and 103, one transparent substrate 103 is formed to have a larger planar dimension than the other transparent substrate 102, and the transparent electrode 109 is formed on the edge 103a of the transparent substrate 103 formed to be large. Terminal portion 109a is formed. Further, alignment films 111 and 112 subjected to a predetermined rubbing process are formed on both transparent electrodes 108 and 109, and the initial alignment of liquid crystal molecules is regulated by the alignment films 111 and 112. ing. Further, a pair of polarizing plates 118 and 119 are disposed outside both the transparent substrates 108 and 109, and the vibration direction of transmitted light from the light source 120 such as a backlight is regulated by both the polarizing plates 118 and 119. It has come to be.

  On the terminal portion 109a, a liquid crystal driving IC 115 is thermocompression bonded via an anisotropic conductive film 114. The anisotropic conductive film 114 is a film formed by mixing conductive particles in a thermosetting binder resin, and heat conduction is performed between the two conductors so that the electrical conduction between the conductors is achieved by the conductive particles. And the mechanical connection between the conductors is maintained by the binder resin. The liquid crystal driving IC 115 can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying a liquid crystal driving voltage to the pixels. In addition, as the adhesive constituting the anisotropic conductive film 114, the most reliable thermosetting adhesive is usually used.

  When the liquid crystal driving IC 115 is connected to the terminal portion 109a through such an anisotropic conductive film 114, first, the anisotropic conductive film 114 is attached to the terminal portion 109a of the transparent electrode 109 by a temporary crimping means (not shown). Temporarily crimp. Subsequently, after the liquid crystal driving IC 115 is mounted on the anisotropic conductive film 114, the liquid crystal driving IC 115 is connected to the terminal together with the anisotropic conductive film 114 by thermocompression bonding means 121 such as a thermocompression bonding head as shown in FIG. The thermocompression bonding means 121 is caused to generate heat while being pressed toward the portion 109a. Due to the heat generated by the thermocompression bonding means 121, the anisotropic conductive film 114 undergoes a thermosetting reaction, whereby the liquid crystal driving IC 115 is bonded onto the terminal portion 109a via the anisotropic conductive film 114.

  By the way, recently, along with the trend toward thin and light display devices, the liquid crystal display device 100 itself has been reduced in size and weight, while it has been required to secure the display area of the liquid crystal display device 100 as much as possible. It is required to make the edge 103a provided with the portion 109a as small as possible.

  Along with this, the distance between the terminal portion 109a thermally pressed by the thermocompression bonding means 121 and the panel display portion 107 becomes shorter, and the heating temperature tends to increase with the miniaturization of the thermocompression bonding means 121. Therefore, there is a problem that the polarizing plates 118 and 119 attached to the liquid crystal display panel 104 and the seal 105 sealing the transparent substrates 102 and 103 are deteriorated by the heat.

  As shown in FIG. 11, when a flexible substrate 122 on which a liquid crystal driving circuit is formed is mounted near the liquid crystal driving IC 115 that is bare-chip mounted on the terminal portion 109a of the liquid crystal panel, thermocompression bonding means There is also a problem that a thermal shock is applied to the liquid crystal driving IC 115 due to the heat from 121, and the mounting state on the terminal portion 109a becomes unstable.

JP 2003-195335 A

Therefore, the present invention provides a mounting apparatus and mounting method for mounting a mounting component on a narrowed terminal portion by applying heat and pressure via an anisotropic conductive film, and other configurations such as a panel display unit and other electronic components. thermocompression bonding head can alleviate heat shock to components, and an object thereof is to provide a mounting apparatus and a mounting how.

  In order to solve the above-described problem, the thermocompression bonding head according to the present invention is a thermocompression bonding head that connects the mounting component to the mounting part by heat-pressing the mounting component via a thermosetting adhesive layer. The thermocompression bonding head includes a Peltier element, and the Peltier element has a cooling part on a surface side facing the other component parts provided in the vicinity of the mounting part when the mounting part is thermally pressurized. Is.

  Further, the mounting device according to the present invention includes a thermocompression bonding head that connects the mounting component to the mounting part by heat-pressing the mounting component through a thermosetting adhesive layer, and the mounting component includes the thermocompression bonding head. A head drive mechanism that opposes the mounting part to be connected and moves the head close to and away from the mounting part, the thermocompression bonding head has a Peltier element, and the Peltier element is used when heat-pressing the mounting component. The surface facing the other component parts provided in the vicinity of the mounting part is the cooling part.

  Further, the mounting method according to the present invention includes a step of placing the mounting component on the mounting portion via a thermosetting adhesive layer, and the mounting component on the mounting portion by a thermocompression bonding head having a Peltier element. A step of heat-pressing, and in the heat-pressing step, the Peltier element has a cooling portion on a surface facing the other components provided in the vicinity of the mounting portion.

  According to the present invention, the thermocompression bonding head has a Peltier element, and a current flowing in a predetermined direction through the Peltier element is used as a cooling part on the side facing the other component part. Can be prevented from being transmitted.

It is a side view which shows the mounting apparatus with which this invention was applied. It is sectional drawing which shows the state which uses the mounting apparatus with which this invention was applied to the other liquid crystal display panel. It is a side view which shows the structure by which the several Peltier element is overlapped and attached. It is a side view which shows the structure which heat-presses mounting components also by a Peltier device. It is a side view showing composition provided with a plurality of thermocompression-bonding heads via a Peltier device. It is sectional drawing which shows the structure which provided the Peltier element around the head main body. It is sectional drawing which shows the thermocompression-bonding head heated by a Peltier device without incorporating a heater. It is a side view which shows the thermocompression-bonding head which consists of a Peltier device. It is sectional drawing which shows the conventional liquid crystal display panel. It is sectional drawing which shows the COG mounting process of the conventional liquid crystal display panel. It is sectional drawing which shows the FOG mounting process of the conventional liquid crystal display panel.

  Hereinafter, a thermocompression bonding head, a mounting apparatus, a mounting method, and a joined body to which the present invention is applied will be described in detail with reference to the drawings. The mounting apparatus 1 to which the present invention is applied includes a thermocompression bonding head 3, and a so-called COG (chip on glass) mounting in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel, or a liquid crystal driving circuit is formed. It can be suitably used for so-called FOG (film on glass) mounting or the like in which a flexible substrate is directly mounted on a substrate of a liquid crystal display panel.

  Prior to the description of the mounting apparatus 1, a liquid crystal display panel 10 on which a flexible substrate on which a liquid crystal driving IC and a liquid crystal driving circuit are formed by the mounting apparatus 1 is mounted will be described with reference to FIG. In the liquid crystal display panel 10, similarly to the liquid crystal display panel 104, two transparent substrates 11 and 12 made of a glass substrate or the like are arranged to face each other, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped seal 13. Yes. In the liquid crystal display panel 10, the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form a panel display unit 15.

  The transparent substrates 11 and 12 have a pair of striped transparent electrodes 16 and 17 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent substrates 16 and 17 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 16 and 17.

  Of the transparent substrates 11 and 12, one transparent substrate 12 is formed to have a larger planar dimension than the other transparent substrate 11, and a liquid crystal driving edge is formed on the edge 12a of the formed transparent substrate 12. A COG mounting unit 20 on which an electronic component 18 such as an IC is mounted is provided, and an FOG mounting unit 22 on which a flexible substrate 21 on which a liquid crystal driving circuit is formed is mounted near the outside of the COG mounting unit 20. ing.

  Note that the liquid crystal driving IC and the liquid crystal driving circuit can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying the liquid crystal driving voltage to the pixels. ing.

  In each of the mounting portions 20 and 22, a terminal portion 17a of the transparent electrode 17 is formed. On the terminal portion 17a, an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 are thermocompression bonded via an anisotropic conductive film 23. The anisotropic conductive film 23 contains conductive particles, and the electrode of the electronic component 18 or the flexible substrate 21 and the terminal portion 17a of the transparent electrode 17 formed on the edge portion 12a of the transparent substrate 12 are electrically conductive. Electrical connection is made through particles. The anisotropic conductive film 23 is a thermosetting adhesive, and is thermally bonded by a thermocompression bonding head 3 to be described later, so that the conductive particles become the terminal portions 17a of the transparent electrode 17, the electronic component 18, and the flexible substrate 21. It hardens | cures in the state crushed between each of these electrodes, and connects the transparent substrate 12, the electronic component 18, and the flexible substrate 21 electrically and mechanically.

  Specifically, the anisotropic conductive film 23 has a composition in which conductive particles are contained in an organic resin binder, and the organic resin binder includes a film forming material, a liquid curing component, a silane coupling agent, a curing agent, and the like. The As the film forming material, any organic resin having film forming ability such as phenoxy resin and solid epoxy resin can be used as appropriate. As the liquid curing component, a thermosetting compound such as a liquid epoxy resin or liquid acrylate can be appropriately used. As a curing agent when a liquid epoxy resin is used, an amine-based curing agent, imidazoles, sulfonium salts, onium salts and the like can be preferably used. As a curing agent when a liquid acrylate is used, a thermal radical generator such as an organic peroxide can be preferably used. Furthermore, you may use an inorganic filler and various additives.

  Examples of the conductive particles include any known conductive particles used in the anisotropic conductive film 23. For example, nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, Particles of various metals such as gold and metal alloys, metal oxides, carbon, graphite, glass, ceramics, plastics and other particles coated with metal, or the surface of these particles further coated with an insulating thin film And the like. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

  When the electronic component 18 or the flexible substrate 21 is connected to the terminal portion 17a through such an anisotropic conductive film 23, first, the anisotropic conductive film 23 is not illustrated on the terminal portion 17a of the transparent electrode 17. Temporary pressure bonding is performed by a pressure bonding means. Subsequently, after placing the electronic component 18 and the flexible substrate 21 on the anisotropic conductive film 23, the thermocompression bonding head 3 presses the electronic component 18 and the flexible substrate 21 together with the anisotropic conductive film 23 toward the terminal portion 17 a side. While doing so, the thermocompression bonding head 3 generates heat. Due to the heat generated by the thermocompression bonding head 3, the anisotropic conductive film 23 undergoes a thermosetting reaction, whereby the electronic component 18 and the flexible substrate 21 are bonded onto the terminal portion 17a via the anisotropic conductive film 23. .

  In this embodiment, instead of the anisotropic conductive film 23, an insulating adhesive film (NCF (Non Conductive Film)) made of only a binder may be used. In this case, the electronic component 18 or the flexible substrate 21 and the terminal portion 17a of the transparent electrode 17 are electrically connected by direct contact. In this case, stud bumps or the like can be suitably used as the bumps of the electronic component 18.

  The anisotropic conductive film 23 is applied and formed on a release film such as PET that has been subjected to a release treatment from the standpoint of ease of handling and storage stability. The shape of the anisotropic conductive film 23 is not particularly limited. For example, the anisotropic conductive film 23 has a long tape shape that can be wound around a take-up reel made of plastic or the like, and is cut by a predetermined length when used for mounting. Can be used.

  An alignment film 24 subjected to a predetermined rubbing process is formed on both transparent electrodes 16 and 17, and the initial alignment of liquid crystal molecules is regulated by the alignment film 24. In addition, a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12, and these polarizing plates 25 and 26 allow transmitted light from a light source (not shown) such as a backlight to be transmitted. The vibration direction is regulated.

[Mounting device 1]
The mounting apparatus 1 mounts the electronic component 18 on the COG mounting portion 20 of the liquid crystal display panel 10 and also mounts the flexible substrate 21 on the FOG mounting portion 22. As shown in FIG. A stage 2 on which the panel 10 is mounted, and a thermocompression bonding head 3 for mounting an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 on the mounting parts 20 and 22 of the liquid crystal display panel 10 mounted on the stage 2. And a head driving mechanism 4 that moves the thermocompression bonding head 3 close to and away from the mounting portions 20 and 22.

  The stage 2 has a sufficient size for mounting the liquid crystal display panel 10, and the liquid crystal display panel 10 is positioned and mounted. When the liquid crystal display panel 10 is positioned and placed on the stage 2, the thermocompression bonding head 3 is provided so as to face the COG mounting part 20 and the FOG mounting part 22 provided on the edge part 12 a of the transparent substrate 12. ing.

  The thermocompression bonding head 3 has a pressing surface 3a for pressing the electronic component 18 and the flexible substrate 21, and a head main body 3b in which a heater is built and a Peltier element 5 is attached. The thermocompression bonding head 3 presses the anisotropic conductive film 23 with conductive particles by pressing the pressing surface 3a heated to a predetermined temperature against the electronic component 18 and the flexible substrate 21 with a predetermined pressure and time. Cure in the crushed state.

  The thermocompression bonding head 3 is provided with a Peltier element 5 on a head body 3b. The Peltier element 5 is a plate-like element that utilizes a phenomenon in which heat is generated or absorbed when a contact surface of a dissimilar metal or semiconductor is energized, and includes a cooling unit 6 and a heating unit 7. The Peltier element 5 can reverse the cooling direction 6 and the heating part 7 because the direction of heat transfer is reversed by reversing the direction in which the direct current flows. Therefore, the Peltier element 5 can be used for both heating and cooling, and is suitable for highly accurate temperature control. The mounting apparatus 1 uses the Peltier element 5 to prevent the heat of the head main body 3b from being transmitted to the components on the transparent substrate 12 such as the electronic component 18 and the panel display unit 15.

  The Peltier element 5 is formed on at least a side surface of the head main body 3b facing the electronic component 18 and the panel display unit 15, and the side facing the component is a cooling unit 6. This is because the liquid crystal display panel 10 forms the panel display unit 15, mounts the electronic component 18 by COG, and then mounts the flexible substrate 21 by FOG. This is to prevent the heat of the head body 3b from being transmitted to the portion 15 and the electronic component 18.

[Head drive mechanism]
The head driving mechanism 4 for driving the thermocompression bonding head 3 supports the thermocompression bonding head 3 so as to be movable up and down so as to be close to and away from the COG mounting portion 20 and the FOG mounting portion 22, The drive of the heater built in the head main body 3b is controlled. The head driving mechanism 4 drives the heater in the head main body 3b to heat it to a predetermined temperature when mounting the electronic component 18 and the flexible substrate 21, and also heats the thermocompression bonding head 3 with a predetermined pressure for a predetermined time. 18 and the flexible substrate 21 are driven to be pressed.

[Mounting method]
Next, a process of performing COG mounting and FOG mounting on the liquid crystal display panel 10 using the mounting apparatus 1 will be described. As shown in FIG. 1, the mounting apparatus 1 has a liquid crystal display panel 10 positioned and placed on a stage 2. At this time, in the liquid crystal display panel 10, the transparent substrates 11 and 12 are bonded together by the seal 13, and the liquid crystal is sealed in the internal space. Further, the liquid crystal display panel 10 is provided with transparent electrodes 16 and 17 on the inner surfaces facing each other, and the edge of the transparent substrate 12 is provided with the COG mounting portion 20 and the FOG in which the terminal portions 17a of the transparent electrodes 17 are formed, respectively. A mounting portion 22 is provided. Further, in the liquid crystal display panel 10, an alignment film 24 subjected to a predetermined rubbing process is formed on the transparent electrodes 16 and 17. A pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12.

  First, the anisotropic conductive film 23 is disposed on the terminal portion 17 a of the COG mounting portion 20. At this time, the thermocompression bonding head 3 is supported above the COG mounting portion 20 by the head driving mechanism 4. Next, an electronic component 18 such as a liquid crystal driving IC is disposed on the anisotropic conductive film 23. The thermocompression bonding head 3 is controlled so that the head main body 3b is heated to a predetermined temperature by the head driving mechanism 4 and the pressing surface 3a is lowered so as to press the electronic component 18 and is pressed for a predetermined pressure and time. Is done. Thereby, the anisotropic conductive film 23 hardens | cures in the state by which the electroconductive particle was crushed, and electrically connects the electronic component 18 and the terminal part 17a.

  At this time, the thermocompression bonding head 3 is provided with a Peltier element 5 on a side surface facing the panel display unit 15 of the head main body 3b, and a side facing the panel display unit 15 by passing a current in a predetermined direction through the Peltier element 5. Therefore, the heat of the head main body 3b can be prevented from being transmitted to the polarizing plate, the seal 13 and the like of the panel display unit 15. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 is narrowed and the head main body 3b is close to the panel display unit 15, deterioration or damage caused by thermal shock applied to each part of the panel display unit 15 Etc. can be prevented.

  Following the COG implementation, FOG implementation is performed. First, the anisotropic conductive film 23 is temporarily disposed on the terminal portion 17 a of the FOG mounting portion 22. Also at this time, the thermocompression bonding head 3 is supported above the FOG mounting portion 22 by the head driving mechanism 4. Subsequently, the terminal part of the flexible substrate 21 in which a liquid crystal driving circuit or the like is formed on the anisotropic conductive film 23 is disposed. As shown in FIG. 2, the thermocompression bonding head 3 is such that the head main body 3 b is heated to a predetermined temperature by the head driving mechanism 4, and the pressing surface 3 a is lowered so as to press the terminal portion of the flexible substrate 21. The pressure is controlled so as to be pressed only for the time. Thereby, the anisotropic conductive film 23 hardens | cures in the state by which the electroconductive particle was crushed, and electrically connects the flexible substrate 21 and the terminal part 17a.

  Also at this time, the thermocompression bonding head 3 is provided with the Peltier element 5 on the side surface facing the panel display unit 15 of the head main body 3b and the electronic component 18 previously mounted with COG, and a current in a predetermined direction is supplied to the Peltier element 5. Since the cooling unit 6 is the side facing the electronic component 18 and the panel display unit 15 by flowing, the heat of the head main body 3b is transmitted to the polarizing plates 25 and 26 of the panel display unit 15, the seal 13, the electronic component 18 and the like. Can be prevented. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 and the FOG mounting unit 22 is reduced and the head body 3b is close to the electronic component 18 or the panel display unit 15, the electronic component 18 or the panel display unit 15 can be prevented from being altered or damaged due to a thermal shock applied thereto, and the connection of the electronic component 18 to the COG mounting portion 20 does not become unstable.

  In this way, the liquid crystal display panel 10 in which the electronic component 18 is COG mounted on the liquid crystal display panel 10 and the flexible substrate 21 is FOG mounted is manufactured. After the mounting is completed, the thermocompression bonding head 3 is raised by the head driving mechanism 4 to prepare for the next mounting process.

  In the above description, the case where the electronic component 18 and the flexible substrate 21 are mounted on the liquid crystal display panel 10 has been described. However, even when the liquid crystal display panel 10 is replaced with a wiring substrate, it can be similarly mounted. Moreover, although it described about mounting the flexible substrate 21 in the panel in which the COG mounting part exists previously, the mounting part mounted previously is not limited to COG.

[Second Embodiment]
Next, modifications of the thermocompression bonding head to which the present invention is applied will be described. As shown in FIG. 3, the thermocompression bonding head 30 has a plurality of Peltier elements 5a, 5b, 5c,. Each Peltier element 5 has different temperature characteristics such as a temperature difference between the cooling unit 6 and the heating unit 7 and a usable temperature range.

  The thermocompression bonding head 30 is attached with the first Peltier element 5a whose upper limit of the usable temperature range is close to the heating temperature of the head body 30a. Then, the thermocompression bonding head 30 attaches the second Peltier element 5b whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the first Peltier element 5a to the first Peltier element 5a. A third Peltier element 5c whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the second Peltier element 5b is attached to the second Peltier element 5b.

  As described above, the thermocompression bonding head 30 has a plurality of other Peltier elements 5 whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the Peltier element 5 that has been previously attached. Peltier elements are superimposed.

  According to the thermocompression bonding head 30, the temperature of each Peltier element 5 can be gradually lowered toward the outside, and faces the components mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18. The cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

[Third embodiment]
In addition, the mounting apparatus 1 to which the present invention is applied may heat-press the mounting components such as the electronic component 18 and the flexible substrate 21 with the Peltier element 5 superimposed on the thermocompression bonding head 30. In the mounting apparatus 1, the heating temperature of the thermocompression bonding head varies depending on the mounting component to be thermocompression bonded and the type of the anisotropic conductive film 23. Therefore, as shown in FIG. 4, when a plurality of different types of mounting parts are arranged and the temperature of the heating press is different, the thermocompression bonding head 30 has a different temperature depending on the superimposed Peltier element 5. The Peltier element 5 having the optimum temperature for the mounted component can be arranged and heated and pressed. As a result, the mounting apparatus 1 can collectively mount a plurality of mounting components having different heating pressure temperatures.

[Fourth embodiment]
As shown in FIG. 5, the thermocompression bonding head to which the present invention is applied is connected to the first thermocompression bonding head 40 with a second thermocompression bonding head 41 having a different heating temperature via one or a plurality of Peltier elements 5. May be attached. When the heating temperature of the second thermocompression bonding head 41 is lower than that of the first thermocompression bonding head 40, the temperature of the cooling unit 6 is between the second thermocompression bonding head 41 and the first thermocompression bonding head 40. Is attached to the Peltier element 5 so as to be close to the heat pressing temperature of the second thermocompression bonding head 41.

  For example, as shown in FIG. 5, when the heating temperature of the first thermocompression bonding head 40 is 200 ° C. and the heating temperature of the second thermocompression bonding head 41 is 130 ° C., the second thermocompression bonding head 41 A plurality of Peltier elements 5 are interposed between one thermocompression bonding head 40 and the temperature is gradually lowered, and the cooling unit 6 is attached to the Peltier element 5 having a temperature of about 130 ° C. The second thermocompression bonding head 41 has a plurality of Peltier elements 5 attached to the head body 41a. The outermost Peltier element 5 has a temperature at which the cooling unit 6 does not affect other components, for example, Set to 10 ° C.

  Even with such a thermocompression bonding head, a plurality of mounting components having different optimum heating temperatures can be collectively mounted by the first thermocompression bonding head 40 and the second thermocompression bonding head 41.

[Fifth embodiment]
Further, as shown in FIG. 6, the thermocompression bonding head to which the present invention is applied covers other side surfaces including the side surface of the Peltier element 5 facing the electronic component 18 and the panel display unit 15 of the head main body 50a and the entire periphery. It is good also as the thermocompression-bonding head 50 formed in this way. The thermocompression bonding head 50 can prevent the heat of the head main body 50a from diffusing to the surroundings, and can suppress the influence of the heat on the surrounding mounting parts.

  Moreover, the thermocompression-bonding head 50 may be attached by superimposing a plurality of Peltier elements 5 on the head body 50a, like the thermocompression-bonding head 30 described above. Thus, the thermocompression bonding head 50 can gradually lower the temperature of each Peltier element 5 as it goes outward, and faces the component parts mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18. The cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

  Further, the thermocompression bonding head 50, like the thermocompression bonding head 40 described above, has one or a plurality of Peltier elements 5 on the other side including the side facing the electronic component 18 and the panel display unit 15 of the head main body 50a and the entire periphery. You may attach the 2nd thermocompression-bonding head from which heating temperature differs through this. Thus, the thermocompression bonding head 50 can collectively mount a plurality of mounting components having different optimum heating temperatures together with the second thermocompression bonding head.

[Sixth embodiment]
Further, as shown in FIG. 7, the thermocompression bonding head to which the present invention is applied does not include a heater in the head body 60a, and is heated to a predetermined temperature by the Peltier element 5 attached around the head body 60a. The thermocompression bonding head 60 may be used. The thermocompression bonding head 60 uses the Peltier element 5 in which the temperature of the heating unit 7 becomes the heating temperature of the mounted component, and the surface attached to the head main body 60a of the Peltier element 5 dissipates heat as the heating unit 7, thereby Heat.

  Thereby, the thermocompression bonding head 60 can be heated to a predetermined temperature without incorporating a heater. The thermocompression bonding head 60 can easily control the temperature by using the Peltier element 5. The thermocompression bonding head 60 can be heated uniformly by attaching the Peltier element 5 to the entire periphery of the head body 60a.

  Further, the thermocompression bonding head 60 may be attached by superimposing a plurality of Peltier elements 5 on the head main body 60a, like the thermocompression bonding head 30 described above. Thereby, the thermocompression bonding head 60 can gradually lower the temperature of each Peltier element 5 as it goes outward, and faces the component parts mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18. The cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

  In addition, the thermocompression bonding head 60, like the thermocompression bonding head 40 described above, has one or a plurality of Peltier elements 5 on other side surfaces including the side surface facing the electronic component 18 and the panel display unit 15 of the head main body 60a and the entire periphery. You may attach the 2nd thermocompression-bonding head from which heating temperature differs through this. The second thermocompression bonding head is also heated to a predetermined temperature by the Peltier element 5 without incorporating a heater. Further, the second thermocompression bonding head can also be heated uniformly by attaching the Peltier element 5 to the entire periphery of the head body. Thereby, the thermocompression bonding head 60 can collectively mount a plurality of mounting components having different optimum heating temperatures together with the second thermocompression bonding head.

[Seventh embodiment]
In the thermocompression bonding heads 3, 50, 60 to which the present invention is applied, the head main bodies 3 b, 50 a, 60 a may be cooled by the Peltier element 5 after the mounting of the mounted components is completed. As described above, since the Peltier element 5 reverses the direction in which the direct current flows, the heat transfer direction is also reversed, so that the cooling unit 6 and the heating unit 7 can be interchanged. Therefore, the thermocompression bonding heads 3, 50, 60 are raised by the head driving mechanism 4 after the mounting of the electronic component 18 and the flexible substrate 21 is finished, and flow the current of the Peltier element 5 in the reverse direction.

  Thus, the surface of the Peltier element 5 facing the head main bodies 3b, 50a, 60a becomes the cooling unit 6. Thereby, the thermocompression bonding heads 3, 50, 60 can cool the head main bodies 3b, 50a, 60a. At this time, in the thermocompression bonding heads 3, 50, 60, the heating unit 7 of the Peltier element 5 is on the outside. However, since the head driving mechanism 4 is raised and separated from the liquid crystal display panel 10, there is no influence of heat dissipation. .

  When the Peltier element 5 again heats and presses the mounting component, the head main body 3b, 50a, 60a side is changed to the heating unit 7 by returning the direction of the current to flow, and the panel display unit 15 or the electronic component 18 is restored. The component side such as the above can be used as the cooling unit 6.

[Eighth embodiment]
Further, in the present invention, as shown in FIG. 8A, the thermocompression bonding head may be composed of only the Peltier element 5. The thermocompression bonding head 70 uses the lower surface facing the electronic component 18 and the flexible substrate 21 of the heating unit 7 of the Peltier element 5 as a pressing surface.

  Further, the present invention may be configured by connecting a pair of Peltier elements 5 as shown in FIG. In the thermocompression bonding head 80, the connection surface side of each Peltier element 5 is the heating unit 7, and the lower surface of the heating unit 7 facing the electronic component 18 and the flexible substrate 21 is the pressing surface.

  Since both the thermocompression bonding heads 70 and 80 use the component parts such as the electronic component 18 and the flexible substrate 21 as the cooling unit 6, the heat of the heating unit 7 can be prevented from being transmitted. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 or the distance between the COG mounting unit 20 and the FOG mounting unit is reduced and the heating unit 7 is close to the panel display unit 15 or the electronic component 18, Alteration, breakage, and the like due to thermal shock applied to each part of the panel display unit 15 can be prevented.

  Note that, in the thermocompression bonding heads 70 and 80, a plurality of Peltier elements 5 may be attached in a superimposed manner as in the thermocompression bonding head 30 described above. As a result, the thermocompression bonding heads 70 and 80 can gradually lower the temperature of each Peltier element 5 as it goes outward, so that the components mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18 can be reduced. The cooling part 6 of the facing Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus, 2 stages, 3 thermocompression-bonding head, 3a press surface, 3b head main body, 4 head drive mechanism, 10 liquid crystal display panel, 11, 12 transparent substrate, 12a edge, 13 seal, 14 liquid crystal, 15 panel display part 16, 17 Transparent electrode, 18 Electronic component, 20 COG mounting part, 21 Flexible substrate, 22 FOG mounting part, 23 Anisotropic conductive film, 24 Alignment film, 25, 26 Polarizing plate

Claims (19)

In the thermocompression bonding head for connecting the mounting component to the mounting part by heat-pressing the mounting component through a thermosetting adhesive layer,
The thermocompression bonding head has a Peltier element,
The Peltier element is a thermocompression bonding head having a cooling portion on a surface facing the other components provided in the vicinity of the mounting portion when the mounting component is heat-pressed. The Peltier element is provided on the side facing at least another component provided near the mounting portion of the head body,
2. The thermocompression bonding head according to claim 1, wherein when the mounting component is heat-pressed, the surface of the Peltier element facing the head body is a heating unit.   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that comes into contact with the head body is set to the heat-pressing temperature of the mounting component, and the cooling part of the Peltier element facing the other components is the other The thermocompression bonding head according to claim 2, wherein the thermocompression bonding head has a temperature that does not affect the components.   The thermocompression bonding head according to any one of claims 1 to 3, wherein the mounting component is heat-pressed by the Peltier element.   The thermocompression bonding head according to any one of claims 2 to 4, wherein the Peltier element is provided all around the head body.   The thermocompression bonding head according to any one of claims 2 to 5, wherein the head main body is heated by the Peltier element when the mounting component is hot-pressed.   The thermocompression bonding head according to claim 6, wherein the head main body is cooled by the Peltier element after the mounting component is heat-pressed.   The thermocompression bonding head according to claim 1, comprising only the Peltier element.   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that heat-presses the mounting part is set to the heat-pressing temperature of the mounting part, and the cooling part of the Peltier element facing the other component parts is the above-mentioned The thermocompression bonding head according to claim 8, wherein the thermocompression bonding head is at a temperature that does not affect other components. A thermocompression bonding head for connecting the mounting component to the mounting part by heat-pressing the mounting component through a thermosetting adhesive layer;
A head drive mechanism that opposes the thermocompression bonding head to the mounting part to which a mounting component is connected, and that moves close to and away from the mounting part;
The thermocompression bonding head has a Peltier element,
The Peltier element is a mounting apparatus in which a surface facing the other component provided near the mounting portion is a cooling portion when the mounting component is heat-pressed. Placing the mounting component on the mounting portion via a thermosetting adhesive layer;
A heat pressurizing step of heat-pressing the mounting component on the mounting portion by a thermocompression bonding head having a Peltier element;
In the thermal pressurizing step, the Peltier element is a mounting method in which a surface facing the other component parts provided in the vicinity of the mounting part is a cooling part. The Peltier element is provided on the side facing at least another component provided near the mounting portion of the head body,
The mounting method according to claim 11, wherein when the mounting component is heat-pressed, the surface of the Peltier element facing the head body is a heating unit.   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that comes into contact with the thermocompression bonding head is set to the heat-pressing temperature of the mounting component, and the cooling part of the Peltier element facing the other component is the above The mounting method according to claim 12, wherein the temperature is set so as not to affect other components.   The mounting method according to claim 12, wherein the Peltier element is provided around the entire circumference of the head body.   The mounting method according to any one of claims 12 to 14, wherein the thermocompression bonding head heats the head body by the Peltier element when the mounting component is heat-pressed.   The mounting method according to claim 15, wherein the thermocompression bonding head heat-presses the mounting component, and then the head main body is cooled by the Peltier element. The mounting method according to claim 11, wherein the thermocompression bonding head includes only the Peltier element.   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that heat-presses the mounting part is set to the heat-pressing temperature of the mounting part, and the cooling part of the Peltier element facing the other component parts is the above-mentioned The mounting method according to claim 17, wherein the temperature is set so as not to affect other components.   The mounting method according to claim 11, wherein the thermosetting adhesive layer is an anisotropic conductive adhesive film or an insulating adhesive film.

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