JP6428038B2 - Circuit board - Google Patents

Description

  The present invention relates to a circuit board in which a press-fit terminal is press-fitted into an insertion hole provided in a resin base material.

  Conventionally, there is a printed circuit board disclosed in Patent Document 1 as an example of a circuit board in which a press-fit terminal is press-fitted into an insertion hole provided in a resin base material. In this printed board, a press-fit terminal as a press-fit terminal is inserted into a through hole as an insertion hole.

JP 2013-89847 A

  However, in the printed circuit board, stress concentrates on the contact portion in contact with the press-fit terminal, and creep may occur from the contact portion as a starting point.

  The present invention has been made in view of the above problems, and an object thereof is to provide a circuit board capable of suppressing the occurrence of creep.

In order to achieve the above object, the present invention provides:
A circuit board into which press-fit terminals (200, 200a) are inserted,
Resin base materials (11, 11a, 11b, 11c);
Wiring (12) laminated via a resin substrate;
An interlayer connection member (13, 14, 15, 15a, 15b) that is provided on the resin base material and electrically connects wirings of different layers;
An insertion hole (16) formed on a resin base material, which is a portion into which a press-fit terminal is press-fitted, and has a conductive portion (17) electrically connected to a wiring on the surface;
The interlayer connection member includes a plurality of first reinforcing members (15) that reinforce the resin base material,
The plurality of first reinforcing members are arranged along a direction in which stress is applied to the resin base material from the contact portion of the press-fit terminal in the conductive portion by the press-fit terminal inserted into the insertion hole. .

  Thus, according to the present invention, the insertion hole into which the press-fit terminal is press-fitted is formed in the resin base material. Furthermore, in the present invention, a plurality of first reinforcing members that reinforce the resin base material are formed on the resin base material. The plurality of first reinforcing members are arranged along a direction in which stress is applied to the resin base material from the contact portion of the press-fit terminal in the conductive portion by the press-fit terminal inserted into the insertion hole. Thus, this invention is raising the metal ratio along the application direction of the stress applied to the resin base material by the press-fit terminal. Therefore, this invention can suppress generation | occurrence | production of creep rather than the case where the 1st reinforcement member is not provided.

  The reference numerals in parentheses described in the claims and in this section indicate the correspondence with the specific means described in the embodiments described later as one aspect, and the technical scope of the invention is as follows. It is not limited.

It is sectional drawing which shows schematic structure of the electronic device in embodiment. It is a fragmentary top view which shows the insertion hole part of the printed circuit board in embodiment. It is sectional drawing which follows the III-III line of FIG. 10 is a partial cross-sectional view illustrating a schematic configuration of a printed circuit board according to Modification 1. FIG. 10 is a partial plan view illustrating a schematic configuration of a printed circuit board according to Modification 2. FIG. It is sectional drawing which follows the VI-VI line of FIG. 10 is a plan view illustrating a schematic configuration of a printed circuit board according to Modification 3. FIG. FIG. 8 is an enlarged plan view of a portion surrounded by a dotted line VIII in FIG. 7. 10 is a partial plan view showing an example of a printed circuit board according to Modification 4. FIG. 10 is a partial plan view showing another example of a printed circuit board according to Modification 4. FIG. 10 is a partial cross-sectional view showing an insertion hole portion of a printed circuit board in Modification 5. FIG.

  Hereinafter, a plurality of embodiments for carrying out the invention will be described with reference to the drawings. In each embodiment, portions corresponding to the matters described in the preceding embodiment may be denoted by the same reference numerals and redundant description may be omitted. In each embodiment, when only a part of the configuration is described, the other configurations described above can be applied to other portions of the configuration.

  In the present embodiment, as an example, an example in which the present invention is applied to the printed circuit board 10 which is a part of the electronic device 100 is employed. As shown in FIG. 1, an electronic device 100 includes a printed circuit board 10, a circuit element 20 mounted on the printed circuit board 10, a sealing resin 30 provided on a mounting surface S1 on which the circuit element 20 is mounted on the printed circuit board 10, and the like. It is configured with.

  The circuit element 20 is mounted on the printed board 10 and is electrically connected to the wiring 12 and the like described later. As the circuit element 20, for example, a MOSFET or a chip capacitor can be adopted. However, the present invention is not limited to this.

  The sealing resin 30 is made of, for example, an epoxy resin and seals the circuit element 20. Further, the sealing resin 30 integrally seals a connection portion between the circuit element 20 and the printed board 10 in addition to the circuit element 20. Further, the sealing resin 30 seals the circuit element 20 and the like while being in close contact with at least a part of the mounting surface S1 of the printed board 10. That is, it can be said that the sealing resin 30 integrally seals the circuit element 20 and the periphery of the circuit element 20 on the mounting surface S1. The sealing resin 30 can be formed by, for example, compression molding or transfer molding. Therefore, the sealing resin 30 can be rephrased as a mold resin. In the present embodiment, as an example, a sealing resin 30 that integrally seals a plurality of circuit elements 20 is employed. However, the present invention is not limited to this.

  The printed circuit board 10 corresponds to a circuit board in the claims. The printed circuit board 10 has a press-fit terminal 200 to be described later inserted therein. In the present embodiment, as shown in FIG. 3, a printed board 10 that is a build-up board is employed as an example. The printed circuit board 10 includes a core layer 11a and a buildup layer 11b, a wiring 12 stacked via the core layer 11a and the buildup layer 11b, and an insertion hole provided through the core layer 11a and the buildup layer 11b. 16 etc. are comprised. Thus, the printed circuit board 10 is a multilayer substrate in which a plurality of wirings 12 are stacked via the core layer 11a and the buildup layer 11b. The printed circuit board 10 includes interlayer connection members 13, 14, and 15 that electrically connect the wirings 12 of different layers. The printed circuit board 10 may be provided with a solder resist.

  The core layer 11a and the buildup layer 11b are made of an insulating resin and correspond to the resin base material in the claims. In the following, when it is not necessary to distinguish between the core layer 11a and the buildup layer 11b, the core layer 11a and the buildup layer 11b may be collectively referred to as a resin base material 11.

  The printed circuit board 10 has a plurality of buildup layers 11b formed on one surface side of the core layer 11a, and a plurality of buildup layers 11b formed on the other surface side of the core layer 11a. . Here, the printed circuit board 10 employs an example in which two build-up layers 11b are formed on one surface side of the core layer 11a, and two build-up layers 11b are formed on the other surface side of the core layer 11a. ing. Further, in the resin base material 11, the surface of the second buildup layer 11b from one surface of the core layer 11a is the mounting surface S1, and the second buildup layer 11b from the other surface of the core layer 11a. The front surface is a back surface S2.

  As shown in FIG. 3, wirings 12 are formed on the surface of the core layer 11a and the surface of the buildup layer 11b. The wiring 12 is made of a conductive member, and is for electrically connecting the circuit elements 20 mounted on the printed board 10 and the circuit elements 20 and the conductive portion 17. The wiring 12 is a metal thin film patterned on the surface of the core layer 11a and the surface of the buildup layer 11b. Note that the wiring 12 is formed of, for example, a material mainly composed of copper.

  The build-up layer 11b is provided with connection via holes 14 and reinforcing members 15 as interlayer connection members. That is, it can be said that the interlayer connection member of the printed circuit board 10 includes the connection via hole 14 and the reinforcing member 15. The connection via hole 14 and the reinforcing member 15 are formed by filling (in other words, embedding) a conductive member whose main component is a metal such as copper in a hole formed in the buildup layer 11b by laser processing. This is a so-called laser via hole. Therefore, it can be said that the buildup layer 11b is formed with the connection via hole 14 and the reinforcing member 15 made of a laser via hole as an interlayer connection member.

  The connection via hole 14 is provided to electrically connect the wirings 12 of different layers. On the other hand, the reinforcing member 15 is provided to electrically connect the wirings 12 of different layers and reinforce the buildup layer 11b. The reinforcing member 15 corresponds to the first reinforcing member in the claims. The reinforcing member 15 will be described in detail later.

  The core layer 11a is provided with blind via holes 13 as interlayer connection members. That is, it can be said that the interlayer connection member of the printed circuit board 10 includes the blind via hole 13. The blind via hole 13 is formed by filling a through hole provided in the core layer 11a with a conductive member mainly composed of a metal such as copper. The blind via hole can also be referred to as IVH (Interstitial Via Hole). The blind via hole 13 has a lower copper ratio than the connection via hole 14 and the reinforcing member 15.

  The insertion hole 16 is a through hole into which a press-fit terminal 200 for electrically connecting the printed circuit board 10 and an external device provided outside the electronic device 100 is inserted. The insertion hole 16 is a through-hole surrounded by a conductive portion 17 made of a conductive member and provided from the mounting surface S1 to the back surface S2 of the resin base material 11. The conductive portion 17 is electrically connected to the wiring 12 or the like. That is, the insertion hole 16 is a part formed in the resin base material 11 and into which the press-fit terminal 200 is press-fitted, and the conductive portion 17 electrically connected to the wiring 12 is formed on the surface. The insertion hole 16 can also be called a through hole.

  The press-fit terminal 200 is a part of the connector of the external device. As shown in FIGS. 1 and 3, the press-fit terminal 200 includes a rod-shaped portion 210 and a deformable portion 220 provided at the tip of the rod-shaped portion 210. The press-fit terminal 200 is provided so as to protrude from, for example, a case for housing the electronic device 100 or an external device to which the electronic device 100 is attached.

  The deformation part 220 is a part that remains in the insertion hole 16 when the press-fit terminal 200 is inserted into the insertion hole 16. For example, as shown in FIG. 1, the deforming portion 220 has a ring shape. The press-fit terminal 200 is configured such that the deformable portion 220 is deformed when inserted into the insertion hole 16. That is, when the deformable portion 220 is inserted into the insertion hole 16, it receives stress from the conductive portion 17. Therefore, it can be said that the press-fit terminal 200 is press-fitted into the insertion hole 16. Further, it can be said that the press-fit terminal 200 is in contact with the conductive portion 17 by the reaction force of the deformable portion 220. The press-fit terminal 200 is press-fitted into the insertion hole 16 and is electrically connected to the circuit board 10. Thus, the press-fit terminal 200 is a so-called press-fit terminal.

  Here, the reinforcing member 15 will be described. As shown in FIGS. 1 to 3, the printed circuit board 10 is provided with a plurality of reinforcing members 15. The plurality of reinforcing members 15 are arranged along the application direction of stress applied to the resin base material 11 from the contact portion of the press-fit terminal 200 in the conductive portion 17 by the press-fit terminal 200 inserted into the insertion hole 16. In this embodiment, the example in which the some reinforcement member 15 is provided in the buildup layer 11b provided in the surface by the side of the back surface S2 in the core layer 11a is employ | adopted. That is, the plurality of reinforcing members 15 are provided in one buildup layer 11b. Further, as shown in FIG. 3, the plurality of reinforcing members 15 are electrically connected to the press-fit terminals 200 through the wirings 12 and the like. Therefore, in the present embodiment, an example in which all of the plurality of reinforcing members 15 are at the same potential is employed. In the following, the application direction of the stress applied to the resin base material 11 by the press-fit terminal 200 inserted into the insertion hole 16 is also simply referred to as an application direction.

  As shown in FIG. 3, a force is applied to the resin base material 11 from the press-fit terminal 200 in the direction of the white arrow. The press-fit terminal 200 of this embodiment applies a force in two directions to the resin base material 11. That is, when the press-fit terminal 200 is employed, the application direction is two directions orthogonal to the thickness direction of the resin base material 11. One application direction is opposite to the other application direction.

  Therefore, the printed circuit board 10 has a plurality of reinforcing members 15 arranged along each of the application directions. As shown in FIGS. 2 and 3, in this embodiment, four reinforcing members 15 are arranged on one application direction side, and four reinforcing members 15 are arranged on the other application direction side. Adopted. Moreover, as shown in FIG. 2, the four reinforcement members 15 arrange | positioned at the one application direction side are arrange | positioned on the straight line. Similarly, the four reinforcing members 15 arranged on the other application direction side are arranged in a straight line. The four reinforcing members 15 on one side and the four reinforcing members 15 on the other side are arranged on a straight line.

  However, in the present invention, it is only necessary that the plurality of reinforcing members 15 be arranged along each application direction. Further, in the printed circuit board 10, when a press-fit terminal having three or more application directions is inserted, a plurality of reinforcing members 15 are arranged along each of the three application directions.

  In addition, it can be said that the some reinforcement member 15 is arrange | positioned continuously at equal intervals. Further, it can be said that each of the plurality of reinforcing members 15 is provided close to each other. Furthermore, the plurality of reinforcing members 15 arranged in one application direction can also be referred to as a reinforcing member group. Therefore, it can also be said that the printed circuit board 10 is provided with a reinforcing member group along each application direction.

  As described above, the printed circuit board 10 is applied with a force in the direction of the white arrow from the press-fit terminal 200 in a state where the press-fit terminal 200 is inserted into the insertion hole 16. Therefore, in the resin base material 11, when the reinforcing member 15 is not provided, creep may grow in the direction of the white arrow. Therefore, the white arrow can be regarded as the creep growth direction when the reinforcing member 15 is not provided.

  The resin base material 11 of the printed circuit board 10 has an elastic modulus of about 20 GPa and is easily deformed as compared with metal. On the other hand, the reinforcing member 15 is made of, for example, pure copper as a main component. This pure copper has an elastic modulus of about 118 GPa. That is, the reinforcing member 15 has a higher elastic modulus than the resin base material 11 and is not easily mechanically deformed.

  Therefore, the printed circuit board 10 increases the metal ratio of the resin base material 11 by providing the reinforcing member 15. In particular, the printed circuit board 10 increases the metal ratio along the application direction from the contact portion of the press-fit terminal 200 in the conductive portion 17. In other words, the printed circuit board 10 reinforces the resin base material 11 by disposing a plurality of reinforcing members 15 along the creep growth direction from the contact portion of the press-fit terminal 200 in the conductive portion 17.

  As a result, the printed circuit board 10 can increase the strength against stress from the press-fit terminal 200 inserted into the insertion hole 16 and suppress the occurrence of creep. For this reason, the printed circuit board 10 does not need to strictly manage tolerances such as the shapes of the insertion holes 16 and the press-fit terminals 200, and can prevent an increase in cost.

  Further, when creep occurs in the printed circuit board 10, there is a possibility that stress is applied to the wiring 12 provided on the resin base material 11 or an electrical connection location such as the wiring 12 and the connection via hole 14. is there. When the stress is applied in this way, the printed circuit board 10 may be disconnected at the wiring 12 or the electrical connection portion or the electrical connection portion may be disconnected. Further, when creep occurs in the printed circuit board 10, the diameter of the insertion hole 16 may increase, and electrical connection between the conductive portion 17 and the press-fit terminal 200 may be insufficient. Accordingly, the electrical characteristics of the printed circuit board 10 may deteriorate due to the occurrence of creep, such as an increase in resistance and an inability to make an electrical connection. However, since the printed circuit board 10 can suppress the occurrence of creep as described above, it is possible to suppress a decrease in electrical characteristics.

  Further, the reinforcing member 15 is made of the same laser via hole as the connection via hole 14. Therefore, the reinforcing member 15 can be formed in the same process as the connection via hole 14. Therefore, the printed circuit board 10 can be manufactured without increasing a special process, and creep can be suppressed. The printed circuit board 10 can be manufactured without increasing the thickness of the wiring 12 or embedding a metal plate in the resin base material 11, and can suppress the occurrence of creep.

  Each of the plurality of reinforcing members 15 can suppress the occurrence of creep as close as possible. preferable. Moreover, generation | occurrence | production of a creep can be suppressed as the space | interval of the electroconductive part 17 and the reinforcement member 15 adjacent to the electroconductive part 17 is as close as possible.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the present invention. The plurality of reinforcing members 15 may include members having different potentials.

  Below, the modifications 1-5 of this invention are demonstrated. The above-described embodiment and Modifications 1 to 5 can be implemented independently, but can be implemented in appropriate combination. The present invention is not limited to the combinations shown in the embodiments, and can be implemented by various combinations.

(Modification 1)
As shown in FIG. 4, the printed circuit board 10 a of Modification 1 is a board without the core layer 11 a and is a so-called any layer board. That is, the printed circuit board 10a has a plurality of build layers 11c stacked thereon. Here, as an example, a printed circuit board 10a provided with five build layers 11c is employed. The build layer 11c corresponds to the resin base material in the claims. Further, since the printed circuit board 10a does not have the core layer 11a, all the interlayer connection members are formed by laser via holes. FIG. 4 is a cross-sectional view corresponding to FIG.

  The printed circuit board 10a can achieve the same effects as the printed circuit board 10. Further, in the printed board 10a, all interlayer connection members are formed by laser via holes. Therefore, the printed circuit board 10a can be provided with the plurality of reinforcing members 15 regardless of the build layer 11c in the plurality of build layers 11c. For this reason, the printed circuit board 10a easily arranges the plurality of reinforcing members 15 along the application direction from the contact portion of the press-fit terminal 200 in the conductive portion 17.

(Modification 2)
The press-fit terminal 200a may have a shape as shown in FIGS. The press-fit terminal 200a includes a rod-shaped portion 210a and a deformable portion 220a provided at the tip of the rod-shaped portion 210a. Unlike the deformable portion 220, the deformable portion 220a is divided into two hands from the tip of the rod-shaped portion 210a and does not have a ring shape. 5 is a plan view corresponding to FIG. On the other hand, FIG. 6 is a cross-sectional view corresponding to FIG.

  In this case, the application direction of the printed circuit board 10b according to Modification 2 is not on a straight line. Therefore, as shown in FIG. 5, in the printed board 10b, the reinforcing member group is not arranged on a straight line. That is, the four reinforcing members 15 arranged on one application direction side are arranged on a straight line. Similarly, the four reinforcing members 15 arranged on the other application direction side are arranged in a straight line. However, the four reinforcing members 15 on one side and the four reinforcing members 15 on the other side are not arranged in a straight line.

  The printed board 10b can achieve the same effects as the printed board 10. That is, the printed circuit board 10b can suppress the occurrence of creep even when the press-fit terminal 200a is inserted.

(Modification 3)
As shown in FIGS. 7 and 8, the printed circuit board 10 c of Modification 3 is provided with a plurality of insertion holes 16. That is, the resin base material 11 of the printed circuit board 10c is provided with a plurality of insertion holes 16. Therefore, the printed circuit board 10c has a plurality of press-fit terminals 200 inserted therein. As shown in FIG. 8, the resin base material 11 is provided with a plurality of reinforcing members 15 corresponding to the plurality of insertion holes 16. The printed board 10c can achieve the same effects as the printed board 10.

(Modification 4)
As shown in FIGS. 9 and 10, the printed circuit board 10 d of Modification 4 is provided with a first preliminary reinforcing member 15 a. The first preliminary reinforcing member 15a corresponds to the second reinforcing member in the claims. 9 and 10 are plan views corresponding to FIG.

  The printed circuit board 10d includes a plurality of first preliminary reinforcement members 15a as interlayer connection members in addition to the plurality of reinforcement members 15 and the like. The first preliminary reinforcing member 15 a is a laser via hole similarly to the reinforcing member 15. The first preliminary reinforcing member 15 a is provided as a spare for the reinforcing member 15.

  The plurality of first preliminary reinforcing members 15 a are provided at positions where the plurality of reinforcing members 15 are moved in the plane direction along the insertion holes 16. That is, the first preliminary reinforcing member 15 a is provided on the same buildup layer 11 b as the plurality of reinforcing members 15. For example, as shown in FIG. 9, the plurality of first preliminary reinforcing members 15 a are arranged at positions where the reinforcing member group is rotated about the center line of the insertion hole 16.

  Further, as shown in FIG. 10, the plurality of first preliminary reinforcing members 15a are arranged at positions where they are translated while shortening the interval between the reinforcing member groups. In the example of FIG. 10, the plurality of first preliminary reinforcing members 15a are arranged in parallel with the reinforcing member group. Among the plurality of first preliminary reinforcing members 15a, the distance between the one closest to the insertion hole 16 and the insertion hole 16 (in other words, the shortest distance) is the one closest to the insertion hole 16 among the plurality of reinforcing members 15 and the insertion hole. 16 and the same interval.

  The center line is an imaginary straight line along the thickness direction of the resin base material 11. The plane direction is a direction along a plane orthogonal to the thickness direction of the resin base material 11.

  In the printed circuit board 10d, the insertion position of the press-fit terminal 200 in the planar direction, that is, the position of the contact portion between the press-fit terminal 200 and the conductive portion 17 in the planar direction may be shifted from the planned position. In the printed board 10d, when the insertion position of the press-fit terminal 200 in the planar direction is shifted, the first preliminary reinforcing member 15a functions as a reinforcing member. For example, when the printed circuit board 10d is shifted to a position rotated around the center line with respect to the position where the press-fit terminal 200 is planned, as shown by a two-dot chain line in FIG. 9, the first preliminary reinforcing member 15a functions as a reinforcing member. Further, when the printed circuit board 10d is shifted to the position where the press-fit terminal 200 is moved in parallel with the position where the press-fit terminal 200 is planned, as shown by a two-dot chain line in FIG. 10, the first preliminary reinforcing member 15a functions as a reinforcing member. To do.

  The printed circuit board 10d can achieve the same effects as the printed circuit board 10. Furthermore, the printed circuit board 10d can suppress the occurrence of creep of the resin base material 11 even when the insertion position of the press-fit terminal 200 is shifted in the plane direction.

(Modification 5)
As shown in FIG. 11, the printed circuit board 10 e of Modification 5 is provided with a second preliminary reinforcing member 15 b. The second preliminary reinforcing member 15b corresponds to the third reinforcing member in the claims. FIG. 11 is a cross-sectional view corresponding to FIG.

  The printed circuit board 10e includes a plurality of second preliminary reinforcing members 15b as interlayer connection members in addition to the plurality of reinforcing members 15 and the like. The second preliminary reinforcing member 15 b is disposed opposite to the plurality of reinforcing members 15 via the wiring 12. In other words, each of the plurality of second preliminary reinforcing members 15 b is provided at a position facing each of the plurality of reinforcing members 15. Further, the second preliminary reinforcing member 15 b is a laser via hole similarly to the reinforcing member 15. The second preliminary reinforcing member 15 b is provided as a spare for the reinforcing member 15.

  In the printed circuit board 10e, the insertion position of the press-fit terminal 200 in the thickness direction, that is, the position of the contact portion between the press-fit terminal 200 and the conductive portion 17 in the thickness direction may deviate from the planned position. For example, the press-fit terminal 200 is scheduled to come into contact with the conductive portion 17 between the third build layer 11c from the bottom, but between the fourth build layer 11c from the bottom and the second build layer 11c from the bottom. 17 may be out of contact.

  In the printed board 10e, when the insertion position of the press-fit terminal 200 in the thickness direction is shifted, the second preliminary reinforcing member 15b functions as a reinforcing member. For example, when the printed circuit board 10e is displaced so as to be in contact with the conductive portion 17 between the fourth build layer 11c from the bottom, the second preliminary reinforcing member 15b provided on the fourth build layer 11c from the bottom is Functions as a reinforcing member.

  The printed circuit board 10e can achieve the same effects as the printed circuit board 10. Furthermore, the printed circuit board 10e can suppress the creep of the resin base material 11 even when the insertion position of the press-fit terminal 200 is shifted in the thickness direction. In addition to the reinforcing member 15, the second preliminary reinforcing member 15b may be disposed to face the first preliminary reinforcing member 15a.

  10, 10a to 10e Printed circuit board, 11 Resin base material, 11a Core layer, 11b Build-up layer, 11c Build layer, 12 Wiring, 13 Blind via hole, 14 Connecting via hole, 15 Reinforcing member, 15a First preliminary reinforcing member, 15b Second preliminary reinforcing member, 16 insertion hole, 17 conductive portion, 20 circuit element, 30 sealing resin, 100 electronic device, 200, 200a press-fit terminal, 210, 210a rod-shaped portion, 220, 220a deformation portion

Claims (8)

A circuit board into which press-fit terminals (200, 200a) are inserted,
Resin base materials (11, 11a, 11b, 11c);
Wiring (12) laminated via the resin substrate;
An interlayer connection member (13, 14, 15, 15a, 15b) mainly composed of a metal provided on the resin base material and electrically connecting the wirings of different layers;
An insertion hole (16) formed on the resin base material, the portion into which the press-fit terminal is press-fitted, and having a conductive portion (17) electrically connected to the wiring on the surface; ,
The interlayer connection member includes a plurality of first reinforcing members (15) that reinforce the resin base material,
The plurality of first reinforcing members are arranged along a direction in which stress is applied to the resin base material by the press-fit terminal inserted into the insertion hole from a contact portion of the press-fit terminal in the conductive portion. A circuit board characterized by comprising: The resin base material has a laser via hole (14, 15) formed as the interlayer connection member,
The circuit board according to claim 1, wherein the plurality of first reinforcing members are formed of the laser via holes.   The resin base material includes a buildup layer (11b) in which the laser via hole is formed, and a core layer (11a) in which a blind via hole (13) is formed as the interlayer connection member. Item 3. The circuit board according to Item 2.   The circuit board according to claim 1, wherein all of the plurality of first reinforcing members have the same potential.   In addition to the plurality of first reinforcement members, the interlayer connection member includes a plurality of second reinforcement members (15a) disposed at positions where the plurality of first reinforcement members are moved in the planar direction along the insertion holes. The circuit board according to claim 1, further comprising:   The interlayer connection member includes, in addition to the plurality of first reinforcement members, a third reinforcement member (15b) disposed to face the plurality of first reinforcement members via the wiring. The circuit board according to any one of claims 1 to 5.   The resin base material is provided with a plurality of insertion holes, and a plurality of the first reinforcing members are provided corresponding to the plurality of insertion holes, respectively. The circuit board according to any one of 1 to 6. The plurality of first reinforcing members are perpendicular to the circuit board, include the press-fit terminals, and are arranged along the application direction on a virtual plane along the spreading direction of the press-fit terminals. The circuit board according to claim 1.

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